A low-power 1:2 demultiplexer (DEMUX) IC based on a resonant tunneling diode (RTD) is proposed. The unique negative differential resistance (NDR) characteristics arising from the quantum effect of the RTD are exploited.
A low-power 1:2 demultiplexer (DEMUX) IC based on a resonant tunneling diode (RTD) is proposed. The unique negative differential resistance (NDR) characteristics arising from the quantum effect of the RTD are exploited.
A low-power 1:2 demultiplexer (DEMUX) IC based on a resonant tunneling diode (RTD) is proposed. The unique negative differential resistance (NDR) characteristics arising from the quantum effect of the RTD are exploited.
Research Letters A Low-Power 40-Gb/s 1:2 Demultiplexer IC Based on a Resonant Tunneling Diode Jooseok Lee, Jongwon Lee, and Kyounghoon Yang, Senior Member, IEEE AbstractA low-power 1:2 demultiplexer (DEMUX) IC based on a resonant tunneling diode (RTD) is proposed. In order to achieve low-power consumption, the unique negative differential resistance (NDR) characteristics arising from the quantum effect of the RTD are exploited. The proposed DEMUX IC consists of an return to zero (RZ)-mode 1:2 demultiplexing block and an RZ-to- nonreturnto zero converting block, whichhave a compact structure based on the NDR-based circuit topologies. By implementing the proposed IC using an InP RTD/heterojunction bipolar transistor monolithic microwave integrated circuit technology, 1:2 demulti- plexing operation up to 40 Gb/s has been achieved with low-power consumption of 61 mW. In addition, the result is the rst demon- stration of a 40-Gb/s-level current-mode-logic-type DEMUX IC based on the NDR topology. Index TermsDemultiplexing, negative differential resistance (NDR), quantum effect, resonant tunneling diode (RTD). I. INTRODUCTION I N the near future, conventional semiconductor devices are expected to reach the saturation point of performance en- hancement by device scaling. Recently, nanoscale quantum- effect devices have gained attention in relation to efforts to overcome the physical limitations faced by the current semicon- ductor technology [1]. Among various nanoscale devices, reso- nant tunneling diodes (RTDs) are considered the most promis- ing devices. The unique nonlinear IV characteristic of RTDs, which exhibit the negative differential resistance (NDR), can be exploited to develop new functional digital logic circuits with a small device count [2]. Furthermore, the RTDs show high switching capability due to the fast quantum-effect tunneling phenomena and small parasitic capacitance [3]. Using these characteristics of RTDs, various RTD-based high-performance digital circuit topologies [4][8] have been reported to date. In our previous study, we carried out the fundamental develop- ment work for implementing high-speed digital communication ICs using the RTD-based IC topology. The key electronic com- ponents of the high-speed digital communication system, such Manuscript received May 26, 2011; accepted September 27, 2011. Date of publication November 15, 2011; date of current version May 9, 2012. The review of this paper was arranged by Associate Editor S. Assefa. The authors are with the Department of Electrical Engineering, Korea Ad- vanced Institute of Science and Technology, Daejeon 305-701, Korea (e-mail: leejooseok@kaist.ac.kr; temuchin80@kaist.ac.kr; khyang@ee.kaist.ac.kr). Color versions of one or more of the gures in this paper are available online at http://ieeexplore.ieee.org. Digital Object Identier 10.1109/TNANO.2011.2171988 Fig. 1. Block diagram of the proposed RTD-based 1:2 DEMUX IC. as a D-ip op [9], a multiplexer [10], and a static frequency divider [11], were developed with signicantly reduced circuit