Motorola Moto E 2nd Gen XT1527-Sample

Report Information
Report Publish Date Jun-15

SI Number SI39521
Analyst Name T.Mate
Product Description
Product Type Smartphone
Brand Motorola
Device Name Moto E 2nd Gen
Device Model # XT1527
Official Release Date 2/1/2015
Target Market USA
Retail Price $149.99
Weight (grams) 144.0 (Measured)
Device Dimensions 130.2 x 67.2 x 12.3 (Measured at
(mm) Longest/Widest/Thickest Points)
Product Features
Operating System Android 5.0 Lollipop
Processor Spec 1.2 GHz Quad-Core Processor
RAM Support 1 GHz DDR3 SDRAM
Quad-Band GSM/EDGE,
Communications WCDMA/HSPA+ (850/1700/1900/2100),
LTE (700/850/1700/1900/2100/2600)
Connectivity WiFi 802.11 b/g/n, Bluetooth 4.0 LE
User Interface Capacitive Touchscreen
Internal: 8 GB MLC NAND Flash
Learn more... Storage
External: MicroSD Card Slot
DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes Sensors Accelerometer (x2), Ambient Light/Proximity
only and may be registered trademarks, trademarks, or service marks of their respective owners. All analyses are done
without participation, authorization, or endorsement of the manufacturer. Any cost analyses presented in this material are Battery Type 3.8 V, 2240 mAh, Lithium Polymer
estimates prepared by TechInsights from generally available data. While TechInsights believes that these estimates reflect
the probable costs, the actual producer did not supply the data, and therefore the actual costs may be different from these Battery Life (Hrs) Use Time: 16.5 ; Standby Time: 60
estimates. Furthermore, TechInsights extends no warranties with respect to any information in this document, and shall
Main Display 4.5 inch, 960 X 540 Pixels, 16M Colors
bear no liability whatsoever for the use of the information.
Front Camera VGA
Copyright 2015, TechInsights. All rights reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit,
download to a shared database, or otherwise copy, transfer, sell, publish, or send this material, or any portion thereof, by Rear Camera 5 MP CMOS BSI, Autofocus
any means without the express written permission of TechInsights.
Deep Dive Teardown

Deep Dive Teardown
Device Analysis
Motorola Moto E 2nd Gen XT1527 SI39521-TMb Design Wins
Design Wins Device Observations

Function Manufacturer Part Number
Qualcomm came away with the design win for this version of the Moto E 2nd Gen mobile phone. There are
Application / MSM8916 - two Rohm Kionix #KXCJ9 accelerometers and a new mixed memory package with 8 GB of NAND Flash and 1
Qualcomm
Baseband Processor Snapdragon 410 GB of SDRAM #MT29TZZZ8D5BKFAH-125 W.95K from Micron. We are starting to see more of these memory
RAM MT29TZZZ8D5BKFAH- package types in our mobile teardowns.
Micron
ROM 125 W.95K
Some new IC components teardown.com has not seen include the STMicro ARM-Based 32-Bit Microcontroller
Power Management (Sensor Hub), the two Rohm Kionix accelerometers, and the Qualcomm Multimode RxD Transceiver + GPS/
Qualcomm PM8916
Audio CODEC GLONASS/BEIDOU.
RF Transceiver Qualcomm WTR4905
Efforts were made to make the device water resistant such as tape over microphone ports and the gaskets
Accelerometer (x2) Rohm Kionix KXCJ9
around the micro USB port and between the top and bottom enclosure. However, the device should not be
MCU Sensor Hub STMicroelectronics STM32L051K8U6D mistaken as water proof.
Touchscreen Controller Synaptics S2316B
The main board substrate had many spare, vacant sockets (or land patterns) leading to the determination
this PCB will be likely used again for other versions of the phone for different regions in the world or cellular
coverage abilities.
The Motorola Moto E XT1527 integrates the touchscreen into the glass display panel, simplifying construction
and reducing the supply chain. Traditionally the touch panel is a separate component attached to the display
glass panel or integrated into the front display window.
The four antennas were plated directly onto the exterior side of back plastic enclosure with plated through-holes
to the interior of the device. The antennas were painted over so X-Ray images were taken for better visibility.
Design Wins Analysis Summary Cost Drivers 2
Front Page Device Analysis Product Label Supporting Materials Block Diagrams Features Components Teardown Photos Antennas Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion
Deep Dive Teardown
Device Analysis
Motorola Moto E 2nd Gen XT1527 SI39521-TMb Analysis Summary
Integrated Circuit Metrics The Motorola Moto E XT1527 is the 2nd generation of the Moto E series at the $150 price tag. Like the Moto E
XT1021, the only feature missing is the NFC function.
IC Die Count** 46
Improvements from the 1st generation Moto E includes a replaceable battery, forward facing camera and an
IC Package Count** 32 auto focus feature for the rear facing 5 MP camera.
Cost Metrics The 28 nm transceiver (shown below) is new to the market and a component we at Teardown.com have only
seen in the Survey Plus report of the Samsung Galaxy A3 being released soon.
Retail Price $149.99
Total Manufacturing Cost* $103.99
Electronics Cost** $70.11 Qualcomms latest 28 nm
Manufacturing Cost Breakdown Transceiver - WTR4905
Integrated Circuits $37.49 36.1%
Modules, Discretes & Connectors $11.30 10.9%
Substrates $3.95 3.8%
Component Insertion $4.08 3.9%
Card Test $1.96 1.9%
Battery Subsystem $4.67 4.5%
Display Subsystem $25.76 24.8%
Rear Camera Subsystem $6.35 6.1%
Non-Electronic Parts $6.43 6.2%
Final Assembly & Test $2.00 1.9%
Total $103.99 100.0%
*Excluding Supporting Materials' Cost

