Professional Documents
Culture Documents
A-Financing:
-Bank interest rate for short term loan.
-Bank interest rate for long term loan.
-Bank discounting rate.
-Grace period granted by banks (usually banks give 2 3 years for such type of projects)
-Repayment period for the long term loan
-Equity to Loan ratio
B -Market Study:
-Capacity Estimation .. MW/Year (for Egypt and for Export)
C- Cost of Utilities:
-Price of one sq. m of land
-Cost of Utility Infra Structure and unit cost:
Electricity Supply + cost/Kwh
Natural Gas Line + cost /cu. m
Water Supply Line + cost/cu. m
Sewage Connection
Telephone Lines and Internet
e- Pre-operation Cost:
- Cost of License and Approvals required
- Fees of Engineering phase and supervision of erection.
- Consultant fees.
erection
H-Indirect Cost:
-Staff salaries (ALL inclusive: taxes, insurance, lodging, bonus per month)
Note: Estimation of number of persons for each job is required.
General Manager.
Senior Accountant ( minimum 10 years experience in similar field)
Accountant (minimum 5 years experience)
Lawyers
PR manager
Office and Security Staff (minimum 5 years experience)
Office boy
Drivers
-Depreciation of machines and buildings.
-Office cost.
-Marketing Cost.
The Egyptian government has rolled out financial initiatives to support expansion of renewable energy infrastructure as the country gets to ready to
host landmark auctions of 4 GW renewable energy capacity.
Egypts government has approved new feed-in tariffs for renewable energy projects . The electricity minister hopes that these new tariffs will attract
bidders to the auctions, and provide certainty to investors.
The tariff regulations are quite comprehensive, and cover small as well as large-scale power projects. Renewable energy projects owned by households
would receive 0.848 Egyptian Pounds (LE0.848) for every kWh generated. Commercial power generators would receive LE0.901 per kWh and
LE0.973 per kWh for projects under 200 kW and 200 to 500 kW respectively.
Large-scale projects with capacity between 500 kW and 20 MW will be eligible for tariff of US$0.136 per kWh, while projects with capacity between
20 MW and 50 MW will receive US$0.1434 per kWh. The government has set 50 MW as the maximum limit for project size, but requests for higher
capacity may be considered.
The government will also provide financial and other incentives to project developers, households, and commercial producers. For small-scale
projects, the government will offer low-cost debt financing, while large-scale project developers will be allowed to pay custom duties at concessional
rates for imported equipment.
Egypt has set a target to generate 20% of the power demand from renewable energy sources by 2020. The emphasis would be on wind energy as the
government plans to add 7,200 MW new. capacity by the end of this decade.
A recent renewable energy tender held in Egypt, January 2015 the first in the Middle East at the gigawatt scale was
oversubscribed twice over for solar energy projects, according to recent reports.
As per the reports, around 177 international consortiums of various companies applied for solar and wind project contracts.
Out of the 177 that applied, 67 have now been chosen to develop roughly 4.3 GW of solar and wind energy projects in the
country. Out of these approved projects, at least 40 are solar energy projects, with the rest being wind energy projects.
This recent tender, and the project approvals that have followed, comes as Egypts energy problems have been hitting a highpoint. The countrys recent moves to attract foreign investment and spur a renewable energy buildout are intended, at least
partially, to address this issue. Considering the countrys great solar energy potential, the move certainly makes good
sense. The biggest potential hurdle is the relative political instability of the region at the moment, but that apparently didnt
scare away project developers.
The Egyptian power sector seems a perfect start for the joint venture. The country plans to boost its renewable energy generation and source 20% of
the total electricity needs from wind and solar power projects by 2020.
Egypt is planning to auction 30 GW of power generation capacity based on renewable energy and coal. The aim is to drive down the selling price of
electricity by promoting competition among international companies. Among the renewable energy technologies the focus is expected to be on wind
energy. The country is already among the largest markets for wind energy in the Middle East and North Africa (MENA) region.
Of the 20% renewable energy share targeted by 2020 in the power generation, 12% is expected to be achieved through wind energy, and the balance
8% from solar power and hydro power. To achieve this, the Egyptian government is planning to auction 7,200 MW of wind energy capacity by 2020.
Egypt is looking to attract foreign investors in the renewable energy auctions through supportive regulatory frameworks and backing of
development banks for debt financing. Last year, the government announced feed-in tariffs for renewable energy project developers as well as
homeowners. The utility-scale renewable energy projects are eligible for tariffs of up to 14.34 per kWh. Utility-scale project developers would also
be eligible for concessional interest rates on imported equipment.
The first auction, conducted in early January, attracted significant interest from global companies. The solar power capacity auction was subscribed
twice over with developers looking to develop as much as 4.3 GW generation capacity. The wind energy auction was comparatively muted but the
government is expected to conduct another wind energy auction in the near future.
