FMEA P

USE THIS FOR YOUR REFERENCE
SPEC. # 4. .1-P1-DCS
FMEA Number : FMEA-034

Prepared by :
FMEA Date:
POTENTIAL
FAILURE MODE AND EFFECT
ANALYSIS
(PROCESS FMEA)
Process : MOLD
Product :
Core Team :
Process
Function
Requirements
Mold
P Page
8 of 24
Process Responsibility :
Key Date :
Potential
Failure
Mode
Package
void
SPEC. NO.
SHEET
Exposed
die and
epoxy
Potential
Effect(s)
of Failure
S
e
v
C
L
A
S
S
Potential Cause(s
Mechanism(s)
of Failure
O
c
c
u
r
Current
Process
Controls
Prevention
Current
Process
Control
Detection
D
e
t
e
c
R
P
N
Brushing
using copper
brush &
airblow
gun before
& after
molding
Defined
mold tool
cleaning
procedure
In-process
monitoring /
visual inspection
12
Cleaning of mold
tool every 3 days
Follow the required

temp. during preheating of mold
compound
18
Review of PCI
prior prodn use
as reference
36
In-process
monitoring/ visual
Inspection
In-process
monitoring/
visual inspection
27
18
24
Reliability
failure
Clogged air vent

due to accumulated
dirt on air vent
Customer
complaint
Dirty mold tool

surface
Reliability failure /
low yield /
customer
complaint
Reliability failure
Inconsistent preheating of molding

compound due to
different technique
of the assigned optr
per mold press
Wrong placement of
die. Bonding diagram
used was not updated
10
Pitted
package
Low yield
Low/ high temp.

due to loose thermocouple wire
Accumulated dirt
on cavity surface
due to improper
cleaning of mold tool
OF
26
FORM # DC -0 3 REV. A
Low yield /
customer
complaint
Fan lead
Low yield
Low clamp pressure
Defined
procedure in
updating and
securing
bonding
diagrams
Reduce/
increase the
mold temp.
from 175 +
15 C
Removed the
accumulated
dirt using
brass plate
& air blow
gun prior
mass prodn
Cleaning of
mold tool
every 3 days
Defined
mold
parameter
REV.
SPEC # 4.2.3.5-P1-FMEA
Calibrate every
start of the shift
Recommended
Action(s)
DCC to secure
old BDs from
prodn area,
only
latest rev.
should be used
Responsibility
& Target
Completion Date
F. Yabut
Action Results
Action
Taken
S
e
v
O
c
c
D
e
t
R
P
N
Done
24
FORM # FMEA-001 REV. A
SPEC. # .5. -P1-DCS

Prepared by :
FMEA Date:
POTENTIAL
ANALYSIS
(PROCESS FMEA)
Process : MOLD
Product :
Core Team :
Process
Function
P Page
9 of 24
Key Date :
Potential
Failure
Mode
Potential
Effect(s)
of Failure
Requirements
Mold
Incomplete
fill
Low yield
S
e
v
C
L
A
S
S
Potential Cause(s
Mechanism(s)
of Failure
Unparallel mold
platen surface
Clog air vent
SPEC. NO.
SHEET
3
3
FORM # DC -003
Chip out
Low yield
High mold temp.
Low mold temp.
Embedded plastic on
cavity surface
EV. A
Package
crack
Low yield
O
c
c
u
r
Inadequately cleaned
corner of die cavities
Sticky molding
compound
Ejector stuck up
Current
Process
Controls
Prevention
Defined
cleaning
procedure
of air vent
Defined
cleaning
of mold
surface
Defined
mold temp.
QC
monitoring of
mold temp.
2X/ shift
Defined
mold
procedure
Unused
pressurized
air blow gun,
Cu brush to
clean up
top & bottom
die
Mold
cleaning
procedure
Current
Process
Control
Detection
D
e
t
e
c
R
P
N
Mach PM semiannual/ spot

adjustment of
mold chase
Checking of air
vent every start
of the shift
36
45
Cleaning/ air blow

