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DRV8840
SLVSAB7D MAY 2010 REVISED DECEMBER 2015

DRV8840 DC Motor Driver IC


1 Features

3 Description

The DRV8840 provides an integrated motor driver


solution for printers, scanners, and other automated
equipment applications. The device has one H-bridge
driver, and is intended to drive one DC motor. The
output driver block for each consists of N-channel
power MOSFETs configured as full H-bridges to drive
the motor windings. The DRV8840 can supply up to
5-A peak or 3.5-A output current (with proper
heatsinking at 24 V and 25C).

Single H-Bridge Current-Control Motor Driver


8.2-V to 45-V Operating Supply Voltage Range
Five Bit Current Control Allows up to 32 Current
Levels
Low MOSFET RDS(on) Typical 0.65 (HS + LS)
5-A Maximum Drive Current at 24 V, TA = 25C
Built-In 3.3-V Reference Output
Parallel Digital Control Interface
Thermal Enhanced Surface Mount Package
Protection Features:
Overcurrent Protection (OCP)
Thermal Shutdown (TSD)
VM Undervoltage Lockout (UVLO)
Fault Condition Indication Pin (nFAULT)

2 Applications

Printers
Scanners
Office Automation Machines
Gaming Machines
Factory Automation
Robotics

A simple parallel digital control interface is compatible


with industry-standard devices. Decay mode is
programmable to allow braking or coasting of the
motor when disabled.
Internal shutdown functions are provided for
overcurrent protection, short-circuit protection,
undervoltage lockout, and overtemperature.
The DRV8840 is available in a 28-pin HTSSOP
package with PowerPAD (Eco-friendly: RoHS & no
Sb/Br).
Device Information(1)
PART NUMBER
DRV8840

PACKAGE
HTSSOP (28)

BODY SIZE (NOM)


9.70 mm 4.40 mm

(1) For all available packages, see the orderable addendum at


the end of the datasheet.

Simplified Schematic

8.2 to 45 V
ENBL

DRV8840

Controller

PHASE
Current Control
Decay Mode

H-Bridge
5A
Motor Driver
-

nFAULT

Current
Control

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.

DRV8840
SLVSAB7D MAY 2010 REVISED DECEMBER 2015

www.ti.com

Table of Contents
1
2
3
4
5
6

Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................

1
1
1
2
3
4

6.1
6.2
6.3
6.4
6.5
6.6

4
4
4
5
6
7

Absolute Maximum Ratings ......................................


ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................

Detailed Description .............................................. 8


7.1
7.2
7.3
7.4

Overview ................................................................... 8
Functional Block Diagram ......................................... 9
Feature Description................................................... 9
Device Functional Modes........................................ 13

Application and Implementation ........................ 14


8.1 Application Information............................................ 14
8.2 Typical Application ................................................. 14

Power Supply Recommendations...................... 17


9.1 Bulk Capacitance Sizing ......................................... 17

10 Layout................................................................... 18
10.1 Layout Guidelines ................................................. 18
10.2 Layout Example .................................................... 18
10.3 Thermal Considerations ........................................ 19

11 Device and Documentation Support ................. 20


11.1
11.2
11.3
11.4
11.5

Documentation Support ........................................


Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................

20
20
20
20
20

12 Mechanical, Packaging, and Orderable


Information ........................................................... 20

4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (August 2013) to Revision D

Page

Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1

Updated Features bullets ....................................................................................................................................................... 1

Added MIN value for ISENSEx row from 0.3 V to 0.8 V ................................................................................................... 4

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5 Pin Configuration and Functions


PWP Package
28-Pin HTSSOP
Top View

CP1
CP2
VCP
VM
OUT1
ISEN
OUT2
OUT2
ISEN
OUT1
VM
VREF
VREF
GND

1
2
3

28

25
24

27
26

5
6

23
GND
(PPAD)

7
8

22
21

20

10

19

11

18

12

17

13

16

14

15

GND
I4
I3
I2
I1
I0
NC
ENBL
PHASE
DECAY
nFAULT
nSLEEP
nRESET
V3P3OUT

Pin Functions
PIN
NAME

NO.

