Thermal Management of a Laptop Computer with

Synthetic Air Micrqjets

J. Stephen Campbell, Jr.
Boeing North American
Aircraft and Missile Systems Division
1800 Satellite Blvd., DL23
Duluth, CA 30097-4099
W. Z. Black, A. Glezer, J. G. Hartley
Woodruff School of Mechanical Engineering
Georgia Institute of Technology

Abstract
This paper discusses experiments conducted to
determine the effectiveness of synthetic air microjets in
cooling packaged thermal test chips and a laptop computer
processor. The details of the experiments may be found in
Reference 1. A small electromagnetic actuator was used to
create the jets. When AC voltage was applied to the assembly,
or microjet, a pulsating jet of air was forced out through an
orifice in one face of the actuator. Design variables included
the number and diameter of the orifices. Tlhe magnitude and
frcquency of the input signal were held constant.
Initially, a microjct was used to cool a heated,
packaged thermal test chip. The setup was such that the jet(s)
of air impinged directly on the package, and the distance
between the microjet and the heated surface was varied. For
the remaining experiments, the microjet was used to cool the
processor of a laptop computer. In these tests, the air jet(s)
impinged on the plate covering the processor. Various orifice
plate designs and methods of baffling and sealing were
employed to increase the cooling efficiency. Occasionally, the
microjet was used in conjunction with a small 5-V fan to
determine the effect of global cooling on the microjet
effectiveness.
Synthetic air microjets were shown to be effective in
cooling both the test chips and the laptop processor. For the
former tcsts, the microjet produced an average 26 percent
reduction in chip temperature rise compared to the tcmperature
rise that existed under natural convection conditions. For the
latter tests, the processor temperature rise was decreased by 22
percent compared to the temperature rise without microjet
cooling.
Introduction
In the almost 40 years since the introduction of the
integrated circuit, the microelectronics industry has seen
tremendous changes. With the advent of LSI and VLSI
tcchnology, the number of circuits per chip has increased on a
very rapid pace, as have the power requirements of the chips.
While chip sizes have also grown, these increases have
occurred at a slower rate than the increases in chip power [2].
Therefore, higher heat fluxes have resulted. As such, thermal

0-7803-4475-8/98/$l0.0001998 IEEE

43

management has taken on an increasingly important rolc in the

microelectronics industry.
In recent years, the introduction of portable electronic
devices such as cellular phones and laptop computers has
presented additional challenges for thermal management
engineers. The small size of these devices often restricts the
use of standard cooling devices such as fans and heat sinks. A
1996 study by Xie et al, wherein several methods of cooling
the processor of a laptop computer were examined,
represented a general survey of laptop computer cooling
techniques [3]. As devices such as these increase in power
(and popularity), the need for thermal management research in
this area has become clear.
The use of forced air convection cooling for
electronic devices is common. Numerous studies have dealt
with the subject of heat removal from a surface via a steady,
impinging jet of air. A 1977 survey by Martin [4] discussed
several aspects of jet cooling, including the influences of
orifice-to-surface spacing and orifice diameter. Jambunathan
gave a similar study of heat transfer resulting from a single,
round jet impinging on a heated surface [ 5 ] . The use of an
array of air jets in cooling a simulated electronic package was
examined by Hamadah [6]. While studies dealing with steady
jets are plentiful, the use of pulsating jets in heat transfer is
relatively unexplored. A 1960 study by Nevins and Ball
discussed the use of unsteady jets created by a compressor,
nozzle system and pneumatic controller [7].
In this paper, the results of an experimental study on
the heat removal capabilities of synthetic air microjets are
presented. The microjets were first used to cool packaged
thermal test chips. Thermal resistance data was calculated for
the packages with and without microjet cooling. A more
rigorous test of the microjets cooling performance was
provided in experiments involving the cooling of a laptop
computer processor. The microjet laptop cooling data was
compared with data collected when the laptop processor was
energized without microjet cooling to determine the
effectiveness of the microjet as a thermal management device.