mold surface
every shot
16
Machine calibration
2 X per shift
Machine
calibration per
shift
45
45
Visual inspection
of mold shot
3x min/ shift
In-process
monitoring / visual
Inspection
48
32
Cleaning of mold
every start of
shift/ change of
device
Further shot of
mold release
agent #x after
mold cleaning
Machine PM
2x/ annum/ spot
adjustment of
ejector spring
48
60
36
Recommended
Action(s)
Responsibility
& Target
Completion Date
Action Results
Action
Taken
S
e
v
O
c
c
REV.
D
e
t
R
P
N
SPEC. # 4. .1-P1-DCS
POTENTIAL
ANALYSIS
(PROCESS FMEA)
P Page
Process : MOLD
Process
Function
10 of 24
12-18-06
Potential
Failure
Mode
Potential
Effect(s)
of Failure
Requirements
Mold
Delamination
Low yield/
Customer
complaint
S
e
v
C
L
A
S
S
Potential Cause(s
Mechanism(s)
of Failure
SPEC. NO.
12
Current
Process
Controls
Prevention
Current
Process
Control
Detection
D
e
t
e
c
R
P
N
Defined
curing
reqrments
Store the
bare units at
the dry box
with N2
Pre-heat at
the lead
frame prior
molding
process
Defined
transfer
pressure
Machine
Calibration
2x/ shift
Visual inspection
45
48
32
Machine checking
2x/ shift
60
Machine PM 2x/
annum/ spot
removal of plastic
Machine checking
2x/ shift
50
60
50
60
45
Insufficient cure time
Unwanted
contaminants on
leadframe
SHEET
O
c
c
u
r
Insufficient transfer
pressure
Plastic seep along

the edge of the
mold tool
High clamp pressure
Package
mismatch
Low yield
Tool mark
Low yield
Customer
complaint
Leadframe not reclined

flat on the mold chase
Pinched
lead
Low yield
Defective guide pin
Dirty
package
Low yield
Accumulated dirt
on mold die surface
OF
Defined
clamp
pressure
Documented
procedure
during mold
Guide pin
change
based on
defined tool
life
Defined and
documented
cleaning
procedure
Visual insp. of
mold shot
3x min/ shift
Machine PM 2X /
annum/ spot
replacement of
defective guide
pin
Cleaning of mold
every start of
shift/ change
of dev.
Recommended
Action(s)
Responsibility
& Target
Completion Date
Action Results
Action
Taken
S
e
v
O
c
c
26
REV.
FORM # DC -003 REV. A
D
e
t
R
P
N
SPEC. # 4.5.1-P1-DCS
POTENTIAL
ANALYSIS
(PROCESS FMEA)
Process
Potential
Potential
Function
Failure
Mode
Effect(s)
of Failure
e
v
L
A
S
S
Potential
Cause(s
Mechanism(s)
of Failure
Current
Current
Recommended
Responsibility
c
c
u
r
Process
Controls
Prevention
Process
Control
Detection
e
t
e
c
P
N
Action(s)
& Target
Completion Date
Action
Taken
Requirements
ELECTRO PLATE
Solderability
Failure
- Poor Contact on
Board
- Yield Loss
- Customer
Complain
Low Plating
Thickness.
Wrong bath
concentration
and
temperature.
Failed pre/post
plating chemical
concentrations.
Overlapping of
units at the
loading area.
Flashes/resin
bleeds on leads
High plating
current
application
SPEC. NO.
SHEET
Exposed
Metal/
Incomplete
Plating/
Plating
Voids
- Cosmetic
Failure
- Yield Loss
- Solderability
Failure
- Customer
Complain
- Optimize plating
parameters per
package type.
- Set plating
thickness limits
Correct bath
concentration and
temperature.
- Set limits for
pre/post/plating
chemical conc.
- Conduct chemical
analysis and
maintenance on a
daily and weekly
basis.
Ensure proper stripto-strip loading at the
machine loading
area.
Optimize deflashing
parameters
16
Rough
Deposit/
Blisters/
Bubbles
OF
- Cosmetic
Failure
- Yield Loss
- Solderability
Failure
- Customer
Complain
Optimize plating
parameters per
pkge. type
26
REV.
FORM # DCS-003 REV. A
Action Results
- PT
measurements
- Solderability Test
- QC Gate
45
- Titration Results
- Temp. monitoring
1x /shift
45
- Daily chemical
monitoring and
dumping record.
- QC Gate
36
- Loader spot
checking every
load.
- QC Gate
- Checking of
deflash parameters
during qual, pkge.
set-up or
conversion.
- QC Gate
-Plating current
checking during
qual, set-up or
conversion
- QC Gate
36
36
36
S
e
v
O
c
c
D
e
t
R
P
N
SPEC. # .5. -P1-DCS
POTENTIAL
ANALYSIS
(PROCESS FMEA)
Process : Electroplating
12-18-06
Process
Potential
Potential
Function
Failure
Mode
Effect(s)
of Failure
e
v
L
A
S
S
Potential
Cause(s
Mechanism(s)
of Failure
Current
Current
Recommended
Responsibility
c
c
u
r
Process
Controls
Prevention
Process
Control
Detection
e
t
e
c
P
N
Action(s)
& Target
Completion Date
- Set conc. limits for

