Moc 3022

6-PIN DIP RANDOM-PHASE OPTOISOLATORS TRIAC DRIVER OUTPUT (250/400 VOLT PEAK)
MOC3010M MOC3011M MOC3012M MOC3020M MOC3021M MOC3022M MOC3023M
PACKAGE
SCHEMATIC
ANODE 1
6 MAIN TERM.
6 6 1
N/C 3 4 MAIN TERM. CATHODE 2 5 NC*
1
*DO NOT CONNECT (TRIAC SUBSTRATE)
DESCRIPTION
The MOC301XM and MOC302XM series are optically isolated triac driver devices. These devices contain a GaAs infrared emitting diode and a light activated silicon bilateral switch, which functions like a triac. They are designed for interfacing between electronic controls and power triacs to control resistive and inductive loads for 115 VAC operations.
FEATURES
Excellent IFT stabilityIR emitting diode has low degradation High isolation voltageminimum 5300 VAC RMS Underwriters Laboratory (UL) recognizedFile #E90700 Peak blocking voltage 250V-MOC301XM 400V-MOC302XM VDE recognized (File #94766) Ordering option V (e.g. MOC3023VM)
APPLICATIONS
Industrial controls Trafc lights Vending machines Solid state relay Lamp ballasts Solenoid/valve controls Static AC power switch Incandescent lamp dimmers Motor control
2003 Fairchild Semiconductor Corporation
Page 1 of 10
4/30/03
ABSOLUTE MAXIMUM RATINGS (TA = 25C unless otherwise noted)

Parameters TOTAL DEVICE Storage Temperature Operating Temperature Lead Solder Temperature Junction Temperature Range Isolation Surge Voltage(1) (peak AC voltage, 60Hz, 1 sec duration) Total Device Power Dissipation @ 25C Derate above 25C EMITTER Continuous Forward Current Reverse Voltage Total Power Dissipation 25C Ambient Derate above 25C DETECTOR Off-State Output Terminal Voltage Peak Repetitive Surge Current (PW = 1 ms, 120 pps) Total Power Dissipation @ 25C Ambient Derate above 25C Note 1. Isolation surge voltage, VISO, is an internal device dielectric breakdown rating. For this test, Pins 1 and 2 are common, and Pins 4, 5 and 6 are common. VDRM ITSM PD MOC3010M/1M/2M MOC3020M/1M/2M/3M All All 250 400 1 300 4 V A mW mW/C IF VR PD All All All 60 3 100 1.33 mA V mW mW/C TSTG TOPR TSOL TJ VISO PD All All All All All All -40 to +150 -40 to +85 260 for 10 sec -40 to +100 7500 330 4.4 C C C C Vac(pk) mW mW/C Symbol Device Value Units
Page 2 of 10
4/30/03
ELECTRICAL CHARACTERISTICS (TA = 25C Unless otherwise specied) INDIVIDUAL COMPONENT CHARACTERISTICS
Parameters EMITTER Input Forward Voltage Reverse Leakage Current DETECTOR Peak Blocking Current,Either Direction Peak On-State Voltage,Either Direction Rated VDRM, IF = 0 (note 1) ITM = 100 mA peak, IF = 0 IDRM VTM All All 10 1.8 100 3 nA V IF = 10 mA VR = 3 V, TA = 25C VF IR All All 1.15 0.01 1.5 100 V A Test Conditions Symbol Device Min Typ Max Units
TRANSFER CHARACTERISTICS (TA = 25C Unless otherwise specied.)