I/O (1)

EXTERNAL COMPONENTS
OR CONNECTIONS

DESCRIPTION

POWER AND GROUND


GND

14, 28

Device ground

VM

4, 11

Bridge A power supply

Connect to motor supply (8.2 - 45 V). Both


pins must be connected to same supply.

V3P3OUT

15

3.3-V regulator output

Bypass to GND with a 0.47-F, 6.3-V ceramic


capacitor. Can be used to supply VREF.

CP1

IO

Charge pump flying capacitor

CP2

IO

Charge pump flying capacitor

VCP

IO

High-side gate drive voltage

Connect a 0.1-F 16-V ceramic capacitor and


a 1-M resistor to VM.

PHASE

20

Bridge phase (direction)

Logic high sets OUT1 high, OUT2 low.


Internal pulldown.

ENBL

21

Bridge enable

Logic high to enable H-bridge. Internal


pulldown.

I0

23

I1

24

I2

25

Current set inputs

Sets winding current as a percentage of fullscale. Internal pulldown.

I3

26

I4

27

DECAY

19

Decay (brake) mode

Low = brake (slow decay), high = coast (fast


decay). Internal pulldown and pullup.

nRESET

16

Reset input

Active-low reset input initializes the logic and


disables the H-bridge outputs. Internal
pulldown.

nSLEEP

17

Sleep mode input

Logic high to enable device, logic low to enter


low-power sleep mode. Internal pulldown.

12,13

Current set reference input

Reference voltage for winding current set.


Both pins must be connected together on the
PCB.

Connect a 0.01-F 50-V capacitor between


CP1 and CP2.

CONTROL

VREF
(1)

Directions: I = input, O = output, OZ = tri-state output, OD = open-drain output, IO = input/output

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SLVSAB7D MAY 2010 REVISED DECEMBER 2015

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Pin Functions (continued)


PIN
NAME

NO.

I/O (1)

DESCRIPTION

EXTERNAL COMPONENTS
OR CONNECTIONS

STATUS
18

OD

Fault

Logic low when in fault condition


(overtemperature, overcurrent)

ISEN

6, 9

IO

Bridge ground / Isense

Connect to current sense resistor. Both pins


must be connected together on the PCB.

OUT1

5, 10

Bridge output 1

Connect to motor winding. Both pins must be


connected together on the PCB.

OUT2

7, 8

Bridge output 2

Connect to motor winding. Both pins must be


connected together on the PCB.

nFAULT
OUTPUT

6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2)
VMx
VREF

MIN

MAX

UNIT

Power supply voltage

0.3

47

Digital pin voltage

0.5

Input voltage

0.3

ISENSEx pin voltage (3)

0.8

0.8

Peak motor drive output current, t < 1 S

Internally limited

Continuous motor drive output current

(4)

Continuous total power dissipation


TJ

Operating virtual junction temperature

40

TA

Operating ambient temperature

Tstg

Storage temperature

(1)
(2)
(3)
(4)

See Thermal Information


150

40

85

60

150

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolutemaximumrated conditions for extended periods may affect device reliability.
All voltage values are with respect to network ground pin.
Transients of 1 V for less than 25 ns are acceptable.
Power dissipation and thermal limits must be observed.

6.2 ESD Ratings


VALUE
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins
V(ESD)
(1)
(2)

Electrostatic discharge

(1)

UNIT

2000

Charged device model (CDM), per JEDEC specification JESD22-C101, all


pins (2)

500

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions


over operating free-air temperature range (unless otherwise noted)
Motor power supply voltage (1)

VM

(2)

MIN

MAX

8.2

45

UNIT
V

VREF

VREF input voltage

3.5

IV3P3

V3P3OUT load current

mA

fPWM

Externally applied PWM frequency

100

kHz

(1)
(2)
4

All VM pins must be connected to the same supply voltage.


