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Institute of Microanalytical Systems, Chemistry Department, Zhejiang University, Hangzhou, 310028, China
A simple, room-temperature bonding process was developed for the fabrication of glass microfluidic chips. Highquality bonding with high yields (>95%) was achieved
without the requirement of clean room facilities, programmed high-temperature furnaces, pressurized water
sources, adhesives, or pressurizing weights. The plates
to be bonded were sequentially prewashed with acetone,
detergent, high-flow-rate (10-20 m/s) tap water, and
absolute ethyl alcohol and were soaked in concentrated
sulfuric acid for 8-12 h. The plates were again washed
in high-flow-rate tap water for 5 min and, finally, with
demineralized water. The plates were bonded by bringing
the cleaned surfaces into close contact under a continuous
flow of demineralized water and air-dried at room temperature for more than 3 h. This bonding process features
simple operation, good smoothness of the plate surface,
and high bonding yield. The procedures can be readily
applied in any routine laboratory. The bonding strength
of glass chips thus produced, measured using a shear
force testing procedure, was higher than 6 kg/cm2. The
mechanism for the strong bonding strength is presumably
related to the formation of a hydrolyzed layer on the plate
surfaces after soaking the substrates in acid or water for
extended periods. Microfluidic chips bonded by the above
procedure were tested in the CE separation of fluorescein
isothiocyanate-labeled amino acids.
Chip-based microfluidic systems have attracted broad interest
in recent years as a major form for realizing the lab-on-a-chip, or
TAS, concept.1-3 Although microfluidic chips may be produced
from glass, quartz, silicon, and various polymeric materials, those
fabricated on glass substrates have been employed most frequently owing to their favorable optical properties and support of
reproducible electroosmotic flow.1-3 Fabrication of glass microfluidic chips usually involves micro channel/structure fabrication
using a photolithographic and wet-etching procedure, followed by
the bonding of the etched plate with a flat coverplate. Currently,
bonding processes involving high temperatures are employed
most frequently. Glass plates are brought into close contact with
* To whom correspondence should be addressed. Phone: +86-571-88273496.
Fax: +86-571-88273496. E-mail: fangqun@mail.hz.zj.cn.
(1) Manz, A.; Fettinger, J. C.; Verpoorte, E.; Ludi, H.; Widmer, H. M.; Harrison,
D. J. Trends Anal. Chem. 1991, 10, 144.
(2) Harrison, D. J.; Manz, A.; Fan, Z.; Lu
di, H.; Widmer, H. M. Anal. Chem.
1992, 64, 1926.
(3) Jacobson, S. C.; Hergenro
der, R.; Koutny, L. B.; Warmack, R. J.; Ramsey,
J. M. Anal. Chem. 1994, 66, 1107.
10.1021/ac0494477 CCC: $27.50
Published on Web 08/11/2004
each other under clean room conditions and are usually subjected
to sophisticated temperature programming in a high-temperature
furnace at 500-650 C.2-4 High-temperature bonding processes
usually involve complicated manipulations requiring considerable
expertise for achieving high yields and stringent laboratory
conditions. Weights made from quartz, graphite, or refractory
materials have often been imposed on the plates to increase the
bonding pressure. Although such measures may be effective in
improving the bonding quality and yield, our experiences have
shown that smoothness of the plate surface was often deteriorated,
which reduced the optical quality of the chips. Recently, Yin et
al.4 reported the high-temperature bonding of glass plates under
routine laboratory conditions involving mating the plates under a
continuous flow of demineralized water.
In contrast to high-temperature bonding processes, lowtemperature bonding of glass microfluidic chips usually involves
the use of various adhesives below 100 C. Such procedures are,
therefore, suitable for the fabrication of microfluidic devices
containing structural features that are nonresistant to high
temperatures, such as electrodes and waveguides. Bonding with
adhesives is also suitable for materials with significantly different
thermal expansion coefficients. Wang et al. bonded glass plates
at 90 C employing sodium silicate as an adhesive layer.5
Nakanishi et al. reported a room-temperature pressure-assisted
procedure for bonding quartz wafers by treating the wafer surface
with dilute hydrofluoric acid.6,7 Sayah et al. described two methods
for direct pressure-assisted low-temperature bonding of glass
substrates,8 involving epoxy gluing at 90 C in the first method
and exposure of the glass stack to high pressure in the 100-200
C temperature range in the second. Chiem et al. proposed a roomtemperature bonding procedure featuring stringent washing of
the plate surfaces under clean-room conditions.9 A UV-curable glue
was used by Huang et al.10 for bonding glass chips at room
temperatures. The glue was filled into guide channels on the
microchip architecture, followed by exposure to UV light.
(4) Yin, X. F.; Shen, H.; Fang, Z. L. Fenxi Huaxue (Chinese J. Anal. Chem.)
2003, 31, 116.
(5) Wang, H. Y.; Foote, R. S.; Jacobson, S. C.; Schneibel, J. H.; Ramsey, J. M.
Sens. Actuators, B 1997, 45, 199.
(6) Nakanishi, H.; Nishimoto, T.; Nakamura, N.; Nagamachi, S.; Arai, A.; Iwata,
Y.; Mito, Y. IEEE. 1997, 299.
(7) Nakanishi, H.; Nishimoto, T.; Kanai, M.; Saitoh, T.; Nakamura, K.; Shoji,
S. Proc. Transducers 99, Sendai, Japan, 1999, 1332.
(8) Sayah, A.; Solignac, D.; Cueni, T.; Gijs, M. A. M. Sens. Actuators, A 2000,
84, 103.
(9) Chiem, N.; Lockyear-Shultz, L.; Andersson, P.; Skinner, C.; Harrison, D. J.
Sens. Actuators, B 2000, 63, 147.
Analytical Chemistry, Vol. 76, No. 18, September 15, 2004 5597
5598 Analytical Chemistry, Vol. 76, No. 18, September 15, 2004
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Figure 4. Presumed mechanism for room-temperature bonding process: (a) the formation of hydrolyzed layer on the substrate surface and
(b) dehydration and condensation/polymerization of Si-OH groups.
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Figure 7. Typical LIF electropherograms of repetitively introduced samples of a mixture of 20 M FITC-labeled arginine, phenylalanine, and
glycine employing glass microchips fabricated by (a) conventional high-temperature bonding method and (b) room-temperature bonding method.
Working electrolyte, 5 mM borax buffer; applied field strengths for filling of sampling channel and CE separation were 500 and 200 V/cm,
respectively; effective separation length, 18 mm.
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