Handbook of A dhesive Techn ology

Second Edition, Revised and Expanded

edited by

A. Pizzi
Universite' de Nancy I Epinal, France

K. L. Mittal
Hopewell Junction, New York, U.S.A.

MARCEL

MARCEL DEKKER, INC.

D E K K E R

NEWYORK BASEL

Copyright 2003 by Taylor & Francis Group, LLC

Although great care has been taken to provide accurate and current information, neither the author(s) nor the publisher, nor anyone else associated with this publication, shall be liable for any loss, damage, or liability directly or indirectly caused or alleged to be caused by this book. The material contained herein is not intended to provide specic advice or recommendations for any specic situation. Trademark notice: Product or corporate names may be trademarks or registered trademarks and are used only for identication and explanation without intent to infringe. Library of Congress Cataloging-in-Publication Data A catalog record for this book is available from the Library of Congress. ISBN: 0-8247-0986-1 This book is printed on acid-free paper. Headquarters Marcel Dekker, Inc., 270 Madison Avenue, New York, NY 10016, U.S.A. tel: 212-696-9000; fax: 212-685-4540 Distribution and Customer Service Marcel Dekker, Inc., Cimarron Road, Monticello, New York 12701, U.S.A. tel: 800-228-1160; fax: 845-796-1772 Eastern Hemisphere Distribution Marcel Dekker AG, Hutgasse 4, Postfach 812, CH-4001 Basel, Switzerland tel: 41-61-260-6300; fax: 41-61-260-6333 World Wide Web http://www.dekker.com The publisher oers discounts on this book when ordered in bulk quantities. For more information, write to Special Sales/Professional Marketing at the headquarters address above. Copyright 2003 by Marcel Dekker, Inc. All Rights Reserved. Neither this book nor any part may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying, microlming, and recording, or by any information storage and retrieval system, without permission in writing from the publisher. Current printing (last digit): 10 9 8 7 6 5 4 3 2 1 PRINTED IN THE UNITED STATES OF AMERICA
Copyright 2003 by Taylor & Francis Group, LLC

Preface to the Second Edition

What can one say about the second edition of any book, especially one like this compendium that contains 50% more material and pages than the rather popular first edition, is heavily revised, expanded, and modernized, and contains 10 new chapters? As editors we can simply say we are elated. This is all true, of course, but it sounds so dull! Some readers (particularly younger ones) may expect some profound truth in a preface, a noteworthy dedication, or even an unusual phrase to remember such as the one that graced the preface of another book (Advanced Wood Adhesives Technology, Marcel Dekker, Inc., 1994). So here it is: On my (AP) first day as a university professor (at the University of the Witwatersrand in Johannesburg), I was profoundly impressed by the motto printed on the paper bookmark that was given to me by the administration clerk, Wherever a site of higher learning stands, there stands a light in the darkness of human folly. The university meant this to signify how good they were (and they were good, too). It goes much deeper than this, however. A site of learning does not need to be a university, or an industrial/research laboratory, but it can be more broadly defined as any source of learning, even, for instance, a book in such an arcane, specialized, but always fascinating, field as adhesives. It is for this reason that this volume has been revised and expanded, to function as a site of learning and a springboard for budding adhesive technologists. It is dedicated to next generations in the hope that they may build, and build rapidly, on the cumulative wisdom of many specialists distilled in this handbook. This book, containing bountiful information, should serve for veterans as a commentary on the current state of knowledge regarding adhesives, and as a Baedeker for those who wish to make their maiden voyage into the wonderful and technologically important area of adhesives. In essence it should be valued by and of use to everyone interested, centrally or peripherally, in adhesives and should appeal to polymer chemists, surface chemists, adhesionists, and engineers, as well as users of adhesives. We now have the pleasant task of thanking all those who helped in many and varied ways to bring this project to fruition. First, we are profoundly thankful to all the authors of the rst edition for consenting to again be part of this much enlarged eort. Many contributors devoted time and eort to update their chapters. As any handbook can benet from an injection of new blood, so our particular thanks must go to the contributors of new chapters. Our appreciation is extended to the sta of Marcel Dekker, Inc. for giving this book its form. In closing, we can happily say that it has been great fun working with all involved in this project. A. Pizzi K. L. Mittal

