Malzeme Bilimi ve Mhendisliine

Giri
Dersin amac...
Malzeme bilimindeki temel kavramlarn retilmesi

malzeme yaps
malzeme zellik-yap ilikisi
nasl bir prosesle malzeme yapsn deitirebiliriz?
malzeme zelliklerini kullanma
yeni malzeme dizayn frsatlarn yaratma

Chapter 1 - 1

Kaynak Kitaplar
Malzeme Bilimi ve Mhendislii : W.F. Smith;
eviren, Nihat Knkolu
Materials Science and Engineering: An Introduction
W.D. Callister, Jr., 7th edition, John Wiley and Sons,
Inc. (2007).

Chapter 1 - 2

Program
Konu
Hafta
Malzeme Bilim. Ve Mh. giri; Atomic balanma
1
Kristal Yaplar ve kristal geometri
2
Katlama kristal kusurlar ve difzyon
3
Malzemelerin elektriksel zellikleri
4
Metallerin mekanik zellikleri
5
Polimer malzemeler
6
Faz diyagramlar
Mhendislik alamlar
7
Seramik malzemeler
8
Korozyon
9
Magnetik zellikler
10
Karma malzemeler
11

Chapter
1,2
3
4
5
6
7
8
9
10
12
11
13
Chapter 1 - 3

Chapter 1 - Giri
Malzeme Bilimi nedir?
Malzemeleri neden tanmak zorundayz?
Gemite
Ta devri
Bronz devri
Demir devri
imdi
Silicon devri
Polymer devri

Chapter 1 - 4

Hip Implant (Kala kemii)

With age or certain illnesses joints deteriorate.
Particularly those with large loads (such as hip).

Adapted from Fig. 22.25, Callister 7e.

Chapter 1 - 5

Example Hip Implant

Gerekli zellikler
Mekanik
mukavemet
Dk srtnme
Biyo uyumlu

Adapted from Fig. 22.24, Callister 7e.

Chapter 1 - 6

Example Hip Implant

Adapted from Fig. 22.26, Callister 7e.

Chapter 1 - 7

Hip Implant
Ball

Acetabular
Cup and Liner

Femoral
Stem
Adapted from chapter-opening photograph,
Chapter 22, Callister 7e.
Chapter 1 - 8

Gelitirilen polimerlere rnekler

plastics eya

Ex.
Polyethylene
Polypropylene
Polystyrene
etc.

Mhendislik reineleri
Ex.
Polycarbonate
Nylon
Polysulfone
etc.

Chapter 1 - 9

Malzemeler
Metals:
-Metalik ba
Dayankl, salam, snek
Yksek termal & elektrik iletkenlii
opak, yanstan

Polymers/plastics: kovalent ba

yumuak, snek, dk mukavemet, dk younluk

termal& electriksel yaltkan
Optik olarak transparant (k geirgenlii).

Seramics: iyonik ba

metalik & non-metallic elementler (oxides, carbides, nitrides,

sulfides)
Krlgan, cams, elastik
yaltkan (insulators)
Chapter 1 - 10

Chapter 1 - 11

Chapter 1 - 12

Chapter 1 - 13

Chapter 1 - 14

Chapter 1 - 15

The Materials Selection Process

1. Application

zelliklerin belirlenmesi Properties

Properties: mechanical, electrical, thermal,

magnetic, optical, deteriorative.

2. Properties

Malzeme seimi Material(s)

Material: structure, composition.

3. Material

gereksinimlerin tanmlanmas Processing

Processing: changes structure and overall shape

ex: casting, sintering, vapor deposition, doping
forming, joining, annealing.

Chapter 1 - 16

Chapter 1 - 17

Chapter 1 - 18

Chapter 1 - 19

ELECTRICAL
Electrical Resistivity of Copper:
6

(10-8 Ohm-m)

Resistivity,

5
4
3
2
1
0

Cu

t%
a
2
3.3

Ni

i
%N
t
a
Ni
16
.
%
t
2
+
12 a
.
Cu
1
u+
C
ed
m
r
Ni
%
t
d efo
12 a
.
1
+
Cu
u
C

e
r
Pu

-200

-100

Adapted from Fig. 18.8, Callister 7e.