pre/post/
plating chemicals.
- Conduct chemical
analysis and
maintenance on a
daily and weekly
basis.
pre/post/
plating chemicals.
- Conduct chemical
analysis and
maintenance on a
daily and weekly
basis.
Regeneration of DI
water for production
use.
- Daily chemical
monitoring and
dumping record.
- QC Gate
36
- Daily chemical
monitoring and
dumping record.
- QC Gate
45
- Water quality
monitoring 1x/shift
45
Action
Taken
Requirements
SPEC. NO.
SHEET
Peel-Off/
Peeling/
Flaking
ELECTRO PLATE
Discoloration/
Contamination
FORM # D S-0 3 REV. A
- Cosmetic
Failure
- Yield Loss
- Solderability
Failure
- Customer
Complain
- Cosmetic
Failure
- Yield Loss
- Solderability
Failure
- Customer
Complain
Failed
pre/post/plating
chemical conc.
Failed
pre/post/plating
chemical conc.
Failed water
quality used
during
production
Failed water
quality used
during
production
Regeneration of DI
water for production
use.
- Water quality
monitoring 1x/shift
- QC Gate
36
Low water
pressure and
flowrates
Set limits for water

pressures and
flowrates.
36
Low product
drying
temperature
Set limits for product

drying temperature
- Water pressures
and flowrates
monitoring 1x/shift
- QC Gate
- Monitor product
drying temp. 1x/shift
- QC Gate
36
Action Results
S
e
v
O
c
c
D
e
t
R
P
N
REV.
SPEC. # .5. -P1-DCS
POTENTIAL
ANALYSIS
(PROCESS FMEA)
Process : ELECTROPLATE
Process
Potential
Potential
Function
Failure
Mode
Effect(s)
of Failure
e
v
L
A
S
S
Potential
Cause(s
Mechanism(s)
of Failure
Current
Current
Recommended
Responsibility
c
c
u
r
Process
Controls
Prevention
Process
Control
Detection
e
t
e
c
P
N
Action(s)
& Target
Completion Date
Action
Taken
Requirements
Excess
tin/Dentrites/
Potrusion/
Extraneous
Plating/
Tin bridging
SPEC. NO.
SHEET
Tin W hiskers
Pb
Contamination
- Yield Loss
- Interlead
shortening
- Customer
Complain
- Yield Loss
- Interlead
shortening
- Customer
Complain
- Yield Loss
- Cosstumer
Complain
High plating
current
application
Optimize plating
parameters per
pkge. type
-Plating current
checking during
qual, set-up or
conversion
- QC Gate
45
Failed
pre/post/plating
chemical conc.
- Daily chemical
monitoring and
dumping record.
- QC Gate
45
Intermettalic
and stress build
up.
- Lot traveler
- QC Gate
- Reliability Test
45
Low Plating
Thickness.
45
Wrong addition
of Pb on the
plating solution
- PT
measurements
- QC Gate
- Pb monthly
outside test results
monitoring.
- 1x/month
- Pb monthly
outside test results
monitoring.
- 1x/month

pre/post/
plating chemicals.
- Conduct chemical
analysis and
maintenance on a
daily and weekly
basis.
100% of the plated
units are subject for
oven
curing/annealing for
1Hr+5mins/-0 @
150-160C
Temperature
within 24Hrs.
Optimize plating
parameters per
package type.
- Designate
dedicated Machine
for Pbfree process.
30
30
Set Pb content limits

on the plating
solution
Action Results
S
e
v
O
c
c
6
REV.
FO M # CS 003 REV. A
D
e
t
R
P
N

FMEA P

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FMEA P

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USE THIS FOR YOUR REFERENCE

FMEA Number : FMEA-034

Follow the required

Clogged air vent

Dirty mold tool

Inconsistent preheating of molding

Low/ high temp.

Low clamp pressure

FORM # FMEA-001 REV. A

USE THIS FOR YOUR REFERENCE

SPEC. # .5. -P1-DCS

FMEA Number : FMEA-034

Clog air vent

High mold temp.

Low mold temp.

Mach PM semiannual/ spot

Cleaning/ air blow

FORM # FMEA-001 REV. A

USE THIS FOR YOUR REFERENCE

FMEA Number : FMEA-034

Insufficient cure time

Plastic seep along

Leadframe not reclined

Defective guide pin

FORM # FMEA-001 REV. A

FORM # DC -003 REV. A

USE THIS FOR YOUR REFERENCE

FORM # DCS-003 REV. A

USE THIS FOR YOUR REFERENCE

FORM # FMEA-001 REV. A

SPEC. # .5. -P1-DCS

FMEA Number : FMEA-034

- Set conc. limits for

FORM # D S-0 3 REV. A

Set limits for water

Set limits for product

FORM # FMEA-001 REV. A

SPEC. # .5. -P1-DCS

FMEA Number : FMEA-034

- Set conc. limits for

Set Pb content limits

FORM # FMEA-001 REV. A

USE THIS FOR YOUR REFERENCE

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