Copyright 2003 by Taylor & Francis Group, LLC

Preface to the First Edition

Bonding different materials together by means of an adhesive may appear to most people as a mundane occurrence. In reality a great deal of technology backs the apparently simple action of bonding. Thus, a complex and advanced technology, or series of technologies, has arisen to deal with adhesives and their applications in many fields. The diversity of substrates and the continuous introduction of new processes and materials has ensured that the field of adhesives technology is one of the more swiftly expanding manufacturing endeavors. Some excellent handbooks on adhesives already exist although there are very few indeed. However, the expansion and diversity of this field has by necessity limited the number of technologies and relevant aspects described in such volumes. This volume is no exception to such a trend. The editors and authors do not pretend that overlaps with other similar works do not exist since basic background is often necessary to understand more advanced concepts. This volume however covers some aspects of technology that are not described in other volumes of this type. It also often looks at already reported technologies from a very dierent angle. It is hoped that such a volume will help to ll some of the technological gaps between the existing literature and industrial reality. The volume is divided into four main sections, the rst being an introductory overview. The remaining three sections are concerned with (1) fundamental aspects, (2) adhesive classes, and (3) some elds in which application of adhesives is very extensive. All the contributors are known specialists in their elds who practice their specialties on a daily basis. Their chapters are the results of considerable knowledge and experience in their particular niches. It is a pleasant duty for the editors and authors, on completing a volume of this nature, to acknowledge the help willingly given by friends, colleagues, their companies, and their institutions. Without their help and encouragement most of the chapters presented would not have seen the light of day. Last, but denitely not least, our thanks go to Marcel Dekker, Inc. and its sta for originating this book, for their help and encouragement, and for prompting us to nish it. A. Pizzi K. L. Mittal

Copyright 2003 by Taylor & Francis Group, LLC

Contents

Preface to the Second Edition Preface to the First Edition Contributors Part 1: Review Topics 1. Historical Development of Adhesives and Adhesive Bonding Fred A. Keimel 2. Information Resources William F. Harrington Part 2: Fundamental Aspects 3. Theories and Mechanisms of Adhesion J. Schultz and M. Nardin 4. The Mechanical Theory of Adhesion D. E. Packham 5. AcidBase Interactions: Relevance to Adhesion and Adhesive Bonding Mohamed M. Chehimi, Ammar Azioune, and Eva Cabet-Deliry 6. Interactions of Polymers in Solution with Surfaces Jean-Franc ois Joanny 7. Tailoring Adhesion of Adhesive Formulations by Molecular Mechanics/Dynamics A. Pizzi 8. Principles of Polymer Networking and Gel Theory in Thermosetting Adhesive Formulations A. Pizzi 9. Application of Plasma Technology for Improved Adhesion of Materials Om S. Kolluri 10. Silane and Other Adhesion Promoters in Adhesive Technology Peter Walker 11. Testing of Adhesives K. L. DeVries and P. R. Borgmeier 12. The Physical Testing of Pressure-Sensitive Adhesive Systems John Johnston 13. Durability of Adhesive Joints Guy D. Davis 14. Analysis of Adhesives David N.-S. Hon
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15. 16.

17. 18. 19.

