LG P920 Optimus 3D Service Manual

Internal Use Only
Service Manual
LG-P920
Date: June, 2011 / Issue 1.0
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Copyright 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Table Of Contents
1. INTRODUCTION ..................................................................... 3
1.1 Purpose ........................................................................................................ 3
1.2 Regulatory Information ......................................................................... 3
1.3 Abbreviations............................................................................................. 5
2. PERFORMANCE ...................................................................... 7
2.1 Product Name ............................................................................................ 7
2.2 Supporting Standard .............................................................................. 7
2.3 Main Parts : GSM Solution ..................................................................... 7
2.4 HW Features ............................................................................................... 8
2.5 SW Features ............................................................................................. 10
2.6 HW SPEC. ................................................................................................. 13
2.7 P920 Figures ............................................................................................ 23
3. TECHNICAL BRIEF ................................................................ 24
3.1 Radio Part General ................................................................................ 25
3.2 Radio Part Rx Section ........................................................................... 26
3.3 Radio Part Tx Section ........................................................................... 27
3.4 Radio Part Interfaces ............................................................................ 28
3.5 Digital Baseband (OMAP4430) ........................................................ 29
3.6 Hardware Architecture ........................................................................ 31
3.7 Subsystem (PMB9811_X-GOLDTM626) ....................................... 32
3.8 Power Block ............................................................................................. 45
3.9 External memory interface ................................................................ 52
3.10 Audio and sound ................................................................................ 53
3.11 Main (5M pixels) & Sub (VGA) Camera ....................................... 58
3.12 Display ..................................................................................................... 60
3.13 Vibrators.................................................................................................. 64
3.14 HDMI ........................................................................................................ 65
3.15 Compass Sensor .................................................................................. 66
3.16 Motion Sensor ...................................................................................... 67
3.17 Gyro Sensor ........................................................................................... 68
3.18 Illumination & Proximity Sensor ................................................... 69
3.19 Touch Module ...................................................................................... 70
3.20 Main Features ....................................................................................... 71
4. TROUBLE SHOOTING .......................................................... 72
4.1 RF Component ....................................................................................... 72
4.2 SIGNAL PATH ........................................................................................... 73
4.3 Checking TCXO Block ........................................................................... 76
4.4 Checking WCDMA Block .................................................................... 78
4.5 Checking GSM Block ............................................................................ 85
4.6 GPS/WIFI/BT RF components ........................................................... 92
4.7 GPS/WIFI/BT SIGNAL PATH ................................................................ 94
4.8 Power ON Troubleshooting ............................................................... 96
4.9 Charger Troubleshooting ................................................................. 101
4.10 USB Trouble shooting ..................................................................... 104
4.11 Audio trouble ..................................................................................... 107
4.12 Camera trouble(5M/VGA) .............................................................. 118
4.13 Main LCD trouble .............................................................................. 122
4.14 SIM detect Trouble shooting ........................................................ 127
4.15 Vibrator Troubleshooting .............................................................. 129
4.16 HDMI Troubleshooting ................................................................... 132
4.17 Motion Sensor on/o trouble ...................................................... 134
4.18 Gyro/Compass sensor troubleshooting .................................. 137
4.19 Proximity Sensor on/o trouble ................................................. 140
4.20 Illumination Sensor on/o trouble ............................................ 142
4.21 Touch trouble ..................................................................................... 144
5. BLOCK DIAGRAM .............................................................. 148
6. CIRCUIT DIAGRAM ............................................................ 152
7. BGA PIN MAP .................................................................... 169
8. PCB LAYOUT ....................................................................... 178
9. CALIBRATION ..................................................................... 191
9.1 Conguration of Tachyon ................................................................ 191
9.2 How to use Tachyon ........................................................................... 193
10. HIDDEN MENU ................................................................. 196
11. EXPLODED VIEW & REPLACEMENT PART LIST ............. 218
11.1 EXPLODED VIEW ................................................................................ 218
11.2 Replacement Parts ........................................................................... 219
11.3 Accessory .............................................................................................252
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1. INTRODUCTION
Cop,riqhl ?007 LG Eloolronios. no. All riqhl rosorvod.
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4/140
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your companys employees, agents, subcontractors, or person working on your
companys behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system. There are may be risks of toll fraud associated
with your telecommunications system. System users are responsible for programming and configuring the
equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune
from the above case but will prevent unauthorized use of common-carrier telecommunication service of
facilities accessed through or connected to it.
The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone service
until repair can be done. A telephone company may temporarily disconnect service as long as repair is not
done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the this phone or compatibility with the
network, the telephone company is required to give advanced written notice to the user, allowing the user
to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized
agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and
may void any remaining warranty.
1. INTRODUCTION
1. INTRODUCTION
1. INTRODUCTION
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1. INTRODUCTION
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E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information such
as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation
Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated
by the sign. Following information is ESD handling:
Service personnel should ground themselves by using a wrist strap when exchange system boards.
When repairs are made to a system board, they should spread the floor with anti-static mat
which is also grounded.
Use a suitable, grounded soldering iron.
Keep sensitive parts in these protective packages until these are used.
When returning system boards or parts like EEPROM to the factory, use the protective
package as described.
2. INTRODUCTION
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1. INTRODUCTION
6/140
1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
Offset Phase Locked Loop OPLL
Light Emitting Diode LED
Low Drop Output LDO
Liquid Crystal Display LCD
Intermediate Frequency IF
International Portable User Identity IPUI
Global System for Mobile Communications GSM
General Purpose Interface Bus GPIB
Gaussian Minimum Shift Keying GMSK
Flexible Printed Circuit Board FPCB
Electrostatic Discharge ESD
Electrical Erasable Programmable Read-Only Memory EEPROM
Digital Signal Processing DSP
dB relative to 1 milli watt dBm
Digital Communication System DCS
Digital to Analog Converter DAC
Constant Current Constant Voltage CC-CV
Bit Error Ratio BER
Baseband BB
Automatic Power Control APC
1. INTRODUCTION
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1. INTRODUCTION
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Wireless Application Protocol WAP
Voltage Control Temperature Compensated Crystal Oscillator VCTCXO
Voltage Controlled Oscillator VCO
Universal Asynchronous Receiver/Transmitter UART
Time Division Multiple Access TDMA
Time Division Duplex TDD
Travel Adapter TA
Side Tone Masking Rating STMR
Pseudo SRAM PSRAM
Static Random Access Memory SRAM
Sending Loudness Rating SLR
Subscriber Identity Module SIM
Surface Acoustic Wave SAW
Real Time Clock RTC
Root Mean Square RMS
Receiving Loudness Rating RLR
Radio Frequency RF
Public Switched Telephone Network PSTN
Phase Locked Loop PLL
Programmable Gain Amplifier PGA
Printed Circuit Board PCB
Power Amplifier Module PAM
1. INTRODUCTION
2. PERFORMANCE
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1
2.1 Product Name
P920 : WCDMA900/1700/1900/2100+EGSM/GSM850/DCS/PCS
(HSUPA 5.8Mbps(cat6)/HSDPA 14.4Mbps(cat10)/GPRS Class12/EDGE Class12)

2.2 Supporting Standard
Item Feature Comment
Supporting Standard WCDMA(FDD1,2,8)/EGSM/GSM850/DCS1800/PCS1900
with seamless handover
Phase 2+(include AMR)
SIM Toolkit : Class 1, 2, 3, C-E

Frequency Range WCDMA(FDD1) TX : 1920 1980 MHz
WCDMA(FDD1) RX : 2110 2170 MHz
WCDMA(FDD2) TX : 1850 1910 MHz
EGSM TX : 880 915 MHz
EGSM RX : 925 960 MHz
GSM850 TX: 824 849 MHz
GSM850 RX: 869 894 MHz
DCS1800 TX: 1710 1785 MHz
DCS1800 RX: 1805 1880 MHz
PCS1900 TX: 1850 1910 MHz
PCS1900 RX: 1930 1990 MHz

Application Standard

2.3 Main Parts : GSM Solution
Item Part Name Comment
AP Chip OMAP 4430 : TI
CP Chip XMM6260 : Infineon

2. PERFORMANCE
2. PERFORMANCE
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2
2.4 HW Features
Form Factor DOP type
1) Capacity
Standard : Li-Ion Polymer, 1500mAh

Battery
2) Packing Type : Soft Pack
Size Standard :128.8 x 68 x 11.9mm
Weight 162g With Battery
Volume TBD
PCB L1B1 type, 10 Layers , 0.8t
Stand by time 2G Up to 500 hrs
3G Up to 500 hrs
@ Paging Period 9 (2G)
@ DRX 7 (3G)
Charging time 3 hrs @ Power Off / 1500mAh
Talk time 2G Up to 1200mins
3G Up to 600 mins
@ Tx=Max(2G)
@ Tx = 12dBm (3G)
RX sensitivity WCDMA(FDD1) : -106.7 dBm
WCDMA(FDD2) : -106.7 dBm
WCDMA(FDD8) : -106.7 dBm
EGSM : -105 dBm
GSM850 : -105 dBm
DCS 1800 : -105 dBm
PCS 1900 : -105 dBm

WCDMA/
GSM/
GPRS
WCDMA : 24dBm/3.84MHz,+1/-3dBm
EGSM : 33dBm
GSM850 : 33 dBm
DCS 1800 : 30 dBm
PCS 1900 : 30 dBm
Class3(WCDMA)
Class4 (EGSM)
Class4 (GSM850)
Class1 (PCS)
Class1 (DCS)
TX
output
power
EDGE GSM 900 : 27 dBm
DCS 1800 : 26 dBm
PCS 1900 : 26 dBm
E2 (GSM900)
E2 (PCS)
E2 (DCS)
GPRS compatibility GPRS Class 12
EDGE compatibility EDGE Class 12
SIM card type Plug-In SIM
2.85V /1.8V

2. PERFORMANCE
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3
Display Main LCD (WVGA)
TFT Main LCD(4.3, 480X800)

Built-in Camera 3D Camera, VGA secondary 5M AF CMOS CAM 2EA
Status Indicator No
Keypad Function Key : 4
Side Key : 4
Function Key:
Home,Back, menu,serach
Side Key :
Volume up,down, power key,
3D key
ANT Main : LDS(Laser Direct Structure) type
Sub : DPA type(Directed Print Antenna)

System connector 5 Pin Micro USB 2.0 HS
Ear Phone Jack 3.5Phi, 4 Pole, Stereo
PC synchronization Yes
Memory(AP) eMMC : 8GB
LP-DDR2 : 512MB

Speech coding FR, EFR, HR, AMR
Data & Fax Built in Data & Fax support
Vibrator Built in Vibrator
BlueTooth V2.1 + EDR
MIDI(for Buzzer
Function)
72 Poly, MP3 Ringtone
Music Player MP3/ WMA/AAC/AAC+/WAV/AC3
Video Player MPEG4, H.263, H.264 @ Full HD 30fps/ Divx HD
Camcorder MPEG4, H.264, H.263 @ 3D : 720p 2D : 1080p
30pfs

Voice Recording Yes
Speaker Phone mode
Support
Yes
Travel Adapter Yes
CDROM No
Stereo Headset Yes
Data Cable Yes
T-Flash
(External Memory)
Yes Upto 32GB
2. PERFORMANCE
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4
2.5 SW Features

RSSI 0 ~ 4 Levels
Battery Charging 0 ~ 6 Levels
Key Volume 0 ~ 7 Level
Audio Volume 1 ~ 15 Level
Time / Date Display Yes
Multi-Language Yes CZECH , DUTCH , FRENCH , GERMAN ,
GREEK , ITALIAN , PORTUGUESE ,
SPANISH , ARABIC , HEBREW , T CHINESE
TW , S CHINESE , ROMANIAN ,
HUNGARIAN , SLOVAK , CROATIAN ,
BULGARIAN , MACEDONIAN , ICELANDIC
Quick Access Mode Phone / Contacts / Messaging / Menu
PC Sync Yes
Speed Dial Yes Voice mail center -> 1 key
Profile Yes not same with feature phone setting
CLIP / CLIR Yes
Phone Book Name / Number / Email / Chat Id /
Website / Postal addresses /
Organizations / Groups / BirthdayNotes /
Ringtone
There is no limitation on the number of
items.
It depends on available memory
amount.
Last Dial Number Yes There is no limitation on the number of
items.
amount.
Last Received
Number
Yes There is no limitation on the number of
items.
amount.
Last Missed Number Yes There is no limitation on the number of
items.
amount.
Search by Number
/ Name
Name / N
Group Yes There is no limitation on the number of
items.
amount.
2. PERFORMANCE
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5
Fixed Dial Number Yes
Service Dial Number No
Own Number Yes Read only
(add/edit/delete are not supported)
Voice Memo Yes Support voice recorder
Call Reminder Yes Missed call popup
Network Selection Automatic
Mute Yes
Call Divert Yes
Call Barring Yes
Call Charge (AoC) Yes
Call Duration Yes
SMS (EMS) There is no limitation on the number of
items.
amount.
EMS does not support.
SMS Over GPRS No
EMS Melody / Picture
Send / Receive / Save
No
No

MMS MPEG4
Send / Receive / Save
Yes
Yes

Long Message MAX 1000 characters SMS 10 concatenated
Cell Broadcast Yes
Download Over the Web
Game Yes
Calendar Yes
Memo Yes There is no limitation on the number of
items.
amount.
World Clock Yes
Unit Convert No
Stop Watch Yes
Wall Paper Yes
WAP Browser No WAP stack and wml are not supported.
Download Melody /
Wallpaper
Yes Over web browser
SIM Lock Yes Operator Dependent
SIM Toolkit Class 1, 2, 3, C, D
MMS Yes
EONS Yes
2. PERFORMANCE
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6
CPHS Yes V4.2
ENS Yes
Camera Yes 5M AF /
Digital Zoom : x8
JAVA No Android do not support JAVA
Voice Dial No
IrDa No
Bluetooth Yes Ver. 2.1+EDR
(GAP, A2DP, AVRCP, DUN, FTP, GAVDP,
GOEP, HFP, HSP, OPP, SDAP, SPP)
FM radio Yes
GPRS Yes Class 12
EDGE Yes Class 12
Hold / Retrieve Yes
Conference Call Yes Max. 6
DTMF Yes
Memo pad Yes Rich Note
TTY No
AMR Yes
SyncML Yes
IM Yes Gtalk
Email Yes
2. PERFORMANCE
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7
2.6 HW SPEC.
1) GSM transceiver specification
Item Specification
Phase Error
Rms : 5
Peak : 20
Frequency Error
GSM : 0.1 ppm
DCS/PCS : 0.1 ppm
EMC(Radiated Spurious Emission
Disturbance)
GSM/DCS : < -28dBm
Transmitter Output power and Burst
Timing
GSM : 5dBm 33dBm 3dB
DCS/PCS : 0dBm 30dBm 3dB
Burst Timing <3.69us
Spectrum due to modulation out to less
than 1800kHz offset
200kHz : -36dBm
600kHz : -51dBm/-56dBm
Spectrum due to modulation out to larger
than 1800kHz offset to the edge of the
transmit band
GSM :
1800-3000kHz :< -63dBc(-46dBm)
3000kHz-6000kHz : <-65dBc(-46dBm)
6000kHz < : < -71dBc(-46dBm)
DCS :
1800-3000kHz :< -65dBc(-51dBm)
6000kHz < : < -73dBc(-51dBm)
Spectrum due to switching transient
400kHz : -19dBm/-22dBm(5/0), -23dBm
600kHz : -21dBm/-24dBm(5/0), -26dBm
Reference Sensitivity TCH/FS Class II(RBER) : -105dBm(2.439%)
Usable receiver input level range 0.012(-15 - -40dBm)
Intermodulation rejection Speech
channels
800kHz, 1600kHz
: -98dBm/-96dBm (2.439%)
AM Suppression
GSM : -31dBm
- DCS : -29dBm
-98dBm/-96dBm (2.439%)
Timing Advance 0.5T

2. PERFORMANCE
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8
2) WCDMA transmitter specification
Item Specification
Transmit Frequency BD1: 1920MHz ~ 1980 MHz
BD2: 1850~1910 MHz
BD8: 880 MHz ~ 915 MHz
Maximum Output Power +24 dBm / 3.84 MHz, +1 / -3 dB
Frequency Error within 0.1 PPM
Open Loop Power Control Normal Conditions : within 9 dB,
Extreme Conditions : within 12 dB
Minimum Transmit Power < -50 dBm /3.84 MHz
Occupied Bandwidth < 5 MHz at 3.84 Mcps (99% of power)
Adjacent Channel Leakage
Power Ratio (ACLR)
> 33 dB @ 5 MHz,
> 43 dB @ 10 MHz
Spurious Emissions
|f-fc| > 12.5 MHz
< -36 dBm / 1 kHz RW @ 9 kHz f < 150 kHz
< -36 dBm / 10 kHz RW @ 150 KHz f < 30 MHz
< -36 dBm / 100 kHz RW @ 30 MHz f < 1 GHz
< -30 dBm / 1 MHz RW @ 1 GHz f < 12.75 GHz
< -60 dBm / 3.84 MHz RW @ 869 MHz f 894 MHz
< -67 dBm / 100 kHz RW @ 925 MHz f 935 MHz
< -79 dBm / 100 kHz RW @ 935 MHz < f 960 GHz
< -71 dBm / 100 kHz RW @ 1805 MHz f 1880 MHz
< -41 dBm / 300 kHz RW @ 1884.5 MHz < f < 1919.6 MHz
Transmit Intermodulation < -31 dBc @ 5 MHz & < -41 dBc @ 10 MHz
when Interference CW Signal Level = -40 dBc
Error Vector Magnitude < 17.5 %, when Pout -20 dBm
Peak Code Domain Error < -15 dB at Pout -20 dBm

2. PERFORMANCE
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9
3) WCDMA receiver specification
Item Specification
Receive Frequency BD1: 2110 MHz ~2170 MHz
BD2: 1850~1910 MHz
BD8: 925 MHz ~ 960 MHz
Reference Sensitivity Level Band1 : BER < 0.001 when or = -106.7 dBm / 3.84 MHz
Band2 : BER < 0.001 when or = -106.7 dBm / 3.84 MHz
Band8 : BER < 0.001 when or = -106.7 dBm / 3.84 MHz
Maximum Input Level BER < 0.001 when or = -25 dBm / 3.84 MHz
Adjacent Channel Selectivity
(ACS)
ACS > 33 dB where BER < 0.001 when
or = -92.7 dBm / 3.84 MHz
& Ioac = 52 dBm / 3.84 MHz @ 5 MHz
Blocking Characteristic BER < 0.001 when or = -103.7 dBm / 3.84 MHz
& Iblocking = -56 dBm / 3.84 MHz @ Fuw(offset) = 10 MHz
or Iblocking = -44 dBm / 3.84 MHz @ Fuw(offset) = 15 MHz
Spurious Response BER < 0.001 when or = -103.7 dBm / 3.84 MHz
& Iblocking = -44 dBm
Intermodulation BER < 0.001 when or= -103.7 dBm / 3.84 MHz
& Iouw1 = -46 dBm @ Fuw1(offset) = 10 MHz
& Iouw2 = -46 dBm / 3.84 MHz @ Fuw2(offset) = 20 MHz
Spurious Emissions < -57 dBm / 100 kHz BW @ 9 kHz f < 1 GHz
< -47 dBm / 1 MHz BW @ 1 GHz f 12.75 GHz

Inner Loop Power Control
In Uplink
Adjust output(TPC command)
cmd 1dB 2dB 3dB
+1 +0.5/1.5 +1/3 +1.5/4
0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5
-1 -0.5/-1.5 -1/-3 -1.5/-4
group(10equal command group)
+1 +8/+12 +16/+24

2. PERFORMANCE
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10
4) HSDPA transmitter specification
Item Specification
Transmit Frequency BD1: 1920MHz ~ 1980 MHz
BD2: 1850~1910 MHz
BD8: 880 MHz ~ 915 MHz
Maximum Output
Power
Sub-Test
1=2/15, 25.7~20.3dBm / 3.84 MHz
2=12/15 25.7~20.3dBm / 3.84 MHz
3=15/8 25.7~19.8dBm / 3.84 MHz
4=15/4 25.7~19.8dBm / 3.84 MHz
Spectrum
Emission Mask
Sub-Test : 1=2/15, 2=12/15, 3=15/8, 4=15/4

Frequency offset from
carrier f
Minimum requirement
Measurement
Bandwidth
2.5 ~ 3.5 MHz -35-15(f-2.5)dBc 30 kHz
3.5 ~ 7.5 MHz -35-1(f-3.5)dBc 1 MHz
7.5 ~ 8.5 MHz -35-10(f-7.5)dBc 1 MHz
8.5 ~ 12.5 MHz -49dBc 1 MHz

Adjacent Channel
Leakage
Power Ratio (ACLR)
Sub-Test : 1=2/15, 2=12/15, 3=15/8, 4=15/4
> 33 dB @ 5 MHz
> 43 dB @ 10 MHz
Error Vector
Magnitude
< 17.5 %, when Pout -20 dBm

5) HSDPA receiver specification
Item Specification
Receive Frequency

BD1: 2110 MHz ~2170 MHz
BD2: 1850~1910 MHz
BD8: 925 MHz ~ 960 MHz
Maximum Input Level
(BLER or R), 16QAM Only
Sub-Test : 1=2/15, 2=12/15, 3=15/8, 4=15/4
BLER < 10% or R >= 700kbps

2. PERFORMANCE
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11
6) HSUPA Tx, Rx specification
Item Specification
Maximum Output
Power
Sub-Test
1=11/15 25.7~17.3dBm / 3.84 MHz
2=6/15 25.7~16.8dBm / 3.84 MHz
3=15/9 25.7~17.8dBm / 3.84 MHz
4=2/15 25.7~16.8dBm / 3.84 MHz
5=15/15 25.7~20.3dBm / 3.84 MHz
Spectrum Emission
Mask
Sub-Test : 1=11/15, 2=6/15, 3=15/9, 4=2/15, 5=15/15

Frequency offset from
carrier f
Minimum requirement
Measurement
Bandwidth
2.5 ~ 3.5 MHz -35-15(f-2.5)dBc 30 kHz
3.5 ~ 7.5 MHz -35-1(f-3.5)dBc 1 MHz
7.5 ~ 8.5 MHz -35-10(f-7.5)dBc 1 MHz
8.5 ~ 12.5 MHz -49dBc 1 MHz

Adjacent Channel
Leakage
Power Ratio (ACLR)
Sub-Test : 1=11/15, 2=6/15, 3=15/9, 4=2/15, 5=15/15
> 33 dB @ 5 MHz
> 43 dB @ 10 MHz

2. PERFORMANCE
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7) WLAN 802.11b transceiver specification
Item Specification
Transmit Frequency 2400 MHz ~ 2483.5 MHz ( CH1~CH13 )
Tx Power Level 20dBm under (Europe), 30dBm under (USA)
Frequency Tolerance within 25 PPM
Chip clock Frequency
Tolerance
within 25 PPM
Spectrum Mask -30 @ fc-22MHz< f <fc-11MHz and fc+11MHz< f <fc+22MHz
-50 @ f < fc-22MHz and f > fc+22MHz
Power ramp on/off time 2us
Carrier Suppression -15dB
Modulation Accuracy
(Peak EVM)
35%
Spurious Emissions < -36 dBm @ 30MHz ~ 1GHz
< -30 dBm above @ 1GHz ~ 12.75GHz
< -47 dBm @ 1.8GHz ~ 1.9GHz
< -47 dBm @ 5.15GHz ~ 5.3GHz
Rx Min input Sensitivity -76dBm(1Mbps,2Mbps,5.5Mbps,11Mbps) @ FER 8%
Rx Max input Sensitivity -10dBm(1Mbps,2Mbps,5.5Mbps,11Mbps) @ FER 8%
Rx Adjacent Channel
Rejection
35dB @FER 8%,
interference input signal -70dBm@fc25MHz(11Mbps)

2. PERFORMANCE
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13
8) WLAN 802.11g transceiver specification
Item Specification
Tolerance
within 25 PPM
Spectrum Mask -20 @ 11MHz offset (9Mhz ~ 11MHz)
-28 @ 20MHz offset (11MHz ~ 20Mhz)
Transmitter constellation error
(rms EVM)
-5dB@6Mbps, -8dB@9Mbps, -10dB@12Mbps,
-22dB@48Mbps, -25dB@54Mbps
< -47 dBm @ 1.8GHz ~ 1.9GHz
< -47 dBm @ 5.15GHz ~ 5.3GHz
Rx Min input Sensitivity PER 10%
-82dBm@6Mbps, -81dBm@9Mbps, -79dBm@12Mbps
-66dBm@48Mbps, -65dBm@54Mbps
Rx Max input Sensitivity -20dBm(6,9,12,18,24,36,48,54Mbps) @ PER 10%
Rx Adjacent Channel
Rejection
PER 10%,
ACR 16dB@6Mbps, ACR 15dB@9Mbps,
ACR 13dB@12Mbps, ACR 11dB@18Mbps,
ACR 8dB@24Mbps, ACR 4dB@36Mbps
ACR 0dB@48Mbps, ACR -1dB@54Mbps

ACR shall be measured by setting the desired signal's strength 3 dB
above the rate-dependent
sensitivity specified in min input sensitivity

2. PERFORMANCE
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14
9) WLAN 802.11n transceiver specification
Item Specification
Tolerance
within 25 PPM
Spectrum Mask -20 @ 11MHz offset (9Mhz ~ 11MHz)
Transmitter constellation error
(rms EVM)
-5dB@6.5Mbps, -10dB@13Mbps, -13dB@19.5Mbps,
-25dB@58.5Mbps, -28dB@65Mbps
< -47 dBm @ 1.8GHz ~ 1.9GHz
< -47 dBm @ 5.15GHz ~ 5.3GHz
Rx Min input Sensitivity PER 10%
-82dBm@6.5Mbps, -79dBm@13Mbps, -77dBm@19.5Mbps
-65dBm@58.5Mbps, -64dBm@65Mbps
Rx Max input Sensitivity -20dBm(6.5,13,19.5,26,39,52,58.5,65Mbps) @ PER 10%
Rx Adjacent Channel
Rejection
PER 10%,
ACR 16dB@6.5Mbps, ACR 13dB@13Mbps,
ACR 11dB@19.5Mbps, ACR 8dB@26Mbps,
ACR 4dB@39Mbps, ACR 0dB@52Mbps
ACR -1dB@58.5Mbps, ACR -2dB@65Mbps

ACR shall be measured by setting the desired signal's strength 3 dB above
the rate-dependent
sensitivity specified in min input sensitivity

2. PERFORMANCE
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10) GPS receiver specification
Item Specification
Receive Frequency 1574.42 MHz ~ 1576.42 MHz
Minimum Sensitivity 1 satellite -142dBm, 7 satellites -147dBm at coarse time aiding

11) Current consumption
Stand by
Bluetooth Off Bluetooth Connected

Voice Call

VT
WCDMA
Only
4.0 mA under
(DRX=1.28)
7 mA under
(DRX=1.28)
350 mA under
(Tx=12dBm)
NA
GSM
Only
4.0 mA under
(Paging=5 period)
7 mA under
(Paging=5 period)
350 mA under
(Tx=Max)

12) FM Radio Current consumption
Current Consumption Reason
FM Radio Play 2G 45mA
FM Radio Play 3G 45mA
Mixing FM radio sound and Android sound
requires enabling ABE, so FM Radio current is
higher than other models using external audio
codec only.

13) Battery life time
Stand by Voice Call VT
WCDMA
350 hours over
(DRX = 1.28)
250 min over
(TX = 12dBm,
Low Pwr mode)
NA
GSM
350 hours over
(Paging Period = 9)
250 min over
(TX Level = Max)

2. PERFORMANCE
- 22 -
16
14) Charging hour
3.5hour under ( 1500mAh battery, 1A TA)

15) RSSI indicator (Based on Cell power)
BAR WCDMA GSM/DCS/PCS
4 Over -882dBm Over -91 2dBm
43 -88 2dBm -91 2dBm
32 -96 2dBm -99 2dBm
21 -104 2dBm -103 2dBm
10 -110 2dBm -105 2dBm

2. PERFORMANCE
- 23 -
17
16) Battery indicator
Battery Bar Specification

BAR 6 (Full) 90% over
BAR 6 --> 5 90% 89%
BAR 5 --> 4 70% 69%
BAR 4 --> 3 50% 49%
BAR 3 --> 2 30% 29%
BAR 2 --> 1 15% 14%
BAR 1 --> 0 5% 4%
Low Battery Pop-up 4% ~ 15% : One Time popup (No call)
Critical Low Battery Pop-up 0% ~ 3% : Every Level change popup (No call)
POWER OFF 0%
remain%

2.7 P920 Figures

3. TECHNICAL BRIEF
- 24 -
The LG-P920 supports UMTS-900, UMTS-1900, UMTS-2100, GSM-850, GSM-900, GSM-1800, and GSM-1900 based
GSM/GPRS/EDGE/UMTS. All receivers and the UMTS transmitter use the radio One Zero-IF architecture to
eliminate intermediate frequencies, directly converting signals between RF and baseband. The quad-band GSM
transmitters use a baseband-to-IF up-conversion followed by an offset phase-locked loop that translates the
GMSK-modulated or 8-PSK-modulated signal to RF.

[Figure 3-1] Total Block diagram of RF part

3. TECHNICAL BRIEF
PMU
RD_H
RD HX
VCTCXO
26MHz
AFC DAC XO VCONT
PMU
RF6590
1V2 1V8 2V852V65
Filter
B946
9
GPS IN
Diplexer
RD_HX AFC_DAC XO VCONT
PAM DCDC
RF6560
VOUT FB
9
PM L
GSM_LB_TX
GSM_HB_TX
B8 TX
Ant B8
CP_OUT
VOUT_FB
B7953
TRX4
VCC
MMMB
RF6260
Transceiver
PMB5712
PM_L
PM_H
B8_TX
B5_TX
B2_TX
B1_TX
B4 TX
Ant_B8
Ant_B5
Ant_B2
Ant_B1
Ant B4
B7953
B8 DPX
B7671
B5 DPX
B7955
B2 DPX
B7696
B1 DPX
TRX2
TRX3
TRX4
TRX5
XMM6260
ST8T
BGSF18D
RX_L1X
RX_L1
RX_L2X
RX_L2
SYS_CLK
B4_TX
Ant_B4
Ant_B3
B7959
B4 DPX
DCS
SAW filter
SYS_CLK_EN
REF_CLK_EN
TRX1
TRX6
SYS_CLK
SYSCLKEN
REF_CLK_EN
BGSF18D
_
RX_M2X
RX_M2
RX_H2X
RX_H2
RX_H1X
RX_H1
RX M1X
DI3_TX_DAT
DI3_TX_DATX
DI3_RX_DAT
DI3_RX_DATX
Di3_TX_DAT
Di3_TX_DATX
Di3_RX_DAT
Di3_RX_DATX
_M
RX_M1
3. TECHNICAL BRIEF
- 25 -
3.1 Radio Part General
SMARTi UE2 is a highly integrated UMTS/GSM-transceiver, with all necessary features to enable multi mode,
multi band mobile cellular devices. It incorporates a fully integrated dual mode receiver with main and diversity
chains, 2 multi band TX outputs, control, Digitally controlled crystal support, a measurement interface,
DigRFV3.09 compliant high speed data and control interface, a multi mode timer unit and all necessary front end
signals for the complete RF Engine control. Overall the IC directly supports RF engines with up to 4 GSM bands
and typical 4 UMTS (can be less or more depending on engine setup) bands without additional discrete RF path
switches.

[Figure 3-2] SMARTi UE2 main feature

-. 3GPP release 7 (HSPA+)
-. Up to 5 UMTS-FDD / 4 EDGE Bands
* Band I ~ VI, VIII ~ X * EGPRS MSC 33 / 34
* 28Mbps DL / 11.5Mbps UL (HSPA+ 64 / 16QAM)
* 14.4Mbps HSDPA / 5.76Mbps HSUPA (cat 10 / 6)
-. Standard DigRF V3.09 interface to Digital BB
-. Multi-Mode / Multi-Band Single-Chain Tx Concept
Power
Control
Diversity
Receiver
PMU
W1
GW2
GW5
GW6
Xtal
DigRF 3G
V3_09
Data
&
Control
Main
Receiver
W1
GW2
G1300
GW5
GW6
Digital
Modulator
Lo band
Hi band
FE CTRL
(GPO/SPI)
Ctrl
Det
Ctrl DC/DC
3. TECHNICAL BRIEF
- 26 -
3.2 Radio Part Rx Section
For the RX section the IC features 6 RX inputs, 4 of those might be used for multi mode receive, this means they
can be used for GSM and UMTS (the IC can be reconfigured to achieve in spec performance) operation. The
highband input are for UMTS operation only. The multi mode inputs include first LNA (for GSM and UMTS)
without and additional external LNA and inter-stage filter. The receiver structure is optimized for compressed
mode operation, thus only a single base band chain is used, saving area and optimizes power consumption. The
receiver AGC can be aligned to the UMTS frame structure.
Additionally to the normal receiver the IC contains a diversity receiver part, enabling up to 4 band Rx diversity for
GSM and UMTS mode without external LNAs and inter-stage filters.

[Figure 3-3] 2G / 3G Rx Block Diagram
RD_L1
RD_L1X
RD_L2
RD_L2X
RD_M
RD_MX
RD_H
RD_HX
RX_L1
RX_L1X
RX_L2
RX_L2X
RX_M1
RX_M1X
RX_M2
RX_M2X
RX_H1
RX_H1X
RX_H2
RX_H2X
0/90
LPF
LPF
ADC
ADC
MUX MUX
S&H
S&H
HPF
HPF
2G Mode
3G Mode
FIR
FIR
DigRF RX synthesizer
0/90
LPF
ADC
LPF
ADC
MUX MUX
S&H
S&H
HPF
HPF
2G Mode
3G Mode
FIR
FIR
3. TECHNICAL BRIEF
- 27 -
3.3 Radio Part Tx Section
The TX features 2 RF outputs, which are directly matched to 50 impedance for easy connection to external
power amplifiers, which reduces significantly external component count. Those 2 outputs are high power, small
signal polar modulated outputs for the GSM and UMTS system, with low sensitivity to PA harmonics. They are
capable to perform GMSK or 8-PSK as well as UMTS modulation signals with excellent noise performance, thus
no inter-stage filter in between transceiver and PA is required. The transmitter outputs are broadband, one
covers all low bands (Band V, VI, and VII), the higher band output covers all GSM and UMTS bands Band I, II, III, IV,
IX and X. The output driver is capable to support high output powers to enable low cost single chain PAs.
The IC features additionally closed loop power control for GSM and for UMTS, thus supporting TRP requirements
in cooperation with the power amplifier and the antenna design. There is one input ball for the power detector
voltage coming from the PA, and one input ball for the RF signal fed back to the TRX. The complete loop circuits
are implemented in the digital domain, which enables a high reliability of the loop performance for both
standards.

[Figure 3-4] Single Chain PAs Tx Architecture

DIG RF
3G
1C HIP
F
I
F
O
I
/
Q
-
C
h
a
i
n
12 bit
sign
0C HIP
12 bit
sign
I
/
Q

t
o

R
/
P
h
iAM-Path
PM-Path
TX-Disruptor
AM-Path
PM-Path
I
/
Q

t
o

R
/
P
h
i
I
/
Q
-
C
h
a
i
n
2
G
M
o
d
u
l
a
t
o
r
Feedback RX
Detector ADC
to signal
chain
F
e
e
d
b
a
c
k

S
i
f
n
a
l
P
r
o
c
e
s
s
i
n
g
3. TECHNICAL BRIEF
- 28 -
3.4 Radio Part Interfaces
The base band is connected via a DigRF V3.09 high speed data interface with a maximum clock frequency of 312
MHz. The pure digital interface enables the digital baseband to shrink efficiently, as all the analog functionality is
within the RFIC. All data and control traffic is multiplexed via the RX and TX interface lines. The IC features a high
level programming model enabling the complete compressed mode operation of the device in an RF engine
environment. It handles RX and TX power control, also incorporating the calibration data.
The complete timing is optimized for compressed mode operation of the transceiver, it controls the front end
components of the engine (PAs, switches, Antenna switches etc). Additionally a SPI control bus for front end
component control is available on the IC, which also enables the read back of data from external components,
thus the handling of functions like PA saturation, mismatch detection, overheating (incorporated in the closed
loop power control) can be adopted.

[Figure 3-5] DigRF Architecture

Table 3-1. DigRF I/F paths Data Rates

Digital
Baseband IC
DI3_RX_DAT
DI3_RX_DATX
SYS_CLK
SYS_CLK_EN
DI3_TX_DAT
DI3_TX_DATX
RLVDS
Driver
SysClk
Driver
PLL
312 MHz
RLVDS
Receiver
Phase
Correlator
Retimed
Data
Retimed
Data
S/P
Converter
Deframer
Control
Data
Control
Data
P/S
Converter
Framer
RF IC
3. TECHNICAL BRIEF
- 29 -
3.5 Digital Baseband (OMAP4430)
The OMAP4430 high-performance multimedia application device is based on enhanced OMAP
TM
architecture
and used 45-nm technology. The device is associated with power and audio integrated circuits(ICs) that is called
TWL6030 and TWL6040.
OMAP4430 Block Diagram (Typical Connections Shown)

TVout
OMAP4430
2 or 4x
LPDDR2
SDRAM
eMMC
(JC64)
SD/MMC
Main isplay d Sub isplay d Touch creen s
Secondary
camera
Primary
camera
TWL6030
DVFS Ctrl
NFC
I2C Ctrl
Finger rint p
/ Slide pad
Other flash
memory
(Nor, Nand,
OneNand, ...)
Micro USB
HDMI companion
(LS+ESD+StepUp)
NVM LPDDR 2
memory
S/PDIF
TWL6040
Audio
Headset
Micro
Handset
microphones x2
Ear
speaker
I2C Ctrl
Headset
I2C4
SDMMC 1
LPDDR21
LPDDR22
Keypad
1 2 3
4 5 6
7 8 9
* 0 #
Vibrator/
ctuator
x2
a
WL1283 BT/FM/GPS/WLAN
AC
harger c
BQ24156
USB
charger
Charger
interface
Power
Main
battery
Gas
gauge
Backup
battery
Buck-
oost b
Boost Speakers
Vbat
HF speakers
x2
Hands
a
-free
mplifier
Vibrators
3G
Mobile TV
HSI
M SPI C 4
M BSP2 C
SDMMC2 GPMC
SR I2C1 MCPDM DMIC M ASP C
USBA0-
OTG
KEYBOARD SDMMC5 SLIMBUS1
UART2
M BSP C 1 M BSP C 2 M SPI C 2
IrDA
I2C3
CCP2
CVIDEO
CSI2-A CSI2-B HDMI DSI2 DSI1 M SPI C 1
C2C
RFBI
M SPI C
intro-002
NFC
PicoDLP
DISPC2 DISPC2
I2C2
Touch creen s
I2C2
RFBI
M BSP C 2
M SPI C 3
UART3
USBB1-
ULPI/HSIC
I2C2
UART3
SDMMC4
Public Version
www.ti.com Environment
1.2 Environment
This section provides an overview of the OMAP environment. The device is associated with power and
audio integrated circuits (ICs). TI provides a global solution with the TWL6030/TWL6040 devices.
Figure 1-1 is an overview of a nonexhaustive environment for the high-tier OMAP4430 device.
Figure 1-1. OMAP4430 High-Tier Environment
257 SWPU231MJuly 2010Revised November 2010 Introduction
Copyright 2010, Texas Instruments Incorporated
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ctuator
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KEYBOARD
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SLIMBUS1
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3. TECHNICAL BRIEF
- 30 -
Cortex-A9 MPU Subsystem
Two ARM Coretex-A9 MPCore
IVA-HD Subsystem
The IVA-HD subsystem is a set of video encoder/decoder hardware accelerators. It supports up to 1080p x 30 fps,
slow-motion camcorder, triple play (HD and SD capture and JPEG capture), real-time transcoding of up to 720p,
and video conferencing up to 720p.
The IVA-HD supports:
MPEG-1/2/4, Divx 5.02, H.263 P0 (encode/decode) and P3 (decode), H.264 Annex G (scalable baseline profile up
to 720p), H.264 BL/MP/HP, H.264 Annex H(partial), Stereoscopic video, JPEG(encode/decode), VC-1 SP/MP/AP,
AVS-1.0, RealVideo 8/9/10 (decode only), On2 VP6.2/VP7 (decode only)
Display Subsystem
Display controller
: Three video pipelines, one graphic pipelines, and write-back pipeline.
Two LCD outputs, One TV output.
Remote frame buffer interface (RFBI) module
Two MIPI display serial interface (DSIs)
High-definition multimedia interface (HDMI) encoder
: HDMI 1.3, HDCP 1.2, and DVI 1.0 compliant
Deep-color mode support (10-bit for up to 1080p and up to 12-bit for 1080i/720p)
NTSC/PAL video encoder
ABE (Audio Back End) Subsystem
The ABE subsystem handles audio processing for the application. It manages the audio and voice streams
between the Cortex-A9 MPU subsystem and/or DSP, and the physical interfaces.
Imaging Subsystem (ISS)
The ISS processes data coming from the image, memory, and IVA-HD subsystem. The ISS is responsible for
multimedia applications such as : camera viewfinder, video record with up to 1080p at 30 fps with digital zoom
and still image processing, such as image capture up to 16 Mp with digital zoom and rotation. The ISS supports a
pixel throughput of up to 200Mp/s. It assures good performance with sensors up to 16 Mp and more (higher
resolution can be achieved through multiple passes).
2D/3D Graphics Accelerator
The 2D/3D graphics accelerator subsystem in based on POWERVR
SGX540 core from Imagination

Technologies. The SGX can process different data types simultaneously.

In addition to its processing elements, an extensive set of peripheral interfaces enables communication with all
necessary external devices.
3. TECHNICAL BRIEF
- 31 -
LCD 4.3
4.3 TFT 3D
EARO
EAR_PIECE(RCV)
FM_ANT
SDIO
5
McPDM
I2C2
DSI
I2C2
McBSP1(PCM)
UART2 TWL6040
BT/WLAN/FM
(WL1271)
LED
Backlight
Driver IC
Touch
4.3 TFT 3D
LCD
(480x800)
PDM
AUXLR
3.5 pi Ear MIC(Ear_Jack)
SPK
MIC1
MIC1
SPK
HS_MIC
HSOLR
FM_L/R
HiFi & PCM Voice
McBSP3(I2S)
MIC2
MIC2
FM
OMAP4430
SDMMC2
SDRC
I2C4
I2C1
TCXO Driver
38.4MHZ
Proximity
Light Sensor
Motor
2Gb-2ch
LPDDR2
eMMC (8Gb)
Compass
Driver IC
3.5 pi Ear_Jack
HSOLR
MCLK
POP
I2C4
FM_ANT
3D CAMERA
GPIO_2
5 DMTIMER8_PWM_EV
T
SDMMC2 I2C1
PMB5712
A-GPS
VT
0.3M
MIPI
5M AF
MIPI(P)
5M AF
MIPI(S)
eMMC (8Gb)
CSI1
CSI2
HDMI
LNA
FEM
UART3
Fuel gauge
3D CAMERA
T
GPIO
UART1
SDMMC1
McSPI4
GPIO_120
XMM6260
5M CAM Flash
HDMI
I2C2
USIF3
GPIO_35
I2S2
Keypad
KB_COL/ROW
MCSPI2(PCM)
1Gb
NAND
512Mb
DDR
NAND
DDR
MCP
DigRF
MIPI_HSI MIPI_HSI
IPC_SRDY
GPIO_119 GPIO_34
IPC_MRDY
I2C1
I2C3
USB UART4
JTAG
Key LED
Gyro
JTAG
JTAG
USB
JTAG USIF1
USIM1
Accelerometer
I2C
I2C4
GPIO_82
PMIC_AP
(TWL6030)
32.768KHz
Charge
r
I2C
32.768KHz
PWR-ON KEY
VCHG
VBAT
Coin cell
Battery
MUIC
3.6 Hardware Architecture
<System HW Block>
Figure. Block Diagram
3. TECHNICAL BRIEF
- 32 -
3.7 Subsystem (PMB9811_X-GOLD
TM
626)
The X-GOLD 626 is a 3GPP Release 7 dual-mode baseband modem which is expected to connect to an
application processor in order to create a high-end smartphone solution. It can be used to create a data-card
solution as well. This section provides a high-level view of the chip architecture. More details can be found in the
sections that follow.
The X-GOLD 626 can be broken into 6 major subsystems: Backbone, Connectivity, Audio, 2GL1, 3GL1, and PMU.
Each of these subsystems play important roles for operation of the modem.

Fig.3.7 Architecture Block Diagram of X-GOLD 626
X-GOLD626
PMB 9811
X-GOLD626 Architecture Concepts CONFIDENTIAL ci
Preliminary Product Overview 57 Revision 1.0, 2010-04-26
ARC__Overview.fm EDD 3.4
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Figure 6 Architecture Block Diagram of the X-GOLD626
4.1.2 Architectural Characteristics
The X-GOLD626 comes along with the following architecture units.
Backbone
Audio
DigRF 3.09
2GL1
2G DSP1
RF IF
3GL1
Rake
Rake
3G DSP
HSDPA
HSIRX
HSORX SYNC_TX
TxBitProc
TxMod
DPE
Searcher
OLP
MRAM
USI
CPU XBAR
LMU
ROM
LMU
RAM
COMRAM
Bridge Peripheral XBAR
Connectivity
3 (+2)
2
6
Audio
DSP1
I2S2
I2S1
6
6
BB_ArchitectureOverview.vsd
1
L2 Cache
256kB
8
Audio
DSP2
PMU
SD1
(VDDCore)
SD2
(VDDIO)
VPLL
VSIM
VPMU VRTC
VUSB VANA
Measurement
TSMU
POR
VMIPI
2G DSP2
RTC
EBU
ARM11
32kB I-Cache
32kB D-Cache
8kB I-TCM
8kB D-TCM
E
T
M
1
1
DMA1
8-ch
FCDP
USIM
Shared
Mem
ICU
STM
DMA2
2-ch
USIF2
USIF3
CEU
USB-FS
USB-HS
USB-HSIC
ABW
MIPI HSI
SD-MMC1
SPCU
CGU
SCU
I2C1
MIPI PTI
GPTU1
GPTU0
CAPCOM1
CAPCOM0
PCL/GPIO
USIF1
DAP
Shared Mem
GUCIPH
GSI
62
(+4)
5
2
(+5)
7
2
7 (+7)
2 (+10)
5
7
GSM
Timer
Channel
Decoder
Equalizer
Accelerator
IR
Memory
GSM
Cipher
SSC
Control Unit
31
DSP
Timer
DSP
Interrupt
DSP
Timer
DSP
Interrupt
MACPHY
DL-MACPHY
UL-MACPHY
ORX
R99ORX
MCU
ARM7
ETM7
ICU
USIF5
3GCU
C
o
p
y

f
o
r

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G
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C
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p
y

f
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C
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p
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C
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p
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f
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G
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DigRF 3.09
C
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p
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f
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C
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2GL1
C
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2G DSP1
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3G DSP
C
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p
y

f
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L
G
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C
o
p
y

f
o
r

L
G
E
SYNC_TX
TxBitProc
TxMod
DPE
Searcher
OLP
MRAM
C
o
p
y

f
o
r

L
G
E
C
o
p
y

f
o
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L
G
E
COMRAM
C
o
p
y

f
o
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L
G
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C
o
p
y

f
o
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L
G
E
Peripheral XBAR
C
o
p
y

f
o
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L
G
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C
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p
y

f
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C
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p
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C
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p
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f
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L
G
E
2G DSP2
C
o
p
y

f
o
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L
G
E
C
o
p
y

f
o
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L
G
E
Shared
Mem
C
o
p
y

f
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L
G
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C
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p
y

f
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G
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C
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p
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C
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p
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f
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L
G
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GUCIPH
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p
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G
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C
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p
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G
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C
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p
y

f
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G
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C
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p
y

f
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L
G
E
GSI
C
o
p
y

f
o
r

L
G
E
C
o
p
y

f
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L
G
E
GSM
Timer
C
o
p
y

f
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L
G
E
C
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p
y

f
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G
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C
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p
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L
G
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C
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p
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G
E
ORX
R99ORX
P
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d

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D
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P
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d
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r

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A
P
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d

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A
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A
P
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U
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2GL1
P
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U
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D
A
P
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D
A
2G DSP2
P
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A
P
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GUCIPH
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GSI
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Timer
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Channel
Decoder
P
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DSP
Timer
3. TECHNICAL BRIEF
- 33 -
3.7.1 The Backbone Subsystem
The backbone subsystem contains elements which handle the main processing in the system. The protocol stack
is expected to execute here. The ARM1176 acts as the main CPU, it is connected via the CPU XBAR with the
internal memories (RAM, ROM), the external bus interface, and the 8-channel DMA (DMA1). There is level 1 cache
and tightly-coupled memory incorporated within the ARM which help with the performance of the CPU. A level
2 cache is also added to this which helps even further with the system performance. Given that the modem is
expected to support high data rates for HSDPA (category 14) and HSUPA (category 7), these additional elements
are necessary. The ARM1176 also has the capability of controlling the peripherals in the device that are
connected to the Peripheral XBAR via a bus bridge. This 32-bit multi master AHB bus is connected to all
peripherals.
The Clock and System Control Unit (CSC) consists of the system control unit (SCU), system power control unit
(SPCU) and the clock generation unit (CGU). These units are responsible for the reset handling, the clock
multiplexing and switching and the power control of the device.

3.7.2 The Connectivity Subsystem
There are a rich set of peripherals included in the connectivity subsystem which allow interfacing to external
devices. It is required that we have connectivity for inter-process communications (IPC) with the AP, SIM card
support, external interrupts, external memory cards, trace and debug, external device control (A-GPS), and
general purpose I/O. For IPC there are 3 generic interfaces: USB HSIC, MIPI HSI, and USIF3 (which provides UART
and SPI operation). SIM and FS-USB interfaces are dedicated to the SIM-Card. External interrupts are included for
waking the modem from low power modes. There is a SD-MMC interface for utilizing memory cards in datacards
applications. The USB-HS, USIF1, and MIPI PTI interfaces can be used for tracing purposes. NAND flash can be
connected to the FCDP interface for supporting memory accesses. External devices can be controlled by the
baseband through the I2C interface. There are also generic input/output pins that can be used to connect the
baseband to external components in the system. These peripherals occupy a different number of pins as
indicated in Fig.3.7. The number in parentheses refer to additional signals which are available only as alternate
functions behind other functions.

