wtf06 525v634563475346

Printed Friday, October 27, 2006 4:25 pm
Working DraftT11
INCITS Project 1626-DT
Technical Report
Revision 03
Friday, October 27, 2006
Information technology -
Fibre Channel Signal Modeling -2 (FCSM -2)
This is a draft technical report of the International Committee for Information Technology Standards
(INCITS). As such this is not a completed technical report. The T11 Technical Committee may modify this
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T11.2 FCSM-2 Ad hoc chair Technical Editor
Dean Wallace Bill Ham
Q Logic Corporation HP Corporation
26600 Laguna Hills Drive 92 Wildwood Road
Aliso Viejo, CA 92626 Andover, MA 01810
USA USA

Telephone: 949 389 6480 978 828-9102
Facsimile: 949 389 6125 978 470-0321
Email: dean.wallace@qlogic.com bill_ham@ix.netcom.com
Reference number
INCITS TR-xx: 200x
T11/1626-DT revision 03
ii Working Draft Fibre Channel Signal Modeling - 2
POINTS OF CONTACT:
T11.2 Chair T11.2 Vice-Chair
Tom Palkert Dean Wallace
Xilinx Semiconductorl Q Logic Corporation
asdfasdfasdf 26600 Laguna Hills Drive
asdfasdfasdf Aliso Viejo, CA 92626
Tel: asdfasdfasdf Tel: 949 389 6480
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Working Draft Fibre Channel Signal Modeling - 2
INCITS Technical Report
Information Technology -
Fibre Channel Signal Modeling - 2 (FCSM - 2)
Secretariat
Information Technology Industry Council
Approved mm.dd.yy
International Committee for Information Technology Standards
ABSTRACT
This technical report is intended to establish a common methodology so that signals in FC systems may be
modeled and simulated accurately and consistently. It establishes the requirements for the exchange of
performance information between components suppliers and system simulators. It defines the acceptable
methods for extracting the electrical and performance attributes of the constituent parts of the FC copper
and optical interface. It establishes a common methodology for simulating the FC physical environment.
It shall be used in conjunction with the requirements within the following documents: FC Physical Interface
(FC-PI; T11/1235-D), FC Physical Interface-2 (FC-PI-2; T11/1506-D), FC 10 Gigabit (10GFC; T11/1413-D),
FC Physical Interface -3 (FC-PI-3, T11/1625-D), and FC Physical Interface-4 (FC-PI-4, T11/1647-D).
INCITS TR-xx: 200x
iv Working Draft Fibre Channel Signal Modeling - 2
Published by
American National Standards Institute
11 W. 42nd Street, New York, New York 10036
Copyright 200x by Information Technology Industry Council (ITI)
All rights reserved.
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without prior written permission of the publisher.
Printed in the United States of America
INCITS
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As a by-product of the standards development process and the resources of
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When the draft Technical Report is completed, the Technical Committee approval
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Patent
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CAUTION: The developers of this Technical Report have requested that holders
of patents that may be required for the implementation of the standard, disclose
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Working Draft Fibre Channel Signal Modeling - 2 v
Table of Contents
1 Scope ....................................................................................................................................................... 1
2 References ............................................................................................................................................... 2
2.1 General ........................................................................................................................................... 2
2.2 Approved references ....................................................................................................................... 2
2.3 References under development ...................................................................................................... 2
2.4 Informative references .................................................................................................................... 3
2.4.1 Electrical ................................................................................................................................ 3
2.4.2 Optical ................................................................................................................................... 3
2.5 Resources bibliography ................................................................................................................... 3
3 Definitions, acronyms, symbols, abbreviations, keywords, and conventions ........................................... 5
3.1 Definitions ....................................................................................................................................... 5
3.2 Symbols, abbreviations, and acronyms ........................................................................................ 14
3.2.1 Symbols .............................................................................................................................. 14
3.2.2 Acronyms and other abbreviations ...................................................................................... 16
3.3 Keywords ...................................................................................................................................... 17
3.4 Conventions .................................................................................................................................. 17
4 General ................................................................................................................................................... 19
4.1 Overview ....................................................................................................................................... 19
4.2 Signal path architectures for modeling .......................................................................................... 19
4.2.1 Transmitter-receiver connection .......................................................................................... 19
4.2.2 Electrical transmitter-receiver connection ........................................................................... 19
4.2.3 Optical transmitter-receiver connection ............................................................................... 20
4.3 Relationship between FCSM-2 and bit errors ............................................................................... 21
4.4 FCSM and scaling ......................................................................................................................... 21
4.5 Range of validity of models and simulations ................................................................................. 22
4.6 Signal modeling purposes ............................................................................................................. 22
4.6.1 Overview ............................................................................................................................. 22
4.6.2 Physical components and signals ....................................................................................... 23
4.6.2.1 Relationship between physical and modeling terminology ........................................ 23
4.6.2.2 Elemental components .............................................................................................. 23
4.6.2.3 Composite components ............................................................................................. 24
4.6.2.4 Systems ..................................................................................................................... 24
4.6.2.5 Instrumented and non-instrumented systems ............................................................ 24
4.6.2.6 Signals and measurement points .............................................................................. 25
4.6.2.7 Modeling run length dependent transmitter signals ................................................... 27
4.6.2.8 Interactions between signals on different signal lines ................................................ 28
4.6.3 Data patterns / launched signals ......................................................................................... 28
4.6.4 Viewpoints ........................................................................................................................... 28
4.7 Application to measurement .......................................................................................................... 31
4.8 Relationship between elemental component models, composite component models, model-ele-
ments, and simulation ................................................................................................................................ 31
4.9 Specification of the simulation and the simulation environment .................................................... 33
4.10 Specification of signals at interoperability points ......................................................................... 33
4.11 Transmitter signals, interconnect, and receivers that contain compensation properties (equaliza-
tion) ............................................................................................................................................................ 33
4.11.1 Compensation ................................................................................................................... 33
4.11.2 Transmitter compensation ................................................................................................. 34
4.11.3 Interconnect compensation ............................................................................................... 35
4.11.4 Receiver compensation ..................................................................................................... 35
4.12 Approaches to creating component models ................................................................................ 36
Working Draft Fibre Channel Signal Modeling - 2 vi
Table of Contents
4.12.1 Create the model from samples of physical components ................................................. 36
4.12.1.1 Behavioral extraction from a linear component ....................................................... 36
4.12.1.2 Fitted circuit parameters .......................................................................................... 36
4.12.1.3 SPICE device model ................................................................................................ 37
4.12.2 Creating the model from design information ..................................................................... 37
4.13 Practical considerations for creating models ............................................................................... 37
4.14 Relationship between constituents of the modeling environment ............................................... 38
4.15 Relationship between signal specifications in standards and modeling ...................................... 39
4.16 Accuracy and model validation considerations ........................................................................... 40
4.17 Component model validation/correlation methods ...................................................................... 41
4.17.1 Overview ........................................................................................................................... 41
4.17.2 Range of validity ................................................................................................................ 41
4.17.3 Method 1 (simultaneous creation and validation) .............................................................. 42
4.17.4 Method 2 (validation of extracted parameters for elemental components) ....................... 42
4.18 Signal timing reference in simulations ......................................................................................... 42
4.19 Tools ........................................................................................................................................... 42
4.19.1 Overview ........................................................................................................................... 42
4.19.2 Simulation tools ................................................................................................................. 42
4.19.3 Parameter extraction tools ................................................................................................ 43
4.19.4 Model creation tools .......................................................................................................... 44
5 Results from a practical experiment to compare signal simulations using a complex component model ..
45
5.1 Description of the experiment ....................................................................................................... 45
5.2 Description of the complex model ................................................................................................. 45
5.3 Transportable specifications of the complex component model itself ........................................... 46
5.3.1 Overall description of the complex model ........................................................................... 46
5.3.2 Input signal source .............................................................................................................. 46
5.3.3 FIR specification .................................................................................................................. 47
5.3.4 Waveshaping / risetime ....................................................................................................... 47
5.3.5 Lumped passive elements .................................................................................................. 47
5.3.6 S parameter files ................................................................................................................. 47
5.4 Final transmitter device specification ............................................................................................ 47
5.5 Quantitative results ....................................................................................................................... 48
5.6 Some additional requirements and actions to create transportables simulations ......................... 49
6 Model-element descriptions .................................................................................................................... 51
6.1 Overview ....................................................................................................................................... 51
6.2 Circuit description .......................................................................................................................... 51
6.3 Behavioral description - S- parameters ......................................................................................... 51
6.3.1 Overview ............................................................................................................................. 51
6.3.2 File specification requirements ............................................................................................ 53
6.3.3 Self consistency tests .......................................................................................................... 53
6.4 Behavioral description - RLGC matrix (Maxwell matrix) ................................................................ 53
6.4.1 Overview ............................................................................................................................. 53
6.4.2 RLGC matrices for general construction ............................................................................. 53
6.4.3 An 11 conductor example ................................................................................................... 55
6.5 Behavioral description - mathematical function ............................................................................. 60
6.6 Behavioral description - IBIS ......................................................................................................... 60
7 Transportable models ............................................................................................................................. 62
7.1 General requirements ................................................................................................................... 62
7.1.1 Overview ............................................................................................................................. 62
Working Draft Fibre Channel Signal Modeling - 2 vii
Table of Contents
7.1.2 Documentation .................................................................................................................... 62
7.1.3 Model Name ........................................................................................................................ 63
7.1.4 Model class ......................................................................................................................... 63
7.1.5 Port identification ................................................................................................................. 63
7.1.6 Model boundary .................................................................................................................. 64
7.1.7 Model limitations and dependencies ................................................................................... 66
7.1.8 Model creation methodology ............................................................................................... 66
7.1.8.1 Overview .................................................................................................................... 66
7.1.8.2 Model creation stimuli ................................................................................................ 66
7.1.8.3 Amplitude and timing ................................................................................................. 66
7.1.8.4 Frequency range .......................................................................................................66
7.1.8.5 Rise time .................................................................................................................... 66
7.1.9 Model validation .................................................................................................................. 69
7.1.9.1 Overview .................................................................................................................... 69
7.1.9.2 Accuracy requirements .............................................................................................. 69
7.1.9.3 Model validation stimuli .............................................................................................. 69
7.1.9.4 Amplitude and timing ................................................................................................. 69
7.1.9.5 Frequency range .......................................................................................................69
7.1.9.6 Rise time .................................................................................................................... 69
7.2 Specific requirements for S-Parameter models ............................................................................ 69
7.2.1 Overview ............................................................................................................................. 69
7.2.2 General requirements for transportable S4P models .......................................................... 70
7.2.2.1 Overview .................................................................................................................... 70
7.2.2.2 Detailed description of the physical entity described by the model ........................... 70
7.2.2.3 Frequency range .......................................................................................................70
7.2.2.4 Starting frequency value and frequency step size ..................................................... 70
7.2.2.5 Extrapolation and interpolation for frequency values ................................................. 71
7.2.2.6 Changes to the data content of S-parameter files ..................................................... 71
7.2.2.7 File format and contents ............................................................................................ 71
7.2.2.8 Tests for self consistency .......................................................................................... 71
7.2.2.9 Correction of defective files ....................................................................................... 71
7.3 Component models examples ....................................................................................................... 71
7.3.1 Overview ............................................................................................................................. 71
7.3.2 Electrical cable assembly - composite component ............................................................. 72
7.3.2.1 Overview .................................................................................................................... 72
7.3.2.2 Cable assembly model boundary .............................................................................. 72
7.3.2.3 Cable assembly model class ..................................................................................... 72
7.3.2.4 Relative position of all the elemental components ..................................................... 72
7.3.2.5 Specification of each elemental component model ................................................... 72
7.3.2.5.1 Mated connector pair ........................................................................................ 72
7.3.2.5.1.1 Elemental component model boundary .................................................. 72
7.3.2.5.1.2 Model-elements in the elemental component ......................................... 72
7.3.2.5.1.2.1 Model element types ...................................................................... 72
7.3.2.5.1.2.2 Model-element creation methodology ............................................ 72
7.3.2.5.1.2.3 Model-element detailed description ............................................... 72
7.3.2.5.2 Transition region ............................................................................................... 73
7.3.2.5.3 Bulk cable ......................................................................................................... 73
Working Draft Fibre Channel Signal Modeling - 2 viii
Table of Contents
7.3.2.5.4 Composite component model validation methodology ..................................... 73
7.3.3 Host bus adapter board - composite model ........................................................................ 74
7.3.3.1 Overview .................................................................................................................... 74
7.3.3.2 Host bus adapter model boundary ............................................................................. 74
7.3.3.3 Host bus adapter model class ................................................................................... 74
7.3.3.4 Relative position of all the elemental components ..................................................... 74
7.3.3.5 Specification of each elemental component model ................................................... 74
7.3.3.5.1 Electrical transceiver ........................................................................................ 74
7.3.3.5.1.1 Elemental component model boundary - electrical transceiver .............. 74
7.3.3.5.1.2 Model-elements in the elemental component - electrical transceiver ..... 74
7.3.3.5.1.2.2 Model-element creation methodology - electrical transceiver ........ 74
7.3.3.5.1.2.3 Model-element detailed description - electrical transceiver ........... 74
7.3.3.5.2 PCB .................................................................................................................. 74
7.3.3.5.2.1 Relative position of model-elements in elemental component - PCB ..... 74
7.3.3.5.2.2 Chip pad / connector pad ........................................................................ 75
7.3.3.5.2.2.1 Model element boundary - chip pad / connector pad ..................... 75
7.3.3.5.2.2.2 Model-element class - chip pad / connector pad ........................... 75
7.3.3.5.2.2.3 Model-element creation methodology - chip pad / connector pad . 75
7.3.3.5.2.2.4 Model-element detailed description - chip pad / connector pad .... 75
7.3.3.5.2.3 PCB trace ................................................................................................ 75
7.3.3.5.2.3.1 Model element boundary - PCB trace ............................................ 75
7.3.3.5.2.3.2 Model-element class - PCB trace .................................................. 75
7.3.3.5.2.3.3 Model-element creation methodology - PCB trace ........................ 75
7.3.3.5.2.3.4 Model-element detailed description - PCB trace ........................... 75
7.3.3.5.2.4 Chip capacitor ......................................................................................... 75
7.3.3.5.2.4.1 Model element boundary -chip capacitor ....................................... 75
7.3.3.5.2.4.2 Model-element class - chip capacitor ............................................ 75
7.3.3.5.2.4.3 Model-element creation methodology - chip capacitor .................. 75
7.3.3.5.2.4.4 Model-element detailed description - chip capacitor ...................... 75
Annex A - Model database format ............................................................................................................ 77
A.1 Overview ............................................................................................................................................. 77
A.2 Database format .................................................................................................................................. 77
Working Draft Fibre Channel Signal Modeling - 2 ix
List of Figures
Figure 1 - Architecture for modeling a minimal electrical transceiver path .................................19
Figure 2 - Architecture for modeling an optical transmitter-receiver connection ........................20
Figure 3 - Example of amplitude scaling ......................................................................................22
Figure 4 - Tx interoperability points (examples) ..........................................................................26
Figure 5 - Rx interoperability points (examples) ..........................................................................27
Figure 6 - FCSM applicability to a simple link ............................................................................29
Figure 7 - Modeling architecture for launching a specific signal at a connector ..........................30
Figure 8 - Measurement set up for evaluating transmitters ..........................................................35
Figure 9 - Measurement set up for evaluating receivers ...............................................................36
Figure 10 - Modeling environment ...............................................................................................38
Figure 11 - Relationship between FC-PI and modeling rise times ...............................................40
Figure 12 - Transmitter device model (differential) .....................................................................45
Figure 13 - Final version of the transmitter device model ............................................................48
Figure 14 - Comparison of results at point B for various simulations ..........................................49
Figure 15 - Basic "Black Box" with four single ended ports or two differential ports .................52
Figure 16 - Single ended S-parameter matrix form ......................................................................52
Figure 17 - A single conductor example .......................................................................................53
Figure 18 - A two conductor example ..........................................................................................54
Figure 19 - A three region example ..............................................................................................55
Figure 20 - General configuration for an 11 conductor PCB ........................................................56
Figure 21 - Maxwell matrices for the 11 conductor example .......................................................56
Figure 22 - Different schemes for identifying model element ports .............................................64
Figure 23 - Example of a boundary definition ..............................................................................65
Working Draft Fibre Channel Signal Modeling - 2 x
List of Tables
Table 1 - Parameter class examples for validation ........................................................................41
Table 2 - Numerical properties for the 11 conductor example ......................................................55
1 Scope
This technical report is the second in a series aimed at establishing a common methodology for FC system
signal modeling. This technical report supercedes FCSM and contains all the information in FCSM
deemed desirable to carry forward with appropriate updates.
Using the methodology described in this document, signals in FC systems may be modeled and simulated
accurately and consistently. These methodologies may also apply to other transports that use high speed
serial communication schemes. This technical report establishes the framework for the exchange of signal
performance information between component suppliers, system integrators, and those carrying-out
simulations. This report defines the acceptable methods for extracting the electrical and signal
performance attributes of the constituent parts of an FC transmitter - receiver connection within a link. It
shall be used in conjunction with the requirements within the following documents: FC Physical Interface
(FC-PI; T11/1235-D), FC Physical Interface-2 (FC-PI-2; T11/1506-D), FC 10 Gigabit (10GFC; T11/1413-D),
FC Physical Interface -3 (FC-PI-3, T11/1625-D), and FC Physical Interface-4 (FC-PI-4, T11/1647-D).

