HI-SINCERITY

MICROELECTRONICS CORP.

Spec. No. : HE6735

Issued Date : 1994.08.10
Revised Date : 2002.01.18
Page No. : 1/4

HTIP107
PNP EPITAXIAL PLANAR TRANSISTOR

Description
The HTIP107 is designed for use in general purpose amplifier and lowspeed switching applications.

Absolute Maximum Ratings (Ta=25C)

TO-220

Maximum Temperatures
Storage Temperature ........................................................................................................ -55 ~ +150 C
Junction Temperature ................................................................................................ +150 C Maximum
Maximum Power Dissipation
Total Power Dissipation (Tc=25C)................................................................................................. 80 W
Total Power Dissipation (Ta=25C)................................................................................................... 2 W
Maximum Voltages and Currents
BVCBO Collector to Base Voltage ............................................................................................... -100 V
BVCEO Collector to Emitter Voltage ............................................................................................ -100 V
BVEBO Emitter to Base Voltage ...................................................................................................... -5 V
IC Collector Current ......................................................................................................................... -8 A

Characteristics (Ta=25C)
Symbol
BVCBO
BVCEO
ICBO
ICEO
IEBO
*VCE(sat)1
*VCE(sat)2
*VBE(on)
*hFE1
*hFE2
Cob

Min.
-100
-100
1
200
-

Typ.
-

Max.
-50
-50
-8
-2
-2.5
-2.8
20
300

Unit
V
V
uA
uA
mA
V
V
V
K
pF

Test Conditions
IC=-1mA, IE=0
IC=-30mA, IB=0
VCB=-100V, IE=0
VCE=-50V, IB=0
VEB=-5V, IC=0
IC=-3A, IB=-6mA
IC=-8A, IB=-80mA
IC=-8A, VCE=-4V
IC=-3A, VCE=-4V
IC=-8A, VCE=-4V
VCB=-10V, f=0.1MHz
*Pulse Test: Pulse Width 380us, Duty Cycle2%

Darlington Schematic
C

R1

R2

HTIP107

HSMC Product Specification

HI-SINCERITY

Spec. No. : HE6735

Issued Date : 1994.08.10
Revised Date : 2002.01.18
Page No. : 2/4

MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current

Saturation Voltage & Collector Current

10000

100000

Saturation Voltage (mV)

10000

hFE

1000
o

125 C

75 C

100
o

25 C

75 C

1000

25 C
o

125 C

10
VCE(s at) @ IC=500IB

hFE @ VCE=4V
1
1

10

100

1000

100
100

10000

1000

Collector Current IC (mA)

Saturation Voltage & Collector Current

Saturation Voltage & Collector Current

10000

10000

Saturation Voltage (mV)

Saturation Voltage (mV)

10000

Collector Current IC (mA)

75 C

1000

25 C

125 C

1000

75 C

25 C

125 C

VCE(sat) @ IC=625IB

100
100

1000

VCE(sat) @ IC=100IB

100
100

10000

Collector Current IC (mA)

1000

10000

Collector Current IC (mA)

ON Voltage & Collcetor Current

Switching Time & Collector Current

10

10000

Switching Times (us)..

ON Voltage (mV)

VCC=30V, IC=250IB1=-250IB2

75 C

25 C
1000
o

125 C

Tstg
1
Tf
Ton

VBE(ON) @ VCE=4V
0.1

100
10

100

1000

Collector Current IC (mA)

HTIP107

10000

10

Collector Current (A)

HSMC Product Specification

HI-SINCERITY

Spec. No. : HE6735

Issued Date : 1994.08.10
Revised Date : 2002.01.18
Page No. : 3/4

MICROELECTRONICS CORP.

Capacitance & Reverse-Biased Voltage

Safe Operating Area

1000

100000

Collector Current-IC (mA)

Capacitance (pF)

10000

100

Cob

1000

PT=1ms
PT=100ms

100

PT=1s

10

10

1
0.1

10

Reverse-Biased Voltage (V)

HTIP107

100

10

100

1000

Forward Voltage-V CE (V)

HSMC Product Specification

HI-SINCERITY

Spec. No. : HE6735

Issued Date : 1994.08.10
Revised Date : 2002.01.18
Page No. : 4/4

MICROELECTRONICS CORP.
TO-220AB Dimension
Marking:
B

A
D

H T I P
1 0 7

Control Code

Date Code

H
K

Style: Pin 1.Base 2.Collector 3.Emitter

2
1

4
P

3-Lead TO-220AB Plastic Package

HSMC Package Code: E
*: Typical

Inches
Min.
Max.
0.2197
0.2949
0.3299
0.3504
0.1732
0.185
0.0453
0.0547
0.0138
0.0236
0.3803
0.4047
*0.6398

DIM
A
B
C
D
E
G
H

Millimeters
Min.
Max.
5.58
7.49
8.38
8.90
4.40
4.70
1.15
1.39
0.35
0.60
9.66
10.28
*16.25

DIM
I
K
M
N
O
P

Inches
Min.
Max.
*0.1508
0.0295
0.0374
0.0449
0.0551
*0.1000
0.5000
0.5618
0.5701
0.6248

Millimeters
Min.
Max.
*3.83
0.75
0.95
1.14
1.40
*2.54
12.70
14.27
14.48
15.87

Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.

Material:
Lead: 42 Alloy; solder plating
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0

Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

Head Office And Factory:

Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931

HTIP107

HSMC Product Specification

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