**Including Subsystems
Deep Dive Teardown
Device Analysis
Motorola Moto E 2nd Gen XT1527 SI39521-TMb Cost Drivers
Pin
Component Piece Extended Pin Count,
Item Function Location Description Pkg Form Qty Count, IC Ref # Pkg Brand Pkg PN Category
Category Cost Cost Each*
Total
113 Display/Touchscreen Module $25.7551 Display / Touchscreen
5 Applications / Baseband Main Board - Side 1 IC Snapdragon 410 Baseband / Applications Processor BGA 1 $14.6600 $14.6600 759 759 Main - IC.24 Qualcomm MSM8916 Applications/Baseband Processor
24 Memory: Mixed Main Board - Side 1 IC Multichip Memory - 8 GB MLC NAND Flash, 1 GB LPDDR3 SDRAM, Memory Controller (eMMC) BGA Stacked 5 1 $10.8300 $10.8300 229 229 Main - IC.25 Micron MT29TZZZ8D5BKFAH-125 W.95K Memory: Mixed
114 5 MP BSI Camera Module $6.3471 Camera / Image
112 Battery Pack $4.6705 Battery
115 Enclosures Back Enclosure 1 $4.3600 $4.3600 Non-Electronics
146 Insertion $4.0798 Final Assembly & Test
142 Main Board 6 Layer Buildup FR4 / HF $3.5400 Unitech Substrates
91 RF Component Main Board - Side 1 IC Multimode RxD Transceiver + GPS/GLONASS/BEIDOU Flip Chip, Solder 1 $2.7500 $2.7500 60 60 Main - IC.22 Qualcomm WTR4905 RF Component
145 Final Assembly & Test $2.0000 Final Assembly & Test
$105.41
$1.40
$3.95
$100.00
$2.27
$6.96
$2.97
$7.99
Supporting Materials
$80.00 Substrates
$6.43
Sensor
RF Component
$10.83
Power Management / Audio
$60.00 Other
$8.04
Non-Electronics
Memory: Mixed
Final Assembly & Test

$25.76 Display / Touchscreen
$40.00
Connectivity
Camera / Image
$1.63
Battery
$7.85
$20.00 Applications/Baseband Processor
$4.67
$14.66
$0.00
Motorola Moto E 2nd Gen XT1527
Deep Dive Teardown
Product Label
Motorola Moto E 2nd Gen XT1527 SI39521-TMb
Deep Dive Teardown
Supporting Materials
Total Estimated
Cost of Supporting Materials: $1.40
Packaging - $0.15
550 mA / 5 V AC Adapter
w/ USB Cable - $1.20
Documentation - $0.05
Deep Dive Teardown
Block Diagram
Motorola Moto E 2nd Gen XT1527 SI39521-TMb Radio Block
Main 1 Main 2 RxD
Power Detect
Coupler Coupler 23 - Qorvo
#RF1660
SP10T Diversity Antenna Switch
DIPL 19 - Qorvo
#RF1494A
SP10T Antenna Switch
B12/17
B7 DUPL DUPL B4 DUPL B5 DUPL
GSM Tx
17 - Skyworks 21 - Skyworks
#SKY77781-11 #SKY77631-11 B2 DUPL
GSM 1800 Rx
LTE Band 7 PA Multimode, Multiband PA
GSM 850 Rx
GSM 900 Rx
B12/17 RxD
1900 Rx
GSM
B2 RxD
B4 RxD
B5 RxD
B7 RxD
30 - Skyworks 30 - Skyworks 30 - Skyworks
#SKY13350-385LF #SKY13350-385LF #SKY13350-385LF
SPDT GaAs Switch SPDT GaAs Switch SPDT GaAs Switch
22 - Qualcomm
#WTR4905
Multimode RxD Transceiver + GPS/GLONASS/BEIDOU
Manufacturer:
Murata
To MSM8916
Qorvo
Qualcomm
Skyworks
Taiyo Yuden Estimated block diagram based on observation of this specific product implementation, manufacturers data
Unknown sheets where available, and best engineering judgment. Certain details of the interface circuitry are not
reflected in this block diagram. Partitioning and connectivity are speculative.
Radio Block System Block 7
Deep Dive Teardown
Block Diagram
Motorola Moto E 2nd Gen XT1527 SI39521-TMb System Block
Manufacturer: WiFi/BT/GPS Unknowm 2 - Samsung

#Unknown #S5K5E2
AMS VGA Camera 5 MP BSI CMOS Image Sensor
Fairchild Semiconductor
Hosiden 5MP Camera
Maxim 3 - Rohm
Micron #BH64240GWZ
Novatek Autofocus VCM Driver
NXP
Qualcomm
Rohm 5 - Synaptics
#S2316B
Samsung Capacitive
STMicro 9 - NXP Semiconductor Touchscreen Controller
Synaptics #BGU8009
Taiyo Yuden GPS/GLONASSBEIDOU LNA
Unknown 20 - Rohm
#BD65B60GWL
To WTR4905 White LED Driver
8 - Qualcomm Atheros 4 - Novatek
#WCN3620 #NA01448
WiFi 802.11b/g/n TFT-LCD Display Driver
Bluetooth 4.0 / FM Radio
Vibrator
6 - Hosiden
#KRM5200
24 - Qualcomm MEMS Microphone
To WTR4905 13 - Qualcomm
#MSM8916 #PM8916
Snapdragon 410 Baseband Power Management + Audio CODEC
Applications Processor 6 - Hosiden
#KRM5200
Speaker MEMS Microphone
25 - Micron Earpiece
M
SI
#MT29TZZZ8D5BKFAH-125 W.95K Headset

8 GB MLC NAND Flash, 1 GB LPDDR3 SDRAM
16 - Maxim
microSD #MAX17050
11 Rohm Kionix 10 - STMicroelectronics Fuel Gauge
#KXCJ9 #STM32L051K8U6D
Battery
11 Rohm
3-Axis Kionix
MEMS Accelerometer ARM-Based 32-Bit MCU (Sensor Hub)
#KXCJ9
3-Axis MEMS Accelerometer 14 - Fairchild Semiconductor
#FAN54053
1.55 A Battery Charger
w/ Power Path
29 - AMS
#TMD2771x
Ambient Light / Proximity Sensor, IR Emitter LED Estimated block diagram based on observation of this specific product implementation, manufacturers data
sheets where available, and best engineering judgment. Certain details of the interface circuitry are not
reflected in this block diagram. Partitioning and connectivity are speculative.
Radio Block System Block 8
Deep Dive Teardown
Features
Motorola Moto E 2nd Gen XT1527 SI39521-TMb Exterior Features
Forward Facing VGA Camera

