Workshop 08 Electronics Cooling with Natural Convection and Radiation

14. 5 Release

Introduction to ANSYS CFX

2012 ANSYS, Inc. December 17, 2012 1 Release 14.5

Introduction
This workshop models the heat dissipation from a hot electronics component fitted to a printed circuit board (PCB) via a finned heat sink. The PCB is fitted into a casing, which is open at the top and bottom. Initially only the heat transfer via convection and conduction will be modelled. The effect of thermal radiation will then be included at a later stage.

Introduction
2012 ANSYS, Inc.

Setup
December 17, 2012

Solving
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Loading Mesh (Workbench)

Open a new Workbench project and save it as HeatSink.wbpj Look in the Component Systems section of the toolbox and drag a CFX system on to the Project Schematic Double-click Setup to start CFX-Pre In CFX-Pre, right-click Mesh and select Import Mesh > ANSYS Meshing Select HeatSink.cmdb (workshop_input_files\WS_08_Electronics Cooling) and click Open

Introduction
2012 ANSYS, Inc.

Setup
December 17, 2012

Solving
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Options
In the tree expand Case Options, double-click General and ensure that Automatic Default Domains is switched on and Automatic Default Interfaces is active Set the Interface Method to One Per Domain Pair Click OK

Separate interfaces are required for each domain so that when radiation is added, emissivity can be set differently at each domain interface

Introduction
2012 ANSYS, Inc.

Setup
December 17, 2012

Solving
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Fluid Domains
First add a domain for the fluid region. The effects of buoyancy must be included as the flow is driven by natural convection. The buoyancy reference density represents the density at the ambient conditions.
Right-click on Flow Analysis 1 and insert a new domain named Fluid Set the Location to Fluid Set the Material to Air Ideal Gas Switch the buoyancy option to Buoyant and set the directional components to (0, -g, 0) Click on the expression button to enter g Set the Buoyancy Reference Density to 1.1093 [kg m^-3] Click the Fluid Models tab Set the heat transfer option to Thermal Energy and turbulence option to None (Laminar) Click OK
Introduction
2012 ANSYS, Inc.

Setup
December 17, 2012

Solving
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Creating Materials
CFX contains a library of many materials, but for this case we will create user materials for the component and Printed Circuit Board (PCB).

In the tree right-click on Materials and select

Insert > Material. Name it ComponentMat Define the material as a Pure Substance in the Material Group called CHT Solids Enable Thermodynamic State and select Solid It can then be used in a solid domain Click the Material Properties tab and set Density to 1120 [kg m^-3] Select Specific Heat Capacity and set it to 1400 [J kg^-1 K^-1] Expand Transport Properties and set Thermal Conductivity to 10 [W m^-1 K^-1] Click OK
Introduction
2012 ANSYS, Inc.

Setup
December 17, 2012

Solving
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Creating Materials
Repeat the material creation steps on the previous page to make a new solid material, named PCBMat
Density = 1250 [kg m^-3] Specific Heat Capacity = 1300 [J kg^-1 K^-1] Thermal Conductivity = 0.35 [W m^-1 K^-1]

Introduction
2012 ANSYS, Inc.

Setup
December 17, 2012

Solving
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Solid Domains
Insert a new domain called HeatSink Set the Location to HeatSink Set the Domain Type to Solid Domain with the Material set to Aluminium Click OK to create the domain
Note that an interface between the two domains is automatically created Repeat the above steps to create a solid domain called Component located at IC using the Material ComponentMat Create a further solid domain called PCB located at PCB using the Material PCBMat

You may see some red physics warnings indicating an update to conditions is required. These messages will go away when the Wall boundaries are created later on and can be ignored for now. When all 4 domains are created the Default Domain will automatically be removed from the tree. Separate interfaces between each domain will have been automatically created, rather than combined into a single interface
Introduction
2012 ANSYS, Inc.

Setup
December 17, 2012

Solving
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Energy Source
The component is generating 75 W of heat, which must be added to the simulation. To add this energy source in CFX, a subdomain must be created

Insert > Subdomain > in the domain, Component

Set Name to Chip

Set Location to IC, so that the subdomain occupies the whole of the domain called Component

Go to the Sources tab and check the Sources box

Click the Energy box Set the Option to Total Source and enter a Total Source of 75 [kg m^2 s^-3] Click OK
Introduction
2012 ANSYS, Inc.

Setup
December 17, 2012

Solving
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Boundary Conditions
For this case all of the heat will be extracted by the air passing over the heat exchanger. So all solid walls will be defined using adiabatic settings. Within the simulation heat can be transferred between all of the solid and fluid domains because interfaces have been automatically created. To allow air to enter or leave the simulation domain the top and bottom face of the fluid domain are defined as openings.

Right-click on the domain called Fluid and insert a new boundary called Walls and set the Boundary Type to Wall Set the Location to Wall

Switch to the Boundary Details tab and check that Heat Transfer is set to Adiabatic
Click OK In the PCB domain rename PCB Default to PCBwalls and check that Heat Transfer is set to Adiabatic

Introduction
2012 ANSYS, Inc.