1998 Intersociety Conference on Thermal Phenomena

the design of each package and gives the nomenclature used to

identify each package in the remainder of this paper.

Micro jets
A novel technique of producing an air jet was used in
this research and was tested to determine its effectiveness in
cooling a heated chip. Instead of using a compressor and
nozzle, the jet was created by a small electromagnetic actuator.
When AC voltage was applied to the actuator wires, a
pulsating jet of air was forced out through an orifice plate
which was attached one face of the actuator. The amplitude
and frequency of the jet were dctcrmined by the input voltage.
The diameter of the hole in the orifice plate was either 1.6 or
0.8 nun. For some tests, an array of holes was used to create
multiple jets. Henceforth, the actuator assembly will be
referred to as a microjet, while the term air jet will refer to the
actual stream of air that leaves the orifice.
A test oscillator was used to generate a sinusoidal
wave to power the microjet. The input voltage to the microjet
was limited to 15 V for all tests to avoid damaging the
actuator. Since the test oscillator was unable to produce a
signal of this magnitude, a 6-V wave was produced by the test
oscillator and fed into a signal amplifier. An oscilloscope was
used to monitor the signal before and after amplification. The
optimal signal frequency was determined by varying the
frequency on the test oscillator and observing the change in jet
strength. A signal frequency of 100 Hz was determined to
produce the strongest jet, and this frequency was used in all
the jet cooling tests. This frequency was chosen also because
it virtually eliminated the noise associated with generating the
air jet. Jet velocities were measured with a miniature pitot
probe mounted on a computer-controlled traversing
mechanism [8]. For a microjet with a single 1.6-mm diameter
orifice, the jet centerline velocity at a distance of two
diameters from the orifice plate was approximately 14 d s .

Thermal Test Chir, Cooling ExDeriments

Thermal Test Packages and Chips
The chip carriers used in this research were multilayer ceramic pin grid array (PGA) carriers manufactured by
Kyocera, Inc. A total of four different carriers of varying size
and cavity orientation were analyzed. Two of the four carriers
were 68 pin, while the other two were 144 pin. Three of the
carriers had a cavity-up design, where the chip cavity was on
the opposite side of the carrier from the pins; the remaining
carrier had a cavity-down design, where the cavity was on the
same side as the pins.
Package assembly and wirebonding were performed
in the cleanroom of the Georgia Tech Microelectronics
Research Center. The thermal test chips used in this research
were supplied by Delco Electronics. Once chips were bonded
inside the carriers, the wirebonding was performed such that
corresponding pins on the different packages carried the same
electrical value; in this fashion, a single socket and test board
could be used for all the tests. Two different methods of
protecting the chips were employed. One of the assembled
packages had an encapsulating material which filled the chip
cavity and completely covered the chip. The other packages
had a ceramic lid that covered the chip. Table 1 summarizes

44

Table 1. Package design table.

No.

Name

Pins

Cavity

68DL
3

1 144UL

144UE

68
68
68

Down
up

up

Cover
Lid
Lid
Lid
Encap.

A 144-pin plastic PGA socket and thermal lest board

formed the package mounting assembly, as shown in Figure I.
The socket pins which carried electrical signals between the
packages and the test board were soldered to the board. In
addition, the socket corner pins were soldered to the board to
ensure a mechanical connection between the two components.
One end of the test board was inserted into an edge connector,
allowing electrical communication between the package and
test equipment through the boards metallic traces.

Substrate
\

,Chip

Socket

Pins

Figure 1: Chip cooling experiment system geometry.