(Fig. 18.8 adapted from: J.O. Linde,
Ann Physik 5, 219 (1932); and
C.A. Wert and R.M. Thomson,
Physics of Solids, 2nd edition,
McGraw-Hill Company, New York,
1970.)

T (C)

Adding impurity atoms to Cu increases resistivity.

Deforming Cu increases resistivity.
Chapter 1 - 20

THERMAL

Space Shuttle Tiles (Uzay mekii):

--Silica fiber insulation
offers low heat conduction.

Thermal Conductivity
(W/m-K)

Adapted from chapteropening photograph,

Chapter 19, Callister 7e.
(Courtesy of Lockheed
Missiles and Space
Company, Inc.)

100 m

Adapted from
Fig. 19.4W, Callister
6e. (Courtesy of
Lockheed Aerospace
Ceramics Systems,
Sunnyvale, CA)
(Note: "W" denotes fig.
is on CD-ROM.)

Thermal Conductivity
of Copper:
--It decreases when
you add zinc!
400
300
200
100
0

0
10
20 30 40
Composition (wt% Zinc)

Adapted from Fig. 19.4, Callister 7e.

(Fig. 19.4 is adapted from Metals Handbook:
Properties and Selection: Nonferrous alloys and
Pure Metals, Vol. 2, 9th ed., H. Baker,
(Managing Editor), American Society for Metals,
1979, p. 315.)
Chapter 1 - 21

MAGNETIC
Magnetic Storage:

vs. Composition:
--Adding 3 atomic % Si
makes Fe a better
recording medium!
Magnetization

--Recording medium
is magnetized by
recording head.

Magnetic Permeability

Fe+3%Si
Fe

Magnetic Field
Fig. 20.23, Callister 7e.
(Fig. 20.23 is from J.U. Lemke, MRS Bulletin,
Vol. XV, No. 3, p. 31, 1990.)

Adapted from C.R. Barrett, W.D. Nix, and

A.S. Tetelman, The Principles of
Engineering Materials, Fig. 1-7(a), p. 9,
1973. Electronically reproduced
by permission of Pearson Education, Inc.,
Upper Saddle River, New Jersey.
Chapter 1 - 22

OPTICAL

Transmittance (Geirgenlik):
-Aluminum oxide
transparent
(saydam)
single crystal

translucent
(yarsaydam)
polycrystal:
low porosity

opaque
(opak)
polycrystal:
high porosity

Adapted from Fig. 1.2,

Callister 7e.
(Specimen preparation,
P.A. Lessing; photo by S.
Tanner.)

Chapter 1 - 23

DETERIORATIVE
Stress & Saltwater...

crack speed in salt water!

crack speed (m/s)

--causes cracks!

Heat treatment: slows

10-8

10-10

Adapted from chapter-opening photograph,

Chapter 17, Callister 7e.
(from Marine Corrosion, Causes, and
Prevention, John Wiley and Sons, Inc., 1975.)

as-is
held at
160C for 1 hr
before testing
Alloy 7178 tested in
saturated aqueous NaCl
solution at 23C

increasing load

Adapted from Fig. 11.20(b), R.W. Hertzberg, "Deformation and

Fracture Mechanics of Engineering Materials" (4th ed.), p. 505, John
Wiley and Sons, 1996. (Original source: Markus O. Speidel, Brown
Boveri Co.)

--material:

4 m

7150-T651 Al "alloy"
(Zn,Cu,Mg,Zr)
Adapted from Fig. 11.26,
Callister 7e. (Fig. 11.26 provided courtesy of G.H.
Narayanan and A.G. Miller, Boeing Commercial
Chapter 1 - 24
Airplane Company.)

ZET
Hedefler:
Doru malzemenin kullanlmas
Malzeme zellikleri, yap ve proses arasndaki
ilikinin anlalmas
Malzeme seimiyle yeni dizayn frsatlarnn
yaratlabiliyor olmas
Bilincinin oluturulmasdr.

Chapter 1 - 25