Fracture of Adhesive-Bonded Wood Joints Bryan H. River Fracture Mechanics Methods for Interface Bond Evaluations of Fiber-Reinforced Plastic/Wood Hybrid Composites Julio F. Davalos and Pizhong Qiao Spectroscopic Techniques in Adhesive Bonding W. J. van Ooij Ultraviolet Stabilization of Adhesives Douglas Horsey Thermal Stabilization of Adhesives Neal J. Earhart, Ambu Patel, and Gerrit Knobloch

Part 3: Adhesive Classes 20. Protein Adhesives for Wood Alan L. Lambuth 21. Animal Glues and Adhesives Charles L. Pearson 22. Carbohydrate Polymers as Adhesives Melissa G. D. Baumann and Anthony H. Conner 23. Natural Rubber-Based Adhesives Sadhan K. De 24. Elastomeric Adhesives William F. Harrington 25. Polysulfide Sealants and Adhesives Naim Akmal and A. M. Usmani 26. Phenolic Resin Adhesives A. Pizzi 27. Natural Phenolic Adhesives I: Tannin A. Pizzi 28. Natural Phenolic Adhesives II: Lignin A. Pizzi 29. Resorcinol Adhesives A. Pizzi 30. Furan-Based Adhesives Mohamed Naceur Belgacem and Alessandro Gandini 31. UreaFormaldehyde Adhesives A. Pizzi 32. MelamineFormaldehyde Adhesives A. Pizzi 33. Isocyanate Wood Binders Charles E. Frazier 34. Polyurethane Adhesives Dennis G. Lay and Paul Cranley 35. Polyvinyl and EthyleneVinyl Acetates Ken Geddes 36. Unsaturated Polyester Adhesives A. Pizzi 37. Hot-Melt Adhesives A. Pizzi
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38. 39. 40.

41. 42. 43. 44. 45.

Reactive Acrylic Adhesives Dennis J. Damico Anaerobic Adhesives Richard D. Rich Aerobic Acrylics: Increasing Quality and Productivity with Customization and Adhesive/Process Integration Andrew G. Bachmann Technology of Cyanoacrylate Adhesives for Industrial Assembly William G. Repensek Silicone Adhesives and Sealants Loren D. Lower and Jerome M. Klosowski Epoxy Resin Adhesives T. M. Goulding Pressure-Sensitive Adhesives T. M. Goulding Electrically Conductive Adhesives Alan M. Lyons and D. W. Dahringer

Part 4: Application of Adhesives 46. Adhesives in the Electronics Industry Monika Bauer and Jurgen Schneider 47. Adhesives in the Wood Industry Manfred Dunky 48. Bioadhesives in Drug Delivery Brian K. Irons and Joseph R. Robinson 49. Bonding Materials and Techniques in Dentistry Eberhard W. Neuse and Eliakim Mizrahi 50. Adhesives in the Automotive Industry Eckhard H. Cordes

Copyright 2003 by Taylor & Francis Group, LLC

Contributors

Naim Akmal* University of Cincinnati, Cincinnati, Ohio, U.S.A. Ammar Azioune Interfaces, Traitement, Organisation et Dynamique des Syste`mes (ITODYS), Universite Paris 7Denis Diderot, Paris, France Andrew G. Bachmann Dymax Corporation, Torrington, Connecticut, U.S.A. Monika Bauer Fraunhofer Institute of Applied Materials Research, Teltow, Germany Melissa G. D. Baumann Forest Products Laboratory, USDAForest Service, Madison, Wisconsin, U.S.A. Mohamed Naceur Belgacem Ecole Franc aise de Papeterie et des Industries Graphiques (INPG), St. Martin dHe`res, France P. R. Borgmeier University of Utah, Salt Lake City, Utah, U.S.A. Eva Cabet-Deliry Laboratoire dElectrochimie Moleculaire, Universite Paris 7Denis Diderot, Paris, France Mohamed M. Chehimi Interfaces, Traitement, Organisation et Dynamique des Syste`mes (ITODYS), Universite Paris 7Denis Diderot, Paris, France Anthony H. Conner Forest Products Laboratory, USDAForest Service, Madison, Wisconsin, U.S.A. Eckhard H. Cordes Mercedes-Benz AG, Bremen, Germany Paul Cranley The Dow Chemical Company, Freeport, Texas, U.S.A. D. W. Dahringer AT&T Bell Laboratories, Murray Hill, New Jersey, U.S.A. Dennis J. Damico Lord Corporation, Erie, Pennsylvania, U.S.A. Julio F. Davalos West Virginia University, Morgantown, West Virginia, U.S.A. Guy D. Davis DACCO SCI, Inc., Columbia, Maryland, U.S.A. Sadhan K. De Indian Institute of Technology, Kharagpur, India K. L. DeVries University of Utah, Salt Lake City, Utah, U.S.A. Manfred Dunky Dynea Austria GmbH, Krems, Austria Neal J. Earhart CIBA-GEIGY Corporation, Ardsley, New York, U.S.A. Charles E. Frazier Virginia Polytechnic Institute and State University, Blacksburg, Virginia, U.S.A. Alessandro Gandini Ecole Franc aise de Papeterie et des Industries Graphiques (INPG), St. Martin dHe`res, France Ken Geddes Crown Berger Limited, Darwen, Lancashire, England T. M. Goulding Consultant, Johannesburg, South Africa

