Dr. H. Schmidt, N.

Leidner; October 2002

1
THT Reflow - Pin in Paste
Technological Overview
Dr. H. Schmidt, N. Leidner; October 2002
2
Printer
Dispenser
Pick&Place
Reflow
Component
Drop In
Test
Printer
Dispenser
Pick&Place
Reflow
Component
Drop In
Component
Press In
Wave
Solder
Manual
Solder
Test
Process flow / Cost saving potential
Benefits
Elimination of capital
equipment
wave and solder
machines,
press- in automates,
robotic single point
soldering systems
Reduce labour cost
manual soldering
operations
equipment operators
maintenance operators
test operators (e.g.
press- in)
Reduce floor space
Reduce of process materials
old new
Dr. H. Schmidt, N. Leidner; October 2002
3
PCB before assembly
PCB with solder paste stencil
Application of solder paste
Process flow
Dr. H. Schmidt, N. Leidner; October 2002
+
Process flow
Removing of
stencil
Equipping of components
PCB with
components
Dr. H. Schmidt, N. Leidner; October 2002
5
Process flow
Reflow melting of solder
paste, contraction of molten
solder
PCB with
soldered
components
Dr. H. Schmidt, N. Leidner; October 2002
6
Problem standard- SMD versus THT soldering
Amount of solder to fill up the holes
Diameter of holes
Thickness of PCB
Diameter of component pin
Process parameters Reflow
Heat resistance of component
Higher heat capacity of connectors require different
process profiles
Equipping
Accuracy of placement and tolerance of component pin
Capability of automatic equipping (geometry, mass,
component height)
Dr. H. Schmidt, N. Leidner; October 2002
7
Speed
Higher squeegee speed reduces solder
paste volume in through hole
Angle
Increased squeegee angle reduces
solder paste volume in through hole
Viscosity of Paste
Viscosity change from temperature,
shear thinning,evaporation of solvents
and humidity
Hole Diameter
Printed solder paste volume and fill,
increases as hole size increases
v
Influence parameters of filling behaviour
Dr. H. Schmidt, N. Leidner; October 2002
8
1. Step - first Print
2. Step - second Print
1. Step - 1. Side
2. Step - 2. Side
Single stage multiple print
Double stage single print
Improvement of filling
Dr. H. Schmidt, N. Leidner; October 2002
9
Shaped / cut Pin
Blunt cut lead will tend
to push solder paste
away from solder joint
Influence of PIN- Design
Dr. H. Schmidt, N. Leidner; October 2002
10
L<1,5mm
Pin Length
If the pin projects to far,
the molten solder cant be
tracked into the hole and
will remain (ball shaped)
at the tip of the pin.
Influence of PIN- projection
Dr. H. Schmidt, N. Leidner; October 2002
11
Paste
Reflow Solder
Volume reduction
45-55%
Volume change through melting
Dr. H. Schmidt, N. Leidner; October 2002
12
Before solder
Volume= Hole +
Solder-mask
After solder
Volume= Hole +
2*Meniscus - Pinvolume
Contour change through melting
Dr. H. Schmidt, N. Leidner; October 2002
13
t h
d3
d2
d1
t d V
hole
=
2
2
4

h d V
pin
=
2
3
4

( )
2
1
2
3
2 ) (
12
d d t h V
hyp
+ =

4
3 1
d d
t h

=
( )
(

|
.
|

\
|
+

+
|
.
|

\
|

= t
d d
d t d d d
d d
V
solder
4
2
12 4
3 1
2
3
2
2
2
1
2
3
3 1

Calculation method of required

solder volume
Dr. H. Schmidt, N. Leidner; October 2002
1+
As
tp
ts
t
d4
d2
tp
ts
As
factor filling hole F t F t
f f p
= ,
t F d V
f hole P
=

