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A
A
ICN
IJ
PE
PNP
I1
IA
IBP
ICP
NB
CJ
I2
IJ
NPN
dV
dt
G
IBN
IK
IA =
dV
Static
dt
What is Static
dV
?
dt
Conditions Influencing
160
dV
is proportional to the rate of voltage change ------- . It triggers
dt
1 (N + p)
K
INTEGRATED
STRUCTURE
( dV
)
dt s
Small transients are incapable of charging the self-capacitance of the gate layer to its forward biased threshold voltage
(Figure 2). Capacitance voltage divider action between the
collector and gate-cathode junctions and built-in resistors
that shunt current away from the cathode emitter are responsible for this effect.
180
dV
(V/s)
dt
140
STATIC
NE
dt
dt
dV
CJ
dt
( dV
dt )s Model
Figure 1.
dV
Static ------- turn-on is a consequence of the Miller effect and
PB
CJ
TWO TRANSISTOR MODEL C
EFF =
1 (N + p)
OF
SCR
dV
Static ------- is a measure of the ability of a thyristor to retain a
( dV
) Device Physics
dt s
120
100
80
60
40
20
20
100
200
300
400
500
600
700
800
( )
dV
Figure 2. Exponential dt
versus Peak Voltage
s
REV. 4.01 6/24/02
AN-3008
APPLICATION NOTE
( dV
)
dt s
dV
Static ------- does not depend strongly on voltage for operation
Improving
dV
Static ------- can be improved by adding an external resistor
dV
reduce ------- capability if a transient is within roughly 50 volts
from the gate to MT1 (Figure 4). The resistor provides a path
dV
for leakage and ------- induced currents that originate in the
dt
dt
dt
dt
dV
A higher rated voltage device guarantees increased ------- at
dt
140
dV
Heat increases current gain and leakage, lowering ------- ,
dt s
the gate trigger voltage and noise immunity (Figure 3).
dV
(V/s)
dt
120
100
STATIC
dV
higher ------- to 200 V than a 200 V device with an identical
dt
60
MAC 228-10
800V 110C
80
RINTERNAL = 600
40
20
0
10
180
100
160
MAC 228-10
VPK = 800 V
dV
(V/s)
dt
STATIC
140
120
80
10000
( )
dV
Figure 4. Exponential dt
versus
s
Gate to MT1 Resistance
100
60
40
20
20
100
200
300
400
500
600
700
800
( )
dV
Figure 3. Exponential dt
versus Temperature
s
( dV
) Failure Mode
dt s
2200
dV
Static ------- turn-on is non-destructive when series impedance
dt
dI
improving its ability to withstand ----- . Breakdown turn-on
dt
2000
MAC 16-8
VPK = 600 V
dV
(V/s)
dt
1800
1600
STATIC
Occasional unwanted turn-on by a transient may be acceptable in a heater circuit but isnt in a fire prevention sprinkler
system or for the control of a large motor. Turn-on is destructive when the follow-on current amplitude or rate is excessive. If the thyristor shorts the power line or charged
capacitor, it will be damaged.
1000
1200
1400
1000
800
600
50
60
70
80
90
100
110
120
130
( )
dV
Figure 5. Exponential dt
s
versus Junction Temperature
APPLICATION NOTE
AN-3008
dV
external resistor, their ------- capability remains inferior to
dt
dV
tinuous current as it would for a resistor that increases -------
dt
dV
The maximum ------- improvement occurs with a short.
dV
reduce maximum operating temperature ------- (Figure 6).
dt s
The capability of these parts varies by more than 100 to 1
depending on gate-cathode termination.
10 MEG
A
10
G
dV
One should keep the thyristor cool for the highest ------- .
dt s
Also devices should be tested in the application circuit at the
highest possible temperature using thyristors with the lowest
measured trigger current.
