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STM32F334x8
ARMCortex-M4 32b MCU+FPU,up to 64KB Flash,16KB SRAM,
2 ADCs,3 DACs,3 comp.,op-amp, 217ps 10-ch (HRTIM1)
Datasheet - production data
Features
LQFP32 (7 x 7 mm)
Core: ARM Cortex-M4 32-bit CPU with FPU LQFP48 (7 x 7 mm)
(72 MHz max), single-cycle multiplication and LQFP64 (10 x 10 mm)
HW division, DSP instruction
Memories Three ultra-fast rail-to-rail analog comparators
Up to 64 Kbytes of Flash memory with analog supply from 2 V to 3.6 V
Up to 12 Kbytes of SRAM with HW parity One operational amplifiers that can be used in
check PGA mode, all terminals accessible with
Routine booster: 4 Kbytes of SRAM on analog supply from 2.4 to 3.6 V
instruction and data bus with HW parity Up to 18 capacitive sensing channels
check (CCM) supporting touchkeys, linear and rotary touch
sensors
CRC calculation unit
Up to 12 timers
Reset and supply management
HRTIM: 6 x16-bit counters, 217 ps
VDD,VDDA voltage range: 2.0 to 3.6 V
resolution, 10 PWM, 5 fault inputs, 10 ext
Power-on/Power-down reset (POR/PDR) event input, 1 synchro. input,1 synchro. out
Programmable voltage detector (PVD) One 32-bit timer and one 16-bit timer with
Low-power modes: Sleep, Stop, Standby up to 4 IC/OC/PWM or pulse counter and
VBAT supply for RTC and backup registers quadrature (incremental) encoder input
One 16-bit 6-channel advanced-control
Clock management
timer, with up to 6 PWM channels,
4 to 32 MHz crystal oscillator deadtime generation and emergency stop
32 kHz oscillator for RTC with calibration One 16-bit timer with 2 IC/OCs,
Internal 8 MHz RC (up to 64 MHz with PLL 1 OCN/PWM, deadtime generation,
option) emergency stop
Internal 40 kHz oscillator Two 16-bit timers with IC/OC/OCN/PWM,
Up to 51 fast I/O ports, all mappable on deadtime generation and emergency stop
external interrupt vectors, several 5 V-tolerant Two watchdog timers (independent,
window)
Interconnect Matrix
SysTick timer: 24-bit downcounter
7-channel DMA controller
Up to two 16-bit basic timers to drive DAC
Up to two ADC 0.20 s (up to 21 channels) with
selectable resolution of 12/10/8/6 bits, 0 to Calendar RTC with alarm, periodic wakeup
3.6 V conversion range, single- from Stop
ended/differential mode, separate analog Communication interfaces
supply from 2.0 to 3.6 V
CAN interface (2.0 B Active) and one SPI
Temperature sensor
One I2C with 20 mA current sink to support
Up to three 12-bit DAC channels with analog Fast mode plus, SMBus/PMBus
supply from 2.4 V to 3.6 V
STM32F334Kx STM32F334K4/K6/K8
STM32F334Cx STM32F334C4/C6/C8
STM32F334Rx STM32F334R4/R6/R8
Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3 Functional overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.1 ARM Cortex-M4 core with FPU with embedded Flash
and SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.2 Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.2.1 Embedded Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.2.2 Embedded SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.2.3 Boot modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.3 Cyclic redundancy check calculation unit (CRC) . . . . . . . . . . . . . . . . . . . 14
3.4 Power management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.4.1 Power supply schemes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.4.2 Power supply supervisor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.4.3 Voltage regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.4.4 Low-power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.5 Interconnect matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.6 Clocks and startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.7 General-purpose inputs/outputs (GPIOs) . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.8 Direct memory access (DMA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.9 Interrupts and events . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.9.1 Nested vectored interrupt controller (NVIC) . . . . . . . . . . . . . . . . . . . . . . 19
3.9.2 Extended interrupt/event controller (EXTI) . . . . . . . . . . . . . . . . . . . . . . 19
3.10 Fast analog-to-digital converter (ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.10.1 Temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.10.2 Internal voltage reference (VREFINT) . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.10.3 VBAT battery voltage monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.10.4 OPAMP2 reference voltage (VOPAMP2) . . . . . . . . . . . . . . . . . . . . . . . . 21
3.11 Digital-to-analog converter (DAC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.12 Operational amplifier (OPAMP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.13 Ultra-fast comparators (COMP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.14 Timers and watchdogs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
5 Memory mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
6 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
6.1 Parameter conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
6.1.1 Minimum and maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
6.1.2 Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
6.1.3 Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
6.1.4 Loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
6.1.5 Input voltage on a pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
6.1.6 Power-supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
6.1.7 Measurement of the current consumption . . . . . . . . . . . . . . . . . . . . . . . 46
6.2 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
6.3 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
6.3.1 General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
6.3.2 Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . . 50
6.3.3 Characteristics of the embedded reset and power-control block . . . . . . 50
List of tables
List of figures
1 Introduction
This datasheet provides the ordering information and the mechanical device characteristics
of the STM32F334x4/6/8 microcontrollers.
This document should be read in conjunction with the STM32F303xx reference manual
RM0364 available from the STMicroelectronics website www.st.com.
For information on the Cortex-M4 core with FPU, refer to:
ARM Cortex-M4 Processor Technical Reference Manual available from the
www.arm.com website.
STM32F3xxx and STM32F4xxx Cortex-M4 programming manual (PM0214) available
from the www.st.com website.