The objectives of the FC Signal Modeling (FCSM-n) technical report series are to:
a) define a set of elemental components for FCSM purposes *
b) define a set of composite components for FCSM purposes *
c) define the physical interface boundaries of the component sets *
d) define the modeling parameters of the component sets *
e) define a methodology for integrating the component models into a system model *
f) define a system simulation strategy
g) define requirements for transportable S-parameters files *
h) define the framework for assignment of simulation accuracy components *
i) define the major points of interest for signal modeling *
j) define the classes of signal modeling purposes and uses *
k) define the properties of signals used for specification compliance at FC interoperability points
l) define the general use of scaling in modeling *
m) define general methods for creating models *
n) define the general validation and correlation methods *
o) define the relationship between constituents of the modeling environment *
p) define the methodology for translating between physical measurements and necessary modeling
parameters
q) define a method for the exchange of information between component suppliers and system
integrators
Items with a "*" are directly addressed in this document. Other items are intended to be addressed in
future documents.
2 Working Draft Fibre Channel Signal Modeling - 2
2 References
2.1 General
The documents named in this section contain provisions that, through reference in this text, constitute
provisions of this document. At the time of publication, the editions indicated were valid. Parties using this
document are encouraged to investigate the possibility of applying the most recent editions of the
standards indicated below. The term approved means that the responsible standards body has approved
the document for publication.
Approved ANSI standards;
Approved and draft regional and international standards (ISO, IEC, CEN/CENELEC and ITU); and
Approved foreign standards (including BIS, JIS and DIN).
The URLs cited in this clause were valid at the time of publication.
2.2 Approved references
EIA-656-A-1999, I/O Buffer Information Specification
ANSI/INCITS 339-2000, Fibre Channel - Very Long Length Optical Interface, (SM-LL-V)
INCITS TR-25-1999, Methodologies for Jitter Specification (MJS)
IEEE 802.3z, Media Access Control Parameters, Physical Layer, Repeater and Management
Parameters for 1000 Megabit per Second Operation, May 06, 1998 (Gigabit Ethernet)
FOTP-127 (EIA/TIA-455-127) - Spectral Characteristics of Multimode Laser Diodes Performance,
Nov. 1991
INCITS 352:2002, Fibre Channel Physical Interfaces, (FC-PI)
INCITS 404:2006, Fibre Channel Physical Interfaces - 2, (FC-PI-2)
INCITS 311:2003, Fibre Channel 10 Gigabit, (10 GFC)
INCITS/TR - 35:2004 T11 1316-DT, Fibre Channel - Methodologies for Jitter and Signal Quality
Specification, (MJSQ)
INCITS 369:2003, SCSI Signal Modeling, (SSM-2)
IEEE draft P802.3ae, Media Access Control Parameters, Physical Layer, Repeater and Management
Parameters for 10 Gb/s Operation, (10 Gigabit Ethernet)
2.3 References under development
INCITS T11 1625-D, Fibre Channel Physical Interfaces - 3, (FC-PI-3)
INCITS T11 1647-D, Fibre Channel Physical Interfaces - 4, (FC-PI-4)
INCITS T11 1739-DT, Fibre Channel - Methodologies Signal Quality Specification, (MSQS)
2.4 Informative references
2.4.1 Electrical
Bockelman and Eisenstadt, IEEE transactions on microwave theory and techniques, V 43, No 7, p
1530 (1995)
SFF-8410 Testing and performance requirements for high speed serial and parallel serial links
SFF-8414 HPEI Passive Cable Assembly and PCB S-Parameter Measurements
SFF-8415 Specification for measurement methodology and signal integrity requirements for high
performance electrical interconnect (in development)
SFF-8416 Specification for HPEI measurement of bulk cable
SFF-8429 Signal specification architecture for HSS links
Note: SFF specifications are available at www.sffcommittee.com
2.4.2 Optical
Gigabit Ethernet Networking, Cunninghan and Lane, MacMillan (ISBN 1578700620)
Link model for 1 GFC found at www.T11.org - document 98-271v0
Link model for 10 GBE found at: www.grouper.ieee.org/groups/802/3/ae/public/index.html - search
for latest version of the link model
Senior, J. M., Optical fiber communications, Prentice Hall, 1992
SFF-8412 High speed optical interconnect - measurement and performance requirements for
passive optical connections
2.5 Resources bibliography
Bissell & Chapman, Digital Signal Transmission, Cambridge University Press,1992
Buchanan, J., Signal and Power Integrity in Digital Systems, McGraw Hill, 1996
Chang, K. ed., Microwave Passive & Antenna Components, John Wiley & Sons, 1989
Dally & Poulton, Digital Systems Engineering, Cambridge University Press, 1998
Fast Logic Applications Handbook, National Semiconductor, 1990
Goel, A., High-Speed VLSI Interconnections, Modeling, Analysis, and Simulation, John Wiley &
Sons, 1994
Gupta, K.C., et al, Microstrip Lines and Slotlines, Artech House, 1996
Johnson & Graham, High-Speed Digital Design, A Handbook of Black Magic, Prentice Hall, 1993
Karmel, Colef, & Camisa, Introduction to Electromagnetic and Microwave Engineering, John Wiley &
Sons, 1998
Kraus & Fleisch, Electromagnetics with Application, McGraw-Hill, 1999
Kraus, J., Electromagnetics, McGraw Hill, 1992
Kronsowski & Helland, Electronic Packaging of High Speed Circuitry, McGraw Hill, 1997
Laverghetta, T., Practical Microwaves, Prentice Hall, 1996
Mardiguian, M., Controlling Radiated Emissions by Design, VNR, 1992
Matick, M., Transmission Lines for Digital and Communications Networks, IEEE Press, 1995
Medley, M., Microwave and RF Circuits: Analysis, Synthesis and Design, Artech House, 1993
Mongia, R., et al, RF and Microwave Coupled-Line Circuits, Artech House, 1999
Montrose, M., EMC and the Printed Circuit Board, Design Theory and Layout Made Simple, IEEE
Press, 1999
Montrose, M., Printed Circuit Board Design Techniques for EMC Compliance, IEEE Press, 1996.
Ott, H., Noise Reduction Techniques in Electronic Systems, 2nd ed., John Wiley & Sons, 1988
Paul, C., Analysis of Multiconductor Transmission Lines, John Wiley & Sons, 1994
Paul, C., Introduction to Electromagnetic Compatibility, John Wiley & Sons, 1992
Pozar, D., Microwave Engineering, 2nd ed., John Wiley & Sons, 1998
Ramo, Whinnery, & Van Duzer, Fields and Waves in Communication Electronics, 3rd ed., John Wiley
& Sons, 1994
Ritchey, L. & Blankenhorn, J., High Speed PCB Design, SMT Plus & Ritchtek, 1996
Rizzi, P., Microwave Engineering, Passive Circuits, Prentice Hall, 1998
Rosenstark, S., Transmission Lines in Computer Engineering, McGraw Hill, 1994
Sevick, J., Transmission Line Transformers, Nobel Publishing, 1996
Wadell, B., Transmission Line Design Handbook, Artech House, 1991
Walker, C., Capacitance, Inductance and Crosstalk Analysis, Artech House, 1990
Williams, T., EMC for Product Designers, Butterworth-Heinemann, 1996.
3 Definitions, acronyms, symbols, abbreviations, keywords, and conventions
3.1 Definitions
3.1.1
T
,
R
: Reference points used for establishing signal budgets at the serial input and output pins of
the chip containing the SERDES in an FC port or Retimer. Alpha points form the end-points of a TxRx con-
nection.
3.1.2
T
,
R
: Interoperability points used for establishing signal budget at the internal connector nearest the
point, unless the point also satisfies the definition for or , where it must be either a or a point.
3.1.3
T
,
R
: Interoperability points used for establishing signal budget at the internal connector of a remov-
able Physical Media Dependent (PMD) element.
3.1.4
T
,
R:
Interoperability points used for establishing signal budgets at the external enclosure connec-
tor.
3.1.5 Accuracy: The quality of freedom from mistake or error. The degree of agreement between a
measured value and the true value - not to be confused with precision. See Precision.
3.1.6 Admittance: In an n-terminal network, the complex current flowing to the ith terminal divided by the
complex voltage applied between the jth terminal with respect to the reference point when all other
terminals have arbitrary terminations. The inverse of impedance.
3.1.7 American Wire Gauge: Formerly the Brown & Sharpe Gage, the standard gauge for copper,
aluminum, and other conductors except steel.
3.1.8 Assembly: A subordinate element of a system that is comprised of two or more components
3.1.9 Attenuation: A general term used to denote a decrease in signal power from one point to another.
Attenuation may be expressed as a scalar ratio of the output power to the input power or in decibels as
10*log(Pout/Pin). (If one uses volts and if the load impedance is the same at the input and the output, then
20*log(Vout/Vin) is also correct.) Despite the fact that attenuation is negative gain it is sometimes
expressed as positive dBs.
3.1.10 Average power: The optical power measured using an average-reading power meter when trans-
mitting valid 8B/10B transmission characters.
3.1.11 Backplane: The printed circuit board that contains the interconnect traces and connectors, where
boards or plug-in units are inserted.
3.1.12 Balanced: 1(1) The state of impedance on a two-wire circuit when the impedance-to-ground of one
wire is equal to the impedance-to-ground of the other wire. (2) Electrical signaling system using two
conductors other than ground wherein the signal on one conductor is equal in magnitude but opposite in
sign to the signal on the other conductor at all times; (3) that portion of a signal applied to two conductors
that meets the criteria described in (2), the remainder being the common mode component of the signal.
3.1.13 Bandwidth: In FCSM context, the corner frequency of a low-pass transmission characteristic, such
as that of an optical receiver. The modal bandwidth of an optical fiber medium is expressed in units of
MHz-km.
3.1.14 Baud: A unit of signaling speed, expressed as the maximum number of times per second the state
of the signal on the transmission line or other medium can change (i.e., minimum unit interval). Units of
baud are sec
-1
. With the Fibre Channel transmission scheme, a signal event represents a single transmis-
sion bit. (Adapted from IEEE Std. 610.7-1995 [A16].12).
3.1.15 Bit error ratio (BER): The probability of a transmitted bit being erroneously received in a communi-
cation system. BER is the number of bits output from a receiver that differ from the transmitted bits, divided
by the number of transmitted bits. See baud.
3.1.16 Byte: An eight-bit entity prior to encoding, or after decoding, with its least significant bit denoted as
bit 0 and most significant bit as bit 7. The most significant bit is shown on the left side in FC-FS, unless
specifically indicated otherwise.
3.1.17 Bulk cable: Cable that is not connector terminated.
3.1.18 Bus: A signal line or a set of lines used by an interface system to connect a number of devices and
transfer data.
3.1.19 Cable assembly: A bulk cable that is connector terminated. Generally, a cable that has been termi-
nated by a manufacturer and is ready for installation.
3.1.20 Cable plant: All passive communications elements (e.g., optical fiber, twisted pair, coaxial cable,
connectors, splices, etc.) between a transmitter device and a receiver device.
3.1.21 Capacitive coupling: T (1) A means of implementing a dc level shift on a signal or (2) a means of
coupling a signal (generally an interfering signal) to a conductor where the mechanism is primarily
electrostatic as opposed to electromagnetic.
3.1.22 Center wavelength (laser): The mean wavelength of the optical power spectrum in an operating,
modulated laser. See FOTP-127.
3.1.23 Character: See transmission character.
3.1.24 Circuit: An interconnection of electrical components.
3.1.25 Circuit element: A basic constituent part of a circuit, exclusive of interconnections. A component.
3.1.26 Coaxial cable: An unbalanced electrical transmission medium consisting of concentric conductors
separated by a dielectric material with the spacings and material arranged to give a specified electrical
impedance.
3.1.27 Common-mode: The instantaneous complex sum of the two single ended signals applied to each
side of a balanced circuit, both single ended signals are referred to a common reference.
3.1.28 Complementary metal oxide semiconductor: A semiconductor technology where circuits are
composed of paired NMOS and PMOS devices.
3.1.29 Compliance point: Compliance points are defined as those interoperability points where the
interoperability specifications are met. They may include , , and points for transmitter devices and
receiver devices.
3.1.30 Complex dielectric constant: The complex permittivity of a physical medium in ratio to the permit-
tivity of free space.
3.1.31 Complex permittivity: For isotropic media, the ratio of the complex amplitude of the electric
displacement density to the complex amplitude of the electric field strength.
3.1.32 Component: Items that comprise a system, assembly, or sub-assembly; for example, resistors,
capacitors, inductors, semiconductors, etc. A circuit element.
3.1.33 Computer-aided engineering: The application of computers to the engineering process. The term
applies to any computer system or program that manipulates data for the purpose or assisting engineering,
design, procurement, maintenance, etc.
3.1.34 Conductivity: () A macroscopic material property that relates the conduction current density to
the electric field in the medium.
3.1.35 Contact: The electrically conductive portion of a connector associated with a single conductor in a
cable.
3.1.36 Dielectric constant: 1) That physical property that determines the electrostatic energy stored per
unit volume for unit potential gradient. This value is usually is given relative to vacuum. 2) The real part of
the complex dielectric constant.
3.1.37 Dielectric loss: That contri bution to the attenuati on constant of a propagating mode on a
transmission line that represents losses associated with the dielectric properties of the insulation materials
involved.
3.1.38 Differential FC: A FC signal configuration that uses balanced transmission lines.
3.1.39 Differential-mode: The instantaneous algebraic difference of two signals applied to a balanced
circuit, both signals referred to a common reference.
3.1.40 Differential-mode noise: The noise voltage that appears differentially between two signal wires
and acts on the signal sensing circuit in the same manner as the desired signal.
3.1.41 Discontinuity: 1) An abrupt non uniformity in a uniform transmission line that causes reflected
waves. 2) An abrupt change in the cross section of the planar transmission line. Abrupt refers usually to a
change in dimensions or material over a length short compared to a wavelength.
3.1.42 Dispersion: A term used to denote pulse broadening and distortion. The two general categories of
dispersion are modal dispersion, due to the difference in the propagation velocity of the propagation
modes in a multimode fiber, and chromatic dispersion, due to the difference in propagation of the various
spectral components of the optical source. Similar effects exist in electrical transmission lines with
non-homogeneous dielectrics (e.g., microstrip) when the velocity of propagation (V
P
) of the spectral com-
ponents of a non-sinusoidal signal are not constant over frequency.
3.1.43 Driver: 1) An electronic circuit that supplies input to another electronic circuit. 2) An electrical circuit
whose purpose is to signal a binary state for transmitting information. Also referred to as a generator in
international standards.
3.1.44 Duty cycle distortion (DCD): Ratio of the mean pulse width of a 1 divided by two UI.
3.1.45 Electrical fall time: The time interval for the falling edge of an electrical pulse to transit between
specified percentages of the signal amplitude. In the context of FCSM special consideration is required.
See 4.15.
3.1.46 Electrical rise time: The time interval for the rising edge of an electrical pulse to transit between
specified percentages of the signal amplitude. In the context of FCSM special consideration is required.
See 4.15.
3.1.47 Electromagnetic compatibility: A systems abi li ty to perform its speci fi ed functi ons in the
presence of electrical noise generated either internally or externally by other systems.
3.1.48 Electromagnetic interference: Electromagnetic energy from sources internal or external to
electrical or electronic equipment that adversely affect equipment by creating undesirable responses.
3.1.49 Electrostatic discharge: The sudden transfer of charge between bodies of differing electrostatic
potential.
3.1.50 Element: A component, subcomponent, assembly, subassembly, or part of a physical architecture
or system.
3.1.51 Enclosure: The outermost electrically conducting boundary (that acts as an EMI barrier) containing
one or more FC ports.
3.1.52 External connector: A connector, whose purpose is to carry the FC signals into and out of an
Enclosure with only minor compromise to the shield effectiveness of the enclosure.
3.1.53 Eye opening (horizontal): The time interval across the eye, measured at the average voltage or
optical power level, that contains none (or only 10
-12
for BER purposes) of the (receiver) threshold cross-
ing population at the same level.
3.1.54 False: One of two binary states, usually represented by 0, the other state being true.
3.1.55 FC component: A component part of a complete FC system. FC components include but are not
limited to: cables, cable assemblies, devices, terminators, boards, backplanes, controllers, and chips.
3.1.56 FC port: An entity that supports the FC protocol functions through one or more of the connectors
defined in this document. A local reference clock is used to time the serial output data stream. See port.
3.1.57 FC port connector: A connector defined in this document that carries the FC serial data signals
into and out of the FC port.
3.1.58 Fiber optic cable: A jacketed optical fiber or fibers.
3.1.59 Fiber optic cable assembly: A jacketed optical fiber or fibers with connectors attached at both
ends. Other terminology commonly used: jumper, patch cord, and cable.
3.1.60 Fiber Optic Test Procedure (FOTP): Standards developed and published by the Electronic Indus-
tries Association (EIA) under the EIA-RS-455 series of standards.
3.1.61 Gain: A general term used to denote an increase in signal power from one point to another. Gain
may be expressed as a scalar ratio of the output power to the input power or in decibels as 10*log(Pout/
Pin). (If one uses volts and if the load impedance is the same at the input and the output, then 20*log(Vout/
Vin) is also correct.)
3.1.62 Group delay: The derivative of radian phase with respect to radian frequency /. Group delay is
equal to the phase delay for an ideal non dispersive device or medium, but may differ greatly in an actual
device or medium where there is ripple in the phase versus frequency characteristic. In practice, must
be sufficiently large to permit adequate measurement resolution. If is too large, the limit in the defining
equation will not be reached, and the measured group delay will be dependent upon . Therefore the
value of used in a measurement must be specified.
3.1.63 Group delay time: The rate of change, with angular frequency of the total phase shift through a
network. Group delay time is the time interval required for the crest of a group of interfering waves to travel
thorough a 2-port network, where the component wave trains have slightly different individual frequencies.
3.1.64 Group velocity: The velocity of propagation of the signal envelope, provided that the envelope
moves without change of shape. The magnitude of the group velocity is equal to the reciprocal of the rate
of change of phase constant with angular frequency.
3.1.65 Hardware description language: A computer language with special constructs and verification
protocols, used to develop, analyze, validate, and document, a hardware design or computer architecture.
3.1.66 High: The higher of two voltages used to convey a single bit of information. For positive logic, a
logic 1.
3.1.67 Inductive coupling: (1) A means of implementing a dc level shift on a signal or (2) a means of
coupling a signal (generally an interfering signal) to a conductor where the mechanism is primarily
electromagnetic as opposed to electrostatic.
3.1.68 Insulation displacement contact: A type of contact where the connection to the cable is made by
mechanically piercing the cable insulation as opposed to a connection where the cable insulation is
removed to provide access to the conductor.
3.1.69 Interface connector: An optical or electrical connector that connects the media to the Fibre Chan-
nel transmitter or receiver. The connector set consists of a receptacle and a plug.
3.1.70 Internal connector: A connector, whose purpose is to carry the FC signals within an enclosure
(may be shielded or unshielded).
3.1.71 Interoperability point: Points in a link or TxRx connection where a standard defines signal require-
ments to enable interoperability. See
T
,
R
,
T
,
R