Operational at VREF between 0 V and 1 V, but accuracy is degraded.
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6.4 Thermal Information


DRV8840
THERMAL METRIC (1)

PWP (HTSSOP)

UNIT

28 PINS
RJA

Junction-to-ambient thermal resistance

31.6

C/W

RJC(top)

Junction-to-case (top) thermal resistance

15.9

C/W

RJB

Junction-to-board thermal resistance

5.6

C/W

JT

Junction-to-top characterization parameter

0.2

C/W

JB

Junction-to-board characterization parameter

5.5

C/W

RJC(bot)

Junction-to-case (bottom) thermal resistance

1.4

C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.

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6.5 Electrical Characteristics


over operating free-air temperature range (unless otherwise noted)
PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

POWER SUPPLIES
IVM

VM operating supply current

VM = 24 V, fPWM < 50 kHz

mA

IVMQ

VM sleep mode supply current

VM = 24 V

10

20

VUVLO

VM undervoltage lockout voltage

VM rising

7.8

8.2

3.3

3.4

V3P3OUT REGULATOR
V3P3

V3P3OUT voltage

IOUT = 0 to 1 mA

3.2

LOGIC-LEVEL INPUTS
VIL

Input low voltage

VIH

Input high voltage

2.2

0.6

VHYS

Input hysteresis

0.3

IIL

Input low current

VIN = 0

IIH

Input high current

VIN = 3.3 V

RPD

Internal pulldown resistance

0.7

5.25

0.45

0.6

20

33

100

20
100

nFAULT OUTPUT (OPEN-DRAIN OUTPUT)


VOL

Output low voltage

IO = 5 mA

IOH

Output high leakage current

VO = 3.3 V

0.5

0.8

40

DECAY INPUT
VIL

Input low threshold voltage

For slow decay (brake) mode

VIH

Input high threshold voltage

For fast decay (coast) mode

IIN

Input current

RPU

Internal pullup resistance

RPD

Internal pulldown resistance

V
130

80

H-BRIDGE FETS
RDS(ON)

HS FET on resistance

RDS(ON)

LS FET on resistance

IOFF

Off-state leakage current

VM = 24 V, IO = 1 A, TJ = 25C

0.1

VM = 24 V, IO = 1 A, TJ = 85C

0.13

VM = 24 V, IO = 1 A, TJ = 25C

0.1

VM = 24 V, IO = 1 A, TJ = 85C

0.13
40

0.16
0.16
40

MOTOR DRIVER
fPWM

Internal current control PWM


frequency

tBLANK

Current sense blanking time

tR

Rise time

30

200

ns

tF

Fall time

30

200

ns

160

180

660

685

mV

50

kHz
s

3.75

PROTECTION CIRCUITS
IOCP

Overcurrent protection trip level

tTSD

Thermal shutdown temperature

6
Die temperature

150

CURRENT CONTROL
IREF

VREF input current

VREF = 3.3 V

VTRIP

ISENSE trip voltage

VREF = 3.3 V, 100% current setting

ITRIP

Current trip accuracy


(relative to programmed value)

AISENSE Current sense amplifier gain

3
635

VREF = 3.3 V, 5% current setting

25%

25%

VREF = 3.3 V, 10% - 34% current setting

15%

15%

VREF = 3.3 V, 38% - 67% current setting

10%

10%

VREF = 3.3 V, 71% - 100% current setting

5%

5%

Reference only

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6.6 Typical Characteristics


7

14

6.5
12
IVMQ (PA)

IVM (mA)

6
5.5

10

5
8

-40qC
25qC
85qC
125qC

4.5
4
10

15

20

25
30
V(VMx) (V)

35

40

45

-40qC
25qC
85qC
125qC

6
10

15

20

Figure 1. IVMx vs V(VMx)

35

40

45
D002

Figure 2. IVMxQ vs V(VMx)


