XDM SPEC A01 4-2 en

XDM
Intelligent MSPP for Metro and

Cellular Networks
System Specifications
=
XDM System Specifications

June 2004
2 nd Edition
Copyright by ECI Telecom Ltd., 2003-2004. All rights reserved worldwide.

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Contents
Table of Contents
1. Overview ........................................................................................................... 1-1
1.1
XDM Intelligent, Scalable, Optical Networking Platforms ............... 1-1
1.2
Unparalleled Capabilities..................................................................... 1-2
1.3
XDM Platforms .................................................................................... 1-4
2. Physical Description........................................................................................ 2-1

2.1
2.2
XDM Shelf Configurations ................................................................. 2-1

2.1.1
XDM-100 Shelf Layout ........................................................... 2-2
2.1.2
XDM-200 Shelf Layout ........................................................... 2-6
2.1.3
XDM-400 Shelf Layout ........................................................... 2-7
2.1.4
XDM-500 Shelf Layout ........................................................... 2-8
2.1.5
XDM-1000 Shelf Layout ......................................................... 2-9
2.1.6
XDM-2000 Shelf Layout ....................................................... 2-10
2.1.7
Rack Layouts and Expansion Shelves ................................. 2-11
XDM-100 Card and Module Layout ................................................... 2-19

2.2.1
Basic XDM-100 Shelf ........................................................... 2-19
2.2.2
Expanded XDM-100 Shelf with I/O Protection...................... 2-20
2.2.3
Nonredundant XDM-100 Shelf ............................................. 2-20
2.2.4
Hybrid XDM-100 Shelf Configuration (XDM-100H) .............. 2-20
2.3
XDM-200 Cards and Modules Layout ............................................... 2-22
2.4
MXC and ECU Cards ........................................................................ 2-24

2.4.1
MXC...................................................................................... 2-24
2.4.2
ECU ...................................................................................... 2-25
2.5
XDM-400 Card Layout....................................................................... 2-26
2.6
XDM-500 Card Layout....................................................................... 2-27
2.7
XDM-1000 Card Layout..................................................................... 2-28
2.8
XDM-2000 Card Layout..................................................................... 2-30
2.9
XDM Control, Matrix and I/O Cards................................................... 2-31

2.9.1
HLXC .................................................................................... 2-31
2.9.2
XIO ....................................................................................... 2-31
2.9.3
xMCP.................................................................................... 2-32
2.9.4
MECP ................................................................................... 2-32
2.9.5
ECB or xECB4...................................................................... 2-32
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ECI Telecom Ltd. Proprietary
Contents
3. XDM-100 Specifications .................................................................................. 3-1

3.1
Cross-Connect Specifications ............................................................. 3-1

3.1.1
Cross-Connect Levels ............................................................ 3-1
3.1.2
Cross-Connect Capacity......................................................... 3-1
3.2
Traffic Protection ................................................................................. 3-1
3.3
Redundancy ........................................................................................ 3-1
3.4
Synchronization................................................................................... 3-2
3.5
Jitter and Wander ................................................................................ 3-2
3.6
I/O Interfaces....................................................................................... 3-2
3.7
3.8
3.9
3.6.1
2 Mbps (E1) ............................................................................ 3-2
3.6.2
34 Mbps (E3) .......................................................................... 3-2
3.6.3
45 Mbps (DS-3) ...................................................................... 3-2
3.6.4
52 Mbps (SONET/STS-1)....................................................... 3-3
3.6.5
STM-1 Electrical ..................................................................... 3-3
3.6.6
STM-1/OC-3 Optical ............................................................... 3-3
3.6.7
STM-4/OC-12 Optical ............................................................. 3-3
3.6.8
STM-16/OC-48 Optical ........................................................... 3-3
Management ....................................................................................... 3-4

3.7.1
Management and Alarm Interfaces ........................................ 3-4
3.7.2
Alarms and Performance........................................................ 3-4
SDH/SONET Interfaces....................................................................... 3-5

3.8.1
SDH/SONET STM-1/OC-3 I/O Module

(155.52 Mbps 4.6 ppm) ........................................................ 3-5
3.8.2

(622 Mbps 4.6 ppm) ............................................................. 3-6
3.8.3

(2488.32 Mbps 4.6 ppm) ...................................................... 3-7
3.8.4
2.5 Gbps Optical CWDM SFP Transceivers for

XDM-100H.............................................................................. 3-8
Data Interfaces .................................................................................... 3-9

3.9.1
Client Transceivers for EISM Cards ....................................... 3-9
3.10 EISM Specifications ............................................................................ 3-9

3.11 Physical Specifications...................................................................... 3-10
3.11.1 Dimensions (H x W x D) ....................................................... 3-10
3.11.2 Weight .................................................................................. 3-10
3.11.3 Power ................................................................................... 3-10
3.11.4 Environmental Conditions..................................................... 3-11
ii
417006-2007-013-A01
Contents
3.11.5 EMC...................................................................................... 3-11

3.11.6 Safety ................................................................................... 3-11
3.11.7 Laser Safety ......................................................................... 3-11
3.11.8 NEBS Compliance................................................................ 3-12
3.11.9 Reliability .............................................................................. 3-12
4. XDM-200 Specifications .................................................................................. 4-1
4.1
Traffic Protection ................................................................................. 4-1
4.2
Redundancy ........................................................................................ 4-1
4.3
Jitter and Wander ................................................................................ 4-1
4.4
Management ....................................................................................... 4-1
4.5
4.6
4.4.1
Management and Alarm Interfaces ........................................ 4-2
4.4.2
Alarm and Performance.......................................................... 4-2
I/O Interfaces....................................................................................... 4-2

4.5.1
2.5 Gbps Optical SFP Transceivers for

Transponders/Combiners ....................................................... 4-2
4.5.2
GbE/FC/FICON Optical SFP Transceivers

forTransponders/Combiners................................................... 4-3
4.5.3
Mux/Demux Modules .............................................................. 4-3
4.5.4
OADM Modules ...................................................................... 4-3
4.5.5
Splitter/Coupler Modules ........................................................ 4-4
4.5.6
CWDM Frequencies and Wavelengths as per G.694.2.......... 4-4
Physical Specifications........................................................................ 4-4

4.6.1
Dimensions (H x W x D) ......................................................... 4-4
4.6.2
Weight .................................................................................... 4-5
4.6.3
Power ..................................................................................... 4-5
4.6.4
Environmental Conditions....................................................... 4-5
4.6.5
EMC........................................................................................ 4-5
4.6.6
Safety ..................................................................................... 4-6
4.6.7
Laser Safety ........................................................................... 4-6
4.6.8
NEBS Compliance.................................................................. 4-6
4.6.9
Reliability ................................................................................ 4-6
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iii
Contents
5. XDM-400, 500, 1000, and 2000 Specifications ............................................... 5-1

5.1
Electrical, Optical, and Mixed Basecard Data ..................................... 5-1

5.1.1
5.2
5.3
5.4
iv
Electrical Interface Connection Modules ................................ 5-2
SDH/SONET Interfaces....................................................................... 5-4

5.2.1
SDH/SONET STM-1/OC-3 (155.52 Mbps 4.6 ppm)

I/O Cards ................................................................................ 5-4
5.2.2
SDH/SONET STM-4/OC-12 (622 Mbps 4.6 ppm)

I/O Cards ................................................................................ 5-5
5.2.3

I/O Cards ................................................................................ 5-6
5.2.4

I/O Cards (7) ............................................................................ 5-7
5.2.5
PDH/Async and SDH/SONET Interface Specifications .......... 5-8
Data Cards ........................................................................................ 5-10

5.3.1
Client Transceivers for DIO and EIS Cards

(and for CMBR25/10 and TRP25_4 Cards).......................... 5-10
5.3.2
DIO Specifications ................................................................ 5-11
5.3.3
EIS Specifications................................................................. 5-11
5.3.4
ATS Specifications ............................................................... 5-11
Optical Components.......................................................................... 5-12

5.4.1
DWDM Mux/Demux Cards and Modules.............................. 5-12
5.4.2
OADM Cards and Modules................................................... 5-15
5.4.3
Transponders ....................................................................... 5-19
5.4.4
Optical Amplifiers.................................................................. 5-27
5.4.5
Optical Auxiliary Cards and Modules.................................... 5-29
5.4.6
DCF/DCM Units.................................................................... 5-30
5.4.7
Auxiliary Cards and Miscellaneous Accessory Modules ...... 5-30
5.4.8
Other Optical Cards.............................................................. 5-31
5.5
Frequencies and Wavelengths.......................................................... 5-32
5.6
Physical Specifications...................................................................... 5-33

5.6.1
Dimensions (H x W x D) ....................................................... 5-33
5.6.2
Weight .................................................................................. 5-33
5.6.3
Power ................................................................................... 5-34
5.6.4
Environmental Conditions..................................................... 5-34
5.6.5
EMC...................................................................................... 5-35
5.6.6
Safety ................................................................................... 5-35
5.6.7
Laser Safety ......................................................................... 5-35
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5.7
5.8
Contents
5.6.8
NEBS Compliance................................................................ 5-35
5.6.9
Reliability .............................................................................. 5-35
Management Specifications .............................................................. 5-36

5.7.1
Management and Alarm Interfaces ...................................... 5-36
5.7.2
Alarms and Performance...................................................... 5-36
Other Specifications .......................................................................... 5-36

5.8.1
Cross-Connect Levels .......................................................... 5-36
5.8.2
Cross-Connect Capacity....................................................... 5-36
5.8.3
Traffic Protection .................................................................. 5-37
5.8.4
Redundancy ......................................................................... 5-37
5.8.5
Synchronization .................................................................... 5-37
5.8.6
Jitter and Wander ................................................................. 5-37
A. Reference Documents ....................................................................................A-1

B. Glossary ...........................................................................................................B-2
Index....................................................................................................................... I-1
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Contents
vi
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Contents
List of Figures
Figure 1-1: Multiservice metropolitan optical network.................................. 1-4
Figure 1-2: XDM shelves ............................................................................. 1-6
Figure 2-1: Basic XDM-100 shelf................................................................. 2-2
Figure 2-2: XDM-100 with TPU (I/O protection)........................................... 2-3
Figure 2-3: XDM-100 nonredundant configuration ...................................... 2-4
Figure 2-4: XDM-100H with one TPU/OCU shelf ........................................ 2-5
Figure 2-5: XDM-200 shelf........................................................................... 2-6
Figure 2-6: XDM-400 shelf open view ......................................................... 2-7
Figure 2-7: XDM-500 shelf open view ......................................................... 2-8
Figure 2-8: XDM-1000 standard shelf open view ........................................ 2-9
Figure 2-9: XDM-2000 open view .............................................................. 2-10
Figure 2-10: Three XDM-100 or XDM-200 shelves in a
2600 mm ECI Telecoms recommended ETSI rack .......................... 2-12
Figure 2-11: Three XDM-400 shelves in a 2600 mm rack ......................... 2-13
Figure 2-12: XDM-1000 and XDM-500 shelves in a 2600 mm rack .......... 2-15
Figure 2-13: Two XDM-500 shelves installed in a 2200 mm rack ............. 2-16
Figure 2-14: Two XDM-2000 shelves installed in a 2200 mm rack ........... 2-17
Figure 2-15: Two XDM-1000 shelves installed in a 2600 mm rack ........... 2-18
Figure 2-16: XDM-100 slot allocation ........................................................ 2-19
Figure 2-17: XDM-200 system card and module layout ............................ 2-22
Figure 2-18: XDM-400 typical card layout ................................................. 2-26
Figure 2-19: XDM-500 standard card layout.............................................. 2-27
Figure 2-20: XDM-1000 standard card layout............................................ 2-29
Figure 2-21: XDM-2000 standard card layout............................................ 2-30
417006-2007-013-A01
vii
Contents
viii
417006-2007-013-A01
1
Overview
1.1 XDM Intelligent, Scalable, Optical
Networking Platforms
The telecommunications landscape is becoming more and more competitive.
Carriers and operators are demanding networking equipment that can do more for
less money. Today's networking equipment must be flexible, upgradeable, and
highly intelligent. It must be able to successfully integrate with equipment produced
by other manufacturers according to accepted industry standards. Above all, today's
networking equipment must be scalable, easy to operate and maintain, and cost
effective.
At ECI Telecom's Optical Networks Division, we specifically addressed these issues
when we designed the XDM platforms. The XDM offers carriers unprecedented
capacity, cost-savings and ease of integration, placing it at the forefront of the
optical networking revolution.
The XDM offers a series of outstanding advantages, including:
Data-awareness the XDM facilitates migration from voice-oriented to
data-oriented networks, combining the cost-effectiveness and universality of

Ethernet with the Quality of Service (QoS), scalability, and resilience of
SDH/SONET.
Optical DWDM capabilities the XDM implements low-cost all-optical
networks by offering sublambda grooming of multiple low-rate services

(including SDH/SONET, IP, ATM, and GbE) onto a single wavelength.
Versatility and interoperability the XDM coexists in perfect harmony with
equipment from other vendors by enabling the free flow of management

information between network elements. Its management software facilitates
smooth integration with other high-level management systems.
417006-2007-013-A01
1-1
Overview
Readiness for future architectures thanks to its inherently modular,
"build-as-you-grow" architecture, the XDM gives carriers the ability to

meet all of tomorrow's networking environments, be they ring, star, or mesh.
The innovative design of the XDM meets all the requirements of modern
transmission networks in a single shelf, consolidating key networking technologies
in a modular infrastructure to create the world's most accommodating and scalable
single-shelf platform. XDM operators can choose to use only the features required
based on current demands, and add functions and services as requirements grow.
This results in flexible and scalable platforms that provide dynamic multiservice
provisioning while reducing both capital expenditures (CAPEX) and operating
expenses (OPEX).
1.2 Unparalleled Capabilities

Typical metro networks span distances anywhere from 10 km to 300 km, serving
large bandwidth-hungry areas. Equipment serving these networks must therefore be
able to interconnect a wide range of protocols, from business customers in the access
layer to service providers in the backbone.
As a true MultiService Provisioning Platform (MSPP), the XDM seamlessly
integrates multiple network types, traffic types and technologies, including:
SDH/SONET
Bitrates ranging from E1/T1 all the way up to STM-64/OC-192
Large, nonblocking matrix for full connectivity
Variety of port densities that can fit into any network layer from the
network termination unit all the way up to the central office
Optical
1-2
High density of lambdas (40 to 80) in the C band
Ability to add/drop any lambda at any site
Ability to provide metro solutions without amplification
Long-haul solutions up to 1500 km
417006-2007-013-A01
Overview
Data
Usable bandwidth to customers, including Layer 1 and Layer 2 Ethernet

services, from 10BaseT all the way up to GbE
Ability to route data over SDH/SONET or DWDM
Additional cards can be added as needed, to reduce cost and protect

against over-expansion
Cellular
Aggregates ATM traffic to make the most of existing bandwidth
Unifies 2G and 3G networks
As a digital cross-connect, the XDM offers VC-12 granularity (STS-1 for SONET)
within a 60 Gbps fabric. Several cross-connect types are available, including
broadband, wideband and integrated broadband/wideband, all of which comply with
applicable standards.
The XDM does all of this while maintaining high levels of performance and
reliability. Moreover, the inherent DWDM capabilities of the XDM provide
operators with an intelligent infrastructure offering virtually unlimited expansion
paths.
The multilayer, multiservice functionality of the XDM enables you to:
Migrate from today's ring topologies to mesh architectures, segment by
segment
Add and activate bandwidth as requirements change
Provide on-demand services across multiple network layers
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1-3
Overview
Up to 80-channel (STM-64/OC-192)
regional optical backbone
OADM
Ethernet
STM-16/64, OC-48/192
DWDM
10 Gbps
ADM
ATM
A
D
M
A
D
M
DXC 4/4/3/1
DCS 3/3
STM-1/4, OC-3/12
N x STM-16/64, OC-48/192
Optical metropolitan ring/mesh
A
D
M
A
D
M
D
W
D
M
D
W
D
M
SDH/SONET ADM
DWDM OADM
PDH
ATM
Ethernet
SDH/
SONET
E1, E3/DS3, STS-1, Ethernet, ATM

STM-1/OC-3(c); STM-4(c)/OC-12(c)
STM-16(c)/OC-48(c);STM-64(c)/OC-192(c)
Figure 1-1: Multiservice metropolitan optical network
1.3 XDM Platforms

The XDM family of integrated optical platforms consolidates key networking
technologies in a modular infrastructure that integrates all the transport functions of
a complete Point of Presence (POP) in a single-shelf-sized element. Cards can be
interchanged between the various platforms, ensuring a flexible, build-as-you-grow
architecture for transporting all types of traffic, including voice, ATM, IP and data.
These technical specifications address the following XDM shelf configurations:
XDM -100 Miniature MSPP for Metro-access and Cellular Networks
an intelligent, integrated system that offers operators a cost-effective, flexible

approach to maximizing bandwidth utilization while delivering both enhanced
data services and traditional voice services.
1-4
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Overview
XDM -200 Compact CWDM Platform for Metro-access Networks a
cost-effective, standalone, carrier-class CWDM solution for metro-access and

campus networks.
XDM -400 Compact MSPP for Metro-Edge or Long-Haul
Applications an innovative product optimized for optical metro-access and

cellular applications. When equipped with high-power, long-haul optical
devices, it provides an excellent solution for regional applications spanning
distances of up to 1500 km.
XDM -500 Data-Aware Access Gateway designed for medium interface
capacities and street-cabinet installations, the XDM-500 is a compact optical

platform optimized for the metro edge. It provides traditional broadband
services and highly advanced data services like adaptive-rate Gigabit
Ethernet, sophisticated Layer 2 Ethernet, POS, and lambda. It can be used
either as a simple ADM, or as an edge multi-ADM/TM shared between
several rings, providing distributed cross-connectivity and concentration of
low-rate services.
XDM -1000 Multiservice Metro Optical Platform designed for
high-capacity central exchange applications, the XDM-1000 is optimized for

the metro core and features unprecedented port densities.
As a digital cross-connect, the XDM-1000 forms a fully protected mesh core.
As a multi-ADM, it simultaneously closes STM-64/OC-192 core
MS-SPRing/BLSR and multiple edge 1+1/UPSR rings. As a DWDM, it
enables migration from SDH/SONET to DWDM networks, providing high
capacity and sublambda grooming and reliability.
The XDM-1000 provides connectivity between central office legacy switches
over E1, E3/DS-3, and STM-1/OC-3 trunks, and between POPs over native
Fast Ethernet, Gigabit Ethernet or POS, while efficiently grooming traffic
from edge rings.
XDM -2000 Multifunctional Intelligent Optical Switch designed for the

metro and metro-regional core, the XDM-2000 is optimized for pure DWDM
and hybrid optical applications. This is a highly dense DWDM platform that
provides intelligent sublambda grooming and optimum wavelength
utilization.
As the most flexible optical switch on the market today, the XDM-2000
transports up to 400 Gbps (upgradeable to 1.6 Tbps and above), and
integrates the most advanced optical units with a variety of interfaces and a
sophisticated, high-capacity matrix in one small, low-cost package.
For additional information about the XDM-100, XDM-200, and XDM-400 shelves,
please refer to their respective general descriptions.
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1-5
Overview
Figure 1-2: XDM shelves
1-6
417006-2007-013-A01
2
Physical Description
2.1 XDM Shelf Configurations
The XDM platforms detailed in this document are provided in the following shelf
configurations:
XDM-100 Miniature MSPP (Multi Service Provisioning Platform)
optimized for metro-access and cellular networks
XDM-200 Miniature CWDM Platform designed for metro-access
networks
XDM-400 Compact MSPP optimized for optical metro-access and
cellular applications
XDM-500 Data-Aware Access Gateway a compact shelf designed for
medium interface capacities and outdoor installations
XDM-1000 Multiservice Metro Optical Switch a standard shelf
designed for high-capacity central exchange applications
XDM-2000 Multifunctional Intelligent Optical Switch designed for
pure DWDM applications
The basic cards of the XDM-100 are also used in the XDM-200. In addition, optical
modules of the XDM-200 are also used with the hybrid configuration of the
XDM-100 (XDM-100H).
To facilitate operation and maintenance, the XDM-500 and XDM-1000 shelves
support exactly the same card types and modules. The shelves differ only in physical
size and in the number of I/O slots supported 12 for the XDM-1000 and
XDM-2000 shelves, six for the XDM-500 shelf, and five for the XDM-400 shelf.
417006-2007-013-A01
2-1
2.1.1 XDM-100 Shelf Layout

The XDM-100 is available in four configurations:
Basic XDM-100 shelf
XDM-100 with I/O protection
Nonredundant XDM-100
Hybrid XDM-100H
Basic XDM-100 shelf
The basic XDM-100 shelf is housed in a 231 mm deep, 443 mm wide, and 200 mm
high equipment cage. The lower part of the shelf consists of the card cage and
accommodates the MXC (Main Cross-connect and Control) cards (main and
protection) and the ECU (External Connection Unit). The upper part of the shelf
consists of the module cage and houses up to eight I/O modules. Various types of
interface modules supporting PDH, SDH, and data services are available. The FCU
fan control unit at the right side of the shelf provides cooling air to the system.
All electrical connections are located directly in the tributary modules; therefore, the
XDM-100 does not need additional electrical interface connections.
To support system redundancy, each MXC card contains an integrated xINF (XDM
Input Filter) unit with connectors for two input power sources.
PIM345_3
AC
AC
FL
IN 1-21
FL
MON
MON
IN 1-21
TR
FL
MON
TR
OUT 1-21
PIM2_21
OUT 1-21
PIM2_21
PIM345_3
AC
TR
MON
AC
FL
OUT1
MON
IN1
MON
OUT2
IN2
MON
OUT3
TR
IN3
MON
OUT1
MON
IN1
OUT2
MON
IN2
OUT3
MON
IN3
MON
XDM -100
R
PIM345_3
AC
MON
MON
OUT 1-21
MXC-100
FL
TR
OUT 1-21
PIM2_21
-+
REMOVE SAM/OSC
MODULES
BEFORE CARD
EXTRACTION
POWER IN B
OUT1
MON
WARNING !!!
POWER IN A
-+
AC
FL
OUT2
MON
IN2
OUT3
TR
IN3
MON
OUT1
AC
FL
CLK
ON
IN1 OUT2
-+
REMOVE SAM/OSC
MODULES
BEFORE CARD
EXTRACTION
POWER IN A
-+
FAIL
TMU
IN2
OUT3
MON
ON
MON
IN
OUT
ON
MON
IN3 OUT4
ON
FL
IN1 OUT2
F-CHANNEL
T3_1/T4_1
CLASS 1 LASER PRODUCT