T
and
R
.
3.1.72 Intersymbol interference: The effect on a sequence of symbols when the symbols are distorted by
transmission through a limited bandwidth medium to the extent that adjacent symbols interfere with each
other.
3.1.73 Intra enclosure FC port: An FC port whose FC port connector is contained within an enclosure. An
internal port.
3.1.74 Isotropic: Pertaining to a material whose electric or magnetic properties, or both, are directionally
independent.
3.1.75 Jitter: the collection of instantaneous deviations of a signal edge times at a defined signal level of
the signal from the reference times for those events. The reference time is the jitter-timing-reference spec-
ified in FC-MJSQ that occurs under a specific set of conditions.
3.1.76 Laser chirp: A phenomenon in lasers where the wavelength of the emitted light changes during
modulation.
3.1.77 Least significant: Within a group of items that, taken as a whole, represents a numerical value, the
item within the group with the smallest numerical weighting.
3.1.78 Limiting amplifier: An active circuit with amplitude gain that keeps the output levels within speci-
fied levels. Commonly used in optical receivers.
3.1.79 Link: (1) In the FCSM context two unidirectional fibers transmitting in opposite directions and their
associated transmitters and receivers. (2) In the FCSM context a synonym for a duplex TxRx connection.
3.1.80 Loss tangent: The ratio of the imaginary part of the complex dielectric constant of a material to its
real part.
3.1.81 Low: The lower of two voltages used to convey a single information bit. For positive logic, a logic 0.
3.1.82 Magnetic coupling: Inductive coupling.
3.1.83 Microstrip: A class of planar transmission lines consisting of one or more thin conducting strips of
finite width parallel to a single extended conducting ground plane. The strips are fixed to an insulating
substrate attached to the ground plane. The semi-infinite space above the strips is filled with a different
medium (typically air or solder mask and air).
3.1.84 Mode: A transmission mode.
3.1.85 Mode partition noise (MPN): Noise in a laser based optical communication system caused by the
changing distribution of laser energy partitioning itself among the laser modes (or lines) on successive
pulses in the data stream. The effect is a different center wavelength for the successive pulses resulting in
arrival time jitter attributable to chromatic dispersion in the fiber.
3.1.86 Model: 1) An approximation, representation, or idealization of selected aspects of the structure,
behavior, operation, or other characteristics of a real-world process, concept, or system. Models may
have other models as components. 2) To serve as a model in definition 1. 3) To develop or use a model as
in definition 1.
3.1.87 Most significant: Within a group of items that, taken as a whole, represents a numerical value, the
item within the group with the greatest numerical weighting.
3.1.88 Multiline: A model representation of a multi-conductor component that includes the capacitive and
inductive coupling among the conductors.
3.1.89 Netlist: A listing of the nets of a circuit. It provides, usually in text format, a description of the
connections among the components of the circuit.
3.1.90 Network function: Any i mpedance, admittance functi on or any other functi on that can be
expressed in terms of or derived from the determinant of a network and its cofactors. This also includes
voltage ratios, current ratios, and numerous other quantities.
3.1.91 Network matrix: Anyone of several matrices that relate the equivalent voltage, current, incident
waves and reflected waves of an n-port network.
3.1.92 Network parameters: The elements of a network matrix.
3.1.93 One: A true logic state.
3.1.94 Optical fall time: The time interval required for the light extinguishing edge of an optical pulse to
transit between specified percentages of the signal amplitude. In the context of FCSM special consider-
ation is required. See 4.15.
3.1.95 Optical fiber: Any filament or fiber, made of dielectric material, that guides light.
3.1.96 Optical modulation amplitude: The absolute difference between the optical power of a logic one
level and the optical power of a logic zero level.
3.1.97 Optical path penalty: A link optical power penalty to account for signal degradation other than
attenuation.
3.1.98 Optical receiver overload: The condition of exceeding the maximum acceptable value of the
received average optical power at point
R
to achieve a BER < 10
-12
.
3.1.99 Optical receiver sensitivity: The minimum acceptable value of received signal at point
R
to
achieve a BER < 10
-12
.
3.1.100 Optical reference plane: The plane that defines the optical boundary between the plug and the
receptacle.
3.1.101 Optical return loss (ORL): See return loss.
3.1.102 Optical rise time: The time interval required for the light increasing edge of an optical pulse to
transit between specified percentages of the signal amplitude. In the context of FCSM special consider-
ation is required. See 4.15.
3.1.103 Phase angle: The measure of the progression of a periodic wave in time or space form a chosen
instant or position.
3.1.104 Phase delay: The ratio of total radian phase shift, to the specified radian frequency. Phase delay
is nominally constant over the frequency band of operation for non dispersive delay components.
3.1.105 Phase shift: (1) The absolute magnitude of the difference between two phase angles. (2) The
displacement in time of one periodic-waveform relative to other waveforms.
3.1.106 Phase velocity: Of a traveling wave at a given frequency, and for a given mode, the velocity of an
equiphase surface in the direction of propagation.
3.1.107 Planar transmission line: A transmission line composed of one or more parallel plates, slabs, or
sheets of conduction or insulating material, including free space, and where one or more layers are
composed of material of differing electromagnetic properties, arranged in strips of finite cross section and
aligned with the axis of propagation to form the guiding structures.
3.1.108 Plug: The half of the interface connector having male connector properties.
3.1.109 Port: A place of access to a network where the network variables may be observed or measured.
3.1.110 Precision: 1(1) The degree of exactness or discrimination used when stating a quantity. For
example 3 decimal places versus 5 decimal places. (2) The repeatability of measurement data expressed
in terms of standard deviation.
3.1.111 Radio frequency: A frequency in the range of 10KHz to 100 000MHz.
3.1.112 Radio frequency interference: Degradat i on of a want ed si gnal by an el ect romagnet i c
disturbance having components in the RF range.
3.1.113 Receiver: In the FCSM context, an electronic circuit (Rx) that converts a signal from the transmis-
sion media (optical or electrical) to an electrical logic signal.
3.1.114 Receptacle: The half of the interface connector having female connector properties.
3.1.115 S parameter: One of the coefficients of the scattering matrix.
3.1.116 Reclocker: A type of repeater specifically designed to modify data edge timing such that the data
edges have a defined timing relation with respect to a bit clock recovered from the (FC) data at its input.
3.1.117 Reference points: Points in a TxRx connection where informative specifications may be written.
These specifications establish the base values for the interoperability points. See
T
and
R
:
3.1.118 Reflections (optical or electrical): Power returned to point
T
by discontinuities in the physical
link.
3.1.119 Repeater: An active circuit designed to modify the (FC) signals that pass through it by changing
any or all of the following parameters of that signal: amplitude, slew rate, and edge to edge timing. Repeat-
ers have jitter transfer characteristics. Types of repeaters include retimers, reclockers and amplifiers.
3.1.120 Retimer: A type of repeater specifically designed to modify data edge timing such that the data
edges have a defined timing relation with respect to a bit clock derived from a timing reference other than
the (FC) data at its input. A Retimer shall be capable of inserting and removing fill words (see FC-FS) from
the (FC) data passing through it. Inserting a retimer into a TxRx connection creates two TxRx connections.
Retimers provide complete isolation of input wander, and their output jitter is unrelated to the input jitter.
Retimers are further characterized by their signal properties including their input jitter tolerance and their
jitter output. These input and output properties may be associated with selected interoperability points
dependent on the application.
3.1.121 Return loss: The ratio (expressed in dB) of incident power to reflected power, when a component
or assembly is introduced into a link or system. May refer to optical power or to electrical power in a speci-
fied frequency range.
3.1.122 RIN
12
(OMA): Relative Intensity Noise. Laser noise in dB/Hz with 12 dB optical return loss, with
respect to the optical modulation amplitude.
3.1.123 Run length: Number of consecutive identical bits in the signal transmitted through the media e.g.,
the pattern 0011111010 has a run length of five (5).
3.1.124 Scattering matrix: An n by n array of complex numbers used to relate incident and reflected
waves for an n-port network at a single frequency. Multiple arrays are used to cover the frequency range
of interest.
3.1.125 Single line: A model representation of a multi-conductor component that does not include the
capacitive and inductive coupling among the conductors.
3.1.126 Single-ended FC: A FC signal configuration that uses unbalanced transmission lines.
3.1.127 Skin depth: Of a conducting material, at a given frequency, the depth where the surface current
density is reduced to 1/e of its value at the surface.
3.1.128 Skin effect: The tendency of alternating current to concentrate in the areas of lowest impedance.
3.1.129 Simulation Program with Integrated Circuit Emphasis: An application-oriented programming
language used widely to design electrical circuits.
3.1.130 Special character: Any transmission character considered valid by the transmission code but not
equated to a valid data byte. Special characters are provided by the transmission code for use in denoting
special functions.
3.1.131 Spectral width (RMS): The weighted root mean square width of the optical spectrum. See
FOTP-127.
3.1.132 State: The value assumed at a given instant by a signal or variable.
3.1.133 Stressed receiver sensitivity: The normal amplitude of optical modulation in the stressed
receiver test given in annex A.6 of FC-PI.
3.1.134 Stressed receiver vertical eye closure power penalty: The ratio of the power required to
achieve normal optical modulation amplitude to the power required to achieve the vertical eye opening in
the stressed receiver test (annex A.6 of FC-PI).
3.1.135 Stripline: A class of planar transmission line characterized by one or more conducting strips of
finite width parallel to and usually midway (for edge coupling) or centered midway (for broadside coupling)
between two extended conducting ground planes. The space between the planes is filled with a
homogeneous insulation medium.
3.1.136 Stub: A branch off of the main transmission line whose other end is open or terminated with an
unmatched (generally higher) impedance.
3.1.137 Synchronization: Bit synchronization, defined above, and/or Transmission-Word synchronization,
defined in FC-FS.
3.1.138 System: In a hierarchical approach, a collection of interacting, interrelated, or interdependent
elements forming a collective functioning entity.
3.1.139 Transceiver: A transmitter and receiver combined in one package.
3.1.140 Transition region: (1)The physical region of a cable assembly or printed circuit board between
the connector contact and the portion of the bulk cable or printed circuit board that is undisturbed by the
connector attachment. (2) The region in time where the state of the signal changes.
3.1.141 Transmission character: Any 10-bit encoded character (valid or invalid) transmitted across a
physical interface specified by FC-PI. Valid transmission characters are specified by the transmission code
and include data and special characters.
3.1.142 Transmission line: A structure designed to guide the propagation of electromagnetic energy in a
well-defined direction.
3.1.143 Transmission medium: The materi al that carri es the i nformati on si gnal s. For exampl e:
twisted-wire pairs, planar transmission lines, coaxial cable, etc.
3.1.144 Transmission mode: A form of propagation along a transmission line characterized by the
presence of one of the elemental type of transverse electric, transverse magnetic, or transverse
electromagnetic waves.
3.1.145 Transmittance: A response function where the variables are measured at different ports.
3.1.146 Transmitter: In FCSM context, an Electronic circuit (Tx) that converts an electrical logic signal to a
signal suitable for the communications media (optical or electrical).
3.1.147 True: One of two binary states, usually represented by 1, the other state being false.
3.1.148 Two-port parameters: The network parameters for a two-port device.
3.1.149 TxRx connection: The complete simplex signal path between the output alpha point of one FC
port, or retimer, to the input alpha point of a second FC port or retimer, where a BER of <10
-12
is achieved.
It is one half of a duplex link.
3.1.150 TxRx connection segment: That portion of a TxRx connection delimited by separable connectors
or changes in media.
3.1.151 Unbalanced: (1) The degree of difference between the impedance to ground of each wire of a
two-wire circuit. (2) Transmission using a single conductor and a ground return. (3) The degree of
difference between the two components of a two conductor signal when the components are not equal and
opposite at all times.
3.1.152 Uniform transmission line: A transmissi on l ine that has substanti all y identi cal electri cal
properties throughout its length.
3.1.153 Unit interval: The period of a nominal bit for a given signaling speed. It is equivalent to the short-
est nominal time between signal transitions. UI is the reciprocal of Baud (Units of UI are seconds).
3.1.154 Validation: The process of evaluating a system or component to ensure compliance with the
functional, performance, and interface requirements.
3.1.155 Vendor-specific: A term used to describe parameters that may vary between vendors supplying
similar components. These parameters peculiarize a vendors implementation of that component.
3.1.156 Verification: Confirmation by examination (testing) with evidence that specified requirements
have been met.
3.1.157 Verilog
1
: An IEEE standard C-like hardware descriptor language used to describe a digital
system, for example, a computer or a component of a computer. It describes designs at a high level of
abstraction such as at the architectural or behavioral level as well as the lower implementation levels.
3.1.158 Via: An electrical connection between the layers of a printed circuit board.
3.1.159 VHDL: An IEEE standard Ada-like hardware descriptor language used to describe a digital
system, for example, a computer or a component of a computer. It describe designs at a high level of
abstraction such as at the architectural or behavioral level as well as the lower implementation levels
3.1.160 Y parameter: The input, output, or transfer admittance matrix, y
11
, y
22
, y
12
, y
21
of a four-terminal
network when the far end is short-circuited for a single frequency. Multiple arrays are used to cover the
frequency range of interest.
3.2 Symbols, abbreviations, and acronyms
3.2.1 Symbols
Unless indicated otherwise, the following symbols have the listed meanings.
1. A registered trademark of Cadence Design Systems, Inc.
Table 1 Symbols
alpha interoperability point
beta interoperability point
gamma interoperability point
delta interoperability point
ohm
micro (e.g., m = micrometer)
wavelength
chassis or earth ground
signal reference ground
plus or minus
approximately
x multiply
+ add
- subtract
< or LT less than
or LE less than or equal
= or EQ equal
> or GT greater than
or GE greater than or equal
or NE not equal
A ampere
c velocity of light in a vacuum
C coulomb
dB decibel
F farad
g gram
H henry
Hz hertz
m meter
N newton
Np neper
ohms
s second
T tesla
V volt
W watt
Wb weber
G 10
9
M 10
6
k 10
3
c 10
-2
m 10
-3
10
-6
n 10
-9
p 10
-12
f 10
-15
3.2.2 Acronyms and other abbreviations
Table 2 Acronyms and other abbreviations
AWG American wire gauge
Bd baud
BER bit error rate
BNC Bayonet-Neil-Councilman (coaxial connector)
CAE computer-aided engineering
CCITT Comite Consultatif International Telegraphique et Telephonique (see ITU-TS)
CMOS complementary metal-oxide semiconductor
dB decibel
dBm decibel (relative to 1 mW)
DF differential
DJ deterministic jitter
DUT device under test
ECL emitter coupled logic
EIA Electronic Industries Association
EMC electromagnetic compatibility
EMI electromagnetic interference
ESD electrostatic discharge
FC Fibre Channel
FOTP fiber optic test procedure
FWHM full width half maximum
GBd gigabaud
HDL hardware description language
hex hexadecimal notation
IBIS I/O Buffer Interface Specification
IDC insulation displacement contact
IEEE Institute of Electrical and Electronics Engineers
ISI inter-symbol interference
ITU International Telecommunication Union
LOS loss of signal
LSB least significant bit
LW long wavelength
MB
megabyte = 10
6
bytes
MBd megabaud
MM multimode
MPN mode partition noise
MSB most significant bit
N_Port Node_Port
NA not applicable
NEXT near-end crosstalk
OFC open fiber control
OFSTP optical fiber system test procedure
ORL optical return loss
PCB printed circuit board
PECL positive emitter coupled logic
PMD physical medium dependent
ppm parts per million
RF radio frequency
RFI radio frequency interference
RIN relative intensity noise
RJ random jitter
RLGC resistance, inductance, admittance, capacitance
RMS root mean square
Rx receiver
3.3 Keywords
3.3.1 Expected: Describes the behavior of the hardware in the design models assumed by this document.
Other hardware design models may also be implemented.
3.3.2 May: Indicates flexibility of choice with no implied preference.
3.3.3 Optional: Features that are not required to be implemented by this document. However, if any
optional feature defined by this document is implemented, it shall be implemented as defined in this
document.
3.3.4 Shall: Indicates a requirement for compliance to this document. Since this document is a technical
report there are no enforceable requirements.
3.3.5 Should: Indicates flexibility of choice with a preferred alternative; equivalent to the phrase it is
recommended.
3.4 Conventions
Certain words and terms used in this American National Technical Report have a specific meaning beyond
the normal English meaning. These words and terms are defined either in clause 3 or in the text where
they first appear.
All parametric data are specified in terms of fundamental MKSA units - meters, kilograms, coulombs,
seconds - and their derivatives - ohms, henrys, mhos, farads, volts, amperes, etc.
Decimals are indicated with a comma (e.g., two and one half is represented as 2,5).
Decimal numbers with more than three significant digits on either side of the decimal point are separated
into groups of three digits by means of a space, for example, 2,997 924 58 x 10
8
or 1 062,5 MegaBaud.
An alphanumeric list (e.g., a, b, c or A, B, C) of items indicate the items in the list are unordered.
S/N or
SNR
signal-to-noise ratio
SD signal detect
SE single-ended
SERDES serializer/deserializer
SM single mode
SPICE Simulation Program with Integrated Circuit Emphasis
STP shielded twisted pair
SW short wavelength
TDR time domain reflectometry
TIA Telecommunication Industries Association
TNC Threaded-Neil-Councilman (coaxial connector)
TP twisted pair
Tx transmitter
TxRx a combination of transmitter and receiver
UI unit interval
ULP upper level protocol
URL uniform resource locator
VHDL VHSIC hardware description language
Table 2 Acronyms and other abbreviations
A numeric list (e.g., 1,2,3) of items indicate the items in the list are ordered (i.e., item 1 shall occur or
complete before item 2).
In the event of conflicting information the precedence for requirements defined in this standard is:
1) text,
2) tables, then
3) figures.
4 General
4.1 Overview
This technical report is a collection of definitions, concepts, and architectural descriptions intended to
enable transportable and reproducible mathematical representation of signals existing within an FC link.
Since this document is the second version of its kind in the industry (FCSM being the first), and it is not
clear what parts could be used for effective standardization, it is being cast as a technical report. Following
generations of this document may be cast in the form of a standard.
4.2 Signal path architectures for modeling
4.2.1 Transmitter-receiver connection
This document considers signal behavior within single FC transmitter-receiver connection - a link may
contain several transmitter-receiver connections if repeaters are used. An FC transmitter-receiver
connection is defined by the existence of a transmitter chip and a receiver chip coupled together by a
single unidirectional signal transmission path. A minimal transmitter-receiver connection contains only
transmission path elements and separable connectors (there may be non-uniformity within the elements.)
For convenience, the term link may be used to refer to a transmitter-receiver connection in the context of
Fibre Channel Signal Modeling. If this is done, then it is implied that a simple link with no repeaters is
intended.
4.2.2 Electrical transmitter-receiver connection
For purposes of this document, the simplest electrical FC transmitter receiver connection that has
interoperability requirements is divided into discrete parts as depicted in figure 1. The transceiver boards
depicted in this figure are FC ports.
Figure 1 - Architecture for modeling a minimal electrical transceiver path
Each feature i denti fi ed i n fi gure 1 i s consi dered a component wi th speci fi c i nterfaces to the
PACKAGE PINS OF THE TRANSMITTER/RECEIVER CHIPS
COUPLING
CIRCUIT
TRANSITION
REGIONS
CONNECTORS
X1
X2 X3
Xn = POINTS OF INTEREST
PCB
X5
X4 X3
PCB
TERMINATION MAY BE PLACED IN COUPLING
CIRCUIT OR IN TRANSMITTER/RECEIVER CHIPS
PCB OR CABLE
transmitter-receiver path.
The points of interest for electrical signal modeling are:
1) Output of the electrical transmitter
2) Transmitter side of the connector on the component with the transmitter
3) Interconnect side of the connector on both ends
4) Receiver side of the connector on the component with the receiver
5) Input to the electrical receiver
4.2.3 Optical transmitter-receiver connection
Figure 2 shows an optical transmitter-receiver connection.
Figure 2 - Architecture for modeling an optical transmitter-receiver connection
The concept in Figure 2 assumes that no filtering is used in any model validation scheme.
To test the model use no filters. For compliance testing, filters on the instrumentation used to measure the
optical transmit signal may be needed.
The points of interest for optical modeling are:
A) Output of the electrical transmitter
B) 50 cm down the fiber from the optical connector attached to the laser
C) Output of the unmated optical connector on the receiver end
D) Input to the electrical receiver
Fiber
Electrical laser
driver
Laser/led
modulated
source
Optical connectors
Optical receiver circuits
[Optical detector e.g., pin
Diode + trans impedance
Amp]
Postamp circuit
For testing transmitter
device optical output
use 50 cm min test lead
Electrical transmitter
circuit
Electrical receiver
circuits
X
Transmission media
dependent interfaces
X
X X
X=Points of interest
Optical receiver circuits
with a noise filter response
built in
Optical transmitter
circuits
Transmitter device Receiver device
4.3 Relationship between FCSM-2 and bit errors
FCSM-2 is directed specifically at electrical and optical signals existing within a link. Bit errors occur only
when a receiver fails to accurately detect the state of the signal presented to its input. The conversion of
signals received at the input of the receiver to logic bits can be a very complex process that involves the
details of the operation of the receiver circuitry. While the FC standards require certain levels of bit error
rate performance, FCSM-2 is not addressing the behavior of receivers. Repeaters do not report bit errors
but nevertheless repeater inputs are considered receivers and repeater outputs are considered
transmitters. Repeaters condition the signals passing through but may fail to pass all incoming signal
transitions to its output and such a condition could be considered a bit error. Defining the details of what
constitutes a suitable passing of an incoming signal transition is beyond the scope of this document. The
input of a repeater is considered a receiver for purposes of this document. FCSM-2 is considered
successful if the methodologies described herein produce simulated signals that agree with measured
signals.
The FC-MJSQ document addresses the relationship between signal properties and bit errors.
4.4 FCSM and scaling
In general, models are a way of describing physical components. As such it is not possible to vary
simulated signal properties without changing the model for the physical components. For some signal
features a linear scaling methodology may be employed to simulate the behavior of links under conditions
other than that produced by the specific components that comprise the link.
For example, if one needs to know what the receiver input signal would look like if the transmitter output
signal were increased to the maximum allowed amplitude, a simple scaling scheme may be used. For
linear systems, that describes most interconnect, this is a straightforward amplitude scaling.
Figure 3 shows a simple example where the simulated transmitter output is half of the maximum allowed
by the specification for this point in the link. This result is due to the properties of the model for the
transmitter and the interconnect between the transmitter and the receiver. It is assumed to be accurate for
purposes of this clause. The simulated signal at the receiver is also shown in Figure 3. In order to
determine what the signal at the receiver would be if the transmitted signal had been at its maximum
allowed amplitude, the simulated signal at the receiver is linerly scaled by multiplying by 2.
For non linear parts of the system, such as the transmitter and receiver such linear scaling is not accurate.
Figure 3 - Example of amplitude scaling
In general, parameters within the model itself may not be used for scaling the simulation results.
Parameters within the model itself could include, for example, parameter values intended to represent
process, temperature, supply voltage corners.
In some cases, timing responses may be scaled by simple time translation. Whether this scaling is valid or
not depends on the details of the system being simulated. Features that do not lend themselves to time
translation scaling include cross talk and other influences that are not synchronized to features of the
transmitted signal.
4.5 Range of validity of models and simulations
Simulations are only likely to produce accurate results if:
a) The models themselves are accurate within specified limits
b) the input stimuli to the simulation are within the limits of accuracy established when the models for
the components used in the simulation were developed
c) signal levels within the link do not exceed the ability of the components to operate.
Component models shall specify the ranges of validity for input stimuli. It is the responsibility of the person
doing the simulation to determine if simulated signals are within the allowed ranges for the components.
4.6 Signal modeling purposes
4.6.1 Overview
Modeled signals are the result of running a simulation. Simulation tool inputs consist of a set of component
models and a set of stimuli. Different simulations may be performed depending on the purpose. The
details of the simulation may vary widely for the same basic link.
SIMULATED TRANSMITTER
OUTPUT FROM TRANSMITTER
MODEL (HALF OF MAX
ALLOWED AMPLITUDE)
SIMULATED RECEIVER
INPUT
MAXIMUM ALLOWED TRANSMIT
AMPLITUDE (SCALED BY 2X FROM
SIMULATED RESULT TO ACHIEVE
MAX AMPLITUDE)
RECEIVED SIGNAL WITH MAXIMUM
ALLOWED TRANSMITTER AMPLITUDE
(SCALED BY 2X FROM SIMULATED
RESULT)
TRANSMITTER RECEIVER
AMAX/2
AMAX
The methodologies within this technical report apply to several purposes. These purposes fall into two
classes:
those that focus on different physical parts in the FC transmitter-receiver path as viewed by the sup-
plier of the part
those that focus on the performance of the overall transmitter-receiver path.
For example, the description of a specific parameter for a connector or bulk cable as a part of a
specification for that part falls into the first class. A system integrator using the same connector as part of
a link may have a very different view of what is important. The optimum approach to modeling may
depend strongly on the purpose.
The remainder of clause 4.6 describes more details for these two classes.
4.6.2 Physical components and signals
4.6.2.1 Relationship between physical and modeling terminology
The physical parts of a FC link are generally referred to as components. Components that are not made
up of lower level components are termed "elemental components". Components that are made from lower
level components are termed "composite components". The view of what is elemental and what is
composite could depend on the point of view of the user. For example, a bulk cable could be considered
elemental for a person making a cable assembly or composite for a person making the bulk cable. If a
person were making the bulk cable, elemental components could be the primary electrical wire, the
dielectric material, and the shield conductors. In order to provide a consistent view in this document a set
of conventions are used to determine whether a component is elemental or composite.
From a modeling perspective there is no requirement to divide the parts of the model into a hierarchical
relationship. Models can be constructed that are not physically realizable. However, if the model applies
only to a portion of the FC link the model may be referred to in a manner similar to the physical description;
for example: system models, component models, etc. Within any specific type of model a standard
construction is defined that contains all the essential ingredients for that type of model.
4.6.2.2 Elemental components
In this document the following components are considered to be elemental components for electrical links:
1) bulk cable
2) mated connectors
3) unmated half of connectors
4) transceiver chips
5) terminator circuits
6) coupling circuits
7) printed circuit boards (without connectors, transceivers, resistors, etc.)
8) instrumentation probes
9) instrumentation
10) transition regions in cable assemblies
11) non-retiming repeaters (e.g. port bypass circuits)
No other electrical components are elemental in this document.
The following elemental components are defined for optical links:
1) termination (not shown in Figure 2)
2) electrical transceiver chips (input to laser drivers and TIA output receiver chips)
3) electrical laser/led/modulator drivers
4) optical sources
5) optical detectors
6) trans-impedance amplifiers
7) post amplifiers (see Figure 2)
8) PCB traces / vias / transition regions / component pads
9) optical connectors
10) jacketed bulk fiber
11) active interconnect (reclockers optional)
12) driver / receiver signal processing (e.g. equalization, filtering, digital signal processing
optional)
No other optical components are elemental in this document.
4.6.2.3 Composite components
The following are the composite components for electrical links:
1) cable assemblies
2) boards containing receiver chip for the transmitter-receiver connection (Including target boards
and boards those that contain the receiver in a link with repeaters
3) boards containing the transmitter chip for the transmitter-receiver connection ( Including host
bus adapter boards and boards that contain the transmitter in a link with repeaters).
4) backplanes (including connectors)
No other items are considered valid composite electrical components.
The following are the composite components for optical links:
1) simple optical transmitter (electrical laser driver + laser)
2) simple optical receiver (optical receiver+preamp)
3) cable assemblies (fiber + connectors)
4) assembled pcbs
In this document composite components are also described by the term "standard model constructions".
4.6.2.4 Systems
System constructions are formed from an interconnected collection of elemental components and
composite components. All constructions addressed in this document are limited to a single clock domain.
There are two classes of system construction:
1) transmitter/receiver connection: a single active transmitter chip and a collection of passive
elements that enable connection to a single active receiver chip
2) complex connection: links that include non-retiming repeaters (e.g. port bypass circuits,
reclockers).
Figure 1 and figure 2 show examples of transmitter/receiver connections. As long as a valid model is
used for the repeater the simulations approach for complex connections is the same as for a simple
transmitter/receiver connection. However, for complex connections amplitude and time scaling becomes
suspect due to the probable non-linear behavior of the repeater. Verifying compliance to specifications
may be more difficult in complex connections.
4.6.2.5 Instrumented and non-instrumented systems
Systems come in two types, instrumented and non-instrumented. An instrumented system is an FC link
that consists of interconnected components and associated instrumentation as it exists during a
measurement. A non-instrumented system is an FC link that consists of interconnected components as it
exists in service.
Since instrumentation may perturb the system and instrumentation is required for verification, it is
important that verification be done only on instrumented system models. FCSM-2 assumes that if a
system is verified using an instrumented system model that the non-instrumented system model is also
valid. The non-instrumented system model should be used for simulation of signals as they exist in
service.
4.6.2.6 Signals and measurement points
Signals are time dependent voltage or optical power waveforms described by a set of parameters.
Signals in a FC link are created from an FC transmitter chip and they propagate along the electrical or
optical path until they reach the receiver chip. The parameters that describe the signal change as the
signal propagates due to effects along the path. With a valid model of the FC link a signal may be
calculated at any point along the path. Identification of the physical point in the segment where the signal
is calculated (measured) shall be provided along with the signal parameters.
Whil e signals may be calculated at any point, certain points in the segment are designated as
interoperability points where the FC family of standards define requirements on the signals. Signals at
points other than interoperability points may also be useful for a variety of purposes.
Figure 4 and Figure 5 shows approximate positions where FC interoperability points exist. It is only at
these points in a link where the requirements on signals specified in FC-PI etc. apply and only at these
points where interoperability is defined by FC-PI etc.
T
TX
TX
PMD
Optical TRX
T(Op or Cu)
TX
MIA
Passive
Elements
TX
PMD
Optical TRX
Active
Elements
T
TX
PMD
Active CU
Enclosure wall
(Faraday shield)
TX
Active
Elements
*
*
*

