Nounune 10 Mt 12 13, 14 REFLOW COMPARISON CHART ‘Condensation Reflow Forced Convection 1/R Convection ‘System Performance Start-up to true process Ready 11 minutes, 20-45 minutes 50-120 minutes Oven repeatability w/in 104°C | w/in 1° - 10°C w/in 59-259 C Thermal Symmetry <5°C 20-8°C 8° - 24°C Load Sensitivity <20C 30-89, g2 - 30°C Internal Temp. vs. Lead Temp. 20° - 30°C cooler =108 - 0° C “108 to +159 C ESD Potential Added (V) oO 0-75 oO Ease of Profiling (# of passes) 4-2 1-5 2-10 ‘Thermodynamics Heat Transfer Rate rapid slow rapid Uniformity of Heat Transfer uniform: uniform non-uniform Heat Recovery rapid slow rapid Range of Temperatures wide range wide range wide range | Gener: Controllability Excellent very good {good Feasibility for Low Volume: excellent very good fair Medium Volume excellent excellent ‘good High Volume. excellent, medium very good, Relative Cost medium medium | medium to expensive Key: 1. Starts ss From a cold start to a true process ready state at which the system, is stabilized. 2. Oven Repeatability: how much the system drifts over time as measured at the PCB level 43. Thermal Symmetry: How much ofa difference PCB orientation/flow diteetion makes 4, Lead Sensitivity: The impaet of passing a volume of produet (load) through the system, 5..Component Internal Temperature: How much cooler the internal portion of a component remains ‘when the lead interconnect is at full liquidous. 6. ESD Potential Added: How much measured ESD potential the system adds to a PCB assembly. (Note: ‘Most forced convection systems do not add ESD but a very few have been observed to exhibit this trait 7 Ease of Profiling: How many passes does it typically take to profile a PCB assembly R&D Technical Services, Inc. 12261 Suite A Nicollet Avenue South Burnsville, Minnesota 55337 phone (952) 707-1931 fax (952) 707-6739 ‘SIVIAILYH SAY wera Ay RR 801S-Z22-998