HAZARD CLASS 1M
LASER RADIATION
WHEN OPEN AVOID
EXPOSURE TO THE BEAM
IN2
OUT3
IN3 OUT4
FCU
IN4
FL
TR
CLK
ON
TR
MON
MON
ON
SAM15_1
MON
ON
MON
ON
MON
ON
ACTIVE
MON
FAIL
SAM1_4/0
MAIN
FAIL
TMU
ADB
NVM
NVM
ECU
DEBUG
IN4
MON
NVM
OUT1
AC
RESET
ALARMS
IN3
MON
ADB
NVM
POWER IN B
USB
OUT3
SAM1_4/0
MAIN
AC
ACT
IN2
MON
LASER KLASSE 1
ON
RESET
MXC-100
OUT2
TR
MON
MON
SAM15_1
WARNING !!!
IN1
MON
FL
TR
ACT
OUT1
MON
IN
OUT
AC
IN1
MON
T3_2/T4_2
MNG
MAIN
MNG
PROT
MODULE
CHANNEL
STM 1
LASER LED ACO
MON
ACTIVE TEST
WAR
MON
PIM2_21
AC
MIN
IN 1-21
TR
MAJ
FL
CRT
MON
FAIL
IN 1-21
TR
ACT
FL
PIM345_3
MON
AC
Figure 2-1: Basic XDM-100 shelf
2-2
417006-2007-013-A01
XDM-100 with I/O protection

A Tributary Protection Unit (TPU) is mounted on top of the XDM-100 basic shelf to
provide I/O protection to the I/O modules. The TPU adds only 75 mm to the basic
shelf height, allowing the XDM-100 to remain compact in size. It has five slots, four
allocated for Tributary Protection Modules (TPMs) and one for a Tributary Control
(TC) module.
Each TPM is connected to both operating and protection I/O modules in the shelf, in
a 1:1 or 1:3 configuration. If a failure is detected in one of the operating I/O
modules, the TC switches the traffic from the active to the protection I/O module.
OUT1
DDF #1
DDF #2
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4
OUT1
IN1
OUT2
IN2
FL
AC
PIM2_21 #1
AC
FL
IN 1-21
MON
IN 1-21
TR
FL
MON
TR
OUT 1-21
OUT 1-21
PIM2_21
PIM345_3
AC
TR
MON
PIM2_21
TPMH_1
PIM345_3
FL
MON
ACTIVE
TC
PROT
TPMH_1
AC
AC
IN4
MAIN
FL
PROT
PIM2_21 #3
TPM2_3
OUT4
PROTECT
MAIN
FL
PIM2_21 #2
IN3
FAIL
PROTECT
PIM2_21 PROTECT
OUT3
DDF #3
AC
AC
FL
OUT1
MON
IN1
MON
OUT2
IN2
MON
OUT3
TR
IN3
MON
OUT1
MON
IN1
OUT2
MON
IN2
OUT3
MON
IN3
MON
XDM -100
R
PIM345_3
AC
MON
MON
OUT 1-21
MXC-100
FL
TR
OUT 1-21
PIM2_21
-+
REMOVE SAM/OSC
MODULES
BEFORE CARD
EXTRACTION
POWER IN B
OUT1
MON
WARNING !!!
POWER IN A
-+
AC
FL
OUT2
MON
IN2
OUT3
TR
IN3
MON
OUT1
AC
FL
CLK
ON
-+
IN1 OUT2
REMOVE SAM/OSC
MODULES
BEFORE CARD
EXTRACTION
POWER IN A
-+
IN2
OUT3
MON
FAIL
OUT
TMU
NVM
IN
ON
MON
ON
MON
IN3 OUT4
ON
F-CHANNEL
T3_1/T4_1

HAZARD CLASS 1M
LASER RADIATION
WHEN OPEN AVOID
IN1 OUT2
IN2
OUT3
IN3 OUT4
FCU
IN4
FL
TR
CLK
ON
TR
MON
MON
ON
SAM15_1
MON
ON
MON
ON
MON
ON
ACTIVE
MON
FAIL
SAM1_4/0
MAIN
FAIL
TMU
ADB
NVM
NVM
ECU
DEBUG
IN4
MON
NVM
OUT1
AC
FL
RESET
ALARMS
IN3
MON
ADB
POWER IN B
USB
OUT3
SAM1_4/0
MAIN
AC
ACT
IN2
MON
LASER KLASSE 1
ON
SAM15_1
WARNING !!!
OUT2
TR
MON
MON
RESET
MXC-100
IN1
MON
FL
TR
ACT
OUT1
MON
IN
OUT
AC
IN1
MON
T3_2/T4_2
MNG
MAIN
MNG
PROT
MODULE
CHANNEL
STM 1
LASER LED ACO
MON
ACTIVE TEST
WAR
MON
PIM2_21
AC
MIN
IN 1-21
TR
MAJ
FL
CRT
MON
FAIL
IN 1-21
TR
ACT
FL
PIM345_3
MON
AC
Figure 2-2: XDM-100 with TPU (I/O protection)
417006-2007-013-A01
2-3
Nonredundant XDM-100
The XDM-100 nonredundant configuration has the same physical dimensions as the
basic shelf. It differs only by the single MXC-100 card that it has in slot MXC A,
compared with a couple of cards in the basic shelf. Slot MXC B of the nonredundant
configuration accommodates a bridging unit, MXC-BR. No redundancy is provided
for the MXC-100 functions in this configuration.
AC
AC
FL
MON
IN 1-21
FL
TR
MON
OUT 1-21
TR
MON
MON
OUT 1-21
PIM2_21
IN 1-21
PIM2_21
XDM -100
R
PIM345_3
AC
FL
MON
IN 1-21
AC
TR
FL
MON
TR
OUT 1-21
PIM2_21
MON
IN1
OUT1
MON
-+
MXC-100
POWER IN A
-+
POWER IN B
OUT2
MON
IN2
OUT3
MON
IN3
OUT1
AC
WARNING !!!
REMOVE SAM/OSC
MODULES
BEFORE CARD
EXTRACTION
IN1 OUT2
IN2
IN3 OUT4
OUT3
IN4
AC
OUT1
IN1 OUT2
IN2
FL
FL
LASER KLASSE 1
TR
TR
ON
MON
ON
MON
ON
MON
ON
MON
SAM4_2
MON
ON
MON
ON

HAZARD CLASS 1M
LASER RADIATION
WHEN OPEN AVOID
MON
SAM1_4/0
ACT
MAIN
FAIL
TMU
ADB
NVM
RESET
NVM
FCU
MXC-BRIDGE
ACTIVE
FAIL
T3_1/T4_1
T3_2/T4_2
MNG
MAIN
MNG
PROT
MODULE
CHANNEL
STM 1
LASER LED ACO
MON
ACTIVE TEST
CRT
MAJ
WAR
F-CHANNEL
MIN
DEBUG
FAIL
ALARMS
MON
ECU
USB
ACT
CONNECTED
Figure 2-3: XDM-100 nonredundant configuration
2-4
417006-2007-013-A01
Hybrid XDM-100H
The XDM-100H combines the SDH/SONET and data capabilities of the XDM-100
with the optical CWDM capabilities of the XDM-200. This is provided by the
software cost option incorporated within the NVM card in each of the MXC-100
cards.
The XDM-100H consists of the XDM-100 basic shelf, and if required, one or two
TPU/OCU shelves. The I/O module cage can accept any mix of the XDM-100 I/O
modules and XDM-200 CWDM I/O modules.
The TPU/OCU shelf is identical in its physical dimensions and number of slots
(five) to the TPU shelf. Four of the slots can house any mix of TPMs and CWDM
optical networking modules (mux/demux, OADM, and splitter/coupler); the fifth
slot always accommodates a TC module.
1511 1531
MUX
LINE OSC
IN OUT DROP1 DROP2
ADD1 ADD2
1511 1531
DEMUX
AC
1571
OSC LINE
IN OUT
1571
OSC LINE
OUT IN
DDF #1
1551
DDF #2
ACTIVE
DDF #3
AC
FL
FAIL
TC
PIM2_21 PROTECT
AC
FL
PIM2_21 #1
FL
TR
TR
MO_COADM2AB
PIM2_21 #2
MO_CMD4C
SIM1_4E
CTRP25_2S
AC
1551
OSC LINE
IN OUT
CLIENT1/LINE1
LINE 1
OUT1
IN1 OUT2
IN2
AC
CLIENT2/LINE2
LINE 2
IN3 OUT4
OUT3
IN4
PIM2_21 #3
TPM2_3
AC
FL
AC
FL
TR
MON
IN 1-21
FL
TR
FL
OUT1
TR
IN1
OUT2
IN2
OUT3
IN3
OUT4
MON
IN 1-21
TR
MON
IN4
MON
OUT 1-21
PIM2_21
OUT 1-21
PIM2_21
XDM -100
R
SIM4_2
AC
-+
WARNING !!!
POWER IN A
REMOVE SAM/OSC
MODULES
BEFORE CARD
EXTRACTION
-+
POWER IN B
MON
OUT 1-21
OUT1
AC
IN1 OUT2
IN2
AC
FL
LASER KLASSE 1
TR
TR
MON
ON
MON
ON
-+
MON
SAM16_1
SAM4_2
WARNING !!!
POWER IN A
REMOVE SAM/OSC
MODULES
BEFORE CARD
EXTRACTION
-+
POWER IN B
MAIN
FAIL
TMU
ADB
NVM
OUT1
AC
IN1 OUT2
NVM
FCU
AC
IN2
FL
FL
TR
TR
MON
ON
MON
ON
MON
ON
MON
ACTIVE
MON
MAIN
FAIL
TMU
ADB
NVM
RESET
NVM
ECU
USB
ALARMS
DEBUG
F-CHANNEL
T3_1/T4_1
FAIL
SAM16_1
SAM4_2
ACT

HAZARD CLASS 1M
LASER RADIATION
WHEN OPEN AVOID
MON
ON
MON
RESET
MXC-100
OUT 1-21
PIM2_21
FL
ACT
MON
IN 1-21
TR
PIM2_21
MXC-100
FL
MON
TR
TR
MON
IN 1-21
TR
FL
FL
AC
FL
IN2
T3_2/T4_2
MNG
MAIN
MNG
PROT
MODULE
CHANNEL
STM 1 LASER LED ACO

MON ACTIVE TEST
CRT
IN1 OUT2
MAJ
OUT1
WAR
AC
MIN
CLIENT2/LINE2
LINE 2
IN3 OUT4
IN4
OUT3
MON
CLIENT1/LINE1
LINE 1
IN1 OUT2
IN2
OUT1
FAIL
AC
ACT
CTRP25_2S
Figure 2-4: XDM-100H with one TPU/OCU shelf
417006-2007-013-A01
2-5

The compact XDM-200 is housed in a 300 mm deep, 450 mm wide, and 275 mm
high equipment cage. The lower part of the basic shelf accommodates the MXC card
and the ECU (External Connection Unit). To support system redundancy, the MXC
card contains an integrated xINF unit with connectors for two input power sources.
However, redundancy for communication and control and all other functions
provided by the MXC is not supported. The upper part of the shelf consists of the
module section, and houses up to eight I/O (transponder and combiner) modules.
The xFCU fan control unit at the right side of the shelf provides cooling air to the
system.
Various types of transponder modules with a variety of client data and SDH/SONET
interfaces are available for the module section. A combiner module supporting GbE,
FC, and FICON data services is also available.
The upper part of the XDM-200 consists of the OCU (Optical CWDM Unit), which
accommodates optical networking modules including mux/demux, OADM, and
splitter/coupler modules.
1511 1531 1551 1571
OSC LINE
IN OUT
MUX
1511 1531 1551 1571
OSC LINE
IN OUT
DEMUX 1511 1531 1551 1571
OSC LINE
OUT IN
DEMUX 1511 1531 1551 1571
OSC LINE
OUT IN
MUX
MUX
MUX
1511 1531 1551 1571
OSC LINE
IN OUT
DEMUX
1511 1531 1551 1571
OSC LINE
OUT IN
1511 1531 1551 1571
ACTIVE
FAIL
LINE OSC
IN OUT DROP1 DROP2
DEMUX
1511 1531 1551 1571
AC
FL
AC
AC
FL
FL
TR
TR
TR
MO_CMD4SL
MO_CMD4SL
CTRP25_2C
CLIENT1/LINE1
IN OUT
AC OUT
LINE1
IN
CLIENT2/LINE2
IN OUT
OUT
LINE2
CLIENT1/LINE1
IN OUT
AC OUT
LINE1
IN
CLIENT2/LINE2
IN OUT
OUT
LINE2
FL
TR
TR
ON
ON
LASER ON
FL
TR
CLIENT1
LINE1
IN OUT
IN
AC OUT
FL
TR
ON
TC
AC
CRPT25_2C
IN
FL
LASER ON
OSC LINE
IN OUT
MO_COADM2AB
CTRP25_2C
IN
ADD1 ADD2
ON
ON
ON
CRPT25_2C
CLIENT1
LINE1
IN OUT
IN
AC OUT
CLIENT2
LINE2
IN OUT
IN
OUT
CLIENT2
LINE2
IN OUT
IN
OUT
FL
TR
LASER ON
ON
ON
ON
LASER ON
ON
ON
ON
XDM -200
R
CRPT25_2C
LINE1
CLIENT1
IN OUT
IN
AC OUT
CRPT25_2C
LINE2
CLIENT2
OUT
IN OUT
IN
LINE1
CLIENT1
IN OUT
IN
AC OUT
CTRP25_2C
CRPT25_2C
LINE2
CLIENT2
OUT
IN OUT
IN
LINE1
CLIENT1
IN OUT
IN
AC OUT
LINE1
CLIENT1/LINE1
IN OUT
IN
AC OUT
LINE2
CLIENT2
OUT
IN OUT
IN
FL
FL
FL
FL
TR
TR
TR
TR
LASER ON
ON
ON
ON
LASER ON
ON
ON
-+
MXC
ON
LASER ON
AC
WARNING !!!
WEST
OUT
ON
ON
IN
OUT
EAST
LASER ON
ON
ON
LINE2
CLIENT2/LINE2
OUT
IN OUT
IN
ON
ON
IN
FL
TR
POWER IN A
REMOVE SAM/OSC
MODULES
BEFORE CARD
EXTRACTION
-+
POWER IN B
LASER KLASSE 1

HAZARD CLASS 1M
LASER RADIATION
WHEN OPEN AVOID
ON
LASER ON
OSC1_2
MAIN
ACT
FAIL
TMU
ADB
NVM
RESET
FCU
F-CHANNEL
T3_1/T4_1
MAJ
CRT
WAR
MIN
DEBUG
FAIL
T3_2/T4_2
MNG
MAIN
MNG
PROT
MODULE
CHANNEL
STM 1
LASER LED ACO
MON
ACTIVE TEST
MON
ALARMS
FAIL
ECU
5
USB
ACT
ACTIVE
Figure 2-5: XDM-200 shelf
2-6
417006-2007-013-A01
IN8
OUT8
OUT16
IN15
IN7
OUT7
OUT15
IN14
IN6
OUT6
OUT14
IN13
IN5
OUT5
OUT13
OUT4
IN12
OUT12
OUT3
IN2
OUT2
IN1
OUT1
IN3
OUT11
IN10
OUT10
IN9
OUT9
IN11
IN4
IN16
The compact XDM-400 shelf is located in a 285 mm deep, 450 mm wide, and 500
mm high equipment cage. It consists of a single-row cage housing I/O, matrix,
processor, and common cards in the middle and right side of the shelf. The electrical
interface connection modules are housed in two slots on the left side of the shelf.
The shelf also contains two xINF4 (XDM-400 Input Filter) units and an xFCU4
(XDM-400 Fan Control Unit) that consists of five separate fans to support system
redundancy.
Figure 2-6: XDM-400 shelf open view
417006-2007-013-A01
2-7

The XDM-500 compact shelf is located in a 285 mm deep, 450 mm wide, and
725 mm high equipment cage, as illustrated in Figure 2-7. The shelf consists of a
single-row cage housing the I/O, matrix, processor, and common cards in two slot
areas on either side of the shelf. The electrical interface connection modules and
DWDM/OADM modules are housed in the central slot area. The shelf also includes
two xINF units and three xFCU units.
ACTIVE
FAIL
FAIL
ACTIVE
ACTIVE
ACTIVE
ACTIVE
FAIL
FAIL
FAIL
xFCU
xFCU
xFCU
Figure 2-7: XDM-500 shelf open view
2-8
417006-2007-013-A01

The standard XDM-1000 is located in a 285 mm deep, 450 mm wide and 1100 mm
high shelf with a module cage and a card cage section, as illustrated in Figure 2-8.
The cards cage houses the I/O, matrix, processor, and common cards. The modules
cage houses the electrical interface connection modules and DWDM/OADM
modules. The shelf also includes two xINFs and three xFCU.
FAIL
ACTIVE
ICBL
XINF
PW1
FAIL
ACTIVE
ALARM
ICBR
XINF2
PW2
xRAP
REF-IN
REF-OUT
OW. NET SEL
Figure 2-8: XDM-1000 standard shelf open view
417006-2007-013-A01
2-9

The XDM-2000 shelf is located in a 285 mm deep, 450 mm wide, and 775 mm high
equipment cage. The shelf consists of a single-row cage that houses optical cards
(transponders, mux/demux, optical amplifiers), and xMCP and MECP cards.
XDM-500 and XDM-2000 shelves may be used in conjunction with the regular
XDM-1000 shelf in the same rack.
OW. NET SEL
ACTIVE
ACTIVE
ACTIVE
FAIL
FAIL
FAIL
xFCU
xFCU
xFCU
Figure 2-9: XDM-2000 open view
2-10
417006-2007-013-A01
2.1.7 Rack Layouts and Expansion Shelves

The various XDM shelves can be installed both in standard or ECI-recommended
ETSI racks, and in 19 and 23 racks.
The ETSI rack offered by ECI Telecom is specially designed for installation of
telecommunication equipment and a large variety of equipment accessories. To
facilitate cable routing, the rack has removable rear and side panels, which enable
tidy leading and efficient maintenance of all rack cables. Two plastic conduits on the
racks front rails support routing of up to 200 optical fibers. It also has open top and
bottom frames to facilitate easy routing of cables from suspension floors and/or
ceiling ladders. The front door can be mounted for right or left opening.
The XDM-100 or XDM-200 can be installed in either 2200 mm or 2600 mm ETSI
racks, as well as in 19 and 23 racks. Figure 2-10 shows the layout of three shelves
in ECI Telecoms 2600 mm ETSI rack.
417006-2007-013-A01
2-11
POWER ON
CRITICAL
MAJOR
MINOR
WARNING
xRAP-100
xRAP-100
SOURCE A
SOURCE B
(FST)
Fiber Storage Tray
Fiber guide
Cable guide
OUT1
DDF #1
DDF #2
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4
OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4
ACTIVE
DDF #3
FAIL
AC
FL
PRO TECT
PIM2_21 PROTECT
AC
PIM2_21 #1
FL
IN 1-21
MON
IN 1-21
PIM345_3
AC
TR
AC
FL
MON
OUT 1-21
TPMH_1
PIM345_3
FL
MON
TR
PROT
TPMH_1
PIM2_21 #3
TPM2_3
AC
FL
FL
TR
OUT 1-21
PIM2_21
MAIN
FL
PROT
PIM2_21 #2
AC
MON
PIM2_21
TC
P ROTECT
AC
MAIN
OUT1
MON
IN1
OUT2
MON
IN2
MON
OUT3
TR
IN3
OUT1
MON
MON
IN1
OUT2
IN1
OUT2
MON
IN2
OUT3
IN2
OUT3
MON
IN3
MON
XDM -100
R
PIM345_3
AC
TR
FL
MON
OUT 1-21
FL
TR
OUT 1-21
PIM2_21
-+
MXC-100
AC
POWER IN A
-+
POWER IN B
AC
OUT
IN1
OUT1
MON
WARNING !!!
OUT2
MON
IN2
MON
OUT3
TR
IN3
MON
CLK
ON
WARNING !!!
POWER IN A
-+
FAIL
TMU
MON
ON
MON
ON
MON
ON
NVM
AC
IN2
IN1 OUT2
OUT1
IN3 OUT4
OUT3
CLK
ON
FCU
TR
MON
MON
ON
MON
ON
MON
ON
MON
ON
T3_1/T4_1
ACTIVE
MON
FAIL
SAM1_4/0
MAIN
FAIL
TMU
T3_2/T4_2
MNG
XDM-100 with TPU
ADB
NVM
NVM
MAIN
MNG
PROT
MODULE
C RT
ECU
F-CHANNEL
IN4
FL
TR
RESET
DEBUG

HAZARD CLAS S 1M
LA SER RA DIATI ON
WHEN OPEN A VOI D
MON
ADB
NVM
IN
OUT
FL
SAM15_1
ACT
ALARMS
IN4
LASER KL AS SE 1
ON
POWER IN B
USB
IN3
MON
IN3 OUT4
SAM1_4/0
MAIN
AC
REMOVE SAM/OSC
MODULES
BEFORE CARD
EXTRACTION
OUT3
TR
MON
MON
RESET
-+
MXC-100
MON
IN2
FL
SAM15_1
ACT
MON
IN1 OUT2
OUT1
AC
TR
REMOVE SAM/OSC
MODULES
BEFORE CARD
EXTRACTION
OUT1
MON
IN
FL
STM 1 LASER LED ACO