MCR22-2
TA = 65C
1 MEG
dt
TRIAC Commutating
100K
What is Commutating
dV
dt
dV
?
dt
dV
The commutating ------- rating applies when a TRIAC has been
dt
10K
0.001
0.1
0.01
STATIC
10
100
dV
(V/s)
dt
( )
dV
Figure 6. Exponential dt
versus
s
Gate-Cathode Resistance
STATIC
dV
(V/s)
dt
120
MAC 228-10
800V 110C
110
100
90
R
VLINE
L
2
i
G
VMT2-1
1
VMT2-1
VOLTAGE CURRENT
130
dl
dt c
PHASE
ANGLE
TIME
TIME
80
70
60
0.001
0.01
0.1
( )
dV
Figure 7. Exponential dt
versus
s
Gate to MT1 Capacitance
VLINE
dV
dt c
( )
dV
Figure 8. TRIAC Inductive Load Turn-Off dt
c
( dV
) Device Physics
dt c
A TRIAC functions like two SCRs connected in inverseparallel. So, a transient of either polarity turns it on.
There is charge within the crystals volume because of prior
conduction (Figure 9). The charge at the boundaries of the
AN-3008
APPLICATION NOTE
dV
collector junction depletion layer responsible for ------- is
dV
dV
also present. TRIACS have lower ------- than ------- because
dt c
dt s
dt
dV
dt
dt
Previously
Conducting Side
N
+
N
dI
dt c
dV
dt
TIME
0
REVERSE RECOVERY
CURRENT PATH
MT2
LATERAL VOLTAGE
DROP
dI
influence. Commutating ----- and delay time to voltage
MT1
TOP
dV
dt
STORED CHARGE
FROM POSITIVE
CONDUCTION
VMT2-1
CHARGE DUE
TO dV/dt
VOLUME
STORAGE
CHARGE
IRRM
E
V
dI
frequency determine ----- . The rate of crossing for sinusoidt c
dal currents is given by the slope of the secant line between
the 50% and 0% levels as:
6fI TM
dI
- A/ms
----- = ------------- dt c
1000
VT
dV
current generated by ------- across the collector capacitance and
dt
dV
bias the emitter and turn the TRIAC on. Commutating ------dt
capability is lower when turning off from the positive direction of current conduction because of device geometry. The
gate is on the top of the die and obstructs current flow.
Recombination takes place throughout the conduction period
and along the back side of the current wave as it declines to zero.
Turn-off capability depends on its shape. If the current amplidI
tude is small and its zero crossing ----- is low, there is little
dt c
TIME
0.5
NORMALIZED DELAY TIME
(td = W0 td)
td
0.2
0.1
0.2
0.05
0.1
0.02
0.05
0.03
0.02
RL = 0
M=1
IRRM = 0
0.01
VT
E 0.005
0.05 0.1
DAMPING FACTOR
APPLICATION NOTE
AN-3008
Conditions Influencing
( dV
)
dt c
Improving
dV
Commutating ------- depends on charge storage and recovery
dt
dV
dynamics in addition to the variables influencing static ------- .
dt
RS
i
dl
dt
60 Hz
+
R
L
> 8.3 s
R
( dV
) Failure Mode
dt c
dV
-------
dt c failure causes a loss of phase control. Temporary turn-
DC MOTOR
dV
dV
The same steps that improve ------- aid ------- except when
dt s
dt c
stored charge dominates turn-off. Steps that reduce the
stored charge or soften the commutation are necessary then.
LS
( dV
)
dt c
( N A B 10 )
t s = --------------------------------- where:
E
ts = time delay to saturation in seconds.
B = saturating flux density in Gauss
A = effective core cross sectional area in cm2
N = number of turns.
AN-3008
APPLICATION NOTE
HS ML
I S = ------------------ where:
0.4 N
HS = MMF to saturate = 0.5 Oersted
ML = mean magnetic path length = 4.99 cm.
(.5) (4.99)
I S = ------------------------ = 60 mA.
0.4 33
Snubber Physics
Undamped Natural Resonance
I
0 = ------------ Radians/second
LC
100H
dV
Resonance determines ------- and boosts the peak capacitor
dt
component.