2 Description
SPI 1
Comm. I2C 1
interfaces USART 2 3
CAN 1
Normal I/Os
10 20 26
(TC, TTa)
GPIOs
5-Volt tolerant
15 17 25
I/Os (FT,FTf)
Capacitive sensing channels 14 17 18
DMA channels 7
12-bit ADCs 2 2 2
Number of channels 10 15 21
12-bit DAC channels 3
Ultra-fast analog comparator 2 3
Operational amplifiers 1
CPU frequency 72 MHz
Operating voltage 2.0 to 3.6 V
Ambient operating temperature: - 40 to 85 C / - 40 to 105 C
Operating temperature
Junction temperature: - 40 to 125 C
Packages LQFP32 LQFP48 LQFP64
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3 Functional overview
3.2 Memories
ADC/COMP 2V 3.6 V
DAC/OPAMP 2.4 V 3.6 V
VBAT = 1.65 to 3.6 V: power supply for RTC, external clock 32 kHz oscillator and
backup registers (through power switch) when VDD is not present.
remains in reset mode when the monitored supply voltage is below a specified threshold,
VPOR/PDR, without the need for an external reset circuit.
The POR monitors only the VDD supply voltage. During the startup phase it is required
that VDDA should arrive first and be greater than or equal to VDD.
The PDR monitors both the VDD and VDDA supply voltages, however the VDDA power
supply supervisor can be disabled (by programming a dedicated Option bit) to reduce
the power consumption if the application design ensures that VDDA is higher than or
equal to VDD.
The device features an embedded programmable voltage detector (PVD) that monitors the
VDD power supply and compares it to the VPVD threshold. An interrupt can be generated
when VDD drops below the VPVD threshold and/or when VDD is higher than the VPVD
threshold. The interrupt service routine can then generate a warning message and/or put
the MCU into a safe state. The PVD is enabled by software.
Note: For more details about the interconnect actions, refer to the corresponding sections in the
RM0364 reference manual.
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independently. A pending register maintains the status of the interrupt requests. The EXTI
can detect an external line with a pulse width shorter than the internal clock period. Up to 51
GPIOs can be connected to the 16 external interrupt lines.
input channels. The precise voltage of VREFINT is individually measured for each part by ST
during production test and stored in the system memory area. It is accessible in read-only
mode.
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1. TIM1 can be clocked from the PLL x 2 running at 144 MHz .
In addition, it provides hardware support for SMBUS 2.0 and PMBUS 1.1: ARP capability,
Host notify protocol, hardware CRC (PEC) generation/verification, timeouts verifications and
ALERT protocol management. It also has a clock domain independent from the CPU clock,
allowing the I2C1 to wake up the MCU from Stop mode on address match.
The I2C interface can be served by the DMA controller.
The features available in I2C1 are showed below in Table 7.
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charging the electrode capacitance and then transferring a part of the accumulated charges
into a sampling capacitor until the voltage across this capacitor has reached a specific
threshold. To limit the CPU bandwidth usage this acquisition is directly managed by the
hardware touch sensing controller and only requires few external components to operate.
The touch sensing controller is fully supported by the STMTouch touch sensing firmware
library which is free to use and allows touch sensing functionality to be implemented reliably
in the end application.
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Unless otherwise specified in brackets below the pin name, the pin function during and
Pin name
after reset is the same as the actual pin name
S Supply pin
Pin type I Input only pin
I/O Input / output pin
FT 5 V tolerant I/O
FTf 5 V tolerant I/O, FM+ capable
TTa 3.3 V tolerant I/O directly connected to ADC
TT 3.3 V tolerant I/O
I/O structure TC Standard 3.3 V I/O
B Dedicated BOOT0 pin
