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MOTOROLA

SEMICONDUCTOR
APPLICATION NOTE

AN282A

SYSTEMIZING RF POWER AMPLIFIER DESIGN


Prepared by: Roy Hejhall

INTRODUCTION
Two of the most popular RF small signal design
techniques are:
1. the use of two port parameters, and
2. the use of some type of equivalent circuit
for the transistor.
Early attempts to adapt these techniques to power amplifier
design led to poor results and frustration.
In the mid-1960s, Motorola pioneered the concept of solid
state power amplifier design through the use of large signal
transistor input and output impedances. This system has
since achieved almost universal acceptance by solid state
communications equipment manufacturers. It provides a
systematic design procedure to replace what used to be a
trial and error process. This note is a description of the
concept and its use in transmitter design.

LIMITATIONS OF SMALL-SIGNAL PARAMETERS


As a vivid example to show the short-comings of trying
to adapt small-signal parameters to power amplifier design,
the 2N3948 transistor was considered. A performance
comparison was made of the 2N3948 operating at 300 MHz
as a Class A small-signal amplifier, and as a Class C* power
amplifier delivering a power output of 1 W. Table 1 shows
the results of this comparison.

small-signal to large-signal conditions, the complex input


impedance of the 2N3948 undergoes a considerable change
in magnitude and actually changes from inductive to
capacitive reactance.
Note also that the transistors output resistances and
power gains are considerably different for the two modes
of operation. This example clearly demonstrates the
inaccuracies that would result in a power-amplifier design
based on the small-signal parameters of this device.

IMPORTANCE OF LARGE-SIGNAL PARAMETERS


The network theory for power amplifier design is well
known but is useless unless the designer has valid input and
output impedance data for the transistor. The design method
described in this report hinges primarily on the direct
measurement of these parameters for use in network
synthesis equations. Large-signal impedance data, together
with power output and gain data, provide the designer with
the information necessary to design his amplifier networks
and to predict the performance that should be achieved when
the design is completed.
A clear understanding of the test conditions and method
of presentation for the large signal impedance data is
important.

TEST CONDITIONS
CLASS A
Small-Signal
Amplifier
VCE = 15 Vdc;
Ic = 80 mA;
300 MHz

CLASS C
Power Amplifier
VCE = 13.6 Vdc;
Po = 1 W

Input resistance

9 Ohms

38 Ohms

Input capacitance or
inductance

0.012 H

21 pF

Transistor output
resistance

199 Ohms

92 Ohms

4.6 pF

5.0 pF

12.4 dB

8.2 dB

Output capacitance
GPE

Table 1. Small- and large-signal performance data for the


2N3948 show the inadequacy of using small-signal
characterization data for large-signal amplifier design.
Resistances and reactances shown are parallel
components. That is, the large-signal input impedance is
38 ohms in parallel with 21 pF, etc.
The most striking difference in this comparison is in the
device input impedance. As operation is changed from

Application
RF
Motorola,
Inc. 1993 Reports

The term large-signal input impedance and large signal


output impedance refer to the actual transistor terminal
impedances when operating in a matched amplifier at the
desired RF power output level and dc supply voltage.
Matched is defined as the condition where the input and
output networks of the test amplifier provide a conjugate
match to the transistor, such that the input and output
impedances of the amplifier are 50 + j 0 ohms.
Large-signal impedances should not be confused with
small-signal, two port parameters which are normally
measured at low signal levels with Class A bias and the
transistor (or IC) connected directly to a short, open, or 50
ohm termination.
Most of the data which appears on Motorola RF power
transistor data sheets is measured in common emitter, Class
C amplifiers; as this condition covers the majority of device
applications.

* Class C, as used here, refers to operation with both the emitter and
base at dc ground potential and with the collector supply as the only
dc voltage applied, regardless of resulting device conduction angle.
Usually, the emitter is connected directly to chassis ground and the
base is dc grounded through an inductive network element or choke.

AN282A

DATA FORMAT
Much of the information on device data sheets is
presented in parallel equivalent form of resistance and
capacitance. Figures 1 3 form an example of this type of
presentation. The data may also be presented in series
equivalent form. It makes no difference which form is used
as long as the designer pays particular attention to the form
and uses the data accordingly. As a convenience, the
series-parallel equivalent conversion equations are given in
Appendix A.

R in , INPUT RESISTANCE (OHMS)

5.0

VCC = 12.5 Vdc

2N5849

4.0

3.0
Pout = 20 W
2.0

1.0

40 W

1000
C out , OUTPUT CAPACITANCE (pF)

One significant exception to this involves transistors


characterized for Class B linear power amplifier service.
Examples of such transistors are the Motorola 2N5941-2
series. Since these transistors are designed specifically for
linear service, their large-signal impedances were measured
in a linear power amplifier test circuit with a two tone test
signal instead of the conventional single frequency signal.
For further information on these transistors see the Motorola
2N5941-2 data sheet.