350

400
-40C

25C

85C

125C

325
RDS(ON) HS + LS (m)

350
RDS(ON) HS + LS (m)

25
30
V(VMx) (V)

D001

300

250

300
275
250
225
200

200

8V
24 V
45 V

175
150

150
8

13

18

23

28

33

V(VMx) (V)

38

43

50

C001

25

25

50

75

100

TA (C)

125
C002

Figure 4. RDS(ON) vs Temperature

Figure 3. RDS(ON) vs V(VMx)

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7 Detailed Description
7.1 Overview
The DRV8840 is an integrated motor driver solution for printers, scanners, and other automated equipment
applications. The device integrates a single NMOS H-bridge, charge pump, current sense, current regulation, and
device protection circuitry. The DRV8828 can be powered from a single voltage supply from 8.2 V to 45 V, and is
capable of providing a continuous output current up to 5 A.
A simple PHASE/ENBL interface allows for easy interfacing to an external controller. A 5 bit current control
scheme allows for up to 32 discrete current levels. The current regulation method is adjustable between slow and
fast decay.
Integrated protection circuits allows the device to monitor and protect against overcurrent, undervoltage, and
overtemperature faults which are all reported through a fault indication pin (nFAULT). A low power sleep mode is
integrated which allows the system to lower power consumption when not driving the motor.

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7.2 Functional Block Diagram


VM
3.3V
V3P3OUT

LS Gate
Drive
CP1

V3P3OUT

Internal
VCC

Charge
Pump

Low Side
Gate
Drive

CP2
HS Gate
Drive

VM
VCP

3.3V
VM
VREF

VM
VM
+

VREF

Additional
Bulk Cap

VM

PHASE
OUT1
ENBL
OUT1
I0

I1
+
I2

Stepper
Motor

BDC

I4

Motor Driver

DECAY

OUT2

nRESET

OUT2

Control
Logic/
Indexer

I3

nSLEEP
ISEN
Thermal
Shut
Down

nFAULT

GND

PPAD

ISEN

GND

7.3 Feature Description


7.3.1 PWM Motor Driver
The DRV8840 device contains one H-bridge motor driver with current-control PWM circuitry. A block diagram of
the motor control circuitry is shown in Figure 5.

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Feature Description (continued)


VM

OCP
VM

VCP, VGD

OUT1
Predrive

DCM

OUT2

ENBL
PHASE

PWM

DECAY
OCP
ISEN

+
I[4:0]

A =5

DAC
5

VREF

Figure 5. Motor Control Circuitry


There are multiple VM, ISEN, OUT, and VREF pins. All like-named pins must be connected together on the PCB.
7.3.2 Bridge Control
The PHASE input pin controls the direction of current flow through the H-bridge, and hence the direction of
rotation of a DC motor. The ENBL input pin enables the H-bridge outputs when active high, and can also be
used for PWM speed control of the motor. Note that the state of the DECAY pin selects the behavior of the
bridge when ENBL = 0, allowing the selection of slow decay (brake) or fast decay (coast). Table 1 shows the
logic.
Table 1. H-Bridge Logic
DECAY

ENBL

PHASE

OUT1

OUT2

The control inputs have internal pulldown resistors of approximately 100 k.


7.3.3 Current Regulation
The maximum current through the motor winding is regulated by a fixed-frequency PWM current regulation, or
current chopping. When the H-bridge is enabled, current rises through the winding at a rate dependent on the
DC voltage and inductance of the winding. Once the current hits the current chopping threshold, the bridge
disables the current until the beginning of the next PWM cycle.
For DC motors, current regulation is used to limit the start-up and stall current of the motor. Speed control is
typically performed by providing an external PWM signal to the ENBLx input pins.
If the current regulation feature is not needed, it can be disabled by connecting the ISENSE pins directly to
ground and the VREF pins to V3P3.
The PWM chopping current is set by a comparator which compares the voltage across a current sense resistor
connected to the ISEN pin, multiplied by a factor of 5, with a reference voltage. The reference voltage is input
from the VREF pin, and is scaled by a 5-bit DAC that allows current settings of zero to 100% in an approximately
sinusoidal sequence.
10

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The full-scale (100%) chopping current is calculated in Equation 1.