2
2
4

S S S P
t A V =

S P hole P P
V V V

+ =
paste solder factor filling Volume F
V F V
Condition
P
solder P P

=
Calculation method of
required solder volume
Dr. H. Schmidt, N. Leidner; October 2002
15
d3
d2
d3
d2
0
10
20
30
40
50
60
70
80
90
100
round square rectang.
A-Pin %
Round pins require the least
solder volume
rectangular pins require the
most solder volume
smaller gaps require less
solder volume
the gap (d2-d3) should be
min 0,3mm for automatic
insertion/placing
Gap=d2-d3
Influence of pin diameter
Dr. H. Schmidt, N. Leidner; October 2002
16
Enlargement of solder paste volume
through bigger aperture
Solder paste - stencil design
As As
As
Stencil apertures do
not need to be
identical - Area
must be equal
Dr. H. Schmidt, N. Leidner; October 2002
17
Possible stencil
designs variations
Variations in the lead in
design have only a minor
influence to the solder joint
Dr. H. Schmidt, N. Leidner; October 2002
18
Calculation sheet
Zoom and double click on worksheet (.ppt-version)
Needed input data from
placer?
Stencil thickness
Filling ratio of hole
(Experience values of
placer?)
PCB thickness
Solder pad ring size
Test Input
Cross section pin Cross section area pin
rectangular pin bp 0,6 mm dq 0,677 mm
lp 0,6 mm Diag 0,849 mm
<or> round pin dp 0 mm Api 0,360 mm
<or> pin area Ap 0 mm
Pad
hole diameter di 1,1 mm suggestion 1,1 mm
pad diameter da 1,45 mm
Board solder volume
board thickness dl 1,55 mm Vl 0,998 mm
Paste solder paste volume
filling factor solderpaste fl 0,5 Vp 1,996 mm
Stencil
stencil thickness ds 0,15 mm
Apertur over pad diameter stencil diameter
ape 0,8 mm 2,25 mm
filling factor hole bevor solder filling factor after solder stencil diameter 100% filling
fb 0,85 fg2 92,59% dd3 2,514 mm
filling factor after solder
square pin filling factor hole bevor solder 30% 40% 50% 60% 70% 80% 90% 100%
a thickness 40,00% out 1,18 1,65 2,01 2,32 2,59 2,84 3,06
45,00% out out 1,50 1,89 2,21 2,50 2,75 2,98
50,00% out out 1,32 1,75 2,10 2,40 2,66 2,90
55,00% out out 1,12 1,61 1,98 2,29 2,56 2,81
60,00% out out out 1,45 1,85 2,18 2,47 2,72
65,00% out out out 1,27 1,71 2,07 2,37 2,63
70,00% out out out out 1,56 1,94 2,26 2,54
75,00% out out out out 1,40 1,81 2,15 2,44
80,00% out out out out 1,21 1,67 2,03 2,34
85,00% out out out out out 1,52 1,91 2,23
90,00% out out out out out 1,35 1,77 2,11
95,00% out out out out out 1,15 1,63 2,00
100,00% out out out out out out 1,47 1,87
105,00% out out out out out out 1,29 1,73
110,00% out out out out out out out 1,58
115,00% out out out out out out out 1,42
120,00% out out out out out out out 1,23
filling factor after solder
rectangular filling factor hole bevor solder 30% 40% 50% 60% 70% 80% 90% 100%
a 40,00% out 1,67 2,34 2,85 3,28 3,67 4,01 4,33
a=2b 45,00% out 1,35 2,11 2,67 3,13 3,53 3,89 4,22
50,00% out out 1,87 2,48 2,97 3,39 3,76 4,10
55,00% out out 1,58 2,27 2,80 3,24 3,63 3,98
60,00% out out 1,23 2,05 2,62 3,08 3,49 3,85
65,00% out out out 1,79 2,42 2,92 3,35 3,72
70,00% out out out 1,49 2,21 2,75 3,20 3,59
75,00% out out out 1,11 1,98 2,56 3,04 3,45
80,00% out out out out 1,71 2,36 2,87 3,30
85,00% out out out out 1,39 2,14 2,69 3,15
90,00% out out out out out 1,90 2,51 2,99
95,00% out out out out out 1,62 2,30 2,82
100,00% out out out out out 1,29 2,08 2,64
105,00% out out out out out out 1,83 2,45
110,00% out out out out out out 1,53 2,24
a
a
b
Dr. H. Schmidt, N. Leidner; October 2002
19
Requirements on components
Compatibility to high temperature
profiles
Component body stand-off
Pin pitch
Height
Weight
Heat through
Heat damaged
housing
Not seated
Shorted
Pins
Not filled
fine pitch
Solder not
molten
Dr. H. Schmidt, N. Leidner; October 2002
20
Soldering profile
Cycle time and profile depends on the solder joints
with the highest heat capacity and the lowest heat
conductivity respectively.
Worst case profile for high mass components
with long preheat e.g. SMT connectors
Small mass SMT
component
e.g. capacitor
Solidus point with low
temperature gradient
Peak temperature
Preheat
Heat needed to activate
flux
Dr. H. Schmidt, N. Leidner; October 2002
21
Input data from placer
Experience concerning filling behaviour of the holes (filling
factor versus hole diameter)
Characteristic values of PCB and stencil thickness
Pick and place process (manual / automatic process -
max. mass, max stroke)
Process parameter soldering profile, Risk at increased
temperature / time
Risk of solder bridges * shorts through splashes at large
arpertures
Dr. H. Schmidt, N. Leidner; October 2002
22
Checklist for Components
Temperature stability of component material regarding to the
soldering profile
Suitable for automatic pick and place
Tolerances of board holes must allow manual / automatic
placing
Experience regarding solder paste filling factor at placer
PCB thickness
Pin contour (projection, tip geometry, Cross section)
Calculation of stencil geometry for component foot print
Check of feasibility of pitch at calculated aperture (depending
on Geometry / Process)
Pre-tests in case of expected risks