RST Bi-directional reset pin with embedded weak pull-up resistor
Unless otherwise specified by a note, all I/Os are set as floating inputs during and after
Notes
reset
Alternate
Functions selected through GPIOx_AFR registers
functions
Pin
functions Additional
Functions directly selected/enabled through peripheral registers
functions
RTC_TAMP1/RTC_TS/
- 2 2 PC13(1) I/O TC TIM1_CH1N
RTC_OUT/WKUP2
I/O structure
Pin type
Pin name (function
LQFP LQFP LQFP after reset) Alternate
Additional functions
32 48 64 functions
EVENTOUT, TIM1_CH4,
- - 11 PC3 I/O TTa ADC12_IN9
TIM1_BKIN2
TIM2_CH1/
TIM2_ETR,
ADC1_IN1(2),
6 10 14 PA0 I/O TTa TSC_G1_IO1,
RTC_TAMP2/WKUP1
USART2_CTS,
EVENTOUT
TIM2_CH2,
TSC_G1_IO2,
7 11 15 PA1 I/O TTa USART2_RTS_DE, ADC1_IN2(2), RTC_REFIN
TIM15_CH1N,
EVENTOUT
TIM2_CH3,
TSC_G1_IO3,
USART2_TX,
8 12 16 PA2 I/O TTa ADC1_IN3(2), COMP2_INM
COMP2_OUT,
TIM15_CH1,
EVENTOUT
TIM2_CH4,
TSC_G1_IO4,
9 13 17 PA3 I/O TTa USART2_RX, ADC1_IN4(2)
TIM15_CH2,
EVENTOUT
- - 18 VSS S - - -
- - 19 VDD S - - -
TIM3_CH2,
TSC_G2_IO1, ADC2_IN1(2), DAC1_OUT1,
10 14 20 PA4(3) I/O TTa SPI1_NSS, COMP2_INM4, COMP4_INM4,
USART2_CK, COMP6_INM4
EVENTOUT
TIM2_CH1/
TIM2_ETR, ADC2_IN2(2), DAC1_OUT2,
11 15 21 PA5(3) I/O TTa
TSC_G2_IO2, OPAMP2_VINM
SPI1_SCK, EVENTOUT
TIM16_CH1, TIM3_CH1,
TSC_G2_IO3,
SPI1_MISO, ADC2_IN3(2), DAC2_OUT1,
12 16 22 PA6(3) I/O TTa
TIM1_BKIN, OPAMP2_VOUT
OPAMP2_DIG,
EVENTOUT
I/O structure
Pin type
Pin name (function
LQFP LQFP LQFP after reset) Alternate
Additional functions
32 48 64 functions
TIM17_CH1, TIM3_CH2,
TSC_G2_IO4,
ADC2_IN4(2), COMP2_INP,
13 17 23 PA7 I/O TTa SPI1_MOSI,
OPAMP2_VINP
TIM1_CH1N,
EVENTOUT
EVENTOUT, TIM1_ETR,
- - 24 PC4 I/O TTa ADC2_IN5(2)
USART1_TX
EVENTOUT,
TIM15_BKIN,
- - 25 PC5 I/O TTa ADC2_IN11, OPAMP2_VINM
TSC_G3_IO1,
USART1_RX
TIM3_CH3,
TSC_G3_IO2, ADC1_IN11, COMP4_INP,
14 18 26 PB0 I/O TTa
TIM1_CH2N, OPAMP2_VINP
EVENTOUT
TIM3_CH4,
TSC_G3_IO3,
TIM1_CH3N,
15 19 27 PB1 I/O TTa ADC1_IN12
COMP4_OUT,
HRTIM1_SCOUT,
EVENTOUT
TSC_G3_IO4,
- 20 28 PB2 I/O TTa HRTIM_SCIN, ADC2_IN12, COMP4_INM
EVENTOUT
TIM2_CH3, TSC_SYNC,
USART3_TX,
- 21 29 PB10 I/O TT -
HRTIM1_FLT3,
EVENTOUT
TIM2_CH4,
TSC_G6_IO1,
- 22 30 PB11 I/O TTa USART3_RX, COMP6_INP
HRTIM1_FLT4,
EVENTOUT
TSC_G6_IO2,
TIM1_BKIN,
- 25 33 PB12 I/O TTa USART3_CK, ADC2_IN13
HRTIM1_CHC1,
EVENTOUT
TSC_G6_IO3,
TIM1_CH1N,
- 26 34 PB13 I/O TTa USART3_CTS, ADC1_IN13
HRTIM1_CHC2,
EVENTOUT
I/O structure
Pin type
Pin name (function
LQFP LQFP LQFP after reset) Alternate
Additional functions
32 48 64 functions
TIM15_CH1,
TSC_G6_IO4,
TIM1_CH2N,
- 27 35 PB14 I/O TTa ADC2_IN14, OPAMP2_VINP
USART3_RTS_DE,
HRTIM1_CHD1,
EVENTOUT
TIM15_CH2,
TIM15_CH1N,
ADC2_IN15, COMP6_INM,
- 28 36 PB15 I/O TTa TIM1_CH3N,
RTC_REFIN
HRTIM1_CHD2,
EVENTOUT
EVENTOUT, TIM3_CH1,
- - 37 PC6 I/O FT HRTIM1_EEV10, -
COMP6_OUT
EVENTOUT, TIM3_CH2,
- - 38 PC7 I/O FT -
HRTIM1_FLT5
EVENTOUT, TIM3_CH3,
- - 39 PC8 I/O FT -
HRTIM1_CHE1
EVENTOUT, TIM3_CH4,
- - 40 PC9 I/O FT -
HRTIM1_CHE2
MCO, TIM1_CH1,
USART1_CK,
18 29 41 PA8 I/O FT -
HRTIM1_CHA1,
EVENTOUT
TSC_G4_IO1,
TIM1_CH2,
USART1_TX,
19 30 42 PA9 I/O FT TIM15_BKIN, -
TIM2_CH3,
HRTIM1_CHA2,
EVENTOUT
TIM17_BKIN,
TSC_G4_IO2,
TIM1_CH3,
USART1_RX,
20 31 43 PA10 I/O FT -
COMP6_OUT,
TIM2_CH4,
HRTIM1_CHB1,
EVENTOUT
TIM1_CH1N,
USART1_CTS,
CAN_RX, TIM1_CH4,
21 32 44 PA11 I/O FT -
TIM1_BKIN2,
HRTIM1_CHB2,
EVENTOUT
TIM16_CH1,
TIM1_CH2N,
USART1_RTS_DE,
22 33 45 PA12 I/O FT COMP2_OUT, CAN_TX, -
TIM1_ETR,
HRTIM1_FLT1,
EVENTOUT
I/O structure
Pin type
Pin name (function
LQFP LQFP LQFP after reset) Alternate
Additional functions
32 48 64 functions
JTMS/SWDAT,
TIM16_CH1N,
23 34 46 PA13 I/O FT TSC_G4_IO3, IR_OUT, -
USART3_CTS,
EVENTOUT
- 35 47 VSS S - - -
- 36 48 VDD S - - -
JTCK/SWCLK,
TSC_G4_IO4,
24 37 49 PA14 I/O FTf I2C1_SDA, TIM1_BKIN, -
USART2_TX,
EVENTOUT
JTDI,
TIM2_CH1/TIM2_ETR,
TSC_SYNC, I2C1_SCL,
SPI1_NSS,
25 38 50 PA15 I/O FTf -
USART2_RX,
TIM1_BKIN,
HRTIM1_FLT2,
EVENTOUT
EVENTOUT,
- - 51 PC10 I/O FT -
USART3_TX
EVENTOUT,
- - 52 PC11 I/O FT HRTIM1_EEV2, -
USART3_RX
