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Abstract
A process for the recovery of gold from processed gold-plated printed circuit boards, gold-coated bangles and gold-coated
mirrors is described. It is based on heating the scrap material along with an eco-friendly or green reagent, 20% (v / v) formic
acid solution to boiling temperature to separate the inorganic component from epoxy resin in gold-coated mirrors. Dissolution of
base metals is affected using a strong oxidizing agent, 20%(w / v) potassium persulphate, which is also eco-friendly or green;
and heating to boiling temperature. Recovery of gold is achieved by melting. The recovery efficiency is on par with the cyanidation
process. The process can be scaled up and adopted by all categories of industries.
2006 Elsevier B.V. All rights reserved.
Keywords: Gold; Secondary sources; Non-metallic; Eco-friendly reagents; Peeling
1. Introduction
Gold coating is one of the important industries
encompassing many walks of human life ranging from
household to hi-tech materials such as mirrors, bangles,
catalysts, communication and electronic applications
(Delfini et al., 2000; Blair, 1999). Increasing demand for
gold in current industrial applications such as electronic
devices and catalysts, and its high cost, makes it crucial
to recover the gold from the inevitably increasing waste
products (Baba, 1987).
During the last three decades, substantial quantities
of gold have been used by the electronic industry in
view of its excellent electrical conductivity and
Tel.: +966 1 4883555; fax: +966 1 4813887.
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0304-386X/$ - see front matter 2006 Elsevier B.V. All rights reserved.
doi:10.1016/j.hydromet.2006.01.004
Non-metallic sources
Scrap jewellery
Alloy scrap
Low grade bench scrap
Contact pins and tips
Plated rejected components
Copper and lead anode slime
Porcelain scrap
Glass bangles
Carbon and filter
Printed circuit boards
Ion exchange resins
I.C. ceramic
Mirrors
Spent catalysts
49
Hydrometallurgy
Pretreatment
Extraction
Refining
crushing
product treatment
solvent extraction
washing
peeling
chemical treatment
drying
dissolution
electrolysis
fractionation
concentration
adsorption
incineration
50
5
10
20
30
40
50
70
90
Incomplete
30
10
8
6
1
0.5
0.3
Table 3
Effect of persulphate concentration at B. pt. on the peeling process of
gold films
Concentration of potassium persulphate (% w / v) Peeling time (min)
2
5
10
20
30
40
50
Incomplete
80 a
30
25
20
b
b
S2 O2
8 2e
0
2SO2
4 E 1:96V
S2 O2
8 2e 2H
2HSO4 E 0 2:08V
Table 4
Effect of temperature on peeling process time
Temperature (C)
Room temp. 25 2
40
60
80
Boiling temp.
1500
260
60
35
20
51
GCM (50kg)
Washing
Heat to boil
temperature
Water
Water
Washing
20 % (w/v) aqueous
potassium persulphate
Sulphate salts
recovery
Heated to boiling
Filtration
Water
Base metal
recovery
Washing
Drying
Melting
Gold 99.5 %
(7.6 g)
Fig. 2. Flow sheet of gold recovery from gold-plated printed circuit boards (GPCB), gold-coated glass bangles (GCGB) and gold-coated mirrors
(GCM).
52
Table 5
Recovery of gold from gold-plated printed circuit board (GPCB), goldcoated mirrors (GCM) and gold-coated glass bangle (GCGB) in a pilot
plant
Sample Quantity of scrap Quantity of Au
(kg)
recovered (g)
Mean a recovery
(%)
GPCB
98.0
97.3
98.1
97.2
98.3
98.1
98.2
97.4
98.4
10
20
30
GCM 10
20
30
GCGB 10
20
30
0.93
1.89
2.82
0.41
0.83
1.11
0.18
0.34
0.45
Acknowledgements
The author thanks M/s Toyama Electric Ltd.,
Bangalore, India, M/s Yousuff Mirror Industries,
Bangalore, India and M/s Kohinoor Glass Bangle
Industry (P) Ltd. Ferozabad, India, for providing sample
of processed gold-plated printed circuit boards, goldcoated mirror scrap and gold-coated glass bangle.
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