3. TECHNICAL BRIEF
- 34 -
3.7.3 2GL1 Subsystem
While the upper layers of the modem software stack run on the main CPU, physical layer processing takes place
in the layer-1 subsystems. The 2GL1 subsystem contains 2 DSPs, which help with layer-1 processing in 2G modes.
The added DSP helps with higher performance use cases such as receive diversity and multi-slot classes. It
contains a set of dedicated HW peripherals (equalizer, etc) and connects to the digital RF interface.

3.7.4 3GL1 Subsystem
While in 3G modes, assistance is required from the 3GL1 subsystem. An ARM7 CPU deals with the
communication of the 3G subsystem with the stack SW running on the ARM1176 and handles the scheduling
of the different activities between the 3G HW peripherals (RAKE, DPE, Searcher, HSDPA Inner Receiver, Rel99-
and HSDPA-Outer Receiver). The signal processing tasks are handled by the 3G DSP. The up-link and downlink
data will be buffered in the COMRAM which connects to the ARM1176 system via the MACPHY peripherals.
Connection to the RF is managed by the DigRF peripheral.

3.7.5 The Integrated PMU Subsystem
The integrated PMU subsystem contains all of the supplies necessary for powering the baseband in the platform.
There are two step down converters for the digital core voltage (SD1) and digital IO voltage (SD2). Seven linear
voltage regulators provide the supply voltages for various internal and external components.
3. TECHNICAL BRIEF
- 35 -
3.7.6 Audio Subsystem
An overview of the Audio Subsystem hardware architecture can be found in Figure 3.7.6.
The three main entities relevant for the audio processing are
ARM1176 Embedded Microcontroller Unit core (ARM1176)
Embedded Digital Signal Processor cores (DSPs)
3rd Party IP CODEC
Fig.3.7.6 Audio Subsystem Block Diagram
3. TECHNICAL BRIEF
- 36 -
ABE Overview
The audio back end (ABE) module is a subsystem that manages various audio and voice uplink and downlink
streams between the initiator (the Cortex-A9 microprocessor unit [MPU], digital signal processor [DSP], or
direct memory access [DMA] controller) and the peripheral physical interfaces (multichannel buffered serial port
[McBSP], SLIMbus, digital microcontroller [DMIC], multichannel pulse density modulation [McPDM], and
multichannel audio serial port [McASP]).
The ABE module handles the audio processing for the applications. It receives voice or audio samples from the
initiator or the external audio chip (TWL6040 or other) and sends them to the peripheral interfaces or memories
after processing. The ABE can perform buffering of audio samples, mix audio with a voice down stream and/or a
microphone up stream (sidetone), and can apply some post-processing.
The ABE integrates the following modules:

Peripheral physical interfaces:
Three McBSP modules
One McASP module
One mobile industry processor interface (MIPI) SLIMbus interface
One DMIC module to support up to six mono and up to three stereo digital microphones
One McPDM module to support interconnect with an external audio chip.
Audio engine (AE):
Performs real-time signal processing like sample rate conversion, filtering, equalizing, and side-tone
Audio traffic controller (ATC):
Performs data move in the ABE
Generates interrupt requests to the DSP and Cortex-A9 interrupt controllers
On-chip memory:
64KB of RAM; 32-bit data memory (DMEM)
6KB for coefficient memory RAM (CMEM)
18KB for sample memory RAM (SMEM)
8KB for program memory RAM (PMEM)
Local L4 interconnect (L4_ABE) to:
L3 interconnect
Cortex-A9 MPU
DSP
3. TECHNICAL BRIEF
- 37 -
The Cortex-A9 MPU and the DSP have private access to the L4_ABE interconnect. All other initiators (sDMA) can
access the L4_ABE only through the L3 interconnect.
Timers:
Four general-purpose (GP) timers
One watchdog timer
Clock and reset management: Receives clock and reset signals from the device PRCM module. The audio
engine operates from the DPLL_ABE, which is in the PRCM module. The ABE modules can be supplied with clock
signals from the DPLL_ABE or the DPLL_PER. The ABE has its own hardware reset domain (AUDIO_RST).
Power management: The ABE module is power-independent. It has its own dedicated power domain (PD_ABE)
and can execute audio processing with the rest of the device in retention or in off mode.
Each peripheral in the ABE can be accessed directly by the initiator when the AE is bypassed (legacy mode, for
old software compatability).
Figure 3.7.6.1 is a high-level overview of the ABE.

Fig.3.7.6.1 Audio Back End
3. TECHNICAL BRIEF
- 38 -
AE Subsystem
The AE is the core of the ABE subsystem. It performs the real-time audio processing within the ABE:
mixing, muxing, volume control, smooth muting, sampling rate conversion, and side-tone equalization. The AE
subsystem also processes and executes all data transfers. To optimize the global processing, the ATC moves the
data. An IRQ/DMA controller controls system IRQ and DMA requests. Input DMA requests come from the ABE
peripherals, and output DMA requests and IRQ are generated and sent to the system (Cortex-A9 MPU interrupt
controller, DSP interrupt controller, system DMA [sDMA], and the DSP enhanced direct memory access controller
[eDMA]).
The AE subsystem contains:
AE: processes and executes the micro code with its own RAMs:
SMEM
CMEM
PMEM
DMEM contains the audio buffer and communication circular buffer.
ATC: Transfers data between all modules in the ABE
IRQ DMA controller
For more information about the audio engine, see the Audio Back-End (ABE) and Hardware Abstraction Layer
(HAL) Addendum.

Multichannel Audio Serial Port
The multichannel audio serial port (McASP) is a GP audio serial port. It is useful for intercomponent (DIT)
transmission. The McASP is intended to be flexible enough so that it may connect gluelessly to audio A/D, D/A,
CODEC and SPDIF transmit physical layer components.
McASP has the following features:
2-interconnect slave interface supports:
One interconnect configuration slave interface
One interconnect DMA slave interface
32-bit data bus width
16- and 32-bit access
10-bit address bus width
Burst not supported
WNP
3. TECHNICAL BRIEF
- 39 -
Supports idle request/acknowledge protocol
Buffers for transmit/receive operations
DMA requests (one per direction) link with the 32-bit register
Up to four transmit channels
Four serializers implemented
Support of disconnect protocol

Multichannel Buffered Serial Port
There are three McBSP instantiations: McBSP1 through McBSP3. They provide a full-duplex direct serial interface
between the ABE and external devices, such as other modems, BT chips, or codecs. Because of its versatility, a
McBSP can accommodate a wide range of peripherals and clocked frame-oriented protocols (I2S, PCM, TDM).
List of recommended usage per McBSP:
MCBSP1: BT voice/audio data
MCBSP2: Digital baseband (DBB) voice data
MCBSP3: MIDI FM data
The McBSP has the following features:
Interconnect slave interface (internal interconnect) supports:
8-, 16-, and 32- bit access
Burst not supported
WNP
Buffers for transmit/receive operations: 128/128 32-bit words (McBSP1, 2, 3)
Interrupts configurable in legacy mode (two requests) or PRCM-compliant (one request)
DMA requests (one per direction) triggered with programmable FIFO thresholds
Multidrop support
Serial interface description
Four-pin configuration (McBSP1, 2, 3)
Full-duplex communication
Multichannel selection modes
Support to enable or block transfers in each channel
Up to 128 channels for transmission and for reception
Supported protocols
3. TECHNICAL BRIEF
- 40 -
Direct interface to industry-standard codecs, analog interface chips (AICs), and other serially connected A/D
and D/A devices:
I2S-compliant devices
TDM bus devices
PCM devices
A wide selection of data sizes: 8, 12, 16, 20, 24, and 32 bits
Supports idle request/acknowledge protocol
Clock generation support:
Independent clocking and framing for reception and for transmission up to 48 MHz
Support for external generation of clock signals and frame-synchronization (frame-sync) signals
A programmable sample rate generator for internal generation and control of clock signals and
frame-sync signals

Multichannel Pulse Density Modulation Module
The McPDM is a proprietary interface based on multichannel pulse density modulation. The module consists of
five downlinks and three uplinks. Two other uplink channels are reserved for status communication.
The McPDM has the following features:
Interconnect slave interface (L4_ABE internal interconnect) supports:
Burst not supported
WNP
Full-duplex communication:
Five audio downstream channels
three audio upstream channels
RX/TX FIFO operations: 32-bit words per channels
Complies with PRCM interrupts:
One to the MPU subsystem
One to the DSP subsystem
DMA requests (one per direction) triggered with programmable FIFO thresholds; depending on the FIFO
implementation, one per channel or one per direction
Decimation filter for embedded uplink paths (five paths if two status paths)
3. TECHNICAL BRIEF
- 41 -
Oversampling for embedded uplinks (five paths)
Sigma delta for embedded downlinks (three paths)
Deserializers for the two status upstream channels

Interface
Phoenix audio comprehend 3 different interfaces:
1. I2C interface for the information with non-critical latency.
2. PDM interface for the audio signal and the register associated with audio path (gain, control)
3. GPO for audio IC interacting with Phoenix audio (drivers, power provider)
Some dual access registers (addresses 0x0A to 0x1B) can be accessed by both I2C and PDM.
By default, the concurrent access is disabled and only the PDM
interface can write in these registers. The R/W access can be switched to I2C only by setting bit
I2CSEL. A concurrent access by both I2C and PDM interfaces is also possible by setting bit
PDMI2CSEL. In this last case, Phoenix audio will not provide arbitration of simultaneous accesses and
the functionality of the system will not be guaranteed if this happens. In this mode, the software must ensure
that access by one interface is complete before using the other one, in order to avoid any
collision

3. TECHNICAL BRIEF
- 42 -
PDM Interface
The PDM interface is the over-sampled serial interface used for communication between Phoenix audio and the
application processor companion chip.
PDM_CLK is 19.2 MHz or 17.64 MHz and data rate represented by PDM_FRAME is respectively 1.92 MHz or 1.764
MHz. Words of data can be transmitted from OMAP to ABB chip using PDM_DN line (downlink path) but words
of data can also be transmitted from ABB chip to OMAP using PDM_UP line (uplink path).
Both chips are synchronized through PDM_FRAME line. By default OMAP is the owner of PDM_FRAME but
during transmission, ABB chip can send back to OMAP some low-latency data by using frame line. This will be
detailed later in this chapter.
Phoenix audio PDM interface consists of three different modes, Normal mode, Command mode and Test mode.
Normal mode and Command mode are intended to use with OMAP McPDM. Test mode is designed for
evaluation and production test.

Fig.3.7.6.2 PDM Interface connectivity between Phoenix and OMAP4 McPDM

3. TECHNICAL BRIEF
- 43 -
3.7.7 Vocoder Subsystem
FR, HR, EFR speech channels (TCH/FS, TCH/HS, TCH/EFS)
NAMR/WAMR speech channels over GMSK and 8PSK
Mandatory sub-functions for speech channels:
Discontinous transmission (DTX)
Voice activity detection (VAD)
Background noise calculation
Fullrate and halfrate data channels (F14.4, F9.6, F4.8, F2.4, H4.8, H2.4)

3.7.8 Memory Subsystem
The X-GOLD626 can use the general term SDRAM as a shortcut for Mobile DDR SDRAM.
A total of up to four external memories is supported, chip selects can be dynamically allocated to one of the two
external memory controllers of X-GOLD626. Only two memory devices can be connected to the SDRAM
controller if DDR support is required.

3.7.9 Battery Management Hardware Configurations
The X-GOLD626 chip has an internal PMU that will provide power supply for the chip itself, memory and the
attached RF. The X-GOLD also holds a measurement unit that can perform all necessary battery measurements
through external HW. This is sufficient for a modem only design where charging is controlled by another chip.

3.7.10 Clocking
The clocking system is based on 2 different clocks, a 26 MHz reference clock generated within the RF Engine and
a 32 kHz real-time clock (RTC) generated in the baseband. The 26 MHz clock provided by the RF engine is the
main reference clock for the RF circuit and the X-GOLD626. Also other system components may be supplied
with 26 MHz reference clocks. A 32 kHz oscillator located at the X-GOLD626 supplies the RTC with the reference
clock for the real time clock application, as well as provides a low power standby clock for system sleep mode
operation. This clock is available
also for other system components like GPS.
.
3. TECHNICAL BRIEF
- 44 -
3.7.11 USB
The XMM6260 platform provides two USB interfaces compliant to the USB2.0 standard:
High speed interface (480 Mbps) for communication with external devices acting both as host or device
Full speed interface (12 Mbps) for communication with the UICC using the IC-USB standard acting as host
The USB solution is based on USB controller hardware IP, which is integrated in the X-GOLD626 baseband chip
including both USB transceivers for high and full speed and the USB Stack software that implements the
different USB device classes and features.
The HS USB component supports the following features:
Modem connection for Dial Up Networking and AT command interface (CDC-ACM)
Tracing over USB (CDC-ACM)
File System Access (Mass Storage Device)
Audio over USB
Suspend/Resume and Remote Wakeup and selective suspend (for power saving)
Software download
The IC-USB component supports the following features:
UICC-Terminal USB interface according to ETSI TS 102 600 (ICCD / Mass Storage / CDC-EEM)
Suspend/Resume and Remote Wakeup (for power saving)
The USB HSIC component supports the following features:
Modem connection for DialUp Networking and AT command interface (CDC-ACM)
Suspend/Resume and Remote Wakeup, device triggered suspend (for power saving)
LPM according to "USB 2.0 Link Power Management Addendum", Remote Wakeup (for power saving)
Wake-up by sideband signals (optional for optimized power consumption)
Software download, flashless boot
The USB HSIC component supports the following features:
Modem connection for DialUp Networking and AT command interface (CDC-ACM)
Suspend/Resume and Remote Wakeup, device triggered suspend (for power saving)
LPM according to USB 2.0 Link Power Management Addendum, Remote Wakeup (for power saving)
Wake-up by sideband signals (optional for optimized power consumption)
Software download, flashless boot

3. TECHNICAL BRIEF
- 45 -
3.8 Power Block
3.8.1 General
Since P920 uses two individual chips, XMM6260 (IFX Modem) uses integrated PMIC and OMAP4430 uses
TWL6030 as a main PMIC.
3.8.2 XMM6260 (IFX Modem)
X-GOLD 626 is a GSM/UMTS/GPRS/EDGE/HSDPA/HSUPA Baseband Controller with integrated modem power
management unit. This system on chip is designed with the latest low power CMOS process technologies which
provides significant performance to meet the ever increasing demands of the cellular subscriber market for
feature rich terminals at lowest power consumption and a very competitive cost position.
Figure. LGP920 Modem Power Block Diagram
X-GOLD 626
PMU Sub-System
General Overview Confidential
Product Specification 9 Revision 2.22, 2010-05-10
Hardware Description
1.1 PMU Block diagram
Figure 1 PMU Overview
LRTC
Bandgap
Digital Control
POR
LUSB_PD
LUSB_ANA
LPMU
LUSB_IO
SD1
SD2
LPLL
SSC
OSC
MU
SD1_FB
SD1_SW
VDD_VBAT_SD1
VSS_SD1
SD2_FB
SD2_SW
VDD_VBAT_SD2
VSS_SD2
VUSB_ANA
VPLL
VUSB_IO
VRTC
VPMU
VSIM
VREF
AGND
LSIM
VDD_VSD2
ANAMON
ANAMON
RESET_PWRDWN_N
O
N
2
_
N
O
N
1
V
S
S
_
P
M
U
V
D
D
_
V
B
A
T
_
P
M
U
B
B
Battery
XGOLD626 PMU
M
1
M
2
M
3
M
4
Ball
R
E
S
E
T
_
B
B
_
N
VUSB_PD
LIO_12
FSS
eFuses
VIO_12
CVSIM
CVPMU
CVRTC_BUF CVRTC
CVUSB_IO
CVPLL
CVUSB_ANA
CVUSB_PD
CVREF
CVIO_12
LSD1
LSD2
CVSD1
CVSD2 CVDD_SD2
CVDD_SD1
V
V
CVDD_VBAT
2x
2x
T
R
I
G
_
B
R
E
F
_
C
L
K
_
E
N
T
M
_
E
N
Battery
Supervision
DCDC
Supervision
3. TECHNICAL BRIEF
- 46 -
3.8.3 TWL6030
The TWL6030 is an integrated Power Management IC for applications powered by a rechargeable battery. The
device provides 7 configurable step-down converters with up to 1.5A capability for Memory, Processor Core, IO,
auxiliary, pre-regulation for LDOs, etc. It contains also 11 LDO regulators which can be supplied either from
battery or from pre-regulated supply. Power up / power down controller is configurable and can support any
Power up / down sequences (EPROM based).
The Real Time clock (RTC) provides 32KHz output buffer, seconds, minutes, hours, day, month, and year
information as well as Alarm wake up. The TWL6030 supports 32KHz clock generation based on crystal oscillator.
The device integrates also a Switch mode charger allowing faster battery charge, higher efficiency & less power
dissipation.
The TWL6030 generates power supplies for OMAP4 and operates together with TWL6040 which includes all
audio and related detection features. For audio IC parameters, see TWL6040 Datasheet. In addition TWL6030 can
be used as PMIC for several other processors, thanks to the programmable startup/shutdown controller and
default supply voltage levels. The TWL6030 is available in an nFBGA package 7.0mm x 7.0mm with 0.4mm ball
pitch.
3. TECHNICAL BRIEF
- 47 -
P
R
O
D
U
C
T

P
R
E
V
I
E
W
SWCS045-001
VCORE1
VCORE2
VCORE3
VMEM
V1V8
V2V1
V1V29
Power control
VANA
VRTC
Interrupt handler
Ext
charger
ctl
OSC
3 MHz
I
2
C to OCP
RTC
Control, data,
and
test logic
Events bus
Card detect
and
PWM
Xtal
32K
RC
32K
RC
24M
USB SRP
I
2
C control
I
2
C SmartReflex
Events detect
SR bus
SRI2C_SDA
SRI2C_SCL
ID
CTLI2C_SDA
CTLI2C_SCL
SIM
MMC
BATREMOVAL
PWM1
BOOT0
BOOT1
BOOT2
BOOT3
RESPWRON
NRESWARM
PWRON
RPWRON
PREQ1
PREQ2A
PREQ3
INT
SYSEN
REGEN1
REGEN2
MSECURE
CLK32KG
CLK32KAO
CLK32KAUDIO
OSC32KOUT
OSC32KIN
VAC
CHRG_CSIN
CHRG_CSOUT
CHRG_EXTCHRG_ENZ
CHRG_EXTCHRG_STATZ
USB
charger
and
VBUS
OTG
CHRG_PMID
CHRG_SW
VBUS
CHRG_AUXPWR
CHRG_GND
VANA
VANA_IN
VRTC_IN
VRTC
V1V29_SW
V1V29_IN
V1V29_FDBK
V1V29_GND
V2V1_SW
V1V2_IN
V2V1_FDBK
V2V1_GND
V1V8_SW
V1V8_IN
V1V8_FDBK
V1V8_GND
VMEM_SW
VMEM_IN
VMEM_FDBK
VMEM_GND
VCORE3_SW
VCORE3_IN
VCORE3_FDBK
VCORE3_GND
VCORE2_SW
VCORE2_IN
VCORE2_FDBK
VCORE2_GND
VCORE1_SW
VCORE1_IN
VCORE1_FDBK
VCORE1_GND
REFS
TESTEN
TESTV
PWM2
10-bit
ADC
GPADC_IN0
GPADC_IN1
GPADC_VREF1
GPADC_IN2
GPADC_IN3
GPADC_IN4
GPADC_VREF4
GPADC_IN5
GPADC_IN6
GPADC_START
Digital
filter
13-bit
ADC
GGAUGE_RESP
GGAUGE_RESN
PWMFORCE
OCP bus
PREQ2B
PREQ2C
OSC32KCAP
GND_DIG_VRTC
VBAT
V
D
D
_
B
4
V
D
D
_
B
2
V
D
D
_
B
1
G
N
D
_
A
N
A
_
B
7
G
N
D
_
A
N
A
_
B
6
G
N
D
_
A
N
A
_
B
5
G
N
D
_
A
N
A
_
B
4
G
N
D
_
A
N
A
_
B
3
G
N
D
_
A
N
A
_
B
2
G
N
D
_
A
N
A
_
B
1
V
A
U
X
3
_
I
N
V
A
U
X
3
V
C
X
I
O
_
I
N
V
C
X
I
O
V
D
A
C
_
I
N
V
D
A
C
C
H
R
G
_
P
M
I
D
V
D
D
_
B
3
V
U
S
B
C
H
R
G
_
L
E
D
_
I
N
C
H
R
G
_
L
E
D
_
T
E
S
T
C
H
R
G
_
V
R
E
F
C
H
R
G
_
D
E
T
_
N
R
E
F
G
N
D
I
R
E
F
V
B
G
V
A
U
X
2
V
A
U
X
2
_
I
N
V
A
U
X
1
V
A
U
X
1
_
I
N
V
U
S
I
M
_
I
N
2
:

s
p
a
r
e
i
n
p
u
t
V
U
S
I
M
_
I
N
2
V
U
S
I
M
_
I
N
1
V
M
M
C
_
I
N
2
:

s
p
a
r
e
i
n
p
u
t
V
M
M
C
_
I
N
2
V
M
M
C
_
I
N
1
V
P
P
V
P
P
_
I
N
V
I
O
G
N
D
_
D
I
G
_
V
I
O
C
o
n
t
r
o
l

O
l
s
V
P
P
V
M
M
C
V
U
S
I
M
V
A
U
X
1
V
A
U
X
2
V
A
U
X
3
V
C
X
I
O
V
D
A
C
V
U
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B
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U
X
S
c
a
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r
s
A
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o

c
a
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i
b
TI Confidential NDA Restrictions
TWL6030
www.ti.com SWCS045 JANUARY 2010
DEVICE INFORMATION
Figure 1. TWL6030 Block Diagram
Copyright 2010, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): TWL6030
Figure. TWL6030 functional block diagram
3. TECHNICAL BRIEF
- 48 -
3.8.3.1 Charging control
P920 uses individual Charger IC which is RT9524.

Features
30V Maximum Rating for DC Adapter
Internal Integrated Power MOSFETs
Support 4.2V/2.3A Factory Mode
50mA Low Dropout Voltage Regulator
Status Pin Indicator
Programmed Charging Current
Under Voltage Lockout
Over Voltage Protection
Thermal Feedback Optimized Charge Rate
RoHS Compliant and Halogen Free
Typical Application Circuit
Functional Pin Description

3. TECHNICAL BRIEF
- 49 -
3.3.8.2 Constant Current Charging Battery Pre-Charge Current
During a charge cycle, if the battery voltage is below the pre-charge threshold, the RT9524 enters the pre-charge
mode. This feature revives deeply discharged cells and protects battery. Under USB100 Mode, the pre-charge
current is internally set to 95mA. When the RT9524 is under USB500 and ISET Mode, the pre-charge current is
20% of fast-charge current set by external resistor RISET.

Battery Fast-Charge Current ISET Mode
The RT9524 offers ISET pin to program the charge current. The resistor RISET is connected to ISET and GND. The
parameter KISET is specified in the specification table.
3. TECHNICAL BRIEF
- 50 -
Battery Voltage Regulation (CV Mode)
The battery voltage regulation feedback is through BATT pin. The RT9524 monitors the battery voltage between
BATT and GND pins. When the battery voltage closes to battery regulation voltage threshold, the voltage
regulation phase begins and the charging current begins to taper down. When the charging current falls below
the programmed end-of-charge current threshold, the CHG_S pin goes high to indicate the termination of
charge cycle. The end-of-charge current threshold is set by the IEOC pin. The resistor RIEOC is connected to IEOC
and GND. The parameters KIEOC and IEOC are specified in the specification table.

The current threshold of IEOC (%) is defined as the percentage of fast-charge current set by RISET. After the
CHGSB pin pulled to high, the RT9524 still monitors the battery voltage. Charge current is resumed when the
battery voltage goes to lower than the battery regulation voltage threshold.
3. TECHNICAL BRIEF
- 51 -
3.8.3.3 Constant Voltage Charging
Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V. The end of constant
voltage charging is commonly detected around 240mA from Travel adaptor.

3.8.3.4 LGP920 Charging Specification
-Charging Method : CC & CV (Constant Current & Constant Voltage)
-Maximum Charging Voltage : 4.2V
-Maximum Charging Current : 948mA
-Nominal Battery Capacity : 1500mAh
-Charging time : Max. 3h 30m
- Full charge indication current (icon stop current) : 248mA

3.8.3.5 LGP920 battery bar icon display
Battery Bar Number Specification
BAR 6 (Full) 90% over
Remain %
BAR 6 --> 5 90% 89%
BAR 5 --> 4 70% 69%
BAR 4 --> 3 50% 49%
BAR 3 --> 2 30% 29%
BAR 2 --> 1 15% 14%
BAR 1 --> 0 5% 4%
Low Battery Pop-up 4% ~ 15% : One Time popup
Critical Low Battery Pop-up 0% ~ 3% : Popup at every level change
POWER OFF 0%
Table. LGP920 battery bar specification

3. TECHNICAL BRIEF
- 52 -
3.9 External memory interface
3.9.1 Introduction
Since LG-P920 contains communication and application processor, memory is dedicated only for each processor.
XMM6260 (IFX modem) uses MCP (Multi Chip Package) 1Gb Nand / 512Mb LPDDR1 and OMAP4430 uses POP
(Package on Package) 512MB LPDDR2 and 8GB eMMC Nand memory.

3.9.2 LG-P920 XMM6260 (IFX Modem) memory Interface
-Multi Chip Package : DDR SDRAM and NAND Flash merged 1 package
-512Mbit Mobile DDR SDRAM / 1Gbit NAND Flash
Interface Spec
Part Name Product Gr Maker Operation Voltage Speed
H8BCS0QG0MMR-
46M
NAND Hynix 1.8V 45ns
SDRAM 1.8V 166MHz

3.9.3 LG-P920 OMAP4430 memory Interface
- Package on Package on OMAP4430: DDR2 SDRAM
- 8GB eMMC 4.41 version

LPDDR2
Interface Spec
K3PE4E400M-XGC1 SDRAM Samsung 1.8V/1.2/1.2/1.2
DDR2 800
(400MHz)

8GB NAND
Interface Spec
SDIN5C2-8G-974D NAND Sandisk 2.8V
15MB/s for read
9MB/s for write

3.9.4 External SD card memory Interface
OMAP4430 supports external SD card which supports up to 32GB (SDHC compatible)

3. TECHNICAL BRIEF
- 53 -
3.10 Audio and sound
3.10.1 Overview of Audio path

Figure. Block diagram of Audio & Sound path

OMAP
I2C1 SDA
I2C1 SDA TWL6040
SPK
HFRP1
AUD_SPK_P
AUD SPK N
4430
PDMDN
PDMUP
PDMCLK
SDA
SCL
PDM_DL_DATA
PDM_UL_DATA
ABE_CLKS
PDM CLK
I2C1_SDA
I2C1_SCL
ABE_PDM_DL_DATA
ABE_PDM_UL_DATA
ABE_CLKS
I2C1_SDA
I2C1_SCL
TWL6040
(Audio Codec)
AUD RCV P
RCV
HFRN1
AUD_SPK_N
HFRP2
HFRN2
HBIAS
HS MICBIAS
PDMCLKLB
PDMFRAME
AUDPWRON
NRESPWRON
NAUDINT
PDM_CLK
PDM_FRAME
AUD_PWRON
SYS_nRESPWRON
SYS_nIRQ2
ABE_PDM_LB_CLK
ABE_PDM_FRAME
HDQ_SIO
SYS NIRQ2
SYS_NRESPWRON
EARP
EARN
AUD_RCV_P
AUD_RCV_N
BT / WiFi / FM
HBIAS
HS_MIC
HSL
HSR
3.5
_
HS_MIC
EAR_L
EAR_R
HOOK_ADC
ACCONN
NAUDINT
AFML
AFMR
FM_AUDIO_R
FM_AUDIO_L
SYS_NIRQ2
FM_I2S_FSYNC
FM_I2S_DI
FM I2S CLK
FM_I2S_FSYNC
FM_I2S_CLK
FM_I2S_DO
ABE McBSP3 CLKX
ABE_McBSP3_DX
ABE_McBSP3_FSX
Analog
MIC1
MBIAS
FM_I2S_CLK
FM_I2S_DO
BT_PCM_SYNC
BT_PCM_DOUT
BT_PCM_DIN
BT PCM CLK
PCM_AUD_FSYNC
PCM_AUD_IN
PCM_AUD_OUT
PCM AUD CLK
FM_I2S_DI
ABE_McBSP3_CLKX
ABE_McBSP3_DR
ABE M BSP1 CLKX
ABE_McBSP1_DR
ABE_McBSP1_DX
ABE_McBSP1_FSX
MMICN
MMICP
Analog
MIC2
SBIAS
SMICN
SMICP
FM_ANT
_ _
PCM_AUD_CLK
ABE_McBSP1_CLKX
SMICN
FM_ANT
EAR_SENSE
EAR_SENSE
DPM EMU10
HCI_CTS
HCI_RTS
HCI_TX
HCI_RX
BT_UART_RTS/
BT_UART_CTS/
BT_UART_RXD
BT_UART_TXD
UART2_RTS/
UART2_CTS/
UART2_RX
UART2_TX
XMM6260
IPC_I2S_DIN
IPC_I2S_DOUT
IPC_I2S_CLK
ABE_McBSP2_CLKX
ABE_McBSP2_DR
ABE M BSP2 DX
I2S2_CLK0
I2S2_TX
I2S2 RX
DPM_EMU10
_ _
ABE_McBSP2_DX
ABE_McBSP2_FSX
IPC_I2S_SYNC
I2S2_RX
I2S2_WA0
3. TECHNICAL BRIEF
- 54 -
3.10.2 TWL6040 (Audio Codec)
The TWL6040 is an audio codec with a high level of integration providing analog audio codec functions for
portable applications, as shown in Figure 3.10.2. It contains multiple audio analog inputs and outputs, as well as
microphone biases and accessory detection. It is connected to the OMAP4 host processor through a proprietary
PDM interface for audio data communication enabling partitioning with optimized power consumption and
performance. Multichannel audio data is multiplexed to a single wire for downlink (PDML) and uplink (PDMUL).
The OMAP4 device provides a TWL6040 with five PDM audio-input channels (DL0DL4). Channels DL0DL3 are
connected to four parallel DAC channels multiplexed to stereo headphone (HSL, HSR), stereo speaker (HFL,HFR),
and earpiece (EAR) or stereo line outputs (AUXL, AUXR).
The stereo headphone path has a low-power (LP) mode operating from a 32-kHz sleep clock to enable over 100
hours of MP3 playback time. Very-high dynamic range of 104 dBA is achieved when using the system clock input
and DAC path high-performance (HP) mode. Headphone drivers provide a 1-Vrms output and are ground
centered for capless connection to headphone, thus enabling system size and cost reduction. The earpiece
driver is a differential class-AB driver with 2 Vrms capability to a typical 16Ohm or 32 Ohm load.
Stereo speaker path has filterless class-D outputs with 1.5W capability per channel. For output power
maximization supply connection to an external boost is supported. Speaker drivers support also hearing aid coil
loads. For vibrator and haptic feedback support TWL6040 has two PWM channels with independent input
signals from DL4 or I2C. Vibra drivers are differential H-bridge outputs, enabling fast acceleration and
deceleration of vibra motor. An external driver for a hearing aid coil or a piezo speaker requiring high voltage
can be connected to line outputs.
The TWL6040 supports three differential microphone inputs (MMIC, HMIC, SMIC) and a stereo line-input (AFML,
AFMR) multiplexed to two parallel analog-to-digital converters (ADCs). The PDM output from the ADCs is
transmitted to the OMAP4 through UL0 and UL1. Two LDOs provide a voltage of 2.1 V to bias analog
microphones (MBIAS and HBIAS). The maximum output current is 2 mA for each analog bias, allowing up to 2
microphones on one bias. Two LDOs provide a voltage of 1.8 V/1.85 V to bias digital microphones (DBIAS1 and
DBIAS2). One bias generator can bias up several digital microphones at the same time, with a total maximum
output current of 10 mA.
3. TECHNICAL BRIEF
- 55 -
The TWL6040 has an integrated negative charge pump and two LDOs (HS LDO and LS LDO) for high PSRR.
The only external supply needed is 2.1 V, which is available from the TWL6040 PMIC in the OMAP4 system. All
other supply inputs can be directly connected to battery or system 1.8-V I/O.
Two integrated phase-locked loops (PLLs) enable operatation from a 12-/19.2-/26738.4-MHz system clock
(MCLK) or, in LP playback mode, from a 32-kHz sleep clock (CLK32K). The frequency plan is based on a 48-kS/s
audio data rate for all channels, and host processor uses sample-rate converters to interface with different
sample rates (e.g., 44.1 kHz). In the specific case of low-power audio playback, the 44.1-kS/s and 48-kS/s rates are
supported by the TWL6040. Transitions between sample rates or input clocks are seamless.
Accessory plug and unplug detections are supported (PLUGDET). Some headsets have a manual switch for
submitting send/end signal to the terminal through the microphone input pin. This feature is supported by a
periodic accessory button press detection to minimize current consumption in sleep mode. Detection cycle
properties can be programmed according to system requirements.
Figure 3.10.2 shows a simplified block diagram of the device.
3. TECHNICAL BRIEF
- 56 -
Figure 3.10.2. Simplified Block diagram
3. TECHNICAL BRIEF
- 57 -
470n C940
R
F
0
5
1
8
1
3
0
S
V
CI
VA901
C934
2.2u
C926 0.47u
C902
4.7u
C920 0.1u
0.1u C919
C922 0.1u C901
4.7u
TP901
0.1u C916
TP902
0 R921
TP903
2.2u
C935
0.1u C917
TP904
C941
100n
1u
C923
C915 0.1u
C936
220n
2.2u C924
R919 0
C933
100n
VBAT
120 FB941
FB913 120
U901
TWL6040
8
G
7
G
8
F
7
E
6
E
E5
D7
D6
D5
0
1
D
1
1
D
1
D
2
E
7
L
9
F
1
G
0
1
H
0
1
C
9
L
4
K
2
L
2
B
2
C
0
1
A
7
A
6
A
3
A
7
J
9
E
2
G
0
1
J
1
1
B
5
H
B1
A2
D3
C1
A8
A9
B5
B4
B8
B9
A5
A4
F4
G4
F3
G3
K11
J11
C11
B10
F1
F2
H2
H1
J3
H4
J4
J2
K1
K3
L4
J5
H7
K7
L11
A11
L1
A1
K2
E1
G5
L5
K6
L6
B7
B6
D4
E8
J9
D8
G6
H6
H8
K8
L10
L8
K9
F11
G11
G9
E11
E10
H11
K10
E4
F7
F6
F5
8
J
2
D
3
B
6
J
9
C
8
C
7
C
6
C
4
C
5
C
0
1
G
0
1
F
1
J
9
D
3
E
3
L
3
H
9
H
5
K
F
E
R
D
N
G
S
H
D
N
G
C
I
M
A
D
N
G
C
I
M
D
D
N
G
1
O
D
L
D
N
G
2
O
D
L
D
N
G
M
C
V
D
N
G
1
P
C
N
D
N
G
2
P
C
N
D
N
G
1
L
F
H
D
N
G
2
L
F
H
D
N
G
3
L
F
H
D
N
G
1
R
F
H
D
N
G
2
R
F
H
D
N
G
3
R
F
H
D
N
G
G
I
D
D
N
G
R
B
I
V
D
N
G
L
B
I
V
D
N
G
O
I
D
N
G
PBKG1
PBKG2
PBKG3
PBKG4
PBKG5
VDDREGNCP
NCPOUT1
NCPOUT2
NCPFB
CFLYP
CFLYN
PDMDN
PDMUP
PDMCLK
PDMCLKLB
PDMFRAME
SDA
SCL
AUDPWRON
NRESPWRON
NAUDINT
GPO1
GPO2
GPO3
REFN
REFP
REF
PLUGDET
ACCONN
ATEST
DTEST1
DTEST2
DTEST3
PROG
MCLK
CLK32K
DBIAS1
DBIAS2
MBIAS
MMICP
MMICN
SMICP
SMICN
HBIAS
HMICP
HMICN
AFMR
AFML
EARP
EARN
HSL
HSR
AUXLP
AUXLN
AUXRP
AUXRN
HFLP1
HFLN1
HFRP1
HFRN1
HFLP2
HFLN2
HFRP2
HFRN2
VIBLP
VIBLN
VIBRP
VIBRN
F
E
R
V
D
D
V
R
A
E
D
D
V
S
H
D
D
V
L
U
D
D
V
L
D
D
D
V
L
L
P
D
D
V
1
L
F
H
D
D
V
2
L
F
H
D
D
V
1
R
F
H
D
D
V
2
R
F
H
D
D
V
L
B
I
V
D
D
V
R
B
I
V
D
D
V
S
A
I
B
M
A
D
D
V
S
A
I
B
M
D
D
D
V
O
I
V
D
D
V
R
A
E
S
S
V
S
H
S
S
V
L
U
S
S
V
L
D
S
S
V
L
L
P
S
S
V
1
V
2
V
D
D
V
O
D
L
D
D
V
N
I
O
D
L
S
S
V
O
D
L
S
S
V
NC1
NC2
NC3
NC4
5
C
N
6
C
N
7
C
N
8
C
N
9
C
N
VBAT VSEL_1.8V
C932
0.1u
VSEL_2.1V
C931
0.1u
C939
0.1u 0.1u
C930 C929
0.1u
0.1u C928
C938
0.1u 2.2u
C937
2.2u C927
4.7u C904
C905 4.7u
C903
4.7u
FB901 120
C925 0.1u
FB914 120
1n
C913
1n
C914
VSEL_2.1V
C921 0.1u
C918 0.1u
VA902
ICVS0318150FR
ICVS0318150FR
VA903
CLK32K_AUD
I2C1_SCL
I2C1_SDA
SYS_nRESPWRON
MICBIAS
MMIC_P
AUD_SPK_N
AUD_SPK_P
AUD_RCV_N
AUD_RCV_P
HS_MICBIAS
EAR_L
EAR_R
SMIC_P
SMIC_N
HOOK_ADC
HS_MIC
EAR_SENSE
MMIC_N
FM_AUDIO_L
FM_AUDIO_R
AUD_CLK_IN
PDM_DL_DATA
PDM_UL_DATA
ABE_CLKS
PDM_CLK
PDM_FRAME
AUD_PWRON
SYS_nIRQ2
Open/ground switch input
stereo headphone
stereo speaker
earpiece
a differential class-AB driver
stereo line outputs
DOWNLINK
UPLINK
filterless class-D outputs with 1.5W
with 2 Vrms capability to a typical 32Ohm
a stereo line-input
2.1V
2.1V
X
X
Microphone input
Removed (Rev.C)
Added (P925 Rev.A)
Added (P925 Rev.A)
Added (P925 Rev.A)
Removed (Rev.C)
C1175
0.1u 0.1u
C1176 R1176
10K
VSEL_1.8V
200K
R1174
C1177
33p
C1179
10u
2.2K
R1178
470p
C1178
R1173 1M
1800 FB1175
1800 FB1176
FB1177 1800
FB1173
1800
R1172
DNI
Q1173
2SJ347
2
3
1
G
D
S
HS_MICBIAS
EAR_L
EAR_R
HOOK_ADC
HS_MIC|HOOK_ADC
HS_MIC
EAR_SENSE
Changed (P925 Rev.B)
Changed (Rev.1.0)
Added (925 Rev.D)
3. TECHNICAL BRIEF
- 58 -
3.11 Main (5M pixels) & Sub (VGA) Camera
LG-P920 supports two cameras. One is 5M pixels, main camera, the other is VGA, sub camera used VT & self
camera scene.

Figure. Main 5M Camera Schematic

Figure. VGA Camera Schematic
FL1223
ICMEF214P101M
0
1
9
8 4
7 3
6 2
5 1
P1 P5
P2 P6
P3 P7
P4 P8
1
G
2
G
CN1221
GB042-40S-H10-E3000
21 20
22 19
23 18
24 17
25 16
26 15
27 14
28 13
29 12
30 11
31 10
32 9
33 8
34 7
35 6
36 5
37 4
38 3
39 2
40 1
ICMEF214P101M
FL1222
0
1
9
8 4
7 3
6 2
5 1
P1 P5
P2 P6
P3 P7
P4 P8
1
G
2
G
1.2V_5M_VDIG
1.8V_5M_VIO
5M_VANA_V2V7_S
5M_VANA_V2V7_P
1u
C1236
4.7u
C1235
5M_VCM_V2V8_P
5M_VCM_V2V8_S
FL1221
ICMEF214P101M
0
1
9
8
7
6
5
P1
1
P5
P2
2
P6
P3
3
P7
P4
4
P8
1
G
2
G
G
5
T
S
0
_
5
B
9
D
S
E
4
2
2
1
D
Z
G
5
T
S
0
_
5
B
9
D
S
E
5
2
2
1
D
Z
0.1u
C1230 C1228
4.7u
C1229
1u
0.1u
C1237
C1231
0.1u
0.1u
C1232
0.1u
C1234
C1233
0.1u
I2C3_SCL
I2C3_SDA
I2C4_SDA
I2C4_SCL
5M_MCLK
PRIMARY_5M_MIPI_DATA0_P
PRIMARY_5M_MIPI_DATA0_N
PRIMARY_5M_MIPI_CLK_P
PRIMARY_5M_MIPI_CLK_N
SECONDARY_5M_MIPI_CLK_P
SECONDARY_5M_MIPI_DATA0_N
SECONDARY_5M_MIPI_DATA0_P
SECONDARY_5M_RESET_N
SECONDARY_5M_MIPI_CLK_N
PRIMARY_5M_RESET_N
5M_MCLK_CAM
5M_MCLK_CAM
CN103
11 10
12 9
13 8
14 7
15 6
16 5
17 4
18 3
19 2
20 1
0.1u
C103
TWL_LDO_1.8V
TWL_LDO_2.8V
0.1u
C104
FB101
VT_CAM_RESET/
VT_CAM_PWDN
VT_0.3M_MIPI_CLK_N
VT_0.3M_MIPI_CLK_P
VT_0.3M_MCLK
VT_0.3M_MIPI_DATA0_N
VT_0.3M_MIPI_DATA0_P
I2C3_SDA
I2C3_SCL
Rev.1.1 (VSEL 1.8V Remove)
Rev.B(Removed Bypass Cap)
3. TECHNICAL BRIEF
- 59 -
CAMERA
VT IO DVDD 1V8
VT_PCLK
VT_HSYNC
VT VSYNC
CAM_MCLK
EMI/ESD Filter
VT_IO_DVDD_1V8
VT_AVDD_2V8
V_PCLK
V_HSYNC
`
1.3M Camera
VT_VSYNC
VT_DATA[7:0]
VT_RESET_N
VT CAM PWDN
V_VSYNC
V_O 29
V_GP0
L
O
C
!
L
O
C
2
VT_CAM_PWDN
CAM_I2C_SC
L
CAM_I2C_SD
A
CAM_SUBPM_EN
V_GP4
CAM_2C_SCL
CAM_2C_SOA
UAPT2_PTS_N
LP8720
SUB PMIC
LP8720
SUB PMIC
AP20
8M MIPI CLK N
CAM_VDIG_1V2
Common mode filter
L
O
C
5
L
O
C
4
L
O
C
3
O
C
i
O
C
8M
Camera
(LGIT)
8M_MIPI_CLK_N
8M_MIPI_DATA0_N
8M_MIPI_CLK_P
8M_MIPI_DATA0_P
CAM_AVDD_2V8
CAM_VIO_1V8
CAM_AF_2V8
8M MIPI DATA1 N
CS_CLKAP
CS_CLKAN
CS_O!AP
CS_O!AN
(LGIT)
8M_MIPI_DATA1_N
8M_MIPI_DATA1_P
8M_RESET_N
CAM_MCLK
8M CAM VCM EN
CS_O2AP
CS_O2AN
V_GP5
V_MCLK
8M_CAM_VCM_EN
CAM_VIO_1V8
VOOC_V
V_GP6
C1212
10u
U1201
LP8720TLX
1
B
E1 C2
B2
C1
E2
D3
C3
A1 C4
B3
A3
D4
E3
D2
B4 E4
2
A
1
D
4
A
T
T
A
B
V
2
N
I
V
1
N
I
V
VINB LDO1
FB
SW
GNDB
LDO2
IRQ_N
SDA LDO3
SCL
DVS
EN
LDO4
DEFSEL
IDSEL LDO5
D
N
G
1u
C1204
C1211
2.2u
C1205
1u
C1209
2.2u 2.2u
C1210
5M_VCM_V2V8_S
10u
C1201
5M_VCM_V2V8_P
5M_VANA_V2V7_P
VBAT
1.2V_5M_VDIG
1.8V_5M_VIO
5M_VANA_V2V7_S
2.2u
L1201
1u
C1206 C1207
1u
C1208
1u
100K
R1202
I2C3_SCL
I2C3_SDA
CAM_SUBPM_EN
Added Res. (Rev.B)
4
E

o
t

e
s
o
l
C
Changed (P925 Rev.A)
Figure. Camera Sub PMIC Schematic
Figure. Camera Block diagram
3. TECHNICAL BRIEF
- 60 -
3.12 Display
LCD module is connected to Main PCB with 30-pin connector.
The LCD is controlled by MIPI Interface in OMAP4430

Figure. Schematic of LCD connector (Main Board)

Table. Interface between LCD Module and MAIN Board
1u
C1143
4
3
2
1
R1191 DNI
600 FB1143
ICMEF214P101M
FL1142
0
1
9
8 4
7 3
6 2
5 1
P1 P5
P2 P6
P3 P7
P4 P8
1
G
2
G
2.8V_3D_LCD
2.8V_LCD_VCI
1.8V_LCD_IOVCC
12V_3D_LCD
FL1141
ICMEF214P101M
0
1
9
8 4
7 3
6 2
5 1
P1 P5
P2 P6
P3 P7
P4 P8
1
G
2
G
CN1141
24-5804-030-000-829+
16 15
17 14
18 13
19 12
20 11
21 10
22 9
23 8
24 7
25 6
26 5
27 4
28 3
29 2
30 1
2.8V_LCD_VCC
2
0
1
1
A
V
R
F
0
5
1
8
1
3
0
S
V
CI
4
0
1
1
A
V
R
F
0
5
1
8
1
3
0
S
V
CI
C1141
1u
DNI R1190
I2C2_SCL
I2C2_SDA
LCD_RESET_N
LED_C2
LED_C1
LED_A
DSI2_LCD_MIPI_CLK_P
DSI2_LCD_MIPI_CLK_N
DSI2_LCD_MIPI_D0_P
DSI2_LCD_MIPI_D1_P
DSI2_LCD_MIPI_D1_N
DSI2_LCD_MIPI_D0_N
3D_LCD_BANK_SEL_1
Added (Rev.B)
Removeed VA1101, VA1103 (Rev.C)
3. TECHNICAL BRIEF
- 61 -
LG-P920 supports 3D LCD(Glassless)
The 3D LCD is controlled by 3D control IC(ISL24832)(3D Control IC is in LCD Module)
OMP4430 is supplying power for the 3D LCD, control signals are supplied.

Figure. Schematic of 3D PWR LDO(Main Board)

Figure. Schematic of 3D LCD Boost(VREF)(Main Board)
2.8V_3D_LCD
U1106
BU28TD2WNVX
5
3 2
4 1
VOUT VIN
GND STBY
D
N
G
P
C1107
1u
VBAT
C1106
1u
3D_LCD_EN
R1136
510K
51K
R1133
12V_3D_LCD
VBAT
200K
R1134 C1134
0.1u
5
3
1
1
R
K
2
2
0.1u C1132 C1138 0.1u
C1137
1u
4.7u
C1131
TPS61093
U1131
11
10
9
4
7
3
5
2
8
6
1
GND
SS
OUT
VIN
EN
CP2
FB
CP1
SW
VO
Exposed_GND
4.7u L1131
3D_BOOST_EN
Changed (Rev.B)
3. TECHNICAL BRIEF
- 62 -
3D Mode On Sequence : 3D PWR On VREF On BANK_SEL On

Figure. 3D Mode On Sequence

3D Mode Off Sequence : BANK_SEL Off VREF Off 3D PWR Off

Figure. 3D Mode Off Sequence

3. TECHNICAL BRIEF
- 63 -
LCD Block Diagram

Figure. LG-P920 LCD Module Block Diagram

3. TECHNICAL BRIEF
- 64 -
3.13 Vibrators
The Linear motor, creates a certain kind of vibration controlled and defined uniquely by LG Electronics. The
followings are the certain examples of conditions that the users may feel the vibration from the phone:
Incoming Call (in Silence Mode), Google Keys Pressed, Turn-on / -off, Dialing, and Text Messaging.

Figure 1 Vibrator Schematic

Figure 2 Vibrator Block Digram
ISA1000
EUSY0238306
U981
9 0
1
1
1
5 4
6 3
7 2
8 1
EN VDP
PWM GND
MODE VDD
GAIN VDN
3
C
N
2
C
N
1
C
N
TWL_LDO_3.0V
C987
2.2u
R982
DNI
L988 82n
L989 82n
R986 470K
0 R987
TP905
R981
100K
C986 3.9n
VIB_L_P
VIB_L_N
VIBE_PWM
VIBE_EN
Added (P925 Rev.A)
3. TECHNICAL BRIEF
- 65 -
3.14 HDMI
When the users desire to output video signals onto the outer display, they are supposed to open the cap first
and connect the suitable cable, which has to be HDMI type-D compatible, to the socket placed at the upper
center of the phone. It will automatically display the video contents on the desired display

Figure 1 HDMI Type D Connector Schematic

Figure 2 HDMI Type D Connector Pin Assignments
C1271
100n
5V_HDMI
R1271
100K
CN1271
78618-0001
25
24
23
22
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
21
20
HDMI_D1-
HDMI_D0-
HDMI_D0+
HDMI_D1+
HDMI_D2-
HDMI_D2+
HDMI_CLK-
HDMI_CLK+
C_HDMI_CEC
C_HDMI_SCL
C_HDMI_SDA
C_HDMI_HPD
Changed Con. (Rev.B)
Removed (Rev.1.0)
3. TECHNICAL BRIEF
- 66 -
3.15 Compass Sensor
If a customer buy the application SW, The Sensor provides user with a Electric Compass function.
U1107 (AMI304) IC is interfaced to AP20(U401) using I2C interface.