*
T
* Inter-enclosure configurations with beta points require active circuits for FC-PI
interoperability between beta and delta or, if no delta point exists, between beta and gamma.
In this figure TX indicates a SERDES and associated transmitter.
Figure 4 - Tx interoperability points (examples)
Note that there are connectors possible where interoperability is not defined by FC standards. In other
cases the details of the configuration and product marketing features determine whether the connector is a
defined interoperability point or not.
4.6.2.7 Modeling run length dependent transmitter signals
Transmitters may use schemes called precompensation, transmitter equalization, or pre-emphasis to help
compensate for jitter caused by intersymbol interference mechanisms such as that caused by the
interconnect not having a "flat" frequency response or reflections.
Modeling transmitters whose output depends on the run length of the data pattern requires special
consideration of the simulation tools to be used. For example IBIS 4.0 or better or a tool that supports
Verilog-AMS is required.
R
RX
RX
PMD
Optical TRX
RX
MIA
Passive
Elements
RX
PMD
Optical TRX
Active
Elements
R
Figure 5 - Rx interoperability points (examples)
RX
PMD
Active CU
Enclosure wall
(Faraday shield)
RX
Active
Elements
*
*

*
R(Op or Cu)
*
* Inter-enclosure configurations with beta points require active circuits for FC-PI
interoperability between beta and delta or, if no delta point exists, between beta and
gamma. In this figure RX indicates a SERDES and associated receiver.
See also sub-clause 5.3.3 for methods for specifying finite impulse response functions.
4.6.2.8 Interactions between signals on different signal lines
When a signal is traveling in one signal line it induces noise on other signal lines in the system. Such
noise coupling is an important part of FC technology. Models that incorporate more than one signal line
are termed "multiline models".
Depending on the application goals, especially the accuracy goals, multiline models may be required. One
should first determine that a multiline model is not required before assuming that a single line model is
adequate.
4.6.3 Data patterns / launched signals
Standardized data patterns shall be used when interchanging information about simulation results. These
data patterns shall take the following into consideration:
a) inter-symbol interference effects on single lines
b) crosstalk from other FC lines
c) word patterns as well as individual patterns
d) SSO
e) worst case digital patterns
f) sinusoidal patterns
g) effects of transition density changes (see 4.18)
h) repeat period
i) rise time (see sub-clause 7.1.8.5)
4.6.4 Viewpoints
The general utility of modeling encompasses many applications. The approach to the modeling effort
depends on the viewpoint and goals of the user.
Viewpoints include: the system integrator, the elemental component supplier, and a number of others.
A system integrator may be concerned with robust operation of the link under the conditions where the
parts that comprise the link may be removed and replaced with other parts that are nominally the same but
may come from different suppliers. Such system level interchangeable parts always have separable
connectors and the behavior at these connectors is the most important focus. The integrator needs to be
sure that the configurations he is selling are robust and are not operating near unacceptable pitfalls.
Therefore, the system integrator will focus on the signals at or near connectors and will do sensitivity
characterization to variables that will be present in the composite components he is using to build his
configurations.
A system integrator varies things like temperature, power supply voltage, segment loading due to different
device populations, electrical length between connectors, frequency response of terminators, ambient
noise, power supply transients, and the entire range of parameters allowed for the individual component
performance.
A chip supplier could consider that his primary interface is the chip pads and that he would like the chip to
be useful for a wide variety of printed circuit board designs. Thus, for the chip supplier, the signal coming
out of the chip pads is the primary focus. The loading of the circuitry that attaches to the chip may be a
critical parameter. Other area of interest to chip suppliers include effects of the chip package and effects of
worst case corners of process, temperature, and supply voltage.
The kind of modeling process used, the output format, the parameters of the launched signal, and the
choice of the parameters of the components that comprise the link may all strongly depend on the
viewpoint of the user.
Another dimension to the viewpoint topic is the part of the link being addressed. Consider figure 6 where
the transmiter chip provides the source for the propagating signal. The only way one can directly affect the
properties of the signal launched by the transmitter chip into the interconnect is by changing the transmitter
model (and to a lesser extent by changing the interconnect model). Signals at all points in the link are
determined by the properties of the signal launched from the driver and the models for the interconnect
and the receiver. Therefore, the properties of the signals at either interoperability point shown in figure 6
cannot be directly controlled but rather must be indirectly "adjusted" by changing properties of the models.
Since "adjusting" the models is done for purposes of attaining a specific signal property, the "adjusted"
models no longer represent the component they are intended to model.
This lack of ability, when modeling complete links, to directly control signal properties at interoperability
points without changing the model for the link, has significant implications when only portions of the link are
of interest. When modeling only a portion of the link, signals at the interoperability point connectors
provide the basis for the requirements on the link portion.
Another related issue is that the signal at the transmitter chip does not represent the signal at the
interoperability point. This is caused by the fact that the launched signal does not emanate directly from
the connector but rather must travel from the transmitter chip to the connector thereby being affected by
the properties of the connector and PCB as well as by the transmitter chip.
Figure 6 - FCSM applicability to a simple link
Since FC standards define the properties of the signals at specific points in the link there are two
fundamental viewpoints:
From the supplier of the signal
From the "user" of the signal or the interconnect
From a signal supplier perspective the focus may be whether a specific driver delivers a compliant signal at
an interoperability point under a worst case loading condition. The modeling process is relatively
straightforward in this case. One calculates the signal at the interoperability point and compares it to the
specification requirements.
TRANSMITTER SIGNAL
AT CHIP PADS
CONNECTOR OF THE DEVICE
WITH THE RECEIVER
(INTEROPERABILITY POINT)
FC DEVICE
FC DEVICE
CONNECTOR OF THE DEVICE
WITH THE TRANSMITTER
(INTEROPERABILITY POINT)
RANGE OF APPLICABILITY OF FCSM
T T
From the perspective of the user of the signal the focus is on whether the interconnect can transport a
minimal quality signal launched into the interconnect at the transmitter end interoperability point to the
receiver end interoperability point of the interconnect. This requires creating a signal at the transmitter
interoperability point that has specific properties. Unfortunately, as discussed above in this sub clause,
these required worst case signal properties are most likely not that produced by the transmitter model
since the transmitter model represents a real transmitter and was almost certainly not designed to transmit
worst case signals. Similarly, one would hope that links with good transmitters would not produce minimal
quality signals at the interoperability points. Therefore, one is faced with creating a signal launch condition
at the interoperability point where the signal does not come from a model for a real FC transmitter.
Worst case specified launch conditions may easily be created in a model by placing ideal sources right at
the interoperability point (see Figure 7) but they will not include the effects of the electrical paths on the FC
port containing the transmitter. At the present state, direct launch from idealized transmitters into the
interoperability point is the method available for this application.
Figure 7 - Modeling architecture for launching a specific signal at a connector
Signals at interoperability points are not specified by FC standards to be those existing in service but rather
those observed with well defined loads applied at the downstream interoperability point. If the downstream
load in service is the same as that used for determining compliance (i.e., the test load) then the signal
observed in service can be directly compared to the standards requirements. If the downstream load is
different from the test load, then the downstream component bears part of the responsibility for the signal
properties observed at the interoperability point.
A major goal of the methodologies in this document is to achieve an accurate representation of signals at
the precise interoperability points of real systems and to determine the effect of the downstream
component properties on the observed signals. S parameter methodologies are especially suited for
modeling this problem for linear systems.
SPECIFIC
LAUNCH
SIGNAL
(WITH PARASITIC
LOADING
AND POSSIBLY
SOURCE
TERMINATION)
BOARD CONTAINING
FC RECEIVER AND TERMINATION
(FOR COPPER LINKS)
CONNECTOR AT THE INTEROPERABILITY
POINT NEAREST THE TRANSMITTER
RANGE OF APPLICABILITY OF FCSMUSING
CONNECTOR LAUNCH CONDITIONS
T
CONNECTOR AT THE INTEROPERABILITY
POINT NEAREST THE RECEIVER
4.7 Application to measurement
The physical location of the specified interoperability points may not be practically accessible in some
cases due to mechanical constraints of the system. A simple example is a backplane system that uses
disk drives. If the signal at the pad of the FC chip on the disk drive is the desired location but the only
accessible point is on the through pins of the backplane connector then the difference between the signals
measured at the accessible point and the signals existing at the desired point is needed.
One may enable a practical scheme for determining compliance with specifications by accounting for the
difference between the measured signal parameters at physically accessible points and the signal
parameters at the desired physical location of the interoperability point. However, the process used is not
by modifying the observed signal at one point to construct the signal at the desired physical location. The
methodology that works depends on having a valid, accurate model for the link as it exists during the
measurement.
If an accurate simulation of the system exists one can construct an accurate representation of the signal at
any point in the system including the desired point. If an accurate simulation does not exist for the
observable points then attempts to determine signals at other points in the link are invalid and should not
be attempted.
The methodologies in this document do not presently allow direct construction of a new signal at a different
point in the system from the signal that is measured. The process that may be used essentially is that
once the signal at a known point in the system (even if this point is not the desired point) is determined to
be that predicted by the system model then signals at other points in the system may be calculated with
confidence. This is not the same as providing a correction function for the measured signal but it is
significantly better than not having any idea of the error caused by inability to access the desired point.
Another important feature of applying modeling to measurement techniques is knowledge of the sensitivity
of the measurement to the details of the measurement process. For example, how precisely should the
position of a probe be controlled? How much disturbance to the system is being caused by the
instrumentation equipment?
4.8 Relationship between elemental component models, composite component
models, model-elements, and simulation
A simulation is an activity that results in an output that represents a signal. Simulations are done by
bringing together the following ingredients:
)defined input signals / stimulus
)a model for the system of interest
)boundary conditions appropriate for the application
)a simulation tool
and running the tool.
The model for the system is usually a collection of models for composite and elemental components
connected in a way that represents the system. Each composite or elemental component model is
constructed from a set of ingredients, or model-elements. Each model-element is classified as one and
only one of the following:
a)circuit description
b)behavioral description
S parameter (for linear models) [Note: Y parameters and other mathematical transforma-
tions are also included in this category]
Maxwell matrix (R,L,G,C) (for linear models)
Mathematical function (equation / transfer function)
IBIS
Verilog-AMS
Behavioral descriptions specify the functional performance of the part of the component being modeled
without any defined or implied relationship to the actual physical design of the component. Behavioral
models are important when design details are held proprietary.
Circuit descriptions specify the circuit elements (such as resistors, transistors, transmission lines (e.g.
W-element), PCB discontinuity (e.g. vias)) connected in a specified way. Circuit descriptions tend to be
more accurate than behavioral descriptions but intrinsically contain topology details that relate to the
physical part and may contain significant design information.
The behavioral descriptions model-elements have the following properties:
)S-parameters are swept frequency responses where the amplitude and phase of a
sinusoidal signal impressed on one port produces an amplitude and phase response
signal at another port. S-parameters also describe the reflections out of all ports and the
reverse transmissions from outputs to inputs. Linearity of the portion of the component
described by S parameters is assumed and required. The term parameter implies an
entire frequency response curve rather than a single (complex) number (unless only one
frequency is of interest). Small signal responses around specified operating points may
be used in non-linear applications.
)Maxwell Matrix (RLGC) is an ordered array of parameters that apply to circuit elements for a
predefined circuit topology. There is no relation between the circuit topology and the
object being modeled (although the values of the parameters are strongly affected). The
parameters do not depend on the amplitude of the signal. Only linear behavior is
describable with Maxwell Matrices.
)Mathematical description such as a transfer function, a closed form equation, or an empirical
equation
)IBIS descriptions apply to active objects such as transmitters. Parameters are assigned to a
predefined circuit topology (that may contain non-linear portions). There is no relationship
between the physical design topology of the component and the model.
Elemental and composite component models are constructed by connecting one or more of the
model-elements described above.
Composite component models almost always have multiple model-elements though all model-elements
may be of the same type. Since this requires the model-element connection topology to be defined there
is a connection to the design of the component. Composite component models are inherently circuit-like
except for S-parameters.
Elemental component models may or may not be composed from multiple interconnected model-elements.
If an elemental component model has only a single model-element (and therefore only a single model-
element type) the elemental component model can be a purely behavioral model. If an elemental
component model has more than one model-element, each model-element needs to be connected, and
once again a circuit-like topology must be part of the model specification.
Of all the possible elemental or composite component models only the single model-element elemental
component models are truly behavioral. All others have at least some design content contained in the
description of the topology of the interconnection of the model-element.
The simpler the physical construction of the component the stronger the connection between the model
description and the actual design parameters of the component regardless of the type of model-element
used to create the model.
Simulation tools may be constrained to accept only certain types of model-elements. This may require
conversion of a model-element type to an equivalent behavior in another model-element type or selection
of a different simulation tool.
4.9 Specification of the simulation and the simulation environment
When a simulation is executed, many variables and considerations exist. The result of the simulation is a
signal that reflects the collection of the choices made when the simulation is designed. Some of the
variables and considerations are:
1) models used for the components (e.g. type of model, ability of model to generate desired
features such as jitter, thermal noise, high frequency effects, simultaneous switching, multiline
(cross talk), basic accuracy of the component model),
2) range of applicability of the model over all of the all of the conditions experienced during the
simulation (e.g., saturation to a rail)
3) parameters chosen for the models (e.g. temperature, voltage, process corner, frequency, slew
rate, transition time, current level, dielectric properties, conductor properties),
4) properties of the system (ac dc coupled, topology)
5) stimulus applied to simulator inputs (driven waveforms, power/ground noise, initial conditions
chosen)
6) ability of simulation tool (e.g. ability to handle advanced IBIS parameters)
7) accuracy of computation (number of significant digits)
8) method used for solving matrices in the simulation tool (e.g. trapezoidal or gear or the TOL
variable)
Unless all of the details are the same, one should not expect agreements between simulations of the same
link. Accuracy of the simulation may be significantly affected by the choices made. Compliance with
FCSM requires identification of all the details used for the signal simulation. Unless complete adherence to
this sub-clause is achieved it is easy to make a simulation prove almost any point desired. See clause 5
for the results of an experiement conducted to further explore the importance of the specification of details.
4.10 Specification of signals at interoperability points
Probe points are places in the system where a simulation output is expected. If the probe point coincides
with a defined interoperability point then direct comparison with standards requirements is possible.
Probe points in models are not necessarily physically accessible. In many cases elemental or composite
models require a boundary at the probe point. Some tools distinguish between physically accessible and
inaccessible probe points and also define whether the point is an input or an output.
Model validation is only possible at physically accessible probe points.
4.11 Transmitter signals, interconnect, and receivers that contain compensation
properties (equalization)
4.11.1 Compensation
Compensation is the attempt to mitigate the deleterious effects occurring during signal transmission by
adding or subtracting features from the signal. Compensation may be executed in the transmitter device
(typically in the transmitter chip), in the interconnect, in the receiver device (typically in the receiver chip).
Compensation may be applied to properties of the signal that depend on the specific data pattern and to
properties that are predictable upon subsequent use such as line to line propagation time skew. The basic
assumption for compensation is that the degradation intensity and type remains stable over periods of at
least several bit times.
Compensation schemes that can adjust the parameters of the compensating mechanism are termed
"adjustable". Compensation schemes that use active circuitry are termed "active". Compensation
schemes that pass the signal through a transfer function are termed "filtered" or "equalized", the latter
being derived from the common practice of matching the transmission losses across part of the frequency
spectrum. Adjustable schemes that change the parameters of the compensating mechanism as a result of
the specific application are termed "adaptive". It is usually assumed that adaptive schemes will use some
sort of automatic means to do the adapting.
When compensation mechanisms are used in the transmitter device or in the receiver device it is
necessary to use a reference load or a reference receiver respectively to emulate the effects of the
compensation. The signals coming out of the reference load or the reference receiver contain the net
effects of the compensation in the signals and allow the eye pattern methodology for specifying
compliance even if the signals coming into the reference load or reference receiver are closed.
The mechanisms of degrading signals fall broadly into two modes: (1) primary losses in the transmission
path during transmission such as attenuation, reflections, and resonances and (2) secondary losses due to
causes that are external to the transmission path such as crosstalk noise. In some cases the secondary
losses may exceed the primary losses. Losses may be amplitude or timing precision or both.
Details concerning the important differences between the location of the compensation are explored in the
