MECH 3040: Heat Transfer Spring 2013 Design Project: Due Last day of classes You are expected

to do this project entirely on your own. See me if you have questions.

Project description
A manufacturer of CPU chips is soliciting designs for heat sinks. Their chip has a 6 cm 6 cm surface area, and the design operating temperature of the chip is 50 C. The heat sink is to be made from a rectangular block of aluminum, with a base matching that of the chip and a height of H =5 cm. Rectangular channels are machined in the aluminum, as illustrated in the gure.

sic tasks in performing a design analysis, for test values of NC and t, will be 1. Determine the pressure drop across the ow channels and the resulting volumetric ow rate and mass averaged velocity. The specs for the fan given in the link provide a) the maximum ow rate provided by the fan and 2) the stagnation pressure (the pressure increase when there is no net ow); these two quantities can be used, when combined with pipe ow analysis, to predict the ow rate for a given channel conguration. 2. Determine the perimeteraveraged heat transfer coecient for the channel. The heat transfer conditions can be modeled as constant surface temperature; this is an approximation, as the side walls will behave as extended surfaces and the temperature will drop from the bottom (base) to the top of the wall. Relations in Ch. 8 for rectangular channels will be useful. Developing ow conditions should be addressed: the ow length may not be adequately long for conditions to become fully developed (and this may be a benet as far as the design objectives are concerned). 3. Use n eciency relations, combined with the heat transfer coecient determined above, to obtain an overall heat transfer coecient which characterizes the heat transfer from the chip surface to the uid. 4. Use the overall heat transfer coecient in the energy equation to obtain the uid outlet temperature and the net heat transfer rate. We will discuss the project in class, I am sure.

The tops of the channels are covered with a thin aluminum plate. Each channel therefore provides a closed ow passage. Air is forced through the channels by means of a fan and a duct. The specs of the fan can be found at www.jameco.com. Your task is to nd a design which will maximize the rate of heat transfer from the chip. This design will specify 1) the number of channels NC and 2) the channel width w. The thickness of the wall separating one channel from the other, denoted as t, will depend on NC and w via W = (NC + 1)t + NC w, where W = 6 cm. The minimum allowable wall thickness is 0.5 mm. The project will combine extended surface heat transfer and internal ow analysis. The ba-