complexity at much lower power consumption. In the present paper, we propose a new RTD-based 1:2 demultiplexer (DE- MUX) IC, which is a crucial receiver component of high-speed digital communication systems. The proposed DEMUX IC has been implemented by using an InP RTD/heterojunction bipo- lar transistor (HBT) monolithic microwave integrated circuit (MMIC) technology, and performance up to 40 Gb/s has been measured by on-wafer high-speed test setups. II. CIRCUIT TOPOLOGY Fig. 1 shows a block diagram of the proposed RTD-based 1:2 DEMUX IC. The DEMUX IC is basically composed of a 1:2 return to zero (RZ)-mode demultiplexing block and an RZ-to-nonreturn to zero (NRZ) converting block. The 1:2 RZ- mode demultiplexing block consists of two current-mode logic monostable to bistable logic elements (CML-MOBILEs) and two RZ-to-NRZ converting blocks of SET/RESET latches. As shown in Fig. 2, each basic building block has a compact circuit structure by exploiting the high circuit functionality based on the NDR-based topology. The detailed operation principles of each building block have been previously reported [9], [12]. Fig. 3 shows the timing diagramof the proposed 1:2 DEMUX IC. The operation principle of the RTD-based 1:2 DEMUX IC is as follows. In the 1:2 DEMUX IC, the CML-MOBILEs, 1536-125X/$26.00 2011 IEEE 432 IEEE TRANSACTIONS ON NANOTECHNOLOGY, VOL. 11, NO. 3, MAY 2012 Fig. 2. Circuit schematics of the basic building blocks. (a) CML MOBILE RZ-mode D-ip op and (b) SET/RESET latch. Fig. 3. Timing diagram of the proposed RTD-based 1:2 DEMUX IC (dotted arrows represent the edge-triggering operations). which are driven by two clock signals (Clock and Clock) with a phase difference of 180
, generate RZ-mode demultiplexed
data streams (RZ A and RZ B ) from the input data stream of D in . The demultiplexed RZ-mode data streams are then converted to NRZ-mode data streams by the SET/RESET latch circuit. Consequently, the nal output data signals (OUT A and OUT B ) are demultiplexed NRZ data with a half bitrate of the input NRZ data bit stream. The major differences in the circuit topology of the RTD- based DEMUX IC from the conventional transistor-based DE- MUX IC can be described as follows. The conventional DE- MUX IC topology requires two master/slave D-latch circuits at each data path to generate the edge-triggered and latched data [13], [14]. Furthermore, since the conventional D-latch circuit has positive feedback path for holding operation, the self-loading effect of the D-latch circuit is relatively large. On the contrary, the proposed RTD-based DEMUX IC needs only one CML-MOBILE with the self-latching chracteristic for both the edge-triggering and latching operation at each data path. By using the compact CML-MOBILE toplogy with self-latching characterstics, the circuit complexity is signicantly reduced, as shown in Table I. The device count in the RTD-based 1:2 DEMUX core IC is reduced to be less than 60% of that in the conventional latch-based DEMUX core IC topology [13], [14]. In addition, there is no feedback path, the self-loading effect is eliminated. Therefore, the high-speed opertaion can be achieved with low tail current and reduced device count. TABLE I COMPARISON OF DEVICE COUNT BETWEEN THE RTD-BASED 1:2 DEMUX AND THE CONVENTIONAL LATCH-BASED 1:2 DEMUX CORE ICS Fig. 4. Chip microphotograph of the fabricated RTD-based 1:2 DEMUX IC. III. FABRICATION TECHNOLOGY The RTD-based DEMUX IC has been fabricated by using an InP RTD/HBTMMICtechnology based on a stacked RTD/HBT epitaxial structure. The detailed nanoscale quantum well and stacked layer structures of RTD/HBT have been previously re- ported [10]. The fabricated 2 2 m 2 RTDs have a peak voltage (V P ) of 0.3 V, a