following sub clauses.
4.11.2 Transmitter compensation
Any compensation scheme that is implemented in the transmitter must either (a) make assumptions
concerning the nature and intensity of the degradation that occurs during the transmission or (b) have
some sort of feedback from the receiver that allows adjustment of the parameters of the compensation
scheme in the transmitter device. If feedback is used then the feedback shall originate after the reference
load.
When transmitter compensation is used, the results are visible in the signal launched from the transmitter
device. However, it may be necessary to use special methods to determine the quality of the signal from
the transmitter device since the compensation process may significantly alter the signal.
The general method for modeling transmitter device compensation is to pass the transmitted signal
through a transfer function (reference load) that emulates the loss mechanism and loss intensity for the
interconnect attached to the transmitter before examining the signal. One measurement set up for such a
methodology is shown in Figure 8.
Figure 8 - Measurement set up for evaluating transmitters
Clause 4.6.2.7 points out that special considerations are required for models of transmitter devices that
incorporate compensation.
4.11.3 Interconnect compensation
If compensation is incorporated into the interconnect itself then the model for the interconnect includes the
compensation and no special treatment is required.
4.11.4 Receiver compensation
Figure 9 shows the basic scheme used to address receiver devices that incorporate compensation. The
receiver device or receiver chip is evaluated based on its ability to produce small error rates with a
minimum quality incoming signal. Since the port with the receiver chip (the receiver device) processes the
signal internally, the observed signal at the connector needs to be reconstructed to emulate the internal
signal in the receiver device at point "A" after the effects of the compensation are applied. Point "A" may
be inside the receiver chip if the compensation is done internal to the chip. This signal reconstruction is
done by passing the signal measured at the connector through a compensation function emulator
(reference receiver) used by the receiver device before evaluating the signal. This reference receiver may
or may not be specified in a way that indicates implementation details for the actual receiver device. The
purpose of the reference receiver is to all exactly the same methodology for specifying the signal
performance for all users and in a way that is independent of any particular receiver device design.
The signal at point "A" in Figure 9 is sought for signal output testing. If a model of the entire link is used
then the signal at point "A" is available by placing a signal simulation point at "A".
For signal tolerance testing of the receiver device the resulting signal is then adjusted to have the
properties of a minimum quality signal, the signal measuring instrument is disconnected and the signal is
applied directly to the receiver device. The receiver device bit error rate is then measured to determine the
signal tolerance. Bit errors are detected at point "B" after passing through the internal receiver.
MINIMUM ERROR SCHEME FOR TRANSMITTERS THAT MAY
INCORPORATE COMPENSATION
TRANSMITTER
TEST TERMINATOR
PLACED AS CLOSE
AS PRACTICAL TO
THE TRANSMITTER
ORDINARY SAMPLING
OSCILLOSCOPE
TRIGGERED ON THE
SAME PART OF THE
REPEATING PATTERN
DIGITIZED REAL TIME
WAVEFORM**
SOFTWARE
SYNTHESIZER
E.G. OCULUS OR ICONNECT
MATHEMATICAL
DESCRIPTION OF
COMPLIANCE
INTERCONNECT
OUTPUT EYE
REPEATING
PATTERN
E.G. K28.5*
* NOTE THAT CJTPAT AND SIMILAR COMPLEX DATA PATTERNS ARE
NOT REQUIRED
**COMPLETE DETAILED WAVEFORM RESULTS -- SEE MJS ANNEX 9.2.8
The effect of the compensation is easily seen by simulating a link with no compensation function in place.
Note that it is required that the behavior of the essential performance parts of the internal compensation
function be known.
Figure 9 - Measurement set up for evaluating receivers
4.12 Approaches to creating component models
4.12.1 Create the model from samples of physical components
4.12.1.1 Behavioral extraction from a linear component
This approach requires measurement of a sample of the physical component with subsequent conversion
to some behavioral form. For example a cable assembly is measured by a vector network analyzer to yield
a complete Sij matrix set. Note that this process is both a valid measurement of the properties of the
sample and a model extraction scheme.
4.12.1.2 Fitted circuit parameters
In this approach start with a known circuit topology either from design information or knowledge of the
physical construction and create a starting point model. Then simulate a signal and compare to a
measurement of the physical part. Change the model parameters, remodel and re measure until adequate
agreement between the simulation and the measurement exists.
The iteration process could start with no known parameters. In that case it is a pure iteration or the iteration
process could start with a set of supplied parameters for the type of component and the iteration produces
a more accurate model for the specific component used for measurement. The latter is an optimization.
GENERAL MEASUREMENT CONFIGURATION FOR THE SIGNAL
GOING INTO THE RECEIVER DEVICE THAT USES COMPENSATION
RECEIVER DEVICE
INTERNAL
COMPENSATION
FUNCTION
INTERNAL RECEIVER
SIGNALS
SPECIFIED
AT CONNECTORS
TRANSMITTER
SIGNAL
MEASURING
INSTRUMENT
SIGNAL
SPECS
APPLIED
AFTER
COMPENSATION
EMULATION
HERE
COMPENSATION FUNCTION
EMULATOR (HARDWARE OR
SOFTWARE) WITH MINIMUM
REQUIRED TRANSFORMATION
SIGNAL MEASUREMENT SCHEME
AT RECEIVER DEVICE CONNECTOR
INTERCONNECT
TEST TERMINATOR
PLACED AS CLOSE
AS PRACTICAL TO
THE RECEIVER DEVICE
CONNECTOR
TRANSMITTER
A
A
B
4.12.1.3 SPICE device model
SPICE device models are intended for use with SPICE simulators but may not be a circuit description. In
the SPICE device model a large number of predefined field types, broken down by specific device
attributes are required. The values for these fields are derived from extensive knowledge of the
manufacturing process, device physics and physical structure. The information available from this type of
model allows complete characterization of the device and goes well beyond what is possible with IBIS.
Holders of SPICE device models are frequently reluctant to make them publicly available.
SPICE device models may use measurements from physical parts to create the parameters in the model.
Simulators other than SPICE may be used to create models by the same general methodology.
4.12.2 Creating the model from design information
In this approach the model in created from information such as:
Connectivity net list - e.g. PC boards
Physical layout including materials e.g. trace paths, cable layup
Physical structure including dimensions e.g. oxide thickness, wire diameter, channel length
Physical parameters e.g doping levels, poly resistance, electrical resistance, cable jacket hardness
Manufacturing process
Device physics
All the above require detailed knowledge of the physical design and possibly the manufacturing process
that may not be available to everyone.
SPICE device models may be created from only design information as well as by using measurements on
physical parts.
No measurements are required for creating models from design information alone. Measurements are still
required for validation.
4.13 Practical considerations for creating models
There is an intrinsic trade off between the accuracy of the model and the practical ability to run the required
simulations. In general, the more accurate the model the more resources it consumes for simulation. Even
the use of S-parameters in linear systems, that may appear on the surface to remove many of these
limitations, can produce excessively long simulation times if the complete S-parameter set is used or if
multiple pair interconnects are used where cross talk must be considered.
The resources involved are:
)storage required for the model description
)time required to assemble a complete package for simulation
)time required for executing the simulation
)resources to create the tangible results (e.g. printers)
)resources and time required to interpret the results
Limits (bounds) on parameter values where the model has a specified accuracy is termed a range.
Limiting the range of applicability can be a significant factor in determining the resources required.
The number of probe points can be a major factor in determining the resources required.
The number of probe points and the validity ranges for the models may impact the ability of the simulation
to converge.
Iteration may be required on the parameters of the model in order to achieve acceptable correlation with
measurement and the conditions used to attain agreement need to be rationalized with the known
properties of the system under consideration.
Lines of code required to describe the component model, frequency of use of the same component model
in the same simulation, number of lines used in a multiline model, granularity used, and the number of
details included are all contributors to the resources required to execute the simulation.
In some situations it may not be practical or rational to simulate more complex properties of a link and only
the simple properties may be accessible.
The capabilities of different simulation tools vary widely as do the processing powers of the computing
resources. Often a hierarchy of tools is needed.
One needs to carefully consider the goals of the simulation and to exercise good engineering judgement in
determining the complexity of the model required for the application.
4.14 Relationship between constituents of the modeling environment
The relationships among the various constituents of the modeling environment are depicted in Figure 10.
Figure 10 - Modeling environment
Netlist
Data
Geometric
Data
Experimental
Data
Component
Model Creation
Tools
Extraction
Tools
Component
Models
Simulator
Tools
Output
Possible for Some Simulators
System Level
Simulations
a) experimental data -
data gathered by physical measurements
b) geometric data -
information that describes the physical dimensions and material properties
c) netlist & topology data -
mathematical description of the printed circuit board topology and materials properties
d) extraction tools-
software packages that use geometric data to create a parametric description of the object
e) component model creation tools -
software packages that use either experimental data or the output of an extraction tool to create
the component model
f) component models-
either a behavioral/functional or circuit/SPICE description of a component
g) simulator tools-
software packages that use any or all of the above to produce an output representing signals
h) output-
results from the simulation tool
4.15 Relationship between signal specifications in standards and modeling
In many instances the signal specifications in standards and those used in modeling are essentially the
same. The signal rise time parameters, however, may be significantly different and this difference is
described in this section.
Signal rise time describes the interval required for a signal to rise or fall between two specified limits. The
rise times listed in various specifications (including FC-PI-n) may define threshold limits that differ from
those used by simulation tools. Some interpolation or extrapolation may be required to derive values with
consistent threshold limits. For example, simulation tools may define rise time as the time interval between
the 0% and 100% points from the extrapolated line passing through the 20% and 80% points as shown in
Figure 11. FC-PI defines rise times between the 20% and 80% points. Figure 11 shows the 60% difference
between the two methods of specifying rise time.
Figure 11 - Relationship between FC-PI and modeling rise times
Users are cautioned to be sure that the signal transition durations being modeled correspond to those
specified.
See also sub-clause 7.1.8.5.
4.16 Accuracy and model validation considerations
Accuracy is the quality of freedom from mistake or error -- the degree of correctness that a simulated value
agrees with the true value. Accuracy can only be considered in the context of a validation methodology as
discussed in 4.17.
One method for creating models uses iterative techniques where model parameters are adjusted to fit
known measured parameters. These models are only accurate over the ranges available for the
measured parameters. Other methods use designed properties, possibly at extreme limits, for the model
parameters. Knowledge of the type of model is critical to attaining optimum accuracy in a simulation.
Models may have difficulties when combined with other models in the same simulation because the
boundary conditions for the combination may no longer be in the valid range for the model.
Accuracy of models shall be considered only in context of the entire simulation being executed. See also
sub-clause 7.1 for division of accuracy assignment between models and simulator tools.
In all cases the validation methodology shall be appropriate for the method used to create the model.
0% TO 100% RISE TIME AS DEFINED BY SOME MODELING TOOLS , T
0-100
20% TO 80% RISE TIME AS DEFINED BY FC-PI , T
20-80
T
0-100
= 1.666*T
20-80
0%
20%
80%
100%
T
0
T
20
T
80
T
100
4.17 Component model validation/correlation methods
4.17.1 Overview
Models shall be validated and understood prior to use for FC signal modeling. This clause describes some
considerations for this process.
Validation is the process of determining the agreement between a measurement and a simulation result.
Since validation requires measurement an instrumented system is implied. Instrumentation models shall
be included in the composite model used for the simulation.
The type of measurement shall be specified (e.g. impedance profile, optical power, eye diagram etc.) and
shall match the form used for the simulation output. Validation only applies where these requirements are
met. For example using impedance profile to validate an S21 performance is not acceptable.
A model will only match a typical component if a typical component is what was modeled. If the specific
component used for validation does not actually have typical properties then the quality of the validation
is compromised as is the accuracy of the model for components that are not "typical".
4.17.2 Range of validity
Physical samples are expected to be different from each other because of variations in the manufacturing
process use to make the samples. Models for the component need to consider the extreme limits of the
tolerances in the manufacturing process. This causes a requirement for multiple models each at different
extreme limits.
In addition to manufacturing process variances ranges of static conditions such as temperature, supply
voltage, humidity, bend radius also influence the model and need to be considered.
Further, the dynamic properties of stimuli have allowed ranges for specific models.
Any of these descriptions are treated as parameters for the simulation.
Table 1 summarizes four classes of parameter that require specification for both the simulation (including
the models used) and the physical sample. Accuracy degradation is expected when the simulation
parameters and physical parameters do not match.
Table 1 - Parameter class examples for validation
Manufacturing
process - individual
parameter
Manufacturing
process - collection
of parameters
Static Parameters
Dynamic
parameters
maximum conductor
diameter
slow semiconductor
process
supply voltage minimum rise time
minimum dielectric
constant
fast semiconductor
process
temperature maximum amplitude
maximum trace width minimum impedance humidity
most stressful data
pattern
minimum contact
radius
maximum material
condition
bend radius data rate
minimum oxide
thickness
minimum material
condition
bias levels
maximum poly
resistance
minimum propagation
time
maximum impedance
termination
minimum sheet
resistance
maximum pair to pair
skew
Model accuracy shall be associated with the ranges of parameters that have been validated. If the
parameter ranges are not known and stated the model validation is unreliable.
Methods for executing validation can vary widely. Two examples are described in 4.17.3 and 4.17.4.
4.17.3 Method 1 (simultaneous creation and validation)
Start with known physical parameters for the exact component being measured (a single number without a
tolerance for each parameter), Signal measurements may need to be done before some parameters can
be known due to destructive processes required to acquire the parameters.
The model is adjusted empirically (based on the measurements without regard for underlying physical
principles.) This type of model is only valid over the specified range for the parameters.
4.17.4 Method 2 (validation of extracted parameters for elemental components)
Start with parameters that have been extracted from a design data base (no measurements on the specific
parts being modeled allowed).
Measure the physical parameters for the parts used to create the system.
Compare with the extracted parameters.
4.18 Signal timing reference in simulations
FC signal modeling shall be done with consideration for the use of special signal timing references (also
known as Golden PLLs) in the final presentation of signals. The timing reference to be used for simulations
whose results are represented by eye diagrams shall be derived from the data stream with a golden PLL.
This is required for purposes of estimating compliance with standards. Failure to use the appropriate
signal timing reference may cause serious errors. See MJSQ for a more complete discussion of signal
timing references (termed jitter timing reference in MJSQ).
4.19 Tools
4.19.1 Overview
There are a number of software tools that are useful in developing and using models. These are simulation
tools, parameter extraction tools, and model creation tools. Examples of these tools are included in the
following sub-clauses.
4.19.2 Simulation tools
The following represents a partial list of presently available simulation tools. This list is included as a way
to aid to classifying and selecting tools that may be appropriate for various applications. All tools listed are
intended to be used for analog simulations. The simulation outputs may have many different forms. It is
usually possible to convert between time and frequency domain. The time/frequency domain noted below
refers to the native mode used by the tool.
Circuit based time domain simulators:
SPICE type
HSPICE (most powerful)
Apsim SPICE
Berkeley SPICE
PSPICE
ADS (includes a SPICE, but not HSPICE, engine)
Harmonic balance type
ADS
others exist
Circuit based frequency domain simulators:
ADS
Eagleware
Ansoft
Integrated simulation tools (uses both circuit and behavioral model-elements)
HSPICE
ADS
SpectraQuest (Cadence)
ICONNECT
Oculus
Stateye
Matlab
PCB post-layout interconnect signal simulators (reduced accuracy compared to SPICE/ADS)
Hyperlynx
Viewlogic XTK
3D physical structural simulators (field solvers) - produces circuit or behavioral models
Ansoft HFSS
Agilent EEsof EDA software with ADS (advanced design simulator)
Pices
StarRC
Raphael
Optical system simulators
LinkSIM
Agilent optical spreadsheet (partially for signals, also is an extraction tool) on T11 web site-
(00-197v0 and 00-199v0)
no tool for optical transmitters presently known
no tool for optical receivers presently known
The following are digital logical behavioral simulators and are not intended for use with signal modeling of
the type described in this document. They are listed to reduce confusion.
Verilog
VHDL
HDL
4.19.3 Parameter extraction tools
Maxwell
Maxwell-2D
Maxwell-3D
Pacific Numerix
Agilent optical spreadsheet (partially for parameters, also is a simulator tool) on T11 web site
4.19.4 Model creation tools
ICONNECT
Oculus
Agilent Suite
Ansoft
5 Results from a practical experiment to compare signal simulations using a com-
plex component model
5.1 Description of the experiment
The experiment described in clause 5 was originally designed to produce some quantitative data for
purposes of determining how much difference in the simulated output signals was found when the same
model was used as the starting point. It was found that even more valuable information resulted from the
issues involved with making the model and simulation methods transportable between users. This
additional information is also described in clause 5.
5.2 Description of the complex model
An early representation of the model of a differential transmitter device is shown in Figure 12. This model
is hypothetical and the values shown have not been optimized. The purpose of this complex model is to
better understand the issues involved with specifying such a model, with specifying the models for the
elements of the complex model, doing a signal simulation at two different points in the transmitter device
(point A) and the output, and reporting the results.
Figure 12 - Transmitter device model (differential)
This model consists of several kinds of model element:
Input signal source
Finite impulse response filters (FIR) to equalize the signal
Risetime element (later changed to waveshaping element to capture more of the signal edge proper-
ties)
Lumped passive elements: capacitors, inductors, resistors
S Parameter elements representing transmission lines and connectors
Transmitter device model
(differential)
Z
0
=100 OHM
Chip
C=0.8 pF
Substrate
Bond Pad
C=0.2 pF
Pkg to board
Incl via
C=0.8 pF
TxVia
C=0.4 pF
Assumes inner
Layer trace to
chip pkg
PkgSubstrate (differential)
Z=100 ohm
Instrumentation
termination
Interconnect
Side Via
C=0.4 pF
Input sig: 2**7-1PRBS
Date rate: 8.5 Gbps
Amplitude: 1V pp
No source jitter
Chip Attach
L=0.05 nH
F
I
R

