TECHNICAL DATA SHEET

CYANIDE COPPER PLATING PROCESSES

Cyanide solutions provide a medium for direct deposition of copper on bass metals, particularly steel and zinc.
Copper plating by cyanide process have a variety of applications in metal finishing operations such as :
a)
b)
c)
d)
e)

An undercoat for surface finishes of decorative nickel and chromium system.

Thick deposits applied to steel as a "stop-off" coating in case of hardening process such as car burising
and nitriding.
As a base for oxidised or coloured finishes on steel and other metals.
Very useful as a copper strike prior to acid copper sulphate, pyrophosphate or fluborate baths to
avoide immersion plating and to provide excellent bonding to top-coats.
For building-up worn out parts.

The Copper Cyanide baths may be divided into four types :

1.
2.
3.
4.

Simple cyanide copper baths

Rochelle Copper Cyanide baths
High efficiency copper cyanide baths
Semi-bright high efficiency copper
cyanide baths

Cyno copper process

Rochelle Copper process
Cyco copper process
Cuproglo copper process

CYNO DULL COPPER SALT

Recommended general purpose cyanide copper plating where low initial cost and operational economy are
important for use in vat and barrel. This bath is restricted to strike and thin deposits. Usually 1 to 3 microns
are deposited and also used as a base for copper oxidation. Low cathode efficiency of the bath helps in general
cleaning of components to obtain adherent top-coats. The bath composition is little difficult to control at room
temperature for high thick deposits due to low cathode efficiency. It is preferable to operate at elevated temperature
since the cathode efficiency and anode corrosion are higher where slightly high thicknesses are desired.
ROCHELLE COPPER SALTS / CUPROBOND COPPER SALT
These salts are also compounded for general copper plating purposes for use in vat or barrel and are designed
to give a high rate of deposition of fine grained structure. The Rochelle salt in the soluiton helps to increase
the cathode efficiency, better anode corrosion and high cathode efficiency. The bath is less critical and can
be more easily maintained compared to Cyno copper bath. Fine grained, non-porous 5-50 microns of copper
deposits can be obtained from high concentrated Rochelle Copper baths at high temperature operation. It can
also be used for striking of copper at lower metal concentration and lower temperatue. Operation cost of Rochelle
copper salts are higher than Cyno/Cyco copper salts.
CYCO COPPER SALTS
Cyco copper salts are compounded to give high rate of deposition of fine grained structure. The deposit obtained
is most ductile and pore-free. It is mainly used for thick deposit on steel as "stop-off" coating in case of hardening
processes such as carburising and nitriding. These are medium efficiency baths and do not emply costly chemicals
like potassium cyanide and Rochelle salts. These baths are easy to operate and are very economical compared
to potassium and rochelle based very high efficiency, semi-bright Cuproglo copper cyanide baths. Cyco copper
baths have high metal content, low free cyanide and is operated at high temperature. Cathode movement agitation
is preferred to air agitation since air agitation builds up more carbonate in the bath.

CYANIDE COPPER PLATING PROCESSES

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CUPROGLO COPPER PROCESS

Cuproglo semi-bright copper plating process produces smooth, pore-free deposits which gives good corrosion
protection and are easily buffed where this operation is required for special reason. The process provides good
metal distribution and permits high current density operation. High efficiency of over 90% and good throwing
power makes it specially suitable for the economical production of heavy copper deposits on irregular shape
or recessed components. This process can be employed as an undercoat to Nickel Chromium on steel, zinc
base die castings, "stop-off" for selective case hardening etc. Cuproglo formulations are based on all potassium
baths to offer high efficiency. However, mixed sodium potassium or sodium baths can also be used with slightly
lower cathode efficiency. For more details refer our catalogue of Cuproglo Copper Plating Process.
EQUIPMENT
It is preferable to use polypropylene, PVC or approved rubber lined steel tanks for cyanide copper plating. An
insulating lining prevents the tank from becoming bipolar and plating up on certain areas. It also minimizes
iron pick-up in the solution which complicates the analysis and may affect the deposit when built up to a high
concentration. Unlined tanks can be used with above referred limitations. Stainless steel/M.S. heaters, heat
exchangers or coils are recommended. Continuous filtration is recommended where high thickness and porefree deposits are desired. For general purposes, occassional filteration is sufficient. Cathode agitation is preferable
to air agitation as air agitation converts cyanide to carbonate at a rapid rate. fume extraction is recommended.
SOLUTION PREPARATION
Fill the tank 1/2 or 2/3rd full of distilled water and heat it to 50C. Add the copper salt and dissolve it by vigorous
stirring until all the salt is dissolved. Filter the solution and use it. For preparing the Cuproglo solution refer
the catalogue of Cuproglo copper process.
ANALYSIS METHOD FOR COPPER PLATING BATHS
Copper Metal
Reagents
0.1 M E.D.T.A.
Murexide Indicator
Sulphuric Acid (Conc.)
Nitric Adic (Conc.)
Ammonia
Procedure
Take 10 ml of sample in the conical flask and add 10 ml of HNO3 followed by 10 ml H2SO4 to it in the fume
cupboard. Heat it on the hot plate until all the cyanides are decomposed and heavy fumes of H2SO4 begin
to be evolved. Cool the flask and dilute the solution to 100 ml in standard measuring flask. Pipette out 10 ml
of diluted solution and add ammonia till it is just dark blue. Dilute it with distilled water and add a pinch of
murexide indicator and titrate it against 0.1M E.D.T.A. till violet colour appears.
ml of EDTA x 6.354 = g/l Cu metal
FREE SODIUM OR POTASSIUM CYANIDE
Reagents
0.1 N Silver Nitrate
10% Potassium Iodide solution
Procedure
Pipette out 10 ml of soluiton and add 150 ml water and 2 ml of 10% potassium Iodide solution. Titrate it against
0.1 N silver nitrate with vigorous shaking till the first appearance of a permanent yellowish white turbidity.
ml of 0.1 N AgNO3 x 0.98 = g/l free NaCN
ml of 0.1 N AgNO3 x 1.3 = g/l free KCN
CYANIDE COPPER PLATING PROCESSES

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Issued on 9.11.2001
Supersedes all earlier

CYANIDE COPPER PLATING PROCESSES

also available online at www.growel.com