peak current density (J P ) of 60 kA/cm 2 , and a peak-to-current ratio (PVCR) of 13.5 at room temperature. The fabricated 1.5 4.0 m 2 HBT shows a maximum current gain of 50 and maximum f T and f max of 100 and 100 GHz, respec- tively. A chip microphotograph of the implemented RTD-based 1:2 DEMUX IC is shown in Fig. 4. The chip area is 1.5 2.0 mm 2 , including the pads for probing. This chip area is ex- pected to be further reduced by using an improved scale-down device technology and layout optimization. IV. MEASUREMENT RESULTS AND DISCUSSION The performances of the RTD-based DEMUX ICs have been characterized with an on-wafer microwave measurement setup. In order to conrm the operational performances of the fabri- cated RTD-based 1:2 DEMUX IC, time-domain measurements were rst performed at 20 Gb/s. The NRZ input data signal was generated by using two pulse pattern generators (Anritsu MP1763B) and a commercial multiplexing unit (SHF 4005). A signal synthesizer (Anritsu MG3694A), RF splitter, and ad- justable phase shifters were used to obtain the clock signals (Clock and Clock). The voltage swings for the input data and the clock signal are 0.6 and 0.8 V P P , respectively. The output waveforms of the DEMUXICwere observed by a 50-GHz band- width digital sampling oscilloscope (Agilent 83484A). Fig. 5 shows the test input data pattern (D in = 1110110011011101) at IEEE TRANSACTIONS ON NANOTECHNOLOGY, VOL. 11, NO. 3, MAY 2012 433 Fig. 5. Input and corresponding output waveforms of the RTD-based 1:2 DEMUX IC at 20 Gb/s operation (vertical scale: 100 mV/div; horizontal scale: 200 ps/div). Fig. 6. Input and corresponding output waveforms of the RTD-based DEMUX ICat 40 Gb/s operation (vertical scale: 100 mV/div; horizontal scale: 100 ps/div). 20 Gb/s and the corresponding demultiplexed output patterns at 10 Gb/s. In order to characterize the demultiplexing operation at higher speed, the time-domain measurement for the 1:2 RTD-based DEMUX IC was conducted up to 40 Gb/s. Fig. 6 shows the test input data patterns (D in = 1010010011110001) at 40 Gb/s and the corresponding output patterns at 20 Gb/s. The correct output data patterns (OUT A =11001100 and OUT B =00101101) have been obtained from the RTD-based DEMUX IC. Fig. 7 shows the measured eye diagrams for the outputs of the fabricated IC at an operation speed of 40 Gb/s for input data with a word length of 2 31 1 pseudorandom bit stream. The obtained eye opening of the fabricated IC was 120 mV. The measured total power consumption of the fabricated DEMUX IC including the output buffer is 61 mW, where the 1:2 RZ-mode demultiplexing block consumes 16 mW and the RZ-to-NRZ converter block consumes 20 mW at a single supply voltage of 2.5 V. The obtained power consumption of 61 mW at an operation speed of 40 Gb/s is 60% of that in the CMOS-based conventional 40- Gb/s-level 1:2 DEMUX [13]. While the power consumption of the CMOS-based 1:2 DE- MUX was obtained by using a deep-submicron device technol- ogy, that of the RTD-based 1:2 DEMUX has been obtained by using a relatively larger device size on a 1.5 m scale in this Fig. 7. Measured eye diagram for the outputs of the RTD-based DEMUX IC at an operation speed of 40 Gb/s (vertical scale: 100 mV/div; horizontal scale: 20 ps/div). (a) OUT A . (b) OUT B . paper. The high-speed and low-power performance characteris- tics of the RTD-based DEMUX IC are expected to be further improved compared to current state-of-the-art CMOS-based 1:2 DEMUX results [15], [16] by using an improved scaled-down device technology. V. CONCLUSION An RTD-based 1:2 DEMUX IC has been proposed and demonstrated. The unique NDR characteristics of the RTD have been utilized in the proposed compact low-power DEMUX IC