*Current affiliation: Teledyne Analytical Instruments, City of Industry, California, U.S.A

Copyright 2003 by Taylor & Francis Group, LLC

William F. Harrington Adhesive Information Services, Mishawaka, Indiana, U.S.A. David N.-S. Hon Clemson University, Clemson, South Carolina, U.S.A. Douglas Horsey CIBA-GEIGY Corporation, Ardsley, New York, U.S.A. Brian K. Irons* Columbia Research Laboratories, Madison, Wisconsin, U.S.A. Jean-Franc ois Joanny Institut Charles Sadron, Strasbourg, France John Johnston Consultant, Charlotte, North Carolina, U.S.A. Fred A. Keimel Adhesives and Sealants Consultants, Berkeley Heights, New Jersey, U.S.A. Jerome M. Klosowski Dow Corning Corporation, Midland, Michigan, U.S.A. Gerrit Knobloch CIBA-GEIGY Corporation, Basel, Switzerland Om S. Kolluri HIMONT Plasma Science, Foster City, California, U.S.A. Alan L. Lambuthy Boise Cascade Corporation, Boise, Idaho, U.S.A. Dennis G. Lay The Dow Chemical Company, Freeport, Texas, U.S.A. Loren D. Lower Dow Corning Corporation, Midland, Michigan, U.S.A. Alan M. Lyons AT&T Bell Laboratories, Murray Hill, New Jersey, U.S.A. Eliakim Mizrahi University of the Witwatersrand, Johannesburg, South Africa M. Nardin Centre de Recherches sur la Physico-Chimie des Surfaces Solides, CNRS, Mulhouse, France Eberhard W. Neuse University of the Witwatersrand, Johannesburg, South Africa D. E. Packham Center for Materials Research, University of Bath, Bath, England Ambu Patel CIBA-GEIGY Corporation, Ardsley, New York, U.S.A. Charles L. Pearson Swift Adhesives Division, Reichhold Chemicals, Inc., Downers Grove, Illinois, U.S.A. A. Pizzi Ecole Nationale Superieure des Technologies et Industries du Bois, Universite de Nancy I, Epinal, France Pizhong Qiao The University of Akron, Akron, Ohio, U.S.A. William G. Repensek National Starch and Chemical Company, Oak Creek, Wisconsin, U.S.A. Richard D. Rich Loctite Corporation, Rocky Hill, Connecticut, U.S.A. Bryan H. River Forest Products Laboratory, USDAForest Service, Madison, Wisconsin, U.S.A. Joseph R. Robinson University of Wisconsin, Madison, Wisconsin, U.S.A. rgen Schneider Fraunhofer Institute of Applied Materials Research, Teltow, Germany Ju J. Schultz Centre de Recherches sur la Physico-Chimie des Surfaces Solides, CNRS, Mulhouse, France A. M. Usmani Firestone, Carmel, Indiana, U.S.A. W. J. van Ooij University of Cincinnati, Cincinnati, Ohio, U.S.A. Peter Walker Atomic Weapons Establishment Plc, Aldermaston, Berkshire, England

*Current affiliation: University of Wisconsin, Madison, Wisconsin, U.S.A. y Deceased.

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