Damping Factor
-700
dV
reduction in ------- requires a 100 to 1 increase in either
dt
dV
between ------- and peak voltage. Damping factors between
dt
VOLTAGE
SENSITIVE
CIRCUIT
10
TIME (s)
R C
= ---- ---2 L
0.1
F
10s
+700
V (VOLTS)
0.05
340 V
20
dI
dt
dV
When < 0.5, the snubber resistor is small, and ------- depends
dt
dV
mostly on resonance. There is little improvement in ------- for
dt
damping factors less than 0.3, but peak voltage and snubber
discharge current increase. The voltage wave has a 1-COS()
dV
shape with overshoot and ringing. Maximum ------- occurs at a
dt
dI
dt
and reduces ----- stress. High ----- destroys the thyristor even
though the pulse duration is very short. The rate of current
rise is directly proportional to circuit voltage and inversely
proportional to series inductance. The snubber is often the
major offender because of its low inductance and close
proximity to the thyristor.
With no transient suppressor, breakdown of the thyristor sets
the maximum voltage on the capacitor. It is possible to
exceed the highest rated voltage in the device series because
high voltage devices are often used to supply low voltage
specifications.
The minimum value of the snubber resistor depends on the
type of thyristor, triggering quadrants, gate current amplitude, voltage, repetitive or non-repetitive operation and
required life expectancy. There is no simple way to predict
the rate of current rise because it depends on turn-on speed
of the thyristor, circuit layout, type and size of snubber
capacitor, and inductance in the snubber resistor. The
equations in Appendix D describes the circuit. However,
APPLICATION NOTE
AN-3008
the values required for the model are not easily obtained
except by testing. Therefore, reliability should be verified in
the actual application circuit.
Table 1 shows suggested minimum resistor values estimated
(Appendix A) by testing a 20 piece sample from the four
different TRIAC die sizes.
Stored Energy
Inductive Switching Transients
TRIAC Type
Peak VC
Volts
RS Ohms
dl
dt
A/S
200
300
400
600
800
3.3
6.8
11
39
51
170
250
308
400
400
Non-Sensitive
Gate
(IGT > 10mA)
8 to 40 A(RMS)
Reducing
dl
dt
dI
dt
1
2
E = --- L I O Watt-seconds or Joules
2
IO = current in Amperes flowing in the inductor at t = 0.
Resonant charging cannot boost the supply voltage at turnoff by more than 2. If there is an initial current flowing in the
load inductance at turn-off, much higher voltages are possible. Energy storage is negligible when a TRIAC turns off
because of its low holding or recovery current.
The presence of an additional switch such as a relay, thermostat or breaker allows the interruption of load current and the
generation of high spike voltages at switch opening. The
energy in the inductance transfers into the circuit capacitance
and determines the peak voltage (Figure 15).
L
I
R
VPK
OPTIONAL
FAST
dI
dt
SLOW
dV
I
=
VPK = I
dt
C
L
C
dV
to prevent degradation of the snubbers ------- suppression
dt
Current Diversion
The current flowing in the load inductor cannot change
instantly. This current diverts through the snubber resistor
dV
causing a spike of theoretically infinite ------- with magnitude
dt
dV
capacitor for a given value of ------- . This reduces the cost and
dt
dV
Highly inductive loads cause increased voltage and ------- at
dt
AN-3008
APPLICATION NOTE
2.8
dV
does turn on. Resistance in the load lowers ------- and VPK
2.6
(Figure 16).
2.4
2.2
E
dV
dt
2.1
1.2
2
VPK
1.9
M = 0.75
M=1
dV
dt
1.7
0.8
NORMALIZED
dV
dt / (E W0)
1.8
1.6
1.5
M = 0.5
1.4
0.6
1.3
M = 0.25
1.2
0.4
1.1
M=0
1.4
dV
dt
dt
E
dV
dt MAX
2.2
2.0
1.8
10-63%
1.6
1.4
M = RS / (RL + RS)
1.0
0.8
0.6
0.4
dV
dt o
0.2
0
0 0.2 0.4 0.6 0.8 1.0 2.2 1.4 1.6 1.8 2.0
DAMPING FACTOR ( )
(RL = 0, M = 1, IRRM = 0)
0.9
NORMALIZED
0
0
0.2
0.4
0.6
0.8
dV dV/dt
V
NORMALIZED VPK = PK
=
dt
E 0
E
dV
Figure 18. Trade-Off Between VPK and dt
DAMPING FACTOR
M = RESISTIVE DIVISION RATIO =
VPK
10-63%
dV
dt
1.2
0.2
0-63%
dV
dt
RS
RL + R S
dV
A variety of wave parameters (Figure 18) describe ------- .