After package assembly and testing were complete,
each chip was calibrated separately. Each chip had a diode
bridge, the voltage drop across which varied linearly with the
chip temperature. The calibration process involved inserting a
package into the socket, heating the assembly to a known
temperature in an oven, and mcasuring the diode forward
voltage drop at that temperature. This procedure was repeated
at selected temperatures until a curve of diode voltage drop as
a function of temperature was generated.
ExDerimental Setup
Once the calibration curves for the various packages
were produced, the packages were individually subjected to
variable heating loads to determine their temperature rise as a
function of heat input. Each chip had a buried resistive
element which provided heating to the chip surface when
connected to DC power. The general procedure for chip
heating involved mounting the device on the test board and
mounting the assembly horizontally onto a test stand. Then
heating current was provided to the device and the diode
voltage drop was recorded. Tests were performed without and
without microjet cooling. In addition, experiments were

1998 Intersociety Conference on Thermal Phenomena

performed wherein the package was cooled by a pin fin heat

sink in natural convection.
For the chip cooling tests, the package/test board
assembly was mounted on the test stand. The microjet was
mounted above the heated package such that the jet would
impinge onto the center of the top surface of the package, as
shown in Figure 2. For the microjet mounting assembly,
mounting holes were drilled at the four corners of the microjet
orifice plate, so that it could be attached to a small Plexiglas
plate. This assembly was supported over the heated package
by threaded rods inserted through holes in tlhe Plexiglas plate
and thermal test board. This arrangement permitted the height
of the microjet over the chip to be adjusted.

Plexiglas plate

icrojeL

II

II
Figure 2: Microjet mounted over test chip.

A 36-gauge T-type thermocouple was used to

measure the ambient temperature in the chip cooling
experiments.
Once the diode voltage drop at a given
power level was known, the chip temperature was calculated
using the chip calibration curve. With these values known, the
package junction-to-ambient thermal resistance e,, was
calculated from

Results of Cooling Test Packages with Microiets

The first test involved studying microjet cooling
effectiveness as a function of microjet height above the
package using the setup described in the previous section. All
tests carried out with a single orifice microjet had a 1.6-mm
orifice, while all tests carried out with a multi-orifice microjet
had an array of nine 0.8-mm orifices. In each test, the microjet
was operated at 15 V peak-to-peak with a frequency of 100

Hz.
Figure 3 shows the change in package e,, as a
function of microjet height above the top surface of the
package for package 4 for both the single-orifice and multiorifice microjets. For these Lests, the package was energized to
1 W. The results show that the cooling effectiveness increased
with increasing microjet height until an optimum height was
reached. Further increases in microjet height beyond this point
caused the cooling effectiveness to drop. When a singleorifice microjet was used to cool the packages, the optimum
microjet height was between 38 and 44 mm. When a multiorifice microjet was used, the optimum height was between 35
and 40 mm.
Figure 3 also shows that the single-orifice microjet
provided better cooling for package 4 than did the multiorifice microjet. This phenomenon was observed for other
package designs as well. The superior performance of the
single-orifice microjet is due to fact that the air leaving the
multiple, smaller orifices is weaker than the air leaving the
single, large orifice. Consequently the air velocity at the point
of impingement on the package top surface was less for the
multi-orifice configuration than for the single-orifice
configuration.
Furthermore, jet spreading hindered the
performance of the multi-orifice microjet, particularly when it
was used to cool the smaller packages, because the spreading
caused some of the air to miss the package entirely.

30

2 29
U,

.- 28
a
.2
27
k
26
25

where Tj, T_ and P were the junction or chip temperature, the

ambient temperature and the chip power dissipation,
respectively.
Package junction-to-case thermal resistance (Ojc) was
calculated with Tj in the above equation replaced by T,,the
case temperature. For all packages, the case thermocouple was
located directly above the chip. Package e, values were an
average of 16 OC/W for packages 3 and 25, and an average of
2 " C W for packages 9 and 26.