Speaker/Earpiece
Proximity/Light
Sensor
Micro USB Port
Exterior Features Backlights 9
Deep Dive Teardown
Features
Motorola Moto E 2nd Gen XT1527 SI39521-TMb Exterior Features 2
5MP Camera
Volume Button
Power Button
Headphone Jack
Deep Dive Teardown
Features
Motorola Moto E 2nd Gen XT1527 SI39521-TMb Backlights
Deep Dive Teardown
Components
Motorola Moto E 2nd Gen XT1527 SI39521-TMb Major Components Side 1
Major Components Main Enclosures Component Arrangement 12
Deep Dive Teardown
Components
Motorola Moto E 2nd Gen XT1527 SI39521-TMb Major Components Side 2
Deep Dive Teardown
Components
Motorola Moto E 2nd Gen XT1527 SI39521-TMb Main Enclosures Side 1
Main Non-Electronics
Part ID2 Main Non-Electronics
Back Enclosure Frame Part ID3
Main Non-Electronics (Available in a Variety of Internal Plate
Part ID1 Interchangeable Colors)
Back Enclosure
(w/ 4 Plated Antennas
Along the Perimeter)
Deep Dive Teardown
Components
Motorola Moto E 2nd Gen XT1527 SI39521-TMb Main Enclosures Side 2
Main Non-Electronics
Part ID2 Main Non-Electronics
Back Enclosure Frame Part ID3
Main Non-Electronics (Available in a Variety of Internal Plate
Part ID1 Interchangeable Colors)
Back Enclosure
(w/ 4 Plated Antennas
Along the Perimeter)
Deep Dive Teardown
Components
Motorola Moto E 2nd Gen XT1527 SI39521-TMb Component Arrangement
Deep Dive Teardown
Teardown
Motorola Moto E 2nd Gen XT1527 SI39521-TMb Photo 1
17
Deep Dive Teardown
Teardown
In order to access the MicroSD and

Micro-SIM slots this outer ring must
be unsnapped and removed.
MicroSD Card Slot
Micro-SIM Card Slot
Secondary Micro-SIM Card Slot

(Covered with a Blank Cover)
Headphone Jack
18
Deep Dive Teardown
Teardown
Button Contacts
IMEI Label Inserted Micro USB

Port
19
Deep Dive Teardown
Teardown
20
Deep Dive Teardown
Teardown
21
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Teardown
22
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Teardown
23
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Teardown
24
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Teardown
25
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Teardown
26
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Teardown
27
Deep Dive Teardown
Antennas
Motorola Moto E 2nd Gen XT1527 SI39521-TMb Main
Main
Antenna 1 Element
Length Width Height
30.4 mm 15.3 mm 4.6 mm
Main Main 2 RxD WiFi/BT/GPS 28
Deep Dive Teardown
Antennas
Motorola Moto E 2nd Gen XT1527 SI39521-TMb Main Antenna 2
Main
Antenna 2 Element
Length Width Height
34.1 mm 14.4 mm 4.6 mm
Deep Dive Teardown
Antennas
Motorola Moto E 2nd Gen XT1527 SI39521-TMb Rx Diversity
RxD
Antenna Element
Length Width Height
23.8 mm 13.2 mm 3.7 mm
Deep Dive Teardown
Antennas
Motorola Moto E 2nd Gen XT1527 SI39521-TMb WiFi / Bluetooth / GPS
WiFi/Bluetooth/GPS
Antenna Element
Length Width Height
20.2 mm 7.3 mm 3.5 mm
Component Function Guide
Deep Dive Teardown
In both the 2015 Deep Dive and Survey Plus reports, ICs and modules will be categorized by their function within the
system.
These categories are in alignment with the high-level IC function categories currently found in IRIS 2.0. The categories
will also be found in the updated excel BoM workbooks which are included with each report.
Component Function
Applications/Baseband Processor Processors which are both Apps/BB Processors
Application Processor Main Processor without cellular modem

Baseband Processor Cellular Modem Processor
Camera / Image Image Sensors, Video processors, Image co-processors , VGA Camera
Connectivity Antennas, Bluetooth, GPS, USB, WiFi, ZigBee components
Display / Touchscreen Display driver, Touchscreen controller, etc.
Logic CPLD, FPGA, PLA, PLD
Memory: Mixed Components with both non-volatile and volatile memory
Memory: Non-Volatile NAND, NOR, EEPROMs, etc.
Memory: Volatile RAM, SDRAM, etc.
Mixed Signal DSPs, MCUs, Mixed-Signal Arrays, (non-audio, non-apps, non-
baseband) Processors
Other Small logic AND, OR gates, LDOs, Transistors, Regulators
Power Management / Audio Audio CODECs, Battery Protection, Battery Charger, Battery Gauge,
Envelope Tracking, MEMS Microphones, Power Management
RF Component Diplexers, RF Antenna, RF antenna switches, RF Filters, RF Power
Amplifiers, RF Receivers, RF Transceivers, etc.
Sensor Accelerometer, Barometer, Heart, Pressure, Temperature
32
Deep Dive Teardown
Subsystems
Motorola Moto E 2nd Gen XT1527 SI39521-TMb Battery Summary
Battery Pack
Pack Brand Hanrim Postech Electronics
Pack Part Number FT40
Pack Voltage 3.8
Cell Type Lithium Polymer
Pack Rating (mAHrs) 2240
Pack Size (mm) 81.7 x 48 x 4.19
Vol. Energy Density (mWHrs/cc) 518.0
Pack Weight (grams) 39.1
Wt. Energy Density (mWHrs/g) 217.7
Cell Brand LG Chemical
Cell $2.50
Electronic Parts $0.29
Non-electronic Parts $0.20
Estimated Costs
Assembly $0.18
Test $0.11
Gross Margin $1.40
Estimated Pack Price $4.67
A full Subsystem Bill of Materials is