MON
ACTIVE TEST
CHANNEL
W AR
MON
PIM2_21
PIM345_3
AC
MIN
TR
MON
IN 1-21
MA J
FL
MON
FAIL
IN 1-21
ACT
FL
MON
AC
(FST)
Fiber Storage Tray
Fiber guide
Cable guide
OUT1
DDF #1
DDF #2
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4
OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4
ACTIVE
DDF #3
FAIL
AC
FL
PRO TECT
PIM2_21 PROTECT
AC
PIM2_21 #1
PIM2_21 #2
TPM2_3
FL
IN 1-21
MON
IN 1-21
PIM345_3
AC
TR
AC
FL
MON
OUT 1-21
TPMH_1
TPMH_1
PIM345_3
FL
MON
TR
PROT
PIM2_21 #3
AC
AC
MON
FL
TR
OUT1
OUT 1-21
PIM2_21
MAIN
FL
PROT
PIM2_21
TC
P ROTECT
AC
MAIN
FL
MON
IN1
OUT2
MON
IN2
MON
OUT3
TR
IN3
OUT1
MON
MON
IN1
OUT2
MON
IN2
OUT3
MON
IN3
MON
XDM -100
R
PIM345_3
AC
MON
PIM345_3
AC
AC
TR
FL
FL
TR
TR
OUT 1-21
POWER IN A
-+
POWER IN B
OUT1
MON
WARNING !!!
AC
REMOVE SAM/OSC
MODULES
BEFORE CARD
EXTRACTION
TR
IN1
OUT2
MON
IN2
MON
OUT3
IN3
MON
AC
MON
ON
MON
ON
IN2
FAIL
OUT
TMU
IN2
IN1 OUT2
IN3 OUT4
OUT3
FCU
IN4
TR
MON
MON
ON
MON
ON
MON
ON
MON
ON
T3_1/T4_1
ACTIVE
MON
FAIL
SAM1_4/0
FAIL
TMU
T3_2/T4_2
MNG
XDM-100 with TPU
ADB
NVM
NVM
MAIN
MNG
PROT
MODULE
CR T
ECU
F-CHANNEL

HAZARD CLAS S 1M
LA SER RA DIATI ON
WHEN OPEN A VOI D
NVM
OUT1
AC
CLK
ON
MAIN
RESET
DEBUG
IN4
MON
FL
TR
ACT
ALARMS
IN3
MON
ON
ADB
NVM
IN
FL
SAM15_1
POWER IN B
USB
OUT3
IN3 OUT4
MON
SAM1_4/0
MAIN
AC
REMOVE SAM/OSC
MODULES
BEFORE CARD
EXTRACTION
OUT3
LASER KL AS SE 1
ON
SAM15_1
WARNING !!!
POWER IN A
-+
OUT2
MON
IN2
TR
MON
MON
RESET
-+
MXC-100
IN1
MON
IN1 OUT2
OUT1
FL
CLK
ON
ACT
OUT1
MON
IN
OUT
FL
STM 1
LASER LED ACO
MON
ACTIVE TEST
CHANNEL
W AR
PIM2_21
-+
MXC-100
MIN
OUT 1-21
PIM2_21
IN 1-21
MA J
FL
MON
IN 1-21
AC T
MON
TR
FA IL
FL
MON
AC
MON
(FST)
Fiber Storage Tray
Fiber guide
Cable guide
OUT1
DDF #1
DDF #2
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4
OUT1
IN1
OUT2
IN2
FL
PIM2_21 PROTECT
AC
PIM2_21 #1
IN 1-21
MON
IN 1-21
TPMH_1
PIM345_3
AC
TR
AC
FL
MON
OUT 1-21
FL
TR
OUT 1-21
PIM2_21
ACTIVE
TC
PROT
TPMH_1
PIM345_3
FL
MON
TR
IN4
MAIN
FL
PROT
PIM2_21 #3
TPM2_3
AC
FL
OUT4
P ROTECT
AC
MAIN
FL
PIM2_21 #2
AC
MON
IN3
FAIL
PRO TECT
PIM2_21
OUT3
DDF #3
AC
OUT1
MON
IN1
MON
OUT2
IN2
MON
OUT3
TR
IN3
MON
OUT1
MON
IN1
OUT2
IN1
OUT2
MON
IN2
OUT3
IN2
OUT3
MON
IN3
MON
XDM -100
R
PIM345_3
AC
FL
MON
FL
TR
OUT 1-21
PIM2_21
-+
POWER IN A
-+
POWER IN B
OUT1
MON
WARNING !!!
REMOVE SAM/OSC
MODULES
BEFORE CARD
EXTRACTION
AC
OUT
IN1
MON
OUT2
MON
IN2
OUT3
TR
IN3
MON
OUT1
AC
MON
IN1 OUT2
TR
CLK
ON
-+
WARNING !!!
POWER IN A
-+
REMOVE SAM/OSC
MODULES
BEFORE CARD
EXTRACTION
MON
ON
MON
MAIN
AC
ON
MON
ON
FAIL
OUT
TMU
DEBUG
F-CHANNEL
T3_1/T4_1

HAZARD CLAS S 1M
LA SER RA DIATI ON
WHEN OPEN A VOI D
MON
ADB
NVM
IN
NVM
AC
FL
OUT1
IN1 OUT2
IN2
OUT3
IN3 OUT4
IN4
FCU
FL
TR
CLK
ON
TR
MON
MON
ON
SAM15_1
MON
ON
MON
ON
MON
ON
ACTIVE
MON
SAM1_4/0
MAIN
FAIL
TMU
T3_2/T4_2
MNG
FAIL
XDM-100 with TPU
ADB
NVM
NVM
ECU
ALARMS
IN4
LASER KL AS SE 1
ON
RESET
USB
IN3
MON
IN3 OUT4
SAM1_4/0
POWER IN B
ACT
OUT3
TR
MON
MON
RESET
MXC-100
MON
IN2
FL
SAM15_1
ACT
OUT1
MON
IN
FL
MAIN
MNG
PROT
MODULE
CHANNEL
STM 1
LASER LED ACO
MON
ACTIVE TEST
WA R
OUT 1-21
MXC-100
AC
MIN
IN 1-21
TR
MON
PIM2_21
PIM345_3
AC
CR T
TR
MON
MAJ
FL
A CT
IN 1-21
MON
FAIL
FL
MON
AC
Figure 2-10: Three XDM-100 or XDM-200 shelves in a 2600 mm ECI Telecoms

recommended ETSI rack
2-12
417006-2007-013-A01
The XDM-400 can be installed in either 2200 mm or 2600 mm ETSI racks, as well
as in 19 and 23 racks.
POWER ON CRITICAL
SHELF 1
SHELF 2
WARNING
IN8
IN16
OUT16
OUT8
IN7
IN15
OUT15
OUT7
IN6
IN14
OUT14
OUT6
IN5
IN13
OUT13
OUT5
IN4
IN12
OUT12
OUT4
IN3
IN11
OUT11
OUT3
IN2
IN10
OUT10
OUT2
IN1
IN9
OUT9
OUT1
IN8
IN16
OUT16
OUT8
IN7
IN15
OUT15
OUT7
IN6
IN14
OUT14
OUT6
IN5
IN13
OUT13
OUT5
IN4
IN12
OUT12
OUT4
IN3
IN11
OUT11
OUT3
IN2
OUT2
IN1
OUT1
IN10
OUT10
IN9
OUT9
IN8
IN16
OUT16
OUT8
IN7
IN15
OUT15
OUT7
IN6
IN14
OUT14
OUT6
IN5
IN13
Cable guide
OUT5
OUT13
SHELF 1
SOURCE B
IN4
IN12
SHELF 2
OUT4
OUT12
IN11
OUT11
OUT2
IN1
OUT1
IN10
OUT10
IN9
OUT9
XDM-400
shelf
MINOR
IN3
XDM-400
shelf
xRAP
SOURCE A
OUT3
XDM-400
shelf
MAJOR
IN2
xRAP
Figure 2-11: Three XDM-400 shelves in a 2600 mm rack
417006-2007-013-A01
2-13
The XDM-1000 can be installed in either a 2200 mm or 2600 mm ETSI rack. Two
XDM-1000 shelves can be installed in a 2600 mm rack, whereas a 2200 mm rack
can accommodate only a single XDM-1000 shelf.
Alternatively, two XDM-500 and/or XDM-2000 shelves can be installed in a
2200 mm rack. One XDM-1000 shelf and one XDM-500 or XDM-2000 shelf can be
installed in a 2600 mm rack.
The installation of XDM-500, XDM-1000 and XDM-2000 in 19 or 23 racks is
supported as well.
In addition, a 600 mm deep rack can house XDM shelves in a back-to-back
configuration, thus doubling the capacity of the rack.
Several racks can be combined to expand the I/O interface capacity of a single XDM
shelf. In this configuration, the XDM shelf containing the matrix core is considered
the master shelf. The other units are used as expansion shelves, providing a capacity
of over 22,000 E1 or 1,152 DS-3 ports in a complete XDM 384 STM-1/OC-3
equivalent system.
2-14
417006-2007-013-A01
Figure 2-12: XDM-1000 and XDM-500 shelves in a 2600 mm rack
417006-2007-013-A01
2-15
Figure 2-13: Two XDM-500 shelves installed in a 2200 mm rack
2-16
417006-2007-013-A01
Rear
extendable
installation
rail
Fiber spooler
POWER ON CRITICAL
xRAP
MAJOR
MINOR
WARNING
SHELF 1
SHELF 2
SHELF 2
xRAP
SOURCE A
SHELF 1
SOURCE B
XDM-2000
shelf
ACTIVE
ACTIVE
FAIL
ACTIVE
FAIL
xFCU
FAIL
xFCU
xFCU
Heat buffer
XDM-2000
shelf
ACTIVE
ACTIVE
FAIL
FAIL
xFCU
ACTIVE
FAIL
xFCU
xFCU
417006-2007-013-A01
2-17
Rear
extendable
installation
rail
Fiber spooler
xRAP
POWER ON CRITICAL
MAJOR
MINOR
WARNING
SHELF 1
SHELF 2
SOURCE A
xRAP
SHELF 2
SHELF 1
SOURCE B
xRAP holder
XDM-1000 shelf
Heat buffer
Cable guide
XDM-1000 shelf
2-18
417006-2007-013-A01
2.2 XDM-100 Card and Module Layout

2.2.1 Basic XDM-100 Shelf
The basic XDM-100 cage contains slots for I/O interface modules, and dedicated
slots for the MXC cards and the ECU. The cages design and mechanical practice
conform to international mechanical standards and specifications.
The modules and cards are distributed as follows:
Eight (8) slots, I1 to I8, optimally allocated for I/O interface modules.
Two (2) slots, A and B respectively, allocated for the MXC cards (main and
protection). Each MXC card has two slots (A1 and A2 and B1 and B2) to
accommodate SDH aggregate modules.
One (1) slot allocated for the ECU card.
The ECU is located beneath the MXC cards. Its front panel features several interface
connectors for management, external timing, alarms, orderwire and overhead (future
release). It also includes alarm severity colored LED indicators and selectors plus a
display for selecting specific modules and ports for monitoring purposes.
I1
I2
I3
I4
I5
I6
I7
I8
MXC-A
MXC-B
A1
A2
B1
B2
FCU
ECU
Figure 2-16: XDM-100 slot allocation
417006-2007-013-A01
2-19
2.2.2 Expanded XDM-100 Shelf with I/O Protection

A TPU (Tributary Protection Unit) shelf can be mounted on top of the XDM-100
basic shelf to add protection of electrical I/O modules.
The TPU is a single-shelf cage with slots for the TPMs (Tributary Protection
Modules) and TC (Tributary Control) or TCF (Tributary Control and Fan) modules.
The modules are distributed as follows:
Four (4) slots flexibly allocated for TPMs (single-slot or double-slot modules
are supported)
One (1) slot allocated for the TC or TCF module
Each TPM is connected to the operating and protection modules of the XDM-100
shelf respectively. If a failure is detected in one of the operating I/O modules, the
XDM-100 control system sends control signals to the appropriate TPM relays to
switch traffic from the operating I/O module to the protection module. Several types
of TPMs for 1:1 or 1:3 protection schemes are supported.
The TC or TCF is connected to the DC and control buses of the MXC cards via the
TPU backplane. It controls the switching of traffic from the main to protection I/O
module by relays in the corresponding TPM. In addition, the TCF has four fans that
provide cooling air to the modules installed in the TPU (optional).
2.2.3 Nonredundant XDM-100 Shelf

The XDM-100 is also available in a nonredundant configuration. This shelf is
equipped with only one MXC card. The second position of the MXC houses an
MXC-BG card that bridges the buses of the second slot to the I/O modules.
Redundancy for power supply, timing and synchronization, cross-connect, and all
other MXC functions is not supported in this configuration. However, since the
MXC has two aggregate modules, SNCP, MSP, and MS-SPRing traffic protection
mechanisms are supported.
2.2.4 Hybrid XDM-100 Shelf Configuration

(XDM-100H)
The XDM-100H platform is based on the XDM-100 basic shelf, with a-software
cost option that supports installation of any mix of the XDM-100 I/O modules with
optical I/O modules in the module cage. In addition, one or two TPU/OCU shelves
can be mounted on top of the basic shelf to support any mix of TPM and CWDM
optical networking modules.
2-20
417006-2007-013-A01
The XDM-100H consists of the following units:

Basic XDM-100 shelf that includes the ECU (External Connection Unit,
ECU or ECU-F), two MXC-100 cards, the I/O module cage with eight slots,
and the FCU (Fan Control Unit). Each MXC-100 card houses an NVM
module, which contains the licensed option software.
The eight slots of the I/O module cage support installation of XDM-100 I/O
modules, as well as CWDM I/O modules (transponders and combiners).
TPU/OCU shelf (optional), mounted on top of the XDM-100 basic shelf,
contains five slots: four for supporting any mix of mux/demux, OADM,
splitter/coupler, and TPM modules and one for a Tributary Control (TC)
module. One or two TPU/OCUs can be mounted on the XDM-100 basic
shelf.
417006-2007-013-A01
2-21
2.3 XDM-200 Cards and Modules Layout

The XDM-200 platform comprises the following units:
Basic XDM-200 shelf houses the common cards and I/O (transponder and
combiner) modules
OCU (Optical CWDM Unit) shelf located on top of the basic shelf,
accommodates passive optical networking (mux/demux, OADM, and
splitter/coupler) modules and a control module
The basic XDM-200 shelf consists slots for I/O (transponder and combiner)
modules and dedicated slots for the MXC and ECU cards. The XDM-200 design and
mechanical practice conform to international mechanical standards and
specifications. The slots for modules and cards are distributed as follows:
Eight (8) slots optimally allocated for I/O modules
One (1) slot allocated for the MXC card
One (1) slot allocated for the ECU card
OCU
cage
OCM1
OCM2
OCM3
OCM4
I1
I2
I3
I4
I5
I6
I7
I8
A1
MXC-A
TC
A2
FCU
ECU
Figure 2-17: XDM-200 system card and module layout
2-22
417006-2007-013-A01
The OCU comprises a single section with slots for optical (mux/demux, OADM,
splitter/coupler) and control modules. The modules are distributed as follows:
Four (4) slots allocated for optical modules
One (1) slot allocated for the TC module
The OCU is mounted on the upper part of the XDM-200 shelf. The optical and TC
modules connect to the DC power and control buses via the OCU backplane. All
connectors on the optical networking modules are LC connectors.
417006-2007-013-A01
2-23
2.4 MXC and ECU Cards

The XDM-100 MXC (Main Cross-Connect and Control) and ECU (External
Connection Unit) cards were designed to facilitate simple installation and
maintenance. They feature:
Electrical interface connectors that are integrated into the I/O modules,
saving the need for separate electrical interface modules
Easy routing of external management interfaces
A monitoring system for acceptance test purposes
Hot insertion of cards and modules to support quick maintenance and repair
activities, without affecting traffic
2.4.1 MXC
The basic and expanded versions of the XDM-100 shelf accommodate two identical
MXC cards. By default, the MXC-A is the main card and MXC-B is the protection
card. Both cards perform the following functions simultaneously in a 1+1 protection
configuration:
Communications and control
Alarm and maintenance
Cross-connect
Timing and synchronization
Distribution of power supply to all modules (xINF function)
Routing and handling of 32 DCC channels
In addition, the MXC accommodates the NVM compact flash memory card and
houses SDH aggregate modules (SAMs).
The additional MXC card provides 1+1 protection to the cross-connect matrix and
full 1:1 protection to all other functions, since the standby MXC has an identical
database to the active MXC.
In case of a hardware failure in the active MXC or its traffic interconnection, the I/O
interface modules switch to the protection MXC within 50 ms. Similarly, in case of
a hardware failure in the TiMing Unit (TMU) of the operational MXC card, the
backup TMU takes over the timing control with no disruption in traffic. The
operational MXC card is configured by eNM LightSoft, ECI Telecoms Optical
Network Divisions multidimensional network manager.
2-24
417006-2007-013-A01
2.4.2 ECU
The ECU connects management, alarms, overhead access, and orderwire interfaces
to the active MXC card. This card also provides the physical connections for these
interfaces.
Two types of ECU cards are available for the XDM-100: ECU-F and ECU (reduced
cost).
The ECU-F supports the following management and alarm interfaces and functions:
Ethernet interface to eNM LightSoft and EMS-XDM (XDM Element
Management System)
Ethernet hub for multiple NE connections
Serial (RS-232) interface for craft terminal
USB interface (future option)
Synchronization inputs and outputs (T3/T4)
Alarm severity outputs (Critical, Major, Minor, Warning)
External alarm outputs and inputs
Alarm Cut Off (ACO)
Operation and alarm LEDs
Selection and display of traffic interfaces for monitoring purposes
Monitor interface for STM-1 ports
Laser activation during ALS, for maintenance purposes
Multiplexer reset
Holdup capacitors
Lamp test activation
The ECU (reduced cost) card supports all functions provided by the ECU-F except
for Ethernet expansion to hub, monitoring points, holdup capacitors, and alarms
in/out.
417006-2007-013-A01
2-25
2.5 XDM-400 Card Layout

The XDM-400 shelf consists of a single cage containing slots for five I/O cards, and
dedicated slots for the XIO (matrix-I/O), processor and common cards in the middle
and right side of the shelf. The electrical interface connection modules are housed in
two slots on the left side of the shelf. The XDM-400s cage design and mechanical
practice conform to international mechanical standards and specifications. The cards
are distributed as follows:
Five (5) slots (IS1 to IS5) optimally allocated for I/O cards
Two (2) slots (MS1 and MS2) allocated for electrical interface connection
modules
Two (2) slots (X1 and X2) allocated for XIO-192 (matrix-I/O) cards
Two (2) slots (C1 and C2) allocated for xMCP cards
An external connection module, the MECP, is located above the xMCP cards. It
connects the management, overhead access (OHA), and orderwire (OW) interfaces
to the active xMCP.
ACTIVE FAIL
xFCU4
Figure 2-18: XDM-400 typical card layout
2-26
417006-2007-013-A01

The XDM-500 shelf consists of a single cage containing slots for six I/O cards, four
connection modules, and dedicated slots for the matrix, processor and common
cards. The XDM-500 cage design and mechanical practice conform to international
mechanical standards and specifications. The cards are distributed as follows:
Six (6) slots (IC1 to IC6) flexibly allocated to I/O cards and/or transponders
(depending on the configuration)
Four (4) slots (#2-#5) allocated to electric interface connection modules or
DWDM/OADM modules
Two (2) slots (X1 and X2) allocated to the HLXC or XIO matrix cards
Two (2) slots (C1 and C2) allocated to the xMCP cards
An external connection module, the MECP, is located above the xMCP cards for
connecting the management, overhead access (OHA), and orderwire (OW)
interfaces to the active xMCP card.
Figure 2-19: XDM-500 standard card layout
417006-2007-013-A01
2-27

The XDM-1000 standard shelf consists of a modules cage housing the connection
modules, a cards cage housing the I/O and common cards, input filters, and fan
control units. The XDM-1000 standard card layout is illustrated in Figure 2-20 and
is allocated as follows:
Modules cage
Eleven (11) slots (M-IO1 to M-IO11) allocated to electric interface
connection modules or DWDM/OADM, optical booster, optical preamp
modules
Two xINFs (Input Power Filters)
Cards cage
Twelve (12) slots (IO1 to IO12) flexibly allocated to I/O cards and/or
transponders (depending on the configuration)
Two (2) slots (X1 and X2) allocated to the HLXC matrix cards
Two (2) slots (C1 and C2) allocated to the xMCP cards
An external connection module, the MECP, is located in the cards cage of the
XDM-1000 shelf above the xMCP cards. It is used to connect the management,
overhead access (OHA), and orderwire (OW) interfaces to the active xMCP card.
The modules cage contains 11 double-slot connection modules. Electrical I/O cards
installed in the cards cage interface with the XDM-1000 shelf via interface
connection modules installed in the modules cage. The modules are extractable, thus
allowing a flexible assignment of physical I/O ports.
Optical I/O cards utilize internal slide-in I/O modules for signal interfacing and do
not require connection modules in the modules cage. The free modules cage slots in
optical systems can therefore be allocated to DWDM or OADM multiplexing and
amplification modules.
2-28
417006-2007-013-A01
417006-2007-013-A01
2-29

The XDM-2000 shelf consists of a single cage whose slots can be allocated as
follows:
Twelve (12) slots allocated to transponders and other optical modules
Two (2) slots allocated for mux/demux or matrix cards (depending on the
system configuration)
Two (2) slots allocated to the xMCP cards
The external connection module, the MECP, is located in the upper section of the
cage.
The cage design and mechanical practice of the XDM-2000 conform to international
mechanical standards and specifications.
2-30
417006-2007-013-A01
2.9 XDM Control, Matrix and I/O Cards

