1 Advanced Topics in Metal Joining - Soldering

01. INTRODUCTION
Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal (solder) into the joint, the filler metal having a lower melting point than the workpiece. Soldering differs from welding in that soldering does not involve melting the work pieces. In brazing, the filler metal melts at a higher temperature, but the workpiece metal does not melt. Formerly nearly all solders contained lead, but environmental concerns have increasingly dictated use of lead-free alloys for electronics and plumbing purposes. 1.1 Solders Soldering filler materials are available in many different alloys for differing applications. In electronics assembly, the eutectic alloy of 63% tin and 37% lead (or 60/40, which is almost identical in melting point) has been the alloy of choice. Other alloys are used for plumbing, mechanical assembly, and other applications. Some examples of soft-solder are tin-lead for general purposes, tin-zinc for joining aluminium, lead-silver for strength at higher than room temperature, cadmium-silver for strength at high temperatures, zinc-aluminium for aluminium and corrosion resistance, and tin-silver and tin-bismuth for electronics. 1.2 Fluxes The purpose of flux is to facilitate the soldering process. One of the obstacles to a successful solder joint is an impurity at the site of the joint, for example, dirt, oil or oxidation. The impurities can be removed by mechanical cleaning or by chemical means, but the elevated temperatures required to melt the filler metal (the solder) encourages the work piece (and the solder) to re-oxidize. This effect is accelerated as the soldering temperatures increase and can completely prevent the solder from joining to the workpiece. One of the earliest forms of flux was charcoal, which acts as a reducing agent and helps prevent oxidation during the soldering process. Some fluxes go beyond the simple prevention of oxidation and also provide some form of chemical cleaning (corrosion). 1.3 Heat source Heat source used to melt the solder could be Iron, Torch, Furnace, Induction, Resistance, Infrared and Ultrasonic heating methods. Further, method of solder application leads to classification of soldering for mass production as Reflow, Dip and wave soldering techniques.

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2 Advanced Topics in Metal Joining - Soldering

02 DIP SOLDERING TECHNIQUE Dip soldering is accomplished by submerging parts to be joined into a molten solder bath. Thus, all components surfaces are coated with filler metal. Solders have low surface tension and high wetting capability. There are many types of solders, each used for different applications, such as Lead-Silver for strength at higher than room temperature. Tin-Lead is used for General Purpose; Tin-Zinc is used for Aluminum; Cadmium-Silver is used for strength at high temperatures; Zinc-Aluminum is used for Aluminum and corrosion resistance; Tin-Silver and Tin-Bismuth is used for Electronics. Because of the toxicity of lead, lead-free solders are being developed and more widely used. The molten bath can be any suitable filler metal, but the selection is usually confined to the lower melting point elements. The most common dip soldering operations use zinc-aluminum & tin-lead solders. Solder pot metal - Cast iron or steel, electrically heated. Bath temperature - 220 deg. Celsius to 260 deg.Celsius (for binary tin-lead alloys) Bath temperature - 350 deg.Celsius to 400 deg. Celsius (for lead-rich alloys) Solder composition - 60% Sn(tin),40% Pb(lead) or eutectic alloy.

Figure 1. Dip soldering method The workpieces to be joined are treated with cleaning flux. Then the workpiece is mounted in the work holding device and immersed in the molten solder for 2 to 12 seconds. The workpiece is often agitated to aid the flow of the solder. The workpiece holder must allow an inclination of 3 to 5 deg. so that the solder may run off to insure a smooth finish. Dip Soldering is used extensively in the electronics industry. However, they have a limited service use at elevated temperatures because of the low melting point of the filler metals. Soldered materials do not have much strength and are therefore not used for load-bearing.

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3 Advanced Topics in Metal Joining - Soldering 03 WAVE SOLDERING METHOD

Wave soldering is a mechanical and technique that allows multiple lead wires to be soldered to a Printed Circuit Board (PCB) as it passes over a wave of molten solder. In this process a PCB on which electronic components have been placed with their lead wires extending through the through the holes in the board, is loaded onto a conveyor for transport through the wave soldering equipment. The conveyor supports the PCB on its sides, so its underside is exposed to the processing steps, which consists of the following: (a) Flux is applied through foaming, spraying, brushing, and (b) Wave soldering is used pump liquid solder from a molten both on to the bottom of board to make soldering connections between lead wire and metal circuit on the board.

Figure 2. Wave soldering

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