Professional Documents
Culture Documents
Technical Data
MPX5700
Rev 8, 01/2007
MPX5700
SERIES
INTEGRATED
PRESSURE SENSOR
0 to 700 kPa (0 to 101.5 psi)
15 to 700 kPa (2.18 to 101.5 psi)
0.2 to 4.7 V OUTPUT
Features
MPX5700D
CASE 867-08
ORDERING INFORMATION
Device
Type
Case
Type
Options
MPX Series
Order Number Device Marking
Basic
Element
Differential
867
MPX5700D
MPX5700D
Absolute
867
MPX5700A
MPX5700A
Ported
Elements
867C
MPX5700DP
MPX5700DP
Gauge
867B
MPX5700GP
MPX5700GP
Gauge, Axial
867E
MPX5700GS
MPX5700D
Absolute
867B
MPX5700AP
MPX5700AP
Absolute, Axial
867E
MPX5700AS
MPX5700A
867F
MPX5700ASX
MPX5700A
MPX5700AP
CASE 867B-04
MPX5700DP
CASE 867C-05
MPX5700AS
CASE 867E-03
VS
Thin Film
Temperature
Compensation
and
Gain Stage #1
Sensing
Element
GND
Gain Stage #2
and
Ground
Reference
Shift Circuitry
Vout
MPX5700ASX
CASE 867F-03
PIN NUMBERS
1
Vout
N/C
GND
N/C
VS
N/C
Symbol
Value
Unit
(P2 1 Atmosphere)
P1max
2800
kPa
Storage Temperature
Tstg
40 to +125
Operating Temperature
TA
40 to +125
(2)
Maximum Pressure
1. Maximum Ratings apply to Case 867 only. Extended exposure at the specified limits may cause permanent damage or degradation to the
device.
2. This sensor is designed for applications where P1 is always greater than, or equal to P2. P2 maximum is 500 kPa.
Table 2. Operating Characteristics (VS = 5.0 Vdc, TA = 25C unless otherwise noted, P1 > P2. Decoupling circuit shown in
Figure 4 required to meet electrical specifications.)
Characteristic
Pressure
Range(1)
Supply Voltage(2)
Supply Current
Zero Pressure Offset(3)
Symbol
Min
Typ
Max
Unit
POP
0
15
700
700
kPa
VS
4.75
5.0
5.25
Vdc
IO
7.0
10
mAdc
Voff
0.088
0.184
0.2
0.313
0.409
Vdc
(0 to 85C)
VFSO
4.587
4.7
4.813
Vdc
(0 to 85C)
VFSS
4.5
Vdc
Accuracy(6)
(0 to 85C)
2.5
%VFSS
V/P
6.4
mV/kPa
Sensitivity
(7)
tR
1.0
ms
IO+
0.1
mAdc
Warm-Up Time(8)
20
ms
Response Time
1.
2.
3.
4.
5.
Typ
Unit
4.0
grams
MPX5700
2
Sensors
Freescale Semiconductor
Transfer Function:
Vout = VS*(0.0012858*P+0.04) Error
VS = 5.0 Vdc
Temperature = 0 to 85C
4.5
4.0
3.5
Output (V)
Typical
3.0
2.5
Maximum
2.0
Minimum
1.5
1.0
0.5
0
100
200
500
400
300
Differential Pressure (kPa)
700
600
800
Fluoro Silicone
Die Coat
Stainless Steel
Metal Cover
Die
P1
Wire Bond
Lead Frame
Lead Frame
RTV Die
Bond
Die
P1
Wire Bond
P2
Epoxy Case
Stainless Steel
Metal Cover
Epoxy Case
DIFFERENTIAL/GAUGE ELEMENT
P2
RTV Die
Bond
ABSOLUTE ELEMENT
Vout
Output
Vs
IPS
1.0 F
0.01 F
GND
470 pF
MPX5700
Sensors
Freescale Semiconductor
Pressure (P1)
Side Identifier
Stainless Steel Cap
MPX5700DP
867C
MPX5700GP, MPX5700AP
867B
MPX5700GS, MPX5700AS
867E
MPX5700ASX
867F
MPX5700
4
Sensors
Freescale Semiconductor
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
R
POSITIVE PRESSURE
(P1)
M
B
-AN
PIN 1
SEATING
PLANE
DIM
A
B
C
D
F
G
J
L
M
N
R
S
-TG
J
S
F
D 6 PL
0.136 (0.005)
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
STYLE 2:
PIN 1.
2.
3.
4.
5.
6.
VOUT
GROUND
VCC
V1
V2
VEX
T A
STYLE 3:
PIN 1.
2.
3.
4.
5.
6.