45

t
2.5

I
3

3.5

4.5

5.5

Microjet height (cm)

Figure 3: Effect of microjet height on e, for package 4 at 1W.
Table 2 shows the percent decrease in package e,
produced when several packages were cooled with a singleorifice microjet. The power level for each chip was 2 W.
Each test was carried out at the optimum microjet cooling
height for each package. In terms of comparing the thermal
performance of single-orifice microjet cooling with natural

1998 lnterSocicty Conference on Thermal Phenomena

convection cooling for all the packages tested, the microjet

produced an average 28 percent decrease i n @,*.
As the table shows, microjet cooling is least effective
on packages with a. lidded design. This result is due to the fact
that the air jct impinges on the cavity lid which, because of the
air gap beneath the lid, is relatively cool. Microjet cooling is
more effective on packages with a lidded design, since the jet
impinges on an area that is comparatively hot. Also, cavitydown design packages show a greater decrease in e,, than do
cavity-up design packages. This result can be explained by the
fact that, for cavity-down packages, the path for heat transfer
to the top surface of the package is less resistive than the path
for heat transfer to the bottom of the package.

Sj, ("CnV)
at 2W wlo
microjet
44.2
44.3
35.3
34.1

Package

I (68 UL)
2 (68 DL)
3 (144 UL)
4 (144 UE)

e,, ( " C N )

% decrease

at 2W wl
microjet
31.6
29.6
27.3
24.6

28.6
33.1
22.6
27.9

Figure 4 compares the e,, values for package 4 for a

single-orifice microjet mounted at a height of 44 mm, e,, when
an aluminum pin fin heat sink is attached to the package and
the natural convection value of e,, when no heat sink is
attached. For the heat sink experiments, the interface between
the bottom surface of the sink and the top of the package was
filled with thermally conductive grease.
The results
demonstrate that the microjet has approximately the same
effectiveness in reducing Ij, as does the pin fin heat sink that is
cooled by natural convection.

Microiet Cooling in a Laptor, Computer

In order to study the effectiveness of air jet cooling
on an actual processor chip, an experiment was designed to
incorporate a microjet into a laptop computer. A laptop was
chosen over a conventional PC for this study due to the
challenge of using jet cooling in an environment where spatial
limitations are a limiting factor. The computer used in this
study had a 90 MHz processor. The experimental tests were
designed so that the effectiveness of the microjet could be
compared to the cooling capabilities of the thermal
management system that exists in the laptop.
Figure 5 shows a schematic of the layout of the main
components inside the laptop. The processor was located
underneath the upper left corner of the keyboard. Other
components contained on the motherboard that housed the
processor were the I/O ports, memory chips, and hard drive.
On the top side of the encapsulated processor was a
brass cold plate, which was used as a heat spreader (see Figure
6 ) . An aluminum piate, which acted as a second heat spreader,
was mounted on the underside of the processor. Thin threaded
rods ran through holes in the motherboard and held the two
plates in place. The vertical clearance between the top of the
processor and thc bottom surface of the keyboard was 14.5
mm, while the clearance between the top of the cold plate and
the bottom of the keyboard was I 1.5 mm.
Processor

/Hard drive

Memory
expansion port

Power car

Sound card

'IBattery (underneath)

Figure 5: Laptop computer component layout.

nat. canv.

+Heat
sink, nat.
conv.

Heat sink

+Single
hole
microjet

**20

,Motherboard

Fan\

L
0.5

1.5

2.5

chip power (W)

Figure 4:Effcct of various cooling modes on e,, for package 4.

Motherboard

\
Aluminum back plate

\ Processor

Figure 6: Laptop thermal management elements.