EVENTOUT,
- - 53 PC12 I/O FT HRTIM1_EEV1, -
USART3_CK
JTDO/TRACE
SWO, TIM2_CH2,
TSC_G5_IO1,
SPI1_SCK,
26 39 55 PB3 I/O FT USART2_TX, -
TIM3_ETR,
HRTIM1_SCOUT,
HRTIM1_EEV9,
EVENTOUT
NJTRST, TIM16_CH1,
TIM3_CH1,
TSC_G5_IO2,
SPI1_MISO,
27 40 56 PB4 I/O FT -
USART2_RX,
TIM17_BKIN,
HRTIM1_EEV7,
EVENTOUT
I/O structure
Pin type
Pin name (function
LQFP LQFP LQFP after reset) Alternate
Additional functions
32 48 64 functions
TIM16_BKIN,
TIM3_CH2,
I2C1_SMBA,
SPI1_MOSI,
28 41 57 PB5 I/O FT -
USART2_CK,
TIM17_CH1,
HRTIM1_EEV6,
EVENTOUT
TIM16_CH1N,
TSC_G5_IO3,
I2C1_SCL,
29 42 58 PB6 I/O FTf USART1_TX, -
HRTIM1_SCIN,
HRTIM1_EEV4,
EVENTOUT
TIM17_CH1N,
TSC_G5_IO4,
I2C1_SDA,
30 43 59 PB7 I/O FTf USART1_RX, -
TIM3_CH4,
HRTIM1_EEV3,
EVENTOUT
31 44 60 BOOT0 I B - -
TIM16_CH1,
TSC_SYNC, I2C1_SCL,
USART3_RX, CAN_RX,
- 45 61 PB8 I/O FTf -
TIM1_BKIN,
HRTIM1_EEV8,
EVENTOUT
TIM17_CH1, I2C1_SDA,
IR_OUT, USART3_TX,
- 46 62 PB9 I/O FTf COMP2_OUT, CAN_TX, -
HRTIM1_EEV5,
EVENTOUT
32 47 63 VSS S - - -
1 48 64 VDD S - - -
1. PC13, PC14 and PC15 are supplied through the power switch. Since the switch sinks only a limited amount of current (3 mA), the use of
GPIO PC13 to PC15 in output mode is limited:
- The speed should not exceed 2 MHz with a maximum load of 30 pF
- These GPIOs must not be used as current sources (e.g. to drive an LED).
After the first backup domain power-up, PC13, PC14 and PC15 operate as GPIOs. Their function then depends on the content of the Backup
registers which is not reset by the main reset. For details on how to manage these GPIOs, refer to the Battery backup domain and BKP
register description sections in the reference manual.
2. Fast ADC channel.
3. These GPIOs offer a reduced touch sensing sensitivity. It is thus recommended to use them as sampling capacitor I/O.
Port
TIM2/TIM15/ TIM1/TIM3/ USART1/USA GPCOMP2/
CAN/TIM1/ TIM2/TIM3 HRTIM1/ HRTIM1/
SYS_AF TIM16/TIM17/ TIM15/ HRTIM1/TSC I2C1/TIM1 SPI1/Infrared TIM1/Infrared RT2/USART3/ GPCOMP4/ TIM1 - EVENT
TIM15 /TIM17 TIM1 OPAMP2
EVENT TIM16 GPCOMP6 GPCOMP6
TIM2_CH1/TI
PA0 - - TSC_G1_IO1 - - - USART2_CTS - - - - - - - EVENTOUT
M2_ETR
USART2_RTS
PA1 - TIM2_CH2 - TSC_G1_IO2 - - - - TIM15_CH1N - - - - - EVENTOUT
_DE
TIM2_CH1/TI
PA5 - - TSC_G2_IO2 - SPI1_SCK - - - - - - - - - EVENTOUT
M2_ETR
USART1_RTS
PA12 - TIM16_CH1 - - - - TIM1_CH2N COMP2_OUT CAN_TX - TIM1_ETR - HRTIM1_FLT1 - EVENTOUT
_DE
TIM2_CH1/
PA15 JTDI - TSC_SYNC I2C1_SCL SPI1_NSS - USART2_RX - TIM1_BKIN - - - HRTIM1_FLT2 - EVENTOUT
TIM2_ETR
JTDO/TRACE HRTIM1_SC
PB3 TIM2_CH2 - TSC_G5_IO1 - SPI1_SCK - USART2_TX - - TIM3_ETR - HRTIM1_EEV9 - EVENTOUT
SWO OUT
TIM17_BK
PB4 NJTRST TIM16_CH1 TIM3_CH1 TSC_G5_IO2 - SPI1_MISO - USART2_RX - - - - HRTIM1_EEV7 - EVENTOUT
IN
Port B
TIM17_CH
PB5 - TIM16_BKIN TIM3_CH2 - I2C1_SMBA SPI1_MOSI - USART2_CK - - - - HRTIM1_EEV6 - EVENTOUT
1
HRTIM1_SCI
PB6 - TIM16_CH1N - TSC_G5_IO3 I2C1_SCL - - USART1_TX - - - - HRTIM1_EEV4 - EVENTOUT
N
Port
TIM2/TIM15/ TIM1/TIM3/ USART1/USA GPCOMP2/
CAN/TIM1/ TIM2/TIM3 HRTIM1/ HRTIM1/
SYS_AF TIM16/TIM17/ TIM15/ HRTIM1/TSC I2C1/TIM1 SPI1/Infrared TIM1/Infrared RT2/USART3/ GPCOMP4/ TIM1 - EVENT
TIM15 /TIM17 TIM1 OPAMP2
EVENT TIM16 GPCOMP6 GPCOMP6
USART3_RTS
PB14 - TIM15_CH1 - TSC_G6_IO4 - - TIM1_CH2N - - - - - HRTIM1_CHD1 - EVENTOUT
_DE
TIM15_CH1
PB15 - TIM15_CH2 - TIM1_CH3N - - - - - - - - HRTIM1_CHD2 - EVENTOUT
N
- - - - - - - - - - - - - - - - -
HRTIM1_EEV1
PC6 - EVENTOUT TIM3_CH1 - - - COMP6_OUT - - - - - - - -
0
PC13 - - - - TIM1_CH1N - - - - - - - - - - -
PC14 - - - - - - - - - - - - - - - -
PC15 - - - - - - - - - - - - - - - -
PF0 - - - - - - TIM1_CH3N - - - - - - - - -
Port F
PF1 - - - - - - - - - - - - - - - -
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Caution: Each power-supply pair (VDD/VSS, VDDA/VSSA etc..) must be decoupled with filtering
ceramic capacitors as shown above. These capacitors must be placed as close as possible
to, or below the appropriate pins on the underside of the PCB to ensure the good
functionality of the device.
