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Figure 1. Package
6A
36 V
SO-8 CMOS COMPATIBLE INPUT ON STATE OPEN LOAD DETECTION I OFF STATE OPEN LOAD DETECTION I SHORTED LOAD PROTECTION I UNDERVOLTAGE AND OVERVOLTAGE SHUTDOWN I PROTECTION AGAINST LOSS OF GROUND I VERY LOW STAND-BY CURRENT
I I I I
PENTAWATT
P2PAK
PPAK
REVERSE BATTERY PROTECTION (*) IN COMPLIANCE WITH THE 2002/95/EC EUROPEAN DIRECTIVE DESCRIPTION The VN750-E, VN750S-E, VN750PT-E, VN750B5-E are a monolithic device designed in STMicroelectronics VIPower M0-3 Technology, intended for driving any kind of load with one side connected to ground. Active VCC pin voltage clamp protects the device against low energy spikes (see ISO7637 transient compatibility table).
Active current limitation combined with thermal shutdown and automatic restart protect the device against overload. The device detects open load condition both is on and off state. Output shorted to VCC is detected in the off state. Device automatically turns off in case of ground pin disconnection.
VCC CLAMP
INPUT LOGIC
STATUS
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4 3 2 1
SO-8
PPAK / P2PAK
PENTAWATT
N.C. X X
Output X
VCC
(1) When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35m thick) connected to all VCC pins. Horizontal mounting and no artificial air flow. (2) When mounted on a standard single-sided FR-4 board with 2cm2 of Cu (at least 35m thick) connected to all VCC pins. Horizontal mounting and no artificial air flow. (3) When mounted on a standard single-sided FR-4 board with 0.5cm 2 of Cu (at least 35m thick). Horizontal mounting and no artificial air flow. (4) When mounted on a standard single-sided FR-4 board with 6cm2 of Cu (at least 35m thick). Horizontal mounting and no artificial air flow.
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Note: 1. To ensure long term reliability under heavy overload or short circuit conditions, protection and related diagnostic signals must be used together with a proper software strategy. If the device is subjected to abnormal conditions, this software must limit the duration and number of activation cycles.
VOL
VIN=0V
1.5
(#)
3.5
V s
tDOL(off)
1000
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VSTAT
VSTAT
tDOL(off)
tDOL(on)
tSDL
tSDL
Current Limitation
Overtemperature Undervoltage Overvoltage Output Voltage > VOL Output Current < IOL
dVOUT/dt(on)
dVOUT/dt(off)
10% t VINn
td(on)
td(off)
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IV C C C C C E
CONTENTS All functions of the device are performed as designed after exposure to disturbance. One or more functions of the device is not performed as designed after exposure to disturbance and cannot be returned to proper operation without replacing the device.
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NORMAL OPERATION INPUT LOAD VOLTAGE STATUS UNDERVOLTAGE VCC VUSD INPUT LOAD VOLTAGE STATUS undefined VUSDhyst
OVERVOLTAGE VCC<VOV VCC INPUT LOAD VOLTAGE STATUS OPEN LOAD with external pull-up INPUT LOAD VOLTAGE STATUS VOUT>VOL VOL VCC>VOV
TTSD TR
OVERTEMPERATURE
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+5V
Rprot STATUS
VCC
GND
NETWORK
AGAINST
Solution 1: Resistor in the ground line (RGND only). This can be used with any type of load. The following is an indication on how to dimension the RGND resistor. 1) RGND 600mV / (IS(on)max). 2) RGND (VCC) / (-IGND) where -IGND is the DC reverse ground pin current and can be found in the absolute maximum rating section of the devices datasheet. Power Dissipation in RGND (when VCC<0: during reverse battery situations) is: PD= (-VCC)2/RGND This resistor can be shared amongst several different HSD. Please note that the value of this resistor should be calculated with formula (1) where IS(on)max becomes the sum of the maximum on-state currents of the different devices. Please note that if the microprocessor ground is not common with the device ground then the RGND will produce a shift (IS(on)max * RGND) in the input thresholds and the status output values. This shift will vary depending on many devices are ON in the case of several high side drivers sharing the same RGND. If the calculated power dissipation leads to a large resistor or several devices have to share the same resistor then the ST suggests to utilize Solution 2 (see below). Solution 2: A diode (DGND) in the ground line. A resistor (RGND=1k) should be inserted in parallel to DGND if the device will be driving an inductive load. This small signal diode can be safely shared amongst several different HSD. Also in this case, the presence of
the ground network will produce a shift (j600mV) in the input threshold and the status output values if the microprocessor ground is not common with the device ground. This shift will not vary if more than one HSD shares the same diode/resistor network. Series resistor in INPUT and STATUS lines are also required to prevent that, during battery voltage transient, the current exceeds the Absolute Maximum Rating. Safest configuration for unused INPUT and STATUS pin is to leave them unconnected.
