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DESCRIPTION
The TDA2030 is a monolithic integrated circuit in
Pentawatt package, intended for use as a low
frequency class AB amplifier. Typically it provides
14W output power (d = 0.5%) at 14V/4; at
14V the guaranteed output power is 12W on a 4
load and 8W on a 8 (DIN45500).
The TDA2030provideshigh outputcurrent and has
very low harmonic and cross-over distortion.
Further the device incorporates an original (and
patented) short circuit protection system comprising an arrangement for automatically limiting the
dissipated power so as to keep the working point
of the output transistors within their safe
operating area. A conventional thermal shutdown system is also included.
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Vs
Supply voltage
Vi
Input voltage
Vi
Io
Ptot
Tstg, Tj
TYPICAL APPLICATION
Pentawatt
Value
Unit
18
Vs
15
3.5
V
A
20
-40 to 150
March 1993
1/11
TDA2030
+VS
OUTPUT
-VS
INVERTING INPUT NON
INVERTING INPUT
TEST CIRCUIT
2/1
1
TDA2030
THERMAL DATA
Symbol
Rth j-case
Parameter
Thermal resistance junction-case
Value
Unit
C/W
max
Parameter
Vs
Supply voltage
Id
Ib
Vos
Ios
Po
Output power
Distortion
Ri
Gv
Gv
eN
iN
SVR
Id
Drain current
Tj
Test conditions
Min.
Typ.
Max.
Unit
18
40
60
mA
0.2
20
mV
20
200
nA
Vs = 18V
Gv = 30 dB
d = 0.5%
f = 40 to 15,000 Hz
RL = 4
RL = 8
d = 10%
f = 1 KHz
RL = 4
RL = 8
12
8
14
9
W
W
18
11
W
W
Gv = 30 dB
Po = 0.1 to 12W
RL = 4
Gv = 30 dB
f = 40 to 15,000 Hz
0.2
0.5
Po = 0.1 to 8W
RL = 8
Gv = 30 dB
f = 40 to 15,000 Hz
0.1
0.5
Gv = 30 dB
Po = 12W
RL = 4
0.5
f = 1 kHz
29.5
B = 22 Hz to 22 KHz
RL = 4
Gv = 30 dB
Rg = 22 k
Vripple = 0.5 Veff
40
10 to 140,000
Hz
90
dB
30
30.5
dB
10
80
200
pA
50
dB
fripple = 100 Hz
Po = 14W
RL = 4
900
mA
Po = W
RL = 8
500
mA
145
C
3/11
TDA2030
Figure 3 . Di stor ti on v s .
output power
Fi gur e 4 . Di stortion v s.
output power
Figure 5. Di stortion vs .
output power
Figure 6 . Di stor ti on v s .
frequency
Figur e 7 . Di stor ti on vs .
frequency
4/1
1
power
TDA2030
APPLICATION INFORMATION
Figure 13. Typical amplifier
5/
1
1
TDA2030
Figure 17. Bridge amplifier configuration with split power supply (P o = 28W, Vs = 14V)
6/1
1
TDA2030
PRACTICAL CONSIDERATIONS
packageandthe
heatsinkwith
The layout shown in Fig. 16 should be adopted bysinglesupplyvoltage
the designers. If different layouts are used, the configuration.
ground points of input 1 and input 2 must be well
decoupled from the ground return of the output in Application
which a high current flows.
suggestions
Printed circuit board
Assembly suggestion
No electrical isolation is needed between the
Component
Recomm.
value
Purpose
R1
22 k
R2
680
R3
22 k
R4
Frequency stability
The recommended
values of the
components are those
shown on application
circuit of fig. 13.
Different values can be
used. The following
table can help the
designer.
Larger than
Smaller than
recommended value
value
R5
3 R2
C1
C2
recommended
Upper frequency
cutoff
Increase of gain
1 F
Input DC
decoupling
(*)
22 F
Inverting DC
decoupling
C3, C4
0.1 F
Supply voltage
bypass
C5, C6
100 F
Supply voltage
bypass
C7
0.22 F
Frequency stability
C8
1
2 B R1
Upper frequency
cutoff
Decrease of gain
Increase of gain
Increase of input
Decrease of input
impedance
impedance
Danger of osccilat. at
high frequencies
with induct. loads
Poor high frequencies
Danger of
attenuation
oscillation
Inc
re
as
e
of
lo
w
fre
qu
en
cie
s
cut
off
Inc
re
as
e
of
lo
w
fre
qu
en
cie
s
cut
off
Da
ng
er
of
os
cill
ati
on
Da
ng
er
of
os
cill
ati
on
Da
ng
er
of
os
cill
ati
on
Smaller bandwidth
D1, D2
1N4001 To protect the
device against output voltage spikes
Larger bandwidth
TDA2030
Fi gur e 1 8 . Ma ximum
output c urr ent v s .
voltage [VCEsat] across
each output transistor
THERMAL SHUT-DOWN
The presence of a thermal limiting circuit offers
the following advantages:
2.
TDA2030
Figure 20. Output power and
dra i n cur rent vs . c ase
temperature (RL = 4)
Fi gur e 2 2. Ma ximum
allowable power dissipation
vs. ambient temperature
Dimension : suggestion.
The following table shows the length that
the heatsink in fig.23 musthavefor several
values of Ptot and Rth.
Ptot (W)
Length of heatsink
(mm)
Rth of heatsink
( C/W)
12
60
40
30
4.2
6.2
8.3
9/
1
1
TDA2030
DIM.
MIN.
inch
TYP.
MAX.
MIN.
TYP.
MAX.
4.8
0.189
1.37
0.054
2.4
2.8
0.094
0.110
D1
1.2
1.35
0.047
0.053
0.35
0.55
0.014
0.022
0.8
1.05
0.031
0.041
F1
1.4
0.039
0.055
3.4
0.126
0.134
0.142
G1
6.8
0.260
0.268
0.276
H2
10.4
H3
10.05
0.409
10.4
0.396
0.409
17.85
0.703
L1
15.75
0.620
L2
21.4
0.843
L3
22.5
0.886
L5
2.6
0.102
0.118
L6
15.1
15.8
0.594
0.622
L7
6.6
0.236
0.260
4.5
M1
0.177
Dia
0.157
3.65
3.85
0.144
0.152
D
L2
L3
H3
L5
L6
F1
L7
H2
Dia.
G1
D1
M1
L1
10/11
TDA2030
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use.
No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously
supplied. SGS-THOMSON Microelectronics products are not authorizedfor use as critical components in life support devices or systems
without express written approval of SGS-THOMSON Microelectronics.
1994 SGS-THOMSON Microelectronics - All Rights Reserved
SGS-THOMSON Microelectronics GROUP OF COMPANIES
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