Professional Documents
Culture Documents
Uptime Asia
A publication of Speedline Technologies Asia
Issue No.6 Autumn 2001
WELCOME FORTHCOMING
SEMINARS
W elcome to Issue 6 of ‘Uptime Asia’. As many Asian companies seek to stabilise
their businesses in a weakening global economy, equipment manufacturers are
continuing to look for ways to help their customers maximize their productivity In the next few months, we will be
and optimize their return on investment. organizing a series of technical
At Speedline Technologies Asia, we are doing just that. Forming the core of our seminars across Asia. Targeted at any
programme is the latest in our series of technical seminars. Allied to this, we will
be participating in a number of tradeshows around Asia between now and the end
process engineer or manager within the
of the year. electronics or semiconductor assembly
Details of all these activities can be found inside this issue, along with some fields, these seminars are free of charge
technical articles to help you keep abreast of the latest in assembly process
and are by invitation only. (see below
technology.
Lastly, we have provided you with a summary of personnel updates, so that you for details of how to register for your
know whom to contact in Asia if you have any questions on spare parts, training, free invitations).
marketing, or indeed any other matter. The first seminar on our schedule
We continue to wish you all the best in the current economic climate, and trust
that the information in this issue of Uptime Asia will continue to help you maximize is on 12th September 2001, during the
your manufacturing productivity. Nepcon Shenzhen show in South
If you require any further information about Speedline’s technologies China. This will take place at the Multi-
and equipment at any time, you will find a form on the back page of
this newsletter. Please fill this in, photo-copy it, and fax it back to us. Function Room Hall C, Hi-Tec Fair
Alternatively, if you prefer, you may send us your contact information to: Exhibition Center, and will be a joint
asiamarketing@speedline.cookson.com. seminar with Speedline’s sister
We look forward to hearing from you.
Good Business. company Alpha Metals; the main topic
to be covered at this seminar will
|be lead-free manufacturing and
technology.
Also planned for September is
Bob Stevens another Shenzhen seminar on 13th
Sector Vice President, Speedline Technologies Asia
E-mail: bstevens@speedline.cookson.com
September 2001, organized by
Speedline’s China distributor,
American Tec Co Ltd. In this seminar,
COME AND SEE US Speedline will cover two topics: 0201
fine pitch printing , and Implementing
During the next two quarters, the latest Speedline equipment will be displayed at a number of Value Added in Production Line
tradeshows across the Asia region. Here’s a taster of what you can expect to see over the next few
months. (covering advanced SMT dispensing).
If you’re interested in attending
DATE SHOW LOCATION MACHINES
any of these forthcoming seminars,
17th Sep to SEMICON Taiwan Taipei World Trade Center, ACCEL: MicroCel, MicroPro, please send us an email to:
19th Sep 2001 Booth 892 CAMALOT: XyflexPro, Matrixx, Vortexx
FOCUS: Complete BGA production line asiamarketing@speedline.cookson.com,
5th Dec to SEMICON Japan Makuhari Messe, Chiba ACCEL: MicroCel, MicroPro, quoting ‘SEPTEMBER SEMINARS’ in
7th Dec 2001 CAMALOT: XyflexPro, Matrixx, 1818 your subject line and indicating which
12th Dec to Protec Japan Makuhari Messe, Chiba CAMALOT: XyflexPro date you will be attending (12th or 13th
14th Dec 2001 ELECTROVERT: Omniflo 7
MPM: UP1500, UP3000 Ultraflex or both), name, company name and fax
number. Please email to us by 7th September
If you need more information about what we’ll be exhibiting, or if you wish to make an
appointment for a personal demonstration, please email us at:
2001 for us to fax you an invitation.
asiamarketing@speedline.cookson.com, quoting ‘2001 EXHIBITIONS’ in your subject line. Act now as seats are limited.
Speedline Technologies
A COOKSON ELECTRONICS COMPANY
1
UPTIME ASIA Autumn 2001
SPOTLIGHT ON APPLICATIONS
BY: ANDY BECKER, VICE PRESIDENT, ECD INSTRUMENTS GROUP; MARC C. APELL, REFLOW PRODUCTS MANAGER, SPEEDLINE ELECTROVERT
Speedline Technologies
A COOKSON ELECTRONICS COMPANY
2
UPTIME ASIA Autumn 2001
Thermocouples READING & EVALUATING This should be expected and accounted for by
Type K are the most commonly used PROFILING DATA examining the profiling device prior to each run
thermocouples in the electronics industry. There Solder paste manufactures typically have profile for any damage that may skew the results. The
are a variety of techniques to attach recommendations specific to their paste key is to ensure that your measuring device is
thermocouples to the components of your PCB. formulations. These recommendations should be capable of delivering accurate results.