XDM shelves have been designed to facilitate simple installation and easy
maintenance. They incorporate the following layout features:
The connection modules in the modules cage (XDM-1000 shelf) are located
as close as possible to the I/O cards in the cards cage
The HLXC-L, HLXC-R, and XIO matrix cards are located near the sidewall
of the shelf to facilitate the routing of the traffic buses to the I/O cards
The xMCP control cards are located such that they simplify the identification
of any control problem issues
The MECP unit is located above the xMCP cards to facilitate the routing of
the external management interfaces
2.9.1 HLXC
The XDM platform (XDM-500, XDM-1000, and XDM-2000) contains two identical
Hi-Lo Cross-connect Matrix (HLXC) cards. Both cards perform the cross-connect
and node synchronization functions simultaneously in a 1+1 protection
configuration. In case of a hardware failure in the operational HLXC or its traffic
interconnections, the I/O interface cards switch to the backup HLXC within 50 ms.
Similarly, in case of a hardware failure in the TMU of the operational HLXC, the
backup TMU takes over the timing control with no traffic disruption. The
operational HLXC is determined by the eNM LightSoft network manager.
2.9.2 XIO
The XDM can optionally contain two identical Cross-Connect Input/Output (XIO)
cards (for the XDM-400 the XIO is the only dedicated matrix card). XIO cards
consist of a matrix unit and SDH/SONET interfaces on the same basecard. Like the
HLXC that it replaces, XIO cards perform the cross-connect and node
synchronization functions simultaneously in a 1+1 protection configuration. Upon
detection of a hardware failure in the XIO or its traffic interconnections, I/O
interface cards can switch to the backup XIO card within 50 ms. If required the
backup TMU can take over timing control from the operational XIO with no traffic
disruption. As an I/O card, the XIO supports 1 x STM-16/OC-48 interface,
4 x STM-1/OC-3 interfaces, or 1 x STM-4/OC-12 interface. The XIO card includes
several optical transceiver options to meet various optical performance
requirements.
417006-2007-013-A01
2-31
2.9.3 xMCP
The Main Control Processor (xMCP) card performs the communications, control,
alarm, and maintenance functions for the XDM. An additional xMCP card may
optionally provide full capability 1:1 protection since the standby xMCP has an
identical database to the active xMCP. Upon a failure of the active xMCP, the
standby xMCP card becomes the active control unit.
The xMCP is also responsible for communicating with external network elements
and management stations. It communicates with other SDH/SONET NEs via the
DCC channel embedded in each SIO link. In addition, the xMCP provides multiple
access to all overhead bytes in all incoming SDH/SONET lines. It provides 64 Kbps
and N x 64 Kbps trail capability for transporting management data, external DCC
channels or for external DCN purposes.
2.9.4 MECP
The Main Equipment Control Panel (MECP) connects the management, overhead
access (OHA), and orderwire (OW) interfaces to the active xMCP card. The
physical management connections are provided by the External Connection Board
(ECB) located above the MECP.
The MECP supports standard OW as well as a special voice channel over the DCC
when using VoIP and a special router. This feature enables external calls from
outside the network to a particular site. In addition, the MECP generates system
alarms and activates indicators, for example, software downloads, restarts,
configurations, and so on.
In pure optical networks and inline amplifier sites, one of two special MECP
versions is supplied to support the optical supervisory channel operating at 1510 nm
or 1310 nm.
2.9.5 ECB or xECB4

The External Connection Board (ECB) provides the physical interface between the
XDM and external management and clock devices. This card is also available in a
special version, xECB4, for the XDM-400.
2-32
417006-2007-013-A01
3
XDM-100 Specifications
3.1 Cross-Connect Specifications
3.1.1 Cross-Connect Levels
Cross-connect levels........................................................ VC-4nc, VC-4, VC-3, VC-2, VC-12
SONET cross-connect levels............................................................................. STS-nc, STS-1
3.1.2 Cross-Connect Capacity

SDH switch core options..........192* x STM-1/OC-3 with cross-connect capability of 4/3/2/1
SONET switch core options.......................................................................... 192 x OC-3, 3/33
* 128 used for redundant XDM-100 configuration; additional 64 used for non-redundant XDM-100
configuration for SNCP purposes.
3.2 Traffic Protection

Applicable specifications ................ITU-T G.841, G.842, GR-1230-CORE, GR-1400-CORE
SNCP I/N LO, HO ............................................................................................... within 30 ms
UPSR.................................................................................................................... within 30 ms
MSP/APS 1+1 ...................................................................................................... within 50 ms
MS-SPRing/BLSR .............................................................................................. within 50 ms
3.3 Redundancy
Control and synchronization systems................................................................ 1+1 duplicated
Switching matrix, power system, internal buses, external buses ...................... 1+1 duplicated
I/O electrical modules protection ........................................................................... 1:1 and 1:3
417006-2007-013-A01
3-1
3.4 Synchronization
There are four timing references available from SDH/SONET/PDH/Async multiple timing
sources:
From any 2 MHz/2 Mbps/SONET 1.5 Mbps PDH/Async tributary interface
From any SDH/SONET line
External 2 MHz/2 Mbps/SONET 1.5 Mbps timing outputs (2 per shelf)
G.813 internal clock
Synchronization Status Marker (SSM) support is provided as well.
3.5 Jitter and Wander

Applicable specifications ......................................................................... ITU-T G.823, G.825
3.6 I/O Interfaces

3.6.1 2 Mbps (E1)
Physical level ............................................................................................. G.703, Paragraph 6
Frame options............................................................................................................ Unframed
Line code.........................................................................................................................HDB3
Line impedance ....................................................................120 balanced/75 unbalanced
3.6.2 34 Mbps (E3)

Frame .............................................................................................................................. G.751
Line code.........................................................................................................................HDB3
Line impedance .............................................................................................. 75 unbalanced
3.6.3 45 Mbps (DS-3)

Frame ................................................................................................ Unframed, ANSI T1.107
Line code.......................................................................................................................... B3ZS
3-2
417006-2007-013-A01
3.6.4 52 Mbps (SONET/STS-1)

Physical level ................................................................................................... GR-253-CORE
Frame .............................................................................................................................. G.253
Line code............................................................................................................................CMI
3.6.5 STM-1 Electrical

Physical level ........................................................................................... G.703, Paragraph 12
Bitrate.................................................................................................... 155.52 Mbps 20 ppm
Frame .............................................................................................................................. G.707
Line code............................................................................................................................CMI
3.6.6 STM-1/OC-3 Optical

Physical level .................................................................................................... G.957, Table 2
Wavelength ................................................................................................. 1310 nm, 1550 nm
Bitrate................................................................................................... 155.52 Mbps 4.6 ppm
Transmission range .............................................................................................I3, S3, L3, L5

Wavelength ................................................................................................. 1310 nm, 1550 nm
Bitrate........................................................................................................ 622 Mbps 4.6 ppm
Transmission range .............................................................................................I3, S3, L3, L5

Wavelength ................................................................................................ 1310 nm, 1550 nm
Bitrate................................................................................................. 2488.32 Mbps 4.6 ppm
Transmission range ............................................ I3, S3, L3, L5, CDWM (G.694.2 and G.695)
417006-2007-013-A01
3-3
3.7 Management
Applicable specifications ........................................................G.784, G.774, M.3010, M.3100
eNM LightSoft (ECI Telecom's Optical Networks Division's Network Manager) server and
client for managing all ECI Telecom equipment ................................ on SUN workstation(s)
EMS-XDM (XDM element manager) ....................................................on SUN workstation
eCraft local craft terminal ............................................................................................... on PC
EMS-XDM and eNM LightSoft can work on the same SUN workstation.
3.7.1 Management and Alarm Interfaces

CMIP-like over TCP/IP to EMS-XDM; MTNM from EMS-XDM to eNM LightSoft or
other TMN; RS-232 to eCraft; OverHead Access (OHA); Orderwire; Rack Alarm Panel.
3.7.2 Alarms and Performance

Performance concept............................................................................................G.821, G.826
Alarm concept ................................................................................................................. G.783
Alarm types ................... LED indicators, dry contacts, audible alarms (per subrack), external
..................................................................................................... alarm inputs and outputs
Alarm classes ........................................................................ Critical, Major, Minor, Warning
3-4
417006-2007-013-A01
3.8 SDH/SONET Interfaces

3.8.1 SDH/SONET STM-1/OC-3 I/O Module
(155.52 Mbps 4.6 ppm)
SFP TRANSCEIVER NAME
APPLICATION CODE
(1)
Operating wavelength (nm)
OTR1_S3
OTR1_L3
OTR1_L5
S-1.1
L-1.1
L-1.2
1261-1360
1263-1360
1480-1580
OTR1_I3
1270-1380
TRANSMITTER
Source type
MLM
SLM
SLM
MLM
7.7
Min. side mode suppression ratio

(dB)
30
30
Min. mean launched power (dBm)
-15
-5
-5
-19
Max. mean launched power (dBm)
-8
-14
Min. extinction ratio (dB)
8.2
10
10
10
Min. sensitivity (BER of 1*10-12)

EOL (dBm)
-28
-34
-34
-30
Min. overload (dBm)
-8
-10
-10
Max. receiver reflectance (dB)
-25
96
Min. optical return loss of cable

(dB)
-20
Max. discrete reflectance (dB)
-25
Max. optical path penalty (dB)
Max. RMS width (nm)
RECEIVER
OPTICAL PATH BETWEEN S & R
Max. dispersion [ps/nm]
(1)
Application code is in reference to ITU-T Recommendation G.691.
417006-2007-013-A01
3-5

(622 Mbps 4.6 ppm)
OTR4_S3
OTR4_L3
OTR4_L5
S-4.1
L-4.1
L-4.2
1293-1334/
1274-1356
1280-1335
1480-1580
1270-1380
Source type
MLM
SLM
SLM
MLM
Max. RMS width (nm)
4/2.5
Max. -20 dB width (nm)
<1

(dB)
30
30
-15
-3
-3
-19
-8
+2
+2
-14
8.2
10
10
10

EOL (dBm)
-28
-28
-28
-31
Min. overload (dBm)
-8
-8
-8
-14
-27
46/74

(dB)
20
24
-25
-27
APPLICATION CODE
(1)
OTR4_I3
TRANSMITTER
RECEIVER
(1)
3-6
417006-2007-013-A01

(2488.32 Mbps 4.6 ppm)
OTR16_S3
OTR16_L3
OTR16_L5
OTR16_I3
S-16.1
L-16.1
L-16.2
I-16
1260-1360
1280-1335
1500-1580
1260-1360
SLM
SLM
SLM
SLM
<1
Max. RMS width (nm)
Min. side mode suppression (dB)
30
30
30
-5
-2
-2
-10
+3
+3
-3
8.2
8.2
8.2
8.2
-18
-27
-28
-16
-9
-9
-27
-27
-27
-27
TBD

(dB)
-24
-24
-24
-24
-27
-27
-27
-27
<1
APPLICATION CODE
(1)

TRANSMITTER
Source type

RECEIVER

EOL (dBm)
Min. overload (dBm)
(1) Application code is in reference to ITU-T Recommendation G.691.
417006-2007-013-A01
3-7
3.8.4 2.5 Gbps Optical CWDM SFP Transceivers for

XDM-100H
OTC25_1PSxx(1)
OTC25_1Alxx(1)
SLM
SLM
1470-1610
1470-1610
Spacing (nm)
20
20
Minimum side mode suppression ratio (dB)
30
30
Mean launched power (min.) (dBm)
Mean launched power (max.) (dBm)
+5
+5
8.2
8.2
-21.5 (-23 GbE)
-28 (-32 GbE)
<3
<3
Source type
Operating output wavelength (nm)
Sensitivity (BER of 1*10-12) (dBm)

OCH switching time (msec)
(1)
xx designates the transceivers wavelength in nm.
3-8
417006-2007-013-A01
3.9 Data Interfaces

3.9.1 Client Transceivers for EISM Cards
OMGE_1SX/
OTGBE-SX
OMGE_1LX/
OTGBE-LX
DOM16_I3/
OTR16-I3
GbE/FC/FICON
short-reach laser,
850 nm,
multimode
GbE/FC/FICON
long-reach laser,
1310 nm, single
mode
2.5 Gbps
long-reach laser,
1310 nm, single
mode
1250
1250
2544
Max.
-3
-3
-10
Min.
-9.5
-11
-3
8.2
8 B/10 B
8 B/10 B
--
Min.
-20
-22
-20
Typical
-21
-25.5
-23
Typical Rx LOS level (dBm)
-24
-29
-25
Connector
LC
LC
LC
550 m
(50/62.5 m
MMF)
10 km
(9 m SMF)
10 km
(9 m SMF)
Transmitter type
Data rate (nominal) (MBaud)

Average launch power
(dBm)
Min. transmitter extinction ratio

(dB)
Data format
Average receiver
sensitivity (dBm)
Fiber lengths
3.10 EISM Specifications

Interfaces ................... 10/100BaseT, 100BaseFX, 1000BaseSX, 1000BaseLX, 1000BaseZX
Switch capacity ...........................................................................................................6.4 Gbps
MAC address memory ..................................................................................................... 3,500
Protection ............................ IOP 1:1 for both Ethernet over SDH ports and optical user ports
Standards compliance....................... IEEE 802.1D, IEEE 802.1p, IEEE 802.1Q, IEEE 802.3,
.......................................................... IEEE 802.3x, IEEE 802.3u, IEEE 802.3z, IEEE 802.1w
.....................................................................................................G.707, G.783, G.7041 (GFP)
417006-2007-013-A01
3-9
3.11 Physical Specifications

3.11.1 Dimensions (H x W x D)
SIM-1/4/16, PIM-2/345............................................35 x 97 x 213 mm (1.38 x 3.82 x 8.38 in)
SAM-4/16.................................................................32 x 97 x 213 mm (1.26 x 3.82 x 8.38 in)
TPM-xx_1/TPM-xx_3..............................................72 x 97 x 211 mm (2.83 x 3.82 x 8.31 in)
TCF ..........................................................................84 x 45 x 210 mm (2.91 x 1.77 x 8.27 in)
MXC.....................................................................52 x 385 x 279 mm (2.05 x 15.16 x 10.1 in)
XDM-100 ...........................................................200 x 443 x 231 mm (7.87 x 17.44 x 9.09 in)
TPU shelf .............................................................75 x 443 x 231 mm (2.95 x 17.44 x 9.09 in)
xRAP rack alarm panel (optional)....................100 x 450 x 285 mm (3.94 x 17.72 x 11.22 in)
xRAP-100 rack alarm panel (optional) ..............133 x 445 x 185 mm (5.24 x 17.53 x 7.29 in)
Racks...................................... 2200/2600 x 600 x 300 mm (86.61/102.36 x 23.62 x 11.81 in)
.................................................................................... 2134 x 584 x 305 mm (82 x 23 x 12 in)
3.11.2 Weight
XDM-100 shelf ............................................................................................. 7.6 kg (16.76 lbs)
XDM-100 fully populated........................................................................... 20.2 kg (44.53 lbs)
3.11.3 Power
Applicable specifications ....................................................... ETSI 300 132-2; FTZ 19 PFL 1
Input voltage ........................................................................................... -40 V dc to -75 V dc
Nominal power source ......................................................................................-48 V or -60 V
Power Consumption ........................................................... Typical 350 W, maximum 550 W
3-10
417006-2007-013-A01
3.11.4 Environmental Conditions

Operation
Applicable specification................................................................. ETS 300 019-1-3 Class 3.2
Temperature range ............................................................................................-5 oC to +55 oC
Relative humidity .................................................................................................... 5% to 90%
NOTE: Extended temperature range of -5 oC to +65 oC is
supported for specific outdoor configurations.
Storage (packed)
Applicable specification................................................................ ETS 300 019-1-1 Class 1.2
Temperature range ..........................................................................................-25 oC to +55 oC
Relative humidity ................................................................................................ 10% to 100%
Handling and Transportation

Applicable specification................................................................ ETS 300 019-1-2 Class 2.3
Temperature range ......................................................................................... -40 oC to +70 oC
Relative humidity ..................................................................................................... up to 95%
3.11.5 EMC
Applicable specifications ..............................................................................EN 300 386/2000
Applicable directive ...................................................................... EMC directive 89/336 EEC
3.11.6 Safety
Applicable specifications .................................................................................EN 60950/2000
Applicable CE directive .................................................................. LVD directive 73/23/EEC
3.11.7 Laser Safety

Applicable specification....................................................................................EN 60825-1&2
417006-2007-013-A01
3-11
3.11.8 NEBS Compliance

The XDM platforms are designed in accordance with NEBS regulations for EMC and
Safety, including GR-1089-CORE Issue 1, October 1995 and GR-63-CORE Issue 2,
December 1997 Revision 1, February 1999 (Level 3).
3.11.9 Reliability
Life
Expected lifetime of the XDM platforms.....................................................................15 years
Availability
Availability of service for an end-to-end service trail passing through a protected
SDH/SONET network............................................................................... better than 99.999%
3-12
417006-2007-013-A01
4
4.1 Traffic Protection
OCH 1+1 optical protection ................................................................................ within 50 ms
4.2 Redundancy
Control and synchronization systems............................................................... 1+1 duplicated
Power system, internal buses, external buses................................................... 1+1 duplicated
4.3 Jitter and Wander

Applicable specifications ........................................................................ITU-T G.823, G.825
4.4 Management
Applicable specifications ...................................................... G.784, G.774, M.3010, M.3100
eNM Lightsoft (ECI Telecoms network manager)
server + client for managing all ECI Telecom equipment .................on SUN workstation(s)
EMS-XDM (XDM element manager) .................................................... on SUN workstation
eCraft local craft terminal ..............................................................................................on PC
EMS-XDM and eNM Lightsoft can work on the same SUN workstation.
417006-2007-013-A01
4-1
4.4.1 Management and Alarm Interfaces

CMIP-like over TCP/IP to EMS-XDM; MTNM from EMS-XDM to TMN; RS-232 to
eCraft; OverHead Access (OHA); Orderwire; Rack Alarm Panel.
4.4.2 Alarm and Performance

Performance concept.............................................................................. G.821, G.826, G.828
Alarm concept .................................................................................................... G.783, G.798
Alarm types ............................... LED indicators, dry contacts, audible alarms (per subrack)
Alarm classes ...................................................................... Critical, Major, Minor, Warning
4.5 I/O Interfaces

4.5.1 2.5 Gbps Optical SFP Transceivers for
Transponders/Combiners
OTC25_1PSxx(1)
OTC25_1Alxx(1)
OTR16_I3
OTR16_S3
SLM
SLM
SLM
SLM
1466-1615
1466-1615
1285-1330
1285-1330
Spacing (nm)
20
20
NA
NA
Minimum side
mode suppression
ratio (dB)
30
30
30
30
Mean launched
power (min.) (dBm)
-9.5
-5
Mean launched
power (max.)
(dBm)
+5
+5
-3
Min. extinction
ratio (dB)
8.2
8.2
8.2
8.2
-21.5
-28
-18
-18
(-23 GbE)
(-32 GbE)
(-22 GbE)
(-22 GbE)
<3
<3
<3
<3
Source type
Operating output
wavelength (nm)
Sensitivity (BER of
1*10-12) (dBm)
OCH switching
time (msec)
(1)
xx designates the transceivers wavelength in nm
4-2
417006-2007-013-A01
4.5.2 GbE/FC/FICON Optical SFP Transceivers

forTransponders/Combiners
OT_GbE_SX
OT_GbE_LX
GbE/FC/FICON short reach

laser, 850 nm, multimode
GbE/FC/FICON long reach

laser, 1310 nm, single mode
1250
1250
Max.
-3
-3
Min.
-9.5
-11
8 B/10 B
8 B/10 B
Min.
-20
-22
Typical
-21
-25.5
-24
-29
Connector
LC
LC
550 m (50/62.5 m MMF)
10 km (9 m SMF)
Transmitter type
Data rate (nominal) (Mbaud)
Mean launch power
(dB.m)

(dB)
Data format
Average receiver
sensitivity (dBm)
Fiber lengths
4.5.3 Mux/Demux Modules

MO-CMD4C
MO_CMD8
MO_CMD4C-E
MO_CMD4SL
Insertion loss Mux +

Demux(dB)(1)
< 4.2
< 5.5
< 4.9
< 7.3
Return loss (dB)
< 40
< 40
< 40
< 40
Directivity (dB)
< 45
< 45
< 45
< 45
(1)
Including built-in 1310 nm OSC filter. The insertion loss for 1310 nm filter is 1.2 dB.
4.5.4 OADM Modules

Insertion loss (1)
Module type
Through
Drop
Add
MO_COADM1AB_xx
(2)
< 3.9dB
< 2.6dB
< 2.2dB
MO_COADM2AB_xx
(3)
< 4.4dB
< 3.2dB
< 3.2dB
(1)
Including built-in 1310 nm OSC filter. The insertion loss for 1310 nm filter is 1.2 dB.
xx designates the channel dropped by the OADM.
(3)
xx designates the group of two channels dropped by the OADM.
(2)
417006-2007-013-A01
4-3
4.5.5 Splitter/Coupler Modules

Module type
Insertion loss
MO_4CP4SPMM50
4 dB
MO_4CP4SPMM62
4 dB
MO_4CP4SPSM
4 dB
4.5.6 CWDM Frequencies and Wavelengths as per

G.694.2
Nominal Central Wavelengths (nm)
for spacing of 20 nm
4-channel system
8-channel system
1471
1491
1511
1531
1551
1571
1591
1611

Transponders and combiners.................................. 35 x 97 x 213 mm (1.38 x 3.82 x 8.38 in)
OSC ....................................................................... 32 x 97 x 213 mm (1.26 x 3.82 x 8.38 in)
Mux/demux; OADM1/2; splitters/couplers ........... 72 x 97 x 213 mm (2.83 x 3.82 x 8.38 in)
TC control module ................................................. 84 x 45 x 210 mm (2.91 x 1.77 x 8.27 in)
MXC................................................................... 52 x 385 x 279 mm (2.05 x 15.16 x 10.1 in)
XDM-200 (basic shelf and OCU shelf).......... 275 x 443 x 231 mm (10.82 x 17.44 x 9.09 in)
xRAP rack alarm panel (optional).................. 100 x 450 x 285 mm (3.94 x 17.72 x 11.22 in)
xRAP-100 rack alarm panel (optional) ............ 133 x 445 x 185 mm (5.24 x 17.53 x 7.29 in)
Racks.....................................2200/2600 x 600 x 300 mm (86.61/102.36 x 23.62 x 11.81 in)
................................................................................... 2134 x 584 x 305 mm (82 x 23 x 12 in)
4-4
417006-2007-013-A01
4.6.2 Weight
XDM-200 (basic shelf and OCU shelf)......................................................12.1 kg (26.68 lbs)
XDM-200 fully populated..........................................................................24.3 kg (53.58 lbs)
4.6.3 Power
Applicable specifications ......................................................... ETSI 300 132-2; FTZ 19FS1
Input voltage ..........................................................................................-40 V dc to -75 V dc
Nominal power source ............................................................... -60 V or -48 V BTNR 2511
Power consumption ........................................................... Typical 350 W, maximum 550 W