DC Characteristics Test Conditions Symbol Device MOC3020M MOC3010M MOC3021M LED Trigger Current Voltage = 3V (note 3) IFT MOC3011M MOC3022M MOC3012M MOC3023M Holding Current, Either Direction Note 1. Test voltage must be applied within dv/dt rating. 2. This is static dv/dt. See Figure 5 for test circuit. Commutating dv/dt is a function of the load-driving thyristor(s) only. 3. All devices are guaranteed to trigger at an IF value less than or equal to max IFT. Therefore, recommended operating IF lies between max IFT (30 mA for MOC3020M, 15 mA for MOC3010M and MOC3021M, 10 mA for MOC3011M and MOC3022M, 5 mA for MOC3012M and MOC3023M) and absolute max IF (60 mA). IH All 100 Min Typ Max 30 15 10 5 A mA Units
Page 3 of 10
4/30/03
Fig. 1 LED Forward Voltage vs. Forward Current

1.8
Fig. 2 On-State Characteristics

800
1.7
600
ON-STATE CURRENT - I TM (mA)
VF - FORWARD VOLTAGE (V)
1.6
400
1.5
200
1.4
TA = -55oC
-200
1.3
TA = 25oC
-400
1.2
TA = 100oC
-600
1.1
-800
1.0 1 10 100
-3
-2
-1
1
TM
ON-STATE VOLTAGE - V
(V)
IF - LED FORWARD CURRENT (mA)
Fig. 3 Trigger Current vs. Ambient Temperature

1.4 25
Fig. 4 LED Current Required to Trigger vs. LED Pulse Width
1.3
TRIGGER CURRENT - I FT (NORMALIZED)
TRIGGER CURRENT - I FT (NORMALIZED)
20
NORMALIZED TO: PWin 100 s
1.2
15
1.1
1.0
10
0.9
0.8
0 0.7 NORMALIZED TO T A = 25C 0.6 -40 -20 0 20 40 60 80 100
10
20
50
100
LED TRIGGER WIDTH - PWin (s) AMBIENT TEMPERATURE - TA (oC)
Fig. 6 Leakage Current, IDRM vs. Temperature

10000
Fig. 5 dv/dt vs. Temperature

12
1000
IDRM, LEAKAGE CURRENT (nA)

100
10
STATIC dv/dt CIRCUIT IN FIGURE 5
STATIC - dv/dt (V/s)
100
10
1
0 25 30 40 50 60 70 80 90
Ambient Temperature - TA (oC)
0.1 -40 -20 0 20 40 60 80 100
TA, AMBIENT TEMPERATURE ( oC)
Page 4 of 10
4/30/03
400V (MOC302X) 250V (MOC301X) Vdc
1. The mercury wetted relay provides a high speed repeated pulse to the D.U.T.
RTEST R = 10 k CTEST
2. 100x scope probes are used, to allow high speeds and voltages. 3. The worst-case condition for static dv/dt is established by triggering the D.U.T. with a normal LED input current, then removing the current. The variable RTEST allows the dv/dt to be gradually increased until the D.U.T. continues to trigger in response to the applied voltage pulse, even after the LED current has been removed. The dv/dt is then decreased until the D.U.T. stops triggering. RC is measured at this point and recorded.
PULSE INPUT
MERCURY WETTED RELAY
D.U.T.
X100 SCOPE PROBE
APPLIED VOLTAGE WAVEFORM
Vmax = 400 V (MOC302X) = 250 V (MOC301X) 252 V (MOC302X) 158 V (MOC301X) dv/dt =
RC
0.63 Vmax
RC
0 VOLTS
252 = (MOC302X) RC 158 = (MOC301X) RC
Figure 5. Static dv/dt Test Circuit
Note: This optoisolator should not be used to drive a load directly. It is intended to be a trigger device only.
RL Rin VCC 2 MOC3010M MOC3011M MOC3012M 5 1 6 180 120 V 60 Hz
Figure 6. Resistive Load
ZL Rin VCC 2 MOC3010M MOC3011M MOC3012M 5 0.1 F C1 1 6 180 2.4k 120 V 60 Hz
Figure 7. Inductive Load with Sensitive Gate Triac (IGT 15 mA)
Page 5 of 10
4/30/03
ZL VCC Rin 1 2 MOC3010M MOC3011M MOC3012M 6 5 180 1.2 k 120 V 60 Hz C1
0.2 F
Figure 8. Inductive Load with Sensitive Gate Triac (IGT 15 mA)
Rin VCC
1 2 MOC3020M MOC3021M MOC3022M MOC3023M
6 5
360
470 HOT
0.05 F
39 240 VAC 0.01 F LOAD GROUND
In this circuit the hot side of the line is switched and the load connected to the cold or ground side. The 39 ohm resistor and 0.01F capacitor are for snubbing of the triac, and the 470 ohm resistor and 0.05 F capacitor are for snubbing the coupler. These components may or may not be necessary depending upon the particular and load used.
Figure 9. Typical Application Circuit
Page 6 of 10
4/30/03
Package Dimensions (Through Hole)

