Professional Documents
Culture Documents
asheet
RochesterElect
roni
cs Qual
ityOver
view
Manufact
ur edComponents
I SO-9001
Rochester branded component s ar
e AS9120certicati
on
manufactured usi
ng eitherdi e/wafer
s QualiedManufact urer
sList(QML)MIL-PRF-
purchased fr
om the originalsupplier
s 35835
or Rochester wafersr ecreated from ClassQ Mi
lit
ar y
the ori
ginal IP. Allr ecreati
ons are ClassVSpaceLevel
donewi t
ht heappr ovaloft heOCM. QualiedSuppliersListofDistr
ibut
ors(
QSLD)
Partsaret est
ed usi
ngori
ginalf
actory Rochest
erisacri
ti
calsuppl
iert
oDLA and
testprogramsorRochesterdeveloped meet
salli
ndustryandDLA st
andar
ds.
test sol
utions t
o guar
antee product
meetsorexceedt heOCM datasheet. RochesterEl
ectr
onics,LLC i
scommi tt
edto
suppl
yingproductsthatsat
isf
ycustomerexpecta-
ti
onsforquali
tyandar eequaltothoseor
igi
nal
ly
suppl
iedbyindustrymanufactur
ers.
Theori
ginalmanufacturer
sdatasheetaccompanyi ngt hisdocumentre ectstheper f
ormance
andspecicationsoftheRochest ermanuf acturedversionofthi
sdevice.Rochest erElect
ron-
i
csguaranteestheper f
ormanceofi tssemiconductorpr oductstotheori
ginalOEM specica-
ti
ons.
Typical
valuesar eforr
eferencepur posesonly.Cer t
ainminimum ormaxi mum rati
ngs
maybebasedonpr oductcharacterizat
ion,design,simulati
on,orsampletesting.
2013Roc
hes
terEl
ect
roni
cs,LLC.Al
lRi
ght
sRes
erv
ed07112013 Tol
ear
nmor
e,pl
eas
evi
si
twww.
roc
elec
.com
FQP8N60C/FQPF8N60C
QFET
FQP8N60C/FQPF8N60C
600V N-Channel MOSFET
D
!
G!
TO-220 GD S
TO-220F
G DS FQPF Series
FQP Series !
S
Thermal Characteristics
Symbol Parameter FQP8N60C FQPF8N60C Units
RJC Thermal Resistance, Junction-to-Case 0.85 2.6 C/W
RCS Thermal Resistance, Case-to-Sink Typ. 0.5 -- C/W
RJA Thermal Resistance, Junction-to-Ambient 62.5 62.5 C/W
Off Characteristics
BVDSS Drain-Source Breakdown Voltage VGS = 0 V, ID = 250 A 600 -- -- V
BVDSS Breakdown Voltage Temperature
ID = 250 A, Referenced to 25C -- 0.7 -- V/C
/ TJ Coefficient
IDSS VDS = 600 V, VGS = 0 V -- -- 1 A
Zero Gate Voltage Drain Current
VDS = 480 V, TC = 125C -- -- 10 A
IGSSF Gate-Body Leakage Current, Forward VGS = 30 V, VDS = 0 V -- -- 100 nA
IGSSR Gate-Body Leakage Current, Reverse VGS = -30 V, VDS = 0 V -- -- -100 nA
On Characteristics
VGS(th) Gate Threshold Voltage VDS = VGS, ID = 250 A 2.0 -- 4.0 V
RDS(on) Static Drain-Source
VGS = 10 V, ID = 3.75 A -- 1.0 1.2
On-Resistance
gFS Forward Transconductance VDS = 40 V, ID = 3.75 A (Note 4) -- 8.7 -- S
Dynamic Characteristics
Ciss Input Capacitance VDS = 25 V, VGS = 0 V, -- 965 1255 pF
Coss Output Capacitance f = 1.0 MHz -- 105 135 pF
Crss Reverse Transfer Capacitance -- 12 16 pF
Switching Characteristics
td(on) Turn-On Delay Time -- 16.5 45 ns