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2)
3)
4)
capacity. Also slow the projects estimated market share on a year by year (segmented, if applicable, by product and/or product group; units and value,
customer/market segment and region).
7. Competition
What is the internal/external competition to the project, e.g., competitive brands, their price range & market share? How will competition affect the ability of the
project to achieve the estimated market share? What are the strengths and weaknesses of individual competitors?
8. Distribution
How will the product(s) from the factory reach the ultimate consumer?
What distribution channels are proposed? How do these compare with those used by competitors?
What transportation methods, storage facilities and warehousing will be used? What is the cost, and how pays it?
9. Marketing Organization
Structure of marketing and sales department including staff numbers, qualifications, nationalities, experience and job descriptions (Including CVs of
management if already recruited).
10. Sales Promotion/Marketing Support
Detailed plans for advertising and other sales promotion activities both to the trade channels and consumer/end-users. Planned budgets and percentage of
these to estimated, broken down by type of media to be used. Rationale for the proposed plans and projected expenditure. Information to be provided on
plans/budget for the company product launch.
11. Marketing Agreements
Copies should be provided of any marketing agreements (including Agency, Representation, Trade Mark, Distribution etc., agreements) which may exists or in
draft whether these be with local companies or foreign partners. Indicate the marketing input from such partners.
6) Specify number of units in a package and specify wrapping cartons, boxes, pallets etc
7) Are the products entirely new or similar to existing products in the market? Are they capable of being modified if required?
2. The Process
1) A description of each operation in the process from raw material to finished product. This should specify the function of each piece of equipment needed
(e.g., press to form curved metal shapes; steam boiler for heating or drying or curing; tanks for storage, pumps and pipe lines).
2) A flow diagram showing the route of each piece of raw material through its various processes.
3) A scaled and dimensioned layout of equipment and machines within the factory showing storage areas for raw materials, work in progress, finished products,
maintenance workshop, laboratory etc.
4) This plan of the layout should show the number of men at each piece of equipment during a production shift. This staffing distribution should be in line with
the numbers of workers of different degrees of skill provided subsequently in the list of workers and salary requirements.
5) Special equipment for waste treatment must be described (incinerators for burning; liquid effluent treatment plants; air filtration).
6) Specific internal factory environment controls vital to the process must be explained. For example, processing of paper and textiles requires strict
atmospheric control. Processing of food requires hygienic safeguards; toxic chemicals require safety procedures for workers and the general public; highly
inflammable materials require special concentration on fire protection. The cost of providing these safeguards will ultimately appear in either building or
equipment costs.
7) Explain the measures taken to treat the factory waste whether gas, liquid or solid in order to make it meet the specifications set out by relevant Government
Authorities.
3. Installed Capacity
1) Indicate the installed capacity of the machinery as contracted with supplier. Show detailed calculations of this capacity and the basis on which it was built
(e.g. for the production of 1,000 small units of product (A) and 100 large units of product (A) a year). The capacity of each piece of machinery should be
specified.
2) The proposed hours per day and days per year must be provided in relation to these quantities.
4. Machinery & Equipment
1) A complete detailed list of machinery and equipment must be provided.
2) Each item must be itemized by type, model, weight, etc....... . Descriptive pamphlets to be presented, whenever possible.
3) The estimated Equipment must be CIF nearest port.
4) Internal factory cranes, pallet trucks, mobile cranes; gantry cranes, monorails and other fixed lifting structures should be itemized under the heading above.
5) Adequate spare parts for at least the first year of operation must be made included.
5. Buildings
1) A location plan of the site in the appropriate city or industrial area.
2) A site plan showing the site boundaries, adjacent roads and the position and size of all buildings on the site. Proposed supporting buildings, internal roads
and parking spaces must be shown.
3) A site plan showing the positions of connection points to main utilities (sewage, water, power).
4) Drawings of buildings giving plan areas, elevations and cross sections. These drawings should clearly indicate the methods and materials of construction of
the buildings, floors and foundations.
5) A brief specification of the main features of the buildings is required.
6) A drawing showing fire prevention equipment and safety measures to guarantee the safety of the project and its workers from the danger of fire or any other
dangers that the project may face.
7) Estimation for civil works and buildings must be obtained (detailed specification or a bill of quantities).
8) In case the building and civil works quotation does not include land preparation costs, separate quotations must be provided to include, for example, the
following;
- Site clearing
- Excavation
- Infilling
- Any other special work related to land preparation.
6. Transportation
A list must be prepared of all the required transport vehicles including distribution and delivery trucks, employee cars, staff buses, forklifts, etc., An explanation
of the need for such vehicles must be provided bearing in mind that the required vehicles must be in line with the qualities of products expected to be
distributed in the initial years of operation and the areas of the products will be distribution in.
7. Furniture & Office Equipment
A list must be drawn up of office furniture and equipment required including office furniture, computers, telephone system, canteen equipment and furniture,
copying machines, etc.
