CPF Progress on the Finite Element Simulation of the Hot Stamping Process

Ambi Naganathan, Dr. Partchapol Sartkulvanich, Deepak Ravindran, Norbert Pierschel, Dr. Taylan Altan

June 13-16, 2011 Kassel, Germany 3rd International Conference on Hot Sheet Metal Forming of High-Performance Steel
Center for Precision Forming (CPF)

Outline
Introduction

CPF

Partners/Supporters

Current work / Strategies & Case Studies

Future Plans Summary (Capabilities/Suggestions)

Center for Precision Forming (CPF)

Introduction/Technology Overview

CPF

- Manganese Boron steel (22MnB5) has ferritic pearlitic

microstructure in as received condition

- These blanks are heated to austenitization temperature

(~950C) for 5 minutes

- The heated blanks are formed and quenched in the press at a cooling rate higher than 27K/sec - Quenching changes the microstructure from austenite to martensite and the final part is hardened and has an

ultimate tensile strength of around 1500 MPa

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Introduction/Direct Hot Stamping

CPF

Direct hot stamping process

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Partners/Supporters

CPF

National Science Foundation (NSF) - Supporting CPF/finite element simulations of hot stamping IMRA , Japan - data base of references and information in hot stamping POSCO (South Korea) and COSKUNOZ (Turkey) - Providing geometry and experimental data on example hot stamped components (details are proprietary) International Cooperation with Various Universities: Lulea, Erlangen, Hannover, Padova, Graz, Munich, Dortmund
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FE Simulation of Hot Stamping

Status / Update

CPF

Various companies/research groups are using combination of different

FE codes like LS-Dyna, ABAQUS, PAMSTAMP, FORGE, MSC. Marc,

AUTOFORM for simulating the entire hot stamping process Our Strategy

Use PAMSTAMP and DEFORM 2D and 3D to predict

-Temperature distribution -Thickness distribution

-Metal flow
-Elastic tool deflection -Cooling channel optimization

Simulate and compare results with example parts a) from literature b)

provided by our partner companies
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Our Strategies
1) Using Pam-Stamp and DEFORM together:
Blank Heating & Transfer DEFORM

CPF

Forming
PAM-STAMP Interface Software

Quenching
DEFORM

2) Using Pam-Stamp 2011, both for forming and quenching simulations (work on-going)
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Our Strategies: 1
PAM-STAMP for forming, DEFORM for quenching simulations

CPF

3D simulation with PAM-STAMP

Generated new mesh for DEFORM 2D

Section information: Coordinates, thickness and pressure distribution from PAM-STAMP

Center for Precision Forming (CPF)

Our Strategies: 2
PAM-STAMP 2011 for both Stamping and Quenching Simulations

CPF

Preliminary quenching simulations are completed, these have to be validated by Hardness from literature and sponsor companies.

Center for Precision Forming (CPF)

Case Study-1/ Hat Shape

Preliminary hot stamping simulations (Supported by NSF)

CPF

Hot stamping simulations are conducted using the FE code DEFORMTM

Case Study-1 The hot stamping experiment conducted at Lulea University of Technology, Sweden is simulated (Reference: AKER06). In the experiment, hot 22MnB5 blank at 827C is formed with a tool at 26C.

Forming force and temperature at a specified location are measured during the experiment.
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Case Study-1/ Hat Shape

CPF

*All dimensions are in m

Experimental Tool (left) and Blank(right) geometry [AKER06]

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Case Study-1/ Hat Shape

CPF

Initial and final step in the simulation (Half of Hat Shape sample is shown)
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Case Study-1/ Hat Shape

35 Forming force (kN) 30 25 20 15 10 5 Experiment DEFORM 3D (FEA)

CPF

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0 1 2 3 Time (s) 4 5 6

Forming Force vs Time

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Case Study-1/ Hat Shape

Average Temperature(C)
840 820 800 780 760 740 720 0 1 2 3 4 5 6

CPF

DEFORM 3D (FEA)

Experiment

Time (s)

Average Temperature vs Time

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Case Study-1 /Hat Shape

Conclusions

CPF

-The forming force during the experiment and temperature calculated at a specified point are matching closely with the experiment

-The commercial software package DEFORM 3D handles

combined thermal and mechanical simulation well for

simple geometries.
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Case Study-2/ AUDI B-Pillar

-Bench Mark problem-3 given in Numisheet-2008. -2D section of the part is simulated using DEFORM 2D and the full model was handled by PAM-STAMP 2011. -The objective is to predict in the formed part: (1) thickness distribution, (2) hardness distribution, (3) potential defects.

CPF

Tooling for hot stamping of B-Pillar

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Case Study-2/ AUDI B-Pillar

Input geometries for simulation

CPF

Die
Punch

Assembly

Blank holder

Blank
Reference: Benchmark problem-3, Numisheet 2008
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Case Study-2/ AUDI B-Pillar

Section DEFORM 2D Top die (75 C)

CPF

22 MnB5 Blank (810 C)

Blank holder(75 C)

Initial simulation setup

Punch (75 C)

Final simulation setup

-A critical section of the B-Pillar is chosen for 2-dimensional simulation (DEFORM 2D /Variable mesh density)

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Case Study-2/ AUDI B-Pillar

Full model - PAM-STAMP 2011

CPF

Non-isothermal die and blank, Strain rate dependent material, Heat transfer coefficient = f(P), Microstructure evolution, Thermal/microstructural dilatation, No cooling channels (at this point).
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Center for Precision Forming (CPF)

Case Study-2/ AUDI B-Pillar

Section 2a 2 1.95

CPF

Thickness (t) [mm]

1.9 1.85 1.8 1.75 1.7 1.65 1.6 0 Numisheet PamStamp 11 15 30 45 60 75 Curvilinear Distance to P2 [mm] 90 105

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Case Study-2/ AUDI B-Pillar

Section 2b 2 1.95

CPF

Thickness (t) [mm]

1.9 1.85 1.8 1.75 1.7 1.65 1.6 0 Numisheet PamStamp 11 15 30 45 60 Curvilinear Distance to P2 [mm] 75

- Thickness of sheet can be calculated accurately. - Hardness calculation is under progress.

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Case study-3/ Cooling Channel Design

CPF

Section of B-pillar from Numisheet 2008 -Different combination of cooling channel configurations and examples from the literature are simulated to achieve uniform cooling and martensite microstructure

Temperature distribution at the end of forming stage. DEFORM 2D

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Summary / Ongoing Work

CPF

- Material properties of 22MnB5 (Flow stress data, coefficient of friction, heat transfer coefficient, formability and forming limit diagrams, phase transformation, anisotropy coefficient, elastic properties),

- Material models,
- Example finite element simulations (in cooperation with participating companies), - Tools for hot stamping / Cooling channel optimization, - Blank heating methods (induction, resistance, furnace).

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CPF Current and future work Optimization / selection of cooling channels, Elastic deflection of dies / effect on heat transfer

between thinned sections and dies,

Modification of die surface geometry,

Novel quenching methods (quenching holes in the

dies),

Correlation of microstructure to hardness.

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Questions

CPF

Non-proprietary information can be found at web sites: www.cpforming.org www.ercnsm.org

Dr. Taylan Altan (altan.1@osu.edu), Ph-614-292-5063

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