Figure. Compass Sensor Schematic

Figure. Compass Sensor Block Diagram

C975
1u
AMI306
U975
10
9
5
4
6
3
7
2
8
1
D
D
V
A
Y
D
R
D
D
N
G
L
C
S
G
E
R
V
P
P
V
INT
SDA ADDR
DVDD
SENSOR_3.0V
C978
1u
VSEL_1.8V
C976
10n
I2C4_SDA
I2C4_SCL
COMPASS_INT
Added (Rev.1.0)
AMI304 Specifications (Preliminary)
3/36 Ver.B9100212
[ 1 ] Scope of Application
This specification applies to the 3-axis magnetic sensor AMI304 provided to by Aichi Steel
Corporation.
[ 2 ] General Description
The AMI304 is a n intelligent electronic compass that integrates three Magneto-Impedance sensor
elements (MI-element) with their controller IC in a single small package.
The controller IC of the AMI304 consists of a circuit for detecting the magnetic signals from three
MI-sensor elements, an amplifier capable of compensating each sensors offset and setting appropriate
sensitivity values, a thermal sensor for measuring the ambient temperature, a 12bit AD converter, an I2C
serial interface circuit and a constant voltage circuit for power control.
[ 3 ] Block Diagram
1.0F
X-axis
MI-sensor
Circuit for
MI-Sensors
Data
12bit AD
Converter
PGA
Logic circuit
Serial I/F
(I2C)
Thermal
sensor
Y-axis
MI-sensor
Z-axis
MI-sensor
NC
AVDD
Vpp
Zero point
Voltage
Adjustment
GNDA
NC
ADDR
GNDS
INT
DRDY
SCL
SDA
C2
0.01F
C1
0.47F
Dropout
Regulator
256 Bytes
For Factory
Calibration
OTP-ROM
VDD
VID
VREG
DVDD
3. TECHNICAL BRIEF
- 67 -
3.16 Motion Sensor
The motion sensor can sense gravity & accelerated motion. Therefore according to the direction of cell phone,
the phone screen is rotated automatically. And the motion sensor is connected with a gyro sensor to
supplement each data.
U971 : KXTF9 IC is interfaced to OMAP4430(U500) using I2C interface.

Figure. Motion Sensor Schematic

Figure. Motion Sensor Block Diagram

R973
DNI
1u
C973
VSEL_1.8V
C972
0.1u
0.1u
C971 U971
KXTF9
4
3
2
1
5
0
1
6
7
8
9
SCL
DNC4
INT
DNC3
A
D
S
D
D
V
IO_VDD
DNC1
DNC2
GND
VSEL_1.8V
SENSOR_3.0V
MOTION_INT
IME_DA
IME_CL
3. TECHNICAL BRIEF
- 68 -
3.17 Gyro Sensor
The gyro sensor(MPU3050) can sense angular velocity not gravity and accelerated motion. The gyro sensor
applied in LG- P920 can detect 3-axis rotation force sensing X,Y and Z angular velocity. And the gyro sensor data
is supplemented by the motion sensor data. It make possible user to development application SW using gyro
sensor data like that motion games.
U961: MPU3050 IC is interfaced to OMAP4430(U500) using I2C interface.

Figure. Gyro Sensor Schematic

Figure. Gyro Sensor Block Diagram
X Accel
Y Accel
Z Accel
ADC
ADC
ADC
Digital
I
2
C
X Gyro
Y Gyro
Z Gyro
ADC
ADC
ADC
ADC Temp
Digital
Control and
Processing
Sensor I
2
C
Interface
Primary
Serial
Interface
R902
1.5K
0.1u
C965
VSEL_1.8V
C962
0.1u
MPU3050A
U961
25
21
20
22
19
23
24
8
1
7
1
9
8
10
7
11
6
12
5
3
1
4
4
1
3
5
1
2
6
1
1
N
I
K
L
C
7
C
N
1
C
N
6
C
N
2
C
N
5
C
N
3
C
N
D
D
V
4
C
N
INT
A
D
_
E
M
I
FSYNC
IME_CL
REGOUT
VLOGIC
AD0
8
C
N
D
N
G
SDA
SCL
RESV1
CLKOUT
CPOUT
RESV2
NC9
C961 2.2n
SENSOR_3.0V
0.1u
C963
R901
1.5K
VSEL_1.8V
I2C4_SDA
I2C4_SCL
GYRO_INT
A
D
_
E
M
I
L
C
_
E
M
I
Added (P925 Rev.A)
3. TECHNICAL BRIEF
- 69 -
3.18 Illumination & Proximity Sensor
Illumination Sensor adjusts LCD backlight current by detecting the surrounding brightness.
If user checks the automatic brightness menu, LCD backlight current adjusting is to be enable automatically.
When the call is connected and the object close to the proximity sensor,
LCD backlight and Touch screen are disable operation automatically.
U101 : APDS-9900 IC used I2C interface to OMAP4430

Figure. Illumination & Proximity Sensor Schematic

Figure. Illumination & Proximity Sensor Block Diagram
PROXI_3.0V
U101
5 4
6 3
7 2
8 1
SDA VDD
INT SCL
LDR GND
LEDK LEDA
SENSOR_3.0V
1u
C101 C102
1u
PROX_INT
I2C3_SDA
I2C3_SCL
Rev.B(Pull Up Move to Main PCB)
3. TECHNICAL BRIEF
- 70 -
3.19 Touch Module
Touch module is connected to Main PCB with 10-pin connector.
The Touch module is controlled by I2C Interface in OMAP4430.

Figure. Schematic of Touch connector (Sub PCB side)

Pin Map
1 SCL
2 GND
3 SDA
4 VDD(3.3V)
5 INT
6 VBUS(1.8V)
7 Reset
8 GND
9 GND
10 GND
CN102
6 5
7 4
8 3
9 2
10 1
3
0
1
A
V
VSEL_1.8V
2
1
1
R
K
0
1
TOUCH_3.3V
VSEL_1.8V
5
0
1
D
Z
C119
2.2u
1
0
1
D
Z
2
0
1
D
Z
3
0
1
D
Z
4
0
1
D
Z
6
0
1
D
Z
u
1
0
2
1
C
I2C2_SCL
I2C2_SDA
TOUCH_INT_N
TOUCH_RESET
Rev.F
Rev.E
Rev.F
Rev.F
Rev.F
3. TECHNICAL BRIEF
- 71 -
3.20 Main Features
3.23.1 LG-P920 Main Features
- DOP Type design
- UMTS 2100 + UMTS 1900 + UMTS900+ GSM 900 + DCS 1800 + PCS 1900 + GSM850 based
GSM/GPRS/EDGE/UMTS
- HSDPA 14.4Mbps, HSUPA 5.7Mbps
- Main LCD (WVGA)
TFT Main LCD (4.3, 480X800), 3D LCD
- Capacitive/Electrostatic Touch Window
- 5M AF 3D Camera, 0.3M VT Camera
- 3.5Phi Stereo Headset & Speaker phone
- MP3/ WMA / AAC/AAC+/WAV/AC3 decoder and play
- MPEG4 encoder/decoder and play/save
- JPEG en/decoder
- Supports Bluetooth and HS-USB
- Supports WLAN(802.11b, 802.11g, 802.11n)
- Supports FM Radio
- 1500 mAh (Li-Ion)

4. TROUBLE SHOOTING
- 72 -
4. TROUBLE SHOOTING

4.1 RF Component

RF component (WCDMA / GSM)

X184
TCXO(26MHz)
U241
Tranceiver PMU
U181
RFIC(Tranceive)
U121
Duplexer(Bank)
U220
PAM DCDC
U171
PAM(MMMB)
FL111
Filter(Seperator)
4. TROUBLE SHOOTING
- 73 -

4.2 SIGNAL PATH

WCDMA 1,2,4,5,8 Band TX Signal PATH

A. WCDMA 2100 TX PATH B. WCDMA 1900 TX PATH
C. WCDMA 1700 TX PATH D. WCDMA 850 TX PATH
E. WCDMA 900 TX PATH F. COMMON TX/RX PATH\
4. TROUBLE SHOOTING
- 74 -

WCDMA 1,2,4,5,8 Band RX Signal PATH

A. WCDMA 2100 RX PATH B. WCDMA 1900 RX PATH
C. WCDMA 1700 RX PATH D. WCDMA 850 RX PATH
E. WCDMA 900 RX PATH F. COMMON TX/RX PATH\

4. TROUBLE SHOOTING
- 75 -

GSM 850,900,1800,1900 Band TX/RX Signal PATH

A. GSM 850 RX PATH B. GSM 900 RX PATH
C. GSM 1800 RX PATH D. GSM 1900 RX PATH
E. GSM 850,900 TX PATH F. GSM 1800,1900 TX PATH
G. COMMON TX/RX PATH

4. TROUBLE SHOOTING
- 76 -

4.3 Checking TCXO Block
The output frequency (26MHz) of TCXO (X184) is used as the reference one of PMB5712

Schematic of the Crystal Part (26MHz)
26MHz
1XXA26000FBA X184
3
2
4
1
VCONT
VCC
GND
OUT
C184
22n
C185
10n
TP2
Schematic of the Crystal Part (26MHz)
TP1
TP1
TP2
4. TROUBLE SHOOTING
- 77 -
Check TP1
VCC of TCXO
1.7V VCC 1.9V Check the PMB5712
No
Yes
Check TP2
26 MHz Signal
Check soldering and
components
No
Yes
TCXO is OK
4. TROUBLE SHOOTING
- 78 -
4.4 Checking WCDMA Block
START
Check TCXO Block
Check RF Switch (M/S)
Check TX/RX Level
Re-download & Cal
Change the Board
4. TROUBLE SHOOTING
- 79 -
4.4.1. Checking RF TX Level
Test Point (TX Level)
TP3
TP4
TP2
TP1
4. TROUBLE SHOOTING
- 80 -
100p C105
C115
10n
DNI
L105
L102 2.2n
L114
3n
C114
27p
DNI
L143
C112 10p
L158 1.5n
DNI
L112
L111
DNI
C123
1p
VBAT
DNI
L169
1.5n L147
L159
DNI
1.5n L168
L148
DNI
L127 1n
L138
DNI
L122 2.2n
L128
DNI
L110 4.7n
33p C163
DNI
L162
C109
1.8p
L113
10n
33p C151
L141
DNI
B40761DY2045L
U121
9
5
7
5
9
4
5
5
3
5
1
5
0
5
40
39
38
37
4
4
3
4
2
4
1
4
8
4
7
4
6
4
5
4
3
3
4
3
5
3
6
3
2
3
1
3
0
3
9
2
8
2
5
1
3
1
2
1
10
8
6
5
4
2
52
54
14
58
60
56
27
26
25
24
17
16
21
20
19
18
23
22
1 3 1
1
7 9
1
d
n
a
B
-
x
T
2
d
n
a
B
-
x
T
4
d
n
a
B
-
x
T
5
d
n
a
B
-
x
T
8
d
n
a
B
-
x
T
Rx-GSM1800_1
Rx-GSM1800_2
Rx-Band1_1
Rx-Band1_2
Rx-Band2_1
Rx-Band2_2
Rx-Band4_1
Rx-Band4_2
Rx-Band5_1
Rx-Band5_2
Rx-Band8_1
Rx-Band8_2
ANT-GSM1800
ANT-Band1
ANT-Band2
ANT_Band4
ANT-Band5
ANT-Band8
GND1
GND2
GND3
GND4
GND5
GND6
7
D
N
G
8
D
N
G
9
D
N
G
0
1
D
N
G
1
1
D
N
G
2
1
D
N
G
3
1
D
N
G
4
1
D
N
G
8
1
D
N
G
7
1
D
N
G
6
1
D
N
G
5
1
D
N
G
7
2
D
N
G
8
2
D
N
G
9
2
D
N
G
0
3
D
N
G
3
2
D
N
G
4
2
D
N
G
5
2
D
N
G
6
2
D
N
G
GND19
GND20
GND21
GND22
2
3
D
N
G
3
3
D
N
G
4
3
D
N
G
5
3
D
N
G
1
3
D
N
G
6
3
D
N
G
7
3
D
N
G
MS-156C
SW102
4 3
2
1
ANT COMMON
G3 G4
C133
DNI
33p C121
C153 22p
100n
L104
DNI
C101 C103
DNI
FL111
BGSF18DM20
1
2
20
5
1
19
0
1
18
6
1
8
1
1
7 9
6
5 2
1
4
3
3
1
2
4
1
1
7
1
D
D
V
TRX_3
L
C
S
TRX_2
OI
D
S
TRX_1
1
D
N
G
6
D
N
G
2
D
N
G
HB_TX
4
D
N
G
3
D
N
G
T
N
A
LB_TX
D
D
V
L
TRX_6
5
D
N
G
TRX_5
M
R
F
TRX_4
D
N
G
P
DNI
L116
33p C116 33p C117
L131 1.2n
SW101
20279-001E-01
G1
ANT G2
L142 2.2n
L161 2.2n
L152
47n
1n L137
C132 33p
RX_B1_H2
RX_B2_M2
RX_B5_L2X
RX_B8_L1X
W
R
D
_
I
P
S
S
S
_
I
P
S
K
L
C
_
I
P
S
I
P
S
V
GSM_HB_TX
GSM_LB_TX
RX_GSM1800_M1
RX_GSM1800_M1X
RX_B8_L1
RX_B5_L2
RX_B2_M2X
RX_B1_H2X
RX_B4_H1X
RX_B4_H1
B2/GSM1900
B4
B5/GSM850
B8/EGSM
GSM1800_RX
B1
Removed (Rev.B)
* Global : 2.2nH
* AT&T, TMUS : 100pF
<L102>
Rev.1.1
0.1u
C173
RF6260
U171
7
1
8
1
9
1
0
2
21
10
11
2
1
13
4
1
15
16
9
8
7
6
5
4
3
2
1
B8_TX
B5_TX
GSM_LB_TX
B2_TX
B1_TX
GSM_HB_TX
B4_TX
HB_RFIN
SPI_SS
VCC
LB_RFIN
I
P
S
V
NC
D
N
G
_
I
P
S
SPI_CLK
SPI_DRW
GND
S
O
M
C
V
M
A
_
B
F
T
A
B
V
T
U
O
_
F
R
C171
220n
C175
1p
L179 1.8n
VBAT_PAM
VBAT
DNI
L180
L176 2.7n
DNI
C178
L177
DNI
C172
0.1u
SPI_DRW
SPI_SS
SPI_CLK
I
P
S
V
F
R
_
A
P
T
E
D
_
W
O
P
_
A
P
TX_H
TX_L
GSM_HB_TX
GSM_LB_TX
T
U
O
_
P
C
Removed (Rev.E)
TP1
TP2
TP2
TP2
TP2
TP2
TP3
TP3
TP3
TP3
TP3
TP4
TP4
Schematic of WCDMA Band1,2,4,5,8 Tx Block
4. TROUBLE SHOOTING
- 81 -
Check Power Level
Check TP1 Over 21dBm? RF Tx Level is OK
Yes
No
Check PMB5712
Check TP2 Over 21dBm? Check Separator
Yes
No
Check TP3 Over 21dBm? Check Duplexer
Yes
No
Check TP4 Over 6dBm? Check PAM
Yes
No
For testing, Max power output is needed.
4. TROUBLE SHOOTING
- 82 -
4.4.2. Checking RF Rx Level
Test Point (RF Rx Level)
TP2
TP1
4. TROUBLE SHOOTING
- 83 -
100p C105
C115
10n
DNI
L105
L102 2.2n
L114
3n
C114
27p
DNI
L143
C112 10p
L158 1.5n
DNI
L112
L111
DNI
C123
1p
VBAT
DNI
L169
1.5n L147
L159
DNI
1.5n L168
L148
DNI
L127 1n
L138
DNI
L122 2.2n
L128
DNI
L110 4.7n
33p C163
DNI
L162
C109
1.8p
L113
10n
33p C151
L141
DNI
B40761DY2045L
U121
9
5
7
5
9
4
5
5
3
5
1
5
0
5
40
39
38
37
4
4
3
4
2
4
1
4
8
4
7
4
6
4
5
4
3
3
4
3
5
3
6
3
2
3
1
3
0
3
9
2
8
2
5
1
3
1
2
1
10
8
6
5
4
2
52
54
14
58
60
56
27
26
25
24
17
16
21
20
19
18
23
22
1 3 1
1
7 9
1
d
n
a
B
-
x
T
2
d
n
a
B
-
x
T
4
d
n
a
B
-
x
T
5
d
n
a
B
-
x
T
8
d
n
a
B
-
x
T
Rx-GSM1800_1
Rx-GSM1800_2
Rx-Band1_1
Rx-Band1_2
Rx-Band2_1
Rx-Band2_2
Rx-Band4_1
Rx-Band4_2
Rx-Band5_1
Rx-Band5_2
Rx-Band8_1
Rx-Band8_2
ANT-GSM1800
ANT-Band1
ANT-Band2
ANT_Band4
ANT-Band5
ANT-Band8
GND1
GND2
GND3
GND4
GND5
GND6
7
D
N
G
8
D
N
G
9
D
N
G
0
1
D
N
G
1
1
D
N
G
2
1
D
N
G
3
1
D
N
G
4
1
D
N
G
8
1
D
N
G
7
1
D
N
G
6
1
D
N
G
5
1
D
N
G
7
2
D
N
G
8
2
D
N
G
9
2
D
N
G
0
3
D
N
G
3
2
D
N
G
4
2
D
N
G
5
2
D
N
G
6
2
D
N
G
GND19
GND20
GND21
GND22
2
3
D
N
G
3
3
D
N
G
4
3
D
N
G
5
3
D
N
G
1
3
D
N
G
6
3
D
N
G
7
3
D
N
G
MS-156C
SW102
4 3
2
1
ANT COMMON
G3 G4
C133
DNI
33p C121
C153 22p
100n
L104
DNI
C101 C103
DNI
FL111
BGSF18DM20
1
2
20
5
1
19
0
1
18
6
1
8
1
1
7 9
6
5 2
1
4
3
3
1
2
4
1
1
7
1
D
D
V
TRX_3
L
C
S
TRX_2
OI
D
S
TRX_1
1
D
N
G
6
D
N
G
2
D
N
G
HB_TX
4
D
N
G
3
D
N
G
T
N
A
LB_TX
D
D
V
L
TRX_6
5
D
N
G
TRX_5
M
R
F
TRX_4
D
N
G
P
DNI
L116
33p C116 33p C117
L131 1.2n
SW101
20279-001E-01
G1
ANT G2
L142 2.2n
L161 2.2n
L152
47n
1n L137
C132 33p
RX_B1_H2
RX_B2_M2
RX_B5_L2X
RX_B8_L1X
W
R
D
_
I
P
S
S
S
_
I
P
S
K
L
C
_
I
P
S
I
P
S
V
GSM_HB_TX
GSM_LB_TX
RX_GSM1800_M1
RX_GSM1800_M1X
RX_B8_L1
RX_B5_L2
RX_B2_M2X
RX_B1_H2X
RX_B4_H1X
RX_B4_H1
B2/GSM1900
B4
B5/GSM850
B8/EGSM
GSM1800_RX
B1
Removed (Rev.B)
* Global : 2.2nH
<L102>
Rev.1.1
TP1
TP2
TP2
TP2
TP2
TP2
Schematic of WCDMA Band1,2,4,5,8 Rx Block
4. TROUBLE SHOOTING
- 84 -
Set the phone Rx is ON
Check TP1 Signal exist? Check RF Switch (M/S)
No
Yes
Check Duplexer, PMB5712
Check TP2
Signal exist?
Check Separator
No
Yes
4. TROUBLE SHOOTING
- 85 -
4.4 Checking WCDMA Block
START
Check TCXO Block
Check RF Switch (M/S)
Check TX/RX Level
Re-download & Cal
Change the Board
4. TROUBLE SHOOTING
- 86 -
4.5.1 Checking RF Tx Block
TP3
TP1
TP2
4. TROUBLE SHOOTING
- 87 -
100p C105
C115
10n
DNI
L105
L102 2.2n
L114
3n
C114
27p
DNI
L143
C112 10p
L158 1.5n
DNI
L112
L111
DNI
C123
1p
VBAT
DNI
L169
1.5n L147
L159
DNI
1.5n L168
L148
DNI
L127 1n
L138
DNI
L122 2.2n
L128
DNI
L110 4.7n
33p C163
DNI
L162
C109
1.8p
L113
10n
33p C151
L141
DNI
B40761DY2045L
U121
9
5
7
5
9
4
5
5
3
5
1
5
0
5
40
39
38
37
4
4
3
4
2
4
1
4
8
4
7
4
6
4
5
4
3
3
4
3
5
3
6
3
2
3
1
3
0
3
9
2
8
2
5
1
3
1
2
1
10
8
6
5
4
2
52
54
14
58
60
56
27
26
25
24
17
16
21
20
19
18
23
22
1 3 1
1
7 9
1
d
n
a
B
-
x
T
2
d
n
a
B
-
x
T
4
d
n
a
B
-
x
T
5
d
n
a
B
-
x
T
8
d
n
a
B
-
x
T
Rx-GSM1800_1
Rx-GSM1800_2
Rx-Band1_1
Rx-Band1_2
Rx-Band2_1
Rx-Band2_2
Rx-Band4_1
Rx-Band4_2
Rx-Band5_1
Rx-Band5_2
Rx-Band8_1
Rx-Band8_2
ANT-GSM1800
ANT-Band1
ANT-Band2
ANT_Band4
ANT-Band5
ANT-Band8
GND1
GND2
GND3
GND4
GND5
GND6
7
D
N
G
8
D
N
G
9
D
N
G
0
1
D
N
G
1
1
D
N
G
2
1
D
N
G
3
1
D
N
G
4
1
D
N
G
8
1
D
N
G
7
1
D
N
G
6
1
D
N
G
5
1
D
N
G
7
2
D
N
G
8
2
D
N
G
9
2
D
N
G
0
3
D
N
G
3
2
D
N
G
4
2
D
N
G
5
2
D
N
G
6
2
D
N
G
GND19
GND20
GND21
GND22
2
3
D
N
G
3
3
D
N
G
4
3
D
N
G
5
3
D
N
G
1
3
D
N
G
6
3
D
N
G
7
3
D
N
G
MS-156C
SW102
4 3
2
1
ANT COMMON
G3 G4
C133
DNI
33p C121
C153 22p
100n
L104
DNI
C101 C103
DNI
FL111
BGSF18DM20
1
2
20
5
1
19
0
1
18
6
1
8
1
1
7 9
6
5 2
1
4
3
3
1
2
4
1
1
7
1
D
D
V
TRX_3
L
C
S
TRX_2
OI
D
S
TRX_1
1
D
N
G
6
D
N
G
2
D
N
G
HB_TX
4
D
N
G
3
D
N
G
T
N
A
LB_TX
D
D
V
L
TRX_6
5
D
N
G
TRX_5
M
R
F
TRX_4
D
N
G
P
DNI
L116
33p C116 33p C117
L131 1.2n
SW101
20279-001E-01
G1
ANT G2
L142 2.2n
L161 2.2n
L152
47n
1n L137
C132 33p
RX_B1_H2
RX_B2_M2
RX_B5_L2X
RX_B8_L1X
W
R
D
_
I
P
S
S
S
_
I
P
S
K
L
C
_
I
P
S
I
P
S
V
GSM_HB_TX
GSM_LB_TX
RX_GSM1800_M1
RX_GSM1800_M1X
RX_B8_L1
RX_B5_L2
RX_B2_M2X
RX_B1_H2X
RX_B4_H1X
RX_B4_H1
B2/GSM1900
B4
B5/GSM850
B8/EGSM
GSM1800_RX
B1
Removed (Rev.B)
* Global : 2.2nH
<L102>
Rev.1.1
0.1u
C173
RF6260
U171
7
1
8
1
9
1
0
2
21
10
11
2
1
13
4
1
15
16
9
8
7
6
5
4
3
2
1
B8_TX
B5_TX
GSM_LB_TX
B2_TX
B1_TX
GSM_HB_TX
B4_TX
HB_RFIN
SPI_SS
VCC
LB_RFIN
I
P
S
V
NC
D
N
G
_
I
P
S
SPI_CLK
SPI_DRW
GND
S
O
M
C
V
M
A
_
B
F
T
A
B
V
T
U
O
_
F
R
C171
220n
C175
1p
L179 1.8n
VBAT_PAM
VBAT
DNI
L180
L176 2.7n
DNI
C178
L177
DNI
C172
0.1u
SPI_DRW
SPI_SS
SPI_CLK
I
P
S
V
F
R
_
A
P
T
E
D
_
W
O
P
_
A
P
TX_H
TX_L
GSM_HB_TX
GSM_LB_TX
T
U
O
_
P
C
Removed (Rev.E)
TP1
TP2
TP3
TP3
Schematic of GSM850/EGSM/DCS/PCS Tx Block
TP2
4. TROUBLE SHOOTING
- 88 -
For testing, Max power output is needed
Chenck Power Level
Check TP1
Over 31 dBm(GSM850, EGSM)
Over 28 dBm(DCS, PCS)
RF TX Level is OK
Yes
No
Check PMB5712
Check TP2
Over 31 dBm(GSM850, EGSM)
Over 28 dBm(DCS, PCS)
Check Separator
Yes
No
Check TP3
Over 12 dBm
Check PAM
Yes
No
No
4. TROUBLE SHOOTING
- 89 -
4.5.2 Checking RF Rx Block
TP2
TP1
4. TROUBLE SHOOTING
- 90 -
100p C105
C115
10n
DNI
L105
L102 2.2n
L114
3n
C114
27p
DNI
L143
C112 10p
L158 1.5n
DNI
L112
L111
DNI
C123
1p
VBAT
DNI
L169
1.5n L147
L159
DNI
1.5n L168
L148
DNI
L127 1n
L138
DNI
L122 2.2n
L128
DNI
L110 4.7n
33p C163
DNI
L162
C109
1.8p
L113
10n
33p C151
L141
DNI
B40761DY2045L
U121
9
5
7
5
9
4
5
5
3
5
1
5
0
5
40
39
38
37
4
4
3
4
2
4
1
4
8
4
7
4
6
4
5
4
3
3
4
3
5
3
6
3
2
3
1
3
0
3
9
2
8
2
5
1
3
1
2
1
10
8
6
5
4
2
52
54
14
58
60
56
27
26
25
24
17
16
21
20
19
18
23
22
1 3 1
1
7 9
1
d
n
a
B
-
x
T
2
d
n
a
B
-
x
T
4
d
n
a
B
-
x
T
5
d
n
a
B
-
x
T
8
d
n
a
B
-
x
T
Rx-GSM1800_1
Rx-GSM1800_2
Rx-Band1_1
Rx-Band1_2
Rx-Band2_1
Rx-Band2_2
Rx-Band4_1
Rx-Band4_2
Rx-Band5_1
Rx-Band5_2
Rx-Band8_1
Rx-Band8_2
ANT-GSM1800
ANT-Band1
ANT-Band2
ANT_Band4
ANT-Band5
ANT-Band8
GND1
GND2
GND3
GND4
GND5
GND6
7
D
N
G
8
D
N
G
9
D
N
G
0
1
D
N
G
1
1
D
N
G
2
1
D
N
G
3
1
D
N
G
4
1
D
N
G
8
1
D
N
G
7
1
D
N
G
6
1
D
N
G
5
1
D
N
G
7
2
D
N
G
8
2
D
N
G
9
2
D
N
G
0
3
D
N
G
3
2
D
N
G
4
2
D
N
G
5
2
D
N
G
6
2
D
N
G
GND19
GND20
GND21
GND22
2
3
D
N
G
3
3
D
N
G
4
3
D
N
G
5
3
D
N
G
1
3
D
N
G
6
3
D
N
G
7
3
D
N
G
MS-156C
SW102
4 3
2
1
ANT COMMON
G3 G4
C133
DNI
33p C121
C153 22p
100n
L104
DNI
C101 C103
DNI
FL111
BGSF18DM20
1
2
20
5
1
19
0
1
18
6
1
8
1
1
7 9
6
5 2
1
4
3
3
1
2
4
1
1
7
1
D
D
V
TRX_3
L
C
S
TRX_2
OI
D
S
TRX_1
1
D
N
G
6
D
N
G
2
D
N
G
HB_TX
4
D
N
G
3
D
N
G
T
N
A
LB_TX
D
D
V
L
TRX_6
5
D
N
G
TRX_5
M
R
F
TRX_4
D
N
G
P
DNI
L116
33p C116 33p C117
L131 1.2n
SW101
20279-001E-01
G1
ANT G2
L142 2.2n
L161 2.2n
L152
47n
1n L137
C132 33p
RX_B1_H2
RX_B2_M2
RX_B5_L2X
RX_B8_L1X
W
R
D
_
I
P
S
S
S
_
I
P
S
K
L
C
_
I
P
S
I
P
S
V
GSM_HB_TX
GSM_LB_TX
RX_GSM1800_M1
RX_GSM1800_M1X
RX_B8_L1
RX_B5_L2
RX_B2_M2X
RX_B1_H2X
RX_B4_H1X
RX_B4_H1
B2/GSM1900
B4
B5/GSM850
B8/EGSM
GSM1800_RX
B1
Removed (Rev.B)
* Global : 2.2nH
<L102>
Rev.1.1
TP1
TP2
TP2
TP2
TP2
TP2
Schematic of GSM850/EGSM/DCS/PCS Rx Block
4. TROUBLE SHOOTING
- 91 -
Set the phone Rx is On
Check TP1 Signal exist? Check RF Switch (M/S)
No
Yes
Check Duplexer, PMB5712
Check TP2 Signal exist? Check Separator
No
Yes
4. TROUBLE SHOOTING
- 92 -

4.6. GPS/WIFI/BT RF components
4.6.1 GPS Module
GPS chip is made by Broadcom and name is BCM4751

U1831
GPS LDO
U1801
GPS LNA
FL1801
Separator
X1821
GPS TCXO
U1811
GPS IC
4. TROUBLE SHOOTING
- 93 -

4.6.2 Wifi/BT/FM Module

FL1901
Filter
U1902
RF3482
U1901
WL1271
4. TROUBLE SHOOTING
- 94 -
4.7 GPS/WIFI/BT SIGNAL PATH
4.7.1 GPS Signal Path
ANT
4. TROUBLE SHOOTING
- 95 -
4.7.2 Wi/BT/FM Signal Path
ANT
Wi Signal
BT Signal
FM Signal
4. TROUBLE SHOOTING
- 96 -

4.9 Power ON Troubleshooting
The main power source of LGP920 is provided by 2 chips which are TWL6030 and XMM6260 (Communication
processor). Since XMM6260 only powers up normally when OMAP4430 is properly powered therefore, TWL6030
is the actual one to take look at.
Power ON sequence of LGP920 is,
PWR key press PM_ON_SW goes low (R1195, TWL6030 PWRON_ pin(L5)) TWL6030 Power Up
SENSOR_3.0V VSEL_1.8V (L803) VSEL_VMEM (L806) VSEL_2.1V (L804) VSEL_1.29V (L805)
VPMIC_VCXIO VSEL_VCORE3 (L802) VCORE1_OMAP_MPU (L800)
VCORE2_OMAP_IVAUD (L801) goes high
(if network connected VSD1_1.3V VSD2_1.8V)
TWL6030 Power on sequence
External
peripherals
Phoenix Power
Device
OMAP4430
External Power IC: Enable
LPDDR2: VDD1
CDC3S04: VDD_DIG
All peripherals: 1.8v lOs and cores
LPDDR2: VDD2
External Power IC: Enable
Phoenix Audio: TBD
LPPDDR2: VDDCA, VDDQ
All peripherals: 1.2v lOs and cores
CDC3S04: IOs
Phoenix Power IC tum
on time up to
REGEN1/2
V1V8
VMEM@1.35V or
1.2V wrt boot mode
SYSTEM
V2V1
V2V29@1.2V
VCXIO
VCORE3
VCORE1
VCORE2
VDDS_1P8
VDDS_DV_xxx@1.8v
VDDA_BG_VBB,
VDD_LDO_SRAM
VDDCA_LPDDR2
VDDQ_LPDDR2
VDD_LDO_EMU_WKUP
VDDS_1P2
VDDS_DV_xxx@1.2V
VDDS_DPLL, VDDA_DSI
1
/2
VDDA_CSI2
1
/2, VDDA_UNI1,
VDDA_USB1OTG_1P8V,
VDDS_1P8_FREF
VDD_CORE
VDD_DLL0/1_LPDDR21/2
VDD_MPU
VDD_IVA_AUDIO
Power On Event: battery plug, power on button, remote power on, RTC wakeup,
battery Voltage > Vbatmin thresold during charge
7ms(after debounce) - Phoenix intermal power up sequence
VBAT
1.8V
500us
500us
1.35V if Phoenix BOOT1=0or1.2V if BOOT1=1
500us
1.8V
500us
2.1V
500us
1.2V
500us
1
2
3
4
5
6
7
2
3
8
9
4.8
4. TROUBLE SHOOTING
- 97 -
X-GOLD 626
PMU Sub-System
PMU Behavior Confidential
Product Specification 13 Revision 2.22, 2010-05-10
Hardware Description
Figure 4 PMU Start-up / Shut-down Timing
2.1 PAD Timing
Figure 5 PAD Control Timing
2.2 PMU control
The PMU can be fully controlled by software using a serial interface (SPI). For timing critical configurations the
PMU additionally offers a parallel interface to the baseband for real-time control of features like voltage scaling,
DCDC mode control and stand-by.
Shut-down
VBAT
LPBG
LPMU
LRTC
ON event
ON event
detected
High Precition Bandgap
Step-Down 1
REF_CLK_EN
BaseBand reset
20s
Step-Down 2
LUSB_PD
LUSB_ANA
LUSB_IO
LIO_12
Reset
XX
XX
LPMU@1.3V
LPMU@1.1V
LPLL
2180s 2560s 1500s 1520s 200s
200s
200s
200s
20s 16ms
20s
20s
20s
Start-up Battery insertion
LPMU
LRTC
Power on Reset
ON1_i
ON2_N_i
RESET_BB_N_i
TRIG_B_i
RESET_PWRDWN
VSD2
TM_EN
REF_CLK_EN_o
BaseBand reset_n
pad active
pad active
pad active
pad active
pad active
pad active
pad active
pad active
SYSTEM OFF SYSTEM ON PMU ISO Mode Battery removal
V
R
T
C

S
u
p
p
l
i
e
d

P
a
d
s
P
M
U

i
n
p
u
t
s
P
M
U

o
u
t
p
u
t
s
V
R
T
C

S
u
p
p
l
i
e
d

P
a
d
s
undefined
POR enables
VRTC pads
POR enables
RESET pad
self enabling
pad
XMM6260 PMU Power on sequence
4. TROUBLE SHOOTING
- 98 -
START
Battery voltage higher than 3.5V? Change or charging the Battery
No
Yes
Change the main board
Press PWR Key
Check TP1 high to low?
Check the Power Key
No
Yes
Power Key is damaged? Change the Power Key
No
Yes
Check TP9 Clock 32.768Khz
Clock Range is O.K?
Change the TCXO and X-tal
No
Yes
Check TP voltage
0.6V < TP2, 3, 4 < 1.3V
TP5 1.8V
TP6 2.1V
TP7, 8 1.2V
Voltage Range is O.K?
Change the Main board
Yes
No
4. TROUBLE SHOOTING
- 99 -
TOP view of LGP920
Power Key of LGP920
TP1 (R1195),
PWR_ON_SW
TP9 (X800), CLOCK
TP6 (L804), VSEL_2.1V
TP7 (L805), VSEL1.29V
TP5 (L803), VSEL_1.8V
TP3 (L801), VCORE2_OMAP_IVAUD TP8 (L806), VSEL_VMEM
TP2 (L800),
VCORE1_OMAP_MPU
TP4 (L802),
VSEL_VCORE3
4. TROUBLE SHOOTING
- 100 -
R1195
1K
G
5
T
S
0
_
5
B
9
D
S
E
5
9
1
1
D
Z
CN1195
2
1
PWR_ON_SW
Added (Rev.E)
TP1
10u C813
R12
T12
R11
T11
R13
R10
T10
H15
H16
J15
J16
G16
K15
K16
E15
E16
D15
D16
F16
C15
C16
M15
L16
M16
P15
P16
N16
L15
R14
T14
T13
H2
H1
J2
J1
G1
K2
K1
R5
T5
R6
T6
R4
R7
T7
M2
L1
M1
P2
P1
N1
L2
R3
T3
T4
VCORE1_IN_B1
VCORE1_IN_B2
VCORE1_IN_B3
VCORE1_FDBK
VCORE1_SW_B1
VCORE1_SW_B2
VCORE1_SW_B3
VCORE1_GND_B1
VCORE1_GND_B2
VCORE1_GND_B3
VCORE2_IN_B1
VCORE2_IN_B2
VCORE2_FDBK
VCORE2_SW_B1
VCORE2_SW_B2
VCORE2_GND_B1
VCORE2_GND_B2
VCORE3_IN_B1
VCORE3_IN_B2
VCORE3_FDBK
VCORE3_SW_B1
VCORE3_SW_B2
VCORE3_GND_B1
VCORE3_GND_B2
V1V8_IN_B1
V1V8_IN_B2
V1V8_IN_B3
V1V8_FDBK
V1V8_SW_B1
V1V8_SW_B2
V1V8_SW_B3
V1V8_GND_B1
V1V8_GND_B2
V1V8_GND_B3
V2V1_IN_B1
V2V1_IN_B2
V2V1_FDBK
V2V1_SW_B1
V2V1_SW_B2
V2V1_GND_B1
V2V1_GND_B2
V1V29_IN_B1
V1V29_IN_B2
V1V29_FDBK
V1V29_SW_B1
V1V29_SW_B2
V1V29_GND_B1
V1V29_GND_B2
VMEM_IN_B1
VMEM_IN_B2
VMEM_FDBK
VMEM_SW_B1
VMEM_SW_B2
VMEM_GND_B1
VMEM_GND_B2
FB803 220
120 FB805
VSEL_1.8V
220 FB800
C817
4.7u
L804 0.47u
L806 0.47u
L800 0.68u
0.47u L801
L802 0.47u
L805 0.47u
L803 0.68u
VCORE1_OMAP_MPU
C831 10u
6
2
8
C
u
7
.
4
C828 10u
4.7u
C824
120 FB801
VSEL_VMEM
C825 10u
4.7u
C819
120 FB804
VSEL_1.29V
C821 10u
VSEL_2.1V
9
2
8
C
u
7
.
4
10u C818
C814
4.7u
120 FB802
VCORE2_OMAP_IVAUD
VSEL_VCORE3
C815 10u
C808
4.7u
FB806 120
VBAT
VBAT
VBAT
VBAT
VBAT
VBAT
VBAT
TP2
TP3
TP4
TP5
TP6
TP7
TP8
4. TROUBLE SHOOTING
- 101 -

4.10 Charger Troubleshooting
LGP920 micro USB is located at the side of the terminal set, charging current flows from external micro USB
Connector directly to the battery. The charger IC maximum charging current is set around 945mA

Charging Procedure
- Connect TA or u-USB Cable
- Control the charging current by RT9524 IC
- Charging current flows into the battery

Troubleshooting Check Point
- Connection of TA or USB Cable
- Charging current path (RT9524)
- Battery

During charging operation test point signal goes low and when stop charging goes high.

4.9
4. TROUBLE SHOOTING
- 102 -
Check the Connection
of uUSB and battery
Connection OK?
No
Yes
Is the uUSB Cable
voltage 4.8V (or 5.0V)
No
Yes
Is it charging properly
After turning on?
START
Change I/O connector
Change TA (or u-USB cable)
END
Yes
No
TP Signal is correct? END
Yes
No
Change the Main Board
4. TROUBLE SHOOTING
- 103 -
During charging operation test point signal goes low and when stop charging goes high.
TP809, CHG_EN_SET/
VCHG USB_VBUS VBAT
)
%
1
(
8
2
8
R
s
m
h
o
K
2
(0603)
10K
R821
1u
C811
C809
1u
7
2
8
R
)
%
1
(
0
6
5
VSEL_1.8V
U801
RT9524
6 5
7 4
8 3
9 2
10 1
11
PGND
VIN BATT
ISET PGB
GND1 CHGSB
LDO GND2
IEOC EN_SET
TP809
1u
C810
CHG_STATUS/
CHG_EN_SET/
USB_VBUS
VCHG
1mm 1mm
0.15mm
(Rev.C)
Removed Res.
TP809 : Charging Enable Signal
4. TROUBLE SHOOTING
- 104 -
Cable is inserted? Insert cable
No
Yes
Change the mainboard
TP1 is 5V? Check MUIC or Charger IC
No
Yes
USB_D+is 3.3V? Check U811
No
Yes
START

4.11 USB Trouble shooting
The sequence of LGP920USB is,
USB connected to LGP920 USB_VBUS(C816) goes to 5V USB_D+ go to 3.3V USB_DATA is triggered
USB work
Block Diagram of USB & UART connection is shown below

Check MUIC or
Charger IC
Insert cable
NO
C816 is 5V?
YES
YES
Cable is inserted?
NO
Check U8!!

NO
USB_D+ is 3.3V?
YES
Start
4.10
4. TROUBLE SHOOTING
- 105 -
ZD801
PSD12-LF
VSEL_1.8V
ESD9B5_0ST5G
ZD802
CN801
GU077-5P-SD-E1500
11
10
9
5
4
3
2
1
8
7
6
VBUS
D-
D+
ID
GND
NFM18PC104R1C3
FL800
IN OUT
GND1 GND2
56K
R850
C827
1u
2.2K R848
C822
0.1u
C823
1u
C820
100n
R854
1.5K
U811
MAX14526EEWP+TCC6
2
B
1
C
2
C
C3 A2
C4
D3
D1 D4
A1
B1
A3
B4 B3
B5 A5
C5 A4
D5 D2
BAT VB
DN1 COMN1
DP2 COMP2
U1 UID
U2
RES
MIC
AUD1 CAP
AUD2
GND
ISET IC
L
C
S
A
D
S
T
N
I
R853
1.5K
VBAT
I2C3_SCL
I2C3_SDA
VCHG
MUIC_INT/
USB_DM_OMAP
USB_DP_OMAP
UART_RX
UART_TX
USB_ID
USB_DP
USB_DM
Added (Rev.B)
1mm
90ohm matching !!
90ohm matching !!
Changed (Rev.C)
Added (P925 Rev.A)
Changed (Rev.E,1.1)
C3
B5
B4
USBA0_OTG_DM/UART3_TX_IRTX/UART2_TX/GPIO_180/SAFE_MODE
USBA0_OTG_DP/UART3_RX_IRRX/UART2_RX/GPIO_179/SAFE_MODE
USBA0_OTG_CE
USB_DM_OMAP
USB_DP_OMAP
USB
MUIC
TP1 (USB_VBUS)
4. TROUBLE SHOOTING
- 106 -
TP1 (USB_VBUS)
U811 (MUIC MAXIM14526)
4. TROUBLE SHOOTING
- 107 -
4.11 Audio trouble
4.11.1 Speaker troubleshooting
Speaker control signals are generated by OMAP4430 (U500) and Power is supplied byTWL6040(U901).
Is speaker sound OK? END
Yes
No
Change the main ANT module.
Is speaker sound OK?
END
Yes
No
Change the RF key PCB.
END
Yes
No
Change the TWL6040(U901)
END
Yes
No
START
Check the speaker sound and
reconnect the main ANT module
4. TROUBLE SHOOTING
- 108 -

RF Key PCB
TWL6040
TWL6040
4. TROUBLE SHOOTING
- 109 -
4.11.2 Receiver troubleshooting
Receiver control signals are generated by OMAP4430 (U500) and Power is supplied byTWL6040(U901).
Is receiver sound OK? END
Yes
No
Change upper module
(receiver + Top FPCB)
END
Yes
No
Change theTWL6040(U901)
END
Yes
No
START
Check the receiver sound
(loop back mode).
And reconnect Top FPCB
connector on main-board.
4. TROUBLE SHOOTING
- 110 -

TWL6040
Upper module :
Receiver + Top FPCB
Top_FPCB BTB
connector
Top_FPCB BTB
connector
TWL6040
4. TROUBLE SHOOTING
- 111 -
4.11.3 Main MIC troubleshooting
Main MIC signal is generate by MEMS MIC on RF-key PCB
Check the MIC hole to
make clear the voice signal path.
Is vioce signal OK?
END
Yes
No
Change the RF-key PCB.
And check the voice siganl.
Is voice signal OK?
END
Yes
No
Change the TWL6040(U901)
Is the voice siganl OK?
END
Yes
No
START
Check the MIC signal by loop-back test
or voice recorder
4. TROUBLE SHOOTING
- 112 -

RF Key PCB
TWL6040
TWL6040
4. TROUBLE SHOOTING
- 113 -
4.11.4 SUB MIC troubleshooting
Sub MIC signal is generate by MEMS MIC on Top FPCB
Is vioce signal OK?
END
Yes
No
Change the Top FPCB.
Is voice signal OK
END
Yes
No
Change the TWL(U901)
Is the voice signal OK?
END
Yes
No
START
Check the MIC signal by loop-back test
or voice recorder
4. TROUBLE SHOOTING
- 114 -