3
t
a
p
0
.
8
1
,

-
0
.
1
5
,

-
0
.
0
4
T
x

c
o
n
n
e
c
t
o
r
Output
signal
Board trace (differential)
S2P, S4P files (Vittel B)
S2P, S4P files (Vittel B)
S2P, S4P files
Tyco/FCI
R
i
s
e

t
i
m
e

2
0
-
8
0
:

3
5

p
s
50 Ohm
Assume that this
block behaves as
an ideal voltage
source
Launch signal
Calibrated into
100 Ohm differential
at this point
Point A
50 Ohm
50 Ohm
The models for each of these elements shall be specified in a transportable way.
5.3 Transportable specifications of the complex component model itself
5.3.1 Overall description of the complex model
The properties of the specification method used in figure 12 is discussed below.
Single ended or differential specification
The model in figure 12 assumed prefect balance but a goal was to retain a full differential specification to
allow for unbalanced cases in the future. There was an issue of documenting the correct value for shunt or
parallel elements. It was decided to use the values as would be correct for the circuit shown - no
conversions should be attempted. This caused an issue for simulators that could not take a pure
differential input because conversions were necessary. A 4x error was easy to produce by using parallel
instead of series assumptons. The conversions to single ended also caused questions about the position
of the ground reference and prevented any results caused by imbalance.
Circuit symbols or blocks
Blocks were chosen because they allow a more complete model than an ideal circuit element. It also left
open the exact specification method for the circuit element.
Meaning of lines
Lines were used to indicate connectivity only. The line indicate ideal, lossless, zero length connections
between model elements. If any electrical impact was needed it was represented by a block.
Physical description of the model elements
Method chosen was to include a verbal description of the object being modeled and requirement to use
clause 8.3 for S-parameter files. Of particular importance here was whether the board via was included in
the connector model or not. This caused a large difference in sumulation results because the via could
easily be double counted or not included at all and the via is a signficant contributor to the results.
Introduction of point A
This was a measurement point designed to verify or characterize the input signal before the down stream
channel effects. This was important for two reasons: (1) to allow a comparison of the relatively simple
launch signal and (2) to determine how much effect the downstream portion was affecting the output. A
problem was experienced because it was not clear whether to report the results at Point A with the overall
model as shown in figure 12 or with the downstream portion replaced by an ideal 100 ohm termination. It
was decided to use the ideal load only but how to document this was never written down.
Port numbering requirements
For the elements described by S-parameters no port numbering scheme was required in figure 12. This
was a bad idea that was corrected later as documented in 6.3.2. Not numbering the ports and not
requiring clear specification of the signal flow direction caused both serious and subtle errors.
5.3.2 Input signal source
The specification of the ideal signal input source did not cause any issues except for simulators that
require a finite amount of Gaussian jitter. In this example no jitter was present in the ideal launched signal
so any introduction of Gaussian jitter for purposes of allowing a specific simulation tool to run was
problematic for those tools.
5.3.3 FIR specification
Transportable specification of the finite impulse response filter didi not cause any problems once the fol-
lowing specification structure was completed:
The difference equation for the FIR filter shall be:
Y(n) = (C0)(x(n)) + (C1)(x(n-1)) + (C2)(x(n-2))
|C0| + |C1| + |C2| = 1
x = +0.5, -0.5 (+0.5 gives a logic 1)
For example if
C0 = 0.81
C1 = - 0.15
C2 = - 0.04
Then we have a de-emphasis signal with maximum p-p value of 1.0.
5.3.4 Waveshaping / risetime
The specification of the rise time turned out to be significantly more complex than originally thought.
Details of this specification method are in 7.1.9.6.
5.3.5 Lumped passive elements
There were no problems attributed to the specification methodology for lumped passive elements.
However, clear specification of whether or not certain lumped passive elements (like a capacitance used to
represent the behavior of a PCB via) were included in models for distributed passive elements was
problematic.
5.3.6 S parameter files
See sub-clause 6.3.
5.4 Final transmitter device specification
Figure 13 shows the final version of the transmitter device model specification.
Figure 13 - Final version of the transmitter device model
5.5 Quantitative results
Figure 14 shows a summary of the final results of simulations on the same transmitter device model
specified as in sub-clause 5.5 using different simulation tools.
The results clearly show a fairly wide range. It is important to realize that the vertical opening is only
around 10% of the launched signal (this particular transmitter device model was not for a good 8GFC
transmitter device design) so this model is more challenging to get agreement than a model with only a
small loss. However, for purposes of this experiment the transmitter device model chosen was nearly
optimal because it shows off the differences. Eye openings in the sub 100 mV range are commonly used
for the higher speed links so this model produces a realistic application from a modeling perspective.
It is not known which, if any, of the simulation results shown are accurate. Agreement between two or
more simulations does not mean that any are correct. If we had some standard reference models where
the correct answer was known independently then some inference of which simulations have the best
accuracy could be made. The key point is that there are significant differences between the simulation
results when using different simulators and that the effective tolerance of the results may be far greater
than may be traditionally assumed for tools that are only math computation engines.
In sub-clause 5.6 a set of additional requirements and actions derived from the overall experiment are
described that aid in reducing the disagreement.
It is clear that use of simulation results for generating specifications and link budgets carries a significant
risk of not being even reasonably accurate or transportable. Consider the case where battles are being
waged over a few mV or a few pS in the link budget. The importance of using the requirements developed
in this document as a minimum for any simulations then becomes apparent.
Figure 14 - Comparison of results at point B for various simulations
5.6 Some additional requirements and actions to create transportables simula-
tions
Analysis of figure 14 and subsequent discussion produced the material in this subclause.
This subclause lists specific requirements and actions whose implementation will reduce the overall
inaccuracy of the simulation results and errors of interpretation.
Adequate detail on the simulation conditions needed or used shall be provided including:
Adequately specifying the object that the model applies to
Boundaries of the elemental models
Simulator version
Simulation methodology (e.g. using HSPICE to create S-parameters followed by a separate
MATLAB to create the eye output)
Probe points
Data pattern
Number of data repeat cycles used
If the simulation tool requires a charge up time to reach steady state, simulations shall be run with
sufficient repetitions of the data pattern so that the eye opening does not change by more than x%
after a doubling of the data repetitions, The value of x depends on the intended use for the simulation
and may be in the range of 1%.
Results depend on
number of passes
varies varies varies HSPICE2
No identified difference
from ADS 1
40 51 142 ADS 2
Unknown
Unknown
Many
80
1
1
1
1 (only 1 required
because of the 2-step
process used)
Number of passes on
input data pattern
before recording
results (127 bits/pass)
41 125 Agere prop
66 157 FCI prop
Cannot use 2**7-1,
Cannot use 8b10b,
Cannot do 0 launch jitter
0
(closed)
0
(closed)
Stat eye (rev not
specified)
37 143 SI 630 Cadence
After correcting FIR
conversions older
release
48 133 Occulus 2
Newest release of
Occulus
50 115 Occulus 1
Repetitive input signal ~38 ~100 ADS 1
Used HSPICE to generate
S parameters then used
MATLAB to generate
eyes
34 105 HSPICE1
Comments Horiz
Opening
(ps)
Max
Vert
opening
(mV)
Performance at
point B output
Conversion between differential and single ended should be done very carefully. In particular parallel/
series element combinations are easy to do wrong. Check and recheck to ensure that the correct con-
version was done.
It is easy to make mistakes setting up the S-parameter files
Extreme care is advised - watch the port numbering schemes for the S4P files especially if S
parameter mode conversions are done
Identification of the file entries should be in the files either by stating compliance with Touch-
stone format or by specific identification of row and column entries
Any comparisons for composite S4P files shall be done using only the lowest common frequency
range in the original files.
When creating composite S4P files from independently supplied elemental models the composite file
may cover the entire frequency range in all elemental models used for the composite file. It is expect-
ed that the tool used to create the composite file will adjust frequency steps and add points as required
to render the composite model valid. This issue is not presently well understood and may be a sig-
nificant source of error that varies with the elemental models and the simulation tool.
For simulators that do not have built in Gaussian shaping functions a circuit shall be used to generate
the specified Gaussian shapes.
Conversion of FIR difference equations for use with specific simulators should be checked and re-
checked. One should verify that the FIR is behaving properly by observing the eye and waveforms.
For example, the launch amplitude at point A should match the known launch.
Inability of some simulators to accept 8b10b encoded data and PRBS data may prevent using these
tools for compliance purposes.
Methods for setting the bit time boundaries shall be clearly specified and can be a significant source
of error.
Methods for measuring the eye openings (max opening, bit center, etc.) shall be clearly specified and
can be a significant source of error.
Identification of the elemental files used in composite models shall be clearly specified. This can be
a problem when there are multiple files for the same element, such as when multiple connector sup-
pliers provide files for their connectors.

The frequency content of the data pattern used in the application shall be considered in conjunction
with the frequency range required for the elemental S4P files. The lower frequency limit (LFL) is de-
termined by:
LFL (Hz) = 2/(bit time * number of bits in the repeating pattern
)
For CJTPAT for 8GFC LFL is 6.25 MHz. The S4P files should therefore have data points
at or below 6.25 MHz.
For PRBS 2**7-1 at 8GFC LFL is 133.86 MHz
Creating and using a web site for models is more complex than it may appear. The issues experienced in
this experiment were simple technically and involved mostly clear identification of and description for the
files - especially for composite files.
It is difficult to overspecify the details applying to the simulation conditions desired (required) by the
application. Similarly, it is difficult to overspecify the details applying to the simulation conditions and
assumptions used by the simulation tool.
6 Model-element descriptions
6.1 Overview
This clause describes the basic structure of the model-element types. See 4.8 for preliminary descriptions
and a general overview.
Model-elements are only one of the following:
a)circuit description
b)behavioral description
S parameter (for linear models) [Note Y parameters and other mathematical transforma-
tions are also included in this category]
Maxwell matrix (R,L,G,C) (for linear models)
Mathematical function (equation / transfer function)
IBIS
Verilog-AMS
Behavioral descriptions specify the functional performance of the part of the component being modeled
without any defined or implied relationship to the actual physical design of the component. Behavioral
models are important when design details are held proprietary.
6.2 Circuit description
Circuit descriptions specify the circuit elements (such as resistors, transistors, transmission lines (e.g.
W-element), PCB discontinuity (e.g. vias)) connected in a specified way. Circuit descriptions tend to be
more accurate than behavioral descriptions but intrinsically contain topology details that relate to the
physical part and may contain significant design information.
For circuit descriptions the key issue is defining the values of the circuit elements, the placement of these
circuit elements in relation to each other, and the value of the circuit parasitics. A SPICE-like model
constructi on i s used for ci rcuit model-el ements. Detai l concerni ng the constructi on of ci rcui t
model-elements varies with the tool used. Consult the documentation for the tool for details on syntax and
formats required.
6.3 Behavioral description - S- parameters
6.3.1 Overview
There are several forms of parameter that may be used to make a behavioral model-element for portions
of components that behave linearly with respect to signal stimuli. Conversion between these different
forms is a straightforward mathematical exercise so it is not necessary to describe more than one in any
detail. The focus in this document is on the most common type, S-parameters.
S-parameters are swept frequency responses where the amplitude and phase of a sinusoidal signal
impressed on one port produces an amplitude and phase response signal from another port. Linearity of
the portion of the component described by S-parameters is assumed and required. The term parameter
implies an entire frequency response curve rather than a single (complex) number (unless only one
frequency is of interest). Small signal responses around specified operating points may be used in
non-linear applications.
The definition of S-parameters may take on different forms depending on whether single ended or
differential si gnal s are involved. Fi gure 15 shows the four singl e ended / two differential port
representation used to define the linear parameters. This figure may be extended to n single ended / 0.5 n
differential ports for a more general description.
Notice that the physical representation where each port has a single wire and the mathematical
representation where each port is viewed as having an incoming signal and an outgoing signal are
significantly different from the schemes used where only the voltage level is specified with no direction of
signal propagation implied. This also applies to currents even though the net current may have a direction
at a port. This net current can be formed from current signals propagating in each direction.
Figure 15 - Basic "Black Box" with four single ended ports or two differential ports
V1 = VA1 + VB1 where VA1 is the amplitude of the inbound voltage signal and VB1 is the voltage
amplitude of the outbound voltage signal on port 1. Current at each port is treated in the same way.
Similar comments apply to the other ports.
Consult standard references for conversion between S-parameters and other linear forms such as
impedance or admittance.
Figure 16 - Single ended S-parameter matrix form
Much of high speed electrical signal modeling is directed to balanced differential schemes that require a
more complex description of S parameters where both the differential and common mode signals are
addressed.
PHYSICAL BLACK BOX
1
2 4
3
V
2
V
3
V
4
GROUND REFERENCE
MATHEMATICAL BLACK BOX
1
2 4
3
V
1
= V
A1
+ V
B1
V
A1
V
B1
V
A2
V
B2
V
A4
V
B4
V
A3
V
B3
Numbers are used to identify terms in this figure and do
not represent requirements on port numbering in general
V
B1
V
B2
V
BN
S
11
S
12
S
1N
S
21