provided in the included BoM workbook.
Battery Display / Touchscreen Rear Camera 33
Deep Dive Teardown
Subsystems
Motorola Moto E 2nd Gen XT1527 SI39521-TMb Battery
Deep Dive Teardown
Subsystems
Motorola Moto E 2nd Gen XT1527 SI39521-TMb Battery IC Identification
1 - ITM Semiconductor
#MP59AF
Battery Protection w/ Dual MOSFET (2-Die Pkg.)
Component Function:
Deep Dive Teardown
Subsystems
Motorola Moto E 2nd Gen XT1527 SI39521-TMb Display / Touchscreen Summary
Display/Touchscreen Module
Brand Unknown
Part Number BV045SQM
Module Dimensions 125.5 x 62.7 x 2.8
Weight (grams) 42.50
View Size (mm) 98.9 x 56
Type TFT w/ Touchscreen
Panel Metrics Colors 16777216
Rows / Columns 960 / 540
Backlighting Scheme 8 White LEDs
Panel $5.23
Circuit Assembly $0.33
Estimated Costs Non-Electronic Parts $4.35
Final Assembly $0.25
Test $0.50
Gross Margin $7.73
Estimated Module Price $25.76

Deep Dive Teardown
Subsystems
Motorola Moto E 2nd Gen XT1527 SI39521-TMb Display / Touchscreen Disassembly
Deep Dive Teardown
Subsystems
Deep Dive Teardown
Subsystems
Deep Dive Teardown
Subsystems
Deep Dive Teardown
Subsystems
Motorola Moto E 2nd Gen XT1527 SI39521-TMb Display / Touchscreen IC Identification
4 - Novatek 5 - Synaptics
#NA01448 #S2316B
TFT-LCD Display Driver Capacitive Touchscreen Controller
Display Flex
Backlight Flex (8 LEDs) Component Function:

Touchscreen Flex Display / Touchscreen
Display Panel
Deep Dive Teardown
Subsystems
Motorola Moto E 2nd Gen XT1527 SI39521-TMb 5 MP Camera Summary
5 MP BSI Camera Module

Brand Unknown
Part Number 4C2611C119557
Subsystem Size (mm) 11.3 x 10.9 x 4.6
Camera Size (mm) 11.3 x 10.9 x 4.6
Subsystem Weight (grams) 0.6
Camera Weight (grams) 0.6
Type CMOS BSI
Resolution 5 MP
Optical Size 1/5
Lens Elements 4
Optical Zoom 1
Non-Electronic Parts $1.03
Estimated Costs Assembly $0.22
Test $0.15
Gross Margin $2.54
Estimated Module Price $6.35

Deep Dive Teardown
Subsystems
Motorola Moto E 2nd Gen XT1527 SI39521-TMb 5 MP Camera IC Identification
2 - Samsung
#S5K5E2
5 MP BSI CMOS Image Sensor
3 - Rohm
Component Function:
#BH64240GWZ Camera / Image
Autofocus VCM Driver
Deep Dive Teardown
Main Board
Motorola Moto E 2nd Gen XT1527 SI39521-TMb Side 1
121.1 mm
VGA Camera Battery Connector
58.3 mm
Earpiece
Contacts
Micro-SIM Card Slot

MicroSD Card Slot
Display/Touchscreen ZIF
Micro USB Port
Assembly IC Identification Radio ICs Sensors X-Rays & Die Photos Radio Modules
Side 1 Side 2 Cross-section 44
Deep Dive Teardown
Main Board
Motorola Moto E 2nd Gen XT1527 SI39521-TMb Side 1 IC Identification
7 - Rohm 10 - STMicroelectronics 13 - Qualcomm 14 - Fairchild Semiconductor 16 - Maxim 6 - Hosiden

#BU12UA3WNVX #STM32L051K8U6D #PM8916 #FAN54053 #MAX17050 #KRM5200
300 mA / 1.2 V ARM-Based 32-Bit Microcontroller Power Management 1.55 A Battery Charger Fuel Gauge MEMS Microphone
LDO Regulator (64 KB Flash, Sensor Hub) + Audio CODEC w/ Power Path (2-Die Pkg.)
6 - Hosiden
#KRM5200
MEMS Microphone
(2-Die Pkg.)
26 - Rohm 18 - Qualcomm
#BU2JTH5WNVX #SMB070A
500 mA / 2.85 V DC-DC Converter ?
LDO Regulator
20 - Rohm
#BD65B60GWL
White LED Driver
25 - Micron 24 - Qualcomm
#MT29TZZZ8D5BKFAH-125 W.95K #MSM8916
Multichip Memory - 8 GB MLC NAND Flash, Snapdragon 410 Baseband
1 GB LPDDR3 SDRAM, Memory Controller (eMMC) / Applications Processor
Component Function:
Applications & Baseband Processor
Memory: Mixed
Mixed Signal
Power Management / Audio ? = Unconfirmed
Other
Deep Dive Teardown
Main Board
Motorola Moto E 2nd Gen XT1527 SI39521-TMb Side 1 ICs - Radio
8 - Qualcomm Atheros 9 - NXP Semiconductor 22 - Qualcomm 17 - Skyworks

#WCN3620 #BGU8009 #WTR4905 #SKY77781-11
WiFi 802.11b/g/n / Bluetooth 4.0 / FM Radio GPS/GLONASS/BEIDOU LNA Multimode RxD Transceiver LTE Band 7 Power
+ GPS/GLONASS/BEIDOU Amplifier (2-Die Pkg.)
30 - Skyworks
#SKY13350-385LF
SPDT GaAs Switch
19 - Qorvo
#RF1494A
23 - Qorvo 21 - Skyworks
#RF1660 #SKY77631-11
SP10T Diversity Antenna Switch Multimode, Multiband Power
Amplifier (5-Die Pkg.)
Component Function:
RF Component
Connectivity
Deep Dive Teardown
Main Board
Motorola Moto E 2nd Gen XT1527 SI39521-TMb Side 1 ICs - Sensors
11 - Rohm Kionix
#KXCJ9
3-Axis MEMS Accelerometer (2-Die Pkg.)
11 - Rohm Kionix
#KXCJ9
3-Axis MEMS Accelerometer (2-Die Pkg.)
Component Function:
Sensor
Deep Dive Teardown
Main Board
Motorola Moto E 2nd Gen XT1527 SI39521-TMb Side 1 X-Rays & Die Photos
8 - Qualcomm Atheros
#WCN3620
WiFi 802.11b/g/n / Bluetooth 4.0 / FM Radio
Pkg Size: 3.56 x 3.33 mm
8.1 - Qualcomm Atheros