TWL6040
Top FPCB
TWL6040
4. TROUBLE SHOOTING
- 115 -
4.11.5 Ear-MIC troubleshooting
Ear MIC control signal is generate by TWL6040 and OMAP4430.
- Disable to recognize headset insert
Check the 3.5pi headest FPCB
BtoB connector or change that FPCB
to new one.
No
Yes
START
Check the left signal and
detectionline became short when
headset inserted
No
END
Check the top FPCB BtoB
Connector or change that FPCB to
new one.
Yes
END
Change the P-channel MOCFET
No
Detecting headset insert well?
Change the TWL6040.
Detecting headset insert well?
No
END
Yes
END
Yes
Yes
No
4. TROUBLE SHOOTING
- 116 -
C1175
0.1u 0.1u
C1176 R1176
10K
G
5
T
S
0
_
5
B
9
D
S
E
ZD1172
VSEL_1.8V
200K
R1174
C1177
33p
VSMF05LCC
D1175
4
3
5
2
6
1
R1173 1M
1800 FB1175
1800 FB1176
FB1177 1800
FB1173
1800
L1172
DNI
C1171 1n
18 17
19 16
20 15
21 14
22 13
23 12
24 11
25 10
26 9
27 8
R1172
DNI
C1172
DNI
Q1173
2SJ347
2
3
1
G
D
S
FM_ANT
AUD_RCV_N
AUD_RCV_P
EAR_L
EAR_R
EAR_SENSE
Added (Rev.E)
Changed (Rev.1.0)
Added (925 Rev.D)
Check the left signal and detection line became short when headset inserted
TP2, FB1176
TP1, FB1173
TP1
TP2
4. TROUBLE SHOOTING
- 117 -
Is vioce signal OK?
END
Yes
No
Change the Top FPCB.
Is voice signal OK
END
Yes
No
Change the TWL(U901)
Is the voice signal OK?
END
Yes
No
START
- Disable to using headset MIC or headset receiver when voice call
4. TROUBLE SHOOTING
- 118 -
4.12 Camera trouble(5M/VGA)
4.12.1 Main 5M AF Camera troubleshooting
5M camera control signals are generated by OMAP4430(U500), and Power is supplied by LP8720(U1201)
Check the camera conn. and
revonnect thr camera
Camera is OK?
No
END
Yes
START
Yes
Check the camera signals MCLK(TP4),
MIPI_CLK(TP5), MIPI_DATA(TP6)
Yes
Change the camera
No
Check IOVDD(TP1),
DVDD(TP2), AVDD(TP3)
Camera is OK? END
Yes
No
4. TROUBLE SHOOTING
- 119 -
C1212
10u
U1201
LP8720TLX
1
B
E1 C2
B2
C1
E2
D3
C3
A1 C4
B3
A3
D4
E3
D2
B4 E4
2
A
1
D
4
A
T
T
A
B
V
2
N
I
V
1
N
I
V
VINB LDO1
FB
SW
GNDB
LDO2
IRQ_N
SDA LDO3
SCL
DVS
EN
LDO4
DEFSEL
IDSEL LDO5
D
N
G
1u
C1204
C1211
2.2u
C1205
1u
C1209
2.2u 2.2u
C1210
5M_VCM_V2V8_S
10u
C1201
5M_VCM_V2V8_P
5M_VANA_V2V7_P
VBAT
1.2V_5M_VDIG
1.8V_5M_VIO
5M_VANA_V2V7_S
2.2u
L1201
1u
C1206 C1207
1u
C1208
1u
100K
R1202
I2C3_SCL
I2C3_SDA
CAM_SUBPM_EN
Added Res. (Rev.B)
4
E

o
t

e
s
o
l
C
FL1223
ICMEF214P101M
0
1
9
8 4
7 3
6 2
5 1
P1 P5
P2 P6
P3 P7
P4 P8
1
G
2
G
CN1221
GB042-40S-H10-E3000
21 20
22 19
23 18
24 17
25 16
26 15
27 14
28 13
29 12
30 11
31 10
32 9
33 8
34 7
35 6
36 5
37 4
38 3
39 2
40 1
ICMEF214P101M
FL1222
0
1
9
8 4
7 3
6 2
5 1
P1 P5
P2 P6
P3 P7
P4 P8
1
G
2
G
1.2V_5M_VDIG
1.8V_5M_VIO
5M_VANA_V2V7_S
5M_VANA_V2V7_P
1u
C1236
4.7u
C1235
5M_VCM_V2V8_P
5M_VCM_V2V8_S
FL1221
ICMEF214P101M
0
1
9
8
7
6
5
P1
1
P5
P2
2
P6
P3
3
P7
P4
4
P8
1
G
2
G
G
5
T
S
0
_
5
B
9
D
S
E
4
2
2
1
D
Z
G
5
T
S
0
_
5
B
9
D
S
E
5
2
2
1
D
Z
0.1u
C1230 C1228
4.7u
C1229
1u
0.1u
C1237
C1231
0.1u
0.1u
C1232
0.1u
C1234
C1233
0.1u
I2C3_SCL
I2C3_SDA
I2C4_SDA
I2C4_SCL
5M_MCLK
PRIMARY_5M_RESET_N
5M_MCLK_CAM
5M_MCLK_CAM
AVDD : TP3
IOVDD : TP1
DVDD : TP2
MCLK: TP4
MIPI_CLK: TP5
MIPI_DATA: TP6
4. TROUBLE SHOOTING
- 120 -
DVDD : TP2(L1201)
AVDD : TP3(C1204)
MIPI_CLK: TP5(FL1222)
MCLK: TP4(FL1222)
MIPI_DATA: TP6(FL1223)
IOVDD : TP1(C1207)
4. TROUBLE SHOOTING
- 121 -
CN103
11 10
12 9
13 8
14 7
15 6
16 5
17 4
18 3
19 2
20 1
0.1u
C103
TWL_LDO_1.8V
TWL_LDO_2.8V
0.1u
C104
FB101
VT_CAM_RESET/
VT_CAM_PWDN
VT_0.3M_MIPI_CLK_N
VT_0.3M_MIPI_CLK_P
VT_0.3M_MCLK
I2C3_SDA
I2C3_SCL
IOVDD & DVDD : TP1(FB101)
AVDD : TP2(C103)
4.12.2 Sub Vga Camera troubleshooting
VGA camera control signals are generated by OMAP4430(U500), and Power is supplied by LP8720(U1201)
IOVDD & DVDD :
TP1(FB101)
AVDD : TP2(C103)
4. TROUBLE SHOOTING
- 122 -
Press PWR key turn the power On
Is the circuit powered?
Yes
END
Follow the Power ON
trouble shooting
No
LCD display OK?
START
No
Check LCD Power
TP1, TP2, TP3
LCD BL Boost output
TP4
No
Disconnect and reconnect
LCD connector(CN1141)
Change the LCD module
The LCD works
Yes
Yes
Yes
4.13 Main LCD trouble
4.13.1 2D LCD Display trouble
Main LCD control signals are generated by OMAP4430. Those signals path are : OMAP4430 -> LCD Module
4. TROUBLE SHOOTING
- 123 -
1u
C1143
4
3
2
1
R1191 DNI
600 FB1143
ICMEF214P101M
FL1142
0
1
9
8 4
7 3
6 2
5 1
P1 P5
P2 P6
P3 P7
P4 P8
1
G
2
G
2.8V_3D_LCD
2.8V_LCD_VCI
1.8V_LCD_IOVCC
12V_3D_LCD
FL1141
ICMEF214P101M
0
1
9
8 4
7 3
6 2
5 1
P1 P5
P2 P6
P3 P7
P4 P8
1
G
2
G
CN1141
24-5804-030-000-829+
16 15
17 14
18 13
19 12
20 11
21 10
22 9
23 8
24 7
25 6
26 5
27 4
28 3
29 2
30 1
2.8V_LCD_VCC
2
0
1
1
A
V
R
F
0
5
1
8
1
3
0
S
V
C
I
4
0
1
1
A
V
R
F
0
5
1
8
1
3
0
S
V
C
I
C1141
1u
DNI R1190
I2C2_SCL
I2C2_SDA
LCD_RESET_N
LED_C2
LED_C1
LED_A
DSI2_LCD_MIPI_CLK_P
DSI2_LCD_MIPI_CLK_N
DSI2_LCD_MIPI_D0_P
DSI2_LCD_MIPI_D1_P
DSI2_LCD_MIPI_D1_N
DSI2_LCD_MIPI_D0_N
3D_LCD_BANK_SEL_1
Added (Rev.B)
TP1
TP2
TP3
100K
R1126
10u L1121
R1102
1.5K
VSEL_1.8V VBAT
1u
C1122
LM3528
U1121
B2
D1
C3
A2
3
D
C2
A3
2
D
B3
A1
C1
B1
GPIO1
HWEN/PGEN/GPIO
OVP
SET
W
S
SUB/FB
SDA
D
N
G
MAIN
IN
VIO
SCL
C1121
1u
12K
R1125
D1122
R1103
1.5K
I2C2_SCL
I2C2_SDA
LED_C2
LED_C1
LED_A
LCD_CP_EN
Rev.B
Added Res. (Rev.B)
TP4
TP1
TP2,3
TP4
4. TROUBLE SHOOTING
- 124 -
4.13.2 3D LCD Display trouble
3D LCD enables by OMAP4430. Those signals path are : OMAP4430 -> LCD Module
Press PWR key turn the power On
Yes
END
Follow the Power ON
trouble shooting
No
3D display OK?
(Dedplay another color)
START
No
Check LCD Power
TP1, TP2
Check 3D LCD conttol signal
TP3
No
Disconnect and reconnect
LCD connector(CN1141)
Change the LCD module
The 3D LCD works
Yes
Yes
Yes
Enter the device test
(S3D LCD test)
4. TROUBLE SHOOTING
- 125 -
2.8V_3D_LCD
U1106
BU28TD2WNVX
5
3 2
4 1
VOUT VIN
GND STBY
D
N
G
P
C1107
1u
VBAT
C1106
1u
3D_LCD_EN
R1136
510K
51K
R1133
12V_3D_LCD
VBAT
200K
R1134 C1134
0.1u
5
3
1
1
R
K
2
2
0.1u C1132 C1138 0.1u
C1137
1u
4.7u
C1131
TPS61093
U1131
11
10
9
4
7
3
5
2
8
6
1
GND
SS
OUT
VIN
EN
CP2
FB
CP1
SW
VO
Exposed_GND
4.7u L1131
3D_BOOST_EN
Changed (Rev.B)
R1191 DNI
16 15
17 14
18 13
19 12
20 11
21 10
22 9
23 8
24 7
25 6
26 5
27 4
28 3
4
0
1
1
A
V
R
F
0
5
1
8
1
3
0
S
V
C
I
DNI R1190
I2C2_SCL
I2C2_SDA
LED_C2
LED_C1
LED_A
3D_LCD_BANK_SEL_1
TP1
TP2
TP3
4. TROUBLE SHOOTING
- 126 -

Figure. 3D LCD operating trouble
TP1
TP3
TP2
TP1
TP3
TP2
4. TROUBLE SHOOTING
- 127 -
Re-insert the SIM card
Work well?
END
Yes
No
Change Main
2.9V_SIM(C103)runs?
No
Yes
Work well? END
Yes
START
Change SUB
Work well?
END
Yes
No
Change SIM card
No

4.15 SIM detect Trouble shooting
The sequence of detecting LG-P920 SIM is,
SIM inserted to LG-P920 2.85V_SIM(C207) goes to 2.85V Triggers SIM clock, reset and data.
Block Diagram of USB & UART connection is shown below

I_O
RST
CLK
USIM
USIM_CLKK
USIM_RESET
USIM_DATA
MP-EHM
XMM6260
CC_IO
CC_CLK
CC_RST
Start
Re-insert the SIM card
Work well?
End
Yes
No
NO
Change the main
board
2.9V_SIM (C103) runs?
YES
Change SUB
Work well? End
Yes
No
Change SIM card
Yes
No
End
Work well?
Change Main
4.14
4. TROUBLE SHOOTING
- 128 -
C101
10p
C104
10p
0.1u
C103
J101
8 7
6 3
5 2
4 1
VCC GND
RST VPP
CLK I_O
GND1 GND2
K
7
.
4
1
0
1
R
VSIM_2.9V VSIM_2.9V
C102
DNI
USIM_RESET/
USIM_CLK USIM_DATA
* layout note : CLK and IO must be seperated
Rev 1.0 value change
VSIM_2.9V : TP1(C103)
VSIM_2.9V : TP1(C103)
P920 SUB RFPCB
Check if SUB RFPCB is damaged
4. TROUBLE SHOOTING
- 129 -
4.15 Vibrator Troubleshooting
Check out the setting menu on the phone. If not, check Test points shown on the pictures.
Turn on the phone
Yes
Follow the power-on
trouble shooting
No
START
Check TP1, 2, 3
No
Change the vibrator
Yes
Vibration OK?
Vibrator works
END
Yes
Check haltic feedback
on the setting menu
No
4. TROUBLE SHOOTING
- 130 -

ISA1000
EUSY0238306
U981
9 0
1
1
1
5 4
6 3
7 2
8 1
EN VDP
PWM GND
MODE VDD
GAIN VDN
3
C
N
2
C
N
1
C
N
TWL_LDO_3.0V
C987
2.2u
R982
DNI
L988 82n
L989 82n
R986 470K
0 R987
TP905
R981
100K
C986 3.9n
VIB_L_P
VIB_L_N
VIBE_PWM
VIBE_EN
Added (P925 Rev.A)
TP1
TP2
TP3
4. TROUBLE SHOOTING
- 131 -

TP1
4. TROUBLE SHOOTING
- 132 -
4.16 HDMI Troubleshooting
Check out the setting menu on the phone and then set the proper resolution for the outer display as shown below
Turn on the phone
Yes
Follow the power-on
trouble shooting
No
START
Check the setting on menu
No
Set the resolution
suitable for the display
Yes
Video ouput OK?
HDMI woeks
END
Yes
Connect the HDMI cable
No
4. TROUBLE SHOOTING
- 133 -

4. TROUBLE SHOOTING
- 134 -
4.17 Motion Sensor on/o trouble
When the motion sensor does not work, the reason is chip problem. If the motion sensor IC is damaged, it will do not
work even thought power is supplied and OMAP4430 controls normally. Therefore if the motion sensor is damaged,
change the motion sensor IC or main board.
Check the gyro & motion sensor function
Function is OK?
No
END
Yes
START
Change the Gyro Sensor
IC(U961)
Yes
Gyro-NG
Motion sensor-OK?
No
END
Yes
Change the motion sensor
IC(U971)
Gyro & motion
function is OK?
No
END
Yes
Function is OK? END
Yes
No
No
4. TROUBLE SHOOTING
- 135 -
R902
1.5K
0.1u
C965
VSEL_1.8V
C962
0.1u
MPU3050A
U961
25
21
20
22
19
23
24
8
1
7
1
9
8
10
7
11
6
12
5
3
1
4
4
1
3
5
1
2
6
1
1
N
I
K
L
C
7
C
N
1
C
N
6
C
N
2
C
N
5
C
N
3
C
N
D
D
V
4
C
N
INT
A
D
_
E
M
I
FSYNC
IME_CL
REGOUT
VLOGIC
AD0
8
C
N
D
N
G
SDA
SCL
RESV1
CLKOUT
CPOUT
RESV2
NC9
C961 2.2n
SENSOR_3.0V
0.1u
C963
R901
1.5K
VSEL_1.8V
I2C4_SDA
I2C4_SCL
GYRO_INT
A
D
_
E
M
I
L
C
_
E
M
I
Added (P925 Rev.A)
R973
DNI
1u
C973
VSEL_1.8V
C972
0.1u
0.1u
C971 U971
KXTF9
4
3
2
1
5
0
1
6
7
8
9
SCL
DNC4
INT
DNC3
A
D
S
D
D
V
IO_VDD
DNC1
DNC2
GND
VSEL_1.8V
SENSOR_3.0V
MOTION_INT
IME_DA
IME_CL
4. TROUBLE SHOOTING
- 136 -
Gyro Sensor
IC(U961)
Motion sensor
IC(U971)
4. TROUBLE SHOOTING
- 137 -
4.18 Gyro/Compass sensor troubleshooting
The compass sensor is calibrated by the gyro sensor data using SW algorithm. Therefore Gyro sensor error makes the
compass sensor malfunction.
Check the gyro & compass
sensor function
Function is OK?
No
END
Yes
START
Change the Gyro Sensor
IC(U961)
Yes
Gyro-NG?
Compass-OK?
No
END
Yes
Change the Compass Sensor IC(U975)
Compass Sensor
function is OK?
No
END
Yes
Gyro & compass
Function is OK?
END
Yes
No
No
4. TROUBLE SHOOTING
- 138 -
R902
1.5K
0.1u
C965
VSEL_1.8V
C962
0.1u
MPU3050A
U961
25
21
20
22
19
23
24
8
1
7
1
9
8
10
7
11
6
12
5
3
1
4
4
1
3
5
1
2
6
1
1
N
I
K
L
C
7
C
N
1
C
N
6
C
N
2
C
N
5
C
N
3
C
N
D
D
V
4
C
N
INT
A
D
_
E
M
I
FSYNC
IME_CL
REGOUT
VLOGIC
AD0
8
C
N
D
N
G
SDA
SCL
RESV1
CLKOUT
CPOUT
RESV2
NC9
C961 2.2n
SENSOR_3.0V
0.1u
C963
R901
1.5K
VSEL_1.8V
I2C4_SDA
I2C4_SCL
GYRO_INT
A
D
_
E
M
I
L
C
_
E
M
I
Added (P925 Rev.A)
C975
1u
AMI306
U975
10
9
5
4
6
3
7
2
8
1
D
D
V
A
Y
D
R
D
D
N
G
L
C
S
G
E
R
V
P
P
V
INT
SDA ADDR
DVDD
SENSOR_3.0V
C978
1u
VSEL_1.8V
C976
10n
I2C4_SDA
I2C4_SCL
COMPASS_INT
Added (Rev.1.0)
4. TROUBLE SHOOTING
- 139 -
Gyro Sensor
IC(U961)

Compass Sensor
C(U975)
Gyro Sensor
C(U96!)
4. TROUBLE SHOOTING
- 140 -
4.19 Proximity Sensor on/o trouble
Proximity Sensor is worked as below:
Send Key click -> Phone number click -> Call connected -> Object moved at the sensor -> Control the screens on/o
operation automatically
Send Key click & Phone number click
& Call connected
START
Change the vt_cam fpcb LCD o? END
Yes
Check TP1 & I2C3_SDA & SCL
& TP2 Output
Output work well?
No
END
Yes
Function is OK? END
Yes
No
No
Object moved at the
Proximity sensor
4. TROUBLE SHOOTING
- 141 -
PROXI_3.0V
U101
5 4
6 3
7 2
8 1
SDA VDD
INT SCL
LDR GND
LEDK LEDA
SENSOR_3.0V
1u
C101 C102
1u
PROX_INT
I2C3_SDA
I2C3_SCL
TP1
TP2
Sensor_3.0V : TP1(C102) PROXI_3.0V : TP2(C101)
4. TROUBLE SHOOTING
- 142 -
4.20 Illumination Sensor on/o trouble
Illumination Sensor is worked as below:
Menu Key click -> Settings click -> Display click -> Brightness click -> Automatic brightness click
Menu key click
-> Settings click
-> Display click
-> Brightness click
-> Automatic brightness click
START
Change the vt_cam fpcb LCD brightness change? END
Yes
Check Sensor_3.0V(TP1)
Output work well?
No
END
Yes
Function is OK? END
Yes
No
No
Hide Illumination sensor by hand
4. TROUBLE SHOOTING
- 143 -
PROXI_3.0V
U101
5 4
6 3
7 2
8 1
SDA VDD
INT SCL
LDR GND
LEDK LEDA
SENSOR_3.0V
1u
C101 C102
1u
PROX_INT
I2C3_SDA
I2C3_SCL
TP1
Sensor_3.0V : TP1(C102)
4. TROUBLE SHOOTING
- 144 -
4.21 Touch trouble
Touch control signals are generated by OMAP4430. Those signals path are : OMAP4430 -> Touch Module
START
Change the vt_cam fpcb Touch is OK? END
Yes
Check Touch_3.3V(TP1)
& Touch_INT_N(TP2)
& I2C2_SDA(TP3) & SCL(TP4) Output
Output work well?
No
END
Yes
Change the Sub Rfpcb
Touch is OK? END
Yes
No
No
Reconnect the touch connector(CN102)
& sub BtB Connector(CN101)
Check the touch connector(CN102)
& sub BtB Connector(CN101)
No
Touch is OK? END
Yes
4. TROUBLE SHOOTING
- 145 -
CN102
6 5
7 4
8 3
9 2
10 1
3
0
1
A
V
VSEL_1.8V
2
1
1
R
K
0
1
TOUCH_3.3V
VSEL_1.8V
5
0
1
D
Z
C119
2.2u
1
0
1
D
Z
2
0
1
D
Z
3
0
1
D
Z
4
0
1
D
Z
6
0
1
D
Z
u
1
0
2
1
C
I2C2_SCL
I2C2_SDA
TOUCH_INT_N
TOUCH_RESET
Rev.F
Rev.E
Rev.F
Rev.F
Rev.F
I2C2_SCL: TP4(ZD103)
C115
1u
TOUCH_3.3V
U102
5
3 2
4 1
VOUT VDD
GND CE
D
N
G
P
VBAT
SENSOR_3.0V
2ch -> 1ch (Rev.E)
Remove 0 ohm (Rev.G)
I2C2_SDA: TP3(ZD102)
Touch_INT_N: TP2(VA103)
Touch_3.3V : TP1(C119)
4. TROUBLE SHOOTING
- 146 -

Touch conneclor(CN!02) Touch conneclor(CN!02)

