MARIAN C.

HARGIS
mchargis@gmail.com H: 765.963.5920 C: 765.437.0151 Kokomo, IN 46902 www.linkedin.com/in/marianhargis/

SR. PRODUCT DEVELOPMENT ENGINEER

Dynamic Master of Electrical Engineering with 20+ years of achievement in research and development for multimillion dollar projects to create high-performing products for delivery into the marketplace. History of facilitating innovative designs by supporting cross-functional teams to exceed program milestones. Proven leader who implements material improvements and feature optimizations to dramatically increase product performance. Technology evangelist with a record of excellence in diverse manufacturing industries. Strategic thinker. Areas of expertise: PROJECT MANAGEMENT PRODUCT DEVELOPMENT DEVICE AND PACKAGING DESIGN SIX SIGMA ENGINEERING DESIGN PROCESSES ROOT CAUSE ANALYSIS STRATEGIC PLANNING DESIGN & DEVELOPMENT TEAM BUILDING SEMICONDUCTORS QUALITY ASSURANCE R&D OPTOELECTRONICS MANUFACTURING CROSS-FUNCTIONAL COMMUNICATION COST CONTROL MEMS TESTING & RELIABILITY COST CONTROL CUSTOM PRODUCTIZATION OPERATIONS TECHNOLOGY

P ROFESSIONAL E XPE RIENCE

DELPHI ELECTRONICS & SAFETY Kokomo, IN
Manufacturer of electronic components for the automotive industry. 2007 to Present

STAFF MICROWAVE PACKAGING ENGINEER

Microwave Packaging subject matter expert for W-band radar development. Head intellectual property review for Advanced Engineering. Liaise with universities for technology development and talent recruitment. Interface with Engineering Managers, Quality Managers, Industrial Managers, and Sourcing Managers. Primary contact with customers during development and implementation. Perform feature troubleshooting and develop technical specifications to resolve issues through collaboration and meticulous mechanical analysis. Evaluate designs to control costs of feature optimization and maximize ROI. Manage design revisions to enhance product lifespan. Introduce new technologies into existing manufacturing processes to grow development capabilities and improve overall production quality. Reduced manufacturing costs by creating novel stripline designs to utilize low-cost substrate materials for radar/antenna designs. Designed optics for collision avoidance system in 2014 Volvo by spearheading technical planning and collaborating with senior engineers to optimize feature specifications. Improved automotive design processes by implementing new nanotechnology applications as Member of Nanotechnology Council.

PERSPECT CONSULTING Rochester, MN

Optoelectronic and microwave device and packaging design

2007 to Present

PRINCIPAL Optoelectronic device and packaging design consultant for product development. Created appropriate product specification and process to ensure quality product from clients vendor. Created appropriate product specification and process to ensure quality product from clients vendor. Improved product yields by supporting vendor management and development of intellectual property for diverse clientele. Pinpointed and implemented CAPA for line-down problem for end-customer shipments. Designed Microwave transmission product line for hard disk drive industry.

MARIAN C. HARGIS
mchargis@gmail.com H: 765.963.5920 C: 765.437.0151 Page 2

JDS UNIPHASE CORPORATION Rochester, MN

Company designing and manufacturing products for optical communications networks, communications test and measurement equipment, lasers, and optical solutions for authentication and decorative applications.

2002 to 2006

LEAD DESIGN ENGINEER Spearheaded design and development of a 10Gb/s optical receiver throughout entire lifespan. Led manufacture readiness team and supplier qualification for product launch. Created primary specifications and test plans for optical receivers. Primary technical contact for vendors and strategic partners during development process. Chaired Datacom Products Patent Review Board. Subject matter expert in IEEE Stressed-Receive-Sensitivity. Collaborated with strategic partners and suppliers to create FTTx small form factor frontend module design. Managed technical plans and education for marketing to support customers.
Improved yields and reduced costs by $3.4M through simplifying designs and working with vendors to implement specifications within two months. Primary resource to lead failure/ root cause issues Decreased cost per piece from $285 to $42 by optimizing engineering processes and redesigning package.

IBM

Rochester, MN Company designing and manufacturing products for computers and networking technologies.

2000 to 2002

SENIOR ENGINEER/SCIENTIST Directed design and development of a 10Gb/s optical receiver and transmitter packaging. Led task force for silicon optical bench and MEMs development, manufacture readiness team and supplier qualification for product launch. Created primary specifications and test plans for optical receivers. Subject matter expert in photodiode technology for high data-rate communication systems. Primary technical contact for vendors and strategic partners during development process. Chaired Optical Patent Review Board. Managed technical plans and education for marketing to support customers.
Corrected process for manufacture of silicon optical bench (MEMs) technology, integrated discrete components on the silicon platform Improved yield of optical receiver to >99%, enabled recovery of >$1M in capital equipment

PURDUE UNIVERSITY West Lafayette, IN

Research institution with 39K+ students.

1997 to 2000

PRINCIPAL RESEARCH SCIENTIST Key contributor for Purdues Materials Research Center for Technology Enabling Heterostructures. Led R&D for ultrafast compound semiconductor device design and fabrication and managed $7M budget. Directed 10+ graduate students within the Materials Research Engineering Center for Technology-Enabling Heterostructures in photodetector technology, novel LED devices, InAs-based transistors and novel materials integration. Researched composite materials for high-speed optical applications and molecular electronics. Created first large-area, high-speed photodetector and first GHz-bandwidth LED enabling gigabit communication via large core plastic fiber.

MARIAN C. HARGIS
mchargis@gmail.com H: 765.963.5920 C: 765.437.0151 Page 3

A DDITIONAL E XPERI ENCE

ADJUNCT PROFESSOR, PURDUE UNIVERSITY West Lafayette, IN ASSISTANT RESEARCH PROFESSOR, EMORY UNIVERSITY Atlanta, Georgia RESEARCH ENGINEER, IBM Yorktown Heights, NY MEDICAL TECHNOLOGIST, TALLAHASSEE MEMORIAL REGIONAL MEDICAL CENTER Tallahassee, FL

E DUCATION & H ONORS

Doctor of Philosophy (PhD) Georgia Institute of Technology Atlanta, GA Master of Science (MS), Electrical Engineering Georgia Institute of Technology Atlanta, GA Bachelor of Science (BS), Electrical Engineering Florida State University Tallahassee, FL Bachelor of Science (BS), Medical Technology, Chemistry Florida State University Tallahassee, FL IBM Graduate Fellowship Georgia Tech Womens Forum Outstanding Graduate Student IEEE/OSA Student Award FAMU/FSU Engineering Honor Society (Tau Beta Pi)

A SSOCIATIONS
Senior Member IEEE Distinguished Lecturer IEEE Electron Device Society Vice Chair IEEE Standard 1787, High Frequency Measurements for Low Temperature Co-fired Ceramics Member of Advisory Board Ivy Tech Community College program in Engineering Technology

T ECHNOLOGY P ORTF OLIO

Software HFSS; ZEMAX; Silvaco Atlas and Luminous; Medici; Matlab; Mathcad; Origin; L-Edit; Alibre Designer; LabView; MS Office, Access, Project; Adobe Creative Suite

30 T E CHNICAL P UBLICATIONS P ATENTS

US 6,792,171 Receive optical sub-assembly US 7,160,039 Compact optical sub-assembly with integrated flexible circuit US 7,365,923 Heatsink tab for optical sub-assembly US 8,277,055 Multiple view Display using a single projector and method of operating the same