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IVDD Total current into sum of all VDD_x power lines (source)(1) 140
(1)
IVSS Total current out of sum of all VSS_x ground lines (sink) -140
(1)
IVDD Maximum current into each VDD_x power line (source) 100
IVSS Maximum current out of each VSS _x ground line (sink)(1) 100
Output current sunk by any I/O and control pin 25
IIO(PIN)
Output current source by any I/O and control pin -25
mA
(2)
Total output current sunk by sum of all I/Os and control pins 80
IIO(PIN)
Total output current sourced by sum of all I/Os and control pins(2) -80
Injected current on TT, FT, FTf and B pins(3) -5 /+0
IINJ(PIN) Injected current on TC and RST pin(4) 5
Injected current on TTa pins (5)
5
IINJ(PIN) Total injected current (sum of all I/O and control pins)(6) 25
1. All main power (VDD, VDDA) and ground (VSS and VSSA) pins must always be connected to the external power supply, in the
permitted range.
2. This current consumption must be correctly distributed over all I/Os and control pins.The total output current must not be
sunk/sourced between two consecutive power supply pins referring to high pin count LQFP packages.
3. Positive injection is not possible on these I/Os and does not occur for input voltages lower than the specified maximum
value.
4. A positive injection is induced by VIN > VDD while a negative injection is induced by VIN< VSS. IINJ(PIN) must never be
exceeded. Refer to Table 16: Voltage characteristics for the maximum allowed input voltage values.
5. A positive injection is induced by VIN > VDDA while a negative injection is induced by VIN< VSS. IINJ(PIN) must never be
exceeded. Refer also to Table 16: Voltage characteristics for the maximum allowed input voltage values. Negative injection
disturbs the analog performance of the device. See note 2. below Table 64.
6. When several inputs are submitted to a current injection, the maximum IINJ(PIN) is the absolute sum of the positive and
negative injected currents (instantaneous values).
VREFINT Internal reference voltage 40 C < TA < +105 C 1.20 1.23 1.25 V
ADC sampling time when
TS_vrefint reading the internal - 2.2 - - s
reference voltage
Internal reference voltage
VRERINT spread over the VDD = 31.8 V 10 mV - - 10(1) mV
temperature range
TCoeff Temperature coefficient - - - 100(1) ppm/C
1. Guaranteed by design, not tested in production.
Table 25. Typical and maximum current consumption from VDD supply at VDD = 3.6V
All peripherals enabled All peripherals disabled
Table 26. Typical and maximum current consumption from the VDDA supply
VDDA = 2.4 V VDDA = 3.6 V
Conditions
Symbol Parameter (1) fHCLK Max. @ TA(2) Max. @ TA(2) Unit
Typ. Typ.
25 C 85 C 105 C 25 C 85 C 105 C
(3) (3) (3)
72 MHz 224 252 265 269 245 272 288 295(3)
64 MHz 196 225 237 241 214 243 257 263
48 MHz 147 174 183 186 159 186 196 201
Supply HSE
32 MHz 100 126 133 135 109 133 142 145
current in bypass
24 MHz 79 102 107 108 85 108 113 116
Run/Sleep
mode, 8 MHz 3 5 5 6 4 6 6 7
IDDA A
code 1 MHz 3 5 5 6 3 5 6 6
executing
64 MHz 259 288 304 309 285 315 332 338
from Flash
or RAM 48 MHz 208 239 251 254 230 258 271 277
HSI clock 32 MHz 162 190 198 202 179 206 216 219
24 MHz 140 168 175 178 155 181 188 191
8 MHz 62 85 88 89 71 94 96 98
1. Current consumption from the VDDA supply is independent of whether the peripherals are on or off. Furthermore when the
PLL is off, IDDA is independent from the frequency.