#HG11-NB563-112
WiFi 802.11b/g/n / Bluetooth 4.0 / FM Radio
Die Size: 3.56 x 3.33 mm
Component Function:
Connectivity
Deep Dive Teardown
Main Board
13 - Qualcomm
#PM8916
Power Management + Audio CODEC
13.1 - Qualcomm
#HG11-NH472-200
Power Management
Component Function:
Deep Dive Teardown
Main Board
17 - Skyworks
#SKY77781-11
LTE Band 7 Power
Pkg Size: 2.48 x 2 mm
17.1 - Skyworks
#PK1046
Bias Control
17.2 - Skyworks
#ZH032_001
RF Power Amplifier
Component
Function:
RF Component
Deep Dive Teardown
Main Board
17 - Skyworks
#SKY77781-11
LTE Band 7 Power
Pkg Size: 2.48 x 2 mm
17.1 - Skyworks
#PK1046
Bias Control
17.2 - Skyworks
#ZH032_001
RF Power Amplifier
Component
Function:
RF Component
Deep Dive Teardown
Main Board
19 - Qorvo
#RF1494A
19.1 - Qorvo
#M1D1496A23
Filter
Component Function:
RF Component
Deep Dive Teardown
Main Board
19 - Qorvo
#RF1494A
19.1 - Qorvo
#M1D1496A23
Filter
Component Function:
RF Component
Deep Dive Teardown
Main Board
21 - Skyworks 21.3 - Skyworks 21.5 - Skyworks
#SKY77631-11 #ZG028_203 #PK1008
Multimode, Multiband Power Amplifier (5-Die Pkg.) RF Power Amplifier Bias Control
Pkg Size: 7 x 5 mm Die Size: 1.27 x 0.73 mm Die Size: 0.59 x 0.51 mm
21.4 - Skyworks
#PK1020 02
Power Amplifier Controller
21.1 - Skyworks
#94054_001
RF Power Amplifier
21.2 - Skyworks
#PK5004 01
Antenna Switch
Component
Function:
RF Component
Deep Dive Teardown
Main Board
21 - Skyworks 21.3 - Skyworks 21.5 - Skyworks
#SKY77631-11 #ZG028_203 #PK1008
Multimode, Multiband Power Amplifier (5-Die Pkg.) RF Power Amplifier Bias Control
Pkg Size: 7 x 5 mm Die Size: 1.27 x 0.73 mm Die Size: 0.59 x 0.51 mm
21.4 - Skyworks
#PK1020 02
Power Amplifier Controller
21.1 - Skyworks
#94054_001
RF Power Amplifier
21.2 - Skyworks
#PK5004 01
Antenna Switch
Component
Function:
RF Component
Deep Dive Teardown
Main Board
22 - Qualcomm
#WTR4905
22.1 - Qualcomm
#HG11-NH40B-200
Component Function:
RF Component
Deep Dive Teardown
Main Board
23 - Qorvo
#RF1494A
23.1 - Qorvo
#M1D1496A23
Component Function:
RF Component
Deep Dive Teardown
Main Board
23 - Qorvo
#RF1494A
23.1 - Qorvo
#M1D1496A23
Component Function:
RF Component
Deep Dive Teardown
Main Board
24 - Qualcomm
#MSM8916
Snapdragon 410 Baseband / Applications Processor
Pkg Size: 14 x 12 mm
24.1 - Qualcomm
#HG11-NK586
Snapdragon 410 Baseband / Applications Processor
Component Function:
Deep Dive Teardown
Main Board
24 - Qualcomm
#MSM8916
Snapdragon 410 Baseband
/ Applications Processor
Pkg Size: 14 x 12 mm
24.1 - Qualcomm
#HG11-NK586
Snapdragon 410 Baseband
/ Applications Processor
Component Function:
Deep Dive Teardown
Main Board
25 - Micron 25.3 - Micron

#MT29TZZZ8D5BKFAH-125 W.95K #L83A
Multichip Memory - 8 GB MLC NAND Flash, 1 GB LPDDR3 SDRAM, Memory Controller (eMMC) (5-Die Pkg.) MLC NAND Flash Memory - 4 GB
Pkg Size: 12.97 x 11.48 mm Die Size: 9.09 x 7.96 mm
25.1 - PHISON Electronics Corp.

#PS8210
Memory Controller
25.2 - Micron
#ECF440AAC
Mobile LPDDR3 SDRAM Memory - 512 MB
Component Function:
Memory: Mixed
Memory: Non-Volatile
Memory: Volatile
Other
Deep Dive Teardown
Main Board
25 - Micron 25.3 - Micron
#MT29TZZZ8D5BKFAH-125 W.95K #L83A
Multichip Memory - 8 GB MLC NAND Flash, 1 GB LPDDR3 SDRAM, Memory Controller (eMMC) (5-Die Pkg.) MLC NAND Flash Memory - 4 GB
Pkg Size: 12.97 x 11.48 mm Die Size: 9.09 x 7.96 mm
25.1 - PHISON Electronics Corp.