0.350 (8.89) 0.320 (8.13)
Package Dimensions (Surface Mount)

0.350 (8.89) 0.320 (8.13)
0.260 (6.60) 0.240 (6.10)
0.260 (6.60) 0.240 (6.10)
0.390 (9.90) 0.332 (8.43)
0.070 (1.77) 0.040 (1.02)
0.070 (1.77) 0.040 (1.02)

0.014 (0.36) 0.010 (0.25) 0.320 (8.13)
0.320 (8.13) 0.014 (0.36) 0.010 (0.25)
0.200 (5.08) 0.115 (2.93)
0.200 (5.08) 0.115 (2.93)
0.012 (0.30) 0.008 (0.20)
0.100 (2.54) 0.015 (0.38) 0.020 (0.50) 0.016 (0.41) 0.100 (2.54) 15 0.012 (0.30)
0.025 (0.63) 0.020 (0.51) 0.020 (0.50) 0.016 (0.41)
0.100 [2.54] 0.035 (0.88) 0.006 (0.16)
Package Dimensions (0.4 Lead Spacing)

0.350 (8.89) 0.320 (8.13)
Recommended Pad Layout for Surface Mount Leadform
0.260 (6.60) 0.240 (6.10)
0.070 (1.78)
0.060 (1.52)
0.070 (1.77) 0.040 (1.02)
0.014 (0.36) 0.010 (0.25)
0.425 (10.79)
0.100 (2.54) 0.305 (7.75) 0.030 (0.76)
0.200 (5.08) 0.115 (2.93)
0.100 (2.54) 0.015 (0.38) 0.020 (0.50) 0.016 (0.41) 0.100 [2.54] 0.012 (0.30) 0.008 (0.21) 0.425 (10.80) 0.400 (10.16)
NOTE All dimensions are in inches (millimeters)
Page 7 of 10
4/30/03
ORDERING INFORMATION
Option S SR2 T V TV SV SR2V Order Entry Identier S SR2 T V TV SV SR2V Description Surface Mount Lead Bend Surface Mount; Tape and reel 0.4" Lead Spacing VDE 0884 VDE 0884, 0.4" Lead Spacing VDE 0884, Surface Mount VDE 0884, Surface Mount, Tape & Reel
MARKING INFORMATION
MOC3010 V
3 4
2 6
X YY Q
5
Denitions
1 2 3 4 5 6 Fairchild logo Device number VDE mark (Note: Only appears on parts ordered with VDE option See order entry table) One digit year code, e.g., 3 Two digit work week ranging from 01 to 53 Assembly package code
*Note Parts that do not have the V option (see denition 3 above) that are marked with date code 325 or earlier are marked in portrait format.
Page 8 of 10
4/30/03
Carrier Tape Specifications

12.0 0.1 4.5 0.20 2.0 0.05 0.30 0.05 4.0 0.1 1.5 MIN 1.75 0.10
11.5 1.0 21.0 0.1 9.1 0.20 24.0 0.3
0.1 MAX
10.1 0.20
1.5 0.1/-0
User Direction of Feed
NOTE All dimensions are in inches (millimeters)
Reow Prole (White Package, -M Sufx)
300 Temperature (C) 250 200 150 100 50 0 0 0.5 1 1.5 2 2.5 245C peak
230C, 1030 s
Time above 183C, 120180 sec Ramp up = 210C/sec Peak reflow temperature: 245C (package surface temperature) Time of temperature higher than 183C for 120180 seconds One time soldering reflow is recommended 3.5 4 4.5
Time (Minute)
Page 9 of 10
4/30/03
DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
Page 10 of 10
4/30/03
This datasheet has been download from: www.datasheetcatalog.com Datasheets for electronics components.

