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FNA41560/B2
TM
General Description
Applications
Additional Information
Figure 1.
FNA41560/B2 Rev. C
www.fairchildsemi.com
October 2010
Pin Configuration
Top View
VB(U) (26)
V TH(1)
VS(U)(25)
R TH(2)
VB(V)(24)
V S(V)(23)
P(3)
V B(W)(22)
VS(W)(21)
U(4)
IN (UH) (20)
IN(VH)(19)
V(5)
IN(WH)(18)
VCC(H) (17)
VCC(L)(16)
W(6)
COM(15)
IN (UL)(14)
IN (VL)(13)
N U(7)
IN (WL) (12)
N V(8)
VFO (11)
NW(9)
CSC(10)
Figure 2.
FNA41560/B2 Rev. C
www.fairchildsemi.com
Pin Descriptions
Pin Number
Pin Name
V TH
Pin Description
Thermistor Bias Voltage
RTH
NU
NV
NW
10
CSC
11
VFO
Fault Output
12
IN(WL)
13
IN (VL)
14
IN(UL)
15
COM
16
VCC(L)
17
V CC(H)
18
IN(WH)
19
IN (VH)
20
IN(UH)
21
VS(W)
22
VB(W)
23
V S(V)
24
V B(V)
25
VS(U)
26
VB(U)
FNA41560/B2 Rev. C
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VTH (1)
Thermister
(26) VB(U)
(25) VS(U)
(24) VB(V)
(23) VS(V)
(22) VB(W)
(21) VS(W)
(20) IN(UH)
(19) IN(VH)
(18) IN(WH)
(17) VCC(H)
(16) VCC(L)
(15) COM
(14) IN(UL)
(13) IN(VL)
(12) IN(WL)
(11) VFO
(10) CSC
RTH (2)
P (3)
UVB
UVS
VVB
OUT(UH)
UVS
U(4)
VVS
WVB
WVS
IN(UH)
OUT(VH)
VVS
V (5)
IN(VH)
IN(WH)
VCC
OUT(WH)
COM
WVS
W(6)
VCC
OUT(UL)
COM
NU (7)
IN(UL)
IN(VL)
IN(WL)
OUT(VL)
NV (8)
VFO
C(SC)
OUT(WL)
NW (9)
Note:
1) Inverter high-side is composed of three IGBTs, freewheeling diodes and one control IC for each IGBT.
2) Inverter low-side is composed of three IGBTs, freewheeling diodes and one control IC for each IGBT. It has gate drive and protection functions.
3) Inverter power side is composed of four inverter dc-link input terminals and three inverter output terminals.
Figure 3.
FNA41560/B2 Rev. C
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Inverter Part
Symbol
VPN
V PN(Surge)
VCES
Parameter
Conditions
Rating
Units
Supply Voltage
450
500
600
Collector-emitter Voltage
IC
TC = 25C, TJ 150C
15
ICP
30
PC
Collector Dissipation
41
TJ
(Note 1)
-40 ~ 150
Rating
Units
Note:
1. The maximum junction temperature rating of the power chips integrated within the SPM is 150C.
Control Part
Symbol
Parameter
Conditions
VCC
20
VBS
20
VIN
VFO
-0.3~VCC +0.3
IFO
VSC
mA
-0.3~VCC +0.3
Rating
Units
600
0.5
Parameter
Conditions
TC = 25C
IFP
TJ
-40 ~ 150
Rating
Units
400
Total System
Symbol
VPN(PROT)
Parameter
Self Protection Supply Voltage Limit
(Short Circuit Protection Capability)
TSTG
Storage Temperature
V ISO
Isolation Voltage
Conditions
VCC = VBS = 13.5 ~ 16.5V
TJ = 150C, Non-repetitive, less than 2ms
60Hz, Sinusoidal, AC 1 minute, Connection
Pins to heat sink plate
-40 ~ 125
2000
Vrms
Thermal Resistance
Symbol
Rth(j-c)Q
Rth(j-c)F
Parameter
Junction to Case Thermal
Resistance
Conditions
Min.