Setup
December 17, 2012

Solving
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Release 14.5

Boundary Conditions
In the Fluid domain rename Fluid Default to Openings and check that the Location is set to be the two ends of the fluid Edit the Openings boundary condition

In the Basic Settings tab change the Boundary Type to Opening

In the Boundary Details tab set the Mass and Momentum option to Opening Pres. and Dirn with a relative pressure of 0 [Pa] Set Heat Transfer to Opening Temperature, entering a temperature of 45 [C] Click OK
The Opening Pressure and Opening Temperature options set Total values when flow is entering the domain and Static values when flow is leaving. The use of Total values for inflow in effect represents the case in which the flow outside the domain is accelerated from rest before entry.

Introduction
2012 ANSYS, Inc.

Setup
December 17, 2012

Solving
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Solver Control
From the tree right-click Solver Control and select Edit Increase the Max. Iterations to 500

Change the Fluid Timescale Control set to Physical Timescale

Leave Solid Timescale set to Auto Timescale
Note that solid regions will use a much larger timescale than fluid regions because only the energy equation is being calculated within the solid

Click OK

Introduction
2012 ANSYS, Inc.

Setup
December 17, 2012

Solving
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Radiation Setup
The next step is to redefine the model to include radiation effects. This will be set up as a second analysis that can be run after the convection-only case using results from the initial simulation as starting conditions. This reduces the overall computational time, as the convection only case will be much closer to the end solution. Most of the settings will be the same as in the original analysis. So the first step will be to make a duplicate analysis.

Right-click on Flow Analysis 1 and rename it Convection

Right-click on Convection and select Duplicate Rename Copy of Convection, created by the above step, Radiation
This will form the basis of the radiation case

Introduction
2012 ANSYS, Inc.

Setup
December 17, 2012

Solving
13

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Summary
Release 14.5

Adding Radiation to the Air Domains

The effects of radiation need to be included in the new analysis. In this case the surface-to-surface model will be used. So radiation is only passed from wall to wall and the fluid does not participate in any way. This saves computational time and is appropriate since air will not absorb or emit significant thermal radiation on these length scales.

In the Radiation analysis, edit the Fluid domain Switch to the Fluid Models tab Under Thermal Radiation set the Option to Discrete Transfer Set Transfer Mode to Surface to Surface Click OK

Introduction
2012 ANSYS, Inc.

Setup
December 17, 2012

Solving
14

Postprocessing

Summary
Release 14.5

Updating the Boundary Conditions

Adding radiation will produce an error because additional information is now required at the Openings boundary.

Edit the boundary Openings. Make sure that it is the copy from the Radiation flow analysis that is edited Click the Boundary Details tab. See that Thermal Radiation has been added and is set to Local Temperature

Click OK to accept this addition to the boundary condition

As the default value was all that was required in this case an alternative method of correcting this error would have been to right-click on the error message and select Auto Fix Physics.
Introduction
2012 ANSYS, Inc.

Setup
December 17, 2012

Solving
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Summary
Release 14.5

Radiation Emissivity
Different materials will have different radiation emissivity values. These can be set at each of the boundaries around the Fluid domain within the Radiation analysis. The emissivity of a surface is a function of the material, surface finish and any coatings that may have been applied as well as local temperature and the radiation wavelength.

In the Fluid domain find the interface boundary that connects the HeatSink to the fluid
Hint: boundaries are highlighted in the viewer when selected

Open up that boundary and

in the Boundary Details tab change Emissivity to 0.3 Click OK

Introduction
2012 ANSYS, Inc.

Setup
December 17, 2012

Solving
16

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Summary
Release 14.5

Radiation Emissivity
Note that each interface object is shown at the flow analysis level. There are two interface boundaries (at the domain level) associated with each interface object. Here we are editing the emissivity values for the interface boundaries in the fluid domain. The interface boundaries in the solid domains do not have an emissivity because there is no radiation in the solid domain (they are opaque!).

Find the interface boundary in the Fluid domain connecting the Component and Fluid domains and set Emissivity to 0.9 Find the interface in the Fluid domain connecting it to the PCB and set Emissivity to 0.9
Introduction
2012 ANSYS, Inc.

Setup
December 17, 2012

Solving
17

Postprocessing

Summary
Release 14.5

Defining Configurations
CFX-Pre now contains two separate set-ups for this project. It is necessary to indicate the order in which they run and how they are linked. This is achieved by setting up configurations. (Note that you could run each case separately, manually starting the radiation case from the convection solution.)

In the main tree expand Simulation Control then right-click on Configurations and select Insert > Configuration, accepting the default name In the General Settings tab set the Flow Analysis to Convection and Activation Condition 1 to Start of Simulation

Click OK
Introduction
2012 ANSYS, Inc.

Setup
December 17, 2012

Solving
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Summary
Release 14.5

Defining Configurations
Insert a second configuration, this time setting the Flow Analysis to Radiation. Set the Activation Condition to End of Configuration, and set Configuration Names to Configuration 1 Switch to the Run Definition tab, select Configuration Execution Control and then Initial Values Specification.