2. Data based on characterization results, not tested in production.
3. Data based characterization results and tested in production with code executing from RAM.
Table 27. Typical and maximum VDD consumption in Stop and Standby modes
Typ. @VDD (VDD=VDDA) Max.(1)
1. Data based on characterization results, not tested in production unless otherwise specified.
Table 28. Typical and maximum VDDA consumption in Stop and Standby modes
Typ. @VDD (VDD = VDDA) Max.(1)
current in power mode, all 1.67 1.79 1.91 2.04 2.19 2.35 2.5 5.9 6.2
Stop mode oscillators OFF
Supply LSI ON and IWDG ON 2.06 2.24 2.41 2.60 2.80 3.04 - - -
current in
Standby LSI OFF and IWDG
1.54 1.68 1.78 1.92 2.06 2.22 2.6 3.0 3.8
mode OFF
IDDA A
Supply Regulator in run/low-
current in power mode, all 0.97 0.99 1.03 1.07 1.14 1.22 - - -
Stop mode oscillators OFF
Supply LSI ON and IWDG ON 1.36 1.44 1.52 1.62 1.76 1.91 - - -
current in
Standby LSI OFF and IWDG
0.86 0.88 0.91 0.95 1.03 1.09 - - -
mode OFF
Table 29. Typical and maximum current consumption from VBAT supply
Max.
Typ.@VBAT
@VBAT= 3.6V(2)
Para
Symbol Conditions(1) Unit
meter TA=
1.65 TA= TA=
2V 2.4V 2.7V 3V 3.3V 3.6V 85
V 1.8V 25C 105C
C
Figure 12. Typical VBAT current consumption (LSE and RTC ON/LSEDRV[1:0] = 00)
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Table 30. Typical current consumption in Run mode, code with data processing
running from Flash memory
Typ.
Symbol Parameter Conditions fHCLK Unit
Peripherals Peripherals
enabled disabled
Table 31. Typical current consumption in Sleep mode, code running from Flash or RAM
Typ.
Symbol Parameter Conditions fHCLK Unit
Peripherals Peripherals
enabled disabled
For the output pins, any external pull-down or external load must also be considered to
estimate the current consumption.
Additional I/O current consumption is due to I/Os configured as inputs if an intermediate
voltage level is externally applied. This current consumption is caused by the input Schmitt
trigger circuits used to discriminate the input value. Unless this specific configuration is
required by the application, this supply current consumption can be avoided by configuring
these I/Os in analog mode. This is notably the case of ADC input pins which should be
configured as analog inputs.
Caution: Any floating input pin can also settle to an intermediate voltage level or switch inadvertently,
as a result of external electromagnetic noise. To avoid current consumption related to
floating pins, they must either be configured in analog mode, or forced internally to a definite
digital value. This can be done either by using pull-up/down resistors or by configuring the
pins in output mode.
I SW = V DD f SW C
where
ISW is the current sunk by a switching I/O to charge/discharge the capacitive load
VDD is the MCU supply voltage
fSW is the I/O switching frequency
C is the total capacitance seen by the I/O pin: C = CINT+ CEXT+CS
The test pin is configured in push-pull output mode and is toggled by software at a fixed
frequency.
2 MHz 0.90
4 MHz 0.93
VDD = 3.3 V
Cext = 0 pF 8 MHz 1.16
C = CINT + CEXT+ CS
18 MHz 1.60
36 MHz 2.51
2 MHz 0.93
4 MHz 1.06
VDD = 3.3 V
Cext = 10 pF 8 MHz 1.47
C = CINT + CEXT +CS
18 MHz 2.26
36 MHz 3.39
2 MHz 1.03
4 MHz 1.30
VDD = 3.3 V
I/O current
ISW Cext = 22 pF 8 MHz 1.79 mA
consumption
C = CINT + CEXT +CS
18 MHz 3.01
36 MHz 5.99
2 MHz 1.10
4 MHz 1.31
VDD = 3.3 V
Cext = 33 pF 8 MHz 2.06
C = CINT + CEXT+ CS
18 MHz 3.47
36 MHz 8.35
2 MHz 1.20
4 MHz 1.54
VDD = 3.3 V
Cext = 47 pF 8 MHz 2.46
C = CINT + CEXT+ CS
18 MHz 4.51
36 MHz 9.98
1. CS = 5 pF (estimated value).
I2C1 13.3 -
CAN 31.3 -
PWR 4.7 -
DAC 15.4 -
DAC2 8.6 -
SPI1 8.2 -
1. The power consumption of the analog part (IDDA) of peripherals such as ADC, DAC, Comparators, OpAmp
etc. is not included. Refer to the tables of characteristics in the subsequent sections.
2. BusMatrix is automatically active when at least one master is ON (CPU or DMA1).
3. The APBx bridge is automatically active when at least one peripheral is ON on the same bus.
Regulator in
4.3 4.1 4.0 3.9 3.8 3.7 4.5
run mode
Wakeup from
tWUSTOP Regulator in
Stop mode
low-power 7.8 6.7 6.1 5.9 5.5 5.3 9 s
mode
Wakeup from LSI and
tWUSTANDBY(1) 74.4 64.3 60.0 56.9 54.3 51.1 103
Standby mode IWDG OFF
CPU
Wakeup from
tWUSLEEP - 6 - clock
Sleep mode
cycles
1. Data based on characterization results, not tested in production.
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For CL1 and CL2, it is recommended to use high-quality external ceramic capacitors in the
5 pF to 25 pF range (typ.), designed for high-frequency applications, and selected to match
the requirements of the crystal or resonator (see Figure 15). CL1 and CL2 are usually the
same size. The crystal manufacturer typically specifies a load capacitance which is the
series combination of CL1 and CL2. PCB and MCU pin capacitance must be included (10 pF
can be used as a rough estimate of the combined pin and board capacitance) when sizing
CL1 and CL2.
Note: For information on selecting the crystal, refer to the application note AN2867 Oscillator
design guide for ST microcontrollers available from the ST website www.st.com.