3.0
C/W
4.3
C/W
Note:
2. For the measurement point of case temperature(TC), please refer to Figure 2.
FNA41560/B2 Rev. C
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Inverter Part
Symbol
Parameter
VCE(SAT)
Collector-Emitter Saturation
Voltage
VIN = 0V
Switching Times
VF
HS
tON
Conditions
tC(ON)
tOFF
Min.
Typ.
IC = 15A, TJ = 25C
1.8
2.3
IF = 15A, TJ = 25C
1.8
2.3
0.45
0.75
1.25
ms
0.25
0.50
ms
0.75
1.25
ms
0.25
0.50
ms
0.15
ms
0.45
0.75
1.25
ms
tC(OFF)
trr
LS
tON
Max. Units
0.25
0.50
ms
0.75
1.25
ms
tC(OFF)
0.25
0.50
ms
trr
0.15
ms
mA
tC(ON)
tOFF
ICES
Collector-Emitter
Leakage Current
VCE = VCES
Note:
3. tON and tOFF include the propagation delay time of the internal drive IC. tC(ON) and tC(OFF) are the switching time of IGBT itself under the given gate driving condition internally.
For the detailed information, please see Figure 4.
100% IC 100% IC
t rr
V CE
IC
IC
V IN
V IN
t ON
10% IC
V IN(ON )
V CE
tO FF
tC(O N)
90% IC
t C(OFF)
V IN (OF F)
10% V C E
10% V C E
10% I C
(b) turn-off
(a) turn-on
FNA41560/B2 Rev. C
www.fairchildsemi.com
900
700
600
500
400
300
200
100
0
800
800
900
700
600
500
400
300
200
100
10
12
14
16
10
12
14
16
Control Part
Symbol
Parameter
Min.
Typ.
IQCCH
Quiescent V CC Supply
Current
V CC(H) - COM
0.10
mA
V CC(L) - COM
2.65
mA
0.15
mA
3.65
mA
IQCCL
IPCCH
IPCCL
Conditions
Max. Units
IQBS
Quiescent V BS Supply
Current
0.30
mA
IPBS
VCC = V BS = 15V, fPWM = 20kHz, V B(U) - VS(U), VB(V) duty=50%, applied to one PWM V S(V), V B(W) - VS(W)
signal input for High-side
2.00
mA
VFOH
4.5
0.5
0.45
0.5
0.55
Detection Level
10.5
13.0
VFOL
VSC(ref)
UVCCD
UVCCR
UV BSD
UV BSR
tFOD
VIN(ON)
ON Threshold Voltage
VIN(OFF)
RTH
Resistance of
Thermister
Reset Level
11.0
13.5
Detection Level
10.0
12.5
Reset Level
10.5
13.0
30
ms
2.6
0.8
47
kW
@TTH =100C
2.9
kW
Note:
4. Short-circuit current protection is functioning only at the low-sides.
5. TTH is the temperature of thermister itselt. To know case temperature (TC), please make the experiment considering your application.
FNA41560/B2 Rev. C
www.fairchildsemi.com
550
500
20
450
16
Resistance[kW]
Resistance[kW]
R-T Curve
600
400
350
300
250
200
12
8
4
0
50
60
70
150
80
90
100
110
120
Temperature [ ]
100
50
0
-20
-10
10
20
30
40
50
60
70
80
90
100
110
120
Temperature TTH[ ]
Parameter
Conditions
Min.
Typ.
Max.
Units
VF
Forward Voltage
IF = 0.1A, TC = 25C
2.5
trr
IF = 0.1A, TC = 25C
80
ns
1.0
0.9
0.8
0.7
IF [A]
0.6
0.5
0.4
0.3
0.2
0.1
0.0
TC=25
0
10
11
12
13
14
15
VF [V]
Note:
6. Built in bootstrap diode includes around 15 resistance characteristic.
FNA41560/B2 Rev. C
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Symbol
V PN
Parameter
Value
Conditions
Supply Voltage
Units
Min.
Typ.
Max.