Set the option to Configuration Results, using Configuration 1

Click OK
The convection case will run first. When it finishes the results file created will be used to initialise the radiation simulation.
Introduction
2012 ANSYS, Inc.

Setup
December 17, 2012

Solving
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Summary
Release 14.5

Solving the Simulation

Select File > Close CFX-Pre Save the Project

In the Project Schematic, right-click on Solution and select Update

While the solver is running right-click on Solution again and select Display Monitors to check on progress

Introduction
2012 ANSYS, Inc.

Setup
December 17, 2012

Solving
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Postprocessing

Summary
Release 14.5

Solving the Simulation

This case uses a multi-configuration set-up. So the first screen will show the global progress by showing which configuration is being run.

Change the Workspace from the current run to Configuration1_001

The standard out file and residuals are displayed

This run will take 45-60 minutes to run so after a few iterations stop the run and the results provided will be used

Close the CFX-Solver Manager

Introduction
2012 ANSYS, Inc.

Setup
December 17, 2012

Solving
21

Postprocessing

Summary
Release 14.5

Opening CFD-Post
The results field in the existing CFX module is associated with the partially calculated results from your set-up. To analyse the existing results you will add a new results field to the project.

From the Component Systems section of the Toolbox drag a Results system onto the Project Schematic

Right-click on the Results cell (B2) and select Edit

When CFD-Post opens, select File > Load Results and select CFX_001.mres.
Set the option Load complete history as to Separate cases

Click Open
Introduction
2012 ANSYS, Inc.

Setup
December 17, 2012

Solving
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Summary
Release 14.5

Case Comparison
The case comparison tool allows two different set-ups to be shown side by side and any differences between the two cases identified.

In the tree edit Case Comparison Switch on Case Comparison Active and check that Case 1 is set to Configuration 1 and Case 2 is set to Configuration 2
In the viewer a new view is created to display the difference between the convection only case and the case including radiation

Click Apply

Introduction
2012 ANSYS, Inc.

Setup
December 17, 2012

Solving
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Summary
Release 14.5

Temperature
Temperature will be a key variable for any electronics cooling application so it will be displayed in several locations, such as within the flow, on the surfaces of the solid region and by extracting the maximum temperature within the component. When these plots are created they appear in the User Locations and Plots section of the tree.

Create a YZ plane (Location > Plane). Name it Centre, set X to 0 [m] and colour it according to Temperature
Create a contour plot (Insert > Contour) . Use the fluid-solid interfaces as the location (use the icon and Ctrl key to select multiple locations from both configurations). Set the Variable to Temperature and Range to Global

Introduction
2012 ANSYS, Inc.

Setup
December 17, 2012

Solving
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Summary
Release 14.5

Temperature
Move to the function calculator using the icon on the toolbar. Set the options to:
Function: maxVal Location: Component Case: All Cases Variable: Temperature

Click Calculate
Note that with radiation (Configuration 2) the temperature in the solid is significantly lower than when radiation was not included. The cooling of the component leads to an increase in the temperature of the walls around the fluid zone. This can be seen if you plot the temperature on the walls or use the Function Calculator with the areaAve function.
Introduction
2012 ANSYS, Inc.

Setup
December 17, 2012

Solving
25

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Summary
Release 14.5

Flow Displays
To show the flow patterns a range of methods can be used including streamlines, vector plots and isosurfaces.

Switch off the visibility of the existing plots

Insert an isosurface (Location > Isosurface) and set the Variable to Velocity with a value of 0.5 [m s^-1]
Gradually reduce the value to 0.2 [m s^-1]. Notice that the flow near the fluid walls and the PCB is faster for the radiation case

Introduction
2012 ANSYS, Inc.

Setup
December 17, 2012

Solving
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Release 14.5

Flow Displays
Insert a vector plot using Insert > Vector or click on Set the location to Centre Change the Sampling to Equally Spaced with 1000 points
To see the pattern in the slow speed sections, click on the Symbol tab and select Normalize Symbols

Insert streamlines using Insert > Streamlines or by clicking on Set Start From to Openings

Apply 100 equally spaced points and set the Direction to Forward and Backward

Introduction
2012 ANSYS, Inc.

Setup
December 17, 2012

Solving
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Summary
Release 14.5

Wrap-up
This workshop has shown the steps needed to set up a simulation that includes:
Heat conduction within several solids, each with different material properties Conjugate heat transfer to the fluid from the solid The effects of natural convection The effects of thermal radiation

Side-by-side comparison of results in CFD-Post In this case we were interested in the maximum temperature in the electronic component. We have seen that radiation has a strong influence on the results Knowing your aims from the start will help you make sensible decisions regarding how much of the part to simulate, the level of mesh refinement needed and which numerical schemes should be selected

Introduction
2012 ANSYS, Inc.

Setup
December 17, 2012

Solving
28

Postprocessing

Summary
Release 14.5