Operation
Applicable specification............................................................... ETS 300 019-1-3 Class 3.2
Temperature range .......................................................................................... -5 oC to +45 oC
Relative humidity ................................................................................................... 5% to 90%
Storage (packed)
Applicable specification.............................................................. ETS 300 019-1-1 Class 1.2
Temperature range ........................................................................................ -25 oC to +55 oC
Relative humidity .............................................................................................. 10% to 100%
Handling and transportation

Applicable specification.............................................................. ETS 300 019-1-2 Class 2.3
Temperature range ....................................................................................... -40 oC to +70 oC
Relative humidity ................................................................................................... up to 95%
4.6.5 EMC
Applicable specifications ............................................................................ EN 300 386/2000
Applicable directive .....................................................................EMC directive 89/336 EEC
417006-2007-013-A01
4-5
4.6.6 Safety
Applicable specifications ............................................................................... EN 60950/2000
Applicable CE directive ................................................................. LVD directive 73/23/EEC
4.6.7 Laser Safety

Applicable specification.................................................................................. EN 60825-1&2

The XDM platforms are designed in accordance with NEBS regulations for EMC and
Safety, including GR-1089-CORE Issue 1, October 1995 and GR-63-CORE Issue 2,
December 1997 Revision 1, February 1999 (Level 3).
4.6.9 Reliability
Life
Expected lifetime of the XDM platforms................................................................... 15 years
Availability
SDH/SONET network..............................................................................better than 99.999%
4-6
417006-2007-013-A01
5
XDM-400, 500, 1000, and 2000
Specifications
5.1 Electrical, Optical, and Mixed Basecard
Data
Card
Ports/Bitrate
Electrical
PIO2_84
84 x E1 (2 Mbps) PDH/Async basecard for balanced and

unbalanced interfaces
PIO2_21
21 x E1 (2 Mbps) PDH/Async basecard for balanced and

unbalanced interfaces
PIO345/PIO345M(1)
16 x E3/DS-3/STS-1 (34/45/51 Mbps) interfaces
Optical
SIO16/SIO16M(1)
SIO64/SIO64M/MF
2 x STM-16/OC-48 (2.488 Gbps) interface

(1) (2)
XIO
1 x STM-64/OC-192 (10 Gbps) interface

1 x STM-16/OC-48 (2.488 Gbps) + 1 x STM-4/OC-12 or
4 x STM-1/OC-3 interfaces
Mixed
SIO1&4/SIO1&4M(1)
Supports various electrical (e) and/or optical (o) interfaces as

follows:
16 x STM-1o/OC-3/OC-3c
16 x STM-1e/STS-3e
4 x STM-4/OC-12
(1)
The suffix M denotes SONET support as well as SDH MS-SPRing support. The MF suffix denotes FEC 7%
support for SONET and MS-SPRing support for SDH.
(2)
SIO64 cards are not supported for XDM-400.
417006-2007-013-A01
5-1
XDM-400, 500, 1000, and 2000 Specifications
NOTE: For full interface support per card and shelf, please
contact ECI Telecoms Optical Networks Divisions Product
Management or your local ECI Telecom representative.
5.1.1 Electrical Interface Connection Modules

Electrical I/O cards are assigned an interface connection module. This module
serves as the I/O card electrical line transceiver and is connected to the I/O cards via
the XDM backplane. For example, when eleven PIO2_84 I/O cards are installed in
the XDM-1000 cards cage, eleven M2_84xx connection modules should be installed
in the modules cage. In this case, if hardware protection is required, one PIO2_84
I/O card can be configured as the protection card, and the corresponding protection
connection module M2_84P I/O is installed in the appropriate slot of the XDM-1000
modules cage.
I/O slot 12 is always configured as a pure optical slot without a modules cage
module.
Connection Module Data for Electrical I/O Cards
I/O card
SIO1&4
Bitrate Mbps
155
I/O ports
16
Module
M1_16BT
M1_16DIN
M1_16P (2)
M1_8BT
16
M345_16BT
M345_16DI
M345_16P (2)
SDH/SONET
electrical
SDH/SONET
electrical
PDH/Async
PDH/Async
PDH/Async
M345_8BT
M345_8DI
M345_8BN
M2_84B
PDH/Async
PDH/Async
PDH/Async
PDH
M2_84U
PDH
M2_84P(1) (2)
PDH
M1_8DIN
PIO345
PIO2_84
5-2
34/45/52
2.048
Interface type
SDH/SONET
electrical
SDH/SONET
electrical
-
84
Function/Description
Connection module
Connection module
Connection module with
protection
Connection module
Connection module
Connection module
Connection module
protection
Connection module
Connection module
Connection module
Balanced (120 )
connection module
Unbalanced (75 )
connection module
protection
417006-2007-013-A01
I/O card
PIO2_21
Bitrate Mbps
2.048
I/O ports
21
Module
Interface type
M2_21B
PDH
Balanced (120 )
connection module
M2_21U
PDH
M2_84P(1) (2)
PDH
Unbalanced (75 )
connection module
protection
(1)
Protection module M2_84P can be used to protect PIO2_84 or PIO2_21 cards.
(2)
Protection modules are not supported for XDM-400
I/O Cards Optical Transceiver Modules

Optical I/O cards utilize a slide-in optical transceiver, which is directly plugged into
the I/O cards for signal interfacing.
I/O card
Optical
module
Connector
type
I/O ports per

optical module
Modules
per I/O card
SIO1&4
OM01_4
LC
16 x STM-1/OC-3
OM04_1
SC/LC
4 x STM-4/OC-12
SIO16
OM16_1
SC/LC
2 x STM-16/OC-48
XIO
OM01_4
LC
4 x STM-1/OC-3
OM04_1
SC/LC
1 x STM-4/OC-12
OM16_1
SC/LC
1 x STM-16/OC-48
OM64_1
LC
1 x STM-64/OC-192
SIO64
(1)
Ports per I/O card
(1)
SIO64 is not supported for XDM-400.
417006-2007-013-A01
5-3
5.2 SDH/SONET Interfaces

5.2.1 SDH/SONET STM-1/OC-3 (155.52 Mbps
4.6 ppm) I/O Cards
CARD NAME
SIO1_16PI3
(1)
SIO1_16AS3
SIO1_16AL3
SIO1_16AL5
MECP_OSC3
MECP_OSC5
S-1.1
L1.1
L-1.2
L-1.1
L-1.2
1270-1380
1261-1360
1263-1360
1480-1580
1263-1360
1480-1580
MLM
SLM
SLM
SLM
SLM
SLM
7.7
> 30
> 30
> 30
> 30
-19
-15
-5
-5
-5
-14
-8
+2
10
8.2
8.2
10
10
10
-30
-28
-34
-34
-34
-34
-8
-10
-10
-10
-10
-25
-25
96
-20
-20
-25
-25
APPLICATION
(2)
CODE
Operating
wavelength (nm)
TRANSMITTER
Source type
Max. RMS width
(nm)
Max. -20 dB width
(nm)
Min. side mode
suppression ratio
(dB)
Min. mean launched
power (dBm)
Max. mean launched
power (dBm)
Min. extinction ratio
(dB)
RECEIVER
Min. sensitivity
(BER of 1*10-12)
EOL (dBm)
Min. overload
(dBm)
Max. receiver
reflectance (dB)
OPTICAL PATH BETWEEN S AND R
Max. dispersion
(ps/nm)
Min. optical return
loss of cable (dB)
Max. discrete
reflectance (dB)
Max. optical path
penalty (dB)(3)
(1)
MLM transceiver for 2 km with multimode fibers.

(3)
Effective optical power budget calculation for single channel with no amplification: Tx min. power minus Rx sensitivity
(EOL) minus max. optical path penalty (dB).
(2)
5-4
417006-2007-013-A01
5.2.2 SDH/SONET STM-4/OC-12

(622 Mbps 4.6 ppm) I/O Cards
CARD NAME
SIO4_4AS3
SIO4_4AL3
SIO4_4AL5
S-4.1
L-4.1
L-4.2
1270-1380
1293-1334
1280-1335
1480-1580
MLM
SLM
SLM
SLM
Max. RMS width (nm)
Min. side mode suppression

ratio (dB)
> 30
> 30
Min. mean launched power

(dBm)
-19
-15
-3
-3
Max. mean launched power

(dBm)
-14
-8
+2
+2
10
8.2
10
10
-31
-28
-28
-28
Min. overload (dBm)
-8
-8
-8
-14
-27
Max. dispersion (ps/nm)
Min. optical return loss of

cable (dB)
-20
-24
-25
-27
Max. optical path penalty

(dB)(3)
APPLICATION CODE
SIO4_4PI31
(2)

TRANSMITTER
Source type
RECEIVER
Min. sensitivity (BER of

1*10-12) EOL (dBm)
(1)
MLM transceiver for 2 km with multimode fibers.

(3)
Effective optical power budget calculation for single channel with no amplification: Tx min. power minus Rx
sensitivity (EOL) minus max. optical path penalty (dB).
(2)
417006-2007-013-A01
5-5

(2488.32 Mbps 4.6 ppm) I/O Cards
SIO16_
1AX5xx
SIO16_
1AV5xx
SIO16_
1AB5xx
SIO16_
(1)
1AX5
SIO16_
1AL5
SIO16_
1AL3
SIO16_
1PS3
X-16.2
V-16.2
U-16.2
X-16.2
15301560
15301565
15301565
15301560
L-16.2
L16.1
S-16.1
I-16
15301565
12601360
12601360
12601360
SLM
SLM
SLM
SLM
SLM
SLM
SLM
SLM
Max. RMS width (nm)
30
30
30
30
30
30
30
Min. mean launched

power (dBm)
+5.5
+1
+0
+5.5
+0
-1
-5
-10
Max. mean launched

power (dBm)
+7.5
+3
+2
+7.5
+3
+2.5
-3

(dB)
8.2
8.2
8.2
8.2
8.2
8.2
8.2
8.2
Photodiode type
APD
APD
APD
APD
APD
APD
PIN
PIN
Min. sensitivity
(BER of 1*10-12)
EOL (dBm)
-28
-28
-28
-28
-28
-28
-18
-16
Min. overload (dBm)
-7
-7
-7
-7
-7
-7
Max. receiver
reflectance (dB)
-27
-27
-27
-27
-27
-27
-27
-27
CARD NAME
APPLICATION CODE
(3)
Operating wavelength
(nm)
SIO16_
(2)
1PI3
TRANSMITTER
Source type
Min. side mode

suppression (dB)
RECEIVER
1800
1800
3000 (4)
2160
1800
(5)
(5)
(5)
Min. optical return loss

of cable (dB)
-24
-24
-24
-24
-24
-24
-24
-24
Max. discrete
reflectance (dB)
-27
-27
-27
-27
-27
-27
-27
-27
<2
<2
<2
<3
<2
<2
<2
<1
Max. optical path

penalty (dB)(6)
(1)
Noncolored interface limited to 120 km with a path penalty is 3 dB.

Single-mode interface for 2 km intraoffice applications.
(3)
(4)
To reach distances of 150 km, SIO16_1AB5 should be connected to a booster.
(5)
The dispersion value is relevant only in the 1500 nm wavelength. PS3 is for 25 km and PI3 for 2 km.
(6)
Effective optical power budget calculation for single channel with no amplification: Tx min. power minus Rx sensitivity
(EOL) minus max. optical path penalty (dB).
(2)
5-6
417006-2007-013-A01

(9953.28 Mbps 4.6 ppm) I/O Cards (7)
SIO64_
1ALSxx
CARD NAME
APPLICATION CODE
(2)
Operating wavelength
(nm)
(3)
L-64.2a
SIO64_
1ASSxx
S-64.2a
(3)
SIO64_
1PSSxx
I-64.2
(3)
SIO64_
1PLSxx
L-64.2b
(3)
SIO64_
(1)
1PSS3
S-64.1
(3)
SIO64_
(1)
1PIS3
I-64.1
(3)
15301565
15301565
15301565
15301565
12851330
12851330
EML
EML
EML
EML
EML
EML
Min. mean launched

power (dBm)
-2
-2
-2
-2
-4
-6
Max. mean launched

power (dBm)
+3
+3
+3
+3
+1
-1

(dB)
9.0
8.2
8.2
10
Photodiode type
APD
APD
PIN
PIN
PIN
PIN
Min. sensitivity
(BER of 1*10-12) EOL
(dBm)
-19 (4)
-19 (4)
-14
-14
-15
-11
Min. overload (dBm)
-8
-8
-1
-1
-1
-1
Max. optical path

penalty (dB)
<2
<2
<2
<2
<1
<1
Max. receiver
reflectance (dB)
-27
-27
-27
-27
-27
-27
TRANSMITTER
Source type
RECEIVER
Max. attenuation range

(dB)
15
15
10
10
10
Min. attenuation range

(dB)
10
10
(6)
800
800
(6)
40
Max. chromatic
dispersion (ps/nm)(5)
(1)
SIO64_1PSS3 is limited to 20 km; SIO64_1PIS3 is limited to 2 km. Both transceivers are single mode.
(3)
All SIO-64 optics are also available for DWDM applications as per the standard ITU-T G.692 grid (n = 1-40).
(4
) When adding FEC, there is a typical improvement of 2 dB for nonamplified networks (sensitivity of -21 dBm
instead of -19 dBm). For amplified networks, a FEC improvement of over 4 dB is typical.
(5)
Effective optical power budget calculation for a single channel with no amplification: Tx min. power minus
Rx sensitivity (EOL) minus max. optical path penalty (dB).
(6)
The limitation for the long-range STM-64 laser is 60 km. Contact Product Management for longer distances.
(7)
STM-64 I/O cards are not supported for XDM-400.
(2)
417006-2007-013-A01
5-7
5.2.5 PDH/Async and SDH/SONET Interface

Specifications
2 Mbps
Physical level .............................................................................................. G.703, Paragraph 6
Frame options.......................................................................... Unframed, G.704, I.431 (ISDN)
Line code.......................................................................................................................... HDB3
Line impedance .....................................................................120 balanced/75 unbalanced
34 Mbps
Frame ............................................................................................................................... G.751
Line code.......................................................................................................................... HDB3
Line impedance ............................................................................................... 75 unbalanced
45 Mbps
Frame ............................................................................................................................... G.751
Line code........................................................................................................................... B3ZS
52 Mpbs (STS-1)
Physical level .....................................................................................................GR-253-CORE
Frame ............................................................................................................................... G.253
Line code.............................................................................................................................CMI
STM-1 Electrical
Physical level ............................................................................................ G.703, Paragraph 12
Frame ............................................................................................................................... G.707
Line code.............................................................................................................................CMI
5-8
417006-2007-013-A01
STM-1/OC-3 Optical
Physical level ..................................................................................................... G.957, Table 2
Wavelength .................................................................................................. 1310 nm, 1550 nm
Short-haul, long-haul bitrate ................................................................. 155.52 Mbps 4.6 ppm
STM-4/OC-12 Optical
Wavelength .................................................................................................. 1310 nm, 1550 nm
Short-haul, long-haul, very long-haul, ultra long-haul bitrate ................... 622 Mbps 4.6 ppm
STM-16/OC-48 Optical
Wavelength ................................................................................................. 1310 nm, 1550 nm
Short-haul, long-haul, very long-haul, ultra long-haul,
DWDM (G.692 and G.957) bitrate ..................................................... 2488.32 Mbps 4.6 ppm
STM-64/OC-192 Optical
Physical level ..........................................................................................G.691, G.957, Table 5
Wavelength ................................................................................................. 1310 nm, 1550 nm
Short-haul, long-haul, very long-haul, DWDM (G.692) bitrate ......... 9953.28 Mbps 4.6 ppm
417006-2007-013-A01
5-9
5.3 Data Cards

Card
Service interfaces
Data
handling
Network interfaces
Bandwidth per
interface
DIO1_80
8 x Gbps Ethernet
Layer 1
8 x EOS*
(1 to 7) x VC-4(1)
DIO1_40R
4 x Gbps Ethernet
Layer 1
4 x EOS
(1 to 7) x VC-4(2)
DIO1_61(3)
6 x Gbps Ethernet
Layer 1
6 x EOS
(1 to 7) x VC-4(2)
EIS2_8
4 GbE + 4 FE or 8 FE
Layer 2
2 x EOS
(1 to 7) x VC-4
EIS8_8
4 GbE + 4 FE or 8 FE
Layer 2
8 x EOS
(1 to 7) x VC-4
2 x VC-4 + 126 x E1
ATM
2 x VC-4 + 125 x E1
2 x VC-4 + 125 x E1
ATS
(4)
* EoS Ethernet over SDH/SONET.

(1)
Maximum capacity per card: 5 Gbps (32 x VC-4).

Maximum capacity per card: 2.5 Gbps (16 x VC-4).
(3)
DIO1_61 Ethernet ports are mapped directly to low-cost 2.5 Gbps STM-16s/OC-48s transceivers connected to
a DWDM transponder. The allocation of VC-4s to service interfaces is not symmetric.
(4)
ATS resources can be software-allocated to service or network interfaces as required.
(2)
5.3.1 Client Transceivers for DIO and EIS Cards (and

for CMBR25/10 and TRP25_4 Cards)
OMGE_1SX/
OTGBE-SX
OMGE_1LX/
OTGBE-LX
DOM16_I3/
OTR16-I3
GbE/FC/FICON
Short-reach laser,
850 nm,
multimode
GbE/FC/FICON
Long-reach laser,
1310 nm, single
mode
2.5 Gbps Longreach laser,

1310 nm, single
mode
1250
1250
2544
Max.
-3
-3
-10
Min.
-9.5
-11
-3
8.2
8 B/10 B
8 B/10 B
--
Min.
-20
-22
-20
Typical
-21
-25.5
-23
-24
-29
-25
Connector
LC
LC
LC
550 m
(50/62.5 m
MMF)
10 km
(9 m SMF)
10 km
(9 m SMF)
Transmitter type
Data rate (nominal) (MBaud)

Average launch power
(dBm)

(dB)
Data format
Average receiver
sensitivity (dBm)
Fiber lengths
5-10
417006-2007-013-A01
5.3.2 DIO Specifications

Optical interfaces .....................................................1000BaseSX, 1000BaseLX, 1000BaseZX
Switch capacity ......................................................................................................up to 5 Gbps
Standards compliance.............. IEEE 802.3, 802.3x, jumbo frames, transparent to 802.1d, p, q
5.3.3 EIS Specifications

Electrical interfaces.............................................................................................. 10/100BaseT
Switch capacity ............................................................................................................. 16 Gbps
MAC address memory .................................................................................................... 32,000
Protection ......................................... IOP 1:1 for both Ethernet over SDH ports and user ports
Standards compliance........................ IEEE 802.1D, IEEE 802.1p, IEEE 802.1Q, IEEE 802.3,
........................................................... IEEE 802.3x, IEEE 802.3u, IEEE 802.3z, IEEE 802.1w
G.707, G.783, G.7041 (GFP)
5.3.4 ATS Specifications

Bandwidth ............................................................................................................. 622.08 Mbps
Simultaneous IMA support ....................... 84 IMA groups per card with 1 to 32 E1 links each
ATM service classes .................................................................. CBR, rt-VBR, nrt-VBR, UBR
ATM signaling ............ UNI 3.1, UNI 4.0, PNNI 1.0, PNNI SPVC Addendum V 1.0, IISP 1.0
IMA...............................................................................................................IMA 1.0, IMA 1.1
OAM .......................................................................................................................ITU-T I.610
Traffic management ........................................................................................... ATMF TM 4.1
417006-2007-013-A01
5-11
5.4 Optical Components

The XDM optical layer can service pure optical networks as well as converged
networks that integrate DWDM with data and SDH/SONET services in the same
platform. To take full advantage of the XDM platform, a variety of optical cards and
modules are used for both the modules cage and the cards cage of the various
shelves, both in I/O slots as well as in the X1/X2 slots (otherwise used for the
cross-connect matrix cards).
5.4.1 DWDM Mux/Demux Cards and Modules

DWDM cards (cards cage of XDM-1000 and XDM-2000 shelves)
Card
Width
(Slots)
16/32-channel DWDM mux/demux cards (slots X1, X2)
DW16MDR-SAV
Mux star, demux AWG, 16 red channels
DW16MDRE-SAV
Mux star, demux AWG, 16 red channels, expandable to 32

channels
DW16MDR-SG
Mux star, demux diffraction grating, 16 red channels
DW16MDRE-SG
Mux star, demux diffraction grating, 16 red channels,

expandable to 32 channels
DW16MDB-SAV
Mux star, demux AWG, 16 blue channels
DW16MDB-SG
Mux star, demux diffraction grating, 16 blue channels
DW16MDB-GG
Mux diffraction grating, demux diffraction grating, 16 blue

channels
DW16MDR-GG
Mux diffraction grating, demux diffraction grating, 16 red

channels
DW16MDRE-GG
Mux diffraction grating, demux diffraction grating, 16 red

channels, expandable to 32 channels
DW16VMDR-AG
Mux AWG, demux diffraction grating, 16 red channels
DW16VMDRE-AG
Mux AWG, demux diffraction grating, 16 red channels,

DW16VMDB-AG
Mux AWG, demux diffraction grating, 16 blue channels
DW40MC-AV
Mux, AWG, 40 channels, C band
DW40MC-G
Mux, diffraction grating, 40 channels, C band
DW40DC-A
Demux, AWG, 40 channels, C band
DW40DC-G
Demux diffraction grating, 40 channels, C band
DW40VMC-AV
Variable mux, AWG, 40 channels, C band
5-12
417006-2007-013-A01
DWDM modules (modules cage of XDM-1000)