Sub BlB conneclor(CN!0!) Sub BlB conneclor(CN!0!)
4. TROUBLE SHOOTING
- 147 -
I2C2_SDA: TP3(ZD102) I2C2_SCL: TP4(ZD103)
Touch_3.3V : TP1(C119)
Touch_INT_N: TP2(VA103)
5. BLOCK DIAGRAM
- 148 -
5. BLOCK DIAGRAM
PMU
RD_H
RD HX
VCTCXO
26MHz
AFC DAC XO VCONT
PMU
RF6590
1V2 1V8 2V852V65
Filter
B946
9
GPS IN
Diplexer
RD_HX AFC_DAC XO VCONT
PAM DCDC
RF6560
VOUT FB
9
PM L
GSM_LB_TX
GSM_HB_TX
B8 TX
Ant B8
CP_OUT
VOUT_FB
B7953
TRX4
VCC
MMMB
RF6260
Transceiver
PMB5712
PM_L
PM_H
B8_TX
B5_TX
B2_TX
B1_TX
B4 TX
Ant_B8
Ant_B5
Ant_B2
Ant_B1
Ant B4
B7953
B8 DPX
B7671
B5 DPX
B7955
B2 DPX
B7696
B1 DPX
TRX2
TRX3
TRX4
TRX5
XMM6260
ST8T
BGSF18D
RX_L1X
RX_L1
RX_L2X
RX_L2
SYS_CLK
B4_TX
Ant_B4
Ant_B3
B7959
B4 DPX
DCS
SAW filter
SYS_CLK_EN
REF_CLK_EN
TRX1
TRX6
SYS_CLK
SYSCLKEN
REF_CLK_EN
BGSF18D
_
RX_M2X
RX_M2
RX_H2X
RX_H2
RX_H1X
RX_H1
RX M1X
DI3_TX_DAT
DI3_TX_DATX
DI3_RX_DAT
DI3_RX_DATX
Di3_TX_DAT
Di3_TX_DATX
Di3_RX_DAT
Di3_RX_DATX
_M
RX_M1
5. BLOCK DIAGRAM
- 149 -
LCD 4.3
4.3 TFT 3D
EARO
EAR_PIECE(RCV)
FM_ANT
SDIO
5
McPDM
I2C2
DSI
I2C2
McBSP1(PCM)
UART2 TWL6040
BT/WLAN/FM
(WL1271)
LED
Backlight
Driver IC
Touch
4.3 TFT 3D
LCD
(480x800)
PDM
AUXLR
3.5 pi Ear MIC(Ear_Jack)
SPK
MIC1
MIC1
SPK
HS_MIC
HSOLR
FM_L/R
HiFi & PCM Voice
McBSP3(I2S)
MIC2
MIC2
FM
OMAP4430
SDMMC2
SDRC
I2C4
I2C1
TCXO Driver
38.4MHZ
Proximity
Light Sensor
Motor
2Gb-2ch
LPDDR2
eMMC (8Gb)
Compass
Driver IC
3.5 pi Ear_Jack
HSOLR
MCLK
POP
I2C4
FM_ANT
3D CAMERA
GPIO_2
5 DMTIMER8_PWM_EV
T
SDMMC2 I2C1
PMB5712
A-GPS
VT
0.3M
MIPI
5M AF
MIPI(P)
5M AF
MIPI(S)
eMMC (8Gb)
CSI1
CSI2
HDMI
LNA
FEM
UART3
Fuel gauge
3D CAMERA
T
GPIO
UART1
SDMMC1
McSPI4
GPIO_120
XMM6260
5M CAM Flash
HDMI
I2C2
USIF3
GPIO_35
I2S2
Keypad
KB_COL/ROW
MCSPI2(PCM)
1Gb
NAND
512Mb
DDR
NAND
DDR
MCP
DigRF
MIPI_HSI MIPI_HSI
IPC_SRDY
GPIO_119 GPIO_34
IPC_MRDY
I2C1
I2C3
USB UART4
JTAG
Key LED
Gyro
JTAG
JTAG
USB
JTAG USIF1
USIM1
Accelerometer
I2C
I2C4
GPIO_82
PMIC_AP
(TWL6030)
32.768KHz
Charge
r
I2C
32.768KHz
PWR-ON KEY
VCHG
VBAT
Coin cell
Battery
MUIC
5. BLOCK DIAGRAM
- 150 -
OMAP
I2C1 SDA
I2C1 SDA TWL6040
SPK
HFRP1
AUD_SPK_P
AUD SPK N
4430
PDMDN
PDMUP
PDMCLK
SDA
SCL
PDM_DL_DATA
PDM_UL_DATA
ABE_CLKS
PDM CLK
I2C1_SDA
I2C1_SCL
ABE_PDM_DL_DATA
ABE_PDM_UL_DATA
ABE_CLKS
I2C1_SDA
I2C1_SCL
TWL6040
(Audio Codec)
AUD RCV P
RCV
HFRN1
AUD_SPK_N
HFRP2
HFRN2
HBIAS
HS MICBIAS
PDMCLKLB
PDMFRAME
AUDPWRON
NRESPWRON
NAUDINT
PDM_CLK
PDM_FRAME
AUD_PWRON
SYS_nRESPWRON
SYS_nIRQ2
ABE_PDM_LB_CLK
ABE_PDM_FRAME
HDQ_SIO
SYS NIRQ2
SYS_NRESPWRON
EARP
EARN
AUD_RCV_P
AUD_RCV_N
BT / WiFi / FM
HBIAS
HS_MIC
HSL
HSR
3.5
_
HS_MIC
EAR_L
EAR_R
HOOK_ADC
ACCONN
NAUDINT
AFML
AFMR
FM_AUDIO_R
FM_AUDIO_L
SYS_NIRQ2
FM_I2S_FSYNC
FM_I2S_DI
FM I2S CLK
FM_I2S_FSYNC
FM_I2S_CLK
FM_I2S_DO
ABE McBSP3 CLKX
ABE_McBSP3_DX
ABE_McBSP3_FSX
Analog
MIC1
MBIAS
FM_I2S_CLK
FM_I2S_DO
BT_PCM_SYNC
BT_PCM_DOUT
BT_PCM_DIN
BT PCM CLK
PCM_AUD_FSYNC
PCM_AUD_IN
PCM_AUD_OUT
PCM AUD CLK
FM_I2S_DI
ABE_McBSP3_CLKX
ABE_McBSP3_DR
ABE M BSP1 CLKX
ABE_McBSP1_DR
ABE_McBSP1_DX
ABE_McBSP1_FSX
MMICN
MMICP
Analog
MIC2
SBIAS
SMICN
SMICP
FM_ANT
_ _
PCM_AUD_CLK
ABE_McBSP1_CLKX
SMICN
FM_ANT
EAR_SENSE
EAR_SENSE
DPM EMU10
HCI_CTS
HCI_RTS
HCI_TX
HCI_RX
BT_UART_RTS/
BT_UART_CTS/
BT_UART_RXD
BT_UART_TXD
UART2_RTS/
UART2_CTS/
UART2_RX
UART2_TX
XMM6260
IPC_I2S_DIN
IPC_I2S_DOUT
IPC_I2S_CLK
ABE_McBSP2_CLKX
ABE_McBSP2_DR
ABE M BSP2 DX
I2S2_CLK0
I2S2_TX
I2S2 RX
DPM_EMU10
_ _
ABE_McBSP2_DX
ABE_McBSP2_FSX
IPC_I2S_SYNC
I2S2_RX
I2S2_WA0
5. BLOCK DIAGRAM
- 151 -
CAMERA
VT IO DVDD 1V8
VT_PCLK
VT_HSYNC
VT VSYNC
CAM_MCLK
EMI/ESD Filter
VT_IO_DVDD_1V8
VT_AVDD_2V8
V_PCLK
V_HSYNC
`
1.3M Camera
VT_VSYNC
VT_DATA[7:0]
VT_RESET_N
VT CAM PWDN
V_VSYNC
V_O 29
V_GP0
L
O
C
!
L
O
C
2
VT_CAM_PWDN
CAM_I2C_SC
L
CAM_I2C_SD
A
CAM_SUBPM_EN
V_GP4
CAM_2C_SCL
CAM_2C_SOA
UAPT2_PTS_N
LP8720
SUB PMIC
LP8720
SUB PMIC
AP20
8M MIPI CLK N
CAM_VDIG_1V2
Common mode filter
L
O
C
5
L
O
C
4
L
O
C
3
O
C
i
O
C
8M
Camera
(LGIT)
8M_MIPI_CLK_N
8M_MIPI_DATA0_N
8M_MIPI_CLK_P
8M_MIPI_DATA0_P
CAM_AVDD_2V8
CAM_VIO_1V8
CAM_AF_2V8
8M MIPI DATA1 N
CS_CLKAP
CS_CLKAN
CS_O!AP
CS_O!AN
(LGIT)
8M_MIPI_DATA1_N
8M_MIPI_DATA1_P
8M_RESET_N
CAM_MCLK
8M CAM VCM EN
CS_O2AP
CS_O2AN
V_GP5
V_MCLK
8M_CAM_VCM_EN
CAM_VIO_1V8
VOOC_V
V_GP6
- 152 - Copyright 2011 LG Electronics. Inc. All right reserved.
6. CIRCUIT DIAGRAM
DNI
C182 C183
DNI
0.1u
C173
C249
2.2u
C195
100n
100p C105
2.2u C231
DNI
C233
C209
2.2u
26MHz
1XXA26000FBA X184
3
2
4
1
VCONT
VCC
GND
OUT
VBAT_PAM
U220
RF6560
B1
D3
C1
C5
3C 2C 2B
A4
C4 A2
D2
B6
D4
D1
A3
D6
D5
B3
A6
A1
6C
A5
B5
B4
SDI_CLK
SDI_DATA
VOUT_FB
2DNG
CB_P
VRAMP
CWELL
CP_OUT
VBATT2
CB_N
CA_P
CC_P
NC
VBATT1A
VBATT1B CC_N
VSDI
B1DNG
1A1 DNG
2A1DNG
SDI_EN
LOUTA
CA_N
LOUTB
2.2u
C226
1n C189
VBAT
C241
1u
10u C224
C242
4.7u
U241
RF6590
B1
D3
C1
C3
C2
2B
A4
4 C
A2
2D
4D
D1
3A
3B
A1
4B
SS_IPS
VSNS_2V85
NO_KLC
DNGA
LX2
KLC_IPS
DNGPOUT3B
WRD_IPS
VANA
OI_DDV
VSNS_1V8
VSNS_1V2
VPWR
LX1
LX3A
C223 10u
4.7u L249
1u L226
L247 4.7u
4.7u L244
100
R187
VDD_2V65
C252
DNI
C115
10n
DNI
L105
VDD_1V8
VDD_2V85
C253
DNI
1u
C250
DNI
C254
4.7u
C244
DNI
C255
15n L245
4.7u
C247
C193
1u 4.7u
C192
L102 2.2n
VSD2_1.8V
L114
3n
VBAT
0.1u
C251
4.7u
C243
C184
22n
L248 15n
RF6260
U171
7181 91 02
21
10
11
21
13
41
15
16
9
8
7
6
5
4
3
2
1
B8_TX
B5_TX
GSM_LB_TX
B2_TX
B1_TX
GSM_HB_TX
B4_TX
HB_RFIN
SPI_SS
VCC
LB_RFIN
IPSV
NC
DNG_IPS
SPI_CLK
SPI_DRW
GND
SOMCV
MA_BF
TABV
TUO_FR
VDD_1V2
U181
PMB5712
9G
01G 3H 4H 5H 6H
01H 3J 6J 7J 9J
01J 5K 6K
01K 3L 8L
11L
21L 2M 7M
J11
K11
M10
M9
M8
A5
B5
E7
D12
C12
D13
C13
E13
F12
F13
A10
H9
C4
D8
B1
E12
F9
B2
C2
A9
K9
L13
B13
C9
E8
D2
D5
A6
L9
G5
F7
L2
F3
B9
D10
L10
J8
C6
C5
J4
J5
8G 7G 6G 4G 3G 01F
8F 6F 5F 4F 6E 5E 1E 9D 11C
01C
8C 7C 3C 7A 3A
B8
A8
E9
M13
M1
A13
A1
J12
J13
H13
H12
G12
G13
K13
B12
B10
A11
A12
B11
J2
K2
K1
L1
H1
J1
G2
H2
F1
G1
E2
F2
L7
L6
M6
M5
L5
L4
M4
M3
K12
M11
M12
D4
E4
D3
E3
C1
D1
A2
A4
PM_L
PM_H
PA_POW_DET
PA_RF
VSPI
SPI_CLK
SPI_SS
SPI_DRW
PA_RAMP
PA_BIAS
RESET_N
RD_L2
RDL2x
RD_L1
RD_L1x
RD_M
RD_Mx
RD_H
RD_Hx
RX_L1X
RX_L1
RX_L2X
RX_L2
RX_M1X
RX_M1
RX_M2X
RX_M2
RX_H2X
RX_H2
RX_H1X
RX_H1
XO_SUP
XOX
XO
AFC_DAC
XO_EXT
CLK_ON
FSYS1_EN
FSYS1
FSYS2_EN
FSYS2
FSYS3_EN
FSYS3
NC1
NC2
NC3
NC4
VDD_TEST
MI1
MI2
1DNG
2DNG
3DNG
4DNG
5DNG
6DN G
7DNG
8DNG
9DNG
01DNG
11DNG
21DNG
31DNG
41DNG
5 1DN G
61DNG
71DNG
8 1DNG
91DNG
02DNG
12DNG
VDD2V5_RCRF
VD2V5_RCBB
VDD2V5_TXBIAS
VDD2V5_TXDCO
VDD2V5_RXDCO
VDD2V5_RFC
VDD2V5_FSYS
D2B_OUT
VDD1V8_RCBB
VDD1V8_RCRF
VDD1V8_RCMS
VDD1V8_RCLO
VDD1V8_RXDCO
VDD1V8_TXDCO
VDD1V8_TXLO
VDD1V8_FBR
VDD1V8_TXMS
VDD1V8_DIG
VDD1V8_SCU
VDD1V8_RFC
VDD1V8_RXPLL
VDDBAT
D2B_OUT_TXRF
VDD_TXRF
VDD1V2_DIG
VDD_IO
VDDBAT_TXRF
CEXT_TXPLL
CEXT_TXMS
CEXT_RXPLL
CEXT_DCXO
SYS_CLK
SYS_CLK_EN
REF_CLK_EN
DI3_RX_DAT
DI3_RX_DATX
DI3_TX_DAT
DI3_TX_DATX
GPO1
GPO2
GPO3
GPO4
GPO5
GPO6
GPO7
GPO8
24DNG
14DNG
04DNG
93DNG
83DNG
73D NG
63DNG
53DNG
43D NG
33DNG
23DNG
13DNG
03DNG
92DNG
82D NG
72DNG
62DNG
52D NG
42DNG
32DNG
22DNG
VDD_1V8
VBAT
C114
27p
C197
47n 47n
C198
47n
C199
C248
4.7u
C190 6.8n
C188 6.8n
4.7n C187
C232 220n
DNI
C181
VDD_1V8
DNI
L143
VDD_2V85
VDD_2V65
VDD_1V2
VSD2_1.8V
VBAT
C112 10p
TP102
L158 1.5n
DNI
L112
C171
220n
L111
DNI
C123
1p
C221
10n
VBAT
DNI
L169
1.5n L147
L159
DNI
1.5n L168
L148
DNI
L127 1n
L138
DNI
L122 2.2n
L128
DNI
L110 4.7n
33p C163
DNI
L162
C109
1.8p
L113
10n
33p C151
L141
DNI
B40761DY2045L
U121
95 75 9455 35 15 05
40
39
38
37
44 34 24 1484 74 64 54
33435363 23 13 03 92 82 51 31 21
10
8
6
5
4
2
52
54
14
58
60
56
27
26
25
24
17
16
21
20
19
18
23
22
1 3 11 7 9
1dnaB-xT
2dnaB-xT
4dnaB-xT
5dnaB-xT
8dnaB-xT
Rx-GSM1800_1
Rx-GSM1800_2
Rx-Band1_1
Rx-Band1_2
Rx-Band2_1
Rx-Band2_2
Rx-Band4_1
Rx-Band4_2
Rx-Band5_1
Rx-Band5_2
Rx-Band8_1
Rx-Band8_2
ANT-GSM1800
ANT-Band1
ANT-Band2
ANT_Band4
ANT-Band5
ANT-Band8
GND1
GND2
GND3
GND4
GND5
GND6
7DNG
8DNG
9DNG
01DNG
11DNG
21DNG
31DNG
41DNG
81DNG
7 1DN G
61DNG
51DNG
72DNG
82DNG
92DNG
03DNG
32DNG
42DNG
52DNG
62DNG
GND19
GND20
GND21
GND22
23DNG
33DNG
43DNG
53DNG
13DNG
63DNG
73DNG
MS-156C
SW102
4 3
2
1
ANT COMMON
G3 G4
C211
1.5p
C175
1p
C133
DNI
L179 1.8n
33p C121
C153 22p
100n
L104
DNI
C101 C103
DNI
VBAT_PAM
VBAT
FL111
BGSF18DM20
12
20
51
19
01
18
61
8
1 1
7 9
6
5 214
3
31
2
41
1
71
D DV
TRX_3
L CS
TRX_2
OI DS
TRX_1
1 DNG
6 DN G
2 DNG
HB_TX
4 DN G
3DNG
TNA
LB_TX
DDVL
TRX_6
5DNG
TRX_5
M RF
TRX_4
DN GP
0.1u
C194
0.1u
C191
C204
0.1u 0.1u
C203 C202
0.1u 0.1u
C201 C200
0.1u
0.1u
C208
0.1u
C207
0.1u
C206 C205
47n
DNI
L116
33p C116 33p C117
4.7n
L215
B9469
2140MHz
FL211
4 5
1
3 2
G1 O1
IN
G2 O2
L213 1n
C230 2.2u
DNI
L180
L176 2.7n
DNI
C178
L177
DNI
L131 1.2n
R186
100
FB201
220
C172
0.1u
C227
2.2u
L214
DNI
SW101
20279-001E-01
G1
ANT G2
C228
2.2n
L142 2.2n
L161 2.2n
L227 20n
C185
10n
L152
47n
1n L137
C245
1u
C225
1u
C222 100n
C132 33p
L211 2.7n
2.7n L212
26MHz_GPS_REF
RX_B1_H2
RX_B1_H2
RX_B2_M2
RX_B2_M2
RX_B5_L2X
RX_B5_L2X
RX_B8_L1X
RX_B8_L1X
RESET_N
PA_RAMP
PA_RAMP
SPI_DRW
W
R
D
_
I
P
S
W
R
D
_
I
P
S
SPI_DRW
SPI_DRW
SPI_SS
S
S
_
I
P
S
S
S
_
I
P
S
SPI_SS
SPI_SS
SPI_CLK
K
L
C
_
I
P
S
K
L
C
_
I
P
S
SPI_CLK
SPI_CLK
VSPI
I
P
S
V
I
P
S
V
VSPI
F
R
_
A
P
PA_RF
T
E
D
_
W
O
P
_
A
P
PA_POW_DET
TX_H
TX_H
TX_L
TX_L
DI3_SYS_CLK
DI3_SYS_CLK_EN
DI3_REF_CLK_EN
DI3_RX_DAT
DI3_RX_DATX
GSM_HB_TX
GSM_HB_TX
GSM_LB_TX
GSM_LB_TX
N
O
_
K
L
C
CLK_ON
CP_OUT
T
U
O
_
P
C
RX_GSM1800_M1
RX_GSM1800_M1
RX_GSM1800_M1X
RX_GSM1800_M1X
DPX_IN
RD_B4_HX
RD_B4_HX
RD_B4_H
RD_B4_H
DI3_TX_DATX
RX_B8_L1
RX_B8_L1
RX_B5_L2
RX_B5_L2
RX_B2_M2X
RX_B2_M2X
RX_B1_H2X
RX_B1_H2X
GPS_PWR_ON
RX_B4_H1X
RX_B4_H1X
DI3_TX_DAT
RX_B4_H1
RX_B4_H1
B2/GSM1900
B4
PAM DCDC
B5/GSM850
B8/EGSM
GSM1800_RX
B4 RX Diversity
Tranceiver PMU
R113 must be close to PMB5712
R114 must be close to Baseband
B1
Removed (Rev.B)
Added (Rev.D)
Removed (Rev.E)
Removed (Rev.E)
Rev.E
Moved to CP (Rev1.0)
Removed(Rev.1.0)
Removed
(Rev.1.0)
* Global : 2.2nH
<L102>
Rev.1.1
Changed
(Rev.1.1)
Changed
(Rev.1.1)
6. CIRCUIT DIAGRAM
6. CIRCUIT DIAGRAM
C336
100n
C325
0.22u
C318
0.22u
C316
0.22u
C324
0.1u
DNI
R384
n022
803C
Q301
NTJD4105CT1G
4 3
5 2
6 1 S1 D1
G1 G2
D2 S2
K7.4
243R
C313
10u
10u
C305
043R
K001
USB_VBUS
C358
2.2u
4.7K
R313
IFX_USB_VBUS
TP301
113C
n022
203C
u1.0 u1
303C 4.7K
R314
10u
C344
VSD2_1.8V
4.7K
R316
FC-135
32.768KHz
X300
2
1
3.3u L303
C343
220n
VRTC_1.8V
VBAT
S
U
B
V_
B
S
U_
X
FI
VSD2_1.8V
VSD1_1.3V
R319
4.7K
VSD2_1.8V
0.1u
C356 C357
0.1u
2.2u
C351
VSD2_1.8V
V3.1_1
D
S
V
VBAT
0.1u
C317
0.1u
C315
VSD1_1.3V
0.1u
C355 C354
0.1u
C323
0.1u
U301
XMM6260
4R 71U
1U 71A
1A
1D2A2R 1R 2P 1P 2N 1N 3K
01U 9T 9U
21P 8T 7T 8U 7U 6F 4D 4K 1J 3H 4E 2F 4C 1H 4B 3C 5A 1G 4F 2G 3F 4J 5J 6J 6H 8H 3E 2K 3J 2J 2H 2C 3A 3D 1E 1B 1F 4A 1C
F13
J12
D13
D12
D11
H10
A7
E11
D10
E9
E8
F9
D8
G9
G11
H11
B16
C16
D16
E16
G15
J15
H16
J16
H17
G17
F17
E17
D17
C17
B17
A16
C9
B9
C12
A8
A9
A10
A11
A13
M13
M15
L11
N12
P13
L13
M14
N13
R5
P3
N4
P10
N8
B6
P9
N10
K10
M8
M9
N17
M16
M17
L17
T10
P14
T15
N9
U15
R12
K16
R16
T12
L8
J17
K11
N11
F15
B11
K8
E12
R8
K9
E13
E10
H9
K14
N5
M6
M4
M2
M5
M3
L7
B14
A15
B15
A14
G16
B10
F16
A12
G13
G14
B7
E14
K17
B12
B13
G10
H13
H14
J13
J14
A6
B8
11T
11U
61P
61N
61T
71R
71T
71P
21U
31U
1T 2U 3U 2T 3T 7P 6R 5T 4T 6T 6U 5U 4U 31T
41T
41U
1K 5L 9L 5K 2L 4L 1L 1M 7 K 4 1N
11P
9R 6 1U
4 1L
01L
9D 6 1L
1 1J
8P 8J 3 1K
8 G 41D
41F
1_SSV
2_SSV
3_SSV
4_SSV
5_SSV
6_SSV
7_SSV
8_SSV
9_SSV
0 1_SSV
1 1_SSV
2 1_SSV
FRGI D_SSV
LL P_SSV
BS U_SSV
KLCECART_ 11MTE
0TKPECART_11MTE
1TKPECART_11MTE
2TKPECART_11MTE
3TKPECART_11MTE
4TKPECART_11MTE
5TKPECART_11MTE
6TKPECART_11MTE
7TKPECART_11MTE
KLC_CC
TSR_CC
OI_CC
ODT
IDT
SMT
KCT
N_TSRT
NI_GIRT
1NOM_WH
2NOM_WH
RSTM_DXT_1FISU
TSRM_DXR_1FISU
N_STR_1FISU
N_STC_1FISU
KLCS_1FISU
ATAD_BSU_CISH
BRTS_BSU_CISH
TSET_BSU
SULPD_BSU
SUNIM D_BSU
ENUT_BSU
DI_BSU
SUBV
SULPD
SUNIMD
FWP
FCDP_RBn
MEM_CS0_N
MEM_CS1_N
MEM_CS2_N
MEM_CS3_N
MEM_ADV_N
MEM_RD_N
MEM_WR_N
MEM_WAIT_N
MEM_RAS_N
MEM_CAS_N
MEM_BE0_N
MEM_BE1_N
MEM_BC0_N
MEM_BC1_N
MEM_BC2_N
MEM_BC3_N
MEM_SDCLKO
MEM_BFCLKO_0
MEM_BFCLKO_1
MEM_CKE
MMCI1_CMD
MMCI1_CLK
MMCI_DAT_0
MMCI1_DAT_1
MMCI1_DAT_2
MMCI1_DAT_3
MMCI1_CD
VDD_CORE_1
VDD_CORE_2
VDD_CORE_3
VDD_CORE_4
VDD_CORE_3G_1
VDD_CORE_3G_2
VDD_CORE_EBU
VDD_IO18_1
VDD_IO18_2
VDD_IO18_3
VDD_IO18_4
VDD_IO18_5
VDD_IO18_6
VDD_MMC
VDD_SIM
VDD_USBIO
VDD_MIPI
VDD_PLL
VDD_IO12
VPP
VDD_USB_PD
VDD_USB_ANA
VDD_DIGRF
F32K
OSC32K
VSS_RTC
VDD_RTC
EINT1
EINT2
EINT3
I2C1_SCL
I2C1_SDA
DSP_AUDIO_IN1
CLKOUT0
CLKOUT2
T_OUT0
T_OUT1
RESET2_N
MIPI_HSI_RX_DATA
MIPI_HSI_RX_FLG
MIPI_HSI_RX_RDY
MIPI_HSI_RX_WAKE
MIPI_HSI_TX_DATA
MIPI_HSI_TX_FLG
MIPI_HSI_TX_RDY
MIPI_HSI_TX_WAKE
MEM_A_0
MEM_A_1
MEM_A_2
MEM_A_3
MEM_A_4
MEM_A_5
MEM_A_6
MEM_A_7
MEM_A_8
MEM_A_9
MEM_A_10
MEM_A_11
MEM_A_12
MEM_A_13
MEM_A_14
MEM_A_15
MEM_A_16
MEM_A_17
MEM_A_18
MEM_A_19
MEM_A_20
MEM_A_21
MEM_A_22
MEM_A_23
MEM_AD_0
MEM_AD_1
MEM_AD_2
MEM_AD_3
MEM_AD_4
MEM_AD_5
MEM_AD_6
MEM_AD_7
MEM_AD_8
MEM_AD_9
MEM_AD_10
MEM_AD_11
MEM_AD_12
MEM_AD_13
MEM_AD_14
MEM_AD_15
1 DS_TABV _DDV
2DS_TABV_DDV
1DS_SSV
2DS _SSV
2WS_1DS
BF_1DS
2WS _2DS
BF_2DS
1NO
N_2NO
N_NWDRWP_TESER
N_BB_TESER
SSF
N_LLA_TESER
1M2M3M4MUMP_TABV_DDV
UMPV
CTRV
MISV
LLPV
2DSV_DDV
21_OIV
OI_BSUV
DP_BSUV
ANA_BSUV
UMP_SSV
DNGA
FERV
NE_MT
NOMANA
B_GIRT
TAD_XR_3iD
XTAD_XR_3iD
TAD_XT_3iD
XTAD_XT_3iD
KLC_SYS
NEKLCSYS
N_TESERX
N_TRELA
NE_KLC_FER
0KLC_2S2I
1KLC_2S2I
XR_2S2I
XT_ 2S2I
0AW_2S2I
1AW_2S2I
1WS _2DS
1WS_1DS
1CN
2CN
3CN
4CN
5CN
V8.1_2
D
S
V
C306
22u
VBAT
3.3u L304
C353
0.1u
0204
633R
0.1u
C352
VSD2_1.8V
4.7 R337
VSIM_2.9V
0.1u
C327
VUSB_IO_3.1V
C328
0.1u
C329
0.1u
10u
C312
VSD2_1.8V
VPLL_1.2V
C330
0.1u
VIO_1.2V
0.1u
C333
22u
C307
V3.1_
U
M
P
V
FB301
60
TP310
TP311
TP312
TP313
4.7K
R383
VSD2_1.8V
TP300
R382
DNI
H8BCS0QG0MMR-46M
U350
B6
B3
B4
A4
A7
A3
A6
M8
L7
M7
N5
N4
M4
N3
N2
L8
M6
L6
N7
L5
M3
M2
M1
H7
D5
H8
D7
J1
G2
F2
H2
D3
F8
G8
B7
B8
C7
C8
C6
D8
C5
E6
J5
J7
K8
J8
K7
K6
K5
K4
J2
H3
E1
E2
J3
C4
D2
C3
D1
C2
B2
K3
K2
K1
J4
N9
N6
M10
L9
L2
K10
J10
H9
H1
G9
F10
E9
D10
C9
B10
B5
B1
A9
M5
A5
L4
L3
J6
H6
H5
H4
G7
G6
G5
G4
G3
F7
F6
F5
F4
F3
F1
E8
E7
E5
E4
E3
D6
D4
A2
M9
L10
K9
J9
H10
F9
E10
D9
C10
B9
N8
L1
G10
G1
C1
A8
01N
1N 01A
1A
1CN
62CN
82CN
92CN
VDD1
VDD2
VDD3
VDD5
VDD4
VDD6
VDDQ1
VDDQ6
VDDQ5
VDDQ4
VDDQ10
VDDQ9
VDDQ2
VDDQ8
VDDQ7
VDDQ3
NC27
NC20
NC21
NC9
NC19
NC8
NC11
NC12
NC17
NC18
NC7
NC16
NC25
NC6
NC10
NC5
NC13
NC14
NC4
NC2
NC24
NC22
NC23
NC15
NC3
VCC1
VCC2
VSS1
VSS4
VSS8
VSSQ5
VSSQ4
VSSQ9
VSSQ8
VSSQ3
VSS2
VSS3
VSSQ10
VSSQ1
VSSQ2
VSS5
VSSQ6
VSSQ7
VSS6
VSS7
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
BA0
BA1
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
/CK
CK
CKE
/CS
/RAS
/CAS
/WED
UDQM
LDQM
UDQS
LDQS
IO0
IO1
IO2
IO3
IO4
IO5
IO6
IO7
IO8
IO9
IO10
IO11
IO12
IO13
IO14
IO15
/CE
/RE
/WE
CLE
ALE
/WP
R/B
VUSB_PD_1.1V
C334
0.1u
0.1u
C337
VUSB_ANA_1.8V
0.1u
C335
413C
n022
60
FB302
V8.1_
C
T
R
V
V9.2_
MI
S
V
V2.1_LL
P
V
n022
013C
103TP
K01
V8.1_2
D
S
V
V2.1_
OI
V
V1.3_
OI_
B
S
U
V
V1.1_
D
P_
B
S
U
V
V8.1_
A
N
A_
B
S
U
V
u1.0
103C
n022
403C
u1.0
903C
C342 10p
VSD2_1.8V
603R
IND
U303
FSA2259UMX
6
5
7
4
8
3
9
2
01
1 VCC
1B2
1B1
A2
A1
2S
1S
2B0
0B1
GND
10p C341
RESET_N
DI3_SYS_CLK
DI3_SYS_CLK_EN
DI3_REF_CLK_EN
DI3_RX_DAT
DI3_RX_DATX
DI3_TX_DATX
DI3_TX_DAT
GSM_TXON_IND
W
S_
X
T_
T
R
A
U
UART_RX_SW
X
FI_-
D_
B
S
U
X
FI_
+
D_
B
S
U
/
T
E
S
E
R_
M I
S
U
KL
C_
MI
S
U
A
T
A
D_
MI
S
U
X
FI_
X
R_
T
R
A
U
X
FI_
X
R_
T
R
A
U
X
FI_
X
T_
T
R
A
U
X
FI_
X
T_
T
R
A
U
C
PI_
X
T_1
T
R
A
U
UART1_RX_IPC
MIPI_HSI_AC_FLAG|McSPI4_SOMI
MIPI_HSI_AC_FLAG
McSPI4_SOMI
MIPI_HSI_AC_DATA
MIPI_HSI_AC_DATA|McSPI4_SIMO
McSPI4_SIMO
MIPI_HSI_CA_READY|McSPI4_CLK
MIPI_HSI_CA_READY
McSPI4_CLK
USIF1_SW
IPC_SRDY
IPC_MRDY
MODEM_SEND
MEM_WR_N
MEM_WR_N
MEM_WR_N
MEM_RD_N
MEM_RD_N
MEM_ADV_N
MEM_ADV_N
MEM_BC0_N
MEM_BC0_N
DDR_RAS_N
DDR_RAS_N
DDR_DQS[0]
DDR_DQS[0]
DDR_DQS[1]
DDR_DQS[1]
DDR_CAS_N
DDR_CAS_N
MEM_BUSY/
MEM_BUSY/
MEM_WP
MEM_WP
MEM_CS1_N
MEM_CS1_N
MEM_A[9]
MEM_A[9]
MEM_A[10]
MEM_A[10]
MEM_A[11]
MEM_A[11]
MEM_A[12]
MEM_A[12]
MEM_A[13]
MEM_A[13]
MEM_A[14]
MEM_A[14]
MEM_A[15]
MEM_A[15]
MEM_AD[0]
MEM_AD[0]
MEM_AD[0]
MEM_AD[1]
MEM_AD[1]
MEM_AD[1]
MEM_AD[2]
MEM_AD[2]
MEM_AD[2]
MEM_AD[3]
MEM_AD[3]
MEM_AD[3]
MEM_AD[4]
MEM_AD[4]
MEM_AD[4]
MEM_AD[5]
MEM_AD[5]
MEM_AD[5]
MEM_AD[6]
MEM_AD[6]
MEM_AD[6]
MEM_AD[7]
MEM_AD[7]
MEM_AD[7]
MEM_AD[8]
MEM_AD[8]
MEM_AD[8]
MEM_AD[9]
MEM_AD[9]
MEM_AD[9]
MEM_AD[10]
MEM_AD[10]
MEM_AD[10]
MEM_AD[11]
MEM_AD[11]
MEM_AD[11]
MEM_AD[12]
MEM_AD[12]
MEM_AD[12]
MEM_AD[13]
MEM_AD[13]
MEM_AD[14]
MEM_AD[14]
MEM_AD[14]
MEM_AD[15]
MEM_AD[15]
MEM_AD[15]
MEM_A[0]
MEM_A[0]
MEM_A[1]
MEM_A[1]
MEM_A[2]
MEM_A[2]
MEM_A[3]
MEM_A[3]
MEM_A[4]
MEM_A[4]
MEM_A[5]
MEM_A[5]
MEM_A[6]
MEM_A[6]
MEM_A[7]
MEM_A[7]
MEM_A[8]
MEM_A[8]
IFX_USB_VBUS_EN
MEM_BC1_N
MEM_BC1_N
N_
U
M
P_
T
E
S
E
R
MEM_WAIT_N
MEM_WAIT_N
MON1
1
N
O
M
MON2
2
N
O
M
IFX_TRIG_IN
NI_
GI
R
T_
X
FI
DSP_AUDIO_IN1
DSP_AUDIO_IN1
OMAP_SEND
/
W
S_
N
O_
R
W
P_
X
FI
MEM_CS0_N
MEM_CS0_N
IPC_I2S_CLK
IPC_I2S_DOUT
IPC_I2S_SYNC
IPC_I2S_DIN
CP_CRASH_INT
MIPI_HSI_CA_WAKE
MIPI_HSI_CA_DATA
MIPI_HSI_CA_FLAG
MIPI_HSI_AC_READY
MIPI_HSI_AC_WAKE
MEM_SDCLKO
MEM_SDCLKO
MEM_BFCLKO
MEM_BFCLKO
DDR_CKE
DDR_CKE
O
X
C
T
ot
e
s
ol
c
0
0
2
T
P
B
B
ot
e
s
ol
c
1
0
3
C
Rev.B
NAND MCP
Analog switch for USIF1
Rev.B
Rev.B
Removed (925 Rev.D)
Added (Rev.B)
Boot Configuration
(Active high)
BASE BAND PROCESSOR
Changeed (Rev.C)
Rev.C
Added (P925 Rev.A)
Changed (Rev.E)
Changed (Rev.E)
Changed (Rev.E)
* C316, C318, C324 : L-W swapped Cap
Rev.1.0
Removed (Rev 1.0)
Removed
(Rev.1.0)
Removed (Rev.1.0)
)0.1.ve
R( devo
me
R
6. CIRCUIT DIAGRAM
R512
DNI
R510
1.5K
R592 51K
51K R593
VSEL_1.8V
R514 2.7K
VSEL_1.8V
2.7K R515
U500
OMAP4430
B23
B26
D22
C23
B12
B11
D25
B22
C25
C22
D21
C21
B25
D20
C20
B21
A21
B20
B19
A19
B18
A18
B17
D19
C19
D18
C18
D17
C17
D16
C16
B16
A16
D15
C15
D13
C13
D12
C12
V4
V3
U4
U3
T4
T3
K4
K3
L4
L3
M4
M3
N4
N3
P4
P3
D7
C7
B7
V27
U27
T27
N25
N26
M25
M26
W25
W26
V25
V26
U25
U26
T25
T26
R25
R26
AF3
AG3
AF4
AE4
AF5
AE5
D11
C11
D8
C8
D9
C9
D10
C10
B8
A8
B10
B9
H3
H2
K1
J1
G2
J2
H4
AH19
AG20
AE20
AF21
AF20
AE21
G28
G27
F28
F27
AH23
AG23
AF23
AE23
AG22
AE22
AF22
AA26
AA25
AB27
AB26
G3
G4
F1
F3
F4
E1
E2
E4
E3
D2
AE14
AF14
AG16
AF16
AE16
AH17
AF17
AE17
AG18
AF18
AE19
AF19
AG19
AE18
AH24
AG24
AF24
AE24
AH26
AF26
AE25
AF25
AG25
AC27
AB25
AC25
AC26
AC28
AD25
AD26
AD27
ABE_McBSP2_CLKX/McSPI2_CLK/ABE_MCASP_AHCLKX/GPIO_110/USBB2_MM_RXDM/SAFE_MODE
ABE_McBSP2_DR/McSPI2_SOMI/ABE_MCASP_AXR/GPIO_111/USBB2_MM_RXDP/SAFE_MODE
ABE_McBSP2_DX/McSPI2_SIMO/ABE_MCASP_AMUTE/GPIO_112/USBB2_MM_RXRCV/SAFE_MODE
ABE_McBSP2_FSX/McSPI2_CS0/ABE_MCASP_AFSX/GPIO_113/USBB2_MM_TXEN/SAFE_MODE
ABE_McBSP1_CLKX/ABE_SLIMBUS1_CLOCK/GPIO_114/SAFE_MODE
ABE_McBSP1_DR/ABE_SLIMBUS1_DATA/GPIO_115/SAFE_MODE
ABE_McBSP1_DX/SDMMC3_DAT2/ABE_MCASP_ACLKX/GPIO_116/SAFE_MODE
ABE_McBSP1_FSX/SDMMC3_DAT3/ABE_MCASP_AMUTEIN/GPIO_117/SAFE_MODE
ABE_PDM_UL_DATA/ABE_McBSP3_DR/SAFE_MODE
ABE_PDM_DL_DATA/ABE_McBSP3_DX/SAFE_MODE
ABE_PDM_FRAME/ABE_McBSP3_CLKX/SAFE_MODE
ABE_PDM_LB_CLK/ABE_McBSP3_FSX/SAFE_MODE
ABE_CLKS/GPIO_118/SAFE_MODE
ABE_DMIC_CLK1/GPIO_119/USBB2_MM_TXSE0/SAFE_MODE
ABE_DMIC_DIN1/GPIO_120/USBB2_MM_TXDAT/SAFE_MODE
ABE_DMIC_DIN2/SLIMBUS2_CLOCK/GPIO_121/SAFE_MODE
ABE_DMIC_DIN3/SLIMBUS2_DATA/ABE_DMIC_CLK2/GPIO_122/SAFE_MODE
USBB1_ULPITLL_CLK/HSI1_CAWAKE/GPIO_84/USBB1_ULPIPHY_CLK/ATTILA_HW_DBG20/SAFE_MODE
USBB1_ULPITLL_STP/HSI1_CADATA/McBSP4_CLKR/GPIO_85/USBB1_ULPIPHY_STP/USBB1_MM_RXDP/ATTILA_HW_DBG21/SAFE_MODE
USBB1_ULPITLL_DIR/HSI1_CAFLAG/McBSP4_FSR/GPIO_86/USBB1_ULPIPHY_DIR/ATTILA_HW_DBG22/SAFE_MODE
USBB1_ULPITLL_NXT/HSI1_ACREADY/McBSP4_FSX/GPIO_87/USBB1_ULPIPHY_NXT/USBB1_MM_RXDM/ATTILA_HW_DBG23/SAFE_MODE
USBB1_ULPITLL_DAT0/HSI1_ACWAKE/McBSP4_CLKX/GPIO_88/USBB1_ULPIPHY_DAT0/USBB1_MM_RXRCV/ATTILA_HW_DBG24/SAFE_MODE
USBB1_ULPITLL_DAT1/HSI1_ACDATA/McBSP4_DX/GPIO_89/USBB1_ULPIPHY_DAT1/USBB1_MM_TXSE0/ATTILA_HW_DBG25/SAFE_MODE
USBB1_ULPITLL_DAT2/HSI1_ACFLAG/McBSP4_DR/GPIO_90/USBB1_ULPIPHY_DAT2/USBB1_MM_TXDAT/ATTILA_HW_DBG26/SAFE_MODE
USBB1_ULPITLL_DAT3/HSI1_CAREADY/GPIO_91/USBB1_ULPIPHY_DAT3/USBB1_MM_TXEN/ATTILA_HW_DBG27/SAFE_MODE
USBB1_ULPITLL_DAT4/DMTIMER8_PWM_EVT/ABE_McBSP3_DR/GPIO_92/USBB1_ULPIPHY_DAT4/ATTILA_HW_DBG28/SAFE_MODE
USBB1_ULPITLL_DAT5/DMTIMER9_PWM_EVT/ABE_McBSP3_DX/GPIO_93/USBB1_ULPIPHY_DAT5/ATTILA_HW_DBG29/SAFE_MODE
USBB1_ULPITLL_DAT6/DMTIMER10_PWM_EVT/ABE_McBSP3_CLKX/GPIO_94/USBB1_ULPIPHY_DAT6/ABE_DMIC_DIN3/ATTILA_HW_DBG30/SAFE_MODE
USBB1_ULPITLL_DAT7/DMTIMER11_PWM_EVT/ABE_McBSP3_FSX/GPIO_95/USBB1_ULPIPHY_DAT7/ABE_DMIC_CLK3/ATTILA_HW_DBG31/SAFE_MODE
USBB1_HSIC_DATA/GPIO_96/SAFE_MODE
USBB1_HSIC_STROBE/GPIO_97/SAFE_MODE
SDMMC1_CLK/DPM_EMU19/GPIO_100/SAFE_MODE
SDMMC1_CMD/UART1_RX/GPIO_101/SAFE_MODE
SDMMC1_DAT0/DPM_EMU18/GPIO_102/SAFE_MODE
SDMMC1_DAT1/DPM_EMU17/GPIO_103/SAFE_MODE
SDMMC1_DAT2/DPM_EMU16/GPIO_104/JTAG_TMS_TMSC/SAFE_MODE
SDMMC1_DAT3/DPM_EMU15/GPIO_105/JTAG_TCK/SAFE_MODE
SDMMC1_DAT4/GPIO_106/SAFE_MODE
UART2_CTS/SDMMC3_CLK/GPIO_123/SAFE_MODE
UART2_RTS/SDMMC3_CMD/GPIO_124/SAFE_MODE
UART2_RX/SDMMC3_DAT0/GPIO_125/SAFE_MODE
UART2_TX/SDMMC3_DAT1/GPIO_126/SAFE_MODE
McSPI1_CLK/GPIO_134/SAFE_MODE
McSPI1_SOMI/GPIO_135/SAFE_MODE
McSPI1_SIMO/GPIO_136/SAFE_MODE
McSPI1_CS0/GPIO_137/SAFE_MODE
McSPI1_CS1/UART1_RX/GPIO_138/SAFE_MODE
McSPI1_CS2/UART1_CTS/SLIMBUS2_CLOCK/GPIO_139/SAFE_MODE
McSPI1_CS3/UART1_RTS/SLIMBUS2_DATA/GPIO_140/SAFE_MODE
UART3_CTS_RCTX/UART1_TX/GPIO_141/SAFE_MODE
UART3_RTS_SD/GPIO_142/SAFE_MODE
UART3_RX_IRRX/DMTIMER8_PWM_EVT/GPIO_143/SAFE_MODE
UART3_TX_IRTX/DMTIMER9_PWM_EVT/GPIO_144/SAFE_MODE
McSPI4_CLK/SDMMC4_CLK/GPIO_151/SAFE_MODE
McSPI4_SIMO/SDMMC4_CMD/GPIO_152/SAFE_MODE
McSPI4_SOMI/SDMMC4_DAT0/GPIO_153/SAFE_MODE
McSPI4_CS0/SDMMC4_DAT3/GPIO_154/SAFE_MODE
UART4_RX/SDMMC4_DAT2/GPIO_155/SAFE_MODE
UART4_TX/SDMMC4_DAT1/GPIO_156/SAFE_MODE
SIM_IO/GPIO_WK0/SAFE_MODE
SIM_CLK/GPIO_WK1/SAFE_MODE
SIM_RESET/GPIO_WK2/SAFE_MODE
SIM_CD/GPIO_WK3/SAFE_MODE
SIM_PWR_CTRL/GPIO_WK4/SAFE_MODE
USBC1_ICUSB_DP/GPIO_98/SAFE_MODE
USBC1_ICUSB_DM/GPIO_99/SAFE_MODE
HDMI_HPD/GPIO_63/SAFE_MODE
HDMI_CEC/GPIO_64/SAFE_MODE
HDMI_DDC_SCL/GPIO_65/SAFE_MODE
HDMI_DDC_SDA/GPIO_66/SAFE_MODE
HDMI_DATA0X
HDMI_DATA0Y
HDMI_DATA1X
HDMI_DATA1Y
HDMI_DATA2X
HDMI_DATA2Y
HDMI_CLOCKX
HDMI_CLOCKY
SDMMC5_CLK/MCSPI2_CLK/USBC1_ICUSB_DP/GPIO_145/SAFE_MODE
SDMMC5_CMD/MCSPI2_SIMO/USBC1_ICUSB_DM/GPIO_146/SAFE_MODE
SDMMC5_DAT0/MCSPI2_SOMI/USBC1_ICUSB_RCV/GPIO_147/SAFE_MODE
SDMMC5_DAT1/USBC1_ICUSB_TXEN/GPIO_148/SAFE_MODE
SDMMC5_DAT2/MCSPI2_CS1/GPIO_149/SAFE_MODE
SDMMC5_DAT3/MCSPI2_CS0/GPIO_150/SAFE_MODE
CSI21_DX0/GPI_67/SAFE_MODE
CSI21_DY0/GPI_68/SAFE_MODE
CAM_SHUTTER/GPIO_81/SAFE_MODE
CAM_STROBE/GPIO_82/SAFE_MODE
CAM_GLOBALRESET/GPIO_83/SAFE_MODE
CVIDEO_TVOUT
CVIDEO_VFB
CVIDEO_RSET
DSI1_DX0
DSI1_DY0
DSI1_DX1
DSI1_DY1
DSI1_DX2
DSI1_DY2
DSI1_DX3
DSI1_DY3
DSI1_DX4
DSI1_DY4
DSI2_DX0
DSI2_DY0
DSI2_DX1
DSI2_DY1
DSI2_DX2
DSI2_DY2
GPMC_AD0/SDMMC2_DAT0
GPMC_AD4/SDMMC2_DAT4/SDMMC2_DIR_DAT0
GPMC_AD5/SDMMC2_DAT5/SDMMC2_DIR_DAT1
GPMC_AD6/SDMMC2_DAT6/SDMMC2_DIR_CMD
GPMC_AD7/SDMMC2_DAT7/SDMMC2_CLK_FDBK
GPMC_AD8/KPD_ROW0/C2C_DATA15/GPIO_32
GPMC_AD12/KPD_COL0/C2C_DATA11/GPIO_36
GPMC_AD13/KPD_COL1/C2C_DATA10/GPIO_37
GPMC_AD14/KPD_COL2/C2C_DATA9/GPIO38
GPMC_AD15/KPD_COL3/C2C_DATA8/GPIO39
GPMC_A16/KPD_ROW4/C2C_DATAIN0/GPIO40/VENC_656_DATA0
GPMC_A17/KPD_ROW5/C2C_DATAIN1/GPIO_41/VENC_656_DATA1/SAFE_MODE
GPMC_A20/KPD_COL4/C2C_DATAIN4/GPIO_44/VENC_656_DATA4/SAFE_MODE
GPMC_A24/C2C_CLKOUT0/GPIO_48/SAFE_MODE
GPMC_A25/C2C_CLKOUT1/GPIO_49/SAFE_MODE
GPMC_nCS0/GPIO_50/SYS_NDMAREQ0
GPMC_nCS1/C2C_DATAOUT6/GPIO_51/SAFE_MODE
GPMC_nCS2/C2C_DATAOUT7/GPIO_52/SAFE_MODE
GPMC_nCS3/GPMC_DIR/C2C_DATAOUT4/GPIO_53/SAFE_MODE
GPMC_nWP/DSI1_TE0/GPIO_54/SYS_NDMAREQ1
GPMC_CLK/GPIO_55/SYS_nDMAREQ2
GPMC_nADV_ALE//DSI1_TE1/GPIO_56/SYS_NDMAREQ3
GPMC_nOE/SDMMC2_CLK
GPMC_nWE/SDMMC2_CMD
GPMC_NBE0_CLE/DSI2_TE0/GPIO_59
GPMC_nBE1/C2C_DATAOUT5/GPIO_60/SAFE_MODE
GPMC_WAIT0/DSI2_TE1/GPIO_61
GPMC_WAIT1/C2C_DATAOUT2/GPIO_62/SAFE_MODE
K3.3
885R
695R
K3.3
VSEL_1.8V
K3 .3
495R
TP523
VSEL_1.8V
VPMIC_VDAC
CDC3S04
U502
B4
D2
B2
A1
A2
B3
C2
A4
C1
A3
D1
E4
D3
D4
E3
E2
C3
E1
C4
B1
MCLK_IN
CLK3
VLDO
REQ3
VBAT
SDAH
ADR_A0
MCLK_REQ
SCLH
VDD_DIG
REQ1
REQ4
CLK1
CLK4
VDD_ANA
CLK2
REQ2
RESET
GND_DIG
GND_ANA
VCLKB_TCXO_VCC
VCLKB_TCXO_VCC
C501
2.2u
VBAT
C500
1u
R511
1.5K
195R
K3.3
IND
895R
TP524 TP525
C507 68p
68p C509
68p C508
C502
1u
VSEL_1.8V
38.4MHz
1XXB38400FAA
X500
3
2
4
1
GND1
VCC
GND2
OUT
685R
IND
485R
I ND
TP511
IND
185R
TP512 TP513
1u
C503
G5TS0_5B9DSE 195DZ
295DZ
G5TS0_5B9DSE
G5TS0_5B9DSE 395DZ
K3.3
795R
VBAT
UAT500
UART_TP
12
11
10
9
8
7
6
5
4
3
2
1
GND
RX
TX
NC1
ON_SW
VBAT
NC2
NC3
NC4
DSR
RTS
CTS
GND
RX
TX
VCHAR
ON_SW
VBAT
PWR
URXD
UTXD
3G 2.5G
VCHG
U500
OMAP4430
C24
B24
A24
D23
D24
AE8
AF8
D27
D28
E25
E26
E27
F26
AD4
AD2
AC3
AC2
AD3
Y28
AA28
G26
G25
H26
H25
J27
H27
J26
J25
K26
K25
L27
K27
C3
B5
B4
AG12
AF12
AE12
AG13
AE11
AF11
AG11
AH11
AE10
AF10
AG10
AE9
AF13
AE13
A27
AC4
AB4
AB3
AB2
AA4
AA3
AA2
AA1
Y4
Y3
Y2
W4
W3
W2
W1
V2
V1
P2
N2
M2
AE3
AG1
AE1
AH1
AH2
AE2
AG7
AG6
AE7
AF7
AD1
AG8
AH5
AH6
AG5
AH7
AE6
AF6
AF9
AG9
AH22
AG21
Y27
W27
D26
C26
AE26
AE28
AA27
HDQ_SIO/I2C3_SCCB/I2C2_SCCB/GPIO_127/SAFE_MODE
I2C1_SCL
I2C1_SDA
I2C2_SCL/UART1_RX/GPIO_128/SAFE_MODE
I2C2_SDA/UART1_TX/GPIO_129/SAFE_MODE
I2C3_SCL/GPIO_130/SAFE_MODE
I2C3_SDA/GPIO_131/SAFE_MODE
I2C4_SCL/GPIO_132/SAFE_MODE
I2C4_SDA/GPIO_133/SAFE_MODE
SR_SCL
SR_SDA
SYS_NIRQ2/GPIO_183/SAFE_MODE
SYS_NIRQ1/SAFE_MODE
SYS_PWR_REQ
FREF_XTAL_VSSOSC
FREF_XTAL_IN/C2C_WAKEREQIN
FREF_XTAL_OUT
FREF_SLICER_IN/GPI_WK5/C2C_WAKEREQIN/SAFE_MODE
FREF_CLK_IOREQ
SYS_NRESWARM
SYS_NRESPWRON
SYS_PWRON_RESET_OUT/GPIO_WK29
SYS_32K
JTAG_TDO
JTAG_nTRST
JTAG_TMS_TMSC/SAFE_MODE
JTAG_TDI
JTAG_TCK/SAFE_MODE
JTAG_RTCK
DPM_EMU0/GPIO_11/ATTILA_HW_DBG0/SAFE_MODE
DPM_EMU1/GPIO_12/ATTILA_HW_DBG1/SAFE_MODE
DPM_EMU2/USBA0_ULPIPHY_CLK/GPIO_13/DISPC2_FID/ATTILA_HW_DBG2/RSVD
DPM_EMU3/USBA0_ULPIPHY_STP/GPIO_14/DISPC2_DATA10/ATTILA_HW_DBG3/RSVD
DPM_EMU4/USBA0_ULPIPHY_DIR/GPIO_15/DISPC2_DATA9/ATTILA_HW_DBG4/RSVD
DPM_EMU5/USBA0_ULPIPHY_NXT/GPIO_16/RFBI_TE_VSYNC0/DISPC2_DATA16/ATTILA_HW_DBG5/RSVD
DPM_EMU6/USBA0_ULPIPHY_DAT0/UART3_TX_IRTX/GPIO_17/RFBI_HSYNC0/DISPC2_DATA17/ATTILA_HW_DBG6/RSVD
DPM_EMU7/USBA0_ULPIPHY_DAT1/UART3_RX_IRRX/GPIO_18/RFBI_CS0/DISPC2_HSYNC/ATTILA_HW_DBG7/RSVD
DPM_EMU8/USBA0_ULPIPHY_DAT2/UART3_RTS_SD/GPIO_19/RFBI_RE/DISPC2_PCLK/ATTILA_HW_DBG8/RSVD
DPM_EMU9/USBA0_ULPIPHY_DAT3/UART3_CTS_RCTX/GPIO_20/RFBI_WE/DISPC2_VSYNC/ATTILA_HW_DBG9/RSVD
DPM_EMU10/USBA0_ULPIPHY_DAT4/GPIO_21/RFBI_A0/DISPC2_DE/ATTILA_HW_DBG10/RSVD
DPM_EMU11/USBA0_ULPIPHY_DAT5/GPIO_22/RFBI_DATA8/DISPC2_DATA8/ATTILA_HW_DBG11/RSVD
DPM_EMU14/SYS_DRM_MSECURE/UART1_RX/GPIO_25/RFBI_DATA5/DISPC2_DATA5/ATTILA_HW_DBG14/RSVD
DPM_EMU15/SYS_SECURE_INDICATOR/GPIO_26/RFBI_DATA4/DISPC2_DATA4/ATTILA_HW_DBG15/RSVD
DPM_EMU16/DMTIMER8_PWM_EVT/DSI1_TE0/GPIO_27/RFBI_DATA3/DISPC2_DATA3/ATTILA_HW_DBG16/RSVD
ATESTV
USBB2_HSIC_STROBE/GPIO_170/SAFE_MODE
USBB2_HSIC_DATA/GPIO_169/SAFE_MODE
USBB2_ULPITLL_DAT7/USBB2_ULPIPHY_DAT7/SDMMC3_CLK/GPIO_168/McSPI3_CLK/DISPC2_DATA11/RSVD
USBB2_ULPITLL_DAT6/USBB2_ULPIPHY_DAT6/SDMMC3_CMD/GPIO_167/McSPI3_SIMO/DISPC2_DATA12/RSVD
USBB2_ULPITLL_DAT5/USBB2_ULPIPHY_DAT5/SDMMC3_DAT3/GPIO_166/McSPI3_CS0/DISPC2_DATA13/RSVD
USBB2_ULPITLL_DAT4/USBB2_ULPIPHY_DAT4/SDMMC3_DAT0/GPIO_165/McSPI3_SOMI/DISPC2_DATA14/RSVD
USBB2_ULPITLL_DAT3/USBB2_ULPIPHY_DAT3/SDMMC3_DAT1/GPIO_164/HSI2_CAREADY/DISPC2_DATA15/RSVD
USBB2_ULPITLL_DAT2/USBB2_ULPIPHY_DAT2/SDMMC3_DAT2/GPIO_163/HSI2_ACFLAG/DISPC2_DATA18/RSVD
USBB2_ULPITLL_DAT1/USBB2_ULPIPHY_DAT1/SDMMC4_DAT3/GPIO_162/HSI2_ACDATA/DISPC2_DATA19/RSVD
USBB2_ULPITLL_DAT0/USBB2_ULPIPHY_DAT0/SDMMC4_DAT2/GPIO_161/HSI2_ACWAKE/DISPC2_DATA20/RSVD
USBB2_ULPITLL_NXT/USBB2_ULPIPHY_NXT/SDMMC4_DAT1/GPIO_160/HSI2_ACREADY/DISPC2_DATA21/RSVD
USBB2_ULPITLL_DIR/USBB2_ULPIPHY_DIR/SDMMC4_DAT0/GPIO_159/HSI2_CAFLAG/DISPC2_DATA22/RSVD
USBB2_ULPITLL_STP/USBB2_ULPIPHY_STP/SDMMC4_CLK/GPIO_158/HSI2_CADATA/DISPC2_DATA23/RSVD
USBB2_ULPITLL_CLK/USBB2_ULPIPHY_CLK/SDMMC4_CMD/GPIO_157/HSI2_CAWAKE/SAFE_MODE
USBA0_OTG_DM/UART3_TX_IRTX/UART2_TX/GPIO_180/SAFE_MODE
USBA0_OTG_DP/UART3_RX_IRRX/UART2_RX/GPIO_179/SAFE_MODE
USBA0_OTG_CE
UNIPRO_RY2/KPD_ROW5/GPI_3/SAFE_MODE
UNIPRO_RX2/KPD_ROW4/GPI_2/SAFE_MODE
UNIPRO_TY2/KPD_COL5/GPIO_1/SAFE_MODE
UNIPRO_TX2/KPD_COL4/GPIO_0/SAFE_MODE
FREF_CLK1_OUT/GPIO_181/SAFE_MODE
FREF_CLK2_OUT/GPIO_182/SAFE_MODE
FREF_CLK3_REQ/FREF_CLK1_REQ/SYS_DRM_MSECURE/GPIO_WK30/C2C_WAKEREQIN/SAFE_MODE
FREF_CLK4_REQ/FREF_CLK5_OUT/GPIO_WK7
FREF_CLK4_OUT/GPIO_WK8
FREF_CLK0_OUT/FREF_CLK1_REQ/SYS_DRM_MSECURE/GPIO_WK6/SAFE_MODE
FREF_CLK3_OUT/FREF_CLK2_REQ/SYS_SECURE_INDICATOR/GPIO_WK31/C2C_WAKEREQOUT/SAFE_MODE
SYS_BOOT0/GPIO_184/SAFE_MODE
SYSBOOT6/DPM_EMU18/GPIO_WK9/C2C_WAKEREQOUT/SAFE_MODE
SYSBOOT7/DPM_EMU19/GPIO_WK10/SAFE_MODE
C2C_DATA15/DSI2_TE1/C2C_DATAOUT1/GPIO_104/SAFE_MODE
C2C_DATA11/USBC1_ICUSB_TXEN/C2C_DATAOUT3/GPIO_100/SYS_NDMAREQ0/SAFE_MODE
C2C_DATA12/DSI1_TE0/C2C_CLKIN0/GPIO_101/SYS_NDMAREQ1/SAFE_MODE
C2C_DATA13/DSI1_TE1/C2C_CLKIN1/GPIO_102/SYS_NDMAREQ2/SAFE_MODE
C2C_DATA14/DSI2_TE0/C2C_DATAOUT0/GPIO_103/SYS_NDMAREQ3/SAFE_MODE
R501 10
C505
0.1u
0.1u C504
VSEL_1.8V
R500
10
2.7K R513
10K
R516
R521
470K
R522
470K
VSEL_1.8V
GPS_PWR_ON
SDMMC2_CMD
SDMMC2_CLK
SYS_nRESWARM
SYS_nRESWARM
SDMMC2_DAT[0]
SDMMC2_DAT[1]
SDMMC2_DAT[2]
SDMMC2_DAT[3]
SDMMC2_DAT[4]
SDMMC2_DAT[5]
SDMMC2_DAT[6]
SDMMC2_DAT[7]
CHG_STATUS/
I2C3_SCL
I2C3_SDA
CHG_EN_SET/
MICROSD_DET/
CLK32K_MAIN
I2C1_SCL
I2C1_SCL
I2C1_SDA
I2C1_SDA
MUIC_INT/
USB_DM_OMAP
USB_DP_OMAP
SRI2C_SCL
SRI2C_SDA
SYS_DRM_MSEC
UART4_RX_OMAP
UART4_TX_OMAP
UART_SW1
UART_SW2
SYS_nRESPWRON
SYS_nIRQ1
SYS_PWRREQ
PWR_ON_SW
I2C2_SCL
MICROSD_CMD
MICROSD_DAT0
MICROSD_DAT1
MICROSD_DAT2
MICROSD_DAT3
MICROSD_CLK
FLASH_EN
I2C2_SDA
I2C4_SDA
I2C4_SCL
VT_0.3M_MCLK
VT_0.3M_MIPI_CLK_P
VT_0.3M_MIPI_CLK_N
PROX_INT
VT_CAM_PWDN
VT_CAM_RESET/
LCD_RESET_N
FRONT_KEY_LED_EN
DSI2_LCD_MIPI_CLK_P
DSI2_LCD_MIPI_CLK_N
DSI2_LCD_MIPI_D0_P
DSI2_LCD_MIPI_D1_P
DSI2_LCD_MIPI_D1_N
DSI2_LCD_MIPI_D0_N
MICROSD_COVER_DET/
LCD_CP_EN
TOUCH_INT_N
KEY_C[0]
KEY_R[0]
KEY_R[1]
UART_RX_IFX
UART_TX_IFX
3D_BOOST_EN
3D_LCD_BANK_SEL
3D_LCD_EN
FM_I2S_CLK
FM_I2S_DI
FM_I2S_FSYNC
FM_I2S_DO
BT_PCM_SYNC
BT_PCM_CLK
BT_PCM_DIN
BT_PCM_DOUT
WL_CLK_REQ
BT_UART_RTS/
BT_UART_CTS/
WLAN_CLK
WLAN_SDIO[0]
WLAN_SDIO[1]
WLAN_SDIO[2]
WLAN_SDIO[3]
WLAN_CMD
WLAN_HOST_WAKEUP
BT_UART_TXD
BT_UART_RXD
WLAN_EN
BT_EN
WL_CLK_IN
UART1_TX_IPC
UART1_RX_IPC
MIPI_HSI_AC_FLAG
McSPI4_SOMI
MIPI_HSI_AC_DATA
McSPI4_SIMO
MIPI_HSI_CA_READY
McSPI4_CLK
USIF1_SW
IPC_SRDY
IPC_MRDY
MODEM_SEND
IFX_USB_VBUS_EN
RESET_PMU_N
OMAP_SEND
IFX_PWR_ON_SW/
IPC_I2S_CLK
IPC_I2S_DOUT
IPC_I2S_SYNC
IPC_I2S_DIN
CP_CRASH_INT
AUD_CLK_IN
HDMI_CEC
HDMI_SCL
HDMI_SDA
HDMI_CT_CP_HPD
HDMI_LS_OE
OMAP_CLK_IN
OMAP_CLK_IN
OMAP_CLK_REQ
OMAP_CLK_REQ
HDMI_HPD
HDMI_D1-
HDMI_D0-
HDMI_D0+
HDMI_D1+
HDMI_D2-
HDMI_D2+
HDMI_CLK-
HDMI_CLK+
PDM_DL_DATA
PDM_UL_DATA
ABE_CLKS
PDM_CLK
PDM_FRAME
AUD_PWRON
5M_MCLK
GPS_UART_TXD
GYRO_INT
CAM_SUBPM_EN
SYS_nIRQ2
MOTION_INT
GPS_RESET_N
GPS_UART_RXD
GPS_UART_RTS_N
GPS_UART_CTS_N SYS_BOOT4
SYS_BOOT4
SYS_BOOT7
SYS_BOOT7
PROXI_LDO_EN
GPS_LNA_SD
VIBE_PWM
VIBE_EN
SYS_BOOT1
SYS_BOOT1
SYS_BOOT2
SYS_BOOT2
SYS_BOOT6
SYS_BOOT6
PRIMARY_5M_RESET_N
MIPI_HSI_CA_WAKE
MIPI_HSI_CA_DATA
MIPI_HSI_CA_FLAG
MIPI_HSI_AC_READY
MIPI_HSI_AC_WAKE
TOUCH_RESET
LCD_EN
KEY_C[1]
COMPASS_INT
FUEL_INT/
FUEL_SDA
FUEL_SCL
MIPI HSI
For Touch S/W control
Rev.B
ARRAY TP
FM I2S
(Rev.1.0)
BOTTING
Removed
Rev.B
Rev.B
Rev.B
IFX control
Added(Rev.C)
SD/MMC2
Reference Clock
JATG & UART INTERFACE
1.2V_VIO GPIOs
USB
MUIC
SYSTEM
Key Pad
UART4
1st 5M CAM, VT CAM, CAM PMU, MUIC
I2C4
I2C3
TCXO_BUFFER, TI PMIC, TI CODEC
BT PCM
USB HSIC
IPC_PCM
NO ASSIGN
CSI2_1
CSI2_2
Composite
DSI1
DSI2
UART1
McSPI4
HDMI
UART2
GPIOs
SD/MMC1
PDM
IPC
McBSP1
McBSP2
FM, SD/MMC5(WLAN)
McSPI port usage
SPI1
SPI2
SPI3
SPI4
DMB
JTAG
Video
I2C
SYSTEM
1.8V & 3.0V_VIO
BT
MICROSD
WLAN
SD/MMC5
I2C2
I2C1
Port I2C port usage
TOUCH, LCD backlight booster, Flash LED driver, Compass sensor
2st 5M CAM, Gyro sensor, PROXI/ALC sensor
TI PMIC SRI2C
eMMC4.4
Rev.C
Rev.C
Added (P925 Rev.A)
Rev.D
Added(Rev.D)
Rev.E, 1.0
Added (Rev.E)
Rev.E
Removed (Rev.E)
Rev.1.0
Changed(Rev.1.0)
Removed (Rev.1.0)
Added (Rev.1.1)
6. CIRCUIT DIAGRAM
SC791
1
137R
K74
C739 1u
0.1u
C626
0.1u
C609
1u
C627
SC792
1
SDIN5C2-8G-974D
U721
5
R
3
R
2
R
1
R
41P
31P
21P
01P
3P 2P 1P 41
N
31
N
2 1
N
01
N
3
N
2
N
1
N
41
M
3 1
M
21
M
01
M
9
M
8
M
5
M
3
M
2
M
1
M
41L
31L
21L
3L 2L 1L 41K
31K
21K
11K
01K
9K 8K 7K 5K
AH11 K3
AH9 K1
AH6 J14
AH4 J13
AG13 J12
AG2 J11
AE14 J10
AE1 J9
AA14 J8
AA13 J7
AA12 J1
AA11 H14
AA10 H13
AA9 H12
AA8 H11
AA7 H10
AA2 H9
AA1 H8
Y14 H7
Y13 H6
Y12 H2
Y11 H1
Y10 D14
Y9 D1
Y8 B13
Y7 B2
Y6 A11
Y3 A9
Y1 A6
W14 A4
W13
W12 AA5
W11 AA3
W10 Y4
W9 W4
W8 K6
W7 AA6
W3 AA4
W2 Y5
W1 Y2
V14 K4
V13 U8
V12 R10
V3 P5
V2 M7
V1 U9
U14 T10
U13 N5
U12 M6
U10
U7 K2
U6
U5 W5
U3
U2 W6
U1
T14 J6
T13 J5
T12 J4
T5 J3
T3 J2
T2 H5
T1 H4
R14 H3
R13
R12 L4
