Concepts:

2D Modeling/Simulation (ANSYS Workbench)

Steady State Heat Transfer

Conduction and Convection w/ Simple Radiation

The figure shows a 2D section of a composite wall

subject to a steady-state heat transfer condition. (All
dimensions are in meters).
There are six materials in this construction (A, B, C, D, E,
and F). Assume unit depth (1 m.) for the model.
kA = 2, kB = 8, kC = 20, kD = 15, kE = 35, and kF = 2
W/m-oC
Each section is in perfect contact with adjacent sections
(no contact resistance).
The top and bottom edges are adiabatic.

On the left side:

Heat enters the model at a rate of 600 W

the left face radiates to/from the surroundings with an

emissivity of 1.0 and a view factor of 1.0

TSURR = 150oC

On the right side (convection only): TAIR = 50oC and hAir =

95 W/m2-oC
This exercise consists of an analysis of an electronics component cooling design
using fins: All electronic components generate heat during the course of their
operation. To ensure optimal working of the component, the generated heat needs
to be removed. This is done by attaching fins to the device which aid in rapid heat
removal to the surroundings. For the sake of simplicity, well assume that the
electronic circuit is made of copper with thermal conductivity of 386 W/mK and
that it generates heat at the rate of 1 W. The enclosing container is made of a steel
with thermal conductivity of 17 W/mK. The fins are made of aluminum with thermal
conductivity of 180 W/mK. There is convection along all the boundaries except the
bottom, which is insulated. The film (convection) coefficient is h=50 W/m2K and
the ambient temperature is 20C.