8. Labour
1) In addition to the layout plan showing factory operatives? work stations (Section 2d), a complete list of all persons employed by the company is required.
This must give job titles basic monthly salaries and all additional expenses for social security, travel, accommodation, bonuses etc.
2) The source of the factory labour force should be specified (foreign, local).
3) Procedures for training people must be described and a plan for recruiting Saudis must be provided.
9. Raw Materials
1) A list of each different type of raw and packing material must be provided. This list should show the both current unit cost prices and those expected in the
first year of start up.
2) The list must include both raw materials for manufacture and items bought in as finished goods.
3) A detail calculation of raw and packaging materials for each single unit of the product must be provided. The Calculations must show the quantities required
for every raw material and its cost.
4) The annual consumption of these materials related to licensed output must be provided.
5) A reasonable allowance for wastage in processing should be made and the amount specified.
10. Utilities
1)
Requirements for electricity, fuel and water must be provided its source, type, quantity and its cost.
2)
The cost estimation should clearly state front fees, annual fees and unit price.
6) A detailed time schedule for implementing the project from the start of the implementation to the commercial production must be provided.
What Are the Differences Between a Merchandising Company & a Manufacturing Company?
Solar cells, which are also called solar panels or photovoltaics, transform natural sunlight into usable energy. Considering the volatile future -- and affordability
-- of fossil fuels and other conventional energy sources, manufacturing solar cells for home or industrial use could prove to be a lucrative business opportunity.
Manufacturing solar cells can be a time-consuming process, so initially focus your production on a specific market for solar cells, such as the home, a farm or an
industrial setting. Beyond the day-to-day operations and planning of the business, knowledge of how solar cells work and how to most efficiently assemble
them in large quantities will also help ensure the future success of your business.
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seek advanced-engineering degrees or credentials specific to generating solar energy, such as certification as a solar installer, builder and technician or a
technical-sales expert. Many community and technical colleges offer certification and associate-degree programs for solar manufacturing and service jobs,
according to the BLS, though independent-certification agencies such as the North American Board of Certified Energy Practitioners offer independent solarenergy certification and training programs.
Step 4
Rent, lease or buy an industrial space that is zoned for manufacturing and has enough space to accommodate your machinery and workers who will weld and
solder the more-intricate components of the panels. Many commercial-scale manufacturers use computer numerically controlled -- or CNC -- machines to
expedite production, according to the BLS; these machines range in size from 3 to 4 square feet to more than 7 square feet and are controlled by a computer
technician. Before you commit to a facility, hire a building inspector to certify that the prospective facility's electrical infrastructure is able to safely power the
machinery you intend to use.
The poly-crystalline or mono-crystalline ingots are cut to wafers. Poly-crystalline material is mostly cut to square wafers,
while mono-crystalline material is used to produce round wafers. In many cases square material with rounded edges is
prepared from round wafers in order to get a denser packing of the solar cells in the solar module.
Manufacturing of pure silicon, starting from reduction of quarz sand with carbon, cleaning of the raw silicon by
transfer to trichlorosilane and destillation of it and finally deposition of poly-silicon under hydrogen atmosphere.
Manufacturing of the starting material can be done only by the large silicon manufacturers and is therefore not explained
on this page in detail. All further manufacturing steps are described below. You can receive more detailed information for
many productions steps by following the links in the text..
Solar Wafer
Manufacturi
ng
Czochralski
crystal growing
(monocrystalline)
and ingot casting
(poly-crystalline)
of p-doped,
Boron-containing
Silicon
Cutting of
columns
using a wire saw
Wafer sawing
using a wire saw.
A complete block
can be cut at a
time.
Solar Cell
Manufacturi
ng
Texturing, KOHetching
for increasing the
surface and
increasing the
light absorption
n-doping with
phosphorus
(POCl3) and
diffusion in a
diffusion furnace
for formation of
the photo diode
and p/n-junction
PSG-etching with
hydrofluoric acid
HF
for removal of
the surface oxide
Anti reflection
coating ARC with
Si3N4
in PECVDequipment
for improving the
light incidence
angle
Contact
formation by
printing metal
paste on the cell,
using a screen
printing machine.
On the front side
silber fingers are
formed while the
backside is
covered
completely with
an aluminum
layer.
Firing Furnace
for metal film
hardening.
Solar
Module
Manufacturi
ng
Tabbing and
stringing
Layup on the
glass and
interconnecting,
bussing
Electric
inspection
Testing and
Packing
In order to setup a continuous production line, of course a lot of automation equipment is necessary also.
The company is Crystec can offer many types of machine for this application, new or used. For solar module
manufacturing, we can even offer a complete turn-key production line. Please send us your project requests and details!
FEATURES
320 Kw
Power Consumption*
160 Kw
Air Consumption*
5.000 L/min
Required Area (L x W )
40 X 25 m.
Operators
15 ~ 20
modules / hour
27.2
*Power requirements may vary according to final lay-out and optional equipment choices.