Module
Conn.
Type
Width
(Slots)
16/32-channel DWDM mux/demux
MO_DW16MDR-SAV
LC
Mux star, demux AWG, 16 red channels
MO_DW16MDRE-SAV
LC
MO_DW16MDB-SAV
LC
Mux star, demux AWG, 16 red channels,

Mux star, demux AWG, 16 blue channels
MO_DW16MDR-SG
LC
MO_DW16MDRE-SG
LC
MO_DW16MDB-SG
LC
MO_DW16MDR-ST
LC
MO_DW16MDB-GAV
LC
MO_DW16MDR-GAV
LC
MO_DW16MDRE-GAV
LC
Mux star, demux diffraction grating, 16 red

channels
Mux star, demux diffraction grating, 16 red
channels, expandable to 32 channels
Mux star, demux diffraction grating, 16 blue
channels
Mux star, demux thin-film, 16 red channels
Mux diffraction grating, demux AWG, 16
blue channels
red channels
red channels, expandable to 32 channels
40-channel DWDM mux/demux
MO_DW40MC-S
LC
Mux star, 40 channels, C band
MO_DW40MC-AV
LC
Mux AWG, 40 channels, C band
MO_DW40MC-G
LC
Mux diffraction grating, 40 channels, C band
MO_DW40DC-AV
LC
Demux AWG, 40 channels, C band
MO_DW40DC-G
LC
Demux diffraction grating, 40 channels,

C band
Mux specifications
16-channel
32-channel
40-channel
< 14.5 (15.5)*
< 18 (21.3)
< 18.5
< 5 (6)
< 8 (11.7)
< 6 (7.3)
Return loss (dB)
< -40
< -40
< -40
Directivity (dB)
< -60
< -60
< -60
Insertion loss (dB):

Star:
AWG/Diffraction grating:
*Values in parenthesis apply to units assembled in the cards cage of the shelves; values without parenthesis
apply to units assembled in the modules cage of the shelves.
417006-2007-013-A01
5-13
Demux specifications
16-channel
32-channel
40-channel
<8
< 4.5 (4.7)*
< 6 (6.7)
< 6 (7.3)
Return loss (dB)
< -45
< -45
< -45
Directivity (dB)
> 25
> 25
> 25
10
20
20
Insertion loss (dB)*:

Thin-film:
AWG/Diffraction grating:
Power consumption (Watt)
5-14
417006-2007-013-A01
5.4.2 OADM Cards and Modules

OADM cards (cards cage)
Card
Width
(Slots)
XDM-2000
XDM-1000
XDM-500
Optical add/drop multiplexing of

16 grouped red channels, 100
GHz spacing, east/west
configuration
Optical add/drop multiplexing of
16 grouped blue channels, 100
configuration
--
--
16-channel OADM for X1, X2 slots

OADM16R
OADM16B
Active OADM basecards for I/O slots

OADM4AB
Basecard for 1-4 active OADM

filter; configuration AB
OADM4AB_SW

filter; configuration AB with 2x2
switch. (Can be installed as
provision for OADM filters.)
OADM4AB_ALS

filter; configuration AB,
including built-in ALS
OADM4AB_SW_ALS

filter; AB configuration with 2x2
switch and built-in ALS. (Can be
installed as provision for
OADM filters.)
OADM4EW

filter; east/west configuration
OADM4EW_SW

with 2x2 switch. (Can be
installed as provision for
OADM filters.)
OADM4EW_ALS

filter; east/west configuration,
including built-in ALS
OADM4EW_SW_ALS

with 2x2 switch and built-in
ALS. (Can be installed as
provision for OADM filters.
The card can also be used as ALS
card for nonprotected OADM
sites or with modules cage
muxes/demuxes or amplifiers)
417006-2007-013-A01
5-15
OADM plug-in filters for OADM cards

Module
OM_AD1QABxx
1-channel 100 GHz OADM filter with built-in equalization for AB

configuration
OM_AD4RQABxx

configuration, random wavelengths
OM_AD4GQABxx

configuration, grouped wavelengths
OM_AD1QEWxx
1-channel 100 GHz OADM filter with built-in equalization for east/west
configuration
OM_AD4RQEWxx
configuration, random wavelengths
OM_AD4GQEWxx
configuration, grouped wavelengths
OADM modules (modules cage)

Module
Conn.
type
Width
(Slots)
Function/
Description
XDM-1000
XDM-500
1-4-channel OADM modules

MO_OADM1ABxx
MO_OADM1EWxx
MO_OADM4GABxx
MO_OADM4GEWxx
LC
Optical add/drop of a single

channel, AB/EW
LC
--
MO_OADM4RABxx
MO_OADM4REWxx
LC
Optical add/drop of
4 grouped channels;
AB/EW
Optical add/drop of 4
random channels; AB/EW
--
channels (upgradeable to 16
channels), 200 GHz
spacing, east/west
configuration
channels (expansion unit for
16 channels),
200 GHz spacing, east/west
configuration
grouped red channels, 100
configuration
grouped blue channels, 100
configuration
--
--
--
--
8/16-channel OADM modules

MO_OADM8TE
LC
MO_OADM8T
LC
MO_OADM16R
LC
MO_OADM16B
LC
5-16
417006-2007-013-A01
OADM specifications
1. 16-channel OADM 100 GHz spacing East/West configuration
OADM16R, OADM16B, MO_OADM16R,
MO_OADM16B
Insertion loss
Through
Drop
Add
Total insertion loss through channels (two

cards) (dB)
< 3 (4.7)*
Total insertion loss for dropped channel (dB)
< 5.5 (5.6)
Minimum insertion loss for added channel (dB)
< 5.5 (6.7)
2. Eight-channel OADM 200 GHz spacing (upgradeable to 16 channels)

East/West configuration
MO_OADM8T, MO_OADM8TE
Insertion loss
Through
Drop
Add
Total insertion loss through channels (dB)
< 13.5
(< 15.5)*
Total insertion loss for dropped channel (dB)
< 5.5
(< 7.5)
Minimum insertion loss for added channel (dB)
<8
*Values in parenthesis apply to insertion loss through an upgrade unit.
3. 1/4-channel OADM 100 GHz spacing protected A/B and unprotected

East/West configurations
Module type
MO_OADM1AB (dB)
MO_OADM1EW
(1)
(dB)
MO_OADM4RAB (dB)
MO_OADM4REW
(1)
(dB)
MO_OADM4GAB (dB)
MO_OADM4GEW
(1)
(1)
(dB)
Insertion Loss
Through
Drop
Add
< 2.8
<2
<2
< 1.8
< 2.3
< 2.3
< 5.5
< 5.0
< 4.5
< 4.8
< 5.3
< 4.5
< 2.5
< 5.5
<5
< 1.8
< 4.8
< 4.8
For protected sites using two East/West cards, the through insertion loss should be doubled.
417006-2007-013-A01
5-17
4. One-channel active OADM with equalization 100 GHz spacing protected A/B
configuration
Random OADM module
Basecard type
Through
Drop
Add
OADM4AB (dB)
2.9
2.3
4.7
OADM4AB_SW (dB)
4.5
3.1
5.5
OADM4AB_ALS (dB)
3.9
2.3
5.7
OADM4AB_SW_ALS (dB)
5.5
3.1
6.5
5. Four-channel active OADM with equalization 100 GHz spacing protected

A/B configuration
Random OADM module
Basecard type
Grouped OADM module
Through
Drop
Add
Through
Drop
Add
OADM4AB (dB)
5.1
3.6
3.3
4.6
5.8
OADM4AB_SW (dB)
6.7
4.4
5.8
4.9
5.4
6.6
OADM4AB_ALS (dB)
6.1
3.6
4.3
4.6
6.8
OADM4AB_SW_ALS (dB)
7.7
4.4
6.8
5.9
5.4
7.6
6. One-channel active OADM with equalization 100 GHz spacing unprotected

Random OADM module
Basecard type
Through
Drop
Add
OADM4EW (dB)
3.1
2.6
4.0
(1)
4.7
3.4
4.8
4.1
2.6
5.0
5.7
3.4
5.8
(1)
OADM4EW_SW (dB)
OADM4EW_ALS
(1)
(dB)
OADM4EW_SW_ALS
(1)
(1)
(dB)
For protected sites using two East/West cards, the through insertion loss should be doubled.
7. Four-channel active OADM with equalization 100 GHz spacing unprotected

Basecard type
Random OADM module
Grouped OADM module
Through
Drop
Add
Through
Drop
Add
OADM4EW (dB)
4.8
4.3
5.9
2.8
5.1
6.7
OADM4EW_SW (dB)
6.4
5.1
6.7
4.4
5.9
7.5
OADM4EW_ALS (dB)
5.6
4.3
6.9
3.8
5.1
7.7
OADM4EW_SW_ALS (dB)
7.4
5.1
7.7
5.4
5.9
8.5
5-18
417006-2007-013-A01
OADM basecard only (no filters), 2 x 2 switch through

Basecard + 2x2
switches
Basecard + 2x2 +
ALS switches
E/W unprotected or AB
2.6
3.6
E/W protected both base cards with 2x 2 switches
5.2
6.2
Type of OADM site
5.4.3 Transponders
TRP25_2 & TRP10_2 basecards
Card
No. of slots
TRP25_2C
Basecard for two 2.5 Gbps transponders with 3R (50 Mbps to

2.7 Gbps). Provides PM (for SDH, SONET, GbE), OCH/UPSR
1+1 protection, and outband FEC.
TRP25_2CT
Add/Drop bidirectional transponder with tunable laser (add) and

noncolored laser (drop) with 3R (50 Mbps to 2.7 Gbps).
Provides PM (for SDH, SONET, GbE), OCH/UPSR 1+1
protection, and outband FEC.
TRP25_2CTR
Bidirectional regenerator with two tunable lasers with 3R (50

Mbps to 2.7 Gbps). Provides PM (for SDH, SONET, GbE),
OCH/UPSR 1+1 protection, and outband FEC.
TRP10_2
Basecard for two 10 Gbps transponders with outband FEC
417006-2007-013-A01
5-19
Optical transmitters and receivers for TRP25_2 and TRP10_2

Module
Description/Function
2.5 Gbps optical transmitters and receivers for TRP25_2
OMT25_Vxx
2.5 Gbps colored transmitter type V
OMT25_Xxx
2.5 Gbps colored transmitter type X
OMT25_Bxx
2.5 Gbps colored transmitter type B
OMT25_Exx
2.5 Gbps colored transmitter type E
OMT25_S3
2.5 Gbps 1310 nm short-haul transmitter type S3
OMT25_T
Optical module tunable transmitter for C band
OMR25C_A
Type A (APD) continuous receiver
OMR25C_P
Type P (PIN diode) continuous receiver
10 Gbps optical transceivers for TRP10_2
OM10_1PSTxx
Short-haul 10 Gbps colored transceiver, PIN diode receiver, with or without

FEC
OM10_1ASTxx
Short-haul 10 Gbps colored transceiver, APD receiver, with or without FEC
OM10_1PLTxx
Long-haul 10 Gbps colored transceiver, PIN diode receiver, with or without

FEC
OM10_1ALTxx
Long-haul 10 Gbps colored transceiver, APD receiver, with or without FEC
OM10_1PS5
Short-haul 1550 nm 10 Gbps transceiver, PIN diode receiver, with or

without FEC (drop direction)
OM10_1PI3
Intra-office (2 km) 1310 nm 10 Gbps transceiver, PIN diode receiver, with

or without FEC (drop direction)
OM10_1PS3
Short-haul 1310 nm 10 Gbps transceiver, PIN diode receiver
Combiner/TRP25_4 basecards
Card
No. of
slots
CMBR25_2 (CHTR)
Basecard for 2.7 Gbps combiners with outband FEC
CMBR10 (CHTR)
Basecard for 10.7 Gbps combiner with outband FEC
CMBR10_D
(CHTR + OMCD_8)
Basecard and module (OMCD_8) for eight SFP data

(GbE/FC/FICON) modules and 10.7 Gbps line card with
outband FEC
TRP25_4 (CHTR)
Basecard for 2 x 2.7 Gbps transponders with outband FEC
5-20
417006-2007-013-A01
Combiner/TRP25_4 modules and transceivers

Module
CMBR25 modules
OMTX27
OMCD25_2
2.7 Gbps line card with outband FEC

Client card for two SFP data (GbE/FC/FICON) modules + 2.7 Gbps line card with
outband FEC
2.7 Gbps optical cards for TRP25_4

OMTR27
Card for STM-16 SFP transceivers + 2.7 Gbps line transceivers with outband FEC, for
Add/Drop and regenerator applications
2.7 Gbps line transceivers for CMBR25 & TRP25_4

OTX27_AVxx
OTX27_ABxx
OTX27_AXxx
OTX27_AExx
OTX27_PVxx
OTX27_PBxx
OTX27_PXxx
OTX27_PExx
OTX27_AT
OTX27_PT
2.7 Gbps transceiver, colored transmitter type V (with outband FEC) and APD receiver
2.7 Gbps transceiver, colored transmitter type B (with outband FEC) and APD receiver
2.7 Gbps transceiver, colored transmitter type X (with outband FEC) and APD receiver
2.7 Gbps transceiver, colored transmitter type E(with outband FEC) and APD receiver
2.7 Gbps transceiver, colored transmitter type V (with outband FEC) and PIN receiver
2.7 Gbps transceiver, colored transmitter type B (with outband FEC) and PIN receiver
2.7 Gbps transceiver, colored transmitter type X (with outband FEC) and PIN receiver
2.7 Gbps transceiver, colored transmitter type E(with outband FEC) and PIN receiver
Tunable 2.7 Gbps transceiver, colored transmitter type B (with outband FEC) and APD
receiver
Tunable 2.7 Gbps transceiver, colored transmitter type B (with outband FEC) and PIN
receiver
CMBR10 modules
OMS16_4
OMDS_6
OMTX10
Client card for four SFP STM-16 modules

Client card for two STM-16 modules and four SFP data (GbE/FC/FICON) modules
10.7 Gbps line card with outband FEC
10.7 Gbps line transceivers for CMBR10

OTX10_Asxx
OTX10_PSxx
OTX10_Alxx
OTX10_PLxx
10.7 Gbps transceiver, colored transmitter type S (with outband FEC) and APD receiver
10.7 Gbps transceiver, colored transmitter type S (with outband FEC) and PIN receiver
10.7 Gbps transceiver, colored transmitter type L (with outband FEC) and APD receiver
10.7 Gbps transceiver, colored transmitter type L (with outband FEC) and PIN receiver
Client SFP transceivers for CMBR25, CMBR10 & TRP25_4

OTR4_S3
OTR4_L3
OTR4_L5
OTGBE_SX
OTGBE_LX
OTR16_I3
OTR16_S3
OTR16_L3
OTR16_L5
STM-4/OC-12 transceiver, short-haul 1310 nm

STM-4/OC-12 transceiver, long-haul 1310 nm
Optical GbE/FC/FICON transceiver, short reach, 850 nm multimode fiber
Optical GbE/FC/FICON transceiver, long reach, 1310 nm single-mode fiber
STM-16/OC-48 transceiver, intra-office 1310 nm
STM-16/OC-48 transceiver, short-haul 1310 nm
417006-2007-013-A01
5-21
2.5 Gbps optical transmitters/receivers for transponders, and

transceivers for combiners (receiver type P)
Each TRP25_2 basecard can accommodate any combination of two optical
transmitters and receivers, as listed below.
OMT25_Vxx
+
OMR25C_P/
OMT25_Bxx
+
OMR25C_P/
OMT25_Xxx
+
OMR25C_P/
OTX27_
PVxx
OTX27_
PBxx
OTX27_
PXxx
SLM
SLM
SLM
SLM
SLM
SLM
1529-1560
1529-1560
1529-1560
1529-1560
1529-1560
1285-1330
<1
<1
<1
<1
<1
<1
Direct
Direct
Direct
Direct
EA(1)
Direct
Spacing (GHz)
100
100
100
100
100
100
Max. dispersion
(ps/nm)
1800
(100 km)
3000
(170 km)
1800
(100 km)
6400
3400
(200 km)
(360 km)
[>18000/100
0 km]
Min. side mode

suppression ratio
(dB)
30
30
30
30
30
30
Min. mean launched

power (dBm)
+1
+0
+5.5
-1
+0.5 [+5.5]
-2
Max. mean launched

power (dBm)
+3
+2
+7.5
+2
+5 [+7]

(dB)
8.2
8.2
8.2
8.2
10
Sensitivity (BER of
1*10-12) (dBm) (2)
-20
-20
-20
-20
-20
-20
Min. overload (dBm)
OCH switching time

(msec)
<3
<3
<3
<3
<3
<3
Power consumption
(TRP25_2 basecard
with two
transponders) (Watt)
40
40
40
40
40
40
Source type
Operating output
wavelength (nm)
Max. -20 dB width
(nm)
Modulation
OMT25_Exx
+
OMR25C_P/
OTX27Pexx
OMT25_T
+
OMR25C_P/
OMT25_S3
+
OMR25C_P/
OTX27_
PS3
(3)
[OTX27_PT]
(1)
EA: External Absorption.

Including typical FEC improvement of 2 dB for nonamplified networks. For amplified networks, an FEC
improvement of over 4 dB is typical.
(3)
Data in square parenthesis corresponds to [OTX27_PT] transceiver.
(2)
5-22
417006-2007-013-A01
200
2.5 Gbps optical transmitters/receivers for transponders, and

transceivers for combiners (receiver type A)
Each TRP25_2 basecard can accommodate any combination of two optical
transmitters and receivers, as listed below.
OMT25_Vxx
+
OMR25C_A/
OMT25_Bxx
+
OMR25C_A/
OMT25_Xxx
+
OMR25C_A/
OMT25_Exx
+
OMR25C_A/
OTX27_AVxx
OTX27_ABxx
OTX27_AXxx
OTX27AExx
Source type
SLM
SLM
SLM
SLM
SLM
SLM
Operating
output
wavelength
(nm)
1529-1560
1529-1560
1529-1560
1529-1560
1529-1560
1285-1330
Max. -20 dB
width (nm)
<1
<1
<1
<1
<1
<1
Modulation
Direct
Direct
Direct
Direct
EA(1)
Direct
100
100
100
100
100
100
1800
3000
1800
6400
(100 km)
(170 km)
(100 km)
(360 km)
Min. side
mode
suppression
ratio (dB)
30
30
30
30
30
30
Min. mean
launched
power (dBm)
+1
+0
+5.5
-1
+. 05 [+5.5]
-2
Max. mean
launched
power (dBm)
+3
+2
+7.5
+2
+5 [+7]
Min.
extinction
ratio (dB)
8.2
8.2
8.2
8.2
10
Sensitivity
(BER of
1*10-12)
(dBm) (2)
-30
--30
-30
-30
-30
-30
Min.
overload
(dBm)
-8
-8
-8
-8
-8
-8
OCH
switching
time (msec)
<3
<3
<3
<3
<3
<3
Spacing
(GHz)
Max.
dispersion
(ps/nm)
417006-2007-013-A01
OMT25_T
+
OMR25C_A/
(3)
[OTX27_AT]
OMT25_S3
+
OMR25C_A/
OTX27_AS3
3400
(200 km)
200
[>18000/1000KM]
5-23
Power
consumption
(TRP25_2
basecard
with two
transponders)
(Watt)
OMT25_Vxx
+
OMR25C_A/
OMT25_Bxx
+
OMR25C_A/
OMT25_Xxx
+
OMR25C_A/
OMT25_Exx
+
OMR25C_A/
OTX27_AVxx
OTX27_ABxx
OTX27_AXxx
OTX27AExx
OMT25_T
+
OMR25C_A/
(3)
[OTX27_AT]
OMT25_S3
+
OMR25C_A/
OTX27_AS3
40
(1)
EA: External Absorption.

