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Ambi Naganathan, Dr. Partchapol Sartkulvanich, Deepak Ravindran, Norbert Pierschel, Dr. Taylan Altan
June 13-16, 2011 Kassel, Germany 3rd International Conference on Hot Sheet Metal Forming of High-Performance Steel
Center for Precision Forming (CPF)
Outline
Introduction
CPF
Partners/Supporters
Introduction/Technology Overview
CPF
CPF
Partners/Supporters
CPF
National Science Foundation (NSF) - Supporting CPF/finite element simulations of hot stamping IMRA , Japan - data base of references and information in hot stamping POSCO (South Korea) and COSKUNOZ (Turkey) - Providing geometry and experimental data on example hot stamped components (details are proprietary) International Cooperation with Various Universities: Lulea, Erlangen, Hannover, Padova, Graz, Munich, Dortmund
Center for Precision Forming (CPF)
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CPF
-Metal flow
-Elastic tool deflection -Cooling channel optimization
Our Strategies
1) Using Pam-Stamp and DEFORM together:
Blank Heating & Transfer DEFORM
CPF
Forming
PAM-STAMP Interface Software
Quenching
DEFORM
2) Using Pam-Stamp 2011, both for forming and quenching simulations (work on-going)
Center for Precision Forming (CPF)
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Our Strategies: 1
PAM-STAMP for forming, DEFORM for quenching simulations
CPF
Our Strategies: 2
PAM-STAMP 2011 for both Stamping and Quenching Simulations
CPF
Preliminary quenching simulations are completed, these have to be validated by Hardness from literature and sponsor companies.
CPF
Forming force and temperature at a specified location are measured during the experiment.
Center for Precision Forming (CPF)
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CPF
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CPF
Initial and final step in the simulation (Half of Hat Shape sample is shown)
Center for Precision Forming (CPF)
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CPF
0
0 1 2 3 Time (s) 4 5 6
CPF
DEFORM 3D (FEA)
Experiment
Time (s)
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CPF
-The forming force during the experiment and temperature calculated at a specified point are matching closely with the experiment
simple geometries.
Center for Precision Forming (CPF)
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CPF
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CPF
Die
Punch
Assembly
Blank holder
Blank
Reference: Benchmark problem-3, Numisheet 2008
Center for Precision Forming (CPF)
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CPF
Blank holder(75 C)
Punch (75 C)
-A critical section of the B-Pillar is chosen for 2-dimensional simulation (DEFORM 2D /Variable mesh density)
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CPF
Non-isothermal die and blank, Strain rate dependent material, Heat transfer coefficient = f(P), Microstructure evolution, Thermal/microstructural dilatation, No cooling channels (at this point).
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CPF
1.9 1.85 1.8 1.75 1.7 1.65 1.6 0 Numisheet PamStamp 11 15 30 45 60 75 Curvilinear Distance to P2 [mm] 90 105
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CPF
1.9 1.85 1.8 1.75 1.7 1.65 1.6 0 Numisheet PamStamp 11 15 30 45 60 Curvilinear Distance to P2 [mm] 75
CPF
Section of B-pillar from Numisheet 2008 -Different combination of cooling channel configurations and examples from the literature are simulated to achieve uniform cooling and martensite microstructure
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CPF
- Material properties of 22MnB5 (Flow stress data, coefficient of friction, heat transfer coefficient, formability and forming limit diagrams, phase transformation, anisotropy coefficient, elastic properties),
- Material models,
- Example finite element simulations (in cooperation with participating companies), - Tools for hot stamping / Cooling channel optimization, - Blank heating methods (induction, resistance, furnace).
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CPF Current and future work Optimization / selection of cooling channels, Elastic deflection of dies / effect on heat transfer
Questions
CPF
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