NC140 NC74
NC75
DAT0 NC76
DAT1 NC77
DAT2 NC78
DAT3 NC79
DAT4 NC144
DAT5 NC81
DAT6 NC82
DAT7 NC83
NC84
CLK NC85
NC86
CMD RESET
NC153
VDDI NC150
NC148
VCC1 NC91
VCC2 NC92
VCC3 NC93
VCC4 NC94
VSS1 NC95
VSS2 NC96
VSS3 NC97
VSS4 NC98
VSSQ1 NC99
VSSQ2 NC100
VSSQ3 NC101
VSSQ4 NC102
VSSQ5 NC103
VCCQ1 NC104
VCCQ2 NC105
VCCQ3 NC106
VCCQ4 NC107
VCCQ5 NC108
NC109
NC1 NC110
NC2 NC111
NC3 NC112
NC4 NC113
NC5 NC114
NC6 NC115
NC7 NC116
NC8 NC117
NC9 NC118
NC10 NC119
NC146 NC120
NC147 NC121
NC13 NC122
NC14 NC123
NC15 NC142
NC16 NC125
NC17 NC126
NC18 NC127
NC19 NC128
NC20 NC129
NC21 NC130
NC22 NC131
NC23 NC132
NC24 NC133
NC25 NC134
NC26 NC135
NC27 NC136
NC28 NC137
NC29 NC138
NC30 NC139
941
C
N
23
C
N
33
C
N
43
C
N
53
C
N
63
C
N
73
C
N
83
C
N
93
C
N
04
C
N
14
C
N
24
C
N
34
C
N
44
C
N
54
C
N
64
C
N
74
C
N
84
C
N
151
C
N
251
C
N
451
C
N
541
C
N
35
C
N
45
C
N
55
C
N
65
C
N
75
C
N
85
C
N
141
C
N
06
C
N
16
C
N
26
C
N
36
C
N
46
C
N
551
C
N
341
C
N
76
C
N
86
C
N
96
C
N
07
C
N
17
C
N
27
C
N
651
C
N
SC793
1
SC794
1
SC796
1
SC795
1
K74
637R
C659 1u
VSEL_1.8V
1u
C619
0.1u
C744
2.2u
C743
FB743 600
SC797
1
1u
C620
10 R721
10 R723
10 R724
10 R725
10 R726
10 R728
R727 10
R730 10
240 R632
C610
0.1u
240 R631
VSEL_1.8V
0.1u
C742 C741
2.2u
FB741 600
C740 0.1u
737R
K74
K74
837R
937R
K74
537R
K74
337R
K74
K74
437R
K74
237R
VSEL_1.8V
VSEL_1.8V
10 R722
10 R729
U701
1
Fiducial1
VPMIC_VAUX1
SC798
1
0.1u
C611
0.1u
C614 C613
0.1u
C612
0.1u
NFM18PS105R0J3D_
FL621
IN OUT
GND
VSEL_VCORE3
VSEL_1.8V
VPMIC_VCXIO
VPMIC_VCXIO
C661 1u
VSEL_1.8V
VPMIC_VUSB
C618
0.1u
VPMIC_OMAP_VPP_CUST
VSEL_1.8V
0.1u
C671
0.1u
C656 C645
0.1u
1u C662
C665 1u
0.1u
C655 C654
0.1u
VSEL_VCORE3
0.1u C651
C646 0.1u
C648 0.1u VSEL_1.29V
VPMIC_VMMC
0.1u C644
VSEL_1.8V
C639
0.1u
C637
0.1u
VSEL_1.29V
VSEL_1.8V
0.1u
C683
C603
0.1u 0.1u
C602 C600
0.1u 0.1u
C601
0.1u
C682
C680
0.47u
C677
0.1u 0.1u
C678 C679
0.1u
C657 220n
VSEL_1.29V
VSEL_VMEM
C675
0.1u 0.1u
C674 C673
0.1u
C670
220n
C668 0.1u
C669
220n
C667 220n
220n C663
C658
0.1u
C652
0.1u
C653
0.1u
0.47u
C681
C649
220n
C647
220n
VSEL_1.29V
VPMIC_VDAC
VSEL_1.8V
C650
0.47u
0.1u
C642
0.1u
C641
0.1u
C640
VSEL_1.8V
VCORE2_OMAP_IVAUD
0.47u
C621
C607
1u
VCORE1_OMAP_MPU
U500
OMAP4430
41R
31R
21R
71P
61P
51P
41P
31P
21P
71N
61N
51N
41N
31N
21N
31H
12M
71M
61M
51M
41M
31M
71Y 1M
62L
52L
12L 9N
82K 2K
12J 4J 3J
82H
91H
71H
11H 1H
52F 2F 2C
72B
31B 6B 3B
32A
02A
01A
H15
N27
M27
K22
K21
T21
B28
B1
A28
AH28
N7
L22
D6
D5
D4
D3
C6
C5
C4
AH27
AG28
Y22
J8
AB12
A2
A1
T7
U22
AB11
AB13
N21
R21
AB10
M7
G9
G22
J7
V22
AA16
H16
G16
G7
H7
W7
G20
G19
G18
G17
AA14
AB17
AA7
AB18
AB19
AB8
AB20
AB16
AB21
AH25
AH20
AH18
AD28
AB28
AB22
AA21
AA22
T28
AH12
AH9
AH4
AF1
AC1
AB9
AA9
AA8
Y1
U1
L8
L28
L7
M8
J28
H21
H20
H9
H8
G21
G8
G1
E28
D1
A25
A22
A17
A12
A9
A6
A4
B2
A26
AF28
AH16
T8
G15
R27
Y14
AH3
AF27
C28
A3
T2
T1
N28
AG14
B15
A15
AG27
AG2
C1
R28
P1
N1
AH14
C27
A13
A5
A7
M28
AB14
N22
P7
T22
Y16
P9
G13
G12
A11
V28
W28
L2
L1
Y7
K7
W22
AB7
V7
U7
J22
H22
AA18
AA19
AA17
Y21
Y20
Y19
Y18
W21
W20
V21
AA10
Y10
Y9
Y8
W9
W8
V8
U9
V9
V20
T9
AA13
Y13
Y12
Y11
U20
T20
R20
N20
M20
M9
L20
L9
K20
K9
J20
J19
J18
J17
J16
J15
J13
J12
J11
J10
J9
H18
H12
22R
8N 8P 11G
22M
01G
01H
12HA
31HA
01HA
8HA
62GA
71GA
4GA
2FA
72EA
1BA
8K 02AA
21AA
11AA
62Y
52Y
82U
12U
71U
61U
51 U
41U
31U
21U
8U 2U 71T
61T
51T
41T
31T
21T
71R
61R
51R
84_S SV
94_SS V
05_SSV
15_SSV
25 _SSV
35 _SSV
45_ SSV
55_ SSV
65_SS V
75_SS V
85_SSV
95_ SSV
06 _SS V
16_SS V
26_ SSV
36_ SSV
46 _SS V
56_SS V
66_ SSV
76_ SSV
86_SS V
96_SSV
07_SSV
17_ SSV
27_SSV
37_SSV
47_SSV
57_SSV
67_SSV
77_SSV
87_SSV
97_SSV
08_SSV
18_SSV
28_SSV
GTO0ABSU_ASSV
V3P3_GTO0ABSU_ASSV
INU_ASSV
CADV_IMDH_ASSV
0_ISD_ASSV
1_ISD_ASSV
2ISC_ASSV
VDD_CORE_0
VDD_CORE_1
VDD_CORE_2
VDD_CORE_3
VDD_CORE_4
VDD_CORE_5
VDD_CORE_6
VDD_CORE_7
VDD_CORE_8
VDD_CORE_9
VDD_CORE_10
VDD_CORE_11
VDD_CORE_12
VDD_CORE_13
VDD_CORE_14
VDD_CORE_15
VDD_CORE_16
VDD_CORE_17
VDD_CORE_18
VDD_CORE_19
VDD_CORE_20
VDD_CORE_21
VDD_CORE_22
VDD_CORE_23
VDD_CORE_24
VDD_CORE_25
VDD_CORE_26
VDD_CORE_27
VDD_CORE_28
VDD_MPU_0
VDD_MPU_1
VDD_MPU_2
VDD_MPU_3
VDD_MPU_4
VDD_MPU_5
VDD_MPU_6
VDD_MPU_7
VDD_MPU_8
VDD_IVA_AUDIO_0
VDD_IVA_AUDIO_1
VDD_IVA_AUDIO_2
VDD_IVA_AUDIO_3
VDD_IVA_AUDIO_4
VDD_IVA_AUDIO_5
VDD_IVA_AUDIO_6
VDD_IVA_AUDIO_7
VDD_IVA_AUDIO_8
VDD_IVA_AUDIO_9
VDDS_1P8_0
VDDS_1P8_1
VDDS_1P8_2
VDDS_1P8_3
VDDS_1P8_4
VDDS_1P8_5
VDDS_1P8_6
VDDS_1P8_FREF
VDDA_DSI1
VDDA_DSI2
VDDA_CSI21
VDDA_CSI22
VDDA_HDMI_VDAC_0
VDDA_HDMI_VDAC_1
VDDA_DPLL_CORE_AUDIO
VDDA_DPLL_MPU
VDDA_DPLL_IVA_PER
VDDA_LDO_SRAM_CORE
VDDA_LDO_EMU_WKUP
VDDA_LDO_SRAM_IVA_AUDIO
VDDA_LDO_SRAM_MPU
VDDA_UNI
VDDA_USBA0OTG_1P8V
VDDA_USBA0OTG_3P3V
POP_VDD1_LPDDR21_A15
POP_VDD1_LPDDR21_C28
POP_VDD1_LPDDR21_AJ15
POP_VDD1_LPDDR22_N2
POP_VDD1_LPDDR22_R1
POP_VDD1_LPDDR22_P29
POP_VDD1_LPDDR2_SHARED_C1
POP_VDD1_LPDDR2_SHARED_AH2
POP_VDD2_LPDDR21_A16
POP_VDD2_LPDDR21_B16
POP_VDD2_LPDDR21_AH15
POP_VDD2_LPDDR22_P28
POP_VDD2_LPDDR22_T1
POP_VDD2_LPDDR22_T2
POP_VDD2_LPDDR2_SHARED_A3
POP_VDD2_LPDDR2_SHARED_C29
POP_VDD2_LPDDR2_SHARED_AG28
VDDCA_VREF_LPDDR21
VDDCA_VREF_LPDDR22
VDDQ_VREF_LPDDR21
VDDQ_VREF_LPDDR22
POP_LPDDR21_ZQ_AJ17
POP_LPDDR22_ZQ_AG29
POP_VACC_LPDDR2_B28
POP_VACC_LPDDR2_B2
VDDQ_LPDDR2_0
VDDQ_LPDDR2_1
VDDQ_LPDDR2_2
VDDQ_LPDDR2_3
VDDQ_LPDDR2_4
VDDQ_LPDDR2_5
VDDQ_LPDDR2_6
VDDQ_LPDDR2_7
VDDQ_LPDDR2_8
VDDQ_LPDDR2_9
VDDQ_LPDDR2_10
VDDQ_LPDDR2_11
VDDQ_LPDDR2_12
VDDQ_LPDDR2_13
VDDQ_LPDDR2_14
VDDQ_LPDDR2_15
VDDQ_LPDDR2_16
VDDQ_LPDDR2_17
VDDQ_LPDDR2_18
VDDQ_LPDDR2_19
VDDQ_LPDDR2_20
VDDQ_LPDDR2_21
VDDQ_LPDDR2_22
VDDQ_LPDDR2_23
VDDQ_LPDDR2_24
VDDQ_LPDDR2_25
VDDQ_LPDDR2_26
VDDQ_LPDDR2_27
VDDQ_LPDDR2_28
VDDQ_LPDDR2_29
VDDQ_LPDDR2_30
VDDCA_LPDDR2_0
VDDCA_LPDDR2_1
VDDCA_LPDDR2_2
VDDCA_LPDDR2_3
VDDCA_LPDDR2_4
VDDCA_LPDDR2_5
VDDCA_LPDDR2_6
VDDCA_LPDDR2_7
VDDCA_LPDDR2_8
VDDCA_LPDDR2_9
VDDS_DV_BANK0
VDDS_DV_BANK1
VDDS_DV_BANK2_0
VDDS_DV_BANK2_1
VDDS_DV_BANK3
VDDS_DV_BANK4
VDDS_DV_BANK5
VDDS_DV_BANK6
VDDS_DV_C2C_0
VDDS_DV_C2C_1
VDDS_DV_C2C_2
VDDS_DV_GPMC
VDDS_DV_FREF
VDDS_SDMMC1_0
VDDS_SDMMC1_1
VDDS_DV_SDMMC2_0
VDDS_DV_SDMMC2_1
VDDS_1P2
VDDS_DV_CAM
VDDS_SIM
VDDA_DLL0_LPDDR21
VDDA_DLL1_LPDDR21
VDDA_DLL0_LPDDR22
VDDA_DLL1_LPDDR22
CAP_VBB_LDO_IVA_AUDIO
CAP_VDD_LDO_SRAM_IVA_AUDIO
CAP_VBB_LDO_MPU
CAP_VDD_LDO_SRAM_MPU
CAP_VDD_LDO_SRAM_CORE
CAP_VDD_LDO_EMU_WKUP
PBIAS_SDMMC1
PBIAS_SIM
VDDA_BDGP_VBB
VPP_CUST
VPP_STD
VSENSE
IFORCE
RSVD1
RSVD2
RSVD3
RSVD4
RSVD5
RSVD6
RSVD7
RSVD8
RSVD9
LPDDR21_NCS0
NC1
NC2
NC3
NC4
NC5
NC6
NC7
NC8
NC9
0_SSV
1_S SV
2_S SV
3_SSV
4_SSV
5_S SV
6_S SV
7_SSV
8_SSV
9_SSV
01_SSV
1 1_ SSV
2 1_SSV
31_SSV
41_ SSV
5 1_ SSV
61_SSV
71_SSV
81_ SSV
91_ SSV
02_SSV
12_SSV
22_ SSV
32_SSV
42_SSV
52_SSV
62_SSV
72_ SSV
82_SSV
92_SSV
03_SSV
13_SSV
23_SSV
33_SSV
43_SSV
53_SSV
63_SSV
73_SSV
83_SSV
93_SSV
04_SSV
14_SSV
24_SSV
34_SSV
44_SSV
54_SSV
64_SSV
74_SSV
VSEL_1.8V
SC799
1
C660 1u
C636
220n
C635
0.1u
C617
0.47u
OJ704
FL627
NFM18PS105R0J3D_
IN OUT
GND
C605
1u
VSEL_1.29V
C686
220n
C685
220n
C687
4.7u 1u
C688
OJ701
C684 0.1u
OJ703 OJ702
SDMMC2_CMD
SDMMC2_CLK
SYS_nRESWARM
SDMMC2_DAT[0]
SDMMC2_DAT[1]
SDMMC2_DAT[2]
SDMMC2_DAT[3]
SDMMC2_DAT[4]
SDMMC2_DAT[5]
SDMMC2_DAT[6]
SDMMC2_DAT[7]
Shield Can Clip (Top)
1%
1%
eMMC 8GB
PoP LPDDR2
4Gb
Voltage Level Check!!!
OMAP POWER
Shield Can
Top Bottom
Screw
Added (P925 Rev.A)
Added (P925 Rev.A)
Added (P925 Rev.A)
Changed (Rev.E)
Changed (Rev.E)
Added (Rev.E)
Added (Rev.1.0)
6. CIRCUIT DIAGRAM
2.2u
C890
C892
1u
C830
10p 10p
C833
R811
(1%)
80.6K
C807
0.47u
VBAT
(0603)
C803
6p
C802
10p
(0603)
VSEL_1.8V
10u C813
K01
008R
TWL6030
U800
21A
11A
51B
41A
21B
31A
41B
11B
21D
21K
31E
31D 9J 9K 8K 7M 6N
21L 8H 8G 9G 9H 6M
51N
21M
11M 5K 5L 5J 7K 5M 5N
01K
31M
31N 4M 4N 2N
51A 8J
11N
21N 1T 2T 1R 5H
61T
51T
61R 1A 2A 1B
R12
T12
R11
T11
R13
R10
T10
H15
H16
J15
J16
G16
K15
K16
E15
E16
D15
D16
F16
C15
C16
M15
L16
M16
P15
P16
N16
L15
R14
T14
T13
H2
H1
J2
J1
G1
K2
K1
R5
T5
R6
T6
R4
R7
T7
M2
L1
M1
P2
P1
N1
L2
R3
T3
T4
E8
A8
A10
J10
H10
E9
F5
F2
E2
F1
E1
E6
D4
E4
G2
B3
B4
A4
A3
D6
D5
H7
E5
F4
J7
D2
C2
D1
C1
E12
F12
A9
H12
G12
B16
A16
G10
01E
7A 7D 4K 31J
51G
51F
9R 9T 8T 01B
8B 5B 6B 6A 5A 4G 8M 7G 4H 9D 31L
11E
01M
8N 31B
9M 31H
31F
7B 8D 31K
21J
8R 01N
7N 4J 01D
11D
4L 9B 31G
9N
1B_DD V
2B_DDV
3B_DDV
4 B_DDV
NI_ CTRV
NI_A NAV
NI_P P V
NI _1XUA V
NI _2XUAV
NI _ 3XUAV
1NI _CMMV
2N I_C MMV
1NI_MI S UV
2 NI_ MIS UV
NI_ OIX CV
NI_C ADV
OIV
TA BV
1B _ANA_DN G
2 B_A NA_D NG
3B_A NA_ DNG
4B _ANA_DN G
5B _AN A_DN G
6B_A NA_ DNG
7B_A NA_ DNG
OIV _GI D_DN G
CTRV_G ID_ DNG
1 B_D NGP _GRH C
2B_D NGP _GR HC
3B_DNGP_G RHC
4B_DNGP_G RHC
MISUV
ANAV
1XUAV
2XUAV
3XUAV
OIXCV
CADV
CMMV
PPV
CTRV
BSUV
PUKCABV
VPROG
PBKG_B51
PBKG_B53
VBG
IREF
REFGND_B1
REFGND_B2
ID
VBUS_B1
VBUS_B2
VBUS_B3
VBUS_B4
CHRG_EXTCHRG_ENZ
VAC
CHRG_DET_N
CHRG_EXTCHRG_STATZ
CHRG_LED_TEST
CHRG_LED_IN
CHRG_SW_B1
CHRG_SW_B2
CHRG_SW_B3
CHRG_SW_B4
CHRG_BOOT
CHRG_CSIN
CHRG_CSOUT
CHRG_AUXPWR
CHRG_PMID_B1
CHRG_PMID_B2
CHRG_PMID_B3
CHRG_PMID_B4
CHRG_VREF
CLK32KAUDIO
CLK32KAO
CLK32KG
OSC32KIN
OSC32KOUT
OSC32KCAP
VCORE1_IN_B1
VCORE1_IN_B2
VCORE1_IN_B3
VCORE1_FDBK
VCORE1_SW_B1
VCORE1_SW_B2
VCORE1_SW_B3
VCORE1_GND_B1
VCORE1_GND_B2
VCORE1_GND_B3
VCORE2_IN_B1
VCORE2_IN_B2
VCORE2_FDBK
VCORE2_SW_B1
VCORE2_SW_B2
VCORE2_GND_B1
VCORE2_GND_B2
VCORE3_IN_B1
VCORE3_IN_B2
VCORE3_FDBK
VCORE3_SW_B1
VCORE3_SW_B2
VCORE3_GND_B1
VCORE3_GND_B2
V1V8_IN_B1
V1V8_IN_B2
V1V8_IN_B3
V1V8_FDBK
V1V8_SW_B1
V1V8_SW_B2
V1V8_SW_B3
V1V8_GND_B1
V1V8_GND_B2
V1V8_GND_B3
V2V1_IN_B1
V2V1_IN_B2
V2V1_FDBK
V2V1_SW_B1
V2V1_SW_B2
V2V1_GND_B1
V2V1_GND_B2
V1V29_IN_B1
V1V29_IN_B2
V1V29_FDBK
V1V29_SW_B1
V1V29_SW_B2
V1V29_GND_B1
V1V29_GND_B2
VMEM_IN_B1
VMEM_IN_B2
VMEM_FDBK
VMEM_SW_B1
VMEM_SW_B2
VMEM_GND_B1
VMEM_GND_B2
3 4B _GKBP
24B_GKBP
14B_GKBP
33B _G KBP
23B _GKBP
13B_GKBP
2B_GKBP
31B _G KBP
21B_GKBP
11B_GKBP
MIS
CMM
NETSET
VT SET
ER UCE SM
ADS_C2ILTC
LCS_ C2I LTC
ADS_C2IRS
LCS_C2IRS
TNI
NORW PS ERN
MRAWSERN
1NEGER
2NEGER
NORWP
NORWPR
1MWP
2 MW P
ECR OFMWP
NESYS
3TOOB
2T OOB
1TOOB
0TOOB
LAVO MERTAB
3QERP
C2QERP
B2QERP
A2QERP
1QERP
NSER_EGUAGG
PSER_EGUAGG
TRATS_CDAPG
0NI_CDAPG
1NI_CDAPG
2NI_CDAPG
3NI_CDAPG
4NI_CDAPG
5NI_CDAPG
6NI_CDAPG
1FERV_CDAPG
4FERV_CDAPG
0.1u C812
BAT800
311HR-VG1
R804
150K
(0603)
C801
10n
VSEL_1.8V
VCHG
ZD801
PSD12-LF
VSEL_1.8V
USB_VBUS
C853
2.2u
(0603)
100p
C800
VBAT
)
%1(
828
R
s
mhoK2
R891
150
FB803 220
C848
1u
C855
1u 1u
C850
R809
330k
1u
C854
1u
C844 C852
1u
2.2u
C836
2.2u
C837
2.2u
C838 C839
2.2u 2.2u
C840
C849
1u
C816
4.7u
VA800
RF051V1015050LV
CI
VSEL_1.8V
FSUSB63
U851
11 12
9
4
6
3
5
2
7
1 8
10
HSD3+
HSD2+ D+
HSD2-
D-
HSD1-
GND
HSD1+
SEL0
HSD3-
VCC SEL1
1u
C841
K01
308R
ESD9B5_0ST5G
ZD802
120 FB805
CN801
GU077-5P-SD-E1500
11
10
9
5
4
3
2
1
8
7
6
VBUS
D-
D+
ID
GND
508R
K01
CN800
EAG62832401
3
2
1
D1
D2
VPMIC_VRTC
NFM18PC104R1C3
FL800
IN OUT
GND1 GND2
IND
818R
VSEL_1.8V
VSEL_1.8V
C805
100u
VBAT
R893
150
C858
10n
VBAT
220 FB800
(0603)
10K
R821
1u
C811
C809
1u
728
R
)
%1(
065
C817
4.7u
R830 1M
2.2u
C845
32.768KHz
FC-135
X800
2
1
L804 0.47u
L806 0.47u
L800 0.68u
C842
2.2u
808R
K01
C804
(0603)
3p
0.47u L801
C834
2.2u
C832
2.2u
L802 0.47u
L805 0.47u
L803 0.68u
C891
1u
VCORE1_OMAP_MPU
C831 10u
628C
u7.4
C828 10u
4.7u
C824
120 FB801
VSEL_VMEM
C825 10u
4.7u
C819
120 FB804
VSEL_1.29V
C821 10u
VSEL_2.1V
928C
u7.4
10u C818
C814
4.7u
120 FB802
USB_VBUS
VCORE2_OMAP_IVAUD
VSEL_1.8V
VSEL_VCORE3
C815 10u
C808
4.7u
FB806 120
56K
R850
C827
1u
2.2K R848
ZD803
PSD05-LF
VSEL_1.8V
C822
0.1u
U801
RT9524
6 5
7 4
8 3
9 2
10 1
11
PGND
VIN BATT
ISET PGB
GND1 CHGSB
LDO GND2
IEOC EN_SET
2.2u
C835
R892
100K
C823
1u
C846
1u
4
3
2
1
2.2u
C851
C820
100n
R895 0
R894 0
U891 MAX17043G
9
7 4
8 1
6
5
3 2
CELL VDD
ALRT
QSTRT
CTG SDA
GND SCL DNGP
R896 DNI
DNI R897
TP809
1u
C810
R854
1.5K
U811
MAX14526EEWP+TCC6
2B1C2C
C3 A2
C4
D3
D1 D4
A1
B1
A3
B4 B3
B5 A5
C5 A4
D5 D2
BAT VB
DN1 COMN1
DP2 COMP2
U1 UID
U2
RES
MIC
AUD1 CAP
AUD2
GND
ISET IC LCS
ADS
TNI
R853
1.5K
R801
10K 10K
R802
NTUD3169CZ
Q801
4 3
5 2
6 1
S1 D1
G1 G2
D2 S2
VBAT
VBAT
VBAT
VBAT
VBAT
VBAT
VBAT
VBAT
VBAT
VBAT
VPMIC_VAUX1
VPMIC_VDAC
M
R
A
W
S
E
Rn_
S
Y
S
VPMIC_VMMC
VPMIC_VUSB
VPMIC_OMAP_VPP_CUST
VPMIC_VCXIO
CHG_STATUS/
BATT_THM_ADC
BATT_THM_ADC
I2C3_SCL
I2C3_SDA
CHG_EN_SET/
USB_VBUS
/
T
E
D_
D
S
O
R
CI
M
VCHG
VCHG
CLK32K_MAIN
CLK32K_AUD
I2C1_SCL
L
C
S_1
C2I
I2C1_SDA
A
D
S_1
C2I
TWL_LDO_1.8V
MUIC_INT/
USB_DM_OMAP
USB_DP_OMAP
L
C
S _
C2 I
R
S
A
D
S_
C2I
R
S
VPMIC_VRTC
PCB_VER_ADC
PCB_VER_ADC
C
E
S
M_
M
R
D_
S
Y
S
UART4_RX_OMAP
UART4_TX_OMAP
UART_SW1
UART_SW2
SYS_nRESPWRON
UART_TX_SW
UART_RX_SW
UART_RX
UART_RX
UART_TX
UART_TX
1
Q
RIn_
S
Y
S
Q
E
R
R
W
P_
S
Y
S
CLK32K_GATE
USB_D-_IFX
USB_D+_IFX
0
T
O
O
B
BOOT0
1
T
O
O
B
BOOT1
2
T
O
O
B
BOOT2
3
T
O
O
B
BOOT3
USB_ID
USB_DP
USB_DM
W
S_
N
O_
R
W
P
TWL_LDO_2.8V
VSEL_2.1V
N
E_
O
DL_
R
O
S
N
E
S
TWL_LDO_3.0V
FUEL_INT/
FUEL_SDA
FUEL_SCL
PCB VERSION CHECK
CHARGER : 1mm
Changed (Rev.C)
FUEL GAUGE
Sensing node
Close to batt. connector
Rev.B
Rev.B
Rev.B
# VBAT LINE WIDTH (STAR Connection)
GSM PA : 2mm -> WCDMA PA 1mm
PMB9801 : 1mm
TWL6030 : 1.5mm
1mm 1mm
0.15mm
150K
150K
150K
150K
150K
150K 10K
1.8V
1.8V
1.8V
1.8V
1.8V Rev.1.0
1.8V
1.8V
150K
# PCB Revision Check ADC
REV
E
330K
C 100K
180K
D 130K
B
240K
EVB
VDD
1.8V
150K
A
68K
Rev.1.1
R1 R2
47K
ADC
Deleted (Rev.B)
780 ohm->(680mA)
2K(10%)->91mA
0.05mm
(Sudden Momentary Power Loss)
through many vias for heat emission.
820 ohm->(646mA)
SMPL DETECTION
560 ohm->(910mA)
R1
R2
1%
Added (Rev.B)
0.113V
0.561V
0.720V
0.836V
1.108V
0.982V
1.238V
0.429V
Rev.C
1%
CHARGER IC
BATTERY CONNECTOR
GND pad on the bottom of chip has to be connected to main GND trace
DP3T SWITCH
1mm
90ohm matching !!
90ohm matching !!
MICRO USB CONN. + MUIC
(Rev.C)
Removed Res.
Changed (Rev.C)
Removed HOOK_ADC (Rev.C)
)
C.ve
R(
L
A
V
O
M
E
R
_
T
A
B
dev
o
me
R
Added (P925 Rev.A)
Changed
Added (P925 Rev.B)
Changed (Rev.E)
Added (Rev.E)
Changed (Rev.E)
Changed (Rev.E,1.1)
Changed (Rev.E, 1.1)
(P925 Rev.A, Rev.E)
Changed ( Rev 1.0)
Added (Rev.1.1)
6. CIRCUIT DIAGRAM
470n C940
RF0518130SVCI
VA901
C934
2.2u
C926 0.47u
C991
1u
C975
1u
AMI306
U975
10
9 5
4
6
3
7
2
8
1
DDVA
YDRD
DNG
LCS
GERV
PPV
INT
SDA ADDR
DVDD
R973
DNI
C902
4.7u
R902
1.5K
SENSOR_3.0V
C920 0.1u
0.1u C919
C922 0.1u C901
4.7u
1u
C992
SENSOR_3.0V
1u
C973
0.1u
C965
VSEL_1.8V
TP901
VSEL_1.8V
C962
0.1u
C972
0.1u
0.1u
C971 U971
KXTF9
4
3
2
1
5
01
6
7
8
9
SCL
DNC4
INT
DNC3
ADS
DDV
IO_VDD
DNC1
DNC2
GND
VSEL_1.8V
SENSOR_3.0V
MPU3050A
U961
25
21
20
22
19
23
24
8171
9
8
10
7
11
6
12
5
31
4
41
3
51
2
6 1
1
NIKLC
7CN
1CN
6CN
2CN
5CN
3CN
DDV
4CN
INT
AD_EMI
FSYNC
IME_CL
REGOUT
VLOGIC
AD0
8CN
DNG
SDA
SCL
RESV1
CLKOUT
CPOUT
RESV2
NC9
0.1u C916
ISA1000
EUSY0238306
U981
9 0 1 11
5 4
6 3
7 2
8 1
EN VDP
PWM GND
MODE VDD
GAIN VDN
3CN
2CN
1CN
C961 2.2n
TP902
C993
1u
0 R921
TP903
2.2u
C935
0.1u C917
RT9032AGQW
U991
9
5 4
6 3
7 2
8 1
VIN VOUT1
EN1 VOUT2
P2 GND
P1 EN2
DNGP
TP904
VBAT
PROXI_3.0V
SENSOR_3.0V
C941
100n
0.1u
C963
TWL_LDO_3.0V
C987
2.2u
R982
DNI
1u
C923
L988 82n
L989 82n
C915 0.1u
C936
220n
2.2u C924
R919 0
C933
100n
VBAT
120 FB941
FB913 120
U901
TWL6040
8G 7G 8F 7E 6E
E5
D7
D6
D5
01D
11D 1D 2E 7L 9F 1G
01H
01C 9L 4K 2L 2B 2C
01A 7A 6A 3A 7J 9E 2G
01J
11B 5H
B1
A2
D3
C1
A8
A9
B5
B4
B8
B9
A5
A4
F4
G4
F3
G3
K11
J11
C11
B10
F1
F2
H2
H1
J3
H4
J4
J2
K1
K3
L4
J5
H7
K7
L11
A11
L1
A1
K2
E1
G5
L5
K6
L6
B7
B6
D4
E8
J9
D8
G6
H6
H8
K8
L10
L8
K9
F11
G11
G9
E11
E10
H11
K10
E4
F7
F6
F5
8J 2D 3B 6J 9C 8C 7C 6C 4C 5C 01G
01F
1J 9D 3E 3L 3H 9H 5K
FERDNG
SHDNG
C IMA DNG
CIMD DNG
1ODLDNG
2ODLDNG
MC VDNG
1 PCND NG
2 PCN DNG
1LF HDNG
2LF HDNG
3 LFHD NG
1 RFH DNG
2RF HDNG
3RFHDNG
GID DNG
R BIV DNG
LBIVDNG
OIDNG
PBKG1
PBKG2
PBKG3
PBKG4
PBKG5
VDDREGNCP
NCPOUT1
NCPOUT2
NCPFB
CFLYP
CFLYN
PDMDN
PDMUP
PDMCLK
PDMCLKLB
PDMFRAME
SDA
SCL
AUDPWRON
NRESPWRON
NAUDINT
GPO1
GPO2
GPO3
REFN
REFP
REF
PLUGDET
ACCONN
ATEST
DTEST1
DTEST2
DTEST3
PROG
MCLK
CLK32K
DBIAS1
DBIAS2
MBIAS
MMICP
MMICN
SMICP
SMICN
HBIAS
HMICP
HMICN
AFMR
AFML
EARP
EARN
HSL
HSR
AUXLP
AUXLN
AUXRP
AUXRN
HFLP1
HFLN1
HFRP1
HFRN1
HFLP2
HFLN2
HFRP2
HFRN2
VIBLP
VIBLN
VIBRP
VIBRN
FERVDDV
RAEDDV
S HDD V
L UDD V
LDDDV
LLPDDV
1LFH DDV
2LFHDDV
1RFHDDV
2RFHDDV
LBIVDDV
RBIVDDV
SAIB MA DDV
SAIB MDDDV
OIVDDV
RAESSV
S HSSV
LUSSV
LDSSV
L LPS SV
1V 2V DDV
ODLDDV
NIODLSSV
O DLS SV
NC1
NC2
NC3
NC4
5CN
6CN
7CN
8CN
9CN
VBAT VSEL_1.8V
C932
0.1u
VSEL_2.1V
C931
0.1u
C939
0.1u 0.1u
C930 C929
0.1u
0.1u C928
C938
0.1u 2.2u
C937
2.2u C927
4.7u C904
C905 4.7u
C903
4.7u
FB901 120
C925 0.1u
FB914 120
1n
C913
1n
C914
VSEL_2.1V
C921 0.1u
C918 0.1u
C978
1u
VA902
ICVS0318150FR
R986 470K
ICVS0318150FR
VA903
0 R987
TP905
R981
100K
R901
1.5K
VSEL_1.8V
C986 3.9n
VSEL_1.8V
C976
10n
CLK32K_AUD
I2C1_SCL
I2C1_SDA
SYS_nRESPWRON
SENSOR_LDO_EN
MICBIAS
MMIC_P
AUD_SPK_N
AUD_SPK_P
VIB_L_P
VIB_L_N
AUD_RCV_N
AUD_RCV_P
I2C4_SDA
I2C4_SDA
I2C4_SCL
I2C4_SCL
HS_MICBIAS
EAR_L
EAR_R
SMIC_P
SMIC_N
HOOK_ADC
HS_MIC
EAR_SENSE
MMIC_N
FM_AUDIO_L
FM_AUDIO_R
AUD_CLK_IN
PDM_DL_DATA
PDM_UL_DATA
ABE_CLKS
PDM_CLK
PDM_FRAME
AUD_PWRON
GYRO_INT
SYS_nIRQ2
MOTION_INT
PROXI_LDO_EN
VIBE_PWM
VIBE_EN
IME_DA
A
D
_
E
M
I
IME_CL
L
C
_
E
M
I
COMPASS_INT
AUDIO CODEC (TWL6040) GYRO SENSOR MOTION SENSOR
SENSOR LDO
MOTOR DRIVER
Digital Compass Movee to MAIN (P925 Rev.B)
Added (Rev.B)
Open/ground switch input
stereo headphone
stereo speaker
earpiece
a differential class-AB driver
stereo line outputs
DOWNLINK
UPLINK
filterless class-D outputs with 1.5W
with 2 Vrms capability to a typical 32Ohm
a stereo line-input
2.1V
2.1V
X
X
Microphone input
Removed (Rev.C)
Added (P925 Rev.A)
Added (P925 Rev.A)
Added (P925 Rev.A)
Added (P925 Rev.A)
Added (P925 Rev.A)
Digital Compass Sensor
Removed (Rev.C)
Added (Rev.1.0)
6. CIRCUIT DIAGRAM
C1175
0.1u 0.1u
C1176 R1176
10K
FL1172
ICMEF112P900M
5
6
3 1
4 2
P2 P4
P1 P3
6P
5P
1u
C1143
4
3
2
1
R1136
510K
R1195
1K
G5TS0_5B9DSE ZD1172
R1191 DNI
100K
R1101
ICMEF112P900M
FL1171 5
6
3 1
4 2
P2 P4
P1 P3
6P
5P
100K
R1126
10u L1121
600 FB1143
1u
C1102 C1103
1u
VSEL_1.8V
ICMEF214P101M
FL1142
01 9
8 4
7 3
6 2
5 1
P1 P5
P2 P6
P3 P7
P4 P8
1
G
2
G
51K
R1133
200K
R1174
VSEL_1.8V
2.8V_3D_LCD
R1102
1.5K
12V_3D_LCD
PROXI_3.0V
2.8V_LCD_VCI
1.8V_LCD_IOVCC
SENSOR_3.0V
12V_3D_LCD
VSEL_1.8V
VBAT
VBAT
24-5804-034-000-829+
CN1161
18 17
19 16
20 15
21 14
22 13
23 12
24 11
25 10
26 9
27 8
28 7
29 6
30 5
31 4
32 3
33 2
34 1
FL1141
ICMEF214P101M 019
8 4
7 3
6 2
5 1
P1 P5
P2 P6
P3 P7
P4 P8
1
G
2
G
1u
C1122
LM3528
U1121
B2
D1
C3
A2
3D
C2
A3
2D
B3
A1
C1
B1
GPIO1
HWEN/PGEN/GPIO
OVP
SET
WS
SUB/FB
SDA
DNG
MAIN
IN
VIO
SCL
TWL_LDO_1.8V
C1121
1u
SENSOR_3.0V
CN1141
24-5804-030-000-829+
16 15
17 14
18 13
19 12
20 11
21 10
22 9
23 8
24 7
25 6
26 5
27 4
28 3
29 2
30 1
12K
R1125
VSIM_2.9V
VBAT
VPMIC_VMMC
C1177
33p
200K
R1134
1.8V_LCD_IOVCC
2.8V_LCD_VCC
2.8V_LCD_VCC
VBAT
C1101
1u
1u
C1173
4.7K R1186
C1134
0.1u
CN1191
SIDEKEY_4P
4
3
2
1
G5TS0_5B9DSE 3911DZ
1911DZ
G5TS0_5B9DSE
2011AV
RF0518130SVCI
G5TS0_5B9DSE 2911DZ
5311R
K22
4011AV
RF0518130SVCI
C1179
10u
0.1u C1132
2.2K
R1178
TWL_LDO_2.8V
470p
C1178
C1138 0.1u
C1137
1u
4.7u
C1131
TPS61093
U1131
11
10
9
4
7
3
5
2
8
6
1
GND
SS
OUT
VIN
EN
CP2
FB
CP1
SW
VO
Exposed_GND
D1122
G5TS0_5B9DSE 281 1DZ
VSEL_1.8V
G5TS0_5B9DSE 1811DZ
VSEL_1.8V
VSMF05LCC
D1175
4
3
5
2
6
1
24-5804-020-000-829+
CN1181
11 10
12 9
13 8
14 7
15 6
16 5
17 4
18 3
19 2
20 1
VBAT
G5TS0_5B9DSE
5911DZ
R1173 1M
U1101
RT9032AGQW
9
5 4
6 3
7 2
8 1
VIN VOUT1
EN1 VOUT2
P2 GND
P1 EN2
D NGP
C1141
1u
1800 FB1175
1800 FB1176
FB1177 1800
FB1173
1800
L1172
DNI
2.8V_3D_LCD
C1171 1n
C1174
27p
R1171
4.7K
Q1186
UMT2222A
1
2
3
120 FB1174
100K
R1187
CN1195
2
1
DNI R1190
U1106
BU28TD2WNVX
5
3 2
4 1
VOUT VIN
GND STBY
D
N
GP
4.7u L1131
24-5804-034-000-829+
CN1171
18 17
19 16
20 15
21 14
22 13
23 12
24 11
25 10
26 9
27 8
28 7
29 6
30 5
31 4
32 3
33 2
34 1
C1107
1u
R1172
DNI
C1172
DNI
R1103
1.5K
VBAT
C1106
1u
U1108
NLSV1T244MUTBG
4 3
5 2
6 1
VCCA VCCB
A B
GND OE_
VSEL_1.8V 2.8V_LCD_VCC
Q1173
2SJ347
2
3
1 G
D
S
GSM_TXON_IND
I2C3_SCL
I2C3_SDA
MICROSD_DET/
PWR_ON_SW
PWR_ON_SW
I2C2_SCL
I2C2_SCL
I2C2_SCL
MICROSD_CMD
MICROSD_DAT0
MICROSD_DAT1
MICROSD_DAT2
MICROSD_DAT3
MICROSD_CLK
FLASH_EN
MICBIAS
MICBIAS
FM_ANT
MMIC_P
AUD_SPK_N
AUD_SPK_P
VIB_L_P
VIB_L_N
AUD_RCV_N
AUD_RCV_P
I2C2_SDA
I2C2_SDA
I2C2_SDA
VT_0.3M_MCLK
VT_0.3M_MIPI_CLK_P
VT_0.3M_MIPI_CLK_N
HS_MICBIAS
USIM_RESET/
USIM_CLK
USIM_DATA
PROX_INT
VT_CAM_PWDN
VT_CAM_RESET/
LCD_RESET_N
FRONT_KEY_LED_EN
EAR_L
EAR_R
LED_C2
LED_C2
LED_C1
LED_C1
LED_A
LED_A
DSI2_LCD_MIPI_CLK_P
DSI2_LCD_MIPI_CLK_N
DSI2_LCD_MIPI_D0_P
DSI2_LCD_MIPI_D1_P
DSI2_LCD_MIPI_D1_N
DSI2_LCD_MIPI_D0_N
SMIC_P
SMIC_N
MICROSD_COVER_DET/
LCD_CP_EN
TOUCH_INT_N
KEY_C[0]
KEY_R[0]
HOOK_ADC
HS_MIC|HOOK_ADC
HS_MIC
KEY_R[1]
KEY_R[1]
EAR_SENSE
MMIC_N
UART_RX_IFX
UART_TX_IFX
3D_BOOST_EN
3D_LCD_BANK_SEL
3D_LCD_EN
3D_LCD_BANK_SEL_1
3D_LCD_BANK_SEL_1
TOUCH_RESET
LCD_EN
KEY_C[1]
LCD BACKLIGHT LED Boost
Changed (Rev.B)
KEY FPCB Connector
TOP FPCB Connector
SUB FPCB Connector
3D LCD 12V Boost
(0.9T, 34 Pin)
(0.9T, 40 Pin)
(0.9T, 20 Pin)
KEY_C[0] - KEY_R[0] : Volume UP
KEY_C[0] - KEY_R[1] : Volume Down
KEY_C[1] - KEY_R[1] : Hot Key
Volumm Key
Rev.B, Rev.D
Rev.B
Added (Rev.B)
Changed Pin map (Rev.B)
Added (Rev.B)
Changed Pin map (Rev.B)
Added Res. (Rev.B)
Added Res. (Rev.B)
LCD Power
3D LCD CONNECTOR
P925 Rev.B
Added (Rev.C)
LCD Level Shifter
Added (Rev.C)
Rev.D
Added (Rev.D)
PWR On Key
Changed Pin map (Rev.D)
Rmoved (Rev.E)
Added (Rev.E)
Added (Rev.E)
Rev.E
Changed (Rev.1.0)
Added (925 Rev.D)
6. CIRCUIT DIAGRAM
C1212
10u
C1241
4.7u
U1201
LP8720TLX
1B
E1 C2
B2
C1
E2
D3
C3
A1 C4
B3
A3
D4
E3
D2
B4 E4
2A 1 D 4A
TTABV
2NIV
1NIV
VINB LDO1
FB
SW
GNDB
LDO2
IRQ_N
SDA LDO3
SCL
DVS
EN
LDO4
DEFSEL
IDSEL LDO5
DNG
C1271
100n
5V_HDMI
R1271
100K
FL1223
ICMEF214P101M 01 9
8 4
7 3
6 2
5 1
P1 P5
P2 P6
P3 P7
P4 P8
1
G
2
G
1u
C1204
1u L1251
C1252
4.7u
CN1221
GB042-40S-H10-E3000
21 20
22 19
23 18
24 17
25 16
26 15
27 14
28 13
29 12
30 11
31 10
32 9
33 8
34 7
35 6
36 5
37 4
38 3
39 2
40 1
ICMEF214P101M
FL1222
01 9
8 4
7 3
6 2
5 1
P1 P5
P2 P6
P3 P7
P4 P8
1
G
2
G
C1211
2.2u
C1205
1u
CN1271
78618-0001
25
24
23
22
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
21
20
1.2V_5M_VDIG
1.8V_5M_VIO
5M_VANA_V2V7_S
5M_VANA_V2V7_P
1u
C1236
4.7u
C1235
5M_VCM_V2V8_P
C1209
2.2u
5M_VCM_V2V8_S
2.2u
C1210
FL1221
ICMEF214P101M
01 9
8
7
6
5
P1
1
P5
P2
2
P6
P3
3
P7
P4
4
P8
1
G
2
G
5M_VCM_V2V8_S
10u
C1201
5M_VCM_V2V8_P
5M_VANA_V2V7_P
VBAT
1.2V_5M_VDIG
1.8V_5M_VIO
5M_VANA_V2V7_S
2.2u
L1201
G5TS0_5B9DSE
4221DZ
G5TS0_5B9DSE
5221DZ
1u
C1206
0.1u
C1230 C1228
4.7u
C1229
1u
0.1u
C1237
VSEL_1.8V
C1231
0.1u
5V_HDMI
C1253
0.1u
VBAT
0.1u
C1232
C1207
1u
C1208
1u
0.1u
C1234
C1233
0.1u
U1251
TPD12S015
D2
E1
A4
C1
B3
F3
G3
A3
A2
C2
B2
D1 B1
A1
D3
F1
E2
F2
E3
E4
F4 C3
G4
G1
C4
D4
B4
G2
VBAT
D1+
D0+
D1-
PGND
CLK-
GND2 CLK+
D0-
SCL_B
SW
GND1
5VOUT
CEC_B
LS_OE
SCL_A CT_CP_HPD
CEC_A
HPD_A
VCCA
D2+
HPD_B
SDA_B
GND3
SDA_A
D2-
FB
GND0
100K
R1202 I2C3_SCL
I2C3_SCL
I2C3_SDA
I2C3_SDA
I2C4_SDA
I2C4_SCL
HDMI_CEC
HDMI_SCL
HDMI_SDA
HDMI_CT_CP_HPD
HDMI_LS_OE
HDMI_HPD
HDMI_D1-
HDMI_D0-
HDMI_D0+
HDMI_D1+
HDMI_D2-
HDMI_D2+
HDMI_CLK-
HDMI_CLK+
5M_MCLK
CAM_SUBPM_EN
PRIMARY_5M_RESET_N
C_HDMI_CEC C_HDMI_CEC
C_HDMI_SCL
C_HDMI_SCL
C_HDMI_SDA
C_HDMI_SDA
C_HDMI_HPD
C_HDMI_HPD
5M_MCLK_CAM
5M_MCLK_CAM
3D CAMERA MODULE
Changed Con. (Rev.B)
Must Check Pin Map!!!
Added Res. (Rev.B)
Changed Pin Map (P <--> S)(Rev.C)
HDMI BackEnd IC
HDMI Connector
CAM POWER
Changed IC (Rev.C, 1.1)
4
E ot esol
C
Removed (Rev.1.0)
Removed (Rev.1.1)
6. CIRCUIT DIAGRAM
CN1803
1
L1810 1n
FL1801
SFAC0002701
LFD211G57DPMD153
240MHz
MURATA
4 3
5 2
6 1
P2 GND3
GND1 P3
P1 GND2
L1811
6.8n
L1807
1n
C1831
1u
C1821
22p
FB1815 60 60 FB1817
9.1n L1803
10n C1814
VBAT VCC_GPS_2V8
C1817
2.2u
VCC_GPS_2V8
2.2u
C1822
TP1801
26MHz
KT2520F26000ACW18TAK
X1821
4 3
5 2
6 1
GND1 VCC
NC1 NC2
GND2 OUT
BU28TD2WNVX
U1831
5
3 2
4 1
VOUT VIN
GND STBY
D
N
G
P
1u
C1832
47p
C1801
C1808
1.8p
C1803
330p
L1806
DNI
TP1802
TP1803
TP1804
R1803
1.5K
VDD_GPS_TCXO_1V8
C1818
2.2u
C1802
0.1u
FB1818
60
VDD_GPS_TCXO_1V8
VCC_GPS_2V8
60
FB1812
C1815
2.2u
VSEL_1.8V
2.2u
C1816
U1811
BCM4751
4F2E3F2F
C3
D3
D4
E4
B3
B5
C4
C6
G4
B2
B1
E5
E3
C2
A1
G3
C5
A4
E6
G6
B6
A2
A3
E1
C1
D2
D5
D1
A5
G2
F1
G1
6A5 F4B6D6F5G
TAB _DDV
ERP_DDV
1 CDDV
2 CDDV
EROC_2P 1DDV
O IDDV
RFIP
VSSIF
VSSLNA
GPS_CAL
TCXO/TSXO
LPO_IN
ADCP
VDDADC
ADCN
SYNC/PPS_OUT
IFVALID
RST_N
REGPU
TM2
SDA1
SCL1
AUXOP
CAL_REQ/ANT_SEL
VSSADC
VDD_AUX_O
VDD_AUX_IN
HOST_REQ
LNA_EN
REF_CAP
SCL2/UART_TX
SDA2/UART_RX
UART_nRTS
UART_nCTS
AVSS
VSSC1
VSSC2
VSSC3
AN LDDV
FIDDV
L PDDV
FRG_2P 1DDV
C1812
2.2u
100p L1802
ALM-2712
U1801
8
9
11
2
1
RF_IN
GND
D
S
V
VDD
RF_OUT
10
R1802
26MHz_GPS_REF
DPX_IN
GPS_PWR_ON
GPS_PWR_ON
VSEL_1.8V
CLK32K_GATE
GPS_UART_TXD
GPS_RESET_N
GPS_UART_RXD
GPS_UART_RTS_N
GPS_UART_CTS_N
GPS_LNA_SD
GPS_26MHz
GPS
TCXO for GPS
Removed Mobile Switch
(Rev.B)
LDO for GPS
Changed (P925 Rev.A) Changed (P925 Rev.A)
(P925 Rev.A)
Changed (Rev.D)
Changed (Rev.1.0,1.1)
(Rev.1.1)
* TMUS
* Global, AT&T
L1810 L1811
1nH 6.8nH
8.2nH 1.8pF
6. CIRCUIT DIAGRAM
TP1901
TP1911
TP1903 TP1904
C1917
DNI
SWB_VIO_1.8V
FB1914 600
1091LF
661A8GS54G212BFL
z
H
M
0
5
4
2
NI
TUO
1DNG
2DNG
C1915 0.1u
U1901
WL1271
6B 11D
2C 4B 9
M
9D 9J 01K
2E 11B
01D
01 G
3G 3H 6K 2K 4L 01A
1A
M11 J10
D6 J11
C7 K8
C6 J8
B7 L10
D4 L9
D3 L11
L1 L5
H10 K5
H7 M5
H9 L7
H6
F4 J6
G4 H5
C10
F6 A11
F7
H11 H8
F8 E8
E6
E7
J7 E9
M7 F10
M8
K7 E5
F5
K9
A9
D8
D7
A5
A4 G7
A3 G8
A2 G11
B1 E11
C1
H2
H1
F1
D5 J3
F2 J4
F3
E4 J5
J2 K4
G5 L3
H4 M3
11K 7A
1
M 3E 9C 6A 8C 8A 8B 5C 3C 2B
11C 4C 2D 8L
01B
6
M 3K 2G 9F
4
M 6L 1J 1G 9G
11F
01E
2
M 1K 6G 2L
ODL_GID_NIV
TABV_S
MP
ODL_
ME
M_DDV
ODL_GID_DDV
1DDV
2 DDV
3DDV
4DDV
5DDV
6 DDV
7DDV
1SD DV
2SDDV
3SD DV
4SD DV
TBFR_DDV
MFV8P1DDV
W OC D_CCV
WANA_CCV
TBOCD_DDV
WXR_CCV
WAXT_CCV
WBXT_CCV
5P1SSALC_DDV
TBFI_APP_DDV
5P1SSALC_NI_ODL_DDV
WNI_ODL
TBNI_ODL_DDV
WOCD_NI_ODL
V8P1_TSET_S
MP
PACGBFERF
PACPAGB
MF
SPI_CLK FM_EN
SPI_DIN BT_EN
SPI_DOUT WL_EN
SPI_CSX WL_PAEN_B
NC1
SDIO_D1 WL_BTH_SW
SDIO_D2 WL_TX_SW
WL_RX_SW
WL_RS232_TX
WL_RS232_RX
NC2
HCI_CTS NC3
HCI_RTS NC4
HCI_TX DRPWRXBP
HCI_RX DRPWRXBM
DRPWTXB
XTALP
XTALM
RFIOBT
SLOWCLK
CLK_REQ_OUT
CLK_REQ_OUT_N JTAG_TDO
JTAG_TDI
BT_FUNC1 JTAG_TCK
BT_FUNC2 JTAG_TMS
BT_FUNC6
BT_FUNC5
BT_FUNC4 AUD_CLK
BT_FUNC7 AUD_FSYNC
AUD_OUT
TESTMBT AUD_IN
TESTPBT
FM_I2S_FSYNC WLAN_IRQ
FM_I2S_CLK WL_UART_DBG
FM_I2S_DI
FM_I2S_DO VPP
FM_SCL IFORCE
FM_IRQ VSENSE
FM_SDA DC_REQ
FMRFINP DRPWPABC
FMRFINM DRPWPDET
FMRFOUTP DRPWTEST1
FMAUDLIN DRPWTEST2
FMAUDRIN DRPWTEST3
FMAUDLOUT DRPWTEST4
FMAUDROUT TESTMODE
6 CN
TB FR_SSV
1 GID_SSV
2G ID_SSV
3G ID_SSV
4GID_SSV
5G ID_SSV
6G ID_SSV
7GID_SSV
TBO CD_SSV
WO CD_SSV
MFFRASSV
M FLLPA CDAASSV
LATX_SSV
MFHTNYSAPASSV
1
WFR_SSV
2
WFR_SSV
LLPDTB_SSV
WANA_SSV
2091 C
u1
U1902
RF3482
71
41 51
7
61
8
9
10
11
12
2
31
1
5
4
6
3
BT
2BV
PAEN
1BV
TXB
TNA
GND1
BTH_SW
RX_SW
TX_SW
VB3
TEDP
NBXR
CBAP
PBXR
2DNG
DNGP
8091C
u1u1
9091C
1.5n
C1920
01 91C
u1
u1
1091C
100p C1932
1u
C1923
VBAT_FEM
TP1902
DNI
C1933
C1930
2.2u 4.7u
C1931
DNI
C1922
20K
R1902
+1.8V_BT
u1.0
3191C
+1.8V_BT
VBAT_FEM
+1.8V_BT +1.8V_BT
L1901 180n
L1924
100n
4091C
u1
220n C1916
VBAT_FEM
u1.0
2191C
1191C
u1.0
VBAT_FEM
VBAT_FEM
u1 .0
70 91C
41 91C
u1 .0
3091C
u1.0
L1903 1.5u
VBAT
TPS62611YFDR
U1904
C1 C2
A2
B2
A1
B1
SW
MODE
EN
VIN
GND FB
C1918
DNI
CN1904
1
L1926
1n
TP1907
60 91C
u1
TP1905
L1923 3.3n
L1925
DNI
C1936 100p
VSEL_1.8VSWB_VIO_1.8V
R1905
0
u1
5091C
TP1906
TP1912TP1913TP1914
CLK32K_GATE
FM_ANT
FM_AUDIO_L
FM_I2S_CLK
FM_I2S_DI
FM_I2S_FSYNC
FM_I2S_DO
BT_PCM_SYNC
BT_PCM_CLK
BT_PCM_DIN
BT_PCM_DOUT
WL_CLK_REQ
BT_UART_RTS/
BT_UART_CTS/
WLAN_CLK
WLAN_SDIO[0]
WLAN_SDIO[1]
WLAN_SDIO[2]
WLAN_SDIO[3]
WLAN_CMD
WLAN_HOST_WAKEUP
BT_UART_TXD
BT_UART_RXD
FM_AUDIO_R
WLAN_EN
BT_EN
DC_MODE
DC_MODE
DC_EN
DC_EN
BT_RF
BT_RF
WL_RX_SW
WL_RX_SW
WL_TX_SW
WL_TX_SW
WL_BTH_SW
WL_BTH_SW
WL_CLK_IN
SWB_VIO_1.8V
BT/WIFI/FM
(Rev.B)
Removed Cap.
Removed TP
(Rev.B)
(Rev.B)
Changed Library
(Rev.B)
Removed TP
Added
(Rev.C)
Removed
(Rev.D)
Removed(Rev.1.0)
Added(Rev.C)
Added (P925 Rev.A)
Added
(Rev.D)
Removed TP (P925 Rev.A)
Added (P925 Rev.A)
Changed (Rev.D)
Removed (Rev.E)
Removed (Rev.E)
6. CIRCUIT DIAGRAM
L101 1u
R118
27
R117
27
IND
121R
VSEL_1.8V
C106
4.7u
R122
DNI
CN102
6 5
7 4
8 3
9 2
10 1
401R
IND
IND
501R
VPMIC_VMMC
3 01AV
VSEL_1.8V
IND
601R
211R
K01
CN101
18 17
19 16
20 15
21 14
22 13
23 12
24 11
25 10
26 9
27 8
28 7
29 6
30 5
31 4
32 3
33 2
34 1
C101
10p
C104
10p
TOUCH_3.3V
C115
1u
VSEL_1.8V
5 01DZ
IND
011R
901R
IND
TP101
TP105
CN110
HJ-BCT-04Y
1
TP103
C119
2.2u
S101
GND
DAT2
CD_DAT3
CMD
VDD
CLK
VSS
CARD_DETECT
DAT0
COVER_DETECT1
DAT1
0.1u
C103
C105
0.1u
J101
8 7
6 3
5 2
4 1
VCC GND
RST VPP
CLK I_O
GND1 GND2
VSIM_2.9V
D102
4
3
5
2
6
1
VPMIC_VMMC
D101
4
3
5
2
6
1
K7.4
101R
VSIM_2.9V
D103
4 3
5 2
6 1
VSIM_2.9V
TOUCH_3.3V
C102
DNI
101 DZ
U102
5
3 2
4 1
VOUT VDD
GND CE
D
N
G
P
VBAT
20 1DZ
VBAT
30 1DZ
4 01DZ
601DZ
TP102
u 1
0 21C
VSEL_1.8V VPMIC_VMMC
VBAT
VSIM_2.9V
SENSOR_3.0V
U101
B1
D3
C1
C3
C2
B2
4A
C4 A2
D2
D4
D1
3A3B
A1
4B
2DNG
LED1
2
WS
1
WS
TX2/INT/GPIO2
HWEN
SDA
OUT1 IN
1DNG
OUT2
TX1/TORCH/GPIO1
STROBE
LEDI/NTC
SCL
LED2
C107
10u
TP104
C109
10u
10 1DL
2
1
VA102
I2C2_SCL
I2C2_SCL
I2C2_SCL
MICROSD_DAT0
MICROSD_DAT0
MICROSD_DAT1
MICROSD_DAT1
MICROSD_DAT2
MICROSD_DAT2
MICROSD_DAT3
MICROSD_DAT3
MICROSD_DET/
MICROSD_DET/
I2C2_SDA
I2C2_SDA
I2C2_SDA
TOUCH_INT_N
TOUCH_INT_N
USIM_RESET/
USIM_RESET/
USIM_RESET/
USIM_CLK
USIM_CLK
USIM_CLK
USIM_DATA
USIM_DATA
USIM_DATA
MICROSD_COVER_DET/
MICROSD_COVER_DET/
PWR_ON_SW
PWR_ON_SW
VBAT
SENSOR_3.0V
UART_RX_IFX
UART_RX_IFX
UART_TX_IFX
UART_TX_IFX
FLASH_EN
FLASH_EN
MICROSD_CMD
MICROSD_CMD MICROSD_CLK
MICROSD_CLK
TOUCH_RESET
TOUCH_RESET
GSM_TXON_IND
GSM_TXON_IND
Routing line must be thick enough to support 1A!!
MicroSD Socket(Hinge Type) USIM for XMM6260
TP gap(center to center) 2mm
Must Check Schematic
CAMERA FLASH LED
Touch Connector
Main2Sub B2B Con.
* layout note : CLK and IO must be seperated
NEST JIG
Rev.F
Rev.B
Rev.B
Remove Series R
Rev.B
Touch LDO
Rev.E
(Rev.E)
2ch -> 1ch (Rev.E)
Zif -> BtB (Rev.E)
Rev.E
Rev.C
Rev.E & 1.0 Rev.F
Rev.C
Rev.F
Rev.F
Remove 0 ohm (Rev.G)
I2C4 -> GND(Rev.G)
Camera Deco contact C-clip
PU Resistor Moved to Main PCB
(Rev.E)
Rev.D
Rev.E
Rev.E
Rev.B
DNI R Added
6. CIRCUIT DIAGRAM
CN103
11 10
12 9
13 8
14 7
15 6
16 5
17 4
18 3
19 2
20 1
PROXI_3.0V
201
D
101
D
L102
100n
U101
5 4
6 3
7 2
8 1
SDA VDD
INT SCL
LDR GND
LEDK LEDA
CN104
6 5
7 4
8 3
9 2
10 1
CN102
2
1
C105
22p
SENSOR_3.0V
1u
C101
CN101
18 17
19 16
20 15
21 14
22 13
23 12
24 11
25 10
26 9
27 8
28 7
29 6
30 5
31 4
32 3
33 2
34 1
MIC101
4
3
2
1
P
G1
G2
O
0.1u
C103
TWL_LDO_1.8V
TWL_LDO_2.8V
0.1u
C104
FB101
401
D
3 01
D
SENSOR_3.0V
TWL_LDO_1.8V
TWL_LDO_2.8V
PROXI_3.0V
C102
1u
AUD_RCV_P
AUD_RCV_P
AUD_RCV_N
AUD_RCV_N
PROX_INT
PROX_INT
SMIC_P
SMIC_P
SMIC_N
SMIC_N
VT_CAM_RESET/
VT_CAM_RESET/
VT_CAM_PWDN
VT_CAM_PWDN
VT_0.3M_MIPI_CLK_N
VT_0.3M_MIPI_CLK_N
VT_0.3M_MIPI_CLK_P
VT_0.3M_MIPI_CLK_P
VT_0.3M_MCLK
VT_0.3M_MCLK
MICBIAS
MICBIAS
I2C3_SDA
I2C3_SDA
I2C3_SDA
I2C3_SCL
I2C3_SCL
I2C3_SCL
HS_MIC
HS_MIC
EAR_L
EAR_L
EAR_SENSE
EAR_SENSE
EAR_R
EAR_R
FM_ANT
FM_ANT
Receiver
SUB MIC
Must Check Schematic
Proxi. Ambiant Sensor
(FPCB, Aptina 1/11", Hansung)
Main2FPCB B2B
VGA(MIPI)
Rev.B(Bead Move to Main PCB)
Must Check!!! Pin MAP
TOP
6. CIRCUIT DIAGRAM
J101
EAG62831701
6
1
4
4D
5
M5-MIC
M4-DETECT
M4-L
M1-R
M6-GND
CN101
6 5
7 4
8 3
9 2
10 1
HS_MIC
HS_MIC
EAR_L
EAR_L
EAR_SENSE
EAR_SENSE
EAR_R
EAR_R
FM_ANT FM_ANT
EAG62831701
3.5pi Ear Jack Connector
Remove HS_GND
6. CIRCUIT DIAGRAM
R101
130
R102
130
VB101
2
1
SP101
HIR-02A57-0000AA
2
1
C114
0.1u
FB103
120
L104
100n
R104
130
R103
130
501R
IND
L103
100n
101DL
201DL
301DL
40 1DL
VBAT
33p
C103
KB101
C110
27p
C113
33p
D101 D102
CN102
11 10
12 9
13 8
14 7
15 6
16 5
17 4
18 3
19 2
20 1
MIC101
4
3
2
1
P
G1
G2
O
L101
82n
L102
82n
VBAT
VIB_L_N
VIB_L_N
VIB_L_P
VIB_L_P
LED_SINK
LED_SINK
AUD_SPK_P
AUD_SPK_P
AUD_SPK_N
AUD_SPK_N
MMIC_N
MMIC_N
MMIC_P
MMIC_P
MICBIAS
MICBIAS
KEY_R[1]
KEY_R[1]
KEY_C[1]
KEY_C[1]
Q-Motor(Not Fixed)
MAIN MIC
3D HOT_KEY
SPEAKER
Main2Key B2B MAIN KEY LED
MOTOR
Volume Key
Must Check Schematic!!!
TOP
Rev.B
Rev.B
6. CIRCUIT DIAGRAM
CN103
HJ-ICT-06Y
1
CN104
HJ-ICT-06Y
1
SW101
G1
ANT G2
C106
0.5p
L105 1.5n
MAIN ANT
6. CIRCUIT DIAGRAM
KB101
CN101
2
1
PWR_ON_SW
PWR_ON_SW
ON/OFF/LOCK
POWER Key
6. CIRCUIT DIAGRAM
KB101 KB102
CN101
SIDEKEY_4P
4
3
2
1
KEY_R[1] KEY_R[1]
KEY_R[0] KEY_R[0]
KEY_C[0] KEY_C[0]
UPDOWN
Volumm Key
KEY_C[0] - KEY_R[1] : Volume Down
KEY_C[0] - KEY_R[0] : Volume UP
7. BGA PIN MAP
- 169 -
U181 PMB5712 (Transceiver)
7. BGA PIN MAP
U181 PMB5712 (Transceiver)
Used
Not Used
7. BGA PIN MAP
- 170 -
U301 PMB 9811 (Digital Baseband Processor,3G)
U301 PMB 9811 (Digital Baseband Processor,3G)
Used
Not Used
7. BGA PIN MAP
- 171 -
U350 H8BCS0QG0MMR-46M U350 H8BCS0QG0MMR 46M