VCC = 12.5 Vdc

2N5849

900
800
Pout = 40 W

700
600
20 W
500
400
300
25

30

35

40

50

60

70

80

f, FREQUENCY (MHz)

Figure 3. Parallel Equivalent Output Capacitance


versus Frequency
For example, reading the complex input impedance, from
Figures 1 and 2 at 50 MHz with 40 W output and a 12.5
Vdc collector supply, we obtain a value of 0.8 ohms
resistance in parallel with a 500 pF capacitance.
Another form of impedance data presentation uses the
series equivalent form plotted on a Smith Chart. This form
is popular with UHF power transistors due to the extensive
use of the Smith Chart in microstrip network synthesis.
Figure 4 is an example of large-signal impedances plotted
on a Smith Chart plot. Note that Figure 4 includes complete
complex output impedance data, not just the output
capacitance. This topic is discussed more fully in the section
on collector load resistance.

0
25

30

35

40

50

60

70

80

f, FREQUENCY (MHz)

Figure 1. Parallel Equivalent Input Resistance


versus Frequency
3000
C in , INPUT CAPACITANCE (pF)

2N5849

VCC = 12.5 Vdc

2500
2000

CHART NOT AVAILABLE ELECTRONICALLY

1500

Pout = 20 W

1000
40 W

500
0
500
1000
1500
25

30

35

40

50

60

70

80

f, FREQUENCY (MHz)

Figure 2. Parallel Equivalent Input Capacitance


versus Frequency

Figure 4. Large Signal Input and Output Series


Impedances, 2N6256

RF Application Reports

AN282A

After selection of a transistor with the required


performance capabilities, the next step in the design of a
power amplifier is to determine the large-signal input and
output impedances of the transistor. When using devices for
which the data is available, this step involves nothing more
than reading the complex impedance values off of the data
sheet. If only output capacitance is given on the data sheet,
the collector load resistance may be calculated in the manner
described in the Collector Load Resistance Section of this
note.
Again, the designer is cautioned to carefully determine
whether the data sheet impedance curves are in parallel or
series equivalent form, and to use the data accordingly. If
the data is not available, a later section of this note contains
information on large-signal impedance measurement.
Having determined the large-signal impedances, the
designer selects a suitable network configuration and
proceeds with his network synthesis.
The primary purpose of this note is to describe the
large-signal impedance concept. Accordingly, network
selection and synthesis are beyond the scope of this
discussion. For specific transmitter design examples using
this concept, the reader is referred to the following Motorola
Application Note: AN-548A.

COLLECTOR LOAD RESISTANCE


Large-signal impedance data at HF and VHF have for the
most part been published by Motorola without collector load
resistance information. The reason is that the load resistance
can easily be calculated. The conditions necessary to obtain
this load resistance derivation will now be discussed.
If certain simplifying assumptions are made, the
theoretical collector voltage of a power amplifier with a tuned
output network is a sine wave which swings from zero to
2 VCC, where VCC is the dc collector supply voltage.
These assumptions include:
1. VCE(sat) is equal to zero.
2. The output network has sufficient loaded Q to produce
a sine wave voltage regardless of transistor conduction
angle.
3. The voltage drop in the dc collector supply feed system
is zero.
4. The collector load impedance at all harmonics of the operating frequency is zero.
Obviously none of the foregoing assumptions is true, and
the most serious discrepancies probably arise from
assumptions 1 and 4. However, conditions are close enough
to give good results.
Let us assume for a moment that this theoretical condition
does exist. The parallel equivalent collector load resistance,
RL, then becomes a function of desired RF output power
and VCC only. The expression for RL given in equation 1
is readily derived.
RL =

(VCC)2
2P

(1)

where P = RF output power


Therefore, the complex collector load impedance for an
amplifier design would be the conjugate of the parallel

RF Application Reports

equivalent output capacitance and collector load resistance


computed with Equation 1.
Figure 5 provides a graphic solution to Equation 1 for the
four popular dc supply levels of 12.5, 13.6, 24 and 28 volts.
COLLECTOR LOAD RESISTANCE, OHMS

AMPLIFIER DESIGN

1k
VCC = 28
100
VCC = 24

VCC = 13.6
10
VCC = 12.5
1.0
0.1

1.0
10
RF POWER OUTPUT, WATTS

100

Figure 5. Collector Load Resistance


versus Power Output
Despite the assumptions required, experience with HF
and VHF lumped-component, power amplifiers with supply
voltages from 7 to 30 Vdc and power output levels from a
few tenths of a watt to 300 watts have proven that the use
of Equation 1 to compute RL for network synthesis yields
good results. That is to say, the types of HF and VHF lumped
component collector output networks which have proved best
from the standpoint of proper impedance matching with low
losses and smooth tuning generally have a sufficient tuning
and matching range to compensate for any errors associated
with Equation 1.
Of course if the VCE(sat) of the transistor is accurately
known for the frequency of operation and collector current
swings anticipated in a particular amplifier, Equation 1 is
readily modified as follows:
RL =