#PS8210
Memory Controller
25.2 - Micron
#ECF440AAC
Mobile LPDDR3 SDRAM Memory - 512 MB
Component Function:
Memory: Mixed
Memory: Non-Volatile
Memory: Volatile
Other
Deep Dive Teardown
Main Board
Motorola Moto E 2nd Gen XT1527 SI39521-TMb Side 1 Modules - Radio
18 - Taiyo Yuden 19 - Taiyo Yuden 20 - Murata 21 - Mfr. Unknown

#F6QA1G582H2JQ #F6HF2G441AF46 #SAYEY2G53BA0F0A #Unknown
Filter: SAW, GPS Filter: SAW. WiFi/Bluetooth Filter: SAW - Duplexer, Band 7 Filter: Diplexer
30 - Mfr. Unknown
#Unknown 22 - Mfr. Unknown
Filter: Band Pass #Unknown
RF Coupler
31 - Murata
#SAFFB2G65AA0F0A
Filter: SAW, Band 7 RxD
23 - Taiyo Yuden
32 - Taiyo Yuden #D5DA737M5K2H2
#F5QA737M5M2QN Filter: SAW - Duplexer,
Filter: SAW, Band 12/17 RxD Band 12/17
33 - Taiyo Yuden 24 - Murata

#F6QA1G582H2JM #Unknown
Filter: SAW, GPS Filter: SAW -
Duplexer, Band 4 ?
36 - Murata
#SAFFB1G96AB0F0A
22 - Mfr. Unknown
35 - Taiyo Yuden #Unknown
#F6QA2G140M2AM RF Coupler
26 - Murata
34 - Murata #SAFFB1G84AB0F0A
#SAFFB881MAN0F0A Filter: SAW,
Filter: SAW, Band 5 RxD GSM 1800 Rx
29 - Murata
#SAFFB942MAN0F0A
Filter: SAW, GSM 900 Rx
28 - Murata
#SAYEY836MBA0F0A
Filter: SAW - Duplexer, Band 5
Component Function:
RF Component 27 - Taiyo Yuden
Connectivity ? = Unconfirmed #D6PF1G960M3B9
Filter: SAW - Duplexer, Band 2
Deep Dive Teardown
Main Board
Motorola Moto E 2nd Gen XT1527 SI39521-TMb Side 2
RxD
Vibrator Main MicroUSB
Antenna
Antenna 1 Port
Sensor
Flex ZIF
5 MP Camera
Socket
Main
Speaker Antenna 1
Contacts
WiFi/Bluetooth/GPS
Antenna
Assembly IC Identification
Deep Dive Teardown
Main Board
Motorola Moto E 2nd Gen XT1527 SI39521-TMb Side 2 IC Identification
27 - Rohm 28 - NXP Semiconductor

#BU2JTH5WNVX #PUSB3TB6
500 mA / 2.85 V LDO Regulator 6-Ch. ESD Protection
Component Function:
Other
Assembly IC Identification
Deep Dive Teardown
Main Board
Motorola Moto E 2nd Gen XT1527 SI39521-TMb Cross-Section
Deep Dive Teardown
Other Substrates
Motorola Moto E 2nd Gen XT1527 SI39521-TMb Sensor Flex
Main Board Connection
Headset Jack Contacts
20.3 mm
25.7 mm
29 - AMS
#TMD2771x
Ambient Light / Proximity Sensor, IR Emitter LED
Component Function:
Sensor
67
Deep Dive Teardown
Summaries
Motorola Moto E 2nd Gen XT1527 SI39521-TMb Substrate Data
Substrates
Min. Min.
ThruVia ThruVia BlindVia BlindVia
Assembly Area Trace Trace Thickness Routing Estimated
Manufacturer Core Material Mfg. Technology Layers Land Dia Hole Dia Land Dia Hole Dia
Name (cm) Pitch Width (mm) Density Costs
(mm) (mm) (mm) (mm)
(mm) (mm)
Main Board Unitech FR4 6 Layer Buildup FR4 / HF 6 70.6 0.15 0.05 0.25 0.10 0.6 41.9 $ 3.54
Sensor Flex Unknown Polyimide 2 Layer Flex w/Vias 2 2.5 0.10 0.04 0.30 0.07 0.1 17.2 $ 0.41
Substrate Data Assembly Metrics Cost by Assembly Component Costs Counts by Assembly IC Metrics IC Mfr. Distribution Non-Electronics Assembly Cost Total 68
Deep Dive Teardown
Summaries
Motorola Moto E 2nd Gen XT1527 SI39521-TMb Electronic Assembly Metrics
Electronic Assembly Metrics

by Assembly
(cm of routing per sq.cm of
(Components/sq.cm)
(Connections/sq.cm)
Component Density
Connection Density
Assembly Weight
Routing Density
General Area Assembly Name
Avg. Pin Count