S
N1
S
NN
V
A1
V
A2
V
AN
=
One may derive differential and common mode S parameters by careful mathematical manipulation of the
single ended S parameters. Suppliers of modeling tools incorporate these conversions into their
instruments and it is not necessary to present all the detail in this document. Details are presented, for
example, in Bockelman and Eisenstadt, IEEE transactions on microwave theory and techniques, V 43, No
7, p 1530 (1995).
6.3.2 File specification requirements
See SFF-8414 for file specification requirements and for S-parameter nomenclature.
6.3.3 Self consistency tests
Self consistency tests are those that attempt to determine whether fundamental properties actually exist in
the S-parameter files. Two common examples of self consistency tests are passivity and causality.
Passivity is the property of not having gain greater than unity at any frequency. Causality properties relate
to the timing of the output related to the input. Causility is basically the requirement that no output can
occur before a time related to the propagation time across the element.
There are presently no standardized methods for defining self consistency tests on S-parameter files.
Some self consistency tests have been defined for use on the T11 modeling page but these are only an
attempt to prevent files with gross errors from being posted.
6.4 Behavioral description - RLGC matrix (Maxwell matrix)
6.4.1 Overview
Maxwell Matrix (RLGC) is an ordered array of parameters that apply to circuit elements for a predefined
circuit topology. There is no relation between the circuit topology and the object being modeled (although
the values of the parameters are strongly affected). The parameters do not depend on the amplitude of the
signal. Only linear behavior is describable with Maxwell Matrices.
One can always construct a Maxwell matrix from a circuit model but the converse is not always true.
Maxwell matrices are strictly behavioral. Sub clause 6.4 describes the basics of the Maxwell Matrix
methodology.
6.4.2 RLGC matrices for general construction
The general construction of a Maxwell Matrix is shown in A single conductor examplefigure 17 for a signal
conductor case. Note that this case is a degenerate matrix where only a single element exists in the matrix
for each parameter type.
Figure 17 - A single conductor example
A two conductor case is shown in A two conductor examplefigure 18. In this case mutual terms arise and
the matrices for each parameter type become 2x2 for a total of 16 values (matrix elements) required to
describe the model.
Figure 18 - A two conductor example
A larger number of conductors produces matrices whose size directly scales with the number of
conductors.
The matrix elements are expressed in per unit length. It is assumed that the user of the model knows the
lengths of interest and will integrate across those lengths in the simulation.
The examples in figure 17 and figure 18 are mathematical abstractions and may not exist physically as
shown in these figures. As seen in the example of an 11 conductor Maxwell Matrix shown in 6.4.3 some
values of the elements may be negative (clearly not physically realizable as resistors, capacitors, or
inductors).
Figure 19 shows an example of a four conductor system over a ground plane wherein there are three
separate sets of matrices required to describe the behavior. One set is used for each of the three regions
shown: 1, 2, and 3. Each matrix set is applied (integrated) for the appropriate distance. Finally all three
sets are concatenated to produce the model. This concatenation process is not described in FCSM.
Figure 19 - A three region example
6.4.3 An 11 conductor example
A specific example of a Maxwell matrix is described for a micro strip construction with 11 conductors. The
numerical properties of this example are described in table 2. Only a single region is assumed in this
example.
Refer to General configuration for an 11 conductor PCBfigure 20 for the abstract physical relationship
between the conductors and the ground. In General configuration for an 11 conductor PCB figure 20 the
conductors are shown equally spaced but equal spacing is not assumed.
Table 2 - Numerical properties for the 11 conductor example
Property Value
Frequency 532 MHz
Relative Dielectric Constant 4.300
Trace width 0.0040"
Minimum trace separation 0.0060"
Trace Thickness 0.002700"
Ground Thickness 0.001350"
Dielectric Thickness 0.004000"
1
2
3
Figure 20 - General configuration for an 11 conductor PCB
The general form for the 11 conductor matrix for capacitance, inductance, resistance and conductance is
shown in figure 21.
Figure 21 - Maxwell matrices for the 11 conductor example
The following is an actual listing of a Maxwell Matrix model.
In this example the model has no G matrix since the frequency is not high enough to produce significant
dielectric losses and leakage between conductors is negligible. If either dielectric loss tangent effects or
leakage were to be included the G matrix would follow the same format.
CMATRIX (F/mil) =
[C
1,1
to C
1,11
]:
1 2 3 4 5 6 7 8 9 10 11
GROUND PLANE
EXAMPLE OF A CROSS SECTION OF A POSSIBLE
11 CONDUCTOR COLLECTION
[R]
I,J
=
R
1,1
R
1,2
R
1,11
R
2,1
R
11,1
R
11,11
[L]
I,J
=
L
1,1
L
1,2
L
1,11
L
2,1
L
11,1
L
11,11
[G]
I,J
=
G
1,1
G
1,2
G
1,11
G
2,1
G
11,1
G
11,11
[C]
I,J
=
C
1,1
C
1,2
C
1,11
C
2,1
C
11,1
C
11,11
2.316e-015 -2.046e-016 -1.879e-017 -7.747e-018 -5.090e-018
2.581e-018 1.423e-019 4.320e-020 -3.914e-021 -4.426e-021
-1.107e-022
[C
2,1
to C
2,11
]:
-2.046e-016 2.345e-015 -2.016e-016 -1.758e-017 -6.955e-018
-5.483e-018 2.560e-018 1.367e-019 5.090e-020 -5.145e-020
2.069e-021
-1.879e-017 -2.016e-016 2.345e-015 -2.015e-016 -1.748e-017
-7.002e-018 -5.486e-018 2.560e-018 1.465e-019 -1.574e-020
-4.214e-020
-7.747e-018 -1.758e-017 -2.015e-016 2.345e-015 -2.014e-016
-1.750e-017 -7.002e-018 -5.483e-018 2.583e-018 -1.401e-020
-6.056e-022
-5.090e-018 -6.955e-018 -1.748e-017 -2.014e-016 2.345e-015
-2.014e-016 -1.749e-017 -6.981e-018 -5.299e-018 1.329e-018
1.563e-019
2.581e-018 -5.483e-018 -7.002e-018 -1.750e-017 -2.014e-016
2.345e-015 -2.015e-016 -1.766e-017 -8.369e-018 4.037e-018
7.046e-020
1.423e-019 2.560e-018 -5.486e-018 -7.002e-018 -1.749e-017
-2.015e-016 2.345e-015 -2.015e-016 -1.745e-017 -9.754e-018
4.236e-018
4.320e-020 1.367e-019 2.560e-018 -5.483e-018 -6.981e-018
-1.766e-017 -2.015e-016 2.345e-015 -2.014e-016 -1.754e-017
-9.083e-018
-3.914e-021 5.090e-020 1.465e-019 2.583e-018 -5.299e-018
-8.369e-018 -1.745e-017 -2.014e-016 2.345e-015 -2.017e-016
-1.895e-017
-4.426e-021 -5.145e-020 -1.574e-020 -1.401e-020 1.329e-018
4.037e-018 -9.754e-018 -1.754e-017 -2.017e-016 2.345e-015
-2.046e-016
-1.107e-022 2.069e-021 -4.214e-020 -6.056e-022 1.563e-019
7.046e-020 4.236e-018 -9.083e-018 -1.895e-017 -2.046e-016
2.316e-015
Notice that there are negative capacitances in many values. Negative capacitance is not consistent with
real circuit models but is fine for the behavioral Maxwell Matrix method. Also notice that the matrix has
symmetry around the diagonal (for example C12 = C21). Similar comments apply to the LMATRIX and the
RMATRIX.
LMATRIX (H/mil) =
8.737e-012 1.767e-012 5.808e-013 2.601e-013 1.461e-013
-1.001e-014 -3.941e-015 -1.401e-015 -3.715e-016 3.834e-017
9.696e-018
1.767e-012 8.652e-012 1.742e-012 5.701e-013 2.544e-013
1.465e-013 -9.868e-015 -3.898e-015 -1.406e-015 1.172e-016
2.982e-017
5.808e-013 1.742e-012 8.643e-012 1.738e-012 5.680e-013
2.545e-013 1.466e-013 -9.859e-015 -3.920e-015 -6.336e-016
1.045e-016
2.601e-013 5.701e-013 1.738e-012 8.642e-012 1.737e-012
5.681e-013 2.546e-013 1.466e-013 -9.906e-015 -2.474e-015
-6.557e-016
1.461e-013 2.544e-013 5.680e-013 1.737e-012 8.641e-012
1.737e-012 5.681e-013 2.545e-013 1.465e-013 -7.046e-015
-2.555e-015
-1.001e-014 1.465e-013 2.545e-013 5.681e-013 1.737e-012
8.642e-012 1.738e-012 5.703e-013 2.606e-013 -1.097e-014
-4.197e-015
-3.941e-015 -9.868e-015 1.466e-013 2.546e-013 5.681e-013
1.738e-012 8.641e-012 1.738e-012 5.700e-013 2.666e-013
-1.122e-014
-1.401e-015 -3.898e-015 -9.859e-015 1.466e-013 2.545e-013
5.703e-013 1.738e-012 8.641e-012 1.738e-012 5.721e-013
2.661e-013
-3.715e-016 -1.406e-015 -3.920e-015 -9.906e-015 1.465e-013
2.606e-013 5.700e-013 1.738e-012 8.643e-012 1.742e-012
5.830e-013
3.834e-017 1.172e-016 -6.336e-016 -2.474e-015 -7.046e-015
-1.097e-014 2.666e-013 5.721e-013 1.742e-012 8.652e-012
1.768e-012
9.696e-018 2.982e-017 1.045e-016 -6.557e-016 -2.555e-015
-4.197e-015 -1.122e-014 2.661e-013 5.830e-013 1.768e-012
8.737e-012
RMATRIX (ohm/mil) =
9.798e-004 9.536e-005 3.828e-005 1.916e-005 1.126e-005
7.350e-006 5.150e-006 3.797e-006 2.908e-006 2.292e-006
1.846e-006
9.536e-005 9.803e-004 9.537e-005 3.830e-005 1.918e-005
1.128e-005 7.359e-006 5.157e-006 3.802e-006 2.909e-006
2.290e-006
3.828e-005 9.537e-005 9.796e-004 9.542e-005 3.832e-005
1.919e-005 1.128e-005 7.364e-006 5.159e-006 3.802e-006
2.906e-006
1.916e-005 3.830e-005 9.542e-005 9.807e-004 9.540e-005
3.832e-005 1.919e-005 1.128e-005 7.364e-006 5.156e-006
3.794e-006
1.126e-005 1.918e-005 3.832e-005 9.540e-005 9.794e-004
9.542e-005 3.833e-005 1.919e-005 1.128e-005 7.359e-006
5.148e-006
7.350e-006 1.128e-005 1.919e-005 3.832e-005 9.542e-005
9.808e-004 9.542e-005 3.832e-005 1.919e-005 1.128e-005
7.347e-006
5.150e-006 7.359e-006 1.128e-005 1.919e-005 3.833e-005
9.542e-005 9.794e-004 9.540e-005 3.832e-005 1.918e-005
1.126e-005
3.797e-006 5.157e-006 7.364e-006 1.128e-005 1.919e-005
3.832e-005 9.540e-005 9.807e-004 9.542e-005 3.830e-005
1.916e-005
2.908e-006 3.802e-006 5.159e-006 7.364e-006 1.128e-005
1.919e-005 3.832e-005 9.542e-005 9.796e-004 9.537e-005
3.827e-005
2.292e-006 2.909e-006 3.802e-006 5.156e-006 7.359e-006
1.128e-005 1.918e-005 3.830e-005 9.537e-005 9.803e-004
9.536e-005
1.846e-006 2.290e-006 2.906e-006 3.794e-006 5.148e-006
7.347e-006 1.126e-005 1.916e-005 3.827e-005 9.536e-005
9.798e-004
6.5 Behavioral description - mathematical function
A mathematical function is a mathematical description such as a transfer function, a closed form equation,
or an empirical equation. Mathematical functions may or may not be linear. This method is perhaps the
most conventional method but difficulties with deriving closed form functions for the complex systems
needed for FCSM limit the applicability of this method.
Another drawback to mathematical modeling is that it tends to ignore reflections from ports and reverse
transfer characteristics. This causes difficulty with cascading component models.
6.6 Behavioral description - IBIS
IBIS descriptions may apply to active objects such as electrical transmitters or passive objects such as
cable assemblies. Parameters are assigned to a predefined circuit topology (that may contain non-linear
portions). There is no relationship between the physical design topology of the component and the model.
IBIS is not applicable to optical transmitters.
IBIS models provide a standardized way of behaviorally representing the electrical characteristics of a
devices pins, input, output, or I/O buffers (buffer is the IBIS terminology for transceiver), that is, without
revealing the underlying circuits structure or process information. This clause explains how to gather the
information required to produce a IBIS model for a transceiver. It does not apply to terminators or
connectors. It also describes the hazards to avoid when developing the IBIS file. IBIS models may be
created from the information obtained by direct measurement of the device itself or transistor level
simulation of the device. This clause defines both methods.
Note that IBIS 3 does not support pre-emphasis or any other scheme where the signal properties depend
on the data pattern. IBIS 4.0, that is currently under development, may address this issue. Check the IBIS
web site (http://www.eigroup.org/ibis/ibis.htm) for the latest status. Applications requiring support for
pre-emphasis are encouraged to consider the Verilog-AMS technology (http://www.eda.org/verilog-ams)
as another alternative for creating behavioral models.
The information in an IBIS file facilitates the exchange of behavioral data. It is in ASCII format and
includes the data needed to model a devices input, output and I/O buffers. This information includes the I/
V (current vs. voltage) and switching (V/s) characteristics. The file also includes the electrical
characteristics of the package.
An output or I/O pin is characterized from the following information:
a) the output I/V characteristics when the output is logically low,
b) the output I/V characteristics when the output is the logically high,
c) the output I/V characteristics when the output is forced below ground and above the power supply
rail,
d) the time it takes a buffers output to switch logic states, and
e) the buffers output capacitance.
An input pin is characterized from the following information:
a) the buffers input I/V characteristics,
b) the buffers characteristics when the input is forced below ground and above the power supply rail,
and
c) the buffers input capacitance.
This information is described through the use of keywords that are recognized by being surrounded by
square brackets. They are followed either by specific parameters or tables of data. Keywords may be
either required or optional. An IBIS file contains, at the minimum, the following information, data and
keywords:
a) information about the file itself and name of the device being modeled is contained under the
keywords [IBIS Ver], [File Name], [File Rev], [Component] and [Manufacturer];
b) information about the packages electrical characteristics and the pin to buffer model mapping is
contained under the [Package] and [Pin] keywords;
c) the [Model] keyword introduces the data set required to model each unique input, output and I/O
buffer of the device. The buffer I/V curves and switching characteristics are contained under the
[Pullup], [Pulldown], [GND clamp], [Power Clamp] and [Ramp] keywords. The parameters speci-
fying the buffer type - input, output, I/O, open drain, etc. - and its input or output capacitance are
contained under the [Model] keyword.
7 Transportable models
7.1 General requirements
7.1.1 Overview
Transportable models are those that are intended for multiple users that may have different simulation
tools. An important example where transportability is very important is where models are used as part of a
performance specification in a standard like a compliance interconnect or a reference transmitter device.
Manufacturers of FC components are encouraged to make transportable simulation models available in a
timely manner to control risk and facilitate useful system design validation. Manufacturers are also
encouraged to make traansportable model development an integral part of their product design process
and to support this model availability from product announcement through end of production.
It is critical to distinguish between accuracy contained in the model itself and accuracy caused by the
simulation tool. Many, if not all, simulation tools need to make certain modifications to the models in order
to allow the simulation to run. An example of such a modification is where the model is expressed in terms
of multiple S-parameter files but the exact frequency range, start and stop frequencies, and frequency step
size are different for each file. In order for the simulation tool to combine these files into a useable form it
will likely be required to convert the original files to a common frequency range, common start and stop
frequencies and common step size. This conversion process can cause errors and can cause self
consistency flags, like passivity and causality, to be raised even if the original files were error free.
It depends on the accuracy required whether changes to the original files are tolerable. The important
point here is that the original models accuracy is measured only in terms of how well it represents the
object being modeled. Any accuracy effect that results from conversions made by simulation tools must be
assigned to the tool - not to the model.
All models shall conform to the requirements of sub-clause 7.1.
7.1.2 Documentation
All transportable models shall include documentation that contains the following information:
a) model name,
b) model supplier,
c) model version,
d) brief revision history,
e) model class description,
f) format (IBIS, HSPICE, S-parameters, Maxwell matrix, etc.)
g) port identification (name, number, single ended, differential, signal flow direction)
h) detailed description of the physical entity whose behavior the model describes
i) detailed identification of the physical interfaces associated with each port
j) model limitations, dependencies, or both,
k) model creation methodology (measurement, physical data base extraction, functional design)
l) special instructions (if any) regarding use of the model or interpretation of the results,
m) range of validity
n) statement of where in the manufacturing distribution or design tolerance range the model applies
o) validation method,
p) model support contact information
q) license requirements and contacts for executing the license.
Additional information may be needed for each class of model and is described in the appropriate clause.
This information shall accompany the model and shall be contained in a separate ASCII text (*.txt) or
Portable Document Format (*.pdf) file.
Equivalent circuit descriptions shall be contained in one or more ASCII text files. All SPICE model and
library files shall contain the model name, model supplier, model version, revision history, limitations, and
special instructions as part of the file.
All other textual documentation shall be contained in one or more ASCII text or Portable Document Format
files. Graphical information (such as measurement and simulation results) may be contained in one or
more Windows Metaformat (*.wmf) or Joint Photographic Experts Group (*.jpg) files.
The model shall also include an ASCII file named packlist.txt that contains a list of all the file names that
belong to the model along with a brief description of the contents of each file. Complete model packages
shall have all files grouped and compressed into a single file in both PC (*.zip) and Unix (*.tar) file formats.
Fogg has published a document that contains additional information relating to identification and use of
component models (T11/06-459v1).
7.1.3 Model Name
To avoid duplication of names and possible confusion, it is recommended that the model name, as a
minimum, be some variation of the suppliers part number. Additionally using the model suppliers vendor
ID string before the model name provides even better identification.
7.1.4 Model class
All models shall be defined as one of following two classes:
a) circuit
b) behavioral
7.1.5 Port identification
Model ports shall be identified by an unambiguous scheme. Unfortunately, there are a multiplicity of
methods used in common practice as shown in figure 22.
Figure 22 - Different schemes for identifying model element ports
For the elements of primary interest to Fibre Channel signals an element with four single ended ports is
most likely used in a differential signaling application. In order to focus on a single port identification
scheme one of the views in figure 22 needs to be chosen. FCSM-2 has chosen In+, In-, Out+ and Out-
convention for the following reasons:
Intrinsically includes the main signal flow direction
Clearly identifies which ports are associated with the differential and common mode pairs
Does not imply a specific use for the ports (like being connected directly to a transmitter device for
example)
Does not imply a specific type of instrumentation (VNA or TDNA).
Assignment of port numbers (for purposes of identifying S-Parameter subscripts for example) is an
additional required secondary identification that shall be included with the model description for any model
that uses numeric port syntax. See
7.1.6 Model boundary
The model boundary defines the interface where the model-element joins another model-element. Signals
can be simulated at the model boundary. Unfortunately, this simple sounding definition can become very
complicated in practice due in part to the differences between the way the model-element appears when it
is separated from the system (state 1) and the way the model-element appears when it is part of a
composite model (state 2).
There are fringing fields in the electrical neighborhood (see SFF-8410 for a discussion of electrical
neighborhood) of the physical boundary of the model-element that can be very different in the two states.
Another way to look at this issue is to consider these fringing fields as interactions across the physical
boundary. This is similar in many ways to the interoperability penalty described in SFF-8429 where
interactions across interoperability points due to finite return losses confound the simple creation of link
budgets.
Port (pinout) identification conventions five different views:
View 1: Ports are identified according to the VNA port numbering scheme
(Agilent numbers shown, other numbers may be used for other instruments)
View 2: Ports are identified according to the TDNA channel numbering
scheme
View 3: Ports are identified according to the function provided by the device
that is connecting to the element in normal service
View 4: Ports are identified according to the signal flow through the element
View 5: Ports are identified according to conventions using
+SIG and SIG and differential port numbering
Single ended four port elements
1
2
4 3
View 3
Tx+
Rx+
Rx- Tx-
View 4
In+
Out+
Out - In-
View 1 View 2
CH1
CH4 CH2
CH3
View 5
+SIG
+SIG
-SIG -SIG
Diff
Port
1
Diff
Port
2
So the concept of a unique, hard boundary for a model-element is intrinsically an imperfect concept.
Engineering judgement is required to determine where to draw the line.
SFF-8414 considers the problem of defining the boundary between a device under test (DUT) and a
measurement system. This problem is identical in principle to the model to model boundary problem. In
the measurement case it is convenient to define a reference plane that is a physical boundary between
the measurement system (including instrumentation cables, probes and fixtures) and the DUT. The
reference plane is defined by the calibration process for the measurement and is usually not a plane at all.
A goal is to co-locate this reference plane with the desired physical boundaries of the DUT.
The details of the position of the reference plane are important to avoid double counting and excessive
penalty to the DUT or conversely causing the DUT to appear better than it really is. Conventional wisdom
suggests that unavoidable residual errors should make the DUT appear worse rather than better so that
the simulation will be conservative. Unfortunately, what is worse depends strongly on the application. For
example, in the case of simulating a signal output, one direction of deviation from reality may be
conservative. Using this same signal output for a signal tolerance measurement will make the BER appear
better than it would be it the true signal were applied.
The general conclusion is simple: the more accurate the model-element boundary is defined the more
accurate the composite model and simulations using the composite model.
The physical boundary of the DUT is the portions of the DUT that most closely approximate the location of
the calibration point on the reference plane as determined by the calibration method.
One example of defining a model boundary can be seen in the interface between a surface mount
connector and a test fixture or board as shown in figure 23.
Figure 23 - Example of a boundary definition
It is common practice for connector suppliers to include portions of the board in their models which
