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27621.6A*
3141 THRU
3144
CC
OUTPUT
SUPPLY
GROUND
Dwg. PH-003A
VCC
REG.
OUTPUT
GROUND
Dwg. FH-005-2
Symbol
Test Conditions
Min.
Supply Voltage
VCC
Operating
4.5
Max.
Units
24
VOUT(SAT)
175
400
mV
IOFF
<1.0
10
Supply Current
ICC
4.4
9.0
mA
tr
RL = 820 , CL = 20 pF
0.04
2.0
tf
RL = 820 , CL = 20 pF
0.18
2.0
Typ.
A3142
Min.
Typ.
Max.
Min. Typ.
50
100
160
130
30
100
175
10
45
10
A3143
A3144
Max.
Min.
Typ.
Max.
Min.
180
230
220
280
340
70
350
115
180
245
205
280
355
35
450
130
75
125
175
165
225
285
50
330
45
145
60
125
190
150
225
300
25
430
20
55
80
30
55
80
30
55
80
20
55
20
55
80
30
55
80
30
55
80
20
55
Typ.
Max.
400
I OUT = 20 mA
=8V
V CC = 4.524 V
CC
SATURATION VOLTAGE IN mV
300
OPERATE POINT
200
RELEASE POINT
100
-25
25
50
100
75
125
100
0
-50
0
-50
200
150
-25
25
50
75
100
125
150
AMBIENT TEMPERATURE IN C
AMBIENT TEMPERATURE IN C
Dwg. GH-044
Dwg. GH-040-1
SUPPLY CURRENT
SUPPLY CURRENT
10
7.0
VCC = 8 V
B B OP
SUPPLY CURRENT IN mA
SUPPLY CURRENT IN mA
8.0
B B OP
6.0
B B RP
4.0
6.0
5.0
T A = +25C
2.0
B B RP
4.0
0
0
10
15
20
25
-50
-25
25
75
100
125
150
AMBIENT TEMPERATURE IN C
Dwg. GH-041-1
* Complete part number includes a suffix denoting operating temperature range (E- or L-) and package type ( -LT, -U, or -UA).
www.allegromicro.com
50
Dwg. GH-039-1
SENSOR LOCATIONS
(0.005 [0.13 mm] die placement)
Suffix LT
ACTIVE AREA DEPTH
0.0305"
0.775 mm
NOM
20
0.043"
1.09 mm
A
1
Dwg. MH-008-2D
Suffix U
ACTIVE AREA DEPTH
0.0165"
0.42 mm
NOM
0.091"
2.31 mm
0.089"
2.26 mm
15
T A = +25C
10
5.0
-5.0
0
10
15
20
25
OPERATION
A
BRANDED
SURFACE
Dwg. MH-002-2C
Suffix UA
ACTIVE AREA DEPTH
0.0195"
0.50 mm
NOM
The output of these devices (pin 3) switches low when the magnetic field
at the Hall sensor exceeds the operate point threshold (BOP). At this point, the
output voltage is VOUT(SAT). When the magnetic field is reduced to below the
release point threshold (BRP), the device output goes high. The difference in
the magnetic operate and release points is called the hysteresis (Bhys) of the
device. This built-in hysteresis allows clean switching of the output even in
the presence of external mechanical vibration and electrical noise.
0.082"
2.07 mm
0.055"
1.39 mm
A
BRANDED
SURFACE
Dwg. GH-042-1
Dwg. MH-011-10A
Dimensions in Inches
(for reference only)
0.181
0.173
0.072
0.064
0.167
0.155
0.063
0.055
0.102
0.090
0.0173
0.0138
0.090
0.084
0.0189
0.0142
0.0221
0.0173
0.047
0.035
0.059
BSC
0.118
BSC
Dwg. MA-009-3A in
Dimensions in Millimeters
(controlling dimensions)
4.60
4.40
1.83
1.62
4.25
3.94
2.60
2.29
0.44
0.35
2.29
2.13
0.48
0.36
1.20
0.89
0.56
0.44
1.50
BSC
1.60
1.40
3.00
BSC
Dwg. MA-009-3A mm
NOTES: 1. Tolerances on package height and width represent allowable mold offsets. Dimensions given are
measured at the widest point (parting line).
2. Exact body and lead configuration at vendors option within limits shown.
3. Height does not include mold gate flash.
www.allegromicro.com
Dimensions in Millimeters
(for reference only)
4.65
4.52
0.183
0.178
1.60
1.50
0.063
0.059
4.60
4.47
0.181
0.176
45
45
0.086
0.018
2.18
0.46
MAX
MAX
0.0173
0.0138
0.600
0.560
0.44
0.35
15.24
14.23
0.48
0.36
0.0189
0.0142
SEE NOTE
SEE NOTE
1.27
0.050
0.100
2.54
Dwg. MH-003E in
Dwg. MH-003E mm
NOTES: 1. Tolerances on package height and width represent allowable mold offsets. Dimensions given are measured
at the widest point (parting line).
2. Exact body and lead configuration at vendors option within limits shown.
3. Height does not include mold gate flash.
4. Recommended minimum PWB hole diameter to clear transition area is 0.035" (0.89 mm).
Dimensions in Millimeters
(for reference only)
4.17
4.04
0.164
0.159
0.062
0.058
45
1.57
1.47
45
3.10
2.97
0.122
0.117
45
45
0.085
0.031
2.16
0.79
MAX
MAX
0.640
0.600
16.26
15.24
0.0173
0.0138
0.0189
0.0142
SEE NOTE
0.48
0.36
SEE NOTE
1.27
0.050
BSC
0.44
0.35
Dwg. MH-014E in
BSC
NOTES: 1. Tolerances on package height and width represent allowable mold offsets. Dimensions given are
measured at the widest point (parting line).
2. Exact body and lead configuration at vendors option within limits shown.
3. Height does not include mold gate flash.
www.allegromicro.com
Dwg. MH-014E mm
Allegro MicroSystems, Inc. reserves the right to make, from time to time,
such departures from the detail specifications as may be required to permit
improvements in the design of its products.
The information included herein is believed to be accurate and reliable.
However, Allegro MicroSystems, Inc. assumes no responsibility for its use;
nor for any infringements of patents or other rights of third parties which
may result from its use.