Substrate Area
Components
Connections
Metal Layers
Circuit Area
Number of
Number of
substrate)
(grams)
(sq.cm)
(sq.cm)
Main Electronics Main Board 70.60 6 423.6 41.9 720 3147 10.2 44.6 4.4 18.80
Main Electronics Sensor Flex 2.46 2 4.9 17.2 9 27 3.7 11.0 3.0 0.20
Main Electronics Totals 73.06 8 428.5 729 3174 10.0 43.4 4.4 19.00
Subsystem Electronics Battery Pack: Battery Board 1.62 4 6.5 16.3 11 23 6.8 14.2 2.1 0.60
Subsystem Electronics 5 MP BSI Camera Module: Camera Board 0.72 5 3.6 77.2 10 69 13.9 95.8 6.9 0.20
Subsystem Electronics Display/Touchscreen Module: Backlight Flex 1.65 2 3.3 13.2 8 16 4.9 9.7 2.0 0.10
Subsystem Electronics Display/Touchscreen Module: Display Flex 20.60 2 41.2 303.0 34 2673 1.7 129.8 78.6 0.80
Subsystem Electronics Display/Touchscreen Module: Touchscreen Flex 5.27 2 10.5 44.5 5 76 1.0 14.4 15.2 0.40
Subsystem Electronics Totals 29.86 15 65.1 68 2857 2.3 95.7 42.0 2.10
System Totals 102.9 23.0 493.6 797 6031 7.7 58.6 7.6 21.10
NOTE: Occasional inconsistencies in totals may be present due to rounding error.
Deep Dive Teardown
Summaries
Motorola Moto E 2nd Gen XT1527 SI39521-TMb Electronic Cost by Assembly
Electronics Costs by Assembly
Small Active Components
Connector Components
Passive Components
Modular & Odd Form
Integrated Circuits
Components
Substrates
Card Test
Insertion
Total
Main Electronics Main Board $ 57.63 $ 37.23 $ 6.05 $ 0.45 $ 2.77 $ 1.81 $ 3.54 $ 4.02 $ 1.77
Main Electronics Sensor Flex $ 1.15 $ 0.26 $ - $ - $ 0.07 $ 0.15 $ 0.41 $ 0.06 $ 0.19
Main Electronics Totals $ 58.78 $ 37.49 $ 6.05 $ 0.45 $ 2.84 $ 1.96 $ 3.95 $ 4.08 $ 1.96
Subsystem Electronics 5 MP BSI Camera Module $ 2.64 $ 1.47 $ 0.60 $ - $ 0.03 $ - $ 0.31 $ 0.08 $ 0.15
Subsystem Electronics Battery Pack $ 0.49 $ 0.08 $ - $ - $ 0.06 $ 0.11 $ 0.03 $ 0.09 $ 0.11
Subsystem Electronics Display/Touchscreen Module $ 8.20 $ 2.24 $ - $ 0.42 $ 0.14 $ 0.11 $ 4.46 $ 0.33 $ 0.50
Subsystem Electronics Totals $ 11.32 $ 3.79 $ 0.60 $ 0.42 $ 0.23 $ 0.22 $ 4.80 $ 0.50 $ 0.76
System Totals $ 70.11 $ 41.28 $ 6.65 $ 0.87 $ 3.07 $ 2.19 $ 8.75 $ 4.58 $ 2.72
Deep Dive Teardown
Summaries
Motorola Moto E 2nd Gen XT1527 SI39521-TMb Electronic Component Costs
Estimated Cost
of Electronics
(Includes Subsystem Electronics)
$70.11
Cost of Electronics
$70.00
$2.72
$4.58
$60.00 Card Test

$8.75
$2.19
Insertion
$50.00 $3.07
$0.87 Substrates
$6.65
Connector Components
$40.00
Passive Components
$30.00 Small Active Components
Modular & Odd Form Components

$20.00 $41.28 Integrated Circuits
$10.00
$-
Deep Dive Teardown
Summaries
Motorola Moto E 2nd Gen XT1527 SI39521-TMb Electronic Counts by Assembly
Counts by Assembly
Small Active Components

Component Connections
Small Active Component
Connector Connections
Passive Components
Passive Component
Modular/Odd Form
Modular/Odd Form
IC Package Count
IC Connections
Subsystem IOs
Opportunities
Components
Connections
Connections
Connectors
Main Electronics Main Board 26 1543 40 176 24 58 613 1242 17 128 0 3867
Main Electronics Sensor Flex 1 8 0 0 0 0 7 14 1 5 0 36
Main Electronics Totals 27 1551 40 176 24 58 620 1256 18 133 0 3903
Subsystem Electronics 5 MP BSI Camera Module 2 53 1 2 0 0 7 14 0 0 30 109
Subsystem Electronics Battery Pack 1 5 0 0 0 0 7 14 3 4 2 36
Subsystem Electronics Display/Touchscreen Module 2 2668 0 0 9 18 35 70 1 9 41 2853
Subsystem Electronics Totals 5 2726 1 2 9 18 49 98 4 13 73 2998
System Totals 32 4277 41 178 33 76 669 1354 22 146 73 6901
Deep Dive Teardown
Summaries
Motorola Moto E 2nd Gen XT1527 SI39521-TMb IC Metrics
IC Metrics
Number of Package Connections
Die Area/Package Area Ratio
per sq.cm of Package Area