C I/Os PROTECTION:
If a ground protection network is used and negative transients are present on the VCC line, the control pins will be pulled negative. ST suggests to insert a resistor (Rprot) in line to prevent the C I/Os pins to latch-up. The value of these resistors is a compromise between the leakage current of C and the current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of C I/Os. -VCCpeak/Ilatchup Rprot (VOHC-VIH-VGND) / IIHmax Calculation example: For VCCpeak= - 100V and Ilatchup 20mA; VOHC 4.5V 5k Rprot 65k. Recommended Rprot value is 10k.
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V batt.
VPU
GROUND
10/31
Vin=3.25V
5
Tc (C)
Tc (C)
Iin=1mA
7.6 7.4 7.2 7 6.8 6.6 6.4 6.2 6 -50 -25 0 25 50 75 100 125 150 175
0.04
Vstat=5V
0.03
0.02
0.01
Tc (C)
Tc (C)
0.5
Istat=1mA
7.6
Istat=1.6mA
0.4 7.4 7.2 0.3 7 6.8 0.2 6.6 6.4 6.2 0 -50 -25 0 25 50 75 100 125 150 175 6 -50 -25 0 25 50 75 100 125 150 175
0.1
Tc (C)
Tc (C)
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120
100
Iout=2A
100
Tc= 150C
90 80
80
Tc= 125C
70 60 50
60
40
Tc= 25C
40
Tc= - 40C
30
35
40
Tc (C)
Vcc (V)
Vcc=13V Vin=5V
Vin=0V
4 3.5 3
100 80 60 40 20 0 -50 -25 0 25 50 75 100 125 150 175 1.5 1 -50 -25 0 25 50 75 100 125 150 175 2.5 2
Tc (C)
Tc (C)
2.8 1.8 2.6 1.6 2.4 2.2 2 -50 -25 0 25 50 75 100 125 150 175 1.4 1.2 1 -50 -25 0 25 50 75 100 125 150 175
Tc (C)
Tc (C)
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Vcc=13V Rl=6.5Ohm
Vcc=13V Rl=6.5Ohm
25
50
75
100
125
150
175
Tc (C)
Tc (C)
Vcc=13V
16 14 12 10 8 6 4 2 0 -50 -25 0 25 50 75 100 125 150 175
Tc (C)
Tc (C)
Tc (C)
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10
A B C
1 0.1 1 L(mH)
A = Single Pulse at TJstart=150C B= Repetitive pulse at TJstart=100C C= Repetitive Pulse at TJstart=125C Conditions: VCC=13.5V VIN, IL Demagnetization Demagnetization Demagnetization Values are generated with RL=0 In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves B and C.
10
100
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10
A B C
1 0.1 1 L(mH)
A = Single Pulse at TJstart=150C B= Repetitive pulse at TJstart=100C C= Repetitive Pulse at TJstart=125C Conditions: VCC=13.5V VIN, IL Demagnetization Demagnetization Demagnetization Values are generated with RL=0 In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves B and C.
10
100
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Layout condition of Rth and Zth measurements (PCB FR4 area= 58mm x 58mm, PCB thickness=2mm, Cu thickness=35m, Copper areas: 0.14cm2, 0.8cm2, 2cm2).