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LSEDRV[1:0]=00
- 0.5 0.9
lower driving capability
LSEDRV[1:0]=10
medium low driving - - 1
capability
IDD LSE current consumption A
LSEDRV[1:0]=01
medium high driving - - 1.3
capability
LSEDRV[1:0]=11
- - 1.6
higher driving capability
LSEDRV[1:0]=00
5 - -
lower driving capability
LSEDRV[1:0]=10
medium low driving 8 - -
Oscillator capability
gm A/V
transconductance LSEDRV[1:0]=01
medium high driving 15 - -
capability
LSEDRV[1:0]=11
25 - -
higher driving capability
tSU(LSE)(3) Startup time VDD is stabilized - 2 - s
1. Refer to the note and caution paragraphs below the table, and to the application note AN2867 Oscillator
design guide for ST microcontrollers.
2. Guaranteed by design, not tested in production.
3. tSU(LSE) is the startup time measured from the moment it is enabled (by software) to a stabilized
32.768 kHz oscillation is reached. This value is measured for a standard crystal and it can vary significantly
with the crystal manufacturer.
Note: For information on selecting the crystal, refer to the application note AN2867 Oscillator
design guide for ST microcontrollers available from the ST website www.st.com.
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Note: An external resistor is not required between OSC32_IN and OSC32_OUT and it is forbidden
to add one.
Figure 17. HSI oscillator accuracy characterization results for soldered parts
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Prequalification trials
Most of the common failures (unexpected reset and program counter corruption) can be
reproduced by manually forcing a low state on the NRST pin or the Oscillator pins for 1
second.
To complete these trials, ESD stress can be applied directly on the device, over the range of
specification values. When unexpected behavior is detected, the software can be hardened
to prevent unrecoverable errors occurring (see application note Software techniques for
improving microcontrollers EMC performance AN1015).
0.1 to 30 MHz 5
VDD = 3.6 V, TA =25 C,
LQFP64 package 30 to 130 MHz 9 dBV
SEMI Peak level
compliant with IEC 130 MHz to 1GHz 31
61967-2
SAE EMI Level 4 -
TA = +25 C,
VESD(HBM Electrostatic discharge
conforming to JESD22- 2 2000
) voltage (human body model)
A114
V
Electrostatic discharge TA = +25 C,
VESD(CD
voltage (charge device conforming to JESD22- II 250
M) model) C101
1. Data based on characterization results, not tested in production.
Static latch-up
Two complementary static tests are required on six parts to assess the latch-up
performance:
A supply overvoltage is applied to each power supply pin
A current injection is applied to each input, output and configurable I/O pin
These tests are compliant with EIA/JESD 78A IC latch-up standard.
The failure is indicated by an out of range parameter: ADC error above a certain limit (higher
than 5 LSB TUE), out of conventional limits of induced leakage current on adjacent pins (out
of 5 A/+0 A range), or other functional failure (for example reset occurrence or oscillator
frequency deviation). The test results are given in Table 49: I/O current injection
susceptibility.
Note: It is recommended to add a Schottky diode (pin to ground) to analog pins which may
potentially inject negative currents.
All I/Os are CMOS and TTL compliant (no software configuration required). Their
characteristics cover more than the strict CMOS-technology or TTL parameters. The
coverage of these requirements is shown in Figure 18 and Figure 19 for standard I/Os.
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VOL(1) Output low level voltage for an I/O pin CMOS port(2) - 0.4
IIO = +8 mA
VOH(3) Output high level voltage for an I/O pin 2.7 V < VDD < 3.6 V VDD0.4 -
VOL (1) Output low level voltage for an I/O pin TTL port(2) - 0.4
IIO = +8 mA
VOH (3) Output high level voltage for an I/O pin 2.7 V < VDD < 3.6 V 2.4 -
VOL(1)(4) Output low level voltage for an I/O pin IIO = +20 mA - 1.3 V
VOH(3)(4) Output high level voltage for an I/O pin 2.7 V < VDD < 3.6 V VDD1.3 -
VOL(1)(4) Output low level voltage for an I/O pin IIO = +6 mA - 0.4
VOH(3)(4) Output high level voltage for an I/O pin 2 V < VDD < 2.7 V VDD0.4 -
Output low level voltage for an FTf I/O pin in IIO = +20 mA
VOLFM+(1)(4) - 0.4
FM+ mode 2.7 V < VDD < 3.6 V
1. The IIO current sunk by the device must always respect the absolute maximum rating specified in Table 17 and the sum of
IIO (I/O ports and control pins) must not exceed IIO(PIN).
2. TTL and CMOS outputs are compatible with JEDEC standards JESD36 and JESD52.
3. The IIO current sourced by the device must always respect the absolute maximum rating specified in Table 17 and the sum
of IIO (I/O ports and control pins) must not exceed IIO(PIN).
4. Data based on design simulation.
Input/output AC characteristics
The definition and values of input/output AC characteristics are given in Figure 22 and
Table 66, respectively.
Unless otherwise specified, the parameters given are derived from tests performed under
ambient temperature and VDD supply voltage conditions summarized in Table 19.
0.3VDD+
VIL(NRST)(1) NRST Input low level voltage - - -
0.07(1)
V
0.445VDD+
VIH(NRST)(1) NRST Input high level voltage - - -
0.398(1)
Vhys(NRST) NRST Schmitt trigger voltage hysteresis - - 200 - mV
(2)
RPU Weak pull-up equivalent resistor VIN = VSS 25 40 55 k
VF(NRST)(1) NRST Input filtered pulse - - - 100(1) ns
VNF(NRST)(1) NRST Input not filtered pulse - 500 (1)
- - ns
1. Guaranteed by design, not tested in production.
2. The pull-up is designed with a true resistance in series with a switchable PMOS. This PMOS contribution to the series
resistance must be minimum (~10% order).
