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This paper is part of a special issue on Hardness across the multi-scales of structure and loading rate
Introduction
Perhaps the earliest deliberate use of contact fracture
has to be the process of making stone tools by striking a
flake from a block of flint or other suitable brittle
material. The existence of such flints is often described as
one of the few tangible evidences of mans presence for
the past million years or so of what is described as
human cultural evolution by Speth.1 Two distinct
methods of flake production are pressure flaking, where
a flake is prised from the rock by a steady concentrated
force applied near the edge, and percussion flaking,
where this force is applied impulsively. Simplified
mathematical models of these processes have been
considered by Fonseca et al.2 Relevant articles on
percussion flaking are that of Speth1 (referred to above)
and Cotterell et al.3 together with the book by
Whittaker.4 If one googles flintknapping, one can find
many lectures on YouTube that describe the process and
in particular indicate which types of rock are suitable.
This topic, although interesting and of great value to
archaeologists, does not lend itself to careful quantitative analysis because of the variability of the rocks.
Hence, we mainly concentrate here on what has been
determined via theory and experiment in glasses and
ceramics, although we make a brief comparison with
indentation fracture in rocks.
The plan of the present paper is as follows. We begin
(section on Indentation fracture) by characterising the
geometry and extent of indentation induced cracking in
terms of contact stress field. Various crack patterns are
then identified: Hertzian cone cracks, median cracks,
lateral vents, etc. Expressions are derived for the scale of
microfracturing in terms of the indentor load from
which the roles of material properties (e.g. hardness H,
toughness C and stiffness E) and extraneous variables
(e.g. indentor geometry, environment, etc.) may be
inferred. Much of this work has been carried out some
1
Indentation fracture
A great deal of study has been made on the indentation
fracture of glasses and ceramics, and whereas we might
expect differences in detail between the phenomena
observed in these materials and those observed in brittle
rock, there are nevertheless fairly close similarities
between them. In this section, we describe the main
features likely to be common to indentation induced
fracture patterns and attempt a quantitative description
of them. There is a vast literature on the indentation
fracture of ceramics and glasses (see the references at the
end of this review for a selection).
The objectives for the first parts of this section will be
to:
(i) characterise the geometry and extent of indentation induced cracking in terms of contact stress
field
(ii) derive expressions for the scale of microfracturing
in terms of the indentor load from which the role
of material properties (e.g. hardness H, toughness
C and stiffness E) and extraneous variables (e.g.
indentor geometry, environment, etc.) may be
inferred.
As far as the loading stress field is concerned, a crude
distinction can be made between the types of indentor,
i.e. blunt or sharp. For a point indentation, typified
by a conical indentor, qualitative results are that:
(i) blunt indentors: dominant tension occurs in near
field just outside the contact area, leading to
Hertzian contact cracks observed when spheres
impact glass
(ii) sharp indentors: dominant tension develops immediately below penetration point.
This distinction can be seen most clearly by comparing the Hertzian and Boussinesq stress fields created
by spherical and point indentors respectively (see
Appendixes 1 and 2).
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Contact mechanics
A typical brittle solid contains a profusion of preexisting flaws, and the deformation process during
indentation may itself create crack nuclei by micromechanical slip events. The macroscopic inhomogeneous stress field induced by the indentor interacts with
these so that pre-existing near surface flaws dominate
crack initiation in the case of blunt indentors. This leads
to Hertzian conical cracks for blunt conical indentors
and to prismoidal shaped cracks for blunt chisel shaped
indentors. These cracks are indicated in cross-section in
Fig. 1 by the letters C and P.
For sharp indentors, deformation induced flaws below
the surface dominate since high tensile stresses are
created there by the inhomogeneous (sharp) indentor
stress field.
Note that more subtle explanations may be relevant if
the micromechanics of non-elastic deformation beneath
the indentor are looked at in more detail.
Crack formation
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dUS !C(cdc)
(1)
Atkinson et al.
Contact mechanics
2 Wedge indentation with median vent crack (M) and prism shaped crack: PL is line distributed force (force per unit
length)
(2)
(3)
(4)
dUM zdUS ~0
(5)
(6a)
(6b)
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H~P =(apa2 )
(7)
P
P
~lL L for line loads
2HL
2H
c~lP a~lP
P
apH
(8a)
1=2
for point loads
(8b)
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(12)
(13)
which has the same form as equation (6a) and (6b) when
we note, by comparing Figs. 3 and 5, that c5Rtan a.