FEATURES
30MW PRODUCTION LINE
Installed Power*
180 Kw
Power Consumption*
80 Kw
Air Consumption*
3.000 L/min
Required Area (L x W )
35 X 25 m.
Operators
12 ~ 16
modules / hour
13.6
*Power requirements may vary according to final lay-out and optional equipment choices.
Purchasing solar cells and use EMS service our partner in Korea for manufacturing solar moduls.
Buying solar cells and manufacture solar panels by yourself with machines and equipment from us.
Buying
Solar Cells
Buying/EMS
Solar Moduls
You
Manufacturer
Solar Farm
Solar Cell
Manufacturing
Solar Modul
Manufacturing
Equipment
Equipment
Final Customer
The market can be developed already in an early stage and customer relations can be built already during the
establishment of an own solar modul factory.
The size of the factory can be dimensioned in a way, that no larger free capacities are generated. Overshooting
demand can be covered by electronic manufacturing services EMS.
Financing can be arranged in steps and the risk of failing business is reduced.
After that the real planning can be started. It is necessary to do it in several steps:
1. Project Feasibility Phase
o Preparation of the factory architecture and layout.
o Identification of all modules required for production.
o Estimation of the rough budget.
2. Pre-implementation, Module qualification, Approved Vendor List or BOM
o Identify supply chains.
Please contact us! We can make proposals to you, which are fitting to your needs and requests in
order to realize your photovoltaic project plans.
power consumption, high performance and flexible design options. The main technologies to do the fabrication of IC are p-well, n-well, twin tub and
Silicon On Insulator (SOI) CMOS process.
In p-well process the substrate is N-type. N channel device is formed into the p-well. The p channel device is directly constructed on the
substrate itself. For n-well it is reverse. In twin tub or twin well process both n-well and p-well are fabricated on single N-type substrate. It is possible
to tune independently threshold voltage, body effect and the channel transconductance of both P and N type transistors using this process. With n+ or
p+ as starting material , lightly doped epitaxial layer is formed on this layer n-well and p-well are formed. Unbalanced drain parasitics are observed in
p and n well CMOS process. Twin tub process avoids this problem.
Silicon On Insulator (SOI) process technology makes it possible to fabricate completely isolated pMOS and nMOS transitors side by side.
Advantages of SOI process over other CMOS technologies are avoidance of latch up problem, low parasitic capacitances, higher integration density
and higher speed.
Process plan
The overall view of the complete CMOS process flow for the fabrication of integrated circuit is briefly explained below.
Step1: obtaining the sand: sand with very good form of clean silicon is used to grow the wafer.
Step2: preparing the molten silicon bath: the sand(SiO2) is heated just above its melting point temperature of 1600C.
Step3: making the ingot: a seed containing desired crystal orientation is placed onto the molten sand bath. This crystal is slowly pulled
out(1mm/minute). Czochralski(CZ) method is used for this process. The resultant pure silicon is called an ingot.
Step 4: preparing the wafers: with a diamond saw ingot is sliced into very thin wafers.
Thickness sorting: Sliced wafers are sorted on an automated basis into bathes of uniform thickness.
Lapping and etching: Cracked or damaged surface of the silicon wafer due to slicing is removed by lapping. Crystal damages are
removed by etching process.
Thickness sorting and flatness checking: Once again wafers are sorted acording to their thickness.
Polishing process: This process can be either mechanical or chemical or both. Here uneven surface left by lapping and etching
processes are smoothened.
Final dimensions and electrical properties qualification: the wafers undergo final test to satisfy customer requirement of flatness , thickness, resistivity
and type.
Fabrication:
The prepared wafers are exposed to multiple levels of photolithography process. Each step is repeated for each mask. Mask defines the
different layers of the integrated circuit pattern which are designed using CAD tools.
First ixide(SiO2) layer is formed on the wafer.
Photolithography: Photoresist coating is applied on the surface of wafer. Wafer is aligned with mask and light source. In the
transparent areas of mask light passes through and exposes the photoresist.
Direct wafer stepping: In this method mask is kept away from the wafer. With the help of series of optics image is placed on to the
wafer. This technique allows larger mask size than the final pattern. Exposed regions of photoresist becomes hard.
Etching the wafer surface: This process removes unwanted material from the wafer. There are two main methods of etching: wet
etching and dry etching.
Wet etching: Chemicals are used for wet etching. Number of wafers are dipped in concentrated acid and exposed areas of wafers are
etched away.
Plasma etching: An intense electric field is applied to generate the plasma state of gaseous matter. Gases used are very reactive in
plasma state. This provides effective etching of exposed surface.
Reactive ion etching and ion milling are the other two techniques used for etching.
Diffusion: First photoresist is coated and patterning is done using photolithography process. Then wafer is kept in a furnace with a flow
of gas running over the wafers. Dopants are slowly diffused.