46

1998 InterSociery Conference on Thermal Phenomena

Also shown schematically in Figure 6 are the heat

sink and fan. The heat sink had conical-shaped, staggered fins
with rounded tips and was mounted over the cold plate. When
the laptop was completely assembled, the tips of the fins were
in contact with the underside of the keyboard. Since the width
of the sink was greater than that of the cold plate, the sink
acted as a third heat spreader. The heat sink base was roughly
6.4x4.4 cm, with a 2.5x1.2 cm cutout in one corner. A thin,
rubbery material reduced the thermal interface resistance
between the cold plate and sink.
The fan operated at 5 VDC, drawing 0.07 A, and was
used to draw air in through ports in the laptop external case
and over the sink fins. Power for the fan came from the
motherboard. The manufacturers rated volumetric air flow
for the fan was 0.92 cfm (0.026 m3/min) [9]. A thermal
feedback loop between the motherboard and fan was assumed
to exist such that the fan would be activated if the processor
temperature exceeded a predetermined level. Since the fan
never came on, that limiting temperature was evidently not
surpassed. For some of the experiments, the goal was to
determine the cooling capabilities of the fan. In these cases,
the fan was disconnected from the motherboard and wired
directly to a DC power supply so that independent operation of
the fan could be assured.
The experimental setup involved mounting the
microjet directly over the laptop processor. To position the
microjet in the space between the cold plate and keyboard, the
heat sink had to be removed. Using the threaded rods, the
microjet was mounted such that the jet impinged directly onto
the cold plate surface. The microjets orifice plate had either a
single, central hole which was either 1.6 or 0.8 mm in
diameter, or an array of 0.8-mm holes. In addition, the shape
of the orifice plate itself was varied. The square, single-orifice
plate and the cut, multi-hole orifice plate designs are shown in
Figures 7a and 7b, respectively. The four outer holes in both
the square and machined orifice plates are the mounting holes.

is as shown in Figure 8a. In this case, during the microjets

out stroke, the expelled air impinges on the heated surface
and flows radially outward, moving nearly parallel to the
surface [lo]. On the microjets intake stroke, the air flows in
approximately parallel to the orifice plate. Conversely, if the
microjet orifice is very close to the heated surface, a
recirculation flow pattern is created (Figure 8b) wherein the
microjet draws in the air that has impinged on the heated
surface. Therefore, the separation between the orifice plate
and the heated surface will have a large impact on the cooling
capabilities of the microjet. A large separation distance
ensures that the heated surface experiences the impingcment of
coo1 air that has not previously passed over the heated surface.
On the other hand, if the spacing is small, the air heated after
impingement will be drawn back into the microjet; thus, the
microjet recirculates hot air and minimal cooling will occur.

Inflow

(a) Large separation between heated surface and microjet.

(b) Small separation between heated surface and microjet.

Figure 8: Air jet circulation patterns.

(a) Square, single-orifice plate (b) Cut, multi-orifice plate

Figure 7: Microjet orifice plate designs for laptop cooling
(not to scale).

Baffling and Sealing

The flow of air from a microjet is created by a closed
electromagnetic actuator. Since the microjet is a closed
system, it draws in air and expels air alternately, with a
frequency based on the microjet input signal. When the gap
between the microjet orifice and heated surface is sufficiently
large, as in the test chip experiments, the air circulation pattern

47

To avoid the recirculation phenomenon, baffling and

sealing were employed to create air ducts that channcled thc
air to and from the microjet. One technique used to direct air
flow was to place a thin horizontal baffle between the microjet
orifice and heated surface (see Figure 9). This baffle had a
hole that was slightly larger than the orifice of the microjet to
compensate for jet spreading. In some cases, the fan was
added to draw air between either the microjet orifice plate and
baffle plate, or between the baffle plate and heated surface.
The former setup (shown in the figure) supplied the microjet
with cool intake air; the latter removed the hot air after
impingement.

1998 InterSociety Conference on Thermal Phenomena

Onficc plate

Adhesive tape

Fan

Air flow

---+

Figure 9: Laptop jet cooling setup.

When the fan was used (either with or without the
horizontal baffle), an airflow channel was created by adding
vertical baffles on both sides of the gap between the microjet
and orifice plate. With this setup, the air drawn by the fan
entered the laptop through the external casc ports, then flowed
between the microjet orifice plate, the cold plate, and the
channel walls. To ensure that the fan drew in cool air through
this path, other internal gaps and natural openings (such as the
gap between the motherboard and laptop external case) were
covered with sealing material.
Experimental Runs
A program designed to exercise the laptop processor
and cause chip heating was installed in the laptop hard drive