A more recent treatment of the cone crack problem is
that of Lawn et al.7 These authors try to analyse the
situation occurring in many test arrangements where
the indentor load increases monotonically so that the
growing crack experiences a time varying stress field. We
list here the characteristics of the Hertzian stress field
based on the solution of Huber12 given in Appendix 1.
These are the following:
(i) within a drop shaped zone beneath the contact
circle, all principal stresses are compressive
(ii) the tensile stress reaches its maximum at the
contact circle and falls off relatively slowly with
increasing radial distance from the contact
centre along the specimen surface
Contact mechanics
(15)
(16)
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P1 ~
P
2 tan y
(17)
P
2 tan y1
(18)
(19)
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K~
2P1
(pc)3=2
(20)
(21)
1{n2
tan y1
(22)
p3
Thus, the unknown proportionality constant in expression (6) has been determined for this case. Lawn and
Fuller8 make comparisons with experiments on soda
lime glass, which seem to justify the P2/c3 relationship of
equation (21) for a variety of indentor angles. These
data give moderate agreement with equation (19) with
the angle of friction m taken to be zero.
In an earlier paper, Lawn and Swain9 have given a
more detailed fracture mechanics analysis of median
vent formation beneath point indentors using the
Boussinesq stress field given in Appendix 2. They note,
in particular, that for n50?25, the three principal stresses
s11>s22>s33 nearly everywhere in the field and that
both s11 and s33 are contained within planes of
symmetry through the normal load axis with s11
everywhere tensile and s33 everywhere compressive.
Thus, the tensile component of the point indentation
field might well be large enough to sustain a brittle
crack. The value of Poissons ratio is critical as far as
the tensile stress is concerned: at n50?5, the tensile
component in the Boussinesq field disappears, and as n
varies between 0?2 and 0?5, the materials generally tend
to vary from highly brittle to highly ductile. The fracture
mechanics calculations of Lawn and Swain9 did not,
however, bear out the similarity relation (21), and this
is probably due to the fact that their calculations modelled the crack as planar, and the distribution of the
tensile stress produced by Boussinesq field was thus not
correctly distributed over the crack plane.
In a more recent paper, Lawn et al.17 have reconsidered this problem by arguing that the complex
elasticplastic stress field beneath the indentor can be
resolved into its elastic and residual components. The
elastic component enhances downward median extension
during the loading half cycle, but since it is reversible,
k~
Atkinson et al.
xr P
c3=2
(23)
where
1{m
E
xr ~jr (Q)
( cot y)2=3
H
(24)
P
(26)
R2
where g(w) appropriate to stresses normal to the median
plane is strongly varying, changing from positive
(tensile) at w50 to negative (compressive) at w590u.
s(R,Q)&g(Q)
Contact mechanics
P
c3=2
(28)
(29)
Because of the c/b dependence of equation (29), expression (28) deviates from the similarity that we deduced in
equations (6b), (21) and (23). However, because of the
ln (c/b) dependence of equation (29), this variation is
not so great. Furthermore, Lawn et al.17 argue that Ke is
secondary in importance to Kr in determining the
ultimate crack configuration.
The condition for equilibrium growth of these cracks
is obtained by equating the net stress intensity factor
K to the toughness KC {this can be related to C used
previously for example in plane strain; since G5
(12n2)K2/E, one would have KC5[2EC/(12n2)]1/2}.
Thus, during the loading/unloading event, one would
have K5KezKr5KC, and care must be taken to realize
that equation (28), being the elastic loading component,
is reversible, whereas the residual term of equation (23)
is irreversible. Since we are interested in what happens
after complete unloading of the crack having then
attained its full half penny configuration, it seems
adequate to use equation (23) and derive
c~(xr Pmax =KC )2=3
(30)
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(35)
fL
E 5=4 7=4
( cot y)7=6
P
1=2
KC H 2
A
(36)
Applications
In the section on Indentation fracture, we have
described the main features of contact fracture in a
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Practical example
The original theory of Hertzian fracture in isotropic
elastic materials was extended by Lawn26 to the case of
brittle single crystals, analysing the inhomogeneous
stress field and crack paths developed in the indentation
of a flat surface with a spherical indentor. He found that
the Hertzian crack passes through four equilibrium
stages before reaching its fully developed length, which
is experimentally confirmed in indentation tests on single
crystals of silicon.