(VCC VCE(sat))2
2P

(2)

The advent of greatly increased numbers of UHF power


transistors and their associated amplifier design problems
brought some revisions to Motorolas methods of presenting
large-signal transistor impedances for UHF devices. Among
the reasons for this are the popularity of microstrip matching
networks and the higher VCE(sat) values at UHF.
The major difference in the data format involves output
impedance, which is presented in full complex form instead
of plotting parallel equivalent output capacitance only and
using Equation 1 to compute the load resistance. Further,
the UHF devices are measured in a microstrip test amplifier
for the purpose of determining the transistor impedances in
an environment which is as close as possible to that of the
majority of the actual applications of the device. And finally,
a Smith Chart plot is used as this is more convenient to the
microstrip network designer, who often makes extensive use
of the Smith Chart as a design tool.
Future Motorola data sheets may also include collector
load resistance data at frequencies below UHF. The
information is automatically generated for the test circuit in
use while measuring Cin, Rin, and Cout.

AN282A
PARAMETER MEASUREMENT
Although design engineers will find large-signal impedance characterization on Motorola data sheets for RF power
transistors, it may help to know how this data is obtained.
The transistor is placed in a test circuit designed to provide
wide tuning capabilities. Design of the first test amplifier for
a new transistor type is based on estimates of input and
output impedance.
Since the input and output impedances are needed to
design an amplifier which is then used to measure the
impedances of the device, we have a chicken or the egg
type of problem. Wide tuning range networks help
compensate for errors in the impedance estimates and they
also permit the same characterization amplifier to be used
at multiple power output levels.
The amplifier is tuned for a careful impedance match at
both input and output. Several precautions are in order to
insure that this is accomplished.
Tuning for maximum power output is valid only if the
source and load impedances are an accurate 50 + j 0 ohms.
Usually a good 50 ohm load is available in the laboratory.
Such a load should be used, as tuning for maximum output
power for a given input power is the best method to use on
the amplifier output network.
The input network poses some additional problems. First,
many laboratory RF power sources are not accurate 50 ohm
generators. A generator impedance that is not 50 ohms can
introduce errors in measuring gain as well as input
impedances. In addition, a source with high harmonic levels
can cause difficulties in low Q input networks.
A good solution to this problem is to use a dual directional
coupler or directional power meter in the coax line between
the generator and the test amplifier. The amplifier is then
tuned for zero reflected power, thus indicating that the input
network is really matching the transistor input impedance to
50 + j 0 ohms.
In practice, the reflected power usually will not null all the
way to zero, so one should insure that the null is at least
as deep as that obtained with a good 50 ohm passive
termination.
In some cases, the amplifier will reflect enough harmonic
power to prevent a satisfactory reflected power null from
being obtained. A good solution to this problem is to place
a fundamental frequency bandpass filter at the reflected
power port of the dual directional coupler.
A typical test amplifier for HF and VHF measurements
is shown in Figure 6. For UHF device characterization,
amplifiers employing microstrip matching networks are most
commonly employed.
After the test amplifier has been properly tuned, the dc
power, signal source, circuit load, and test transistor are
disconnected from the circuit. Then the signal source and
output load circuit connections are each terminated with
50 ohms. After performing these substitutions, complex
impedances are measured at the base and collector circuit
connections of the test transistor (points A and B respectively

in Figure 7). The desired data, the transistor input and output
impedances, will be the conjugates of the base circuit
connection and the collector circuit connection, impedances
respectively.
By operating test amplifiers at several different
frequencies with at least two power outputs, sufficient data
can be obtained to characterize a transistor for the majority
of its power applications.
RL = 50
RS = 50

RFC
RFC

VCC

Figure 6. Typical Test Amplifier Circuit

RL = 50
RS = 50
B
A

RFC

RFC

VCC
Complex impedances are measured at the
base and collector circuit connections of the
test transistor (points A and B respectively).
Desired data will be the conjugates of these
impedances.

Figure 7. Test Circuit with Transistor Removed

SUMMARY
The large-signal impedance characterization of RF power
transistors has provided the most systematic and successful
power amplifier design method the author has encountered
since the concept was explored in depth in the mid 1960s.

RF Application Reports

AN282A
APPENDIX A
PARALLEL-TO-SERIES AND SERIES-TO-PARALLEL
IMPEDANCE CONVERSION EQUATIONS

X 2
Rp = Rs 1 + s
Rs

Rs

Xp =
Rp

Xp

Xs
Rs =

R p Rs
Xs
Rp
1 +

Xs =

RF Application Reports

Rp
Xp

R s Rp
Xp

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