Ion implantation: Here desired dopant ions are shooted (or implanted) into the wafer. This process can handle single wafer at a time
while diffusion chamber can handle many wafers at a time.
Drive in: Wafers are heated so that implanted(or diffused) ions are go deeper into the wafer.
Annealing: Crystal lattice structure of the wafer is disturbed by the diffusion or ion implantation. To repair this wafer is heated so that
crystal structure is repeated itself.
The circuit elements are fabricated with different mask operations. Some of the final masks define interconnections.
A passivation layer is coated to protect the entire wafer from the contamination during assembly. Passivation material is etched from the bonding pads
using final mask and passivation etch. Then all ICs are tested for its functionalty and non functional ICs are marked. A diamond saw is used to cut the
wafer into indivisual chips.
Die attach/wire bond: Die is mounted on to the lead frame. A thin gold wire connects between bonding pad and lead frame.
Encapsulation: Lead frames are placed onto the mold plates and heated. Molten plastic material is pressed around each die to form its
individual IC package.
Lead finish/trim and form: Conductivity of the leads are improved by coating tin or lead solution. Then exact form of the leads as per
package requirement is formed step by step.
Final testing and shipping: Quality, reliabilty and functionality of the each chip is tested. Product type, date, package code etc are
marked on to the IC packages. Individual chips are then put into antistatic tubes for shipping.
Equipments Required
Several equipments are required for the complete wafer processing into a chip. Some of the important machines are listed here.
Crystal growers: Single crystal ingots are produced by Czochralski (CZ) method. Resistivity is adjusted using the dopants, such as
boron and phosphorus.
Wafer slicing machine: This is used to cut single crystal ingot to wafers.
Spinner (Photo resist Coater): A spinner used to apply photoresist to the surface of a silicon wafer. Spin speed and spin time can be
adjusted.
Wafer Cleaners: The processed wafers are cleaned and inspected to be polished wafers.
Wafer shaping machines (Lapping machines): These machines are used to remove surface roughness.
Wafer polishing machine: Used to make the wafer surface highly flat.
SIMOX implanter: Defects made in the wafer surface are removed by annealing and ion implantation. This machine does this job.
Epitaxial furnace: This is shown in the Figure (10). This furnace is used for Chemical Vapor Deposition (CVD) to grow epitaxial layer.
Hydrogen annealing furnace: Used to improve the surface crystalline perfection by hydrogen annealing.
Generally these machines have 4 modes of operation: proximity, hard and soft contact, vacuum contact. Machine configuration allows
processing of 300 inch wafers.
Etchers: Anisotropic etchings of nitride, oxide, silicon and polymer layers are possible with this machine. Plasma machines generally use chlorine- and
fluorine-based chemistries for etching various Si, polysilicon, nitride, tungsten, tungsten silicide films. These machines have different
selectivity options. Laser interferometer is used for etch rate determination and end point detection. Some etchers have four
independent process chambers. These etchers are capable of metals, oxides and nitrides, silicon and polysilicon. Wafer size can be up
to 300 mm.
E-Beam Lithography System: This is Ultra high resolution E-beam lithography system. Ultimate resolution specified to 60 nm with
sub-30 nm features possible with this machine. E beam is directly exposed to wafers up to 300 mm diameter.
Sputter Coater machines: This is used for depositing a conductive coating for visualizing SEM samples.
Ellipsometer: Ellipsometer allows measurement of the thickness and refractive index of very thin transparent films.
Surface Profile meter: This instrument is used to measure step heights and roughness of surfaces. It also measures many other
surface topography parameters. The measurement technique is either contact or contact less; both are used in the industry. Optical
phase shifting interferometry concept is being used in the equipment.
Asher: Used to strip the photo resist from the wafer. Plasma of oxygen and nitrogen reacts with the photo resist and burns off the wafer.
Laser Writer (mask making machine): This machine accepts GDS II format input file and generate mask patterns.
Film Thickness Measurement: This system uses non-contact, spectro-reflectometry (measurement of the intensity of reflective light
as a function of incident wavelength) to determine the thickness of transparent films on substrates, such as silicon, that are reflective in
the visible range.
Resistivity Measurement: This resistive measurement instrument collects and analyzes sheet resistance data on various conductive
layers such as implants, diffusions, epi, metals and bulk substrates.
Wafer Dicing saw: This machine is used to cut the wafers into individual die. It utilizes rotary blade. Some wafer cutting machine
diamond saw.
Field Emission Scanning Electron Microscope: This is high resolution imaging instrument. This instrument has a resolution of 5nm
and less.
Film Stress Tester: This equipment measures the stress induced by the deposited films on a substrate. Deflection of a scanning laser
beam is used for the measurement. With and without the deposited film change in the curvature of the wafer is measured.