300
400
VCC
13.5
15
16.5
VBS
13.0
15
18.5
dVCC/dt,
dVBS/dt
-1
V/ms
1.5
ms
20
kHz
V
ms
tdead
fPWM
-40C TJ 150C
V SEN
-4
(Note 7)
0.5
0.5
PWIN(ON)
P WIN(OFF)
Note:
7. SPM might not make response if input pulse width is less than the recommanded value.
fSW=5kHz
11
10
9
IOrms [Arms]
8
7
6
5
fSW=15kHz
VDC=300V, VCC=VBS=15V
TJ 150 , TC 125
M.I.=0.9, P.F.=0.8
Sinusoidal PWM
2
1
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
Case Temperature, TC []
Note:
8. The allowable output current value may be different from the actual application.
Device
Package
Reel Size
Tape Width
Quantity
FNA41560
FNA41560
SPM26-AAA
12
FNA41560B2
FNA41560B2
SPM26-AAC
12
FNA41560/B2 Rev. C
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Parameter
Device Flatness
Mounting Torque
Limits
Conditions
Note Figure 9
Min.
Typ.
Max.
+120
Units
mm
Mounting Screw: - M3
Recommended 0.7Nm
0.6
0.7
0.8
Nm
Note Figure 10
Recommended 7.1kgcm
6.2
7.1
8.1
kgcm
11
Weight
Pre - Screwing : 12
Final Screwing : 21
Note:
9. Do not make over torque when mounting screws. Much mounting torque may cause ceramic cracks, as well as bolts and Al heat-sink destruction.
10. Avoid one side tightening stress. Fig.10 shows the recommended torque order for mounting screws. Uneven mounting can cause the SPM ceramic substrate to be damaged.
The Pre-Screwing torque is set to 20~30% of maximum torque rating.
FNA41560/B2 Rev. C
10
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Input Signal
Protection
Circuit State
RESET
SET
RESET
UVCCR
a1
Control
Supply Voltage
a6
UVCCD
a3
a2
a7
a4
Output Current
a5
a1 : Control supply voltage rises: After the voltage rises UVCCR, the circuits start to operate when next input is applied.
a2 : Normal operation: IGBT ON and carrying current.
a3 : Under voltage detection (UVCCD).
a4 : IGBT OFF in spite of control input condition.
a5 : Fault output operation starts.
a6 : Under voltage reset (UVCCR ).
a7 : Normal operation: IGBT ON and carrying current.
Input Signal
Protection
Circuit State
RESET
SET
RESET
UVBSR
Control
Supply Voltage
b1
UVBSD
b5
b3
b6
b2
b4
Output Current
High-level (no fault output)
FNA41560/B2 Rev. C
11
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c6
Protection
Circuit state
SET
Internal IGBT
Gate-Emitter Voltage
c3
Lower arms
control input
c7
RESET
c4
c2
SC
c1
c8
Output Current
SC Reference Voltage
Sensing Voltage
of the shunt
resistance
Fault Output Signal
c5
CR circuit time
constant delay
SPM
R PF=10k
MCU
VFO
COM
Note:
1) RC coupling at each input (parts shown dotted) might change depending on the PWM control scheme used in the application and the wiring impedance of the applications
printed circuit board. The SPM input signal section integrates 5kW (typ.) pull-down resistor. Therefore, when using an external filtering resistor, please pay attention to the signal voltage drop at input terminal.
2) The logic input is compatible with standard CMOS outputs.