(3)
Data in square parenthesis refers to [OTX27_AT] transceivers.
(2)
5-24
417006-2007-013-A01
10 Gbps optical transceivers for transponders and combiners

receiver type P
Each TRP10_2 basecard accommodates two optical transceivers.
OM10_1PSxx/S5
OM10_1PLxx
OTX10_PSxx/S5
OTX10_PLxx
SLM
OM10_1PI3
OM10_1PS3
SLM
SLM
SLM
1529-1560
1529-1560
1285-1330
1285-1330
<1
<1
<1
<1
External
External
Direct
Direct
Spacing (GHz)
100
100
800
1600
40
Min. side mode

suppression ratio (dB)
30
30
30
30
Min. mean launched power

(dBm)
-2
-2
-6
-4
Max. mean launched

power (dBm)
+3
+3
-1
+1
8.2
10
8.2
-16(1)
-16(1)
-11
-15
Min. overload (dBm)
-1
-1
-1
-1
OCH switching time

(msec)
<3
<3
<3
<3
Source type
Operating output
wavelength (nm)
Direct max. -20 dB width
(nm)
Modulation

-
Sensitivity (BER of 1*10

12
) (dBm)
Power consumption
(TRP10_2 basecard with
two transponders) (Watt)
(1)
60
417006-2007-013-A01
5-25
10 Gbps optical transceivers for transponders and combiners

receiver type A
Each TRP10_2 basecard accommodates two optical transceivers.
OM10_1ASxx/S5
OM10_1ALxx
OTX10_ASxx/S5
OTX10_ALxx
SLM
SLM
1529-1560
1529-1560
<1
<1
External
External
Spacing (GHz)
100
100
800
1600

(dB)
30
30
-2
-2
+3
+3
8.2
10
Sensitivity (BER of 1*10 )

(dBm) (1)
-21
-21
Min. overload (dBm)
-8
-8
OCH switching time (msec)
<3
<3
Source type
Operating output wavelength (nm)
Modulation
-12
Power consumption TRP10_2

basecard with two transponders)
(Watt)
(1)
60
2.66 Gbps receivers

Type P
Type A
-20
-30
-8
-27
-27
Min. optical return cable loss (dB)
-24
-24
-27
-27
-12
Minimum sensitivity (BER of 1*10 ) (STM-16/OC-48 signal)

(dBm) (1)
Minimum overload (dBm)
(1)
5-26
417006-2007-013-A01
10.66 Gbps receivers

Type P
Type A
Minimum sensitivity (BER of 1*10 ) (dBm)

(STM-64/OC-192 signal) (dBm) (1)
-16
-21
Minimum overload (dBm)
-1
-8
-27
-27
Min. optical return cable loss (dB)
-24
-24
-27
-27
-12
(1)
5.4.4 Optical Amplifiers

Card/Module
Width
(Slots)
Cards cage
OFA2_BPC
OFA2_BBC
OFA2_BC
OFA2_PC
OFA2_PPC
OFA2_I29I29C
1
1
1
1
1
1
OFA2_I29C
OFA2_I23I23C
1
1
OFA2_I23C
OFA2_I23I29C
1
1
OFA2_BI23C
OFA2_BI29C
OFA_M
One booster and one preamplifier for the C band in a single-slot card
Two boosters for the C band in a single-slot card
One booster for the C band in a single-slot card
One preamplifier for the C band in a single-slot card
Two preamplifiers for the C band in a single-slot card
Two inline amplifiers with a gain of 29 dB for the C band in a single-slot
card
One inline amplifier with a gain of 29 dB for the C band in a single-slot card
Two inline amplifiers with a gain of 23 dB for the C band in a single-slot
card
One inline amplifier with a gain of 23 dB for the C band in a single-slot card
Two inline amplifiers with a gain of 23 dB and 29 dB for the C band in a
single-slot card
One booster and one inline amplifier with a gain of 23 dB for the C band in a
single-slot card
One booster and one inline amplifier with a gain of 29 dB for the C band in a
single-slot card
High-power, dynamic, multistage amplifier for extended long-haul and metro
applications
Modules cage
MO_BAC
1
Optical booster for the C band
MO_PAC
1
Optical preamplifier for the C band
MO_BAS
1
Single-channel optical booster for the C band
MO_PAS
1
Single-channel optical preamplifier for the C band
MO_SFF_OA2
1
Basecard for small-form-factor optical booster modules
Optical modules for MO_SFF_OA2 card
OM_HTx
N/A
High Tx power, single channel, optical amplifier for the C band
417006-2007-013-A01
5-27
OFAs for Single Channel and DWDM applications

OFA_M*
OFA2_BC/
OFA2_PC/
OFA2_I23C/
OFA2_I29C/
OFA2_BBC
(Booster)
OFA2_BPC
OFA2_I23I23C
(Inline)*
OFA2_I29I29C
(Inline)*
+17
+12
+16
+16
+20
Up to 18
Up to 32
Typ. 21**
Typ. 27**
22-32
1529-1561
1529-1561
1529-1561
1529-1561
1529-1561
Gain flatness (dB)
< 1
< 1
< 1
< 1
< 0.75
Noise figure (dB)
<9
< 5.5
< 6***
< 6***
< 7.5
In/out isolation (dB)
> 40
> 40
> 40
> 40
> 40
Return loss (dB)
< 40
< 40
< 40
< 40
< 40
15
13
13
13
25
MO_BAC/
OFA2_BC
MO_PAC
OFA2_I23C
OFA2_I29C
21
21
21
21
OFA2_
BBC
OFA2_
BPC
OFA2_
I23I23C
OFA2
I29I29C
Max. total power

(dBm)
Gain (dB)
Spectrum (nm)
Power consumption
(Watt)
Power consumption
of two amplifiers
(Watt)
(Preamplifier)
* Inline amplifiers can be accommodated in XDM-400 shelves functioning as pure inline sites. When installed in
XDM-500, XDM-1000, and XDM-2000 shelves, the site can be upgraded to a fully-functional OADM site.
**The rating does not include the attenuation introduced by the built-in VOA.
*** Does not include the effect introduced by the built-in VOA.
OFAs for single-channel applications
Max. total power

(dBm)
Gain (dB)
Spectrum (nm)
Output power
deviation (dB)
Noise figure (dB)

In/out isolation (dB)
Return loss (dB)
5-28
OM_HTx/HT
aux (Booster)
MO_BAS
(Booster)
MO_PAS
(Pre-amplifier)
+13
+15
+12
Typ. 11
Up to 16
15291561
Up to 30
1529-1561
< 1.5
< 1
< 10
> 40
< 40
< 6.5
> 40
< 40
1529-1561
< 5.5 at Pin -38
dBm
< 2.5 at Pin -26
dBm
< 1.0 at Pin -14
dBm
< 5.5
> 40
< 40
MO_BAC
(Booster)
MO_PAC
(Preamplifier)
+17
+12
Up to 18
1529-1561
Up to 32
1529-1561
< 1
< 1
<9
> 40
< 40
< 5.5
> 40
< 40
417006-2007-013-A01
OM_HTx/HTau
x (Booster)
MO_BAS
(Booster)
MO_PAS
(Pre-amplifier)
MO_BAC
(Booster)
MO_PAC
(Preamplifier
Power consumption
(Watt)
13
15
13
15
13
Power consumption of
two amplifiers (Watt)
20
N/A
N/A
N/A
N/A
5.4.5 Optical Auxiliary Cards and Modules

Card/Module
Cards cage cards
AUX-2I
AUX-2X
Auxiliary basecard installed in a single I/O slot. Each basecard

accommodates any two of the modules listed below.
Auxiliary basecard installed in either the X1 or X2 slot. Each basecard
accommodates any two of the modules listed below.
Modules
OM_4SP50
OM_2COSC5
OM_2COSC5_RB
OM_2COSC5_SP95
OM_2LCOSC5
OM_2SP95
OM_2RB
OM_2VOA
OM_2COSC3
OM_2COSC3_RB
OM_2COSC3_SP95
OM_HTaux
OM_RHaux
Four 50/50 splitters

2 x C band/OSC filters (mux + demux) for the 1510 nm supervisory
channel
channel, and 2 x red/blue filters
channel, and 2 x 95/5 splitters
2 x C/L/T filters (mux + demux) for the 1510 nm supervisory channel,
including provision for the L band
2 x 95/5 splitters
2 x red/blue filters
2 x controlled variable optical attenuators for OADM-V implementation
channel
channel, and 2 x red/blue filters
channel, and 2 x 95/5 splitters
Optical booster with a gain of 15 dB for the C band
Optical preamplifier for the C band
Modules cage modules (single slot)
MO_ACC6CP
MO_ACC6SP50
MO_ACC6SP95
MO_ACC4COSC5
MO_ACC4CLOSC5
MO_ACC4COSC3
MO_ACC4RB
417006-2007-013-A01
Six couplers
Six 50/50 splitters
Six 95/5 splitters
Four C/T filters
Four C/L/T filters
Four supervisory 1310 nm modules
Four red/blue filters
5-29
5.4.6 DCF/DCM Units

Unit
DCF-40
Dispersion compensation fiber unit for 700 ps/nm
DCF-80
DCF-80-S
Dispersion compensation fiber unit for 1400 ps/nm with filter channel 35
DCF-95
MO_DCM-Lxx
Single-channel dispersion compensation module for 700 ps/nm for channel xx

for modules cage
MO_DCM-Vxx
Single-channel dispersion compensation module for 1400 ps/nm for channel

xx for modules cage
MO_DCM-Xxx
Single-channel dispersion compensation module for 1600 ps/nm for channel

xx for modules cage
5.4.7 Auxiliary Cards and Miscellaneous Accessory

Modules
Module type
Insertion loss (dB)
OM_ACC4SP50/ MO_ACC6SP50
OM_ACC2SP95/ MO_ACC4SP95
0.65
OM_2RB/ MO_ACC4RB
Mux
Red 0.7
Blue 1.2
Demux
Red 1.2
Blue 0.7
OM_2COSC3
Mux/demux
C band 1.2
OSC 1310 nm 1.2
OM_2COSC5
Mux
C band 0.8
OSC 1510 nm 1.2
Demux
C band 1.2
OSC 1510 nm 2.0
OM_2LCOSC5
Mux/demux C band 1.1 L band 1.6 OSC 1510 nm 2.0
DCF_40
DCF_80
DCF_95
10
MO_DCM_L_xx
3.5
MO_DCM_V_xx
MO_DCM_X_xx
MECP_OSC3*
MECP_OSC5*
Transmit power 1310 nm
-5 dBm
Receiver sensitivity 10E-12
-34 dBm
Transmit power 1510 nm

Receiver sensitivity 10E-12
0 dBm
-34 dBm
*See Section 5.2.1 for details.
5-30
417006-2007-013-A01
5.4.8 Other Optical Cards

Card
No. of
slots
OPM
Optical performance monitoring card for four fiber monitoring points
OMSP
Optical MS protection card
OPM card specifications

Wavelength range................................................................................................ 1529-1562 nm
Power range............................................................................................................ -50 to +5 dB
OSNR range ...............................................................................................................0 to 30 dB
OMSP card specifications

Insertion loss through two cards ..................................................................................... < 3 dB
Switching time ................................................................................................................ < 4 ms
417006-2007-013-A01
5-31
5.5 Frequencies and Wavelengths

ITU-T
channel
number
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
5-32
Sub-band
Blue
Red
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
Channel
center
frequency
(THz)
Channel
center
wavelength
(nm)
192.1
192.2
192.3
192.4
192.5
192.6
192.7
192.8
192.9
193.0
193.1
193.2
193.3
193.4
193.5
193.6
193.7
193.8
193.9
194.0
194.1
194.2
194.3
194.4
194.5
194.6
194.7
194.8
194.9
195.0
195.1
195.2
195.3
195.4
195.5
195.6
195.7
195.8
195.9
196.0
1560.61
1559.79
1558.98
1558.17
1557.36
1556.55
1555.75
1554.94
1554.13
1553.33
1552.52
1551.72
1550.92
1550.12
1549.32
1548.51
1547.72
1546.92
1546.12
1545.32
1544.53
1543.73
1542.94
1542.14
1541.35
1540.56
1539.77
1538.98
1538.19
1537.40
1536.61
1535.82
1535.04
1534.25
1533.47
1532.68
1531.90
1531.12
1530.33
1529.55
200 GHz channel

spacing
100 GHz channel spacing
8channel
system
16channel
system
16channel
system
32channel
system
40channel
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417006-2007-013-A01

MECP......................................................................120 x 50 x 225 mm (4.72 x 1.97 x 8.86 in)
xMCP ....................................................................265 x 25 x 225 mm (10.43 x 0.98 x 8.86 in)
HLXC, XIO, SIO, PIO, DIO, EIS, ATS and cards cage mux/demux, OADM, transponder,
OFA, OPM ............................................................415 x 25 x 225 mm (16.34 x 0.98 x 8.86 in)
Modules cage connection modules (electrical), mux/demux, OADM, OFA
...............................................................................265 x 40 x 175 mm (10.43 x 1.57 x 6.89 in)
XDM-400 shelf ...............................................500 x 450 x 285 mm (19.68 x 17.72 x 11.22 in)
XDM-500 shelf ...............................................725 x 450 x 285 mm (28.54 x 17.72 x 11.22 in)
XDM-1000 shelf ...........................................1100 x 450 x 285 mm (43.31 x 17.72 x 11.22 in)
XDM-2000 shelf .............................................775 x 450 x 285 mm (30.51 x 17.72 x 11.22 in)
xRAP rack alarm panel (optional).....................100 x 450 x 285 mm (3.94 x 17.72 x 11.22 in)
xRAP-100 rack alarm panel (optional) ...............133 x 445 x 185 mm (5.24 x 17.53 x 7.29 in)
XDM-400 heat buffer.......................................44.5 x 412 x 285 mm (1.75 x 16.22 x 11.22 in)
Heat buffer ........................................................125 x 450 x 285 mm (4.92 x 17.72 x 11.22 in)
Racks....................................... 2200/2600 x 600 x 300 mm (86.61/102.36 x 23.62 x 11.81 in)
......................................................................................2134 x 584 x 305 mm (82 x 23 x 12 in)
5.6.2 Weight
XDM-400 ........................................................................................................ 17 kg (37.48 lbs)
XDM-400 fully populated............................................................................... 35 kg (77.16 lbs)
XDM-500 ........................................................................................................ 20 kg (44.09 lbs)
XDM-500 fully populated............................................................................. 50 kg (110.23 lbs)
XDM-1000 ...................................................................................................... 25 kg (55.12 lbs)
XDM-1000 fully populated........................................................................... 70 kg (154.32 lbs)
XDM-2000 ...................................................................................................... 20 kg (44.09 lbs)
XDM-2000 fully populated........................................................................... 50 kg (110.23 lbs)
417006-2007-013-A01
5-33
5.6.3 Power
Power requirements
Applicable specifications ............................................................ ETSI 300 132-2; FTZ 19FS1
Input voltage .........................................................................................-40 V DC to -75 V DC
Nominal power source .................................................................. -60 V or -48 V BTNR 2511
Power consumption
XDM-400 ..............................................................................Typical 500 W, maximum 800 W
XDM-500 ..............................................................................Typical 650 W, maximum 950 W
XDM-1000 ..................................................................... Typical 1000 W, maximum 1800* W
XDM-2000 ........................................................................Typical 1200 W, maximum 1700 W
* Depending on shelf revision.

Operation
Applicable specification................................................................ETS 300 019-1-3 Class 3.1E
Temperature range .............................................................................................-5 oC to +45 oC
Relative humidity ..................................................................................................... 5% to 90%
Storage (packed)
Temperature range ...........................................................................................-25 oC to +55 oC
Relative humidity ................................................................................................. 10% to 100%
Handling and transportation

Temperature range .......................................................................................... -40 oC to +70 oC
Relative humidity ...................................................................................................... up to 95%
5-34
417006-2007-013-A01
5.6.5 EMC
Applicable specifications .... EMC directive 89/336, (including EN 300 386-2: 1997, Class B,
........................................................................................emission and immunity requirements)
5.6.6 Safety
Applicable specifications ...........EN 60950 edition 2 (including A1/1992, A2/1993, A3/1995,
...................................................................................................................A4/1996); EN 41003
CE safety ...........................................................................................LVD directive 73/23/EEC
5.6.7 Laser Safety

Applicable specification................................................... EN 60825-1&2 (including A1/1997)

The XDM platform complies with NEBS regulations for EMC and Safety, including
GR-1089-CORE Issue 1, October 1995 and GR-63-CORE Issue 2, December 1997 with
Revision 1, February 1999 (Level 3).
5.6.9 Reliability
Life
Expected lifetime of the XDM platforms...................................................................... 15 years
Availability
SDH/SONET network................................................................................ better than 99.999%
417006-2007-013-A01
5-35
5.7 Management Specifications

Applicable specifications .........................................................G.784, G.774, M.3010, M.3100
eNM LightSoft (ECI Telecoms Network Manager) and client for managing
all Optical Networks Division equipment............................................. on SUN workstation(s)
EMS-XDM (XDM element manager) .....................................................on SUN workstation
eCraft Local Craft Terminal ............................................................................................ on PC
Note: EMS-XDM and eNM LightSoft can work on the same SUN workstation.
5.7.1
Management and Alarm Interfaces
CMIP-like over TCP/IP to EMS-XDM; MTNM from EMS-XDM to eNM LightSoft or

other TMN; RS-232 to eCraft; OverHead Access (OHA) and External Alarms; Orderwire;
Rack Alarm Panel.
5.7.2 Alarms and Performance

Performance concept.............................................................................................G.821, G.826
Alarm concept .................................................................................................................. G.783
Alarm types .................................. LED indicators, dry contacts, audible alarms (per subrack)
Alarm classes ..........................................................................Critical, Major, Minor, Warning
5.8 Other Specifications

5.8.1 Cross-Connect Levels
Cross-connect levels......................................................... VC-4nc, VC-4, VC-3, VC-2, VC-12
SONET cross-connect levels.............................................................................. STS-nc, STS-1
5.8.2 Cross-Connect Capacity

SDH switch core options............... 192/384 x STM-1 with cross-connect capability of 4/3/2/1
SONET switch core options............................................................................. 576/1152 STS-1
5-36
417006-2007-013-A01
5.8.3 Traffic Protection

Applicable specifications .................ITU-T G.841, G.842, GR-1230-CORE, GR-1400-CORE
SNCP* I/N LO, HO, UPSR ....................................................................................within 30 ms
MSP/APS 1+1 ........................................................................................................within 50 ms
MS-SPRing/BLSR ................................................................................................within 50 ms
OCH .........................................................................................................................within 5 ms
Optical line protection..............................................................................................within 5 ms
5.8.4 Redundancy
Control and synchronization systems..................................................................1+1 duplicated
Switching matrix, power system, internal buses, external buses ........................1+1 duplicated
I/O electrical modules protection .....................................................................1:N (N=1 to 10)
5.8.5 Synchronization
The XDM supports four timing references, which can be selected from multiple timing
sources, including:
From any PDH/Async tributary interface
From any SDH/SONET line(1)
External 2 MHz and 2 Mbps/1.5 Mbps(1) timing outputs (two T3 ports per shelf)
G.813 internal clock.
(1)
The XDM uses the original Synchronization Status Marker (SSM) byte from SDH/SONET tributary/aggregate
lines and transmits it over SDH/SONET lines.
5.8.6 Jitter and Wander

Applicable specifications .......................................................................... ITU-T G.823, G.825
SNCP S will be available in a future release of the XDM platforms.
417006-2007-013-A01
5-37
5-38
417006-2007-013-A01
A
Reference Documents
The primary reference documents for this document are:
1. ANSI T1.105-1991 Digital Hierarchy Optical Interface Rates and Format
Specification SONET.
2. BS ISO/IEC-3309 Information Technology Telecommunications and
Information Exchange between Systems High-Level Data Link Control
(HDLC) Procedures Frame Structure.
3. BS ISO/IEC-9595, Information Technology Open Systems Interconnection
Common Management Information Services.
4. ETSI ETR 114 Functional Architecture of SDH Transport Networks.
5. ETSI ETS 300 119 European Telecommunication Standard for Equipment
Practice.
6. ETSI EN 300 147 Synchronous Digital Hierarchy Multiplexing Structure.
7. ETSI EN 300 386-2 EMC Requirements for Telecom.
8. ETSI EN 300 132-2 D.C. Power Line.
9. ETSI ETS 300 232 Optical Interfaces for Equipment and Systems Relating
to the Synchronous Digital Hierarchy.
10. ETSI EN 300 417 Generic Functional Requirements for Synchronous
Digital Hierarchy Equipment.
11. ETSI ETS 300 462 (Parts 1, 2, 3, 4, 5) Transmission and Multiplexing
(TM) Generic Requirements for Synchronization Networks;
Synchronization Network Architecture; The Control of Jitter and Wander
within Synchronization; Timing Characteristics of Slave Clocks Suitable for
Operation in Synchronous Digital Hierarchy (SDH) Equipment.
12. ETSI ETS 300 746 Transmission and Multiplexing; Synchronous Digital
Hierarchy; Network Protection Schemes; Automatic Protection Switch
(APS) Operation.
417006-2007-013-A01
A-1
Reference Documents
13. GR-1089-CORE Electromagnetic Compatibility and Electrical Safety

Generic Criteria for Network Telecommunications Equipment.
14. GR-1209-CORE Generic Requirements for Passive Optical Components.
15. GR-1230-CORE SONET Bidirectional Line-Switched Ring Equipment
Generic Criteria.
16. GR-1312-CORE Generic Requirements for Optical Fiber Amplifiers and
Proprietary Dense Wavelength-Division Multiplexed Systems.
17. GR-1377-CORE SONET OC-192 Transport System Generic Criteria.
18. GR-1400-CORE SONET Dual-Fed Unidirectional Path Switched Ring
(UPSR) Equipment Generic Criteria.
19. GR-253-CORE Synchronous Optical Network (SONET) Transport
Systems: Common Generic Criteria.
20. GR-326-CORE Generic Requirements for Singlemode Optical Connectors
and Jumper Assemblies.
21. GR-3580 NEBS Criteria Levels.
22. GR-383-CORE COMMON LANGUAGE Equipment Codes (CLEI
Codes) Generic Requirements for Bar Code Labels.
23. GR-436-CORE Digital Network Synchronization Plan.
24. GR-485-CORE COMMON LANGUAGE Equipment Codes (CLEI
Codes) Generic Requirements for Processes and Guidelines.
25. GR-499-CORE Transport Systems Generic Requirements (TSGR):
Common Requirements.
26. GR-63-CORE Network Equipment Building System (NEBS)
Requirements: Physical Protection.
27. IEC-68 Environmental Testing
28. IEC 917 Modular Order for the Development of Mechanical Structures for
Electronic Equipment Practices.
29. IEC 60950 Electrical Safety.
30. IEC 60825 Optical Safety.
A-2
417006-2007-013-A01
Reference Documents
31. IEEE 802.3 IEEE Standard for Information Technology

Telecommunications and Information Exchange Between Systems Local
and Metropolitan Area Networks Specific Requirements Part 3: Carrier
Sense Multiple Access with Collision Detection (CSMA/CD) Access
Method and Physical Layer Specifications.
32. ISO 9595, ISO 9596 CMISE Specification.
33. ITU-T Recommendation G.650 Definition and Test Methods for the
Relevant Parameters of Single-mode Fibers.
34. ITU-T Recommendation G.651 Characteristics of a 50/125 m Multimode
Graded Index Optical Fiber Cable.
35. ITU-T Recommendation G.652 Characteristics of a Single-mode Optical
Fiber Cable.
36. ITU-T Recommendation G.653 Characteristics of a Dispersion-shifted
Single-mode Optical Fiber Cable.
37. ITU-T Recommendation G.654 Characteristics of a Cut-off Shifted Singlemode Optical Fiber Cable.
38. ITU-T Recommendation G.655 Characteristics of a Non-zero Dispersion
Shifted Single-mode Optical Fiber Cable.
39. ITU-T Recommendation G.661 Definition and Test Methods for the
Relevant Generic Parameters of Optical Amplifier Devices and Subsystems.
40. ITU-T Recommendation G.662 Generic Characteristics of Optical Fiber
Amplifier Devices and Subsystems.
41. ITU-T Recommendation G.663 Application Related Aspects of Optical
Fiber Amplifier Devices and Subsystems.
42. ITU-T Recommendation G.664 Optical Safety Procedures and
Requirements for Optical Transport Systems.
43. ITU-T Recommendation G.671 Transmission Characteristics of Passive
Optical Components.
44. ITU-T Recommendation G.681 Functional Characteristics of Interoffice
and Long-haul Line Systems Using Optical Amplifiers, Including Optical
Multiplexing.
45. ITU-T Recommendation G.691 Optical Interfaces for Single Channel SDH
Systems with Optical Amplifiers and STM-64 Systems (Draft).
417006-2007-013-A01
A-3
Reference Documents
46. ITU-T Recommendation G.692 Optical Interfaces for Multi-channel