effectively moves the reference plane away from the pad and onto the trace. This practice has beneficial
Reference Plane Location
Surface Mount
Connector
Surface Mount Board
Calibration point on reference plane
features in that the interactions across the model boundary may be reduced. It might be a conservative
approach, but at the same time it forces part of the performance for the connector to include board features
that may not exist in service.
Moving the reference plane away from the board pad has some important benefits. If the reference plane
is as shown in figure 23 significant interactions across the physical boundary exist between the connector
contact lead and the pad due to capacitive and inductive coupling. Further, the portion of the connector
lead that extends beyond the actual contact point would act as a stub. Both of these effects are mitigated
if the reference plane is moved onto the board trace.
The most important feature of the model boundary specification is that it be clearly described what is
included and what is not. Simply stating that the model includes the board pad is not adequate. A detailed
descripti on of the board desi gn and assumpti ons about the connector to board assembl y (for
understanding how much stub is present, for example) is also required.
Future versions of FCSM-n may address the model boundary issue in more depth.
7.1.7 Model limitations and dependencies
Models shall conform to the requirements specified in 4.5, 4.9, and 4.17.
7.1.8 Model creation methodology
7.1.8.1 Overview
The model creation methodology that shall be used for each model component is defined in the
appropriate clause.
7.1.8.2 Model creation stimuli
When creating models from physical samples, a specified set of stimuli shall be used. The parameters of
these stimuli shall be recorded in the model documentation in the model creation clause. These
parameters include:
a) amplitude
b) timing
c) frequency range
d) rise time
e) precision
7.1.8.3 Amplitude and timing
The general parameters regarding signal amplitudes and timings of the stimulus waveforms shall be as
described in the appropriate standard unless otherwise specified. Note especially the requirements for
timing reference per 4.18.
7.1.8.4 Frequency range
While the spectral content of a FC signal depends heavily on the rise time of the transmitter circuit and may
contain measurable frequency components into the microwave region, for FCSM simulation purposes and
model creation purposes, the frequency range shall be from 10,0MHz to 0.5/minimum STD time inclusive,
unless otherwise specified.
7.1.8.5 Rise time
Signal modeling requires a sensible excitation waveform that is specifyable for its frequency content and is
free from discontinuities in the waveform and its time derivatives. The frequency content is a combination
of the data pattern used at a specified data rate (that has abrupt signal level transitions) and the analog
properties of the signal waveforms. Both data pattern and analog properties require clear and
transportable specification.
The simplest attempt at specifying the analog properties is to introduce a non-abrupt signal edge by using
a PWL (piecewise linear) model. But PWL models have step discontinuities in its slope (the first time
derivative), leading to unreasonably high frequency content (relative to S-parameter files) and likely
simulation instabilities.
The challenge is to smooth the PWL in a specifiable way to get rid of these discontinuities without
introducing inter-symbol interference in the process.
The ideal specification of signal waveshape is known shape and known time between the 20 and 80%
signal levels during a signal edge or transition. Unfortunately the data pattern and data rate can cause
interaction between edges so the actual waveshape cannot be specified independently from the data
pattern.
The approach used in FCSM is to pass the ideal data pattern (at a specified data rate) through a specified
waveshaping element that produces a Gaussian waveshape (as defined by the equation below). The
general specification methodology for waveshape is therefore to specify either the impulse response or the
step response (single step only) for the waveshaping element.
In this case the rise time and the Gaussian function are related by the following equations:
The Gaussian impulse response (time domain) is:
h(t) = exp( -0.5*(t/)2 ) / (*sqrt(2))
Where is related to the rise time, Tr, by:
Tr (20-80%) = 1.6832*
Tr (10-90%) = 2.5631*
To ensure that a Gaussian waveshaping element is used a mathematical statement is required. Do not
attempt to use a physical circuit. The waveshaping element is described by the following S-parameter file:
# HZ S MA R 50
!Use as many frequencies as are needed in the following format:
FREQ 0 0 EXP(-0.5*(2**FREQ*)
2
) 0 0 0 0 0
The element has no reflections and no reverse transmission but is not physically realizable because of its
perfect phase response.
This element shall be placed immediately after the ideal waveform and ahead of the transmitter device
source impedance element.
If the simulator rejects the use of non realizable circuits it may be necessary to synthesize circuits,
S-parameter files, or other forms to use as input. A tenth order low pass Bessel-Thomson filter is a close
approximation.
It is up to the specific simulator to do this conversion and to verify its validity.
Some ISI will be generated by this physically realizable elements step response.
There are several other methods for specifying the signal rise time that could be used by specific
simulators described below with comments about each. This document does not recommend these
methods unless shown to be equivalent to one of the two methods described above. This material is
provided for information only:
Specify the analytical form of the wave
Can generate unintended ISI unless the data rate and the desired rise time have the correct
relationship
Specify a number of points along the time domain signal edge (sampled) e.g., specify a time
domain Gaussian response - typically an FIR filter- as a way to determine these points
Does not allow for and edge to edge interaction or data rate dependency
Creates discontinuities at each point that may have to be smoothed
How to determine the number of points required - hard to get agreement
May create unintentional ISI (slight amounts if done right)
Set the simulator macro values to give a Gaussian waveshape with the desired risetime
Easy to do, but what did you do?
Simulator may not tell you -- could be a way to implement the specified points or could be a
call to a filter, or ...
Requires independent verification that ISI is not generated
Specify an equation in S domain e.g., a transfer function
How to simulate with this input may require translation to a circuit due to simulator
restrictions on model specification input forms
Requires independent verification that ISI is not generated.
See also 4.15 for other requirements on signal rise time.
7.1.9 Model validation
7.1.9.1 Overview
Each model provided shall be validated by its creator to ensure its accuracy. Accuracy is a criterion of how
closely simulation results agree with physical measurements. See 4.17.
7.1.9.2 Accuracy requirements
Accuracy requirements shall be specified by the application.
7.1.9.3 Model validation stimuli
When validating models, a standard set of stimuli shall be used. The parameters of these stimuli shall be
recorded in the model documentation in the model creation clause. These parameters include:
a) amplitude,
b) timing,
c) frequency range,
d) rise time, and
e) precision.
7.1.9.4 Amplitude and timing
The general parameters regarding signal amplitudes and timings of the stimulus waveforms shall be as
described in the relevant standard unless otherwise specified. All signal related timing parameters shall be
measured at the specified signal level.
While the spectral content of a FC signal depends heavily on the rise time of the transmitter circuit and may
contain measurable frequency components into the microwave region, for FCSM simulation purposes and
model creation purposes, the frequency range shall be from 10,0 MHz to 0.5/minimum STD time inclusive,
unless otherwise specified.
7.1.9.6 Rise time
See 4.15 for requirements on signal rise time.
7.2 Specific requirements for S-Parameter models
7.2.1 Overview
S-parameters are often the preferred method for describing linear components and S-parameters are
being incorporated into some signal performance specifications in the industry. It requires care and
attention to detail as described in this subclause, however, to produce valid transportable S-parameter
files. Users of this document are encouraged to be suspicious of any S-parameter descriptions that do not
conform to these requirements.
7.2.2 General requirements for transportable S4P models
7.2.2.1 Overview
SFF-8414 describes many requirements for specifying and measuring S-parameters. The terminology,
relationship between the port numbering and the DUT, calibration point (reference plane) definitions, test
fixture uniformity requirements, shall be as specified in SFF-8414.
The remainder of 7.2.2 describes other requirements.
7.2.2.2 Detailed description of the physical entity described by the model
The physical structure whose performance is represented by the S4P file shall be specified. A drawing or
picture of the physical structure that points out the portion that the model applies to shall be provided.
Examples of details that require description are:
Which portions of test fixtures have been de-embedded
Which portions of the test fixtures are included in the model
For connectors, are vias/pads included? If so provide a detailed description of the vias/pads that are
included.
This is required to ensure that elements are included once and only once and to assess the error caused
by fringing that is different when the link is completely assembled from when the models for the elements
were generated.
Even though the frequency range is explicitly contained within the S4P file a separate statment of the
frequency range shall be specified in the comments embedded in the file and in other descriptions
pertaining to the file.
7.2.2.4 Starting frequency value and frequency step size
If the phase step is more than 360 degrees then there is no way for the simulator to determine how many
rotations occurred between points since only values between 0 and 360 are reported. So clearly, the step
size and starting frequency value should be less than 360 degrees. In addition, some simulators assume
that the shortest path between adjacent phase angles is the correct direction. This assumption can be
incorrect, careful review of the frequency step and phase rotation is required to determine if an error is
present. For example, if the phase is reported as -70 degrees and the next phase is +110 degrees the
simulator would not know whether the phase advanced or retreated by 180 degrees. As long as the phase
change is less than 180 degrees the assumption of shortest phase path is correct. For physically long
elements such as cable assemblies over 5 meters ( approximately 20 ns) the correct assumption is that the
longest phase path between adjacent frequency points is correct.
To ensure that correct usage is executed, both the phase associated with the starting frequency value (the
value closest to D. C.) and the incremental phase associated with the frequency step size shall be less
than 360 degrees (preferably less than 180 degrees). Meeting this criteria is determined from knowledge
of the dielectric constants used in the DUT and the physical length of the DUT.
Another verification method for meeting this criteria is a graphical plot of phase versus frequency over
extended frequencies that shows no discontinuities greater than 360 degrees.
Note that the start frequency practically attainable is determined by the limits of the tool generating the S
parameters. If the attainable start frequency does not meet this criteria then the S4P file may not be
suitable. If the file is submitted then it should be plainly noted in the comments embedded in the file and in
other descriptions pertaining to the file.
7.2.2.5 Extrapolation and interpolation for frequency values
Extrapolation to frequencies below the start frequency (possibly to d.c.) may be required for some
simulators and data patterns. These extrapolations are considered as part of the simulator dependent
simulator accuracy, not as part of the S4P file accuracy. Significant errors are likely in extrapolation to d.c.;
it is recommended to measure d.c. parameters directly.
Interpolation between known frequency values may also be required by some simulators. These
interpolations are considered as part of the simulator dependent simulator accuracy, not as part of the S4P
file accuracy.
Extrapolation to higher frequencies than specified in the S-parameter file is not allowed due to complex
behavior at higher frequencies. Extrapolation to lower frequencies is less error prone due to knowledge of
behavior at D.C.
7.2.2.6 Changes to the data content of S-parameter files
Only the originator of the S4P file is authorized to make any changes in the data content of the file. Any
changes made to correct self consistency errors (such as passivity or causality) or made internally by
simulator tools impact only the accuracy of the simulation - not the accuracy of the model.
7.2.2.7 File format and contents
Use the file specification requirements specified in SFF-8414.
7.2.2.8 Tests for self consistency
Self consistency tests vary with different simulators and are not used to validate the model.
7.2.2.9 Correction of defective files
Correction of files that have failed a self consistency test (simulator dependent) affects only the accuracy of
the simulation from the tool that made the correction. Corrected files shall not be used to validate the
model.
7.3 Component models examples
7.3.1 Overview
This sub clause describes through the use of examples details of how to construct and document
component models. Construction of models that conform to the framework defined in this document is
non-trivial and is not uniformly practiced in the industry. Strict adherence to the definitions and hierarchy is
required. The examples in this sub clause illustrate the use of the definitions and framework.
Composite component models shall contain the following information:
a) composite component model boundary
b) composite component model class (behavioral or circuit - note if any model-element is circuit then
the component model is classed as a circuit model)
c) relative position of all the elemental components required to specify the composite component
d) specification of each elemental component model including its boundary and model-elements
required
e) specification of each model-element.including its boundary, its class, its creation methodology and
a detailed description (including single or multi-line, limits on the validity range, position in
manufacturing process distribution, etc.)
f) composite component model validation methodology
Two examples of component models are partially described in the 7.3.2 and 7.3.3 for a cable assembly
and a host bus adapter board respectively.
7.3.2 Electrical cable assembly - composite component
7.3.2.1 Overview
Electrical cable assemblies are composite components that consist of five elemental components; two
mated connectors, two transition regions, and a bulk cable. This example assumes a round shielded bulk
cable that uses HSSDC connectors.
Each elemental component is modeled by one or more model-elements.
7.3.2.2 Cable assembly model boundary
The boundaries of the cable assembly model are the ends of the contacts on the connectors mated to the
cable assembly on each end. This boundary means that there is a mated connector half on a test fixture
on each end that is not physically part of the cable assembly but nevertheless shall be included in the
model.
7.3.2.3 Cable assembly model class
Although there are no circuit model-elements used this is a circuit class model because the order of
connection of model elements is specified.
7.3.2.4 Relative position of all the elemental components
This cable assembly consists of a mated connector pair, joined to a transition region, joined to a bulk cable,
joined to another transition region, joined to another mated connector pair.
7.3.2.5 Specification of each elemental component model
7.3.2.5.1 Mated connector pair
7.3.2.5.1.1 Elemental component model boundary
The mated connector pair is bounded by the ends of the metal used for contacts where wires or PCBs are
attached. It is assumed that the mated pair is fully seated with any retention torqued to specification.
7.3.2.5.1.2 Model-elements in the elemental component
7.3.2.5.1.2.1 Model element types
A single Maxwell Matrix behavioral model-element is used.
7.3.2.5.1.2.2 Model-element creation methodology
The connector model is created by use of a 3D Maxwell field solver.
7.3.2.5.1.2.3 Model-element detailed description
A multiline model that is valid for currents up to 1 AMP. Uses nominal mechanical dimensions. Assumes
both halves came from the same supplier and 25
o
C.
7.3.2.5.2 Transition region
The transition region is bounded by the ends of the metal used for contacts on the connector and the point
where the bulk cable is undisturbed.
A single S-parameter behavioral model-element is used.
The transition model is created by use of a TDT (full waveform time domain) with subsequent conversion
to parameters using Oculus.
A multiline model that is valid for quad constructions using welded connector termination. Uses nominal
mechanical dimensions and operating temperature.
7.3.2.5.3 Bulk cable
The bulk cable is bounded by the ends of the transition regions on either end.
A single S-parameter behavioral model-element is used.
The bulk cable model is created by use of a TDT (full waveform time domain) with subsequent conversion
to parameters using Oculus.
A multiline model that uses nominal mechanical dimensions and operating temperature. Assumes no
significant bend radius or jacket deformation.
7.3.2.5.4 Composite component model validation methodology
Select a cable assembly and test fixtures that have been verified to actually have nominal mechanical
properties. With the ambient temperature set at 25
o
C and the cable assembly laid out straight perform
TDR and TDT measurements. Use the specified methods to account for test fixture and instrumentation
cables up to the attachment point of the connector on the test fixture.
Compare the measurements to the simulated results.
7.3.3 Host bus adapter board - composite model
7.3.3.1 Overview
A host bus adapter consists of a printed circuit board, a transceiver chip, and passive components. This
board also has a connector attached - see following sub clause.
7.3.3.2 Host bus adapter model boundary
The model boundaries of a host bus adapter are the connector contact attachment to the PCB and the
transceiver chip pads.
7.3.3.3 Host bus adapter model class
Host bus adapter models are classified as circuit models because the order of connection of elemental
components is required and some model-elements are circuit types.
7.3.3.4 Relative position of all the elemental components
The transceiver is joined to the PCB that is joined to the connector. Note the all passive of the PCB
including traces, vias, coupling capacitors, magnetics and all part of the PCB model. There are only two
elemental components in the host bus adapter described - the transceiver and the PCB.
7.3.3.5 Specification of each elemental component model
7.3.3.5.1 Electrical transceiver
7.3.3.5.1.1 Elemental component model boundary - electrical transceiver
The transceiver pair is bounded by the pins of the chip package that contains the transceiver.
7.3.3.5.1.2 Model-elements in the elemental component - electrical transceiver
A single IBIS behavioral model-element is used.
7.3.3.5.1.2.2 Model-element creation methodology - electrical transceiver
The transceiver model is created by the designer of the transceiver using SPICE methods with subsequent
conversion into IBIS format.
7.3.3.5.1.2.3 Model-element detailed description - electrical transceiver
Use a single line model that is valid for signal levels from 200 mV to 3 V. Use fast manufacturing process
corner, high supply voltage corner, and low temperature.
7.3.3.5.2 PCB
7.3.3.5.2.1 Relative position of model-elements in elemental component - PCB
The chip pad is joined to a trace that is joined to a capacitor (PCB pads are included in the capacitor
model) that is joined to a trace that is joined to a connector pad.
7.3.3.5.2.2 Chip pad / connector pad
7.3.3.5.2.2.1 Model element boundary - chip pad / connector pad
Trace connection point to pin of the chip package for the chip pad. The trace connection point to the
connector contact attachment point for the connector pad.
7.3.3.5.2.2.2 Model-element class - chip pad / connector pad
Chip pad and connector pad model elements are circuit class.
7.3.3.5.2.2.3 Model-element creation methodology - chip pad / connector pad
Using a tool like ADS or Spectraquest a circuit model is extracted from the physical design data base.
7.3.3.5.2.2.4 Model-element detailed description - chip pad / connector pad
A simple circuit element derived from nominal dimensions.
7.3.3.5.2.3 PCB trace
7.3.3.5.2.3.1 Model element boundary - PCB trace
From chip pad to capacitor for trace 1 and from capacitor to connector pad for trace 2.
7.3.3.5.2.3.2 Model-element class - PCB trace
PCB trace model elements are circuit class.
7.3.3.5.2.3.3 Model-element creation methodology - PCB trace
Use a tool like ADS or Spectraquest to extract a W element SPICE model from the physical design data
base.
7.3.3.5.2.3.4 Model-element detailed description - PCB trace
A simple circuit element derived from nominal dimensions.
7.3.3.5.2.4 Chip capacitor
7.3.3.5.2.4.1 Model element boundary -chip capacitor
From trace connection to trace connection.
7.3.3.5.2.4.2 Model-element class - chip capacitor
Chip capacitor model elements are circuit class.
7.3.3.5.2.4.3 Model-element creation methodology - chip capacitor
Use a tool like a vector network analyzer to measure over a frequency range a selection of physical parts
to determine a typical frequency response at room temperature. Synthesize a simple RLC circuit to
represent the component.
7.3.3.5.2.4.4 Model-element detailed description - chip capacitor
A simple circuit element representing room temperature behavior of a typical part.
Annex A - Model database format
A.1 Overview
A format for a model database is described in this annex. It is intended that the FC community use this
format as the starting point for collecting modeling information.
Complete modeling information may not be directly maintained in the database that uses this format due to
requirements of licensing and maintenance. The format is intended to allow links to vendor sites where the
information is maintained as well as directly providing some basic information.
A.2 Database format
The database should contain the following information for identifying each model:
1) vendor name
2) product type
3) generic name
4) description
5) model name/number
6) model type
7) model elements used in the model and type of each
8) requirements for using the model (e.g., tools, input stimuli, environmental information)
9) product URL (Uniform Resource Locator)
10) model URL
At the vendor site, the following additional information is required:
1) description / intended use
2) model support contact information
3) revision history
The models themselves should contain all the information specified in 7.1.2.

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