Prelim

1. C. 9.11x10^-28 g
2. B. Conductors
3. A. Carbon
4. D. All of the above
5. C. Hole
6. D. Conductivity
7. B. 8 corner, 6 faces, 4 interior atoms
8. C. SiC
9. B. 1.21eV
10. C. Oxidation
11. C. Valence Electrons
12. B. Germanium
13. B. Face centered cubic
14.
15. D. Negative
16.
17. C. Fermi Dirac
18.
19. B. Electron Energy
20. C. Superconductors (?)
21. D. Electronegativity
22. A. HTO
23.
24. C. Avogadro's Number
25. B. ESD
26. B. Diffusion
27. C. Drift
28. C. 32
29. D. 14
30. B. Diffuse
Midterm
1. B. Purification
2. A. Refining
3. D. Deposition
4. D. Front Opening Unified Pods
5. C. These elements have their melting point higher than the melting point of t
he liquid solution.
6. C. Extraction Speed, Temperature and Pressure Only
7. C. Boule
8. C. Diamond
9. D. Lapping
10. A. Grinding
11. B. Polysilicon Deposition
12. B. Diffusion
13. B. Condenser
14. C. Dry Etching / Anisotropic
15. C. Ammonia, Hydrogen Peroxide and pure H20 only
16. B. Class 10
17. N/A
18. B. Argon Gas (?)
19. C. Gettering
20. D. Hydrofluoric Acid
21. C. Acetic Acid
22. A. positive voltage increase the current
23. A. UV is inexpensive and efficient. (?)
24. B. Ge
25. B. Hydrochloric Acid
26. B. Photoresist

27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.

C. Planarization
A. Australia
D.
B.
A.
B.
B.
B.
B.
C.
C.
D.
C.
C.
D.
B.
B.
D.

Superconductivity
Stepper
Ion Implantation
Drive In
Ion Milling
Heavily doped Boron < 1 ohm/cm^2
Class 10 (?)
Fairchild Camera and Instrument
Etching
the gold insulation totally terminated the current flow (?)
Robert Gibley
Plasma Etching
CVD Metals
Oxygen
356 nm
Czochralski's Method

Finals
1. A. Wire Bonding
2. C. Wafer Dicing
3. B. Die Bonding
4. A. Final Test
5. D. Spindle Speed
6. C. Epoxy Die Attach
7. D. Supporters
8. D. Wire-bond Stability
9. C. Ball Shear (?)
10. C. Capillary
11. C. Plating Solution (?)
12. C. Tin (?)
13. B. Too low bond level
14. C. Linear arm section
15. A. Incomplete Fill (?)
16. D. Yttrium Aluminum Garnet
17. B. Aluminum
18. D. Open Metal (?)
19. C. Molds bleed and exceed on the die.
20. D. Ejector
21. A. Nozzle, Valves, Pipe
22. D. Thermosonic
23. C. Chipping
24. C. Too high anvil block
25. B. Wire Tensioner
26. B. Glassivation
27. C. Probe Needle Damage
28. B. Yttrium Iron Garnet
29. C. Blade Thickness
30. B. Die Attach Fillet
31. D. Die Shear
32. B. Wafer Mount
33. A. protects the lead against moisture
34. B. Wafer Probing
35. C. Scribe Defect
36. D. Automated Test Equipment
37. C. Die Placement
38. B. Ticks
39. C. Wafer Backgrind (?)

40.
41.
42.
43.
44.
45.
46.
47.
48.
49.
50.

C. to have a reference for inventory (?)

D.
B.
A.
C.
A.
B.
B.

Laser Marking
Wedge Bonding
It will adhere to the surface
Trim and Form
Free Scale Cutting
Ball Grid Array
Tungsten-Copper