VDD = 300 V, ID = 7.5A,
tr Turn-On Rise Time -- 60.5 130 ns
RG = 25
td(off) Turn-Off Delay Time -- 81 170 ns
(Note 4, 5)
tf Turn-Off Fall Time -- 64.5 140 ns
Qg Total Gate Charge VDS = 480 V, ID = 7.5A, -- 28 36 nC
Qgs Gate-Source Charge VGS = 10 V -- 4.5 -- nC
Qgd Gate-Drain Charge (Note 4, 5) -- 12 -- nC
Notes:
1. Repetitive Rating : Pulse width limited by maximum junction temperature
2. L = 7.3mH, IAS = 7.5 A, VDD = 50V, RG = 25 , Starting TJ = 25C
3. ISD 7.5A, di/dt 200A/s, VDD BVDSS, Starting TJ = 25C
4. Pulse Test : Pulse width 300s, Duty cycle 2%
5. Essentially independent of operating temperature
VGS
Top : 15.0 V
10.0 V
1 8.0 V
10 7.0 V 10
1
6.5 V
6.0 V
150 C
Bottom : 5.0 V
o
0
10 25 C
o
10
0 -55 C
Notes : Notes :
10
-1
1. 250s Pulse Test 1. VDS = 40V
2. TC = 25 2. 250 s Pulse Test
-1
10
-1 0 1 2 4 6 8 10
10 10 10
VDS, Drain-Source Voltage [V] VGS, Gate-Source Voltage [V]
3.5
1
10
3.0
Drain-Source On-Resistance
VGS = 10V
2.5
RDS(ON) [ ],
2.0
0
10
1.5
VGS = 20V
Notes :
1.0
150 25 1. VGS = 0V
Note : TJ = 25 2. 250s Pulse Test
0.5 10
-1
2000 12
Ciss = Cgs + Cgd (Cds = shorted)
Coss = Cds + Cgd
1800 Crss = Cgd
10 VDS = 120V
1600
VGS, Gate-Source Voltage [V]
800
4
600 Notes ;
1. VGS = 0 V
Crss 2. f = 1 MHz
400
2
200 Note : ID = 8A
0 0
-1 0 1 0 5 10 15 20 25 30
10 10 10
QG, Total Gate Charge [nC]
VDS, Drain-Source Voltage [V]
1.2 3.0
Drain-Source Breakdown Voltage
2.5
Drain-Source On-Resistance
1.1
BVDSS, (Normalized)
RDS(ON), (Normalized)
2.0
1.0 1.5
1.0
0.9 Notes :
1. VGS = 0 V Notes :
0.5 1. VGS = 10 V
2. ID = 250 A
2. ID = 4 A
0.8 0.0
-100 -50 0 50 100 150 200 -100 -50 0 50 100 150 200
o
TJ, Junction Temperature [ C]
o TJ, Junction Temperature [ C]
2
10
Operation in This Area
Operation in This Area
is Limited by R DS(on) 10 s 2
10 is Limited by R DS(on)
100 s 10 s
1
10
1 ms 100 s
ID, Drain Current [A]
1
10 ms 10
1 ms
100 ms 10 ms
DC
10
0 100 ms
0 DC
10
-1
10
Notes : -1
o 10 Notes :
1. TC = 25 C o
o
1. TC = 25 C
2. TJ = 150 C o
2. TJ = 150 C
3. Single Pulse
3. Single Pulse
-2
10 -2
0 1 2 3
10 10 10 10 10
0 1 2 3
10 10 10 10
VDS, Drain-Source Voltage [V]
VDS, Drain-Source Voltage [V]
Figure 9-1. Maximum Safe Operating Area Figure 9-2. Maximum Safe Operating Area
for FQP8N60C for FQPF8N60C
6
ID, Drain Current [A]
0
25 50 75 100 125 150
TC, Case Temperature []
0
10
D = 0 .5
Z JC(t), Thermal Response
0 .2
-1
10 0 .1
0 .0 5
N o te s :
1 . Z J C (t) = 0 .8 5 /W M a x .
0 .0 2 2 . D u ty F a c to r, D = t 1 /t 2
3 . T J M - T C = P D M * Z J C (t)
0 .0 1
PDM
-2 s in g le p u ls e
10
t1
t2
-5 -4 -3 -2 -1 0 1
10 10 10 10 10 10 10
t 1 , S q u a re W a v e P u ls e D u ra tio n [s e c ]
D = 0 .5
0
10
Z JC(t), Thermal Response
0 .2
0 .1
0 .0 5 N o te s :
-1 1 . Z J C (t) = 2 .6 /W M a x .