FNA41560/B2 Rev. C
12
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CBS
CBSC
RS
(25) VS(U)
VS(U)
(20) IN(UH)
Gating UH
CBSC
CBS
(23) VS(V)
VS(V)
IN(VH)
CBSC
M
C
U
RS
15V line
CPS
CPS
CPS
(21) VS(W)
VS(W)
IN(WH)
(17) VCC(H)
CSPC15
CSP15
VS(W)
(15) COM
LVIC
OUT(UL)
NU (7)
CSPC05 CSP05
(11) VFO
Fault
Gating WL
W (6)
VCC
RPF
RS
Gating VL
VDC
COM
(16) VCC(L)
Gating UL
CDCS
OUT(WH)
VCC
5V line
CBPF
V (5)
VB(W)
(18) IN(WH)
Gating WH
OUT(VH)
VS(V)
(22) VB(W)
CBS
U (4)
VS(U)
VB(V)
(19) IN(VH)
Gating VH
OUT(UH)
IN(UH)
(24) VB(V)
RS
P (3)
VB(U)
RSU
VFO
CPF
RS
(14) IN(UL)
RS
(13) IN(VL)
RS
(12) IN(WL)
OUT(VL)
IN(UL)
RTH
COM
(10) CSC
RF
RSV
IN(WL)
CSC
CPS CPS CPS
NV (8)
IN(VL)
OUT(WL)
CSC
NW (9)
RSW
(1) VTH
(2) RTH
THERMISTOR
Temp. Monitoring
U-Phase Current
V-Phase Current
W-Phase Current
Note:
1) To avoid malfunction, the wiring of each input should be as short as possible. (less than 2-3cm)
2) By virtue of integrating an application specific type HVIC inside the SPM, direct coupling to CPU terminals without any opto-coupler or transformer isolation is possible.
3) VFO output is open drain type. This signal line should be pulled up to the positive side of the MCU or control power supply with a resistor that makes IFO up to 1mA. Please refer
to Figure14.
4) CSP15 of around 7 times larger than bootstrap capacitor CBS is recommended.
5) Input signal is High-Active type. There is a 5kW resistor inside the IC to pull down each input signal line to GND. RC coupling circuits is recommanded for the prevention
of input signal oscillation. RSCPS time constant should be selected in the range 50~150ns. (Recommended RS=100 , CPS=1nF)
6) To prevent errors of the protection function, the wiring around RF and C SC should be as short as possible.
7) In the short-circuit protection circuit, please select the RFCSC time constant in the range 1.5~2ms.
8) Each capacitor should be mounted as close to the pins of the SPM as possible.
9) To prevent surge destruction, the wiring between the smoothing capacitor and the P&GND pins should be as short as possible. The use of a high frequency non-inductive
capacitor of around 0.1~0.22mF between the P&GND pins is recommended.
10) Relays are used at almost every systems of electrical equipments of home appliances. In these cases, there should be sufficient distance between the CPU and the relays.
11) The zener diode should be adopted for the protection of ICs from the surge destruction between each pair of control supply terminals. (Recommanded zener diode=24V/1W)
12) Please choose the electrolytic capacitor with good temperature characteristic in CBS. Also, choose 0.1~0.2mF R-category ceramic capacitors with good temperature and
frequency characteristics in CBSC.
13) For the detailed information, please refer to the AN-9070 and FEB305-001.
FNA41560/B2 Rev. C
13
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HVIC
(26) VB(U)
FNA41560/B2 Rev. C
14
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FNA41560/B2 Rev. C
15
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TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not
intended to be an exhaustive list of all such trademarks.
FRFET
Global Power ResourceSM
Green FPS
Green FPS e-Series
GTO
IntelliMAX
ISOPLANAR
MegaBuck
MICROCOUPLER
MicroFET
MicroPak
MillerDrive
MotionMax
Motion-SPM
OPTOLOGIC
OPTOPLANAR
Build it Now
CorePLUS
CorePOWER
CROSSVOLT
CTL
Current Transfer Logic
EcoSPARK
EfficentMax
EZSWITCH *
Fairchild
Fairchild Semiconductor
FACT Quiet Series
FACT
FAST
FastvCore
FlashWriter *
FPS
F-PFS
PDP SPM
Power-SPM
PowerTrench
PowerXS
TinyBoost
TinyBuck
TinyLogic
TINYOPTO
TinyPower
TinyPWM
TinyWire
TriFault Detect
mSerDes
UHC
Ultra FRFET
UniFET
VCX
VisualMax
XS
* EZSWITCH and FlashWriter are trademarks of System General Corporation, used under license by Fairchild Semiconductor.
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PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative / In Design
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production