VREFX
ICHOP
5 u RISENSE

(1)

Example:
If a 0.25- sense resistor is used and the VREFx pin is 2.5 V, the full-scale (100%) chopping current will be
2.5 V / (5 0.25 ) = 2 A.
Five input pins (I0 - I4) are used to scale the current in the bridge as a percentage of the full-scale current set by
the VREF input pin and sense resistance. The I0 - I4 pins have internal pulldown resistors of approximately
100 k. The function of the pins is shown in Table 2.
Table 2. Pin Functions
I[4..0]

RELATIVE CURRENT
(% FULL-SCALE CHOPPING CURRENT)

0x00h

0%

0x01h

5%

0x02h

10%

0x03h

15%

0x04h

20%

0x05h

24%

0x06h

29%

0x07h

34%

0x08h

38%

0x09h

43%

0x0Ah

47%

0x0Bh

51%

0x0Ch

56%

0x0Dh

60%

0x0Eh

63%

0x0Fh

67%

0x10h

71%

0x11h

74%

0x12h

77%

0x13h

80%

0x14h

83%

0x15h

86%

0x16h

88%

0x17h

90%

0x18h

92%

0x19h

94%

0x1Ah

96%

0x1Bh

97%

0x1Ch

98%

0x1Dh

99%

0x1Eh

100%

0x1Fh

100%

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7.3.4 Decay Mode and Braking


During PWM current chopping, the H-bridge is enabled to drive current through the motor winding until the PWM
current chopping threshold is reached. This is shown in Figure 6 as case 1. The current flow direction shown
indicates the state when the xENBL pin is high.
Once the chopping current threshold is reached, the H-bridge can operate in two different states, fast decay or
slow decay.
In fast decay mode, once the PWM chopping current level has been reached, the H-bridge reverses state to
allow winding current to flow in a reverse direction. As the winding current approaches zero, the bridge is
disabled to prevent any reverse current flow. Fast decay mode is shown in Figure 6 as case 2.
In slow decay mode, winding current is re-circulated by enabling both of the low-side FETs in the bridge. This is
shown in Figure 6 as case 3.

Figure 6. Decay Mode


The DRV8840 device supports fast decay and slow decay mode. Slow or fast decay mode is selected by the
state of the DECAY pin - logic low selects slow decay, and logic high sets fast decay mode. The DECAY pin has
both an internal pullup resistor of approximately 130 k and an internal pulldown resistor of approximately 80 k.
This sets the mixed decay mode if the pin is left open or undriven.
DECAY mode also affects the operation of the bridge when it is disabled (by taking the ENBL pin inactive). This
applies if the ENABLE input is being used for PWM speed control of the motor, or if it is simply being used to
start and stop motor rotation.
If the DECAY pin is high (fast decay), when the bridge is disabled fast decay mode will be entered until the
current through the bridge reaches zero. Once the current is at zero, the bridge is disabled to prevent the motor
from reversing direction. This allows the motor to coast to a stop.
If the DECAY pin is low (slow decay), both low-side FETs will be turned on when ENBL is made inactive. This
essentially shorts out the back EMF of the motor, causing the motor to brake, and stop quickly. The low-side
FETs will stay in the ON state even after the current reaches zero.

12

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7.3.5 Blanking Time


After the current is enabled in an H-bridge, the voltage on the xISEN pin is ignored for a fixed period of time
before enabling the current sense circuitry. This blanking time is fixed at 3.75 s. Note that the blanking time also
sets the minimum on time of the PWM.
7.3.6 Protection Circuits
The DRV8840 device is fully protected against undervoltage, overcurrent and overtemperature events.
7.3.6.1 Overcurrent Protection (OCP)
An analog current limit circuit on each FET limits the current through the FET by removing the gate drive. If this
analog current limit persists for longer than the OCP time, all FETs in the H-bridge will be disabled and the
nFAULT pin will be driven low. The device will remain disabled until either nRESET pin is applied, or VM is
removed and re-applied.
Overcurrent conditions on both high and low side devices; i.e., a short to ground, supply, or across the motor
winding will all result in an overcurrent shutdown. Note that overcurrent protection does not use the current sense
circuitry used for PWM current control, and is independent of the ISENSE resistor value or VREF voltage.
7.3.6.2 Thermal Shutdown (TSD)
If the die temperature exceeds safe limits, all FETs in the H-bridge will be disabled and the nFAULT pin will be
driven low. Once the die temperature has fallen to a safe level operation will automatically resume.
7.3.6.3 Undervoltage Lockout (UVLO)
If at any time the voltage on the VM pins falls below the undervoltage lockout threshold voltage, all circuitry in the
device will be disabled and internal logic will be reset. Operation will resume when VM rises above the UVLO
threshold.

7.4 Device Functional Modes


7.4.1 nRESET and nSLEEP Operation
The nRESET pin, when driven active low, resets the internal logic. It also disables the H-bridge driver. All inputs
are ignored while nRESET is active.
Driving nSLEEP low will put the device into a low power sleep state. In this state, the H-bridges are disabled, the
gate drive charge pump is stopped, the V3P3OUT regulator is disabled, and all internal clocks are stopped. In
this state all inputs are ignored until nSLEEP returns inactive high. When returning from sleep mode, some time
(approximately 1 ms) needs to pass before the motor driver becomes fully operational. Note that nRESET and
nSLEEP have internal pulldown resistors of approximately 100 k. These signals need to be driven to logic high
for device operation.

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8 Application and Implementation


NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TIs customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.

8.1 Application Information


The DRV8840 device is used in brushed motor or stepper motor control. The onboard current regulation allows
for limiting the motor current through simple pin configurations.

8.2 Typical Application


1

CP1

GND

DRV8840

28

0.01 F
2

CP2

I4

VCP

I3

VM

I2

OUT1

I1

ISEN

I0

27

VM
3
0.1 F

0.1 F

26

1M
4

25

24

100 m
6

BDC

10

OUT2

NC

OUT2

ENBL

ISEN

PHASE

OUT1

DECAY

VM

nFAULT

VREF

nSLEEP

VREF

nRESET

23

22

21

20

19

VM
11
100 F

18

0.1 F
12

17

14

GND

PPAD

10 k
13

V3P3OUT

16

15
0.47 F
R1

R2

Figure 7. Typical Application Schematic


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Typical Application (continued)


8.2.1 Design Requirements
Table 3 shows the design parameters for this application.
Table 3. Design Parameters
DESIGN PARAMETER

REFERENCE

EXAMPLE VALUE

Supply Voltage

VM

24 V

Motor Winding Resistance

RM

3.9 V

Motor Winding Inductance

LM

2.9 mH

Target Chopping Current

ITRIP

1.5 A

Sense Resistor

RSENSE

100 m

VREF Voltage

VREF

0.75 V

8.2.2 Detailed Design Procedure


8.2.2.1 Current Regulation
The maximum current (ITRIP) is set by the Ix pins, the VREF analog voltage, and the sense resistor value
(RSENSE). When starting a brushed DC motor, a large inrush current may occur because there is no back-EMF
and high detent torque. Current regulation will act to limit this inrush current and prevent high current on start-up.
ITRIP / (5 RSENSE)

(2)

Example: If the desired chopping current is 1.5 A:


Set RSENSE = 100 m
VREF would have to be 0.75 V
Create a resistor divider network from V3P3OUT (3.3 V) to set VREF = 0.75 V
Set R2 = 10 k and set R1 = 3 k
8.2.2.2 Sense Resistor
For optimal performance, it is important for the sense resistor to be:
Surface-mount
Low inductance
Rated for high enough power
Placed closely to the motor driver
The power dissipated by the sense resistor equals Irms2 R. For example, if the RMS motor current is 1.5 A and
a 200-m sense resistor is used, the resistor will dissipate 1.5 A2 0.2 = 0.3 W. The power quickly increases
with greater current levels.
Resistors typically have a rated power within some ambient temperature range, along with a de-rated power
curve for high ambient temperatures. When a PCB is shared with other components generating heat, margin
should be added. It is always best to measure the actual sense resistor temperature in a final system, along with
the power MOSFETs, as those are often the hottest components.
Because power resistors are larger and more expensive than standard resistors, it is common practice to use
multiple standard resistors in parallel, between the sense node and ground. This distributes the current and heat
dissipation.

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8.2.3 Application Curves

Figure 8. DRV8842 Current Regulation

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Figure 9. DRV8842 Direction Change

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9 Power Supply Recommendations


The DRV8840 is designed to operate from an input voltage supply (VM) range from 8.2 V to 45 V. The device
has an absolute maximum rating of 47 V. A 0.1-F ceramic capacitor rated for VM must be placed at each VM
pin as close to the DRV8840 as possible. In addition, a bulk capacitor must be included on VM.

9.1 Bulk Capacitance Sizing


Having appropriate local bulk capacitance is an important factor in motor drive system design. It is generally
beneficial to have more bulk capacitance, while the disadvantages are increased cost and physical size.
The amount of local capacitance needed depends on a variety of factors, including:
The highest current required by the motor system.
The power supplys capacitance and ability to source current.
The amount of parasitic inductance between the power supply and motor system.
The acceptable voltage ripple.
The type of motor used (Brushed DC, Brushless DC, Stepper).
The motor braking method.
The inductance between the power supply and motor drive system will limit the rate current can change from the
power supply. If the local bulk capacitance is too small, the system will respond to excessive current demands or
dumps from the motor with a change in voltage. When adequate bulk capacitance is used, the motor voltage
remains stable and high current can be quickly supplied.
The data sheet generally provides a recommended value, but system-level testing is required to determine the
appropriate sized bulk capacitor.
The voltage rating for bulk capacitors should be greater than the operating voltage, to provide margin for cases
when the motor transfers energy to the supply.

Power Supply

Parasitic Wire
Inductance

Motor Drive System


VM

Motor
Driver
GND

Local
Bulk Capacitor

IC Bypass
Capacitor

Figure 10. Setup of Motor Drive System With External Power Supply

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10 Layout
10.1 Layout Guidelines
Each VM terminal must be bypassed to GND using a low-ESR ceramic bypass capacitors with recommended
values of 0.1 F rated for VM. These capacitors should be placed as close to the VM pins as possible with a
thick trace or ground plane connection to the device GND pin.
The VM pin must be bypassed to ground using a bulk capacitor rated for VM. This component may be an
electrolytic.
A low-ESR ceramic capacitor must be placed in between the CP1 and CP2 pins. TI recommends a value of 0.1
F rated for VM . Place this component as close to the pins as possible.
A low-ESR ceramic capacitor must be placed in between the VM and VCP pins. TI recommends a value of 0.47
F rated for 16 V. Place this component as close to the pins as possible. In addition, place a 1 M between VM
and VCP.
Bypass V3P3OUT to ground with a ceramic capacitor rated 6.3 V. Place this bypassing capacitor as close to the
pin as possible.
The current sense resistor should be placed as close as possible to the device pins to minimize trace inductance
between the pin and resistor.

10.2 Layout Example

+
0.1 F

CP1

GND

CP2

I4

VCP

I3

VM

I2

OUT1

I1

0.1 F
1 M

RISEN

0.47 F

0.1 F

ISEN

I0

OUT2

NC

OUT2

ENBL

ISEN

PHASE

OUT1

DECAY

VM

nFAULT

VREF

nSLEEP

VREF

nRESET

GND

V3P3OUT

0.1 F

Figure 11. Example Layout

18

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10.3 Thermal Considerations


The DRV8840 has thermal shutdown (TSD) as described above. If the die temperature exceeds approximately
150C, the device will be disabled until the temperature drops to a safe level.
Any tendency of the device to enter TSD is an indication of either excessive power dissipation, insufficient
heatsinking, or too high an ambient temperature.
10.3.1 Power Dissipation
Average power dissipation in the DRV8840 when running a DC motor can be roughly estimated by: Equation 3.

2 u RDS(ON) u IOUT

where

P is the power dissipation of one H-bridge


RDS(ON) is the resistance of each FET
IOUT is the RMS output current being applied to each winding.

(3)

IOUT is equal to the average current drawn by the DC motor. Note that at start-up and fault conditions this current
is much higher than normal running current; these peak currents and their duration also need to be taken into
consideration. The factor of 2 comes from the fact that at any instant two FETs are conducting winding current
(one high-side and one low-side).
The maximum amount of power that can be dissipated in the device is dependent on ambient temperature and
heatsinking.
Note that RDS(ON) increases with temperature, so as the device heats, the power dissipation increases. This must
be taken into consideration when sizing the heatsink.
10.3.2 Heatsinking
The PowerPAD package uses an exposed pad to remove heat from the device. For proper operation, this pad
must be thermally connected to copper on the PCB to dissipate heat. On a multilayer PCB with a ground plane,
this can be accomplished by adding a number of vias to connect the thermal pad to the ground plane. On PCBs
without internal planes, copper area can be added on either side of the PCB to dissipate heat. If the copper area
is on the opposite side of the PCB from the device, thermal vias are used to transfer the heat between top and
bottom layers.
For details about how to design the PCB, see the TI application report, PowerPAD Thermally Enhanced
Package (SLMA002), and the TI application brief, PowerPAD Made Easy (SLMA004), available at www.ti.com.
In general, the more copper area that can be provided, the more power can be dissipated.

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11 Device and Documentation Support


11.1 Documentation Support
11.1.1 Related Documentation
For related documentation see the following:
PowerPAD Thermally Enhanced Package, SLMA002
PowerPAD Made Easy, SLMA004

11.2 Community Resources


The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.

11.3 Trademarks
PowerPAD, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution


These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.

11.5 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information


The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

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PACKAGE OPTION ADDENDUM

www.ti.com

16-Oct-2014

PACKAGING INFORMATION
Orderable Device

Status
(1)

Package Type Package Pins Package


Drawing
Qty

Eco Plan

Lead/Ball Finish

MSL Peak Temp

(2)

(6)

(3)

Op Temp (C)

Device Marking
(4/5)

DRV8840PWP

ACTIVE

HTSSOP

PWP

28

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-3-260C-168 HR

-40 to 85

DRV8840

DRV8840PWPR

ACTIVE

HTSSOP

PWP

28

2000

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-3-260C-168 HR

-40 to 85

DRV8840

(1)

The marketing status values are defined as follows:


ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)

MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)

There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)

Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)

Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

Addendum-Page 1

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

16-Oct-2014

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

PACKAGE MATERIALS INFORMATION


www.ti.com

16-Oct-2014

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

DRV8840PWPR

Package Package Pins


Type Drawing

SPQ

HTSSOP

2000

PWP

28

Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
330.0

16.4

Pack Materials-Page 1

6.9

B0
(mm)

K0
(mm)

P1
(mm)

W
Pin1
(mm) Quadrant

10.2

1.8

12.0

16.0

Q1

PACKAGE MATERIALS INFORMATION


www.ti.com

16-Oct-2014

*All dimensions are nominal

Device

Package Type

Package Drawing

Pins

SPQ

Length (mm)

Width (mm)

Height (mm)

DRV8840PWPR

HTSSOP

PWP

28

2000

367.0

367.0

38.0

Pack Materials-Page 2

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