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Table 57. HRTIM output response to external events 1 to 10 (Synchronous mode (1))
Max.
Symbol Parameter Conditions Min. Typ. (2) Unit
tTIMxCL
- 1 -
K
/4 0 0.1 409.6
/8 1 0.2 819.2
/16 2 0.4 1638.4
/32 3 0.8 3276.8
/64 4 1.6 6553.6
/128 5 3.2 13107.2
/256 7 6.4 26214.4
1. These timings are given for a 40 kHz clock but the microcontrollers internal RC frequency can vary from 30
to 60 kHz. Moreover, given an exact RC oscillator frequency, the exact timings still depend on the phasing
of the APB interface clock versus the LSI clock so that there is always a full RC period of uncertainty.
1 0 0.05687 3.6409
2 1 0.1137 7.2817
4 2 0.2275 14.564
8 3 0.4551 29.127
1. Guaranteed by design, not tested in production.
All I2C SDA and SCL I/Os embed an analog filter. Refer to the table below for the analog
filter characteristics:
SPI characteristics
Unless otherwise specified, the parameters given in Table 53 for SPI are derived from tests
performed under ambient temperature, fPCLKx frequency and VDD supply voltage conditions
summarized in Table 19: General operating conditions.
Refer to Section 6.3.14: I/O port characteristics for more details on the input/output alternate
function characteristics (NSS, SCK, MOSI, MISO for SPI).
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fADC = 72 MHz
0.19 - 8.52 s
Total conversion time Resolution = 12 bits
tCONV(1)
(including sampling time) 14 to 614 (tS for sampling + 12.5 for
Resolution = 12 bits 1/fADC
successive approximation)
(VSSA +
Common Mode Input (VSSA+VREF+)/2 (VSSA +
CMIR ADC differential mode VREF+)/2 V
signal -0.18 VREF+)/2
+ 0.18
1. Data guaranteed by design, not tested in production.
Figure 27. ADC typical current consumption in single-ended and differential modes
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1. The DAC integrates an output buffer that can be used to reduce the output impedance and to drive external
loads directly without the use of an external operational amplifier. The buffer can be bypassed by
configuring the BOFFx bit in the DAC_CR register.
VDDA 2.7 V - 5 10
VOFFSET Comparator offset error mV
VDDA < 2.7 V - - 25
TVOFFSET Total offset variation Full temperature range - - 3 mV
COMP current
IDD(COMP) - - 400 600 A
consumption
1. Guaranteed by design, not tested in production.
2. For more details and conditions see Figure 31: Maximum VREFINT scaler startup time from power-down.
Rload = min,
VDDA-100 -
Input at VDDA.
VOHSAT High saturation voltage(2)
Rload = 20K,
VDDA-20 -
Input at VDDA.
mV
Rload = min,
- - 100
input at 0 V
VOLSAT Low saturation voltage
Rload = 20K,
- - 20
input at 0 V.
m Phase margin - - 62 -
Offset trim time: during calibration,
tOFFTRIM minimum time needed between two - - - 2 ms
steps to have 1 mV accuracy
CLOAD 50 pf,
RLOAD 4 k,
tWAKEUP Wake up time from OFF state. - 2.8 5 s
Follower
configuration
tS_OPAM_VOUT ADC sampling time when reading the OPAMP output 400 - - ns
- 2 - -
- 4 - -
PGA gain Non inverting gain value -
- 8 - -
- 16 - -
Gain=2 - 5.4/5.4 -
@ 1KHz, Output
loaded with - 109 -
4 K
7 Package information
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samples in production. ST Quality has to be contacted prior to any decision to use these Engineering
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A1 0.050 - 0.150 0.0020 - 0.0059
A2 1.350 1.400 1.450 0.0531 0.0551 0.0571
b 0.170 0.220 0.270 0.0067 0.0087 0.0106
c 0.090 - 0.200 0.0035 - 0.0079
D 8.800 9.000 9.200 0.3465 0.3543 0.3622
D1 6.800 7.000 7.200 0.2677 0.2756 0.2835
D3 - 5.500 - - 0.2165 -
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samples in production. ST Quality has to be contacted prior to any decision to use these Engineering
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A1 0.050 - 0.150 0.0020 - 0.0059
A2 1.350 1.400 1.450 0.0531 0.0551 0.0571
b 0.170 0.220 0.270 0.0067 0.0087 0.0106
c 0.090 - 0.200 0.0035 - 0.0079
D 11.800 12.000 - - 0.4724 -
D1 9.800 10.000 - - 0.3937 -
E - 12.000 - - 0.4724 -
E1 - 10.000 - - 0.3937 -
e - 0.500 - - 0.0197 -
0 3.5 7 0 3.5 7
L 0.450 0.600 0.750 0.0177 0.0236 0.0295
L1 - 1.000 - - 0.0394 -
Number of pins
N
64
1. Values in inches are converted from mm and rounded to 4 decimal digits.
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samples in production. ST Quality has to be contacted prior to any decision to use these Engineering
samples to run qualification activity.
8 Part numbering
Device family
STM32 = ARM-based 32-bit microcontroller
Product type
F = general-purpose
Device subfamily
334 = STM32F334xx, 2.0 to 3.6 V operating voltage
Pin count
K = 32 pins
C = 48 pins
R = 64 pins
Flash memory size
4 = 16 Kbytes of Flash memory
6 = 32 Kbytes of Flash memory
8 = 64 Kbytes of Flash memory
Package
T = LQFP
Temperature range
6 = Industrial temperature range, 40 to 85 C
7 = Industrial temperature range, 40 to 105 C
Options
xxx = programmed parts
TR = tape and reel
9 Revision history
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