U350 H8BCS0QG0MMR-46M
7. BGA PIN MAP
- 172 -
U701 K3PE4E400M-XGC1 4Gb LPDDR2 PoP
4Gb LPOOP2 PoP 2!6ball
U701 K3PE4E400M-XGC1 4Gb LPDDR2 PoP
Used
Not Used
7. BGA PIN MAP
- 173 -
U500 OMAP4430 lC, Application Processor

U500 OMAP4430 IC, Application Processor
Used
Not Used
Not Used
7. BGA PIN MAP
- 174 -

U800 PMIC
Not Used
7. BGA PIN MAP
- 175 -
U
7
2
1

S
a
n
D
i
s
k

8
G

N
A
N
D

F
l
a
s
h
U721 SanDisk 8G NAND Flash

Not Used
Used
7. BGA PIN MAP
- 176 -
U901 (TWL6040 Audio codec)

U901 (TWL6040 Audio codec)
Not Used
7. BGA PIN MAP
- 177 -

U811 MUCI
Used
Not Used
8. PCB LAYOUT
F
A U
C K
DT
H
Y J
01
G
A
H
A
1
A B
U
1 2
C
A
D
A
E
A WYA
A
B
A V
A
B
C
D E F G H J
EFGHJKLMNPR
P N M L K JT R
L NM
71
ABC
1
41
ABCDG F E
1
AABACADAEAFAGAHA
16
KLMNPRTUVW
F
A B C D E
1
4
8 2
1
ABCDEFGH
1
A
B
C
D
E
G
H
J
K
L
M
N
P
R
T
BA
1
C D
5
109
R
78 9
R
C991
C312
SC796
3
0
9
1
L
C353
9 23
C
2 46
C
C618
21 5
R
C674
TP512
C635
R631
C648
50 6
C
C667
C671
C684
C679
C636
R516
C600
6
0
8
L
28 6
C
1
0
7
U
07 6
C
C619
1
0
5
C
C660
9 66
C
73 6
C
3 16
C
416
C
8 76
C
315
R
0 56
C
7
8
6
C
656
C
0 86
C
C620
C645
70 6
C
2 43
R
1
0
8
L
1
0
8
N
C
0
1
8
C
1
0
8
U
458
R
3 58
R
R986
3
9
1
1
D
Z
2
9
1
1
D
Z
1
9
1
1
D
Z
1
6
9
U
C961
27 9
C
569
C
C973
369
C
37 9
R
26 9
C
C986
20 9
R
28 9
R
1 89
R
1
9
1
1
N
C
R593
R592
U971
C971
9
8
9
L
6
8
1
1
Q8
8
9
L
1
8
9
U
7
8
9
C
TP905
78 11
R
6811
R
CN1195
1
4
7
B
F
4
9
7
C
S
5
9
7
C
S
591 1
R
5
9
1
1
D
Z
C742
3
4
7
B
F
3
4
7
C
1
4
7
C
C744
TP523
4 25PT
TP525
R382
4 53
C
48 3
R
753
C
653
C
R383
C344 82 3
C
C302 C343
433
C
6
3
3
R
C333
7 33
C
733
R
033
C
723
C
C318
TP313
C315
TP311
781
R
TP310 TP312
4 13
R
31 3
R
9 13
R
413
C
903
C
303
C
5
0
3
C
U1904
C1931
0
3
9
1
C
FB1914
0
5
3
U
5 33
C
C342
X300
523
C
C341
1
0
3
U
3
0
3
L
6
0
3
C
TP513
25 6
C
7 95
R
85 6
C
C336
8
2
8
C
C307
TP1912 TP1911
1
2
7
U
C993
TP904
C992
U991
TP901
0
9
1
CTP902
C627
C351 C352
C358
C662
C661
5 53
C
42 3
C U303
C316
5
2
8
C
7 13
C
3 23
C
2
0
3
B
F
4 03
C
3
1
3
C
1
0
3
B
F
L304
L805
C840
ZD591 ZD593
TP1913 TP1914
TP1906
716
C
R501
TP1905
77 6
C
23 6
R
TP301
1 46
C
936
C
2 06
C
81 8
R
57 6
C
C845 038
R
9
0
8
R
21 8
C
4
0
8
R
446
C
3 66
C
C841
L804
4
2
8
C
C850
C837
C849
FB804
6
2
8
C
C821
FB805
C851
FB803
C831
00 3PT
L803
9
1
8
C
9 27
R
R733 R723
X800
SC793
ZD592
R727
R738 R728
R737
9
3
7
C
C740
R724
R732
R726
R734
R736
R725
R731
R735
R722
R730 R739
R721 C505
R581
586
C
86 6
C
R591
386
C
686
C
756
C
0
0
5
U
3 06
C
746
C
35 6
C
1 26
C
94 6
C
046
C
C844 C854 C833 C830
U800
C846
9
2
8
C
1
0
8
B
F
4
1
8
C
6
0
8
B
F
C848
4
3
8
C
L802
C507
C508
C502
C509
205U
C504
3
0
5
C
X500
49 5
R
69 5
R
485
R
685
R
37 6
C
C852
156
C
1 06
C
216
C
186
C
C611 1
2
6
L
F
8
3
8
C
043
R
C818
Q301
C816
9
3
8
C
7
1
8
C
FB802
C832
C813
FB800
C815
L800
8
0
8
C
1
5
8
U
1
1
8
U
1
0
8
D
Z
1
1
8
C
R805 R803
C827
C855
00 5
C
84 8
R
C820
R850
0
0
8
L
FZD802
1
9
7
C
S
TP511
C823
C822
8 85
R
8 9 5
R
7
2
8
R
3
5
8
C
R808
2
9
7
C
S
9
0
8
C
R800
R821
1
7
2
1
N
C
8
2
8
R
TP809
8. PCB LAYOUT
LG-P920_MAIN_1.1_TOP
U721 : EMMC memory
- no Booting
- no Service
X500 : 38.4Mhz X-tal
- no Booting
U502 : Clock Buer IC
- no Booting
- no BT/WiFi/FM
- no Audio
U851 : DP3T S/W
- no CP USB/UART port
- no AP UART port
U811 : MUIC
- no USB/UART
CN801 : uUSB Conn.
- no USB/UART
- no Charging
U500 + U701: AP + POP memory
- no Booting
CN1271 : HDMI Conn.
- no HDMI diplay
Q301 : FET
- no CP USB
U800 : PMIC
- no Booting
- no Power On
- no Service
U801 : Charger IC
- no Charging
- no AP/CP USB
U991 : Dual LDO
- no Gyro sensor
- no Motion sensor
- no Compass sonsor
- no Proximity sensor
U1904 : DCDC
- no Bluetooth/WiFI/FM
U350 : CP memory
- no Service
U303 : SPDT S/W
- no CP UART port
- no AP-CP UART port
U961 : Gyro sensor
- no Gyro sensor
- no Motion sensor
U971 : Motion sensor
- no Motion sensor
U301 : CP modem
- no Service
U981 : Motor D-IC
- no Vibration
8. PCB LAYOUT
LG-P920_MAIN_1.1_BOT
34
F
3 0
11
C
4
12
04
01
E
02
0 2
1 1
F
1
E
D
C
B
A
K
L
M
J
H
G
6
1A
1 1
D
1 5
1 6
18
17
3 1
ABCDE
1
81
43
71
GHJKLM
A
B
C
D
3 1
1
4
AB
L
A
B
C
D
H
G
F
E
K
J
1
DEFG
C N 1 9 0 4
U 1 2 0 1
F L 1 2 2 1
R 8 1 1
U 1 9 0 1
R 5 2 1
181
C
L 1 1 3 1
R 8 9 2
C 1 9 1 6
R 5 0 0
481
C
C 2 4 8
9
0
2
C
C 2 0 6
U 1 1 3 1
C 1 1 3 4
L 1 7 9
6
2
2
L
U 8 9 1
C 3 1 0
L 1 8 0
U 1 1 0 1
3
7
1
1
B
F
1
8
1
U
F L 1 1 7 1
5
7
1
1
D
2
7
1
1
L
F L 1 1 7 2
R 3 0 6
4 91
C
U 1 2 1
L 1 3 8
2
3
1
C
L 1 5 2
U 1 1 0 8
C 1 1 4 1
1
5
2
1
L
U 1 8 1 1
T P 9 0 3
C 1 8 1 8
F B 1 8 1 8
1 49
C
F B 9 4 1
C 6 1 0
64 6
CC 9 3 4
C 6 0 9
C 1 2 5 3
L 1 6 2
L 1 0 5
1
1
1
L
F
Q 8 0 1
C 1 0 5
L 1 1 2 1
C N 1 8 0 3
L 1 2 0 1
1
1
2
1
C
5
2
2
1
D
Z
1
8
1
1
N
C
C 9 7 5
5
2
9
1
L
C 1 2 0 4
1
0
2
1
C
2
1
2
1
C
F L 1 2 2 3
1
2
2
1
N
C
4
2
2
1
D
Z
C 9 7 8
C 9 7 6
7
1
9
1
C
C 1 9 3 6
R 1 2 0 2C 1 2 0 8
C 1 2 3 0
3
0
8
D
Z
L 1 9 2 4
6
2
9
1
L
C 1 2 0 6
C 1 2 0 5
C 1 2 0 9
C 1 2 0 7
C 1 2 1 0
F L 1 2 2 2
8
2
2
1
C
C 1 2 3 3
C 1 2 3 2
C 1 2 3 1
C 1 2 2 9
C 1 2 3 7
C 1 2 3 6
C 1 2 3 4
5
3
2
1
C
5
7
9
U
Z D 1 1 8 1
Z D 1 1 8 2
5
0
8
C
308
C
4 08
C
8
1
9
1
C
C N 8 0 0
008
C
108
C
70 8
C
20 8
C
V A 8 0 0
F L 1 9 0 1
C 8 9 0
229 1
C
3
2
9
1
L C 1 9 2 3
3
3
9
1
C
C 1 9 3 2
B A T 8 0 0
2
0
9
1
U
1
0
2
B
F
022
U
C 8 9 1R 8 9 1
C 1 9 2 0
C 1 9 0 9
509 1
C
C 1 9 0 8 C 1 9 0 6
C 1 9 1 0
C 1 9 1 4
C 1 9 1 3
T P 1 9 0 4
R 1 9 0 2
1
0
9
1
C
T P 1 9 0 3
9
4
2
L
C 2 5 0
9
4
2
C
C 2 4 3
1
4
2
CU 2 4 1
C 2 5 1
C 1 1 3 1
2
3
1
1
C
C 2 3 3
C 2 2 5
C 2 3 0
R 1 1 3 3
C 2 2 1
6
2
2
C
4
2
2
C
858
C
7 98
R
R 8 9 3
6 98
R
R 1 1 0 1
1
0
1
1
C
R 5 2 2
C 2 4 2
5
3
1
1
R
7
3
1
1
C
2
0
1
1
C
C N 1 1 6 1
C 1 9 0 7
T P 1 9 0 7
C 1 9 0 2
C 1 9 1 1
R 1 9 0 5 C 1 9 1 5C 1 9 1 2
C 1 9 0 3
L 1 9 0 1
C 1 9 0 4
C 9 1 6
C 9 1 5
7
4
2
C
L 2 4 8
7
4
2
L
L 2 4 4
L 2 4 5
C 2 4 4
5
4
2
C
R 1 1 3 6
C 1 1 3 8
C 2 3 1
C 2 3 2
R 1 1 3 4
C 2 2 2
7
2
2
L
3
2
2
C
C 2 5 5
C 2 2 8
C 8 9 2F B 1 1 4 3
103
C
C 2 2 7
R 5 1 4
1 13
C
R 8 9 5
R 8 9 4
515
R
3
0
1
1
C
3 711
R
8 71 1
C
209 1PT
67 11
R
3 52
C
C 1 9 1
252
C
8
6
1
L
8
5
1
L
371
C
8
7
1
C
2 71
C
U 1 7 1
1
7
1
C
3
7
1
1
C
R 1 1 7 8
C 1 1 7 9
F B 1 1 7 6
10 91 PT
F B 1 1 7 5
7
7
1
1
B
F
6 71 1
C
57 11
C
R 1 1 7 2
C 1 1 7 1
27 11
C
P T 3 0 1
3 71 1
Q
4711
R
C 1 8 7
68 1
R
4
8
1
X
58 1
C
802
C
1 02
C
C 1 9 2
C 2 0 4
C 1 8 3
C 2 0 0
C 1 8 9
591
C
L 1 6 9L 1 5 9
19 11
R
8 03
C
R 3 1 6
4 01 1A V
0911
R C 1 1 4 3
C N 1 1 4 1
V A 1 1 0 2
171 1
R
C 1 9 7
20 1PT
7
4
1
L
7
3
1
L
7
2
1
L
7
7
1
L
2
4
1
1
L
F
4 71 1
C
77 11
C
1
7
1
1
N
C
Z D 1 1 7 2
308 1PT
C 1 8 8
702
C
452
C 202
C
391
C
C 1 9 9
3 02
C
C 2 0 5
C 1 9 8
28 1
C
8
4
1
L L 1 2 8
3
5
1
C
L 1 7 6
C 8 3 5
6
3
8
C
C 1 7 5
1
4
1
1
L
F
7
1
8
1
B
F
7
1
8
1
C
C 9 2 6
C 1 3 3
7
0
1
1
C 2011
R
52 11
R 62 11
R
30 11
R
F B 1 1 7 4
C 1 8 3 2
1
3
8
1
C
U 1 8 3 1
F B 1 8 1 2
4081PT
C 1 8 1 4
20 8 1PT
10 81PT
6 39
C
C 1 8 1 5
7
3
9
C
C 1 8 1 6
C 6 6 5
F B 1 8 1 5
C 6 5 9
C 1 8 1 2
3
0
9
C
C 9 2 5
C 6 2 6
F B 9 0 1
1
0
9
C
7
2
6
L
F
2
0
9
C
C 9 3 9
C 6 8 8
556
C
C 6 5 4
4
2
9
C
C 1 2 3
1
2
1
C
2
2
1
L
L 1 4 3
L 1 4 1
3
6
1
C
2
4
1
L
1
6
1
L
3
1
1
L
L 1 3 1
L 1 1 2
C 1 5 1
C 1 1 2
10 8
R
L 1 1 0L 1 1 1 C 1 0 9
C 8 4 2
1
2
1
1
C
2
2
1
1
D
2
2
1
1
C
U 1 1 2 1
C 1 8 0 8
R 1 8 0 2
C 1 1 4
6
0
1
1
C
3
0
8
1
R
C 1 8 0 1
C 1 8 0 2
L 1 8 0 3
U 1 8 0 1
C 9 3 8
2 39
C
929
C
4
0
9
C
C 1 8 0 3
1 39
C
5
0
9
C
C 1 8 2 2
1281
C
U 9 0 1
C 9 1 3
5
3
9
C
3
1
9
B
F
C 9 1 4
4
1
9
B
F
7
1
1
C
L 1 1 6
6
1
1
C
5 11
C
L 1 1 4
R 5 1 1 20 8
RR 5 1 0
6011
U
1
0
8
1
L
F
1
2
8
1
X
0 49
C
1
4
2
1
C
1
0
1
W
S
L 1 8 0 7
L 1 8 0 2
L 2 1 5
3
1
2
L
4
1
2
L
C 2 1 1 3 39
C
1
1
2
L
F
2
1
2
L
V A 9 0 1 C 9 2 3
L 2 1 1
309 AV
C 9 1 7
V A 9 0 2 C 9 2 2
919
R
029
C
C 9 3 0
C 9 2 8
91 9
C C 9 2 1
R 9 2 1
C 9 1 8
7
2
9
C
1 721
R
15 21
U
C 1 2 5 2C 1 2 7 1
L 1 0 4
C 1 0 3
2
0
1
W
S
C 1 0 12
0
1
L
L 1 8 0 61
1
8
1
L L 1 8 1 0
CN1171 : Top FPCB Con.
- no Ear-jack
- no Sub MIC
- no Receiver
- no VT Camera
- no Illumination sensor
- no Proximity sensor U1902 : BT/WiFi RF Module
- no BT Connection
- no WiFi connection
CN1161 : Sub PCB Con.
-no SIM
-no T-ash memory
-no Flash LED
-no Touch
CN1904 : WiFi/BT Ant
- no WiFi/Bluetooth
U1901 : WiFi/BT/FM Module
- no WiFi connection
- no BT Connection
- no FM Radio
U1201 : Camera PMIC.
- no 5M Camera
- no VT Camera
CN1803 : GPS Ant.
- no GPS
U1831 : LDO (for GPS)
- no GPS
U1811 : GPS chip
- no GPS
CN1221 : 3D Cam con.
- no 5M Camera
- no 3D Camera
FL1801 : Diplexer (GPS/B4 Diversity)
- no GPS
X1821 : 26Mhz X-tal
- no GPS
U901 : Audio codec
- no Sound
U1251 : HDMI IC
- no HDMI Display
U1801 : GPS RF Module
- no GPS
U1106 : LDO
- no 3D LCD
U1121 : LCD LED boost
- no LCD backlight
FL1141/FL1142 : EMI lter
- no Display
CN1141 : LCD Conn.
- no Display
U1131 : 3D LCD boost
- no 3D LCD
U975 : Compass sensor
- no compass sensor
CN1181 : Key FPCB Con.
- no 4 key LED
- no 3D key
- no Main MIC
- no Speaker
- no Vibrator
BAT800 : Backup Cap.
- RTC Reset
U891 : Fuel gauge
- Battery-bar accuracy declined
U1101 : Dual LDO
- no Display
U241 : PMU(for Transceiver)
- no Service
- RF Sensitivity & TX Power
X184 : 26Mhz X-tal
- no Service
U181 : Transceiver
- no Service
U121 : Bank Duplexer
- no Service
FL111 : FEM
- no Service
U220 : DCDC (for PAM)
- no Service
U171:MMMB (Multi PAM)
- no Service
SW102 : RF S/W
- no Service
SW101 : Coaxial Conn.
- no Service
8. PCB LAYOUT
34 18
17
CN101
LG-P920_F_SUB_1.0_TOP
8. PCB LAYOUT
5
1 0 6
L D 1 0 1
Z D 1 0 1
R 1 1 2
2
0
1
U
R 1 2 1
1
0
1
S
T P 1 0 5
2
0
1
D
2
0
1
A
V
C N 1 1 0
5
1
1
C
90 1
C
C 1 0 4 V A 1 0 3
Z D 1 0 5
C N 1 0 2
C 1 2 0 C 1 1 9
6
0
1
D
Z
4
0
1
D
Z
2
0
1
D
Z
3
0
1
D
Z
2
2
1
R10 1
C
2
0
1
C
R 1 0 1
3 01
C
3
0
1
D
70 1
C
1
0
1
U
L 1 0 1
T P 1 0 2T P 1 0 1
1
0
1
J
T P 1 0 4 T P 1 0 3
5
0
1
R
4
0
1
R
0
1
1
R
9
0
1
R
1
0
1
D
6
0
1
C
8
1
1
R
7
1
1
R
501
C
6
0
1
R
LG-P920_F_SUB_1.0_BOT
8. PCB LAYOUT
20
10
11
C104
1
0
1
U
FB101
4
0
1
D
2
0
1
D
1
0
1
CI
M
CN103
3
0
1
D
C101
3
0
1
C
C102
2
0
1
N
C
1
0
1
D
LG-P920_F_VTCAM_1.1_TOP
8. PCB LAYOUT
6 10
5
43
8171
L 1 0 2
C 1 0 5
C N 1 0 4
1
0
1
N
C
LG-P920_F_VTCAM_1.1_BOT
8. PCB LAYOUT
LG-P920_F_EAR_1.0_TOP
8. PCB LAYOUT
LG-P920_F_EAR_1.0_BOT
8. PCB LAYOUT
L103
D101
D102
L104
LD101
L102 R101
MIC101
V
B
1
0
1
1
0
1
P
S
1
0
1
B
K
101L C103 FB103 R102
LD102
501R
0 11C
3 11C
411C R104
LD103
R103
LD104
LG-P920_RF_KEY_1.1_TOP
8. PCB LAYOUT
LG-P920_RF_KEY_1.1_BOT
11
02
0 1
2
0
1
N
C
8. PCB LAYOUT
C
N
1
0
4
C
N
1
0
3 5 0 1 L
C
1
0
6
1 0 1 W S
LG-P920_E_PCB_1.0
8. PCB LAYOUT
KB101
LG-P920_F_SK_PWR_1.0
8. PCB LAYOUT
2
0
1
B
K
1
0
1
B
K
LG-P920_F_SK_VOL_1.0
9. CALIBRATION
- 191 -
9. CALIBRATION
9.1 Conguration of Tachyon
9.1.1 Conguration of directory
P920/ LGP920
LGP920
LGP920
LGP920
9. CALIBRATION
- 192 -
9.1.2 Description of basic folders
9.1.3 Description of conguration les
Folder Description
Tachyon Exe file and MFC dll, UI dll is present.
Common
Common dll files.
(XML Data I/O , Auto Test Logic, Tachyon Logic Control, Communication)
Config
Envirement files.
(Port configuration, Loss adjust)
Instrument Tester control dll.
Model
Model files is present.
(Model -> Solution (Qualcomm, EMP, ADI, INFINEON) -> MODEL
NAME(LGGW620, LGSH470, ..) -> BUYER NAME(SKT, TEL, VIVO, )
OCX Conponent files.
PhoneCmd Phone communication file
Report
Report Files is present.
(Cal data, test data)
File Description
MODEL NAME_Calibration.XML
There are imformations to calibrate.
It consist of calibration items.
MODEL NAME_CallSetup.XML There are imformations to call.
MODEL NAME_NV.INI
It consists of default values.
It is written when cal&auto is begun.
MODEL NAME_Sequence.XML It is described a testing procedures.
9. CALIBRATION
- 193 -
9.2 How to use Tachyon
9.2.1 Model selection
Follow the procedure before start calibration & auto test
a. Click the icon, in tool bar. Then, you can see the below screen.
b. Select Model LGP920
B
9. CALIBRATION
- 194 -
c. Select the model : You should select LGP920
d. Select the buyer (must be double clicked) Then, you can see PASS in Cong File Check.
e. Click select button
C
D
E
9. CALIBRATION
- 195 -
9.2.2 Start cal & auto
a. Click calibration & autotest button, in Tool bar.
b. Calibration & autotest will be executed in order.
1) Precede Action.
- NV write
- Test command send.
2) Calibration
3) Auto test
4) After action
- Phone reset
- Change UE to AMSS