Moc 3022

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6-PIN DIP RANDOM-PHASE OPTOISOLATORS TRIAC DRIVER OUTPUT (250/400 VOLT PEAK)

MOC3010M MOC3011M MOC3012M MOC3020M MOC3021M MOC3022M MOC3023M

2003 Fairchild Semiconductor Corporation

ABSOLUTE MAXIMUM RATINGS (TA = 25C unless otherwise noted)

2003 Fairchild Semiconductor Corporation

TRANSFER CHARACTERISTICS (TA = 25C Unless otherwise specied.)

2003 Fairchild Semiconductor Corporation

Fig. 1 LED Forward Voltage vs. Forward Current

Fig. 2 On-State Characteristics

ON-STATE CURRENT - I TM (mA)

VF - FORWARD VOLTAGE (V)

IF - LED FORWARD CURRENT (mA)

Fig. 3 Trigger Current vs. Ambient Temperature

Fig. 4 LED Current Required to Trigger vs. LED Pulse Width

TRIGGER CURRENT - I FT (NORMALIZED)

TRIGGER CURRENT - I FT (NORMALIZED)

NORMALIZED TO: PWin 100 s

0 0.7 NORMALIZED TO T A = 25C 0.6 -40 -20 0 20 40 60 80 100

LED TRIGGER WIDTH - PWin (s) AMBIENT TEMPERATURE - TA (oC)

Fig. 6 Leakage Current, IDRM vs. Temperature

Fig. 5 dv/dt vs. Temperature

IDRM, LEAKAGE CURRENT (nA)

STATIC dv/dt CIRCUIT IN FIGURE 5

STATIC - dv/dt (V/s)

Ambient Temperature - TA (oC)

0.1 -40 -20 0 20 40 60 80 100

TA, AMBIENT TEMPERATURE ( oC)

2003 Fairchild Semiconductor Corporation

400V (MOC302X) 250V (MOC301X) Vdc

MERCURY WETTED RELAY

X100 SCOPE PROBE

APPLIED VOLTAGE WAVEFORM

252 = (MOC302X) RC 158 = (MOC301X) RC

Figure 5. Static dv/dt Test Circuit

RL Rin VCC 2 MOC3010M MOC3011M MOC3012M 5 1 6 180 120 V 60 Hz

Figure 6. Resistive Load

ZL Rin VCC 2 MOC3010M MOC3011M MOC3012M 5 0.1 F C1 1 6 180 2.4k 120 V 60 Hz

Figure 7. Inductive Load with Sensitive Gate Triac (IGT 15 mA)

2003 Fairchild Semiconductor Corporation

ZL VCC Rin 1 2 MOC3010M MOC3011M MOC3012M 6 5 180 1.2 k 120 V 60 Hz C1

Figure 8. Inductive Load with Sensitive Gate Triac (IGT 15 mA)

1 2 MOC3020M MOC3021M MOC3022M MOC3023M

39 240 VAC 0.01 F LOAD GROUND

Figure 9. Typical Application Circuit

2003 Fairchild Semiconductor Corporation

Package Dimensions (Through Hole)

Package Dimensions (Surface Mount)

0.260 (6.60) 0.240 (6.10)

0.260 (6.60) 0.240 (6.10)

0.390 (9.90) 0.332 (8.43)

0.070 (1.77) 0.040 (1.02)

0.070 (1.77) 0.040 (1.02)

0.320 (8.13) 0.014 (0.36) 0.010 (0.25)

0.200 (5.08) 0.115 (2.93)

0.200 (5.08) 0.115 (2.93)

0.012 (0.30) 0.008 (0.20)

0.025 (0.63) 0.020 (0.51) 0.020 (0.50) 0.016 (0.41)

0.100 [2.54] 0.035 (0.88) 0.006 (0.16)

Package Dimensions (0.4 Lead Spacing)

Recommended Pad Layout for Surface Mount Leadform

0.260 (6.60) 0.240 (6.10)

0.014 (0.36) 0.010 (0.25)

0.100 (2.54) 0.305 (7.75) 0.030 (0.76)