193. The software was an MS DOS 6.2 batch file which

opened a DOS Edit window. When this window was open and
a menu was pulled down, the power drawn by the processor
was at a maximum. The power stayed relatively constant
while the software was running.
In all laptop tests the components were at ambient
temperature at the beginning of the test. The processor selfheating program was started at time zero, and the processor
temperature began to rise immediately thereafter. A 36-gauge
type T thermocouple, located on the bottom side of the
processor encapsulant, was used to measure the processor
temperature. The thermocouple bead was surrounded with
high-conductivity thermal grease and then taped down.
Table 3 is a summary table which lists each laptop
cooling experiment and describes the setup used in each
experiment. As the table indicates, the baffling design and
quality of the sealing improved throughout the course of the
study; hence the descriptions poor sealing, medium
sealing, and good sealing. These improvements included the
use of better materials for the flow channel and the use of more
sealing materials to cover more of the openings and gaps.
Table 3 also lists two control cases which are
indicated by Runs 1 and 2. Run 1 involved a heat sink but no
fan, and Run 2 involved the 5-V fan but had no heat sink. In
the other experiments where the fan was used, its input voltage
was varied. In all the jet cooling runs, the microjet was run at
15 V peak-to-peak and at a frequency of 100 Hz.

Table 3. Laptop cooling experimental runs.

Laptop Jet Cooling Results

The results of the laptop cooling experiments are
given in Figures 10-13. In Figure 10, the processor
temperature as a function of time is plotted for Runs 6 and 7.
Referring to Table 3, the horizontal baffle plate was used in
Run 6 but not in Run 7. Clearly, the removal of the baffle
plate had a beneficial impact on the processor temperature,
causing the temperature rise to decrease from 64.9C to 61.6C
(averaged over the last ten minutes of heating). A possible
explanation for this behavior in Run 6 could be that the
microjet was forced to draw intake air from the thin gap
between these two plates. Conversely, in Run 7, the microjet
could draw air through a larger opening. Also, the hole in the

48

baffle plate used in Run 6 might not have been exactly

oriented with the centerline of the microjet orifice, thus
causing interference with the air stream.
The effect of improved sealing is shown in Figure 1 1,
which compares the processor temperature rise for Runs 3 and
4. As indicated in Table 3, the sealing design was improved
between thc two runs. While the precise difference between
poor and medium sealing is difficult to quantify, basically
it involves more liberal use of sealing material to cover more
of the possible air leakage points. The effect of this
improvement in sealing is evident in the results shown in the
figure.

1998 InterSociety Conference on Thermal Phenoiriena

In Figure 12, the eflects of improved sealing, the

number of microjet orifices and the orifice plate design are
compared. From the data, it can be seen that when the 3 V fan
is used without a microjet (Run 5 ) , it does not provide
particularly effective cooling. However, the addition of
microjet cooling to the cooling provided by the fan, along with
improved baffling (Run 7), leads to approximately a 7C drop
in processor temperaturc.
The next comparison shown in the figure is between
Runs 7 and 8, where the latter test used the multi-orifice
machined plate. The change in microjet design caused a
further 8C drop in processor temperature rise. Obviously, the
presence of more air jets, which are able to cover more of the
cold plate area with cooling air, is quite beneficial. In
addition, the machined orifice plate allows the microjet to take
in cooler air from the regions around and above the microjet,
rather than just below it. As such, this orifice plate design
represents an improvement over the single-hole orifice plate
design. This result is in contrast to the results of the test chip
cooling experiments. Therefore, a single air jet has more
cooling capability in situations where the distance between the
orifice plate and heated surface is large. Howcvcr, when the
orifice plate-heated surface spacing is small, more efficient
cooling is provided by an array of air jets.
Finally, the performance of the microjet setup that
produced the greatest drop in the laptop CPU temperature
(Run 8) was compared with the baseline test when the 5-V fan
was operated alone (Run 2) and the temperature produced
when the finned heat sink was used alone (Run 1). These
comparison cases are shown in Figure 13. While the microjet
system described in Run 8 cools the processor to a lower
temperature than when the fan is used as the
sole cooling
1
'
device, it lags slightly behind the cooling provided by the heat
sink. This result is mainly due to the fact that the heat sink
base is larger than the area of the processor, so it provides
significant heat spreading.