Systems with Optical Amplifiers.
47. ITU-T Recommendation G.703 Physical/Electrical Characteristics of
Hierarchical Digital Interfaces.
48. ITU-T Recommendation G.704 Synchronous Frame Structures Used at
1544, 6312, 2048, 8448 and 44 736 kbit/s Hierarchical Levels.
49. ITU-T Recommendation G.706 Frame alignment and CRC procedures
relating to basic frame structure defined in Rec G.704.
50. ITU-T Recommendation G.707 Network Node Interface for the
Synchronous Digital Hierarchy.
51. ITU-T Recommendation G.708 Sub STM-0 Network Node Interface for
the Synchronous Digital Hierarchy (SDH).
52. ITU-T Recommendation G.709 Network Node Interface for OTN.
53. ITU-T Recommendation G.772 Protected Monitoring Points provided on
Digital Transmission Systems.
54. ITU-T Recommendation G.774 & G774.n SDH Information Model.
55. ITU-T Recommendation G.783 Characteristics of SDH Equipment
Functional Blocks.
56. ITU-T Recommendation G.784 Synchronous Digital Hierarchy (SDH)
Management.
57. ITU-T Recommendation G.798 Characteristics of OTN Hierarchy
Equipment Functional Blocks.
58. ITU-T Recommendation G.803 Architectures of Transport Networks based
on the Synchronous Digital Hierarchy.
59. ITU-T Recommendation G.805 Generic Functional Architecture of
Transport Networks.
60. ITU-T Recommendation G.811 Timing Characteristics of Primary
Reference Clocks.
61. ITU-T Recommendation G.812 Timing Requirements of Slave Clocks
Suitable for Use as Node Clocks in Synchronization Networks.
62. ITU-T Recommendation G.813 Timing Characteristics of SDH Equipment
Slave Clocks (SEC).
A-4
417006-2007-013-A01
Reference Documents
63. ITU-T Recommendation G.823 The Control of Jitter and Wander within
Digital Networks, which are Based on the 2048 kbit/s Hierarchy.
Digital Networks, which are Based on the SDH (Draft).
the Optical Transport Network (OTN).
66. ITU-T Recommendation G.826 Error Performance Parameters and
Objectives for International, Constant Bit Rate Digital Paths at or above the
Primary Rate.
67. ITU-T Recommendation G.828 Error Performance Parameters and
Objectives for International, Constant Bit Rate Synchronous Digital Paths.
68. ITU-T Recommendation G.829 Error Performance Events for SDH
Multiplex and Regenerator Sections.
69. ITU-T Recommendation G.841 Types and Characteristics of SDH
Network Protection Architectures.
70. ITU-T Recommendation G.842 Inter-working of SDH Protection
Architectures.
71. ITU-T Recommendation G.872 Architecture of Optical Transport
Networks.
72. ITU-T Recommendation G.874 Management Aspects of the Optical
Transport Network Element.
73. ITU-T Recommendation G.875 OTN Management Information Model for
the NE View.
74. ITU-T Recommendation G.957 Optical Interfaces for Equipment and
Systems relating to the Synchronous Digital Hierarchy.
75. ITU-T Recommendation G.958 Digital Line Systems Based on the
Synchronous Digital Hierarchy for Use on Optical Fiber Cables.
76. ITU-T Recommendation G.959.1 Optical Transport Network Physical
Layer Interfaces.
77. ITU-T Recommendation G.975 Forward Error Correction for Submarine
Systems.
78. ITU-T Recommendation M.3010 Principles for a Telecommunications
Management Network.
417006-2007-013-A01
A-5
Reference Documents
79. ITU-T Recommendation M.3100 Generic Network Information Model.

80. ITU-T Recommendation Q.821 Alarm Surveillance.
81. ITU-T Recommendation Q.822 Performance Monitoring.
82. ITU-T Recommendations X.217, X.227 ACSE Specification.
83. ITU-T Recommendations X.219, X.229 ROSE Specification.
84. RFC-1493 Definition of Managed Objects for Bridges.
85. RFC-1662 PPP in HDLC-life Framing.
86. RFC-2108 Definitions of Managed Objects for IEEE 802.3 Repeater
Devices using SMIv2.
87. RFC-2615 PPP over SONET/SDH.
88. RFC-2665 Definitions of Managed Objects for the Ethernet-like Interface
Types.
89. RFC-2737 Entity MIB (Version 2).
90. RFC-2819 Remote Network Monitoring Management Information Base.
91. RFC-2823 PPP over Simple Data Link (SDL) using SONET/SDH with
ATM-like Framing.
92. UL- 60950 Electrical Safety.
A-6
417006-2007-013-A01
B
Glossary
ACO
Alarm Cut Off
ADM
Add-and-Drop Multiplexer
AIS
Alarm Indication Signal
ALS
Automatic Laser Shutdown
ANSI
American National Standards Institute
APD
Avalanche PhotoDiode
APS
Automatic Protection Switching
ASIC
Application-Specific Integrated Circuit
ASP
Application Service Providers
ATM
Asynchronous Transfer Mode
ATS
ATM Traffic Switch
AU
Administrative Unit
AU-AIS/AIS-P
AU Alarm Indication Signal/STS Alarm Indication Signal
AU-LOP/LOP-P
AU Loss of Pointer/STS Loss of Pointer
AWG
Array Waveguide Grating
BB
Broadband
BB-DXC
Broadband Digital Cross-connect
BBE
Background Block Error
BER
Bit Error Rate
BIT
Built-In Test
BLSR
Bidirectional Line Switched Ring
BSC
Base Station Controller
CI
417006-2007-013-A01
Command, Control, Communication and Computer
B-1
Glossary
CAPEX
CAPital EXpenditure
CATV
Cable TV
C band
The wavelength range between 1530 nm and 1562 nm used in

CWDM and DWDM applications
CES
Circuit Emulation Service (ATM)
CLE
Customer Located Equipment
CLEC
Competitive Local Exchange Carrier
CMN
Customer Managed Network
CMS
Central Monitoring Station
CO
Cable Operator
CoC
Carrier of Carriers
CORBA
Common Object Request Broker Architecture
COTS
Commercial Off-The-Shelf
CPE
Customer Premise Equipment
CSU
Channel Service Unit
CU
Consolidation Unit
CWDM
Coarse Wavelength Division Multiplex
DCC
Digital Communications Channel
DCF
Dispersion Compensating Fiber
DCM
Dispersion Compensation Module
DCN
Data Communication Network
DCS
Digital Cross-connect System
Demux
Demultiplexer
DIO
XDM Data I/O card
DS-3
Digital Signal Level 3 (44.736 Mbps)
DSLAM
Digital Subscriber Line Access Multiplexer
DSU
Data Service Unit
DWDM
Dense Wavelength Division Multiplexing
DXC
Digital Cross-connect
EBER
Excessive Bit Error Rate
ECB
External Connection Board
B-2
417006-2007-013-A01
Glossary
eCRAFT
Desktop or laptop PC-based craft terminal
EDFA
Erbium-Doped Fiber Amplifier
eEM
ECI Telecoms Element Manager
EIS
Ethernet Interface Switch
EML
Element Management Layer
EMS
Element Management System
EMS-XDM
XDM Element Management System
eNM LightSoft
ECI Telecoms Network Manager
EOW
Engineering OrderWire
ESCON
Enterprise Systems Connection
ETSI
European Telecommunication Standards Institute
EVPL
Ethernet Virtual Private Line
Fast Ethernet
100BaseT. Ethernet at 100 Mbps
FC
Fiber Channel
FCU
Fan Control Unit
FE
Fast Ethernet
FEC
Forward Error Correction
FICON
Fiber Connection
FN
Functional Node
FR
Frame Relay
FTP
File Transfer Protocol
GbE
Gigabit Ethernet. Ethernet technology that raises transmission

speed to 1 Gbps.
HLXC
High Level/Low Level Cross-connect
HO
High Order
HTML
Hyper Text Markup Language
I/O
Input/Output
ILEC
Independent Local Exchange Carrier
IMA
Inverse Multiplexing over ATM
INF
Input Filter Unit
IP
Internet Protocol
417006-2007-013-A01
B-3
Glossary
ISDN
Integrated Services Digital Networks
ISP
Internet Service Provider
ITU-T
International Telecommunications Union-Telecommunication
LAN
Local Area Network
L band
The wavelength range between 1570 nm and 1610 nm used in

some CWDM and DWDM applications
LCAS
Link Capacity Adjustment Scheme
LEC
Local Exchange Carriers
LO
Low Order
LOD
Loss of Data
LOF
Loss of Frame
LOS
Loss Of Signal
ME
Managed Element
MECP
Main Equipment Control Panel
MLM
Multilongitudinal Mode
MS
Multiplex Section
MSC
Mobile Switching Center
MS-EBER
Multiplex Section-Excessive Bit Error Rate
MSO
MultiService Operator
MSP
Multiplex Section Protection
MSP-L
Linear Multiplex Section Protection
MSPP
MultiService Provisioning Platform
MS-SPRing
Multiplex Section Shared Protection Ring
MTBF
Mean Time Between Failures
MTNM
MultiTechnology Network Management
MTTR
Mean Time To Repair
Mux
Multiplexer
NB
Narrowband
NB-DXC
Narrowband Digital Cross-connect
NE
Network Element
NEL
Network Element Layer
B-4
417006-2007-013-A01
Glossary
NIM
Nonintrusive Monitoring
NML
Network Management Layer
NMS
Network Management System
NNI
Network-to-Network Interface
NT
Network Termination
NVM
Non-Volatile Memory
OADM
Optical Add/Drop Multiplexer
OAM&P
Operations, Administration, Maintenance and Provisioning
OC
Optical Carrier, the transmission speeds defined in the

SONET specification
OC-1
Optical Carrier level 1, 51.84 Mbps
OC-12
OC-192
Optical Carrier level 192, 9.953 Gbps
OC-256
OC-3
OC-48
OCH
Optical CHannel
OCHP
Optical CHannel Protection
OEO
Optical-to-Electrical-to-Optical
OFA
Optical Fiber Amplifier
OHA
OverHead Access
OMP
Optical Multiplex Protection
OMS
Optical Multiplex Section
OMSP
Optical Multiplex Section Protection
OMT
Optical Multiplexing Terminal
ONE
Optical Network Element
OPEX
OPerational EXpenditure
OPM
Optical Performance Monitoring
OSC
Optical Supervisory Channel
OSNR
Optical Signal to Noise Ratio
OSS
Operations Support System
417006-2007-013-A01
B-5
Glossary
OTN
Optical Transport Network
OW
OrderWire channel
PABX
Private Automatic Branch Exchange
PDH
Plesiochronous Digital Hierarchy
PIN
Packet Identification Number
PIO
PDH Input/Output
PM
Performance Monitoring
POP
Point of Presence
POS
Packet Over SDH/SONET
PPC
Power-Per-Channel
PSTN
Public Switched Telephone Networks
PTT
Postal Telegraph and Telephone
QoS
Quality of Service
RDR
Remote Database Replication
RNC
Radio Network Controller
SAN
Storage Area Network
SD
Signal Degradation
SDH
Synchronous Digital Hierarchy
SES
Severed Error Second
SF/SD
Signal Failure/Signal Degradation
SFF
Small-Form-Factor
SIO
SDH Input/Output
SLA
Service Level Agreement
SLM
Single Longitudinal Mode
SNCP
SubNetwork Connection Protection
SNR
Signal-to-Noise Ratio
SOA
Semiconductor Optical Amplifier
SONET
Synchronous Optical Network
SQL
Structured Query Language
SSIM
SDH/SONET Interface Module
B-6
417006-2007-013-A01
Glossary
SSM
Synchronization Status Marker (protocol)
SSP
Storage Service Provider
STM
Synchronous Transfer Mode
STM-1
Synchronous Transport Module 1, 155.52 Mbps
STM-16
STM-4
STM-64
SU
Slot Unit
TDM
Time Division Multiplexing
TLS
Transparent LAN Services
TM
Terminal Multiplexer
TMF
TeleManagement Forum
TMN
Telecommunications Management Network
TMU
TiMing Unit
TO
Telecom Operator
TSI
Time Slot Interchange
TU
Tributary Unit
TU-AIS/AIS-V
TU Alarm Indication Signal/VT Alarm Indication Signal
TU-BER
Tributary Bit Error Rate
TU-LOP/LOP-V
TU Loss of Pointer/VT Loss of Pointer
TVCXO
Temperature Compensated Voltage Controlled Crystal

Oscillator
UAS
Unavailable Seconds
UNI
User to Network Interface
UPSR
Unidirectional Path Switched Ring
VC
Virtual Container
VLAN
Virtual Local Area Network
VMUX
Variable Mux
VOA
Variable Optical Attenuator
VOD
Video-On-Demand
VPN
Virtual Private Network
417006-2007-013-A01
B-7
Glossary
WAN
Wide Area Network
WB
Wideband
WB-DXC
Wideband Digital Cross-connect
WDM
Wavelength Division Multiplexing
WTR
Wait-To-Restore
xFCU
XDM Fan Control Unit
xINF
XDM Input Filter Unit
XIO
Cross-connect Input/Output
xMCP
XDM Main Control Processor
xRAP
XDM Rack Alarm Panel
B-8
417006-2007-013-A01
I
Index
A
ADM, 1-5
Alarms and Performance, 5-36
ATM, 1-3, 1-4
C
Cards
ECB, 2-32
ECU, 2-22, 2-25
HLXC, 2-31
MECP, 2-32
MXC, 2-24
XIO, 2-31
xMCP, 2-32
Cross-connect specifications, 3-1
CWDM Platform for Metro-access Networks.
See XDM-200
D
Data interfaces specifications, 3-9
Data-Aware Access Gateway. See XDM-500
DWDM, 1-5
E
ECU card, 2-25
EIS-M
interfaces specifications, 3-9
Expansion Shelves, 2-14
F
Frequencies and Wavelengths, 5-32
I
I/O interfaces specifications, 3-2
J
Jitter and wander specifications, 3-2
L
Long-haul, 1-5
417006-2007-013-A01
M
Management specifications, 3-4
Modules
OCU, 2-23
MSPP, 1-2
MSPP for Metro-Edge or Long-Haul. See
XDM-400
Multifunctional Intelligent Optical Switch.
See XDM-2000
Multiservice Metro Optical Platform. See
XDM-1000
MXC card, 2-24
N
NEBS Compliance, 5-35
O
OADM, 2-22
Optical
CWDM unit, 2-22
P
Platform for Metro-access and Cellular
Networks. See XDM-100
POP, 1-4
Q
QoS, 1-1
R
Rack Layouts, 2-14
Redundancy specifications, 3-1
Reliability, 5-35
S
SDH/SONET interfaces specifications, 3-5
Shelf configurations
non-redundant shelf layout, 2-20
I-1
Index
Shelf Layout
XDM-1000, 2-9
XDM-2000, 2-10
XDM-500, 2-8
Specifications, 3-1
alarm and performance, 4-2
ATS, 5-11
auxiliary cards, 5-30
client transceivers for DIO and EIS cards,
5-10
connection module data for electrical I/O
cards, 5-2
cross-connect, 3-1
cross-connect capacity, 5-36
cross-connect levels, 5-36
data cards, 5-10
data interfaces, 3-9
DCF/DCM units, 5-30
Demux, 5-14
DIO, 5-11
DWDM cards, 5-12
DWDM modules, 5-13
EIS, 5-11
EIS-M interfaces, 3-9
electrical interface connection modules, 5-2
electrical, optical and mixed basecard data,
5-1
EMC, 3-11, 4-5, 5-35
environmental, 4-5, 5-34
environmental conditions, 3-11
I/O cards optical transceiver modules, 5-3
I/O interfaces, 3-2, 4-2
jitter and wander, 3-2, 4-1, 5-37
laser safety, 4-6, 5-35
management, 3-4, 4-1, 5-36
management and alarm interfaces, 4-2
miscellaneous accessory modules, 5-30
Mux, 5-13
NEBS, 3-12
NEBS compliance, 4-6
OADM, 5-17
OADM basecard, 5-19
OADM cards, 5-15
OADM modules, 5-16
OADM plug-in filters, 5-16
OFA for DWDM applications, 5-28
OFA for single-channel applications, 5-28
OMSP card, 5-31
OPM card, 5-31
optical amplifiers, 5-27
optical auxiliary cards and modules, 5-29
optical components, 5-12
I-2
PDH/Async and SDH/SONET interface,

5-8
physical, 3-10, 4-4, 5-33
power, 4-5
redundancy, 3-1, 4-1, 5-37
reliability, 3-12, 4-6
safety, 3-11, 4-6, 5-35
SDH/SONET interfaces, 3-5, 5-4
synchronization, 3-2, 5-37
traffic protection, 3-1, 5-37
transponders, 5-19
T
TM, 1-5
Traffic protection specifications, 3-1
Transponders
10 Gbps optical transceivers and combiners
(receiver type A), 5-26
10 Gbps optical transceivers and combiners
(receiver type P), 5-25
10.66 Gbps receivers, 5-27
2.5 Gbps optical transmitters/receivers,
5-22, 5-23
2.66 Gbps receivers, 5-26
combiner/TRP25_4 basecards, 5-20
combiner/TRP25_4 card modules and
transceivers, 5-21
optical transmitters and receivers, 5-20
transceivers for combiners (receiver type
A), 5-23
transceivers for combiners (receiver type
P), 5-22
TRP25_2 & TRP10_2 transponder
basecards, 5-19
X
XDM
capabilities, 1-2
cellular capabilities, 1-3
control, matrix and I/O cards, 2-31
data capabilities, 1-3
optical capabilities, 1-2
platforms, 1-4
SDH/SONET capabilities, 1-2
shelf configurations, 1-5
XDM-100, 1-4
non-redundant shelf layout, 2-20
specifications, 3-1
XDM-1000, 1-5, 2-1
cards cage, 2-28
modules cage, 2-28
standard card layout, 2-28
XDM-200, 1-5
basic shelf, 2-22
417006-2007-013-A01
cards and modules, 2-22

specifications, 4-1
splitter/coupler module, 2-22
XDM-2000, 1-5, 2-1
417006-2007-013-A01
Index
XDM-400
rack layout, 2-13
XDM-500, 1-5, 2-1
I-3
Index
I-4
417006-2007-013-A01

XDM SPEC A01 4-2 en

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XDM

Intelligent MSPP for Metro and

XDM System Specifications

Copyright by ECI Telecom Ltd., 2003-2004. All rights reserved worldwide.

XDM System Specifications

XDM Intelligent, Scalable, Optical Networking Platforms ............... 1-1

Unparalleled Capabilities..................................................................... 1-2

XDM Platforms .................................................................................... 1-4

2. Physical Description........................................................................................ 2-1

XDM Shelf Configurations ................................................................. 2-1

XDM-100 Shelf Layout ........................................................... 2-2

XDM-200 Shelf Layout ........................................................... 2-6

XDM-400 Shelf Layout ........................................................... 2-7

XDM-500 Shelf Layout ........................................................... 2-8

XDM-1000 Shelf Layout ......................................................... 2-9

XDM-2000 Shelf Layout ....................................................... 2-10

Rack Layouts and Expansion Shelves ................................. 2-11

XDM-100 Card and Module Layout ................................................... 2-19

Basic XDM-100 Shelf ........................................................... 2-19

Expanded XDM-100 Shelf with I/O Protection...................... 2-20

Nonredundant XDM-100 Shelf ............................................. 2-20

Hybrid XDM-100 Shelf Configuration (XDM-100H) .............. 2-20

XDM-200 Cards and Modules Layout ............................................... 2-22

MXC and ECU Cards ........................................................................ 2-24

ECU ...................................................................................... 2-25

XDM-400 Card Layout....................................................................... 2-26

XDM-500 Card Layout....................................................................... 2-27

XDM-1000 Card Layout..................................................................... 2-28

XDM-2000 Card Layout..................................................................... 2-30

XDM Control, Matrix and I/O Cards................................................... 2-31

HLXC .................................................................................... 2-31

XIO ....................................................................................... 2-31

MECP ................................................................................... 2-32

ECB or xECB4...................................................................... 2-32

ECI Telecom Ltd. Proprietary

XDM System Specifications

3. XDM-100 Specifications .................................................................................. 3-1

Cross-Connect Specifications ............................................................. 3-1

Cross-Connect Levels ............................................................ 3-1

Cross-Connect Capacity......................................................... 3-1

Traffic Protection ................................................................................. 3-1

Redundancy ........................................................................................ 3-1

Jitter and Wander ................................................................................ 3-2

I/O Interfaces....................................................................................... 3-2

2 Mbps (E1) ............................................................................ 3-2

34 Mbps (E3) .......................................................................... 3-2

45 Mbps (DS-3) ...................................................................... 3-2

52 Mbps (SONET/STS-1)....................................................... 3-3

STM-1 Electrical ..................................................................... 3-3

STM-1/OC-3 Optical ............................................................... 3-3

STM-4/OC-12 Optical ............................................................. 3-3

STM-16/OC-48 Optical ........................................................... 3-3

Management ....................................................................................... 3-4

Management and Alarm Interfaces ........................................ 3-4

Alarms and Performance........................................................ 3-4

SDH/SONET Interfaces....................................................................... 3-5

SDH/SONET STM-1/OC-3 I/O Module

SDH/SONET STM-4/OC-12 I/O Module

SDH/SONET STM-16/OC-48 I/O Module

2.5 Gbps Optical CWDM SFP Transceivers for

Data Interfaces .................................................................................... 3-9

Client Transceivers for EISM Cards ....................................... 3-9