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Rhidiyan Waroko 0806331935 Departemen Teknik Metalurgi dan Material Fakultas Teknik Universitas Indonesia
Outline
Introduction Application Design Process and Material Selection
Material for Microsensor Material for Microactuator
Introduction
Electronic materials are material which used for electronic application, such as Microelectromechanical systems (MEMS), due to of their electrical properties. MEMS are small integrated devices or systems that combine electrical and mechanical components. Microsensors and microactuators are vital organs of MEMS, forming the interfaces between controller and environment.
Application
MEMS device applications include : Inkjet-printer cartridges Miniature robots Microengines Microtransmissions Optical scanners Chemical, pressure and flow sensors Ext.
To maximize the deflection d for measuring higher pressure, so, the maximum stress in the diaphragm is:
The best material for the diaphragm is that with the largest value of M
For high mass sensitivity, the best material for a cantilever is that with the largest value of M
To minimize the volume, the product must be maximized, so is the performance index for this problem.
Case Study
Material selection for microelectronic heat sinks
Heat sinks are the most common and cost-effective hardware employed for the thermal management of microelectronic circuits and microelectromechanical systems (MEMS) devices. Heat sinks function by efciently transferring thermal energy (heat) from an object at a relatively high temperature to a second object at a lowert emperature with a much greater heat capacity. This rapid transfer of thermal energy quickly brings the rst object into thermal equilibrium with the second, lowering the temperature of the rst object, fullling the heat sinks rolecas a cooling device.
Material Properties
Material Selection
To prevent electrical coupling and stray capacitance between a microchip and heat sink, the heat sink must be a good insulator, meaning a high resistivity. But at the same time it must also have the highest possible thermal conductivity to drain away heat as fast as possible from the chip. The translation step is summarized as follows:
Material Selection
From the graph shown we nd that Aluminum Nitride (AlN) or Alumina (Al2O3) satises the constraints and our objective to maximize thermal conductivity and resistivity is achieved with these materials.
Material Selection
Thermal stress is the stress that appears in a body when it is heated or cooled but prevented from expanding or contracting. It depends on the expansion coefcient of the material and on its modulus. A development of the theory of expansion leads to the relation:
Material Selection
We can make the following observations based on these equations: i. As temperature of the material used in heat sink increases (T), the value of thermal expansion also decreases. ii. For high values of Youngs Modulus, the value of thermal expansion must be signicant (i.e.neither too high nor too low). iii. Despite satisfying the above mechanical properties, the material should have high electrical resistivity.
Material Selection
From the graph we can conclude that Al, AlN, Al2O3 and to some extent even Cu and Zn alloys can be best possible materials for microelectronic heat sinks.
Material Selection
Thermal contact resistance. Consider a case wherein 2 solid bars are brought into contact as. Suppose bar A is the microchip and bar B is the heat sink. Let the length of bar A be DxA and that of bar B be DxB performing an energy balance on the two materials, we obtain:
Where the quantity (hCA)-1 is called the thermal contact resistance and hC is called the contact coefcient.
Material Selection
Therefore, we must note that there are two principal contributions to the heat transfer at the joint: i. ii. The solid solid conduction at the spots of contact. The conduction through entrapped gases in the void spaces created by the contact.
Material Selection
Designating the contact area by Ac and the void area by Av, the equation for heat transfer can be written as:
From standard values, aluminum is the best possible material to satisfy this requirement. We assume that solid A is silicon based material/substrate
Reference
1. S.M. Spearing. Materials Issues in Microelectro-mechanical System (MEMS). Actamater. 48 (2000) 179-196 2. G. Prashant Reddy, Navneet Gupta.Material selection for microelectronic heat sinks: An application of the Ashby approach. Materials and Design 31 (2010) 113117 3. Jin Qian, Ya-Pu Zhao.Materials selection in mechanical design for microsensors and microactuators. Materials and Design 23 (2002) 619625