70

Run 3
-+- Run 4

-m-

10

*O

04

20

40

60

80

100

120

Time (min)
Figure 11: Effect of sealing on laptop CPU temperature.
70

60

50
40

=: 30

20
10

0
0

30

15

45

75

60

90

105

120

Time (min)

Figure 12: Effect of baffling, sealing and orifice plate design

on laptop CPU temperature.

6oi
s""mc=n=;i

50

4- ff

30
20

20

40

60

80

100

120

Time (min)

15

30

45

60

75

90

1
105 120

Time (min)
Figure 10: Effect of horizontal baffling on laptop CPU
temperature.

Figure 13: Laptop jet cooling compared with baseline data.

49

1998 Interbociety Conference on Thermal Phenomena

Conclusions
The use of synthetic air jets produced by an
electromagnetic actuator was shown to be effective in
electronic cooling applications, both on packaged thermal test
chips and on the CPU of a laptop computer. Microjet design
variables included the number and diameter of the jet orifices
and the height of the microjet above the heated surface. When
used to cool the thermal test chips, the microjet produced an
average 26 percent drop in chip temperature rise when
compared to the temperature rise that exists under natural
convection conditions.
This value was approximately
comparable to that provided when a heat sink is attached to the
package and the fins are cooled by natural convection. For the
application of jet cooling in the laptop computer, design
variables such as baffling and sealing were studied. Using the
optimum combination of the various parameters (baffling,
sealing, orifice size and number), the microjet was able to
lower the processor operating temperature rise by 22 percent
when compared to the laptop operating without the microjet.
At this point in the research, the design of the
microjet (i.e. material, actuating device, etc.) has not been
optimized. I n addition, further improvements in baffling and
sealing are still possible. Therefore, even though the microjet
has been shown to be rclativcly effective in electronics
cooling, optimization of the microjet design and improvements
in the baffling and sealing could lead to improved jet cooling
capabilities.

2.

R. Simons, Microelectronics Cooling and SEMITHERM:

A Look Back, lOlh IEEE SEMI-THERM Symposium, 116. 1994.

3.

H. Xie, et al, Thermal Solutions to Penlium Processors in

TCP in Notebooks and Sub-Notebooks, IEEE Trans. on
Comp., Hybrids, and Man. Tech., Part A, 19(1), 54-64,
March, 1996.

4. H. Martin, Heat and Mass Transfer between Impinging

Gas Jets and Solid Surfaces, Advances in Heat Transfer,
1-60, 1977.
5.

K. Jambunathan, et al, A Review of Heat Transfer Data

for Single Circular Jet Impingement, Inti. J. of Heat and
Fluid Flow, 13(2), 106-1 15, June, 1992.

6 . T. Hamadah, Impingement Cooling of a Simulated

Electronics Package with a Square Array of Round Jets,
Heat Transfer in Electronics, ASME HTD Vol. 1 1 1, 107112,1989.

7. R. Nevins and H. Ball, Heat Transfer between a Flat

Plate and a Pulsating Impinging Jet, The 1961 National
Heat Transfer Conference, 60,5 10-516, 1961.
8.

Thompson, M., Thermal Managcment of Integrated

Circuits Using Synthetic Jet Technology.
Masters
Thesis, Georgia Institute of Technology, 1997.

9.

P. Gilchrist, Member Technical Staff, Microelectronics

and Computer Technology Corporation, personal
communication, 5 Feb. 1997.

References
1.

J. S. Campbell, Jr., Establishment of an Analytical and

Experimental Test Facility for the Evaluation of Thermal
Management in Microelectronic Packages. Masters
Thesis, Georgia Institute of Technology, 1997.

so

10. A. Glezer, Assoc. Prof., Georgia Inst. of Technology,

personal communication, 17 July, 1996.

1998 InierSociety Conference on Thermal Phenomena