IRRM = 0
dt
dV
Figure 16. 0 to 63% dt
dV
dV
include the initial ------- , the maximum instantaneous ------- , and
VMT2-1 (VOLTS)
500
dt
dt
dV
the average ------- to the peak reapplied voltage. The 0 to 63%
dt
dV
dV
------- and 10 to 63% ------- definitions on device data sheets
dt s
dt c
Non-Ideal Behaviors
= 0.1
Core Losses
400
300
200
0.3
0.1
= 0.3
100
=1
0
0
0.7
1.4
2.1
2.8
3.5
4.2
4.9
5.6
6.3
TIME (s)
0-63%
dV
resistance (Figure 19). This causes actual ------- to be less than
dt
dV
= 100 V/s, E = 250 V,
dt s
RL = 0, IRRM = 0
APPLICATION NOTE
AN-3008
1.
2.
Complex Loads
Many real-world inductances are non-linear. Their core
materials are not gapped causing inductance to vary with
current amplitude. Small signal measurements poorly
characterize them. For modeling purposes, it is best to
measure them in the actual application.
Complex load circuits should be checked for transient voltages and currents at turn-on and turn-off. With a capacitive
load, turn-on at peak input voltage causes the maximum
surge current. Motor starting current runs 4 to 6 times the
steady state value. Generator action can boost voltages above
the line value. Incandescent lamps have cold start currents 10
to 20 times the steady state value. Transformers generate
voltage spikes when they are energized. Power factor correction
circuits and switching devices create complex loads. In most
cases, the simple CRL model allows an approximate snubber
design. However, there is no substitute for testing and measuring the worst case load conditions.
3.
4.
5.
6.
dV
Use a snubber to prevent TRIAC ------- failure.
dt c
0.1
dV
controlling ------- and VPK when a fast transient such as that
dt
i (AMPERES)
90
Self-Capacitance
80
120
TIME (MILLISECONDS)
160
200
dV
A thyristor has self-capacitance which limits ------- when the
dt
AN-3008
APPLICATION NOTE
Snubber Examples
1A, 60Hz
Without Inductance
Power TRIAC Example
VCC
6
MOC
3020
3021
RS
CS
= (RL + RS) CS
e
E
t=0
e(t = o+) = E
RS
RS + RL
TIME
180
R1
0.1F
2.4k
170V
R2
C1
T2322D
1V/s
CNTL
0.63 (170)
DESIGN
240s
dV
(0.63) (170)
=
= 0.45V/s
dt
(2400) (0.1F)
TIME
dV
(V/s)
dt
Power TRIAC
Optocoupler
0.99
0.35
RL
Vstep = E
L = 318 MHY
10V/s
Rin 1
The optocoupler conducts current only long enough to trigger the power device. When it turns on, the voltage between
MT2 and the gate drops below the forward threshold voltage
of the opto-TRIAC causing turn-off. The optocoupler sees
dV
-------
dt s when the power TRIAC turns off later in the conduc-
CAPACITOR
COMPONENT
1MHY
100
VCC
1
2
3
MOC3031
Opto-TRIAC Examples
Single Snubber, Time Constant Design
4
5
6
1N4001
430
120V
400 Hz
MCR265-4
MCR265-4
51
100
0.022
F
1N4001
APPLICATION NOTE
AN-3008
Opto
--
V
i = ------ 1 e ,
R
( dV
)
dt c
e = i RS
80
70
60
CS = 0.01
1.
50
40
30
CS = 0.001
dt
20
NO SNUBBER
10
2.