10 2 . D u ty F a c to r, D = t 1 /t 2
0 .0 2 3 . T J M - T C = P D M * Z J C (t)
0 .0 1
PDM
s in g le p u ls e
-2
t1
10 t2
-5 -4 -3 -2 -1 0 1
10 10 10 10 10 10 10
t 1 , S q u a re W a v e P u ls e D u r a tio n [s e c ]
VGS
Same Type
50K
as DUT Qg
12V 200nF
300nF 10V
VDS
VGS Qgs Qgd
DUT
3mA
Charge
RL VDS
VDS 90%
VGS VDD
RG
10%
VGS
10V DUT
td(on) tr td(off)
tf
t on t off
L BVDSS
1
VDS EAS = ---- L IAS2 --------------------
2 BVDSS - VDD
BVDSS
ID
IAS
RG
VDD ID (t)
DUT +
VDS
I SD
L
Driver
RG
Same Type
as DUT VDD
IRM
VSD VDD
Body Diode
Forward Voltage Drop
TO-220
9.90 0.20 4.50 0.20
1.30 0.10
(8.70)
2.80 0.10
(1.70)
+0.10
3.60 0.10 1.30 0.05
18.95MAX.
(3.70)
15.90 0.20
9.20 0.20
(1.46)
(3.00)
(45
)
(1.00)
13.08 0.20
10.08 0.30
10.00 0.20
Dimensions in Millimeters
TO-220F
3.30 0.10
6.68 0.20
15.87 0.20
15.80 0.20
(1.00x45)
MAX1.47
9.75 0.30
0.80 0.10
(3
0
)
#1
0.35 0.10 +0.10
0.50 0.05 2.76 0.20
2.54TYP 2.54TYP
[2.54 0.20] [2.54 0.20]
4.70 0.20
9.40 0.20
Dimensions in Millimeters
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY
LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR
CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems 2. A critical component is any component of a life support
which, (a) are intended for surgical implant into the body, device or system whose failure to perform can be
or (b) support or sustain life, or (c) whose failure to perform reasonably expected to cause the failure of the life support
when properly used in accordance with instructions for use device or system, or to affect its safety or effectiveness.
provided in the labeling, can be reasonably expected to
result in significant injury to the user.
Advance Information Formative or In This datasheet contains the design specifications for
Design product development. Specifications may change in
any manner without notice.
No Identification Needed Full Production This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Careers | Sitema
Go
DATASHEETS, SAMPLES, BUY TECHNICAL INFORMATION APPLICATIONS DESIGN CENTER SUPPORT COMPANY INVESTORS MY FA
Sales support
General description
Quality and reliability
These N-Channel enhancement mode power field effect transistors are
produced using Fairchilds proprietary, planar stripe, DMOS technology. e-mail this datasheet
Design center
This advanced technology has been especially tailored to minimize on-state
resistance, provide superior switching performance, and withstand high
energy pulse in the avalanche and commutation mode. These devices are
well suited for high efficiency switched mode power supplies, active power This page
factor correction, electronic lamp ballasts based on half bridge topology. Print version
back to top
Features
back to top
Product status/pricing/packaging
Product Product status Pb-free Status Pricing* Package type Leads Packing method Package Marking Convention**
mhtml:file://C:\TEMP\FQPF8N60CT.mht 17-Aug-2007
Product Folder - Fairchild P/N FQPF8N60C - 600V N-Channel Advance Q-FET C-Series Page 2 of 3
Indicates product with Pb-free second-level interconnect. For more information click here.
Package marking information for product FQPF8N60C is available. Click here for more information .
back to top
Application notes
back to top
Qualification Support
Product
FQPF8N60C
FQPF8N60CT
FQPF8N60CYDTU
back to top
mhtml:file://C:\TEMP\FQPF8N60CT.mht 17-Aug-2007
Product Folder - Fairchild P/N FQPF8N60C - 600V N-Channel Advance Q-FET C-Series Page 3 of 3
Products | Design Center | Support | Company News | Investors | My Fairchild | Contact Us | Site Index | Privacy Policy | Site Terms & Conditions | Standard Terms & Conditions o
mhtml:file://C:\TEMP\FQPF8N60CT.mht 17-Aug-2007