The method depends upon the type of PCB being used to determine the best profile for your process
processed, as well as user preferences. and compared against actual assembly results. CLASSIC PCB PROFILING VS. MACHINE
Steps can then be taken to alter machine settings QUALITY MANAGEMENT PROFILING
Thermocouple Attachment to deliver the best results for the specific While the most popular type of thermal profiling
High Temperature Solder provides a very strong assembly. involves using a traveling profiler and
physical connection to the PCB. This method is thermocouples to monitor PCB component
commonly used in an operation that can afford CLASSIC PCB REFLOW THERMAL PROFILE temperatures, profiling is also used to ensure that
to sacrifice a dedicated reference board for the reflow oven is continually operating at its
profiling and process verification. Caution should optimal settings. A variety of self-contained
be used to ensure that a minimum amount of machine profiling instruments are available to
solder is applied to avoid affecting the profile. provide you with a daily check of your key reflow
Adhesives can be used to secure the oven parameters, including air temperature, heat
thermocouple to the assembly. This usually results flow and conveyor speed. These instruments also
in a positive physical connection of the provide the opportunity to quickly identify any
thermocouple junction to the assembly. out-of-control trends before they adversely affect
Drawbacks include the possibility of the adhesive the quality of your finished PCB assembly.
failing during the heating process, removal at
the conclusion of the profile and residue left on PROFILING THE WAVESOLDER PROCESS
the assembly. Again, caution should be taken to While this article has focused on the reflow
use a minimum amount of adhesive as adding solder process, classic PCB profiling can also
thermal mass can affect the results of the profile. New tools are now available to PCB assemblers be performed on assemblies as they pass
Kapton or Aluminum Tape is easy to use, but which make it easy to design a target profile for through a wavesolder machine. Techniques and
provides the least secure method of attachment. a specific combination of solder paste and reflow profiling benefits are similar to those utilised
Profiles done using tape will often show a rather oven. Once designed, this target profile can simply and obtained for the reflow process. In
jagged profile due to the thermocouple junction be called-up by the machine operator and set to addition, you are able to select from a variety
lifting from the contact surface during heating. automatically run on the reflow oven, based on of self-contained profiling instruments designed
Ease of use and lack of residual or destructive that specific PCB assembly. to allow you to collect data from your
effects to the assembly make this is a popular wavesolder machine to quickly identify any out-
method. WHEN TO PROFILE of-control trends and be certain of consistent
Pressure Type Thermocouples are now Profiling is especially useful when starting with a day-to-day and shift-to-shift operations.
available as well. These devices clamp to the edge new assembly. Oven settings must be determined
of a circuit board and use spring tension to hold to optimise the process for high-quality results. SUMMARY
a thermocouple junction firmly in contact with As a diagnostic tool, a profiler is invaluable in Thermal profiling is a key element in the
the assembly being profiled. These pressure probes helping determine the causes of poor yields and/ assembly of PCBs, both to determine process
are quick and easy to use, and are non-destructive or high rework. machine settings and to verify process
to the PCB. Profiling can uncover inappropriate oven consistency. Without measurable results, your
settings or assure that settings are appropriate control over the reflow process is limited.
Thermocouple Placement to the assembly. Many facilities run a profile on Consult your paste vendor and review
Because the outside edges and corners of an standard reference boards or with a machine component specifications to determine the best
assembly will heat up faster than the center, and quality management profiling instrument profile parameters for your process. By
components of greater thermal mass will heat everyday, or at the beginning of each shift, to implementing a regular regimen of both classic
more slowly than components of lesser thermal verify oven operation and avoid potential PCB profiling and machine quality management
mass, a minimum of four thermocouple problems before they happen. These profiles can profiling you will be able to lower your PCB
placements are recommended. One thermocouple be stored in hard copy or electronic format and scrap rates while improving quality and
should be placed toward an edge or corner of the used as part of an ISO program or to perform throughput. As a result, your total operating
assembly being profiled, one on a small SPC operations on machine performance over costs will be reduced, resulting in a substantial
component, another toward the center of the time. improvement in profits.
board, and a fourth on a component of higher Care should be taken with the assembly used
mass. Most profilers have five or six channels and for profiling. This assembly may degrade over time If you have any questions about any if the points
additional thermocouples can be placed on other from mishandling or repeated exposure to reflow raised in this article, please send us an email to:
asiamarketing@speedline.cookson.com, quoting
parts of the board of interest, or on components temperatures. It is not uncommon for the board
‘PCB THERMAL PROFILING’ in your subject line.
at risk to thermal shock or high temperature of a profiling assembly to delaminate over time
damage. or for thermocouple attachments to become loose.
Speedline Technologies
A COOKSON ELECTRONICS COMPANY
3
UPTIME ASIA Autumn 2001
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FROM THE HASSLES OF
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N CONFORMAL COATING?
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eed some help with your equipment, software, spare parts, or process? Here’s an up-
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to-date list of key people to help keep you running smoothly:
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CAMALOT 4398 IS THE SOLUTION.
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Activity Contact Email
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Regional Management (Asia Pacific) L.W.Kho lkho@speedline.cookson.com
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Business Management (Korea) J.H.Lee jhlee@speedline.cookson.com
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Key Accounts Management S.S.Kwa skwa@speedline.cookson.com
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Application Process John Carbajal jcarbajal@speedline.cookson.com
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Technical Services & Training Management Steven Ng sng@speedline.cookson.com A ll information is now available at our
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Spare Parts Management Halim Hannan hhannan@speedline.cookson.com website www.speedlinetechnologies.com.
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The 4398, a programmable automatic
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Marketing S.M.Fong fseeming@speedline.cookson.com
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selective coating system, is designed to
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coat your complex assemblies and pcbs
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Sales Order Korene Sum ksum@speedline.cookson.com
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precisely with no need for masking and
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Finance Jasmine Phuah jphuah@speedline.cookson.com demasking. So, if you’re interested in
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saving time and money, and increasing
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For any other enquiries, phone us on (65) 286 6635, or just drop us an email with throughput, drop us an email at:
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your requests to: asiamarketing@speedline.cookson.com asiamarketing@speedline.cookson.com,
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quoting ‘CONFORMAL COATING’ in
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your subject line or give us a click at
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www.speedlinetechnologies.com
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Speedline Technologies
A COOKSON ELECTRONICS COMPANY
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