topology. The device count used in the RTD-based DEMUX IC is 60% of that in the conventional CML-type latch-based DE- MUX IC. The fabricated DEMUX IC has the low-power con- sumption of 61 mWat an operation speed of 40 Gb/s. According to the results obtained in this paper, the quantum-effect RTD- based IC technology is one of the most mature nanoelectron- ics technologies suitable for the high-speed, high-functionality applications. REFERENCES [1] International Technology Roadmap for Semiconductors. (2009). [Online]. Available: http://www.itrs.net 2009, 2012. [2] P. Mazumder, S. Kulkarni, M. Bhattacharya, J. P. Sun, and G. I. Haddad, Digital circuit applications of resonant tunneling devices, in Proc. IEEE, Apr. 1998, vol. 86, no. 4, pp. 664686. [3] N. Shimizu, T. Nagatsuma, T. Waho, M. Shinagawa, M. Yaita, and M. Ya- mamoto, InGaAs/AlAs resonant tunneling diodes with switching time of 1.5 ps, Electron. Lett., vol. 31, no. 19, pp. 16951697, Sep. 1995. [4] C. Pacha, U. Auer, C. Burwick, P. Glosekotter, A. Brennemann, W. Prost, F. J. Tegude, and K. F. Goser, Threshold logic circuit design of parallel adders using resonant tunneling devices, IEEE Trans. VLSI Syst., vol. 8, no. 5, pp. 558572, Oct. 2000. [5] C. H. Lin, K. Yang, M. Bhattacharya, X. Wang, X. Zhang, J. R. East, P. Mazumder, and G. I. Haddad, Monolithically integrated RTD/HBT minority logic gate using an RTD/HBT heterostructure, in Proc. IEEE Indium Phosphide Relat. Mater. Conf., May 1998, pp. 419422. [6] Q. Liu and A. C. Seabaugh, Design approach using tunnel diodes for lowering power in differential ampliers, IEEE Trans. Circuit Syst. II, vol. 52, no. 9, pp. 572575, Sep. 2005. [7] Y. Zheng and C. Huang, Complete logic functionality of recongurable RTD circuit elements, IEEE Trans. Nanotech, vol. 8, no. 5, pp. 631642, Sep. 2009. [8] W. Prost, S. O. Kim, P. Glosekotter, C. Pacha, H. van Husen, T. Reiman, K. F. Goser, and F. J. Tegude, Experimental threshold logic implementations based on resonant tunnelling diodes, in Proc. Int. Conf. Electron. Circuits Syst., 2002, pp. 669672. [9] T. Kim, Y. Jeong, and K. Yang, Low-power high-speed performance of current-mode logic D ip-op topology using negative-differential- resistance devices, Circuits, Devices Syst., IET, vol. 2, no. 2, pp. 281 287, Apr. 2008. [10] S. Choi, Y. Jeong, J. Lee, and K. Yang, A novel high-speed multiplexing IC based on resonant tunneling diodes, IEEE Trans. Nanotech., vol. 8, no. 4, pp. 482486, Jul. 2009. [11] T. Kim, Y. Jeong, and K. Yang, Low-power static frequency divider using an inp-based monolithic RTD/HBT technology, Electron. Lett., vol. 42, no. 1, pp. 3637, Jan. 2006. 434 IEEE TRANSACTIONS ON NANOTECHNOLOGY, VOL. 11, NO. 3, MAY 2012 [12] S. Choi, B. Lee, T. Kim, and K. Yang, CML-type monostable bistable logic element (MOBILE) using an InP-based monolithic RTD/HBT tech- nology, Electron. Lett., vol. 40, no. 13, pp. 792793, Jun. 2004. [13] D. Kehrer, H.-D. Wohlmuth, H. Knapp, M. Wurzer, and A. L. Scholtz, 40- Gb/s 2:1 multiplexer and 1:2 demultiplexer in 120-nm standard CMOS, IEEE J. Solid-State Circuits, vol. 38, no. 11, pp. 18301837, Nov. 2003. [14] J.-C. Chien and L.-H. Lu, A 20-Gb/s 1:2 demultiplexer with capacitive- splitting current-mode-logic latches, IEEE Tran. Micro Theory Tech., vol. 55, no. 8, pp. 16241632, Aug. 2007. [15] K. Kanada, D. Yamazaki, T. Yamamoto, M. Horinaka, J. Ogawa, H. Tamura, and H. Onodera, 40Gb/s 4:1 MUX/1:4 DEMUX in 90 nm standard CMOS, IEEE Int. Solid-State Circuits Conf. Tech. Dig., vol. 1, pp. 152153, Feb. 2005. [16] C.-F. Liao and S.-I. Liu, 40 Gb/s transimpedance-AGC amplier and CDR circuit for broadband data receivers in 90 nm CMOS, IEEE J. Solid-State Circuits, vol. 43, no. 3, pp. 642655, Mar. 2008.