0
20
60
70
80
90 100
40
50
TA, AMBIENT TEMPERATURE (C)
(RS = 100, VRMS = 220V, POWER FACTOR = 0.5)
30
dV
operation of an optocoupler in ------- mode. Very large
dt
Snubber with no C
RS
E
AC LINE SNUBBER
L
RECTIFIER
BRIDGE
C1
ERS
dV
=
dt
L
RS
E
AC LINE SNUBBER
L
RECTIFIER
BRIDGE
C1
11
AN-3008
APPLICATION NOTE
( dV
dt )c
dV
Determine the normalized ------- corresponding to the
dt
X L
------ where
R L
Then
-ITM = 15A
2
2
RL
and
100
dl = 6 f ITM x 10-3 A/ms
dt c
XL
L = --------------------2 f Line
dV (V/s)
dt c
V RMS
2
2
Z = --------------- R L + X L X L =
I RMS
10
WITH COMMUTATION L
V RMS
L = --------------------------------------- where E =
2 f LINE I RMS
2 V RMS
0.1
10
For Example:
E =
120
2 120 = 170 V; L = ------------------------------------ = 39.8 mH
( 8 A ) ( 377 rps )
2.
dV
dV
0 = spec ------- ------- E
dt dt ( P )
6
3
5 10 V/S
0 = ----------------------------- = 29.4 10 rps
( 1 ) ( 170 V )
1
C = -------------- = 0.029 F
2
0 L
3.
L
39.8 10
R S = 2 ---- = 2 ( 0.6 ) ------------------------------ = 1400 ohms
6
C
0.029 10
12
18
22
26 30
34
38
42
dV AMPERES/MILLISECOND
dt c
46
50
( )
( )
dl
dV
Figure 26. dt
versus dt
T = 125 C
c
c J
Static
14
dV
Design
dt
APPLICATION NOTE
AN-3008
10
8A LOAD
0.33 F
R
< 50 V/s
100 H
20A
MAC 218-6
68
120V
60Hz
0.033 F
LS1
340
V
dV
= 100 V/s
dt s
12
HEATER
Given E = 240
0.75
0.03
0.04
0.06
2 = 340V
dV
= 5 V/s
dt c
Vstep
VPK
dV
dt
15
0
10.6
13.5
MHY
0.1
39.8
28.1
17.3
V
170
170
120
74
V
191
325
225
136
V/s
86
4.0
3.3
2.6
Pick = 0.3
50 10 V/S
0 = ----------------------------------- = 201450 rps
( 0.73 ) ( 340 V )
1
C = --------------------------------------------------------- = 0.2464F
2
6
( 201450 ) ( 100 10 )
5.0V/s
6
100 10
R = 2 ( 0.3 ) --------------------------------- = 12ohms
6
0.2464 10
L
H
C
F
R
Ohm
50V/s
C
F
R
Ohm
47
100V/s
C
F
R
Ohm
0.15
10
Variable Loads
100
0.33
10
0.1
20
220
0.15
22
0.03
47
dV
inductance because ------- will then be highest because of its
dt
3
500
0.06
51
8
100
0
3.0
11
0.03
0.01
110
5
100
dt
13
AN-3008
APPLICATION NOTE
2.5A
0.6A RMS
10A
RS(OHMS)
5A
1000
20A
40A
80A
100
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
DAMPING FACTOR
( dV
dt )c
dt
resistor. Limiting the input voltage with a transient suppressor reduces the step.
dV
high ------- step when series inductance is added to the snubber
400
= 5.0 V/s
WITHOUT 5 HY
WITH 5 5 HY AND
450V MOV
AT AC INPUT
VMT
2-1
(VOLTS)
80A RMS
WITH 5 HY
-400
0
40A
TIME (s)
0.1
CS(F)
20A
10A
+10
5A
0.01
2.5A
0.6A
0.001
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
-10
100H
-20
Vin
-30
DAMPING FACTOR
PURE INDUCTIVE LOAD, V = 120 VRMS,
IRRM = 0
( )
dV
Figure 30. Snubber Capacitor For dt
= 5.0 V/s
c
14
-40
10K
WITH 5HY
5H
12
Vout
10
0.33F
WITHOUT 5HY
100K
FREQUENCY (Hz)
1M
(VV )
out
in
APPLICATION NOTE
AN-3008
dV
The noise induced into a circuit is proportional to ------- when
dt
dI
coupling is by stray capacitance, and ----- when the coupling
dt
dV
from ------- or breakover. The circuit should be designed for
dt
dt
dV
With the snubber it sets the maximum ------- and peak voltage
dt
VMAX
15
AN-3008
APPLICATION NOTE
REV
91
0.1
91
FWD
0.1
RS
CS
3.75
LS 330V
46 V/s
MAX
500H 5.6
MOTOR
1/70 HP
0.26A
115
dV
of voltage rise. The inductors are added to prevent static ------dt
T2323D
SNUBBER
1
100H
22
2W
WIREWOUND
300
4 MOC
3081
91
0.15
F
FWD
SNUBBER
1
G
300
4 MOC
3081
91
1/3 HP
208V
3 PHASE
REV
SNUBBER
2
SNUBBER
ALL MOVs ARE 275
VRMS
ALL TRIACS ARE
MAC218-10
91
G
100H
MOC
3081
300
4 MOC
3081
91
SNUBBER
FWD
43
SNUBBER
2
1
G
300
4 MOC
3081
3
91
REV
16
APPLICATION NOTE
AN-3008
Appendix A
dV
on the line cause ------- firing of the TRIAC. High inrush
dt s
dI
current, ----- and overvoltage damage to the filter capacitor are
dt
possibilities. Prevention requres the addition of a RC snubber across the TRIAC and an inductor in series with the line.
dI
dt
SUBBER INDUCTOR
D2
120 VAC
OR
240 VAC
C1
D3
dI
----- . A MBS4991 supplies the trigger pulse while the
dt
D4
RL
240V
G
C2
120V
RS
CS
Thyristor Types
Sensitive gate thyristors are easy to turn-on because of their
low trigger current requirements. However, they have less
dV
------- capability than similar non-sensitive devices. A nondt
dV
sensitive thyristor should be used for high ------- .
dt
dV
TRIAC commutating ------- ratings are 5 to 20 times less than
dt
dV
static ------- ratings.
dt
dV
Phase controllable optocouplers have lower ------- ratings than
dt
17
AN-3008
APPLICATION NOTE
2000
RS
50
5000
200W
2.5kV
OPTIONAL PEARSON
411 CURRENT
TRANSFORMER
OPTIONAL MOV
500W
MT2
X100
V PROBE
VTC
5-50
SWEEP FOR
DESIRED VCi
G
56
MT1
CS
TRIAC
UNDER TEST
91
3000
VMT2-1
2
3
12 V
1
4
VG
Q1,3
MBS4991
1
F
Q2,4
QUADRANT
SWITCH
QUADRANT
MAP
dI
Figure 38. Snubber Discharge dt Test
Appendix B
Measuring
( dV
dt )s
dV
Figure 40 shows a test circuit for measuring the static ------dt
dt
18
APPLICATION NOTE
AN-3008
27
VDRM/VRRM SELECT
2W
1000
10 WATT
WIREWOUND
X100 PROBE
DUT
DIFFERENTIAL
PREAMP
G
X100 PROBE
20k
2W
1000V
0.047
1000V
RGK
470pF
dV
dt
VERNIER
MOUNT DUT ON
TEMPERATURE CONTROLLED
C PLATE
0.33
100
2W
0.001
0.005
1 MEG
82
2W
0.01
2W
POWER
0.047
1N914
2W EACH
1.2 MEG
TEST
0.1
MTP1N100
20V
0.47
56
2W
f = 10 Hz
PW = 100 s
50 PULSE
GENERATOR
1000
1/4W
0-1000V
10mA
1N967A
18V
dV
Figure 40. Circuit For Static dt Measurement of Power Thyristors
Appendix C
Measuring
( dV
dt )c
dV
A test fixture to measure commutating ------- is shown in
dt
Commercial chokes simplify the construction of the necessary inductors. Their inductance should be adjusted by
increasing the air gap in the core. Removal of the magnetic
pole piece reduces inductance by 4 to 6 but extends the current without saturation.
dV
To measure ------- , synchronize the storage scope on the
dt c
current waveform and verify the proper current amplitude
and period. Increase the initial voltage on the capacitor to
compensate for losses within the coil if necessary. Adjust the
snubber until the device fails to turn off after the first halfcycle. Inspect the rate of voltage rise at the fastest passing
condition.
19
AN-3008
APPLICATION NOTE
HG = W AT LOW
TRIAD C30X
50H, 3500
910k
120
1/2W
62F
1kV
2W
6.2 MEG
2N3906
6.2 MEG
150k
2W
2N3904
0.1
PEARSON
301 X
2N3904
360
CASE
CONTROLLED
HEATSINK
51
+5
Q1
360
1/2W
1/2W
2N3906
1k
CS
70mA
+5
-5
0.1
+ 1.5kV
2N3904
Q3
2N3906
MR760
2.2M
910k
2W
Q1
MR760
0.01
120
1/2W
0-1 kV 20 mA
2N3906
2.2M
2.2M
2W
2N3904
0.01
51k
Q3
2.2M
2W
MR760
RS
RL
LL
CL (NON-POLAR)
2.2M, 2W
51k
2W
LD10-1000-1000
-CLAMP
2.2M, 2W
+CLAMP
NON-INDUCTIVE
RESISTOR DECADE
0-10k, 1 STEP
2W
51
dV
dt
SYNC
1
G
2W -5
IPK
W0 VCi
56
2 WATT
IP T
2 VCi
LL =
Q3
0.22
TRIAC
UNDER
TEST
2.2k
1/2
CL =
1k
2N3904
VCi
T2
42 CL
2N3906
Q1
0.22
1N5343
7.5V
270k
W0 IPK
W0 =
I
LL
270k
dl
= 6f IPK x 10-6
dt c
A/s
( )
dV
Figure 41. dt
Test Circuit for Power TRIACs
c
Appendix D
dV
Derivations
dt
Definitions
1.0
1.1
RS
M = ------- = Snubber Divider Ratio
RT
1.2
1
0 = --------------- = Undamped Natural Frequency
LC S
= Damped Natural Frequency
1.3
RT
= ------- = Wave Decrement Factor
2L
1.4
1 2 LI
2
Initial Energy In Inductor
= --------------------2- = ---------------------------------------------------------------------Final Energy In Capaitor
1 2CV
1.5
I L
= --- ---- = Initial Current Factor
E C
1.6
RT C
= ------- ---- = ------- = Damping Factor
2 L 0
1.7
20
APPLICATION NOTE
1.8
AN-3008
I ER
= ------ ----------LL
CS
dV
dV
------- = initial instantaneous -------at t = 0, ignoring any instantaneous voltage step at
dt 0
dt
t = 0 because of IRRM
1.9
R
dV
------- = V OL ------T- + . For All Damping Conditions
dt 0
L
2.0
ER
dV
When I = 0, ------- = ----------S
dt 0
L
dV
dV
-------
= Maximum Instantaneous ------ dt max
dt
dV
t max = Time of maximum instantaneous ------dt
t peak = Time of maximum instantaneous peak voltage across thyristor
dV
Average ------- = V PK t PK = Slope of the secant line from t = 0 through V PK
dt
V PK = Maximum instantaneous voltage across the thyristor.
No Damping ( = 0 )
= 0
RT = = = 0
2.2
2.3
0 = 0 1
Critial Damped ( = 1 )
L
2
= 0, = 0, R = 2 ---- , C = ----------C
R T
2.4
Overdamped ( > 1 )
=
0 = 0 1
SV O
E L + SI
E
L
i ( S ) = ------------------------------------- ; e = --- ------------------------------------R
S
2
1
2 RT
1
T
S + S ------- + -------S + ------- S + -------L LC
L
LC
RL
t=0
+
RS
CS
INITIAL CONDITIONS
I = IRRM
VCS = 0
21
AN-3008
APPLICATION NOTE
t
e = E V O Cos ( t ) ---- sin ( t ) e + ---- sin ( t ) e
L
4.1
( )
t
t
de
------ = V O 2Cos ( t ) + ----------------------- sin ( t ) e
+ Cos ( t ) ---- sin ( t ) e
L
dt
4.2
2V O +
1 1
L
t PK = ---- tan ----------------------------------------------2
2
V O ------------------- ------L
When M = 0, R S = 0, I = 0 ; t PK =
4.3
2
2
2
V PK = E + ------ t PK 0 V O + 2V O +
L
L
0
When I = 0, R L = 0, M = 1:
4.4
V PK
---------- = ( 1 + e t PK )
E
V PK
dV
Average ------- = ---------dt
t PK
2
4.5
( 2 V O ( 3 ) )
1
L
t max = ---- ATN -------------------------------------------------------------------------3
2
2
2
V O ( 3 ) + ( )
L
4.6
dV
-------
=
dt max
2 t max
V O 0 + 2 V O + e
L
No Damping
5.0
I
e = E ( 1 Cos ( 0 t ) ) + ----------- sin ( 0 t )
C 0
5.1
I
de
------ = E 0 sin ( 0 t ) + ---- cos ( 0 t )
C
dt
5.2
I
dV
------- = ---- = 0 when I = 0
dt 0
C
5.3
I
1
tan ---------------
CE 0
= -----------------------------------------0
t PK
5.4
2
I
V PK = E + E + ---------------2 2
0 C
5.5
V PK
dV
-------
= --------- dt AVG
t PK
5.6
I
I
1 0 EC
t max = ------ tan --------------- = ------ --- when I = 0
I
0 2
0
5.7
I
2
2
2 2
dV
-------
= ---- E 0 C + I = 0 E when I = 0
dt max
C
22
APPLICATION NOTE
AN-3008
Critical Damping
t
e = E V O ( 1 t )e
6.1
t
de
------ = [ V O ( 2 t ) + ( 1 t ) ]e
L
dt
6.2
t PK
+ te
6.0
2 + -------------2V OL
= -----------------------
+ ---------VO
L
6.3
V PK = E [ V O ( 1 t PK ) t PK ]e
6.4
V PK
dV
Average ------- = ---------dt
t PK
t PK
When I = 0, R S = 0, M = 0
dV
e(t) rises asymptotically to E. t PK and average ------- do not exist.
dt
6.5
3V O + 2
L
t max = ----------------------------2
V O +
L
When I = 0, t max = 0
RS
For ------- 3 4
RT
dV
then ------=
dt max
6.6
dV
-------
dt 0
dV
-------
dt max
= [ V O ( 2 t max ) + ( 1 t max ) ]e
t max
Appendix E
Snubber Discharge
dI
Derivations
dt
Overdamped
1.0
V CS t
i = ---------- sinh ( t )
L S
1.1
i PK = V C
1.2
1
1
t PK = ---- tan h ---
CS
------ e t PK
LS
Critical Damped
2.0
VC
t
i = ---------S te
LS
2.1
VC
i PK = 0.736 ---------S
RS
23
AN-3008
2.2
APPLICATION NOTE
1
t PK = --
Underdamped
3.0
V C t
sin (t )
i = ----------S e
L S
3.1
i PK = V C
3.2
1 1
t PK = ---- tan ---
CS
------e t PK
LS
RS
LS
t=0
VCS
CS
INITIAL CONDITIONS:
i = 0, VCS = INITIAL VOLTAGE
No Damping
4.0
VC
i = ----------S sin ( t )
L S
4.1
i PK = V C
4.2
t PK = ------2
CS
-----LS
Bibliography
Bird, B. M. and K. G. King. An Introduction To Power Electronics. John Wiley & Sons, 1983, pp. 250281.
McMurray, William. Optimum Snubbers For Power Semicondutors," IEEE Transactions On Industry Applications,
Vol.1A-8, September/October 1972.
Gempe, Horst. Applications of Zero Voltage Crossing Optically Isolated TRIAC Drivers, AN982, Motorola Inc., 1987
Guide for Surge Withstand Capability (SWC) Tests, ANSI
337.90A-1974, IEEE Std 4721974.
IEEE Guide for Surge Voltages in Low-Voltage AC Power
Circuits, ANS1/lEEE C62.41 -1980, IEEE Std 5871980
dI
Ikeda, Shigeru and Tsuneo Araki. The ----- Capability of
dt
24
AN-3008
APPLICATION NOTE
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY
LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER
DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, or (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in significant injury to the user.
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