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Santanu Sarma
Impact
of
Temperature
Elevated
temperatures
directly
impact
all
key
circuit
metrics
including:
life3me
and
reliability,
speed,
power,
and
costs.
Hot
spots
reduce
the
mean
3me
to
failure
as
most
failure
mechanisms
have
strong
temperature
dependencies
[Pedram2006].
Dierent
thermal
expansion
coefcients
of
chip
materials
cause
mechanical
stresses
that
can
eventually
crack
the
chip/
package
interface
[Brooks2007]
The
exponen3al
dependency
of
leakage
power
on
temperature
further
increases
total
power
and
could
lead
to
thermal
runaway
[Lin2008].
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Impact
of
Temperature
The
failure
rate
due
to
thermal
cycling
increases
with
the
increasing
magnitude
and
frequency
of
the
temperature
cycles
[JEDEC2006].
A
10
oC
rise
in
temperature
can
reduce
the
chip
life-3me
by
half
[h\p://www.nanowerk.com].
Increasing
temperature
increases
local
resistances,
and
thus
circuit
delays
and
IR
drop
[Santarini2005].
Elevated
temperatures
also
slow
down
devices
and
interconnects
leading
to
3ming
failures
[Cheng1998],
[Pileggi2006].
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Impact
of
Temperature
Inaccuracies
in
thermal
tracking
decreases
the
processors
performance
and
wastes
power.
In
par3cular,
it
was
shown
that
a
1oC
accuracy
translates
to
2W
power
savings,
and
that
due
to
lack
of
proximity,
sensor
measurements
and
hot
spot
temperatures
could
dier
by
up
to
10oC
[Rotem2006]
In
mobile
computers,
1.5oC
accuracy
in
temperature
measurement
is
equivalent
to
1
Wa\
of
CPU
power
[Rotem2006]
Inaccuracy
1oC
in
thermal
es3mates
can
trigger
DTM
and
unwanted
performance
loss
of
upto
14.4
%
[Zhang
2011].
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Maximum
temperature
distribu3on
along
ver3cal
distance
from
the
substrate
to
the
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Santanu
Sarma,
UCI
10
top
metal
layer
[Im2000]
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11
Magnitude
Remarks
Independent Dimensions
Maximum
Spa3al
Varia3ons
Up
to
40-60
oC
across
adjacent
blocks
Maximum
Spa3al
Gradients
Maximum
Temporal
Varia3ons
Maximum
Temporal
Gradients
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12
13
Problem
Classica3on
Placement
Techniques
Reconstruc0on Techniques
Based on Approach
Direct
Methods
Inverse
Methods
Based
on
Sensing
Approach
Based
on
Sampling
Mechanism
Based
on
Transformed
domain
Based
on
Informa3on
Theory
Adap3ve
Methods
Direct/Indirect
[Sharif
2010]
Phase
based
[Reda
2012]
Predic3ve
Model
based
[Coskun
2009]
Sta3c
placement
Dynamic
placement
[Buedo2004]
Based
on
Geometry
Uniform
Non-uniform
Based
on
Transformed
Domain
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14
Problem
Classica3on
THERMAL
CHARACTERIZATION
SENSOR PLACEMENT
RECONSTRUCTION
HYBRID
(IR
Imaging)
APPROACH
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GEOMETRY
XFORMS
DIRECT
INVERSE
ADAPTIVE
15
Thermal
Characteriza0on
Design-Time
Technique
Run-3me Technique
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16
17
18
Actual
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Sensed
[Skadron
2005,
Sankaranarayanan2009
]
Santanu
Sarma,
UCI
19
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20
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Disadvantages
limits
the
accuracy
of
the
uniform
grid
model
distances
between
the
sensor
loca3ons
and
the
hot
spots
cannot
be
minimized
Not
always
be
able
to
detect
hot
spots
as
accurately
as
the
same
number
of
sensors
located
near
common
hot
spots
21
[Memic 2008]
22
Interpola0on-Based Sensing
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23
24
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25
Disadvantages
Hot
spot
loca3ons
and
temperatures
are
applica3on
dependent
Solu3on
op3mized
for
a
single
applica3on
will
not
be
sucient
for
other
workloads
Can
have
too
many
hot
spots
points
and
hence
many
sensors
26
27
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29
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31
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Disadvantages
algorithm
does
not
end
execu3on
un3l
every
hot
spot
is
placed
in
a
cluster
Creates
new
clusters
where
necessary
to
include
hot
spots
that
are
located
far
away
from
the
others
number
of
sensors
required
by
the
QT
clustering
may
be
large
for
prac3cal
design
32
33
Thermal-Aware
K-Means:
Place
the
temperature
sensors
to
hot
spots
that
typically
have
higher
temperatures
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35
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38
39
40
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41
Uniform
Non
Interpolated
Accuracy
Uniform
sensing
[Memic 2008]
Yes
No
Yes
1.59C
Nearest
neighbor
With
16
sensors
interpola3on
[Sankaranarayan Yes
an2009]
No
Yes
Be\er
than
[Memic
2008]
Bilinear
/
Cubic
Spline
[Long2008]
Yes
No
Yes
3.1C
with
16
sensors
Non-linear Spline
[Skadron2005a] No
Yes
Yes
[Yun 2008]
No
Yes
No
0.2899C
with
23
sensors
QT
Clustering
+
Analy3cal
Model
[Mukherjee06]
No
Yes
No
4.58C
with
16
sensors
Basic
K-means
clustering
[Mukherjee06]
No
Yes
No
2.1C with 16
Thermal-aware
K-
42
means
clustering
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Remarks
Analy3cal
Model
Based
Uniform
Non
Interpolated
Accuracy
Uniform
sensing
Remarks
[Long2008]
No
Yes
Yes
~2.0C
with
16
sensors
[Sabuncu2004]
No
Yes
Depends
Sub-sampling
[Wang 2013]
No
Yes
Yes
0.26oC
with
14
sensors
Correla3on
Clustering
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43
INVERSE Methods
INVERSE Methods
ADAPTIVE Methods
Physical / Computa3onal
( Interpolated / Virtual)
45
46
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49
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50
Ti
Temperature
of
node
I
Tj-
Temperature
at
node
j
Pi-
Power
dissipa0on
at
node
I
Ci-
thermal
Capacitance
at
node
i
Gij-
lateral
conductance
between
node
I
and
j
=1/Rij
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51
Direct
Methods
Advantages
Highly
Accurate
Finite
Element
Model
(FEM)
based
automated
R-C
network
can
be
generated
Supported
by
many
tools
6/1/12
Disadvantages
Computa3onally
Intensive
Not
feasible
as
run-3me
approach
Requires
power
at
every
block/grid
point
52
Inverse
Methods
Inverse
methods:
given
the
value
of
the
temperature
in
some
loca3ons
and
some
a-priori
informa3on
about
the
thermal
map,
reconstruct
the
complete
map.
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55
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60
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62
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64
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66
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69
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[Zhou2012]
71
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72
Online
adapta0on
when
exis3ng
model
is
not
{ng
the
current
workload
Santanu
Sarma,
UCI
73
74
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75
76
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77
References
6/1/12
78
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6/1/12
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Thanks
santanus@uci.edu
www.variability.org
6/1/12
www.nsf.gov
www.uci.edu
83