Developer: Exposed photo resist wafers are developed with the help of this machine. This machine has facility for dispensing developer and
post bake oven station. Number wafers and size of the wafer which can be processed is machine specific.
requires an area of around 2,000 sf. Thus the required area for the clean room of class 10 is around 3,000 to 5,000 sf. ea for gases cover around 10,000
sf. Remaining area is required for loading and unloading duck , DI water plant, cold and chilled water plant, several other gas storage and purifying
plants. If clean room of class 10 is having an area around 5,000 sf then the supporting clean room area can be around 6,000sf.
Layout of the fabrication facility [3] (click on the figure to enlarge it)
In addition to the main equipments many supporting equipments are used in the fabrication plant. Location for such support equipments must
be carefully planned. It is good practice to keep supporting equipments in chase. If they are kept in clean room they disturb the airflow and also require
additional maintenance activities. This eats up clean room floor area.
Airflow requirement has to be considered when equipment cant be bulkhead mounted. The key in the equipment placement is to ensure that
the cleanest air coming from ULPA filters is directed to the critical areas of the equipment.
The floor above the clean room is used for air handlers and heat exchangers. Support equipments such as air compressors, chilled water,
vacuum pumps and acid neutralizers are kept away from the clean room. Storing corrosive and toxic gases in clean room is hazardous. Hence they are
stored and monitored away from the main laboratory itself. An outdoor area, known as facility area, is utilized for storing the DI water, chilled water,
liquid gases and emergency power generators. Support facilities are essential for the smooth clean room operation. Stock room, semi clean laboratory,
maintenance work areas and staff offices are located near to the clean room.
Fire suppression systems are installed such that they provide suitable fire protection to the equipment, contribute no contamination to the
equipment, and allow proper airflow to the product-wafer areas. Fire extinguishers are located at strategic locations throughout the clean room and
other sub laboratory areas. Generally preferred area is the chase. Location of extinguishers should not be in the airflow path leading to product-wafer
areas.
Service facilities
Brief explanation of the several service facilities required for the fabrication plant is given below.
Emergency gas shutoff systems: This system is a pressurized loop tied to normally closed valves on hazardous gases entering the
fabrication plant. The emergency shutoff stations located at different strategic points around the plant.
Toxic gas monitoring system: This is either a microprocessor or PLC controlled system. The system monitors the hazardous level of
different hazardous gases of type-hydride, oxidizer, mineral acid and pyrolyzer at both sides-source and at the point of use. Inputs of
the gas monitoring system are located at the point of use and the exhaust duct immediately upstream from where an emission is most
likely to occur. When installing such detection systems specific gravity of the gases has to be taken into consideration.
Containment pressure monitoring system: This system mainly checks three important conditions: high pressure, low pressure and
zero (atmospheric) pressure. High and low pressure indicates leakage of gases while atmospheric pressure in the gas supply pipe
indicates a catastrophic failure of the system.
Safety Shower/Eyewash Stations: The place where hazardous liquids are used there safety showers and eyewash stations are
required. Locations must be chosen such that an electrical hazard is not created by the discharge of the safety shower. Any electrical
outlets in proximity to the shower must be protected by ground-fault circuit interruption.
Fire Suppression Systems and extinguishers: Those equipments having combustible material and chemical are
equipped with fire suppression and extinguishable systems. The extinguishers used should be compatible with the
chemicals used in the system.
Particle Filters (HEPA and ULPA): HEPA (High-Efficiency Particulate Air) Filters rated 99.99% are efficient in filtering particles 0.3
microns and larger in diameter. ULPA (Ultra-Low Penetration Air) Filters rated 99.999% can efficiently filter particles of size 0.12 microns
in diameter. These filters are available in variety of sizes which are specifically designed and used for clean rooms of class 10
specification. The filtration medium consists of highly efficient micro porous polyurethane mini plates.
Air handlers: Air handlers consisting of ULPA and HEPA filters handle recirculation of air in clean room to maintain positive pressure
and to provide cooling to support areas and office.
Exhaust system: Exhaust systems treat hazardous gases prior to being scrubbed by the fluoride exhaust.
High Purity Bulk Gases: Different bulk gases required to the wafer fabrication building. They are: nitrogen, hydrogen and oxygen.
Oxygen and nitrogen are required of two different qualities, one is ultra high purity and the other is "house" quality.
Chilled water supply system: Water from this system is used for dehumidification on the outside air units.
Vacuum pumps: These systems provide necessary vacuum for the machines located at clean room and elsewhere.
Air compressors: Air compressors provide 60 deg C dew point air to the Wafer building.
Solar-Report as PDF-Document
Wafer-based PV manufacturing: design and integrated layout concept. Source: M+W Zander FE GmbH
The vast majority of fabrication facilities are small and under 25MW annual production levels. Simply multiplying
such conventional facilities in the race to grid parity is seen as insufficient for continued cost-per-watt reductions.
Fully integrated and highly automated facilities will be required, and the scaling of single-site facilities to the gigawatt
level is a strategic move that both conventional crystalline cell and emerging thin film producers would be wise to
adopt.
Wafer-based manufacturing design and integrated layout. Source: M+W Zander FE GmbH
The need for scale
After a detailed study undertaken in 2006/7 with involvement from equipment suppliers and PV manufacturers from
both cell and thin film camps, M+W Zander FE GmbH, a leading high-technology cleanroom, design and construction
company with many years experience in major projects around the world, realized that significant changes would be
required in the building and operating of largescale PV manufacturing plants if the cost reductions required to meet
grid parity were to be achieved.
"I think the industry has to understand now and hopefully accept is that to reach its potential it needs to scale
facilities to the gigawatt level" noted Robert Gattereder, Managing Director of M+W Zander FE GmbH. "Such levels
cannot be achieved by 10X at 100MW lines. The costs will not come down sufficiently and the environmental issues
are there in relation to chemical usage based on current facility designs without a fresh approach in achieving real
economies of scale." Gattereder highlighted that conventional PV manufacturing lines are based on a linear process
flow arrangement according to their process function, typically employing manual Wafer In Process (WIP)
transportation. Capacity is simply increased by adding further new lines in adjacent space.
Left: wafer production at Deutsche Solar AG. Source: SolarWorld AG. Right: production for solar cells. Source: M+W
Zander FE GmbH
Though this is the typical approach taken by PV manufacturers, Gattereder believes that improvements to these
conventional Farm cell line facilities is still possible. He noted that improvements to equipment utilization can be
realized that in turn reduce the number of tools required and reduce the manufacturing area required. Further
savings could be achieved in regard to cutting labor costs, but as labor only accounts for a mere 3 to 5 percent of
total operating costs, according to Gattereder, such improvements do not meet the required reductions in
manufacturing costs to reach grid parity.
In the M+W Zander analysis (see table 1), the focus on scaling waferbased PV manufacturing highlighted that
manufacturing cost savings in the region of 15 percent were possible when production reached the gigawatt level.
The largerscaled facility could have a more efficient line and tool layout that actually delivers the true cost savings
Green Energy high efficiency and reduced CO2 footprint. Source: M+W Zander FE GmbH
For a fully utilized gigawatt facility, Gattereder also expects the need for 25-30 megawatts of required energy. This
would necessitate a co-generation or tri-generation solution, something similar to that used by semiconductor
microprocessor manufacturer AMD in Dresden, Germany, whose co-generation plant M+W Zander project managed.
The challenge is to combine the reduction of cost-per-watt, but also to reduce the carbon footprint while providing
greater energy efficiency as shown in Figure 2.
This will become an important issue later as many experts expect carbon tariffs on industries to be implemented
across several countries in the not too distant future.
Table 2 Thin film manufacturing: scaling and productivity considerations. Source: M+W Zander FE GmbH
"Overall, there is no low-hanging fruit, so we have to combine a variety of factors to gain the cost advantages. The
important message is that there is a productivity gain of 15 percent when considering the scaling of the facilities",
commented Gattereder.
Left: Thin film production with technology by Oerlikon. Source: Oerlikon Solar. Right: Applied SunFab: Production
linie for thin film modules. Source: Applied Materials.
However, there are few current examples of companies proving that rapid scaling of thin film plants is achievable at
levels greater than those of crystalline wafers. The only clear example of this is First Solar. In its February 2008
financial conference call, the company revealed that it expects annual capacity to reach approximately 1 gigawatt by
the end of 2009 with the expected full ramp of all four plants in Malaysia going to plan. Capital spending in 2008 has
been put at US0 million to expand capacity towards that goal.
First Solar 1 GW production schedule by end of 2009. Source: First Solar Inc.;M+W Zander FE GmbH
However, it should be noted that First Solars capacity ramp is based on multiple facilities, some of which are not
centred in Malaysia. But what it does highlight is that First Solar has been able to ramp thin film production towards
the 1 gigawatt scale faster than the top five wafer-based PV manufacturers (see Figure 3), few of which expect to
reach the 1 gigawatt level in the same period.
According to M+W Zander, thin film fabs could benefit from an area ratio improvement of as much as 12 percent
when scaled to the gigawatt production level, as shown in Table 2. Another revealing aspect of the M+W Zander
study is the ability for thin film facilities to be even more cost-competitive at the gigawatt scale. With overall utility
cost savings as highlighted earlier, a comparison between wafer-based and thin film manufacturing (see Table 3)
shows that thin film utility demands are significantly less than those for wafers.
Table 3. Sample Utility requirements: Giga fab manufacturing. Source: M+W Zander FE GmbH
Dear Professor !