(die area / substrate area)
Substrate Tiling Density
Package Connections
Non-Volatile Memory
IC Package Count
Volatile Memory
Package Area
IC Die Count
(KBytes)
(KBytes)
Die Area
(sq.mm)
(sq.mm)
Main Electronics Main Board 39 26 1543 395.1 0.06 515.6 0.77 299.2 1048576 8388608
Main Electronics Sensor Flex 1 1 8 1.6 0.01 9.9 0.16 80.5 0 0
Main Electronics Totals 40 27 1551 396.6 525.6 0.75 295.1 1048576 8388608
Subsystems 5 MP BSI Camera Module 2 2 53 20.2 27.9 0.72 1.9 0 0
Subsystems Battery Pack 2 1 5 1.8 12.5 0.14 0.4 0 0
Subsystems Display/Touchscreen Module 2 2 2668 32.4 60.7 0.53 44.0 0 0
Subsystem Electronics Totals 6 5 2726 54.3 101.1 0.54 2697.7 0 0
System Totals 46 32 4277 451.0 626.6 0.72 682.6 1048576 8388608
Deep Dive Teardown
Summaries
Motorola Moto E 2nd Gen XT1527 SI39521-TMb IC Manufacturer Distribution
100.00%
Pkg. Brand Cost
13.11% Qualcomm $19.33
90.00% Micron $10.83
Rohm Kionix $1.51
3.31%
Novatek $1.45
3.35%
80.00% Samsung $1.38
3.51%
Qualcomm Atheros $1.37
3.66%
70.00%
Other $5.41
Skyworks $1.31
STMicroelectronics $0.80
60.00% 26.23% Synaptics $0.79
Other
Qorvo $0.69
Hosiden $0.50
50.00%
Qualcomm Atheros
Rohm $0.35
Fairchild Semiconductor $0.30
Samsung
AMS $0.26
40.00% Maxim $0.23
Novatek
NXP Semiconductor $0.10
ITM Semiconductor $0.08
30.00%
Rohm Kionix
46.83%
20.00% Micron
Qualcomm
10.00%
0.00%
Vendor Share %
Deep Dive Teardown
Summaries
Motorola Moto E 2nd Gen XT1527 SI39521-TMb Non-Electronic Cost
Part ID Weight Est'd Cost Est'd
Subsystem Qty Description Fabrication Process Material Dimensions (mm)
No. (grams) Each Extended Cost
1 1 Back Enclosure Molded + Plated + Pulls + Painted + Printed PC (XANTAR 3735C) 129.11 x 66.54 x 12.86 22.90 4.360 4.360
Enclosures
2 1 Back Enclosure Frame Molded + Pulls Plastic 129.4 x 68.12 x 8.31 3.00 0.520 0.520
3 1 Internal Plate Stamped + Formed + Printed Metal 106 x 57.54 x 1.4 2.60 0.150 0.150
4 1 Upper Board Support Stamped + Formed + Co-molded + Pulls + Printed PC + Metal 58.53 x 27.4 x 3.87 1.30 0.310 0.310
5 1 Lower Board Support Molded PC 59.6 x 39.7 x 3.88 1.00 0.050 0.050
6 1 Camera Bezel Cast + Fly-Cut Aluminum 19.3 x 13.9 x 6.19 0.10 0.120 0.120
7 1 Camera Bezel Plate Stamped + Painted Metal 15.73 x 14.98 x 0.35 0.30 0.030 0.030
8 1 Camera Window Molded + Painted + Polished Glass 8.78 x 8.78 x 0.94 0.10 0.050 0.050
9 1 Camera Frame Stamped + Formed Metal 11.3 x 10.97 x 4.41 0.30 0.050 0.050
10 1 Earpiece Bezel Molded + Plated + Painted Plastic + Copper 20.4 x 1.78 x 1.7 0.03 0.030 0.030
11 1 Earpiece Bezel Support Molded + Heat Staked Plastic 26.6 x 5.26 x 0.78 0.02 0.020 0.020
12 1 Secondary Micro-SIM Blank Cover Molded Plastic 16.62 x 4.42 x 1.77 0.10 0.020 0.020
13 1 Volume Button Molded + Plated + Painted Plastic + Copper 22.54 x 3.86 x 2.35 0.10 0.080 0.080
14 1 Power Button Molded + Plated + Painted Plastic + Copper 14.49 x 3.41 x 2.44 0.10 0.060 0.060
Miscellaneous 15 1 Label Support Tag Die-Cut Plastic 58.7 x 15.5 x 0.19 0.10 0.020 0.020
16 1 Medium Label Die-Cut + Printed Plastic + Adhesive 43 x 10.9 x 0.09 0.02 0.040 0.040
17 1 Power/Volume Key Contacts Molded + Painted Rubber 37.6 x 6.5 x 5.2 0.50 0.050 0.050
18 3 Small Rubber Gaskets Molded Rubber x 0.06 0.020 0.060
19 16 Screws Machined + Painted Metal x 0.80 0.010 0.160
20 1 Medium Gasket Die-Cut Foam + Adhesive x 0.03 0.020 0.020
21 5 Small Gasket Die-Cut Foam + Adhesive x 0.05 0.010 0.050
22 2 Small Label Die-Cut + Printed Plastic + Adhesive 22.3 x 2.75 x 0.07 0.04 0.020 0.040
23 1 Microphone Screen Die-Cut Plastic + Adhesive 2.5 x 2.5 x 0.07 0.01 0.010 0.010
24 2 Moisture Sensor Die-Cut Plastic + Paper + Adhesive 4.22 x 2.85 x 0.24 0.04 0.010 0.020
25 2 Medium Kapton Tape Die-Cut Polyimide + Adhesive x 0.10 0.040 0.080
26 1 Small Kapton Tape Die-Cut Polyimide + Adhesive x 0.01 0.020 0.020
27 1 Small Plastic Tape Die-Cut Plastic + Adhesive x 0.01 0.010 0.010
Total 51 Estimated Cost $6.43
Deep Dive Teardown
Summaries
Motorola Moto E 2nd Gen XT1527 SI39521-TMb Assembly Cost Total
Final Assembly & Test

Made in China
Number of parts 63
Total System Costs Percentage Est'd number of steps 227
1.92% Est'd time (seconds) 862
100.00%
6.18% Est'd final assembly cost $ 0.75
90.00% 6.11%
Final Assembly & Test Est'd final test cost $ 1.25
80.00%
Estimated Cost Totals
24.77% Non-Electronic Parts
70.00% Main Electronic Assemblies $ 58.78
Battery Pack $ 4.67
60.00% 4.49% Rear Camera Display/Touchscreen $ 25.76
Rear Camera $ 6.35
50.00%
Display/Touchscreen Non-Electronic Parts $ 6.43
40.00% Final Assembly & Test $ 2.00
56.52%
Battery Pack Total $ 103.99
30.00%
Note: An additional $1.40 estimated for accessories
20.00% Main Electronic Assemblies and supporting materials
Cost Total Notes:

10.00%
Estimated final assembly cost includes labor only.
Total cost does not include Non-recurring, R&D,
0.00% G&A, IP licensing fees/royalties, software, sales &
marketing, distribution.
Assumes fully scaled production.
Deep Dive Teardown
Overview & Discussion
COST ESTIMATION PROCESS

Overview and Discussion
Cost modeling is tricky business. Multiple variables affect the actual production costs a manufacturer will experience, including development expenses, unit volumes, supply-and-demand in component
markets, die yield-curve maturity, OEM purchasing power, and even variations in accounting practices. Different cost modeling methods employ different assumptions about how to handle these and
other variables, but we can identify two basic approaches: that which seeks to track short-term variations in the inputs to the production process, and that which strives to maintain comparability of the
output of the model across product families and over time.
TechInsights philosophy in cost modeling is to emphasize consistency across products and comparability over time, rather than to track short-term fluctuations. During the past eight years, we have
developed an estimation process that, while necessarily lacking an insiders knowledge of the cost factors that impact any one manufacturer, is reasonably accurate in its prediction of unit costs in
high-volume production environments. We do not claim that the model will produce the right answer for your firms environment. However, TechInsights does give customers a key analytical tool
with a complete set of data in our Bill of Materials (BOM). The BOM allows readers to 1) scrutinize the assumptions behind our cost model and 2) modify the results based on substitution of their own
component cost estimates where they have better information based on inside knowledge.
Our estimation process decