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PC324
LOW POWER QUAD OPERATIONAL AMPLIFIER
DESCRIPTION
FEATURES
3 V to 30 V (Single)
1.5 V to 15 V (Split)
mode.
100 A
6 A
6 A
OUT1 1
Q5
II
Q1
Q2
Q3
PC324C, 324G2
V+
Q4
CC
Q6
II1 2
Q7
IN
OUTPUT
Q13
Q10
Q8
Q9
1
+
4
+
IN1 3
RSC
Q11
14 OUT4
12 IN4
11 V
IN2 5
Q12
50 A
II2 6
13 II4
10 IN3
+
2
+
3
OUT2 7
9 II3
8 OUT3
ORDERING INFORMATION
Part Number
Package
PC324C
PC324G2
The mark
1997
PC324
ABSOLUTE MAXIMUM RATINGS (TA = 25 C)
Parameter
+
Symbol
Note 1
V V
Ratings
Unit
0.3 to +32
VID
32
Input Voltage
Note 2
VI
V0.3 to V+32
Output Voltage
Note 3
VO
V0.3 to V++0.3
Note 4
PT
Power Dissipation
C Package
G2 Package Note 5
Output Short Circuit Duration
Note 6
570
mW
550
mW
Indefinite
sec
TA
20 to +80
Storage Temperature
Tstg
55 to + 125
Symbol
MIN.
MAX.
Unit
1.5
15
30
TYP.
Symbol
VIO
IIO
Note 7
Conditions
MIN.
RS = 0
IB
AV
RL 2 k
Supply Current
ICC
RL = , IO = 0 A, All Amplifiers
25
TYP.
2
mV
50
nA
45
250
100
CMR
65
85
SVR
65
100
VO
RL = 2 k (Connect to GND)
VICM
+
mA
dB
dB
V 1.5
V+ 1.5
IO SOURCE
VIN = +1 V, VIN = 0 V
20
40
mA
IO SINK
VIN = +1 V, VIN+ = 0 V
10
20
mA
50
120
dB
nA
V/mV
1.0
Unit
MAX.
f = 1 kHz to 20 kHz
12
Notes 7. Input bias currents flow out from IC. Because each currents are base current of PNP-transistor on input
stage.
PC324
TYPICAL PERFORMANCE CHARACTERISTICS (TA = 25 C, TYP.)
POWER DISSIPATION
SUPPLY CURRENT
1000
ICC
324C
600
800
324G2
400
+
2
TA = 0 to 70 C
1
200
TA = 20 C
20
40
60
80
100
10
20
30
5
V+ = 5 V
2
TA = 25 C
40
3
2
1
0
1
2
3
0
0
10
20
30
V+ - Supply Voltage - V (V = GND)
4
50
40
100
75
50
TA = +25 C
25
80
100
50
V+ = +15 V
V = GND
60
40
20
10
20
30
40
V+ - Supply Voltage - V (V = GND)
0
50
0
50
100
TA - Operating Ambient Temperature - C
PC324
OUTPUT SINK CURRENT LIMIT
10
V+
VO - Output Voltage to V+ - V
VO - Output Voltage - V
V+ = 15 V
1.0
V+
0.1
V+/2
IO SINK
0.01
0.01
0.1
1.0
VO
10
V+/2
0.1
1.0
10
100
70
10 M
IO SOURCE
0
0.01
100
VO
IO SHORT
60
+
50
40
30
20
120
0.1 F
100
V+
VIN
VO
+
V+/2
80
60
V+ = 30 V
40
V+ = 10 to 15 V
20
0
0
40
20
60
80
TA - Operating Ambient Temperature - C
10
100
1k
10 k 100 k 1 M
10 M
f - Frequency - Hz
160
100 k
RL = 20 k
120
RL = 2 k
80
40
10
20
30
V+ - Supply Voltage - V (V = GND)
40
1 k
15
VIN
7V
+15 V
VO
2 k
10
0
1k
5 10 k
30 50 100 k
f - Frequency - Hz
300 500 1 M
PC324
COMMON MODE REJECTION RATIO
Output
Voltage - V
100
80
RL 2 k
V+ = 15 V
3
2
1
0
60
40
Input
Voltage - V
120
20
0
100
1k
10 k
100 k
f - Frequency - Hz
1M
2
1
20
40
Time - s
60
80
SLEW RATE
SR
SR - Slew Rate - V/ s
0.3
SR+
0.2
0.1
V = 15 V
VO = 10 V
0
50
0
50
100
TA - Operating Ambient Temperature - C
PC324
PACKAGE DRAWINGS
7
A
K
L
F
D
NOTES
1) Each lead centerline is located within 0.25 mm (0.01 inch) of
its true position (T.P.) at maximum material condition.
2) ltem "K" to center of leads when formed parallel.
ITEM MILLIMETERS
INCHES
A
B
20.32 MAX.
2.54 MAX.
0.800 MAX.
0.100 MAX.
2.54 (T.P.)
0.100 (T.P.)
0.500.10
0.020 +0.004
0.005
1.2 MIN.
0.047 MIN.
G
H
3.60.3
0.51 MIN.
0.1420.012
0.020 MIN.
I
J
4.31 MAX.
5.08 MAX.
0.170 MAX.
0.200 MAX.
7.62 (T.P.)
0.300 (T.P.)
6.4
0.252
0.25 +0.10
0.05
0.010 +0.004
0.003
0.25
0.01
0~15
0~15
P14C-100-300B1-1
PC324
14 PIN PLASTIC SOP (225 mil)
14
7
A
H
I
C
D
NOTE
Each lead centerline is located within 0.12 mm (0.005 inch) of
its true position (T.P.) at maximum material condition.
ITEM MILLIMETERS
INCHES
10.46 MAX.
0.412 MAX.
1.42 MAX.
0.056 MAX.
1.27 (T.P.)
0.050 (T.P.)
0.40 +0.10
0.05
0.016 +0.004
0.003
0.10.1
0.0040.004
1.8 MAX.
0.071 MAX.
1.49
0.059
6.50.3
0.2560.012
4.4
0.173
1.1
0.043
0.15 +0.10
0.05
0.006 +0.004
0.002
0.60.2
0.12
0.005
0.10
0.004
3 +7
3
3 +7
3
0.024 +0.008
0.009
S14GM-50-225B, C-4
PC324
RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering
processes are used, or if the soldering is performed under different conditions, please make sure to consult with our
sales offices.
For more details, refer to our document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL
(C10535E).
Surface mount device
Conditions
Symbol
IR30-00-1
VP15-00-1
Wave Soldering
WS60-00-1
Caution Apply only one kind of soldering condition to a device, except for partial heating method, or
the device will be damaged by heat stress.
Through-hole device
Conditions
Wave soldering
(only to leads)
Caution For through-hole device, the wave soldering process must be applied only to leads, and make
sure that the package body does not get jet soldered.
PC324
REFERENCE DOCUMENTS
QUALITY GRADES ON NEC SEMICONDUCTOR DEVICES
C11531E
C10535E
IC PACKAGE MANUAL
C10943X
MEI-1202
X10679E
IEI-1212
PC324
[MEMO]
10
PC324
[MEMO]
11
PC324
[MEMO]
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.
M4 96.5