A compilation of indentation results on silicon crystals for several indentor types and a large range in load
values covering elastic, plastic and fracture behaviours
has been reported by Armstrong et al.27 In the case of
sharp indenters, they attribute crack initiation to dislocation reaction mechanisms that develop during microslip deformation interaction, in agreement with the
TEM results reported for damage of silicon by various
contact testing experiments.
The role of dislocations in indentation (and nanoindentation) processes has been analysed by Chaudhri,28
mainly based on elastic behaviour, as well as the phase
Atkinson et al.
Contact mechanics
7 Scheme of indented wafers and square samples prepared (highlighted in green): location of indents in wafers is also
shown with one side of Berkovich tip parallel to [011] direction (note that scale of imprint is not real)
transformation of silicon associated with stresses generated during indentation hardness experiments.
Here, we describe briefly a practical example aimed at
understanding silicon wafer handling damage.
In order to replicate defect generation in real
processes, controlled damage was introduced on initially
defect free silicon wafer samples using nanoindentation
with a Berkovich tip. The tested samples consisted of
square pieces of 20620 mm size. They were prepared by
first cleaving a 300 mm silicon wafer with (100) surface
crystallographic orientation along the [011] direction
8 Sequence of eld emission gun SEM images from topdown bbing on 110 mN Berkovich indent on Si, showing coexistence of radial and median cracks close to surface and further development of median cracks under indentor imprint
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9 Image (STEM) of cross-section cut of median and lateral cracks under 150 mN Berkovich indent on Si
10 Three-dimensional reconstruction from FIB tomography of median and lateral cracks under 120 mN
Berkovich indent on Si
Conclusions
We have concentrated in the section on Indentation
fracture on outlining the consequences of the inhomogeneous stress field produced by the indentor, the main
theme being that tensile stresses can initiate cracks
and subsequently sustain crack propagation. We have
emphasised the crack propagation stage since such
macrocracks lead to chip formation. However, if
11 a geometry of silicon piece to be indented and b, c structured mesh of eight-node hexahedral elements for half of
model
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12 Comparison of 2D Raman spectrum map obtained experimentally (left) and prediction based on stress eld resulting
from nite element model simulations (right)
a at maximum indentation load; b after indentation process (broken material has been removed from plot for clarity); c
3D reconstruction of vertical experimental crack in same plane
13 Crack in vertical plane: contour plots of generated damage
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References
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Appendix 1
Hertzian stress field
The Hertzian stress field has the property of geometrical
similarity when all stress components are normalised to
the mean contact pressure p05P/(pa2) and all spatial
coordinates normalised to the contact radius a. The
stresses in the OXZ plane (see Fig. 5) are given by
Huber12 as
"
#
3
sxx 1{2n a 2
z 3
z
a2 u
:
z1 5 1=:2
~
1{ 1=2
z
2
r
u2 za2 z2
p0
u
u
z
u
u1=2
a
1:5 1=2 (1{n) 2
z(1zn)
arctan 1=2 {2
a zu
a
u
u
szz
z 3 a2 u
:
~{1 5 1=2
u2 za2 z2
p0
u
sxz
xz2 a2 u1=2
~{1:5 2
p0
u za2 z2 a2 zu
where r25x2zz2 and
h
i 1=2
2
1
(x2 zz2 {a2 )z x2 zz2 {a2 z4a2 z2
u~
2
The principal normal stress across the crack path (at an
angle a to the horizontal) is
sN (x,z)~sxx sin2 azszz cos2 a{2sxz sin a cos a
The angle a between the crack path and the specimen
surface is found from
tan 2a~{2
sxz
sxx {szz
Appendix 2
Boussinesq problem
The stress field in an isotropic elastic half space
subjected to a normal point load P (the Boussinesq
problem) can be written in terms of the curvilinear
coordinates of Fig. 14 as
P 1{2n 2
3
srr ~ 2
sec (Q=2){ cos Q sin2 Q
pR
4
2
shh ~
P 1{2n
1 2
cos
Q{
sec
(Q=2)
pR2
2
2
szz ~
P
3
3
{
Q
cos
pR2
2
Atkinson et al.
Contact mechanics
P
3
2
srz ~ 2 { cos Q sin Q
pR
2
srh ~shz ~0
Two of the principal normal stresses, s11 and s33, are
contained in the symmetry plane h5constant, with their
angles with the specimen surface given by
tan 2a~2
srz
szz {srr
s12 ~
s11 {s22
2
s22 {s33
2
inclined at p/4 to the principal directions. In addition,
the magnitude of the component of hydrostatic compression is
s23 ~
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