Figure 30. Rthj-amb Vs PCB copper area in open box free air condition
RTHj_amb (C/W)
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Layout condition of Rth and Zth measurements (PCB FR4 area= 60mm x 60mm, PCB thickness=2mm, Cu thickness=35m, Copper areas: 0.97cm2, 8cm2).
Figure 32. Rthj-amb Vs PCB copper area in open box free air condition
RTHj_amb (C/W)
55
Tj-Tamb=50C
50 45 40 35 30
0 2 4 6 8 10
PCB Cu heatsink area (cm^2)
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Layout condition of Rth and Zth measurements (PCB FR4 area= 60mm x 60mm, PCB thickness=2mm, Cu thickness=35m, Copper areas: 0.44cm2, 8cm2).
Figure 34. Rthj-amb Vs PCB copper area in open box free air condition
RTHj_amb (C/W)
90 80 70 60 50 40 30 20 10 0 0 2 4 6 8 10
PCB Cu heatsink area (cm^2)
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100
10
0.1
= R TH + Z THtp ( 1 ) = tp T
where
C1
C2
C3
C4
C5
C6
R1
R2
R3
R4
R5
R6
Pd
T_amb
Area/island (cm2) (C/W) (C/W) ( C/W) (C/W) (C/W) (C/W) (W.s/C) (W.s/C) (W.s/C) (W.s/C) (W.s/C) (W.s/C)
0.5 0.05 0.8 3.5 21 16 58 0.006 2.60E-03 0.0075 0.045 0.35 1.05
28
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ZT H (C/W) 1000
100
10
= R TH + Z THtp ( 1 ) = tp T
where
C1
C2
C3
C4
C5
C6
R1
R2
R3
R4
R5
R6
Pd
T_amb
Area/island (cm2) (C/W) (C/W) ( C/W) (C/W) (C/W) (C/W) (W.s/C) (W.s/C) (W.s/C) (W.s/C) (W.s/C) (W.s/C)
0.5 0.15 0.7 1.6 2 15 61 0.0006 0.0025 0.08 0.3 0.45 0.8
24
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100
0.5 cm2 6 cm2
10
= R TH + Z THtp ( 1 ) = tp T
where
C1
C2
C3
C4
C5
C6
R1
R2
R3
R4
R5
R6
Pd
T_amb
Area/island (cm2) (C/W) (C/W) ( C/W) (C/W) (C/W) (C/W) (W.s/C) (W.s/C) (W.s/C) (W.s/C) (W.s/C) (W.s/C)
22
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millimeters Min
4.30 2.40 0.03 0.80 0.45 1.17 8.95 8.00 10.40
Typ
Max
4.80 2.80 0.23 1.05 0.60 1.37 9.35
P010R
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millimeters Min
2.20 0.90 0.03 0.40 5.20 0.45 0.48 5.1 6.20 6.60
Typ
Max
2.40 1.10 0.23 0.60 5.40 0.60 0.60
P032T1
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Figure 46. SO-8 TAPE AND REEL SHIPMENT (suffix TR) REEL DIMENSIONS
Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) F G (+ 2 / -0) N (min) T (max)
2500 2500 330 1.5 13 20.2 12.4 60 18.4
TAPE DIMENSIONS
According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986
Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing
Start Top cover tape 500mm min Empty components pockets saled with cover tape. User direction of feed 500mm min No components Components No components
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REEL DIMENSIONS
Bulk Q.ty A (max) B (min) C ( 0.2) F G (+ 2 / -0) N (min) T (max)
1000 330 1.5 13 20.2 24.4 60 30.4
TAPE DIMENSIONS
According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986
Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing
Start Top cover tape 500mm min Empty components pockets saled with cover tape. User direction of feed 500mm min No components Components No components
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1.8
6.7
REEL DIMENSIONS
Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) F G (+ 2 / -0) N (min) T (max)
2500 2500 330 1.5 13 20.2 16.4 60 22.4
TAPE DIMENSIONS
According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986
Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing
Start Top cover tape 500mm min Empty components pockets saled with cover tape. User direction of feed 500mm min No components Components No components
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Revision
1 - First Issue.
Description of Changes
30/31
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners 2004 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com
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This datasheet has been download from: www.datasheetcatalog.com Datasheets for electronics components.