LGP920
10. HIDDEN MENU
- 196 -
10. HIDDEN MENU
Hidden Menu Start
Start shortcut keys:3845#*920#
Hidden Menu List
Start the desired menu: Menu, click
Device Test
List:
Auto all Test: Device functionality testing at the factory to use
Accelerometer Test
ALC/Proximity Test
AutoDetecting Test
Bluetooth Scan Test
Camera Test
Compass Test
Gyroscope Test
External Memory Test
Font Test
Key/Compass Test
LCD Test
S3D LCD Test
3D LCD Test
RTC Test
Sound Test
Touch Test
Vibrator Test
Wi Scan Test
Gyro Cal Test
EMI Test
HDMI Output Test
HDMI Test
Touch LED Brightness
Gesture Manager Test
Gmtest_app2
Gesture Test
10. HIDDEN MENU
- 197 -
Device Test List
Auto All Test :
-> Auto All Test menu click
-> Continuous information on the menu, giving you ability test
Accelerometer Test
Proximity Test
: Proximity Sensor
Phone contact with your ngers in the top of the sensor
determine the sensor response
- Far 1.0
- Near 0.0
Check the Auto brightness mode
- ALC level changed due to the brightness
10. HIDDEN MENU
- 198 -
AutoDetecting Test
: USIM, SD card, Ear jack
Check the SIM card
Check the SD card
Check Ear phone(jack)
- Ejected ear jack is normal
Bluetooth Scan Test
Camera Test
Menu features disabled
This feature is part of Auto All Test replaced by
-> Auto All Test
-> Camera Preview
-> VTCamera Preview
-> 3DCamera Preview
10. HIDDEN MENU
- 199 -
Camera Test 1
Camera Preview
Camera Test 2
VTCamera Preview
Camera Test 3
3DCamera Preview
10. HIDDEN MENU
- 200 -
Compass Test
Compass Test
External Memory Test
SD Card
SD Card test
-> Write a test check of the SD Card memory
10. HIDDEN MENU
- 201 -
Font Test
Change native font
Key/Compass Test
Up/Down key : Check Recognition
Menu key : Check Recognition
Home key : Check Recognition
Back key : Check Recognition
Search key : Check Recognition
3D key : Check recognition
End key : Check recognition
Phone contact with your ngers in the top of the sensor
determine the sensor response
Far 1.0
Near 0.0
- ALC Change
Compass test
LCD Test List
Manual Test : Click on the following screen
Automatic Test : Automatically, without clicking
Manual Test
Automatic Test
2D pattern Test
3D pattern Test
Red Display
Green Display
Blue Display
White Display
Red, Green, Blue, White Display
Gradation brightness Display
10. HIDDEN MENU
- 202 -
S3D LCD Test
3D LCD Test
RTC test
10. HIDDEN MENU
- 203 -
Ring test
Touch window test
Write with nger
Vibrator test
A case-by-state vibration tests
10. HIDDEN MENU
- 204 -
Wi Scan test
Gyro Cal Test
Gyroscope calibration
EMI Test
Display EMI
10. HIDDEN MENU
- 205 -
HDMI output Test
Using HDMI output
HDMI Test
Display HDMI
Touch LED Brightness
10. HIDDEN MENU
- 206 -
Gesture Test
Audio Loop Back Test
Mic & Speak Phone loop Back test
ELT Test
Automatic Mode: Test Automatically
Manual Mode : Test selectivity
10. HIDDEN MENU
- 207 -
ELT Test
Automatic Mode : LCD Automatic on/o test
-> time setting
ELT Manual Test
LCD Backlight
Ringtone
Vibrator
Camera
Audio Loopback
-> test on the device is working
(The ability to use plant)
SW Sanity Test
FPRI Test
CRC Test: BIN CRC
CAL CRC
EFS CRC
EFS CRC Detail
10. HIDDEN MENU
- 208 -
Factory Reset
Format External SD card : External SD Card Data reset
Format Internal SD card : Internal SD Card Data reset
Factory Rest :Changing the Factory
Version Info
Classied Information representation
Module Test list
- BT DUT setting
- SMS Prefer set
- LCD Always ON
- Hidden Reset
- USB mode selection
- Reboot CP/AP
- Stability Test
- Charging Test
- FOTA Test
- Crash Handling
- SMPL Setting
- SMPL count
- Wakelock Monitoring Setting
10. HIDDEN MENU
- 209 -
WLAN Test
WLAN performance on SW
ERS Menu
Contacts Test
10. HIDDEN MENU
- 210 -
Contacts Test
Aging Test
Port Setting
Select -> OK
KR Setting
-> Select OK
10. HIDDEN MENU
- 211 -
Log service
Browser Utility
AT Test
10. HIDDEN MENU
- 212 -
Modem Setting
Menu:
Engineering Mode
Band Selection
Auto Call Answering
RRC Version Setting
QCRIL/Android Log On/O
PDP Setting
HSDPA Category
GSM A5 Algorithm
Protocol Test
GCF Flag
Arm9 Log ON/O
GPS Test
GPS HW Test
10. HIDDEN MENU
- 213 -
SMS Test
->Automatic Memfull Test
DRM Test
Call Test
VC Auto answer
-> Select Disable or Enable
10. HIDDEN MENU
- 214 -
MMS Test
WPS test
Network Mode
10. HIDDEN MENU
- 215 -
Network Mode
Preferred networks
FM radio Test
Input the Freq. & Volume
10. HIDDEN MENU
- 216 -
Development Menu Setting
For monkey cage test
VT memu
Connectivity Test
10. HIDDEN MENU
- 217 -
TouchArea Setting
Fake Language
11. EXPLODED VIEW & REPLACEMENT PART LIST
MCQ00
MJN00
SVLM00 SVCY00 EBR01 ACQ00
EBR00
ACQ01 ACQ02
ADV00
EBR04
MEG00
SURY00
MCQ02
SUMY00
MCQ01
MBK02
EAX01
EAX00
MBL01
MBL00
EBR05
EAA00
GMEY01
GMZZ00
EAC00
MBK03
MBK00
MBK01
MBK04
SUMY00
MBG01
EBP00
EBR02
SWCC00
MBG02
MBG00
GMEY00 EBR03
Location Description
EBR00 PCB Assembly,Main
MBK00 Can,Shield
MBK01 Can,Shield
MBK02 Can,Shield
EAX00 PCB,Sidekey
MBK03 Can,Shield
EAX01 PCB,Sidekey
MBK04 Can,Shield
EBR01 PCB Assembly,Flexible
SUMY00 Microphone,Condenser
SUMY00 Microphone,Condenser
SVCY00 Camera Module
SVLM00 LCD,Module-TFT
SWCC00 Cable,Assembly
ADV00 Frame Assembly
GMEY00 Screw,Machine
MBG00 Button
MBG01 Button
MBG02 Button
MCQ00 Damper,LCD
MCQ01 Damper
MCQ02 Damper
MEG00 Holder
SURY00 Receiver
EBP00 Camera Module
ACQ00 Cover Assembly,Front
ACQ01 Cover Assembly,Rear
EAA00 Antenna Assembly
MBL00 Cap,Receptacle
MBL01 Cap,Receptacle
GMEY01 Screw,Machine
GMZZ00 Screw,Machine
EAC00 Rechargeable Battery,Lithium Ion
ACQ02 Cover Assembly,Battery
MJN00 Tape
- 219 -
ordered by SBOM standard on GCSC
Level Location No. Description PartNumber Spec Remark
1 AGQ000000 Phone Assembly AGQ86509311
LGP920.ANEUML ML:Metal Black UADS : refer to
AGQ86509301
2 MEZ002100 Label, Approval MLAA0062316
COMPLEX GU280 OREBK ZZ:Without Color
COMPLEX, (empty), , , , ,
2 ACQ100400
Cover Assembly,
EMS
ACQ85692012 LGP920.ANEUML ML:Metal Black -
3 EBR00
PCB Assembly,
Main
EBR73661711 LGP920.ANEUML 1.0 Main
4 EBR071800
PCB Assembly,
Main, SMT
EBR73661811 LGP920.ANEUML 1.0 Main
5 EBR071600
PCB Assembly,
Main,
SMT Bottom
EBR72793001 LGP920.ASFRZY 1.1 MAIN
6 MBK00 Can, Shield MBK62874201 PRESS CU 0.2 LGP920.ASFRZY ZZ:Without Color -
6 BAT800 Capacitor Assembly SMZY0023501
PAS311HR-VG1 3.8 Backup Capacitor 0.03F, Module
Assembly, KOREA TAIYO YUDEN.CO., LTD.
6 MBK01 Can, Shield MBK63032501 PRESS STS 304 0.2mm LGP920.ASFRZY SV:Silver -
5 EBR071700
PCB Assembly,
Main,
SMT Top
EBR72793201 LGP920.ASFRZY 1.1 MAIN
6 EAX010000 PCB, Main EAX63973701 LGP920.ASFRZY 1.1 FR-4 Any Layer 10 0.75 MAIN
6 MBK02 Can, Shield MBK62874001 PRESS CU 0.2 LGP920.ASFRZY ZZ:Without Color -
5 MEZ000000 Label MLAZ0038301
COMPLEX LG-VX6000 ZZ:Without Color PID Label 4
Array PRINTING,
4 EBR071500
PCB Assembly,
Main, Insert
EBR74043701 LGP920.AGBRML 1.1 Main
5 EAX00 PCB, Sidekey EAX64050301 LGP920.ASFRZY E POLYI Multi 2 0.18 SIDEKEY
12.2 Replacement Parts
Note: This Chapter is used for reference, Part order is
<Mechanic component>
11
- 220 -
5 MBK03 Can, Shield MBK62874101
PRESS STS 0.15 LGP920.ASFRZY ZZ:Without Color
-
5 EAX01 PCB, Sidekey EAX64144001 LGP920.AGBWBK 1.0 POLYI Double 2 0.18 Sidekey
5 MEV000000 Insulator MEV63895901 COMPLEX LGP920.ASFRZY ZZ:Without Color -
5 MEV000001 Insulator MEV63896101 COMPLEX LGP920.ASFRZY ZZ:Without Color -
PRESS STS 304 0.2 LGP920.ASFRZY ZZ:Without
Color -
PRESS STS 0.15 LGP920.ASFRZY ZZ:Without Color
-
6 MJN000001 Tape MJN67868301 COMPLEX LGP920.ASFRZY ZZ:Without Color -
5 RAA050100 Resin, PC BRAH0001301 UF-1060
3 ACQ003400
Cover Assembly,
Bar
ACQ85692101 LGP920.AGBRML ML:Metal Black -
4 EBR01
PCB Assembly,
Flexible
EBR74043801 LGP920.AGBRML 1.0 Flexible
5 EBR070400
PCB Assembly,
Flexible, SMT
6 EBR070300
PCB Assembly,
Flexible,
SMT Top
7 EAX010700 PCB, Flexible EAX63975101 LGP920.ASFRZY 1.1 POLYI Multi 5 - FLEXIBLE
7 SUMY00
Microphone,
Condenser
SUMY0010609
SPU0410HR5H -PB SPU0410HR5H -PB, UNIT, 42
dB, 3.76*2.95*1.1, mems smd mic KNOWLES
ACOUSTICS
6 EBR070200
PCB Assembly,
Flexible,
SMT Bottom
4 EBR02
PCB Assembly,
Flexible
5 EBR070400
PCB Assembly,
Flexible, SMT
6 EBR070300
PCB Assembly,
Flexible,
SMT Top
- 221 -
7 EAX010700 PCB, Flexible EAX64142901 LGP920.ASFRZY C POLYI Multi 3 - Flexible
6 EBR070200
PCB Assembly,
Flexible,
SMT Bottom
4 EBR03
PCB Assembly,
Flexible
5 EBR070400
PCB Assembly,
Flexible, SMT
6 EBR070200
PCB Assembly,
Flexible,
SMT Bottom
6 EBR070300
PCB Assembly,
Flexible,
SMT Top
7 EAX010700 PCB, Flexible EAX64132001 LGP920.ASFRZY 1.1 POLYI Double 2 0.18 Flexible
4 EBR04
PCB Assembly,
Flexible
5 EBR070400
PCB Assembly,
Flexible, SMT
6 EBR070300
PCB Assembly,
Flexible,
SMT Top
7 EAX010700 PCB, Flexible EAX63975001 LGP920.ASFRZY 1.0 POLYI Multi 4 0.4 Flexible
7 SUMY00
Microphone,
Condenser
SUMY0010609
SPU0410HR5H -PB SPU0410HR5H -PB, UNIT, 42
dB, 3.76*2.95*1.1, mems smd mic KNOWLES
ACOUSTICS
6 EBR070200
PCB Assembly,
Flexible,
SMT Bottom
4 SVCY00 Camera Module SVCY0027901
LM08MIFF LM08MI VGA Aptina 1/11", MIPI I/F,
FPCB type, 90deg HANSUNG ELCOMTEC CO.,
LTD.
4 SVLM00 LCD, Module-TFT SVLM0043201
LH430WV2-SD01 WVGA 4.3INCH 480X800 170CD
COLOR 70% 15/9 1000:1 60Hz Inverter N 3D LCD LG
Display Co. Ltd.
4 SWCC00 Cable, Assembly SWCC0010601
80186-202B-80L 80 mm, LINE, 20311-011R_20311-
011R, H=2.0, I-PEX CO., LTD
4 ADV00 Frame Assembly ADV73885501 LGP920.ASFRZY BK:Black -
- 222 -
5 MCQ009400 Damper, Camera MCQ66476601 COMPLEX LGP920.ASFRZY ZZ:Without Color -
5 MCQ000000 Damper MCQ66476501 COMPLEX LGP920.ASFRZY ZZ:Without Color -
5 MJN009401 Tape, Camera MJN67697901 COMPLEX LGP920.ASFRZY ZZ:Without Color -
5 MDQ000000 Frame MDQ62840301 COMPLEX LGP920.ASFRZY SV:Silver -
4 GMEY00 Screw, Machine GMEY0018101
GMEY0018101 FH + 1.4mM 1.5mM SWCH FZB N -
KUMGANG SCREW CO., LTD
4 MBG00 Button MBG64110501
MOLD PC LUPOY SC-1004A LGP920.ASFRZY
BK:Black -
BK:Black -
BK:Black -
4 MCQ00 Damper, LCD MCQ66476801 COMPLEX LGP920.ASFRZY BK:Black -
4 MCQ01 Damper MCQ66720201
MOLD URETHANE LGP920.ASFRZY ZZ:Without
Color P920 Pad LCD Rubber
4 MCQ02 Damper MCQ66726801 COMPLEX LGP920.ASFRZY BK:Black -
4 MEG00 Holder MEG62719101 MOLD NBR LGP920.ASFRZY BK:Black -
4 SURY00 Receiver SURY0010114
BWBR1207L-04B-P 30mW 32OHM 105DB
0HZTO0HZ WIRE - BUJEON ELECTRONICS CO.,
LTD
4 EBP00 Camera Module EBP61302201
HSIS-LM58SNAFVS HSIS-LM58SNAFVS 5M AF
Dual Sony 1/4 CIS, MIPI, RFPCB 0degree HANSUNG
ELCOMTEC CO., LTD.
MJN00
- 223 -
4 ACQ00
Cover Assembly,
Front
ACQ85371101 LGP920.ASFRZY BK:Black -
5 MCQ000001 Damper MCQ66723401 COMPLEX LGP920.ASFRZY ZY:Color Unfixed -
5 MJN020801 Tape, Decor MJN67787801 COMPLEX LGP920.ASFRZY ZZ:Without Color -
5 MJN020800 Tape, Decor MJN67787701 COMPLEX LGP920.ASFRZY ZZ:Without Color -
5 MEA000000 Guide MEA62590801
MOLD PC LGP920.ASFRZY ZZ:Without Color light
plate
5 MDJ000000 Filter MDJ63124501 COMPLEX LGP920.ASFRZY ZZ:Without Color -
5 MCR000002 Decor MCR64356501 PRESS STS 304 0.3 LGP920.ASFRZY BK:Black -
5 MCQ009400 Damper, Camera MCQ66627301 COMPLEX LGP920.ASFRZY ZZ:Without Color -
5 MCQ074200 Damper, Speaker MCQ66627201 COMPLEX LGP920.ASFRZY ZZ:Without Color -
5 MCK032700 Cover, Front MCK66589601 MOLD PC LGP920.ASFRZY BK:Black -
6 MET099500 INSERT, NUT MICE0016909 MECH_COMMON ZY, ZZ, PRESS, STS, , , , ,
5 MCR000000 Decor MCR64367501 MOLD PC+ABS LGP920.ASFRZY BK:Black -
5 MCR000001 Decor MCR64367401 MOLD PC+ABS LGP920.ASFRZY BK:Black -
5 EBD030100
Touch Window
Assembly
EBD61005201
S09CL04301B CAPACITIVE TOUCH G/G Synaptics
Gen3 4.3 BB - Kyoshin Technosonic(Korea)Co., LTD.
5 MDJ000001 Filter MDJ63124401 COMPLEX LGP920.ASFRZY ZZ:Without Color -
COMPLEX LG-LC3200 WA:White PRINTING, PPRI
PRINTING
4 MJN000003 Tape MJN67902001
COMPLEX LGP920.ASFRZY ZZ:Without Color P920
USP Film, Europe
- 224 -
3 ACQ01
Cover Assembly,
Rear
ACQ85531901 LGP920.ASFRZY BK:Black -
4 EAA00 Antenna Assembly EAA62609302
P920-MODULE-LAIRD LGP925.AATTDB Black Black
Black LAIRD TECHNOLOGIES KOREA
4 ACW000000 Decor Assembly ACW73637101 LGP920.ASFRZY ZZ:Without Color -
5 MCR000000 Decor MCR64367601 CASTING AL LGP920.ASFRZY SV:Silver -
4 MBL00 Cap, Receptacle MBL64823201
BK:Black -
4 MBL01 Cap, Receptacle MBL64837601
BK:Black -
4 MCK063300 Cover, Rear MCK66589801
BK:Black GF 10%
4 EAA030100
PIFA Antenna,
Multiple
EAA62546001
ACB-00103 DUAL -2DB 3:1 Planar Inverted F Type -
MOBITECH CORPORATION
4 MEZ000900
Label,
After Service
MLAB0001102
COMPLEX C2000 CGRSV WA:White C2000 USASV
DIA 4.0 PRINTING,
4 MKC009400 Window, Camera MKC63903301
CUTTING SODA LIME GLASS LGP920.ASFRZY
ZZ:Without Color -
4 MGJ000000 Plate MGJ63003001 COMPLEX LGP920.ASFRZY BK:Black -
4 MFB029600 Lens, Flash MFB62473601 MOLD PMMA LGP920.ASFRZY ZZ:Without Color -
- 225 -
3 EBR05
PCB Assembly,
Flexible
4 EBR070400
PCB Assembly,
Flexible, SMT
5 EBR070300
PCB Assembly,
Flexible,
SMT Top
6 EAX010700 PCB, Flexible EAX63974901 LGP920.ASFRZY G POLYI Multi 4 0.4 FLEXIBLE
5 EBR070200
PCB Assembly,
Flexible,
SMT Bottom
3 GMEY01 Screw, Machine GMEY0007902
GMEY0007902 CS + 2.7M 4.5M SWRH BLACK N A
KUMGANG SCREW CO., LTD
3 GMZZ00 Screw, Machine GMZZ0017701
GMZZ0017701 BH + 1.4mM 3mM MSWR NI PLT N -
ASIA BOLT
1 AAD000000 Addition Assembly AAD85849712 LGP920.ANEUML ML:Metal Black -
2 ACQ02
Cover Assembly,
Battery
ACQ85513201
LGP920.ASFRZY BK:Black LG-P920 ASFRZY, Cover
Assy Battery
3 MCR000000 Decor MCR64356401 PRESS AL 0.3 LGP920.ASFRZY BK:Black -
3 MCK004100 Cover, Battery MCK66590101
MOLD PC LUPOY SC-1004A LGP920.AGBRML
ML:Metal Black GF10%
3 MGJ000000 Plate MGJ63107801 COMPLEX LGP920.ASFRZY ZZ:Without Color -
2 EAD010000 Cable, Assembly EAD61875101
LG0050 USB USB 1.2M 5pin BLACK halogen free N
ningbo broad telecommunication co., ltd
1 AGF000000 Package Assembly AGF76258517
LGP920.ANEUML ZZ:Without Color
LGP920_COSMO1 NEU Palletizing_700ea
2 MAY084000 Box, Unit MAY65193101
COMPLEX LGP920.ACISML ZZ:Without Color
COSMO 1_H/Case Upper_LG-P920_Small ENG_EU
STD / CIS
2 MAY084001 Box, Unit MAY65193102
COMPLEX LGP920.ACISML ZZ:Without Color
COSMO 1_H/Case Lower_LG-P920_Small ENG_EU
STD / CIS
2 MAY047100 Box, Master MAY65217301
COMPLEX LGP920.AFRAML ZZ:Without Color
COSMO 1 M/Box_LGP920_None_EU STD / CIS
- 226 -
2 MEZ084100 Label, Unit Box MEZ64160701
COMPLEX LGP920.ADEUML ZZ:Without Color
COSMO_USP Label_LGP920_ENG_ENG STD
2 MEZ003500 Label, Barcode MEZ64187101 COMPLEX LGP920.ADEUML ZZ:Without Color -
2 MEZ047200 Label, Master Box MLAJ0004402
PRINTING CG300 CGR DG ZZ:Without Color LABEL
MASTER BOX(for CGR TDR 2VER. mbox_label) GSM
standard_master box label
COMPLEX KU990.AGBRBK ZZ:Without Color Battery
Warning Label (Lithium ion Battery Label)
2 AGJ000000 Pallet Assembly AGJ73398303
LGP920.ADEUML ZZ:Without Color COSMO1
NEU_Body 1200*800(9501)_700ea
3 MBL007000 Cap, Box MCCL0001710 COMPLEX LGP920.ANLDML ZZ:Without Color 2/700
3 MAY010800 Box, Carton MBEC0003012 COMPLEX LGP920.ANLDML ZZ:Without Color 1/700
3 MGA000000 Pallet MPCY0009501
COMPLEX G7100 ORUBK BK:Black PALLET(G7100
for Orange UK_EUR) COMPLEX,
- 227 -
6 L113
Inductor, Multilayer,
Chip
ELCH0001048
1005GC2T10NJLF 10NH 5% - 250mA 0.42OHM
2.5GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
PILKOR ELECTRONICS LTD.
6 C211
Capacitor, Ceramic,
Chip
ECZH0000822
C1005C0G1H1R5CT000F 1.5pF 0.25PF 50V NP0 -
55TO+125C 1005 R/TP - TDK KOREA
COOPERATION
6
C244,
C247
Capacitor, Ceramic,
Chip
ECCH0006201
C1608X5R0J475KT000N 4.7uF 10% 6.3V X5R -
55TO+85C 1608 R/TP - TDK CORPORATION
6
C1209,
C1210,
C1211,
C227,
C835,
C836,
C842,
C890,
C934,
C935
Capacitor, Ceramic,
Chip
ECCH0007804
CL05A225MP5NSNC 2.2uF 20% 10V X5R -
55TO+85C 1005 R/TP 0.5MM SAMSUNG
ELECTRO-MECHANICS CO., LTD.
6
C1107,
C1173,
C1204,
C1205,
C1206,
C1207,
C1208,
C1832,
C1901,
C1902,
C1905,
C193,
C241,
C245,
C250,
C659,
C665
Capacitor, Ceramic,
Chip
ECCH0004904
GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C
1005 R/TP - MURATA MANUFACTURING CO., LTD.
6 C1201
Capacitor, Ceramic,
Chip
ECCH0005604
GRM188R60J106M 10000000 pF, 6.3V, M, X5R, TC,
1608, R/TP, 0.8 mm MURATA MANUFACTURING
CO., LTD.
12.2 Replacement Parts
<Main component>
11
- 228 -
6
C1101,
C1102,
C1103,
C1106,
C1121,
C1831,
C1923,
C891,
C975,
C978
Capacitor, Ceramic,
Chip
ECZH0001215
C1005X5R1A105KT000F 1uF 10% 10V X5R -
COOPERATION
6 R811 Resistor, Chip ERHZ0000318
MCR01MZP5F8062 80.6KOHM 1% 1/16W 1005 R/TP
- ROHM.
6
C1122,
C1137
Capacitor, Ceramic,
Chip
ECZH0003503
GRM188R61E105K 1uF 10% 25V X5R -55TO+85C
6
C1812,
C1815,
C1816,
C1817,
C1818,
C1822,
C209,
C230,
C231,
C249,
C924,
C927,
C937
Capacitor, Ceramic,
Chip
ECCH0000198
CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -
55TO+85C 1005 R/TP . SAMSUNG ELECTRO-
MECHANICS CO., LTD.
MCR01MZP5F1501 1.5KOHM 1% 1/16W 1005 R/TP -
ROHM.
6
C115,
C1814,
C185,
C801,
C858
Capacitor, Ceramic,
Chip
ECCH0009106
C0603X7R1C103KT 10nF 10% 10V X7R -
6
R1176,
R801,
R802
Resistor, Chip ERHY0009505
MCR006YZPJ103 10KOHM 5% 1/20W 0603 R/TP -
ROHM.
6
C105,
C1932,
C1936,
L1802
Capacitor, Ceramic,
Chip
ECZH0000813
C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C
1005 R/TP - TDK KOREA COOPERATION
6 R1125 Resistor, Chip ERHY0009555
MCR006YZPF1202 12KOHM 1% 1/20W 0603 R/TP -
ROHM.
- 229 -
6
ZD1172,
ZD1181,
ZD1182,
ZD1224,
ZD1225
Diode, TVS EDTY0010101
ESD9B5.0ST5G ESD9B5.0ST5G, SOD-923, 5 V, 300
mW, R/TP, 15pF SCG HONG KONG SAR LTD.
6 L131
Chip
ELCH0001411
LL1005-FHL1N2S 1.2NH 0.3NH - 400mA 0.1OHM
16GHZ 7 SHIELD NONE 1.0X0.5X0.5MM R/TP
TOKO, INC.
6
C1228,
C1235,
C1241,
C1252,
C192,
C243,
C248,
C901,
C902,
C903,
C904,
C905
Capacitor, Ceramic,
Chip
ECCH0017601
CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R -
6 U1121
IC, DC, DC
Converter
EUSY0430301
LM3528TMX 2.5 to 5.5V adj 0W CSP R/TP 12P -
NATIONAL SEMICONDUCTOR ASIA PACIFIC PTE.
LTD.
6
C114,
C1174
Capacitor, Ceramic,
Chip
ECCH0009506
MCH032A270JK 27pF 5% 25V NP0 -55TO+125C
0603 R/TP - ROHM.
6
R1190,
R1191,
R896,
R897
PCB ASSY,
MAIN,
PAD OPEN
SAFO0000401 AX3100 ATL SV_SHIPBACK, MAIN, A, 0OHM DNI
6
R1102,
R1103,
R510,
R511
MCR006YZPJ152 1.5KOHM 5% 1/20W 0603 R/TP -
ROHM.
6 L179
Chip
ELCH0003847
LQG15HS1N8S02D 1.8NH 0.3NH - 300mA 0.1OHM
MURATA MANUFACTURING CO., LTD.
6 U1801
Module, RF
Amplifier
SMZY0027801
ALM-2712 0DBM 14.2DB 0% 0A 200mA 0DB 80DBM
1.26DBM 0P 3.0x2.5x1.0MM - AVAGO
TECHNOLOGIES INTERNATIONAL SALES PTE.
LIMITED
6 U975 IC, Magnetic Sensor EBD60985501
AMI306 1.7 to 3.6V - QFN R/TP 8P - AICHI STEEL
CORPORATION
6 C187
Capacitor, Ceramic,
Chip
ECCH0009228
GRM033R61A472K 4700pF 10% 10V X5R -
55TO+85C 0603 R/TP - MURATA
MANUFACTURING CO., LTD.
- 230 -
6
C1141,
C1229,
C1236,
C1904,
C1906,
C1908,
C1909,
C1910,
C225,
C688,
C892,
C923
Capacitor, Ceramic,
Chip
ECCH0017301
CL03A105MQ3CSNH 0.000001F 20% 6.3V X5R -
45TO+85C 0603 R/TP - SAMSUNG ELECTRO-
MECHANICS CO., LTD.
6
FB1812,
FB1815,
FB1817,
FB1818
Filter, Bead EAM62150301
CIM05J600NC 60 ohm 1.0X0.5X0.5 25% 0.2 ohm
0.65A SMD R/TP 2P 0 SAMSUNG ELECTRO-
MECHANICS CO., LTD.
6
C221,
C976
Capacitor, Ceramic,
Chip
ECCH0000155
MCH153CN103KK 10nF 10% 16V X7R -55TO+125C
1005 R/TP - ROHM Semiconductor KOREA
CORPORATION
6 C1143 Capacitor, Array EAE62463801
GNM0M2R60J105ME18D 1uF2 20% 6.3V 2R SMD
R/TP 4P MURATA MANUFACTURING CO., LTD.
6
C1171,
C189,
C913,
C914
Capacitor, Ceramic,
Chip
ECZH0025920
GRM033R71C102K 1nF 10% 16V X7R -55TO+125C
6
R1905,
R894,
R895,
R919,
R921
PCB ASSY, MAIN,
PAD SHORT
SAFP0000401 LG-LU3000 LGTBK, MAIN, A,
6 X1821 Oscillator, TCXO EXST0002501
KT2520F26000ACW18TAK 26 MHz, 2 PPM, 10 pF,
SMD, 2.5*2.0*0.8, 2ppm, 26, 1.8V, 2.5, 2.0, 0.8, SMD,
R/TP KYOCERA CORP.
6 CN800
Connector, Terminal
Block
EAG62832401
04-9254-003-037-037-829+ 3P 2.50MM ANGLE SMD
T/REEL - KYOCERA ELCO KOREA SALES CO.,
LTD.
- 231 -
6
C1134,
C1175,
C1176,
C1230,
C1231,
C1232,
C1233,
C1234,
C1237,
C1253,
C173,
C1802,
C1903,
C1907,
C191,
C1911,
C1912,
C1913,
C1914,
C1915,
C194,
C200,
C201,
C202,
C203,
C204,
C206,
C207,
C208,
C251,
C301,
C609,
C610,
C626
Capacitor, Ceramic,
Chip
ECCH0009101
C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R -
6
C646,
C654,
C655,
C915,
C916,
C917,
C918,
C919,
C920,
C921,
C922,
C925,
C928,
C929,
C930,
C931,
C932,
C938,
C939
Capacitor, Ceramic,
Chip
ECCH0009101
C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R -
- 232 -
6 FB201 Filter, Bead EAM62070801
BLM15EG221SN1D 220 ohm 1.0X0.5X0.5 25% 0.28
ohm 0.7A SMD R/TP 2P 0 MURATA
6 D1122 Diode, Switching EDSY0011901
SDB310Q 340mV 30V 200mA 1A 0SEC 150mW
EMD2 R/TP 2P 1 AUK CORP
6 FL111 Filter Separator SFAY0015301
BGSF18DM20 800, 1900, 1.0 dB, 1.0 dB, 25 dB, 25
dB, 3226, 3228Size INFINEON TECHNOLOGIES
(ASIA PACIFIC) PTE LTD.
6
R1134,
R1174
ROHM.
6
C1131,
C242
Capacitor, Ceramic,
Chip
ECCH0007802
CL10A475KP8NNNC 4.7uF 10% 10V X5R -
MECHANICS CO., LTD.
6 C1178
Capacitor, Ceramic,
Chip
ECCH0009231
GRM033R71C471K 470pF 10% 16V X7R -
6
L1807,
L1810,
L1926
Chip
ELCH0003831
LQG15HS1N0S02D 1NH 0.3NH - 300mA 0.07OHM
6 C1138
Capacitor, Ceramic,
Chip
ECZH0003504
GRM188R71E104K 100nF 10% 25V X7R -
6 C800
Capacitor, Ceramic,
Chip
ECCH0009103
C0603C0G1H101JT00NN 100pF 5% 50V X7R -
6 C1821
Capacitor, Ceramic,
Chip
ECCH0009216
GRM0335C1E220J 22pF 5% 25V X7R -55TO+125C
6
R521,
R522
ROHM Semiconductor KOREA CORPORATION
6
L102,
L122,
L142,
L161
Chip
ELCH0003832
LQG15HS2N2S02D 2.2NH 0.3NH - 300mA - -
0.12OHM 6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM
R/TP MURATA MANUFACTURING CO., LTD.
6
L127,
L137,
L213
Chip
ELCH0001403
LL1005-FHL1N0S 1NH 0.3NH - 400mA 0.1OHM
TOKO, INC.
6 U181
IC, RF Transceiver,
3G
EUSY0432901
PMB5712 XMM6260 RFIC , ; , IC, Tx/Rx WFWLB
R/TP 138P INFINEON TECHNOLOGIES (ASIA
PACIFIC) PTE LTD.
- 233 -
6 U1901 IC, WiFi EUSY0378501
WL1271BYFFR 0VTO0V 0W 137P - WLCSP R/TP
137P TEXAS INSTRUMENTS KOREA LTD,
HONGKONG BRANCH.
6
C1916,
C308,
C310,
C311,
C936
Capacitor, Ceramic,
Chip
ECCH0032801
GRM033R60J224M 0.00000022F 20% 6.3V X5R -
55TO+85C 0603 R/TP 0.3MM MURATA
6 U891 IC, Fuel Gauge EAN61958601
MAX17043G 2.5 to 4.5V Vbat 0W DFN R/TP 8P -
MAXIM INTEGRATED PRODUCTS INC.
6 L1131
Inductor, Wire
Wound, Chip
ELCP0008019
VLS252010ET- 4R7M 4.7UH 20% - 800mA
0.332OHM - - NON SHIELD 2.5X2X1MM NONE -
TDK CORPORATION
6 FL211 Filter, Saw SFSY0035004
B9469 2140 MHz, 1.4*1.1*0.45, SMD, 2110M~2170M,
IL 2.5, 5pin, U-B, 50-100, BAND I DIVERSITY,
2140MHz, 1.4*1.1*0.45, SMD, R/TP EPCOS PTE
LTD.
6
CN1161,
CN1171
Connector, BtoB ENBY0057501
24-5804-034-000-829+ 34, 0.4 mm, STRAIGHT, gold,
34, 0.40MM, STRAIGHT, FEMALE, SMD, 0.9T,
KYOCERA ELCO KOREA SALES CO., LTD.
6
L176,
L211,
L212
Chip
ELCH0001056
1005GC2T2N7SLF 2.7NH 0.3NH - 300mA 0.17OHM
6 C803
Capacitor, Ceramic,
Chip
ECCH0009213
GRM0335C1E6R0D 6pF 0.5PF 25V X7R -
6
VA1102,
VA1104,
VA901,
VA902,
VA903
Varistor SEVY0008901
ICVS0318150FR 18V 0% 15pF 0.6*0.3*0.33 NONE
SMD R/TP INNOCHIPS TECHNOLOGY
6
L244,
L247,
L249
Inductor, Wire
Wound, chip
ELCP0008014
MIPSZ2012D4R7 MIPSZ2012D4R7, 4.7 uH, N,
2.0X1.2X1.0, R/TP FDK CORPORATION.
6
FL1141,
FL1142,
FL1221,
FL1222,
FL1223
Filter, EMI/Power SFEY0015901
ICMEF214P101MFR ICMEF214P101MFR, SMD,
ESD Common mode Filter INNOCHIPS
TECHNOLOGY
6 PT301 Thermistor, NTC SETY0006301
NCP15XH103J03RC 10KOHM 5% 0V 0A 3.35KK
SMD P/TP 1005size MURATA MANUFACTURING
CO., LTD.
- 234 -
6
FB1173,
FB1175,
FB1176,
FB1177
Filter, Bead SFBH0008102
BLM15HD182SN1D 1800 ohm 1.0X0.5X0.5 25% 2.2
6 U1131
IC, DC, DC
Converter
EAN61841601
TPS61093 1.6 to 6V adj 1.6W DFN R/TP 10P -
TEXAS INSTRUMENTS KOREA LTD, HONGKONG
BRANCH.
6
C116,
C117,
C121,
C132,
C151,
C163
Capacitor, Ceramic,
Chip
ECZH0000830
C1005C0G1H330JT000F 33pF 5% 50V NP0 -
COOPERATION
6 Q1173 FET EQFP0000101
2SJ347 P-CHANNEL MOSFET -20V -7 -0.05A
40OHM 100mW SSM R/TP 3P TOSHIBA
6
R514,
R515
ROHM.
6 VA800 Varistor SEVY0003601
ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55
NONE SMD R/TP INNOCHIPS TECHNOLOGY
6 U1108 IC, Level Translator EUSY0391601
NLSV1T244-D 0.9~4.5V - LEVEL SHIFTER - R/TP 6P
- SCG HONG KONG SAR LTD.
MCR01MZP5F5103 510KOHM 1% 1/16W 1005 R/TP
- ROHM.
- ROHM.
MCR006YZPJ101 100OHM 5% 1/20W 0603 R/TP -
ROHM.
6
CN1803,
CN1904
Contact MCE62252901
COMPLEX LGP999BN ZZ:Without Color LG-P999
CLIP_SUB
6
C197,
C198,
C199,
C205
Capacitor, Ceramic,
Chip
ECCH0009201
GRM033R60J473KE19D 47nF 10% 6.3V X5R -
6 C153
Capacitor, Ceramic,
Chip
ECCH0000115
MCH155A220JK 22pF 5% 50V NP0 -55TO+125C
CORPORATION
6
FB1174,
FB901,
FB913,
FB914,
FB941
BLM15AG121SN1D 120 ohm 1.0X0.5X0.5 25% 0.25
- 235 -
6
C1271,
C195,
C222,
C933,
C941
Capacitor, Ceramic,
Chip
EAE62286801
CL03A104KP3NNNC 0.0000001F 10% 10V X5R -
55TO+85C 0603 R/TP 0.3 SAMSUNG ELECTRO-
MECHANICS CO., LTD.
6 C1920
Capacitor, Ceramic,
Chip
ECCH0000145
MCH155CN152KK 1.5nF 10% 50V X7R -55TO+125C
CORPORATION
6 L1923
Chip
ELCH0001034
HK1005 3N3S-T 3.3NH 0.3NH - 300mA 0.16OHM
6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP TAIYO
YUDEN CO., LTD
6
U1106,
U1831
IC, LDO Voltage
Regulator
EUSY0407101
BU28TD4WNVX SSON004, 4, R/TP, 2.8V 150mA
Single LDO, IC, LDO Voltage RegulatorIC, LDO Voltage
Regulator ROHM.
6
R1171,
R316
ROHM.
6 SW102 Connector, RF ENWY0008701
MS-156C NONE STRAIGHT SOCKET SMD T/REEL
AU 50OHM 400mDB HIROSE KOREA CO., LTD
6 L226
Inductor, Wire
Wound, chip
ELCP0009408
LQM2HPN1R0MG0 LQM2HPN1R0MG0, 1 uH, N,
2X2.5X1.0, R/TP, Chip power MURATA
6 C228
Capacitor, Ceramic,
Chip
ECCH0009230
GRM033R61A222K 2.2nF 10% 25V X5R -55TO+85C
6 L1803
Chip
ELCH0003818
LQG15HS9N1J02D 9.1NH 5% - 300mA 0.26OHM
6
C807,
C926
Capacitor, Ceramic,
Chip
ECCH0034801
CL03A474MQ3NNNH 0.47 uF, 6.3V, M, X5R, HD,
0603, R/TP, 0.0000047, 20%, 6.3V, X5R, -55TO+85C,
0603, R/TP, .3 mm SAMSUNG ELECTRO-
MECHANICS CO., LTD.
6
R1802,
R500
MCR006YZPJ100 10OHM 5% 1/20W 0603 R/TP -
ROHM.
6 FL627 Filter, EMI/Power EAM62230801
NFM18PS105R0J3D_ EMI 0HZ 1uF 0H SMD R/TP
6.3V, 2A, 0.03ohm MURATA MANUFACTURING
CO., LTD.
6 C805
Capacitor, TA,
Conformal
ECTH0002703
TCTAL1A107M8R 0.0001F 20% 10V 50UA -
55TO+125C 0OHM 3.2x1.6x1.1 NONE SMD R/TP
ROHM CO., LTD.
ROHM.
- 236 -
6 U901 IC, Audio Codec EUSY0424501
TWL6040 BGA, 120, R/TP, 6X6, OMAP4XXX, IC,
Audio Codec TEXAS INSTRUMENTS KOREA LTD,
HONGKONG BRANCH.
6 C1803
Capacitor, Ceramic,
Chip
ECCH0009109
C0603X7R1H331KT00NN 330pF 10% 50V X7R -
6 C226
Capacitor, Ceramic,
Chip
ECCH0005603
GRM188R61A225K 2.2uF 10% 10V X5R -55TO+85C
6 C172
Capacitor, Ceramic,
Chip
ECCH0000182
GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C
MCR01MZP5F2201 2.2KOHM 1% 1/16W 1005 R/TP -
ROHM.
6
L147,
L158,
L168
Chip
ELCH0001404
TOKO, INC.
6 FB1143 Filter, Bead SFBH0008101
BLM15AG601SN1D 600 ohm 1.0X0.5X0.5 25% 0.6
6
FL1171,
FL1172
Filter, EMI/Power SFEY0016301
ICMEF112P900M COMMON MODE NOISE FILTER
0HZ 0F 0H SMD R/TP INNOCHIPS TECHNOLOGY
6 C188
Capacitor, Ceramic,
Chip
ECZH0001108
C1005X7R1E682KT000F 6.8nF 10% 25V X7R -
COOPERATION
6 D1175 Diode, TVS EDTY0009801
VSMF05LCC 5V 6V 12V 2A 25W SOT-963 R/TP 6P 5
PROTEK DEVICES INC.
6
C1179,
C1212,
C223,
C224
Capacitor, Ceramic,
Chip
ECCH0007803
CL10A106MP8NNNC 10uF 20% 10V X5R -
6 C1801
Capacitor, Ceramic,
Chip
ECZH0025917
GRM0335C1E470J 47pF 5% 25V NP0 -55TO+125C
6 C112
Capacitor, Ceramic,
Chip
ECCH0000110
MCH155A100D 10pF 0.5PF 50V NP0 -55TO+125C
CORPORATION
6 C802
Capacitor, Ceramic,
Chip
ECCH0009514
MCH032A(AN)100DK 10pF 0.5PF 25V X7R -
55TO+125C 0603 R/TP - ROHM.
6 CN1181 Connector, BtoB ENBY0053601
24-5804-020-000-829+ 20P 0.40MM STRAIGHT
FEMALE SMD R/TP 900mM - KYOCERA ELCO
KOREA SALES CO., LTD.
- 237 -
6 L1251
Inductor, Wire
Wound, chip
ELCP0008015
MIPSTZ2012D1R0 MIPSTZ2012D1R0, 1.0 uH, N,
2*1.25*0.8, R/TP FDK CORPORATION.
6 U220
IC, DC, DC
Converter
EUSY0264510
RF6560 2.9 to 5.1V adj 0W CSP R/TP 24P - RF
MICRO DEVICES INC
6
R1101,
R1126,
R1202,
R1271
ROHM.
6
L110,
L215
Chip
ELCH0001035
HK1005 4N7S-T 4.7NH 0.3NH - 300mA 0.21OHM
4GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP TAIYO
YUDEN CO., LTD
6 U241 IC, MM PMIC EUSY0264511
RF6590 CSP , 16 , R/TP , 3B, 2LDO, CSP,
1.732X1.722 , ; , IC, DC, DC Converter MICRO
DEVICES, INC.
6 C1132
Capacitor, Ceramic,
Chip
ECZH0003103
GRM36X7R104K10PT 100nF 10% 10V X7R -
6 FL1901 Filter, Ceramic SFCY0000901
LFB212G45SG8A166 BPF 2.45KHZ 100Hz SMD
6 U1902 Module, WLAN SMZY0027002
RF3482 TI WLAN WL1271 COB 3x3 SP3T + PAM +
DET + Balun + Tx Filter, RF Module RF MICRO
DEVICES INC
6
C109,
C1808
Capacitor, Ceramic,
Chip
ECCH0000183
GRM1555C1H1R8C 1.8pF 0.25PF 50V NP0 -
6 U121 Filter, Multiplexer EAM62070401
B40761DY2045L Duplexer Bank for UE2j,
Band1/2/4/5/8+DCS1800, 10.4*3.6*1.0 KOREA
TAIYO YUDEN.CO., LTD.
6 L1201
Inductor, Wire
Wound, chip
ELCP0008013
MIPSZ2012D2R2 MIPSZ2012D2R2, 2.2 uH, N,
2.0X1.2X1.0, R/TP FDK CORPORATION.
6 U1811 IC, GPS EUSY0415301
BCM4751IUB2G , 42, BCM4750 Shrink version 65nm,
IC, GPS WLBGA R/TP 42P BROADCOM CORP
6 U1251 IC, I/O Support Chip EUSY0426301
TPD12S015 ESD protection HDMI companion chip , ; ,
IC, CMOS WCSP R/TP 28P TEXAS INSTRUMENTS
KOREA LTD, HONGKONG BRANCH.
GB042-40S-H10-E3000 40P 0.4MM STRAIGHT
SOCKET SMD R/TP 1M ENGINEERING PLASTIC
UL94V-0 AU OVER NI LS Mtron Ltd.
- 238 -
6
C171,
C232
Capacitor, Ceramic,
Chip
ECZH0001216
C1005X5R1A224KT000E 220nF 10% 10V X5R -
COOPERATION
6 U1101
IC, LDO Voltage
Regulator
EUSY0407401
RT9032 WDFN8L, 8, R/TP, Programmable Dual LDO,
IC, LDO Voltage RegulatorIC, LDO Voltage Regulator
RICHTEK TECHNOLOGY CORP.
6 L1811
Chip
ELCH0009109
0402CS-6N8XJEW 6.8NH 5% - 680mA 0.083OHM
4.8GHZ 20 NON SHIELD NONE 1.19X0.64X0.66MM
R/TP COILCRAFT SINGAPORE PTE LTD.
6 L114
Chip
ELCH0003820
LQG15HS3N0S02D 3NH 0.3NH - 300mA 0.17OHM
6 C804
Capacitor, Ceramic,
Chip
ECCH0042009
GRM0335C1E3R0BD01D 3 pF, 25V, B, C0G, TC,
0603, R/TP, 0.000000000003, 0.1PF, 25V, C0G, -
55TO+125C, 0603, R/TP, 0.3 mm MURATA
6 U1201 IC, MM PMIC EUSY0227205
LP8720TLX 2.7 To 5.5V Adj 1.2W CSP R/TP 20P -
NATIONAL SEMICONDUCTOR ASIA PACIFIC PTE.
LTD.
6 U171 Module, Tx Module SMRH0006901
RF6260 0DBM 0DB 0% 0A 0A 0DB 0DBM 0DBM 0P
0.0x0.0x0.0MM - RF MICRO DEVICES INC
ROHM.
6
R891,
R893
RC0603J151CS 150OHM 5% 1/20W 0603 R/TP -
SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 FL1801
Filter, Separator,
Spdt
SFAC0002701
LFD211G57DPMD153 0.67 13.5 - 2050, 240 MHz,
0.67 dB, 13.5 dB, 1575, 6 MHz, 0.88 dB, 18.3 dB,
SMD, ETC, diplexer, GPS/PCS, 2.0*1.25, MURATA
6 L1901
Chip
ELCH0003830
LQG15HSR18J02D 180NH 5% - 130mA 3.38OHM
500MHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
6 Q801 FET, Array EBK61611301
NTUD3169CZ N/P-CHANNEL 20 8 0.22(0.2) 2(6)
0.125 SOT-963 R/TP 6P 2 ON SEMICONDUCTOR
6
C1177,
C184
Capacitor, Ceramic,
Chip
ECCH0009110
C0603X7R0J223KT 22nF 10% 6.3V X7R -
RC0201JR-0751KL 51KOHM 5% 1/20W 0603 R/TP -
YAGEO CORPORATION
- 239 -
6 L1121
Inductor, Wire
Wound, Chip
EAP61747901
VLS3010ET-100M 10UH 20% - 630mA 0.39OHM
1.8MHZ 19 SHIELD 3.03x3.03x1.0 NONE R/TP TDK
KOREA COOPERATION
24-5804-030-000-829+ 30P 0.40MM STRAIGHT
6 X184 Oscillator, VCTCXO EAW61443801
1XXA26000FBA 26MHZ 1PPM 1.8V 2.5x2.0x0.8MM ;
SMD R/TP DAISHINKU CORPORATION.
MCR01MZP5F2202 22KOHM 1% 1/16W 1005 R/TP -
ROHM.
6 C940
Capacitor, Ceramic,
Chip
ECZH0001217
GRM155R60J474K 470nF 10% 6.3V X5R -25TO+70C
1005 BK-DUP - MURATA MANUFACTURING CO.,
LTD.
6 L227
Inductor, Wire
Wound, Chip
EAP61785901
LQW15CN18NJ00D 18NH 5% - 1.4A - - 0.046OHM
3GHZ - SHIELD 1.0X0.5X0.5MM NONE R/TP
6
C123,
C175
Capacitor, Ceramic,
Chip
ECZH0000802
C1005C0G1H010CT 1pF 0.25PF 50V NP0 -
COOPERATION
6
L104,
L1924
Chip
ELCH0001430
LL1005-FHLR10J 100NH 5% - 150mA 2.2OHM
TOKO, INC.
6 L152
Chip
ELCH0003813
LQG15HN47NJ02D 47NH 5% - 200mA 1.15OHM
6 ZD803 Diode, TVS EDTY0008601
PSD05-LF 5V 6 13.5V 42A 500W SOD323 R/TP 2P 1
PROTEK DEVICES INC.
6
L245,
L248
Chip
ELCH0012510
LQW15AN15NG00D 15NH 2% - 460mA 0.16OHM
5GHZ 30 NON SHIELD NONE 1.0X0.5X0.5MM R/TP
20279-001E-01 NONE STRAIGHT SOCKET SMD
R/TP AU 50OHM 400mDB I-PEX CO., LTD
6
C1271,
C195,
C222,
C933,
C941
Capacitor, Ceramic,
Chip
EAE62286801
CL03A104KP3NNNC 0.0000001F 10% 10V X5R -
55TO+85C 0603 R/TP 0.3 SAMSUNG ELECTRO-
MECHANICS CO., LTD.
- 240 -
6
C1107,
C1173,
C1204,
C1205,
C1206,
C1207,
C1208,
C1832,
C1901,
C1902,
C1905,
C193,
C241,
C245,
C250,
C659,
C665
Capacitor, Ceramic,
Chip
ECCH0004904
GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C
6
C1134,
C1175,
C1176,
C1230,
C1231,
C1232,
C1233,
C1234,
C1237,
C1253,
C173,
C1802,
C1903,
C1907,
C191,
C1911,
C1912,
C1913,
C1914,
C1915,
C194,
C200,
C201,
C202,
C203,
C204,
C206,
C207,
C208,
C251,
C301,
C609,
C610,
C626
Capacitor, Ceramic,
Chip
ECCH0009101
C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R -
- 241 -
6
C646,
C654,
C655,
C915,
C916,
C917,
C918,
C919,
C920,
C921,
C922,
C925,
C928,
C929,
C930,
C931,
C932,
C938,
C939
Capacitor, Ceramic,
Chip
ECCH0009101
C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R -
6
C1179,
C1212,
C223,
C224
Capacitor, Ceramic,
Chip
ECCH0007803
CL10A106MP8NNNC 10uF 20% 10V X5R -
6 FL627 Filter, EMI/Power EAM62230801
NFM18PS105R0J3D_ EMI 0HZ 1uF 0H SMD R/TP
6.3V, 2A, 0.03ohm MURATA MANUFACTURING
CO., LTD.
6
C1228,
C1235,
C1241,
C1252,
C192,
C243,
C248,
C901,
C902,
C903,
C904,
C905
Capacitor, Ceramic,
Chip
ECCH0017601
CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R -
6 C1201
Capacitor, Ceramic,
Chip
ECCH0005604
GRM188R60J106M 10000000 pF, 6.3V, M, X5R, TC,
CO., LTD.
6 ZD801 Diode, TVS EDTY0008602
PSD12-LF 12V 13.3 25.9V 21A 500W SOD323 R/TP
2P 1 PROTEK DEVICES INC.
6 U500
IC, Application
Processor
EUSY0425001
OMAP4430 , 54, 547pin, IC, Digital Signal Processors
BGA R/TP 547P TEXAS INSTRUMENTS KOREA
LTD, HONGKONG BRANCH.
6 U303 IC, Analog Switch EUSY0186504
FSA2259UMX QFN , 8 , R/TP , Dual SPDT , ; , IC,
Analog Switch FAIRCHILD SEMICONDUCTOR
- 242 -
6
R588,
R591,
R594,
R596,
R597
ROHM.
6 C1143 Capacitor, Array EAE62463801
GNM0M2R60J105ME18D 1uF2 20% 6.3V 2R SMD
6
C807,
C926
Capacitor, Ceramic,
Chip
ECCH0034801
CL03A474MQ3NNNH 0.47 uF, 6.3V, M, X5R, HD,
0603, R/TP, 0.0000047, 20%, 6.3V, X5R, -55TO+85C,
0603, R/TP, .3 mm SAMSUNG ELECTRO-
MECHANICS CO., LTD.
6
R1802,
R500
MCR006YZPJ100 10OHM 5% 1/20W 0603 R/TP -
ROHM.
6
C1916,
C308,
C310,
C311,
C936
Capacitor, Ceramic,
Chip
ECCH0032801
GRM033R60J224M 0.00000022F 20% 6.3V X5R -
55TO+85C 0603 R/TP 0.3MM MURATA
6
C1141,
C1229,
C1236,
C1904,
C1906,
C1908,
C1909,
C1910,
C225,
C688,
C892,
C923
Capacitor, Ceramic,
Chip
ECCH0017301
CL03A105MQ3CSNH 0.000001F 20% 6.3V X5R -
MECHANICS CO., LTD.
6
R1176,
R801,
R802
ROHM.
6 U1904
IC, DC, DC
Converter
EUSY0416301
TPS62611YFDR CSP, 6, R/TP, DCDC Converter for
WiFi BT Module Power, IC, DC, DC Converter TEXAS
INSTRUMENTS KOREA LTD, HONGKONG
BRANCH.
6 CN1271 Connector, I/O EAG62832201
78618-0001 19P 0.40MM ANGLE RECEPTACLE DIP
R/TP - HANKOOK MOLEX
6
C316,
C318,
C325
Capacitor, Low ESL EAE62487001
LLL153C80J224ME14E 0.22uF 20% 6.3V X6S -
55TO+105C 1005 R/TP 0.35T max. MURATA
6
FB1812,
FB1815,
FB1817,
FB1818
CIM05J600NC 60 ohm 1.0X0.5X0.5 25% 0.2 ohm
MECHANICS CO., LTD.
- 243 -
6
R514,
R515
ROHM.
6
C507,
C508,
C509
Capacitor, Ceramic,
Chip
ECCH0009206
GRM0335C1E680J 68pF 5% 25V X7R -55TO+125C
6
R1171,
R316
ROHM.
6
ZD1172,
ZD1181,
ZD1182,
ZD1224,
ZD1225
6 U981 IC, Motor Driver EUSY0238306 ISA1000 2.4~3.6V 150mV~300mV 0W DFN R/TP 8P -
6 U1101
IC, LDO Voltage
Regulator
EUSY0407401
RT9032 WDFN8L, 8, R/TP, Programmable Dual LDO,
IC, LDO Voltage RegulatorIC, LDO Voltage Regulator
6
SC791,
SC792,
SC793,
SC794,
SC795,
SC796
Clip MCGY0003801 COMPLEX LG-KH3900 KTF ZZ:Without Color -
- ROHM.
MCR01MZP5F5600 560OHM 1% 1/16W 1005 R/TP -
ROHM.
6 FB1143 Filter, Bead SFBH0008101
BLM15AG601SN1D 600 ohm 1.0X0.5X0.5 25% 0.6
6 C823
Capacitor, Ceramic,
Chip
ECZH0001420
C1608X5R1A105KT000E 1uF 10% 10V X5R -
COOPERATION
6 U301
IC, Digital Baseband
Processor, 3G
EUSY0432001
PMB9811 1.7VTO2V, 1.7VTO2V, 1.7VTO2V 100mW
300P - BGA P/TP 300P INFINEON TECHNOLOGIES
(ASIA PACIFIC) PTE LTD.
6 Q1186 TR, Bipolar EQBN0005301
UMT2222A NPN 6V 75V 40V 600mA 100mA 100~300
200mW UMT3 R/TP 3P ROHM Semiconductor
KOREA CORPORATION
- 244 -
6
L801,
L802,
L804,
L805,
L806
Inductor, Wire
Wound, chip
ELCP0014001
CIG21LR47MNE 0.47 uH, M, 2.0*1.25*1.0, R/TP,
0.0000047, 20%, 1.3A, 0.08 ohm, SHIELD,
2X1.25X1MM, NONE, R/TP, Inductor, Wire Wound,
Chip SAMSUNG ELECTRO-MECHANICS CO., LTD.
RC0201JR-0751KL 51KOHM 5% 1/20W 0603 R/TP -
YAGEO CORPORATION
6
X300,
X800
Crystal EXXY0018701
FC-135(12.5PF, +-20PPM) 32.768KHZ 20PPM
12.5PF 32*15 SMD R/TP SEIKO EPSON CORP
6
R1102,
R1103,
R510,
R511
ROHM.
MCR006YZPF1004 1MOHM 1% 1/20W 0603 R/TP -
ROHM Semiconductor KOREA CORPORATION
6 U801 IC, Charger EUSY0410801
RT9524 DFN, 10, R/TP, DFN Cal Test Mode Single
Charger IC for Micro USB, IC, ChargerIC, Charger
6
R631,
R632
Resistor, Chip EBC61856201
RC0201FR-07240RL 240OHM 1% 1/20W 0603 R/TP
- YAGEO CORPORATION
6 U350 IC, MCP, NAND EUSY0425901
H8BCS0QG0MMR-46M NAND/1G SDRAM/512M
0VTO0V 8.0x9.0x1.0 TR 130P NAND+DRAM BGA -
HYNIX SEMICONDUCTOR INC.
RC1005F4021CS 4.02KOHM 1% 1/16W 1005 R/TP -
6
C1209,
C1210,
C1211,
C227,
C835,
C836,
C842,
C890,
C934,
C935
Capacitor, Ceramic,
Chip
ECCH0007804
CL05A225MP5NSNC 2.2uF 20% 10V X5R -
6 C802
Capacitor, Ceramic,
Chip
ECCH0009514
MCH032A(AN)100DK 10pF 0.5PF 25V X7R -
55TO+125C 0603 R/TP - ROHM.
6
L800,
L803
Inductor, Wire
Wound, Chip
ELCP0013901
XPL2010-681MEC 680NH 20% - 2.1A 2.19 2.1
0.057OHM 152MHZ - SHIELD 2X2X1.2MM NONE
R/TP COILCRAFT INC.
ROHM.
- 245 -
6
L303,
L304
Inductor, Wire
Wound, Chip
ELCP0008007
MIPS2520D3R3M 3.3UH 30% - 1A 0.12OHM - -
SHIELD 2.5X2X1MM NONE R/TP FDK
CORPORATION.
6
C306,
C307
Capacitor, Ceramic,
Chip
ECCH0017501
CL10A226MQ8NRNE 22uF 20% 6.3V X5R -
ROHM.
6 Q301 FET EQFP0003601
NTJD4105CT1G P-CHANNEL MOSFET 20V +-12
660mA 0.63OHM 270mW SC70 R/TP 6P ON
SEMICONDUCTOR
6
C1101,
C1102,
C1103,
C1106,
C1121,
C1831,
C1923,
C891,
C975,
C978
Capacitor, Ceramic,
Chip
ECZH0001215
C1005X5R1A105KT000F 1uF 10% 10V X5R -
COOPERATION
6 C1132
Capacitor, Ceramic,
Chip
ECZH0003103
GRM36X7R104K10PT 100nF 10% 10V X7R -
6 U811 IC, MUIC EUSY0371201
MAX14526EEWP+TCC6 MAX14526EEWP+TCC6,
WLP, MUIC for 5Pin Micro USB WLP R/TP 20P
MAXIM INTEGRATED PRODUCTS INC.
ROHM.
6 FL800 Filter, EMI/Power SFEY0015301
NFM18PC104R1C3 ESD/EMI 0HZ 0.1uF 0H SMD
R/TP MURATA MANUFACTURING CO., LTD.
6 U721 IC, MCP, eMMC EUSY0431102
SDIN5C2-8G-974D FBGA, 166, ETC, 8GB eMMC
v4.41 / 12.0x16.0x1.2 / 169ball, ;, IC, MCP SANDISK
CORPORATION
6
L988,
L989
Chip
ELCH0001444
0402AF-101XJEW 100NH 5% - 900mA 0.16OHM
6
R1190,
R1191,
R896,
R897
PCB ASSY,
MAIN,
PAD OPEN
SAFO0000401 AX3100 ATL SV_SHIPBACK, MAIN, A, 0OHM DNI
MCR01MZP5F2001 2KOHM 1% 1/16W 1005 R/TP -
ROHM.
- 246 -
MCR01MZP5J474 470KOHM 5% 1/16W 1005 R/TP -
ROHM.
6
C1812,
C1815,
C1816,
C1817,
C1818,
C1822,
C209,
C230,
C231,
C249,
C924,
C927,
C937
Capacitor, Ceramic,
Chip
ECCH0000198
CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -
MECHANICS CO., LTD.
ROHM.
6
FB741,
FB743
CIM05J601NC 600 ohm 1.0X0.5X0.5 25% 0.6 ohm
MECHANICS CO., LTD.
6 CN801 Connector, I/O ENRY0011501
GU077-5P-SD-E1500 5, 0.65 mm, ETC, 0.64MM,
RECEPTACLE, DIP, R/TP, Reverse, Offset (1.50mm),
SUS plate LS Mtron Ltd.
6 U502 IC, Buffer EUSY0428301
CDC3S04 1.65~1.95 999 999 999W 999W 33~68 4
WCSP R/TP 20P Quad Sine-wave Clock Buffer
TEXAS INSTRUMENTS KOREA LTD, HONGKONG
BRANCH.
- ROHM.
MCR006YZPJ101 100OHM 5% 1/20W 0603 R/TP -
ROHM.
6 U800 IC, PMIC EAN62093401
TWL6030B107CMR 2.5 to 4.8V adj 1.7W BGA R/TP
187P - TEXAS INSTRUMENTS KOREA LTD,
HONGKONG BRANCH.
RC0201FR-074R7L 4.7OHM 1% 1/20W 0603 R/TP -
YAGEO CORPORATION
6 U701 IC, MCP, NAND EUSY0429001
K3PE4E400M-XGC1 4096MBIT 1.14VTO1.3V,
1.7VTO1.95V 12.0x12.0x0.71 TR 216P DRAM FBGA
4Gb LPDDR2 PoP 216ball for OMAP4 Series Chipset
(44nm) SAMSUNG ELECTRONIC CO., LTD
6 C986
Capacitor, Ceramic,
Chip
ECZH0001120
CC1005X7R1H392KT000F 3.9nF 10% 50V X7R -
COOPERATION
- 247 -
6 X500 Oscillator, TCXO EXST0002601
1XXB38400FAA 38.4 MHz, 1.5 PPM, 10 pF, SMD,
2.5*2.0*0.8, 38.4, 1.5PPM, 1.8V, 2.5, 2.0, 0.8, SMD,
R/TP DAISHINKU CORPORATION.
6
R1101,
R1126,
R1202,
R1271
ROHM.
6 U971
IC, Acceleration
Sensor
EUSY0410101
KXTF9 1.8V to 3.6V 400KHZ 12BIT 1SPS 1W LGA
R/TP 10P Accelerometer Sensor - LGA R/TP 10P -
KIONIX, INC.
6 U961 IC, Gyro Sensor EUSY0434601
MPU3050 1.8~3.6 Gyro Sensor - QFN R/TP 24P -
INVENSENSE
6 U851 IC, Analog Switch EAN61871401
FSUSB63 2.7~4.3V 400NSEC 45NSEC 0W MLP
R/TP 12P 1 FAIRCHILD SEMICONDUCTOR HONG
KONG LTD.
6
R1905,
R894,
R895,
R919,
R921
PCB ASSY,
MAIN,
PAD SHORT
SAFP0000401 LG-LU3000 LGTBK, MAIN, A,
6 C188
Capacitor, Ceramic,
Chip
ECZH0001108
C1005X7R1E682KT000F 6.8nF 10% 25V X7R -
COOPERATION
6 C961
Capacitor, Ceramic,
Chip
ECCH0000147
MCH155CN222KK 2.2nF 10% 50V X7R -55TO+125C
1005 R/TP - ROHM.
6
FB800,
FB803
BLM18KG221SN1D 220 ohm 1.6X0.8X0.8 25% 0.05
6
FB801,
FB802,
FB804,
FB805,
FB806
BLM15PD121SN1D 120 ohm 1.0X0.5X0.5 25% 0.09
6 L1903
Inductor, Wire
Wound, chip
ELCP0012801
MIPS2520D1R5 1.6 uH, N, 2.5*2.0*1.0, R/TP,
0.0000015, 30%, 1.2A, 0.1 OHM, 2.5X2X1MM, NONE,
R/TP, Inductor, Wire Wound, Chip FDK
CORPORATION.
7
D101,
D102,
D103,
D104
PRSB6.8C 4.7V 5.7 - - 10W - R/TP 2P 1 PROTEK
DEVICES INC.
SOCKET SMD R/TP 1M - LS Mtron Ltd.
- 248 -
7
C1101,
C1102,
C1103,
C1106,
C1121,
C1831,
C1923,
C891,
C975,
C978
Capacitor, Ceramic,
Chip
ECZH0001215
C1005X5R1A105KT000F 1uF 10% 10V X5R -
COOPERATION
7 C1132
Capacitor, Ceramic,
Chip
ECZH0003103
GRM36X7R104K10PT 100nF 10% 10V X7R -
7 U101
IC, Ambient Light
Sensor
EUSY0431901
APDS-9900 - - - - - - AVAGO TECHNOLOGIES
INTERNATIONAL SALES PTE. LIMITED
7
FB741,
FB743
CIM05J601NC 600 ohm 1.0X0.5X0.5 25% 0.6 ohm
MECHANICS CO., LTD.
7
L988,
L989
Chip
ELCH0001444
0402AF-101XJEW 100NH 5% - 900mA 0.16OHM
24-5804-010-000-829+ 10P 0.40MM STRAIGHT
14-5804-034-000-829+ 34, 0.4 mm, STRAIGHT, gold,
34, 0.40MM, STRAIGHT, MALE, SMD, 0.9T,
7 C153
Capacitor, Ceramic,
Chip
ECCH0000115
MCH155A220JK 22pF 5% 50V NP0 -55TO+125C
CORPORATION
14-5804-010-000-829+ 10P 0.40MM STRAIGHT
MALE SMD R/TP 900mM - KYOCERA ELCO KOREA
SALES CO., LTD.
7 J101 Jack, Phone EAG62831701
KJA-PH-3-0176 4P 4P ANGLE R/TP 3.5M BLACK 5P
6.5x12.6x4.0t, Short Detect, All DIP type KSD CO.,
LTD
7
CN103,
CN104
Contact MCIZ0008401
COMPLEX LG-C900 ATTDW ZZ:Without Color
PRESS, BeCu, , 3.0, 1.2, 1.5,
7 C106
Capacitor, Ceramic,
Chip
ECZH0001002
C1005CH1H0R5BT000F 0.5pF 0.1PF 50V NP0 -
COOPERATION
7
L147,
L158,
L168
Chip
ELCH0001404
TOKO, INC.
- 249 -
20279-001E-01 NONE STRAIGHT SOCKET SMD
R/TP AU 50OHM 400mDB I-PEX CO., LTD
7
LD101,
LD102,
LD103,
LD104
LED, Chip EDLH0015109
19-219UTD-S592/TR8 WHITE 2.7~3.1 25mA
112~285mcd x, y 95mW 1608 R/TP 2P -
EVERLIGHT ELECTRONICS CO., LTD.
7
L988,
L989
Chip
ELCH0001444
0402AF-101XJEW 100NH 5% - 900mA 0.16OHM
7
L101,
L102
Chip
ELCH0004717
1005GC2T82NJLF 82NH 5% - 150mA 2.1OHM
700MHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
7
R101,
R102,
R103,
R104
Resistor, Chip ERHZ0000415
MCR01MZP5J131 130OHM 5% 1/16W 1005 R/TP -
ROHM.
7
C116,
C117,
C121,
C132,
C151,
C163
Capacitor, Ceramic,
Chip
ECZH0000830
C1005C0G1H330JT000F 33pF 5% 50V NP0 -
COOPERATION
7
ZD1172,
ZD1181,
ZD1182,
ZD1224,
ZD1225
7 C172
Capacitor, Ceramic,
Chip
ECCH0000182
GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C
7
FB1174,
FB901,
FB913,
FB914,
FB941
BLM15AG121SN1D 120 ohm 1.0X0.5X0.5 25% 0.25
7 C110
Capacitor, Ceramic,
Chip
ECCH0000117
CL05C270JB5NNNC 27pF 5% 50V NP0 -55TO+125C
1005 R/TP 0.5 SAMSUNG ELECTRO-MECHANICS
CO., LTD.
14-5804-020-000-829+ 20P 0.40MM STRAIGHT
MALE SMD R/TP 900mM - KYOCERA ELCO KOREA
SALES CO., LTD.
14-5804-034-000-829+ 34, 0.4 mm, STRAIGHT, gold,
34, 0.40MM, STRAIGHT, MALE, SMD, 0.9T,
- 250 -
6
C103,
C105
Capacitor, Ceramic,
Chip
ECCH0002001
C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P -
FEMALE SMD R/TP 1M - LS Mtron Ltd.
6
R117,
R118
RC1005F270CS 27OHM 1% 1/16W 1005 R/TP -
6
ZD1172,
ZD1181,
ZD1182,
ZD1224,
ZD1225
EVL5M02200 5.5V 0% 480F 1.0*0.5*0.6 NONE SMD
R/TP AMOTECH CO., LTD.
MCR01MZP5J103 10KOHM 5% 1/16W 1005 R/TP -
ROHM.
MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP -
ROHM.
6 S101 Socket, Card ENSY0023802
SCHB1B0201 Micro-SD 8P ANGLE SMD R/TP -
ALPS ELECTRIC KOREA CO., LTD.
6 C1201
Capacitor, Ceramic,
Chip
ECCH0005604
GRM188R60J106M 10000000 pF, 6.3V, M, X5R, TC,
CO., LTD.
6
C1228,
C1235,
C1241,
C1252,
C192,
C243,
C248,
C901,
C902,
C903,
C904,
C905
Capacitor, Ceramic,
Chip
ECCH0017601
CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R -
6 U101
IC, DC, DC
Converter
EAN61850201
LM3559TLX 2.5 to 5.5V adj 0W MICRO SMD R/TP
16P - NATIONAL SEMICONDUCTOR ASIA PACIFIC
PTE. LTD.
6 C112
Capacitor, Ceramic,
Chip
ECCH0000110
MCH155A100D 10pF 0.5PF 50V NP0 -55TO+125C
CORPORATION
- 251 -
6
C1812,
C1815,
C1816,
C1817,
C1818,
C1822,
C209,
C230,
C231,
C249,
C924,
C927,
C937
Capacitor, Ceramic,
Chip
ECCH0000198
CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -
MECHANICS CO., LTD.
6 CN110 Contact MCIZ0008701
COMPLEX L-04C, ANTTWV ZZ:Without Color
PRESS, YCUT-FX, 4.2, 2.5, 1.5,
6 U102
IC, LDO Voltage
Regulator
EUSY0353801
RP103K331D 1.7V TO 5.25V 3.3V 400mW DFN R/TP
4P - RICOH COMPANY, LTD.
6 LD101 LED, Chip EDLM0009501
LXCL-PWF4 WHITE 2.8~4.6 150mA 28~59cd NA 1W
2016 R/TP 2P - LUMILEDS LIGHTING U.S., LLC
6 L101
Inductor, Wire
Wound, chip
ELCP0008008
MIPS2520D1R0M MIPS2520D1R0M, 1 uH, M,
2.0x2.5x1.0, R/TP, MLCI FDK CORPORATION.
6 D1175 Diode, TVS EDTY0009801
VSMF05LCC 5V 6V 12V 2A 25W SOT-963 R/TP 6P 5
PROTEK DEVICES INC.
6
C1101,
C1102,
C1103,
C1106,
C1121,
C1831,
C1923,
C891,
C975,
C978
Capacitor, Ceramic,
Chip
ECZH0001215
C1005X5R1A105KT000F 1uF 10% 10V X5R -
COOPERATION
6 J101 Card Socket ENSY0022101
GCA26C-6S-H15-E1500 GCA26C-6S-H15-E1500, 6,
ETC2.54 mm, H=1.5 LS Mtron Ltd.
EVLC14S02050 14V 0% 50F 1.0*0.5*0.6 NONE SMD
R/TP AMOTECH CO., LTD.
- 252 -
2 EAB010200 Earphone, Stereo EAB62410801
COSMO 3mW 16OHM 5DB 20HZTO20KHZ 1M
BLACK 4 POLE PLUG - CRESYN CO., LTD
2 EAC00
Rechargeable
Battery,
Lithium Ion
EAC61679801
FL-53HN_WWU_TOCAD PRISMATIC 3.7V 1.5AH
300mAH 45x53x5.3 54.5x47.8x5.7 BLACK Frame Type
534553, 1500mAh, Frame, WW, Up TOCAD
DONG-HWA CO., LTD
2 EAY060000 Adapters EAY62531701
SC0600LGA 100-240V 5.0V 1A 50-60Hz CB, CE
WALL 2P USB - SALCOMP OY
2 AFN053800
Manual Assembly,
Operation
AFN75494322
LGP920.ANEUMN ZZ:Without Color LGP920 manual
assy for NEU
3 MBM062602
Card, Quick
Reference
MBM63496413
NORWEGIAN_Simple Manual
3 MBM062601
Card, Quick
Reference
MBM63496412
FINNISH_Simple Manual
3 MBM062600
Card, Quick
Reference
MBM63496411
DANISH_Simple Manual
3 MBM062603
Card, Quick
Reference
MBM63496414
SWEDISH_Simple Manual
3 MFL053800
Manual,
Operation
MFL67303501
COMPLEX LGP920.ANEUML ZZ:Without Color Safety
Guide for P920 NEU
3 MBM087200
CARD,
WARRANTY
MCDF0001123 KP202 TNR BK, ZZ, PRINTING
12.3 Accessory
11

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