Please find enclosed our informations based onto 250/260 Watt 60 cell 6 inch design J.v.G, desert solar modules 70 MW pa:
Module factory:
cells plus all other materials (glass, foils, ribbons, flux, labels, JB, ALU, bar code,
etc.) is roughly 36 Euro Cent (if you take best materials) per Wattpeak
up to now we made about 100 business studies and found out that the costs of the
factory is round about between 2,5 and 3,5 million Euros (depends onto the
country)
if you calculate with highest costs, you yearly turnover is 38.5 Mio Euro
your profit is = 13,3 million Euros - minus 3,5 million Euros = 10 million Euros pa
wafer price, plus all other materials (silver, led, fluids, gases, print materials, etc.)
17 Cent per Wattpeak
up to now we made about 14 business studies and found out that the costs of the
factory is round about between 1,5 and 2,5 million Euros (depends onto the
country)
if you calculate with highest costs, you yearly turnover is 14 Mio Euro
your profit is = 2,1 million Euros minus 2,5 million Euros = minus !
So you see cell factory cannot be profitable, only if we can get better prices for high class
cells.
Sale price of high eff cells must be more then 25 Euro Cent !
Recommendation:
Invest in higher Module capacity and buy cells from external !
Hanwha SolarOne Co., Ltd. (Shanghai, China) on December 2 nd, 2014 announced to build a new solar photovoltaic (PV) module factory in
Eumseong, Chungbuk, South Korea. The company will invest USD 12 million to build the facility, which is scheduled to begin
production in the second quarter of 2015 with an annual manufacturing capacity of 230 megawatt (MW)
Pricing for polysilicon and PV components was stable in Q3 2013 due to strong demand pickup from Japan, the EU, and China, as well as a more
consolidated supply chain. Blended polysilicon prices stayed flat at $19/kg, while Tier 1 Chinese delivered module ASPs were up to $0.70/W, 3%
higher than Q2 2013 levels of $0.68/W.
The first is the price of solar modules, which shows a rebound. The second is the crucial one for the future of the industry, and its ability to undercut
fossil fuels over the long term, because it shows that the cost of manufacture of a solar module will fall around 20 per cent over the year despite the
60-80 per cent falls achieved over the previous three to four years. The same story is expected to be repeated among many other manufacturers.
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And here are some on solar power growth and projected growth in the U.S.:
SEIA & GTM Host U.S. Solar Energy Year In Review On-Air Google Hangout
Keep up to
I can very easily answer the question How much do solar panels cost? (see below), but I think the real question youre asking is How much will it
cost to put solar panels on my roof? Thats a more complicated question to answer, but Ill explain in more detail and provide some useful perspective
on that in the article below.
How Much Does It Cost To Go Solar? & How Much Will I Save?
But when it comes down to it, what you probably really need to know is how much it will cost you to actually go solar. And a related question would
be how much you will save in the long run.
In many places now, you can go solar for $0 or close to $0 down through solar leasing companies or through simple bank loans. Then youre just
paying monthly payments like you would on a house, car, or college loan. However, in this case, your payments are likely to be less than the amount
of money youre saving on your electricity bill. So, really, youre not paying any more than youre already paying for electricity youre saving
money!
Co
st
An
aly
sis
of
So
lar
Ph
ot
ov
olt
aic
s
17
pv
modules
, Q4 2009 To Q1 2012
Factory-gate price in Europe (USD/Watt)
2009
PV module suppliers
High efficiency c-Si
Q4
2.45
2010
Q1
2.22
Q2
2.25
2011
Q3
2.29
Q4
2.21
Q1
2.20
Q2
2.15
2012
Q3
2.10
Q4
2.00
Q1
1.94
Japanese/Western c-Si **
1.98
1.81
1.83
1.74
1.66
1.40
1.27
1.08
1.22
1.22
1.51
1.42
1.52
1.51
1.45
1.39
1.39
1.39
1.39
1.24
1.45
1.35
1.42
1.43
1.43
1.36
1.31
1.03
1,02
1.02
1.26
1.30
1.39
1.37
1.27
1.16
1.05
0.98
0.93
0.93
2.86
2.20
2.55
2.55
2.53
2.30
2.30
2.30
2.30
2.20
Japanese/Western c-Si
2.10
2.05
1.95
1.95
1.93
1.91
1.91
1.91
1.91
1.82
1.91
1.87
1.83
1.87
1.80
1.43
1.43
1.47
1.43
1.34
1.89
1.75
1.70
1.78
1.74
1.50
1.50
1.50
1.50
1.41
1.21
1.20
1.22
1.25
1.19
1.20
1.22
1.25
0.93
0.93
Notes: Based on short-term contract prices for quantities of 0.5 MW or more. Spot market prices are typically more volatile. * Sunpower
and Sanyo ** Sharp, Kyocera, Solarworld and Schoth *** Suntech, Yungli, Trina Solar and Green Energy, etc. **** Chinese, Korean and Indian
manufacturers.
Sources: Solarbuzz, 2011; Photovoltaik, 2012 and Luo, 2011.