OPEN
GROUND
-VOUT
VSUPPLY
+VOUT
OPEN
INCHES
MILLIMETERS
MAX
MIN
MAX MIN
16.00
0.595
0.630 15.11
13.56
0.514
0.534 13.06
5.59
0.200
0.220
5.08
0.84
0.027
0.033
0.68
1.63
0.048
0.064
1.22
0.100 BSC
2.54 BSC
0.40
0.014
0.016
0.36
18.42
0.695
0.725 17.65
30 NOM
30 NOM
12.57
0.475
0.495 12.07
11.43
0.430
0.450 10.92
0.090
0.105
2.29
2.66
OPEN
GROUND
+VOUT
+VSUPPLY
-VOUT
OPEN
CASE 867-08
ISSUE N
BASIC ELEMENT
P
0.25 (0.010)
T Q
-A-
U
W
X
R
PORT #1
POSITIVE
PRESSURE
(P1)
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
L
V
PORT #2 VACUUM (P2)
PORT #1 POSITIVE
PRESSURE (P1)
-Q-
PORT #2
VACUUM
(P2)
B
PIN 1
C
SEATING
PLANE
-T-
-TJ
S
SEATING
PLANE
G
F
D 6 PL
0.13 (0.005)
DIM
A
B
C
D
F
G
J
K
L
N
P
Q
R
S
U
V
W
X
INCHES
MIN
MAX
1.145
1.175
0.685
0.715
0.405
0.435
0.027
0.033
0.048
0.064
0.100 BSC
0.014
0.016
0.695
0.725
0.290
0.300
0.420
0.440
0.153
0.159
0.153
0.159
0.063
0.083
0.220
0.240
0.910 BSC
0.182
0.194
0.310
0.330
0.248
0.278
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
MILLIMETERS
MIN
MAX
29.08
29.85
17.40
18.16
10.29
11.05
0.68
0.84
1.22
1.63
2.54 BSC
0.36
0.41
17.65
18.42
7.37
7.62
10.67
11.18
3.89
4.04
3.89
4.04
1.60
2.11
5.59
6.10
23.11 BSC
4.62
4.93
7.87
8.38
6.30
7.06
VOUT
GROUND
VCC
V1
V2
VEX
CASE 867C-05
ISSUE F
PRESSURE AND VACUUM SIDES PORTED (DP)
MPX5700
Sensors
Freescale Semiconductor
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 867B-04
ISSUE G
PRESSURE SIDE PORTED (AP, GP)
MPX5700
6
Sensors
Freescale Semiconductor
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 867B-04
ISSUE G
PRESSURE SIDE PORTED (AP, GP)
MPX5700
Sensors
Freescale Semiconductor
PACKAGE DIMENSIONS
-B-
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
B
C
D
E
F
G
J
K
N
S
V
V
PIN 1
PORT #1
POSITIVE
PRESSURE
(P1)
J
N
G
F
D 6 PL
-T-
0.13 (0.005)
T B
INCHES
MILLIMETERS
MAX
MIN
MAX
MIN
18.28
0.720 17.53
0.690
6.48
6.22
0.245
0.255
20.82
0.780
0.820 19.81
0.84
0.69
0.027
0.033
4.72
4.52
0.178
0.186
1.63
1.22
0.048
0.064
0.100 BSC
2.54 BSC
0.41
0.36
0.014
0.016
9.53
8.76
0.375
0.345
7.87
7.62
0.300
0.310
6.10
5.59
0.220
0.240
4.93
4.62
0.194
0.182
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
VOUT
GROUND
VCC
V1
V2
VEX
CASE 867E-03
ISSUE D
PRESSURE SIDE PORTED (AS, GS)
-TC
A
E
-Q-
B
R
PIN 1
PORT #1
POSITIVE
PRESSURE
(P1)
-P0.25 (0.010)
T Q
S
K
J
0.13 (0.005)
T P
D 6 PL
Q S
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
B
C
D
E
F
G
J
K
N
P
Q
R
S
U
V
INCHES
MILLIMETERS
MAX
MIN
MIN MAX
28.45
27.43
1.080 1.120
19.30
18.80
0.740 0.760
16.51
16.00
0.630 0.650
0.84
0.68
0.027 0.033
4.57
4.06
0.160 0.180
1.63
1.22
0.048 0.064
0.100 BSC
2.54 BSC
0.41
0.36
0.014 0.016
6.10
5.59
0.220 0.240
2.03
1.78
0.070 0.080
4.06
3.81
0.150 0.160
4.06
3.81
0.150 0.160
11.68
11.18
0.440 0.460
18.42
17.65
0.695 0.725
21.84
21.34
0.840 0.860
4.93
4.62
0.182 0.194
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
VOUT
GROUND
VCC
V1
V2
VEX
CASE 867F-03
ISSUE D
PRESSURE SIDE AXIAL PORT (ASX)
MPX5700
8
Sensors
Freescale Semiconductor
MPX5700
Rev. 8
01/2007