a 148-Lead Chip Scale Package Ball Grid Array [CSP_BGA]

(BC-148)
Dimensions shown in millimeters

9.10 A1 CORNER
INDEX AREA
9.00 SQ 16 14 12 10
15 13 11 9 8 7 6 5 4 3 2 1
8.90
A
B
C
D
BALL A1 E
PAD CORNER F
7.50 G
BSC SQ H
TOP VIEW J
K
L
M
N
P
R
T

0.50 BSC

DETAIL A
*1.40 MAX

DETAIL A *1.11 MAX

0.15 MIN

COPLANARITY
0.35 0.08
SEATING
0.30 PLANE
0.25
BALL DIAMETER

*COMPLIANT TO JEDEC STANDARDS MO-195 WITH EXCEPTION

TO DIMENSIONS INDICATED BY AN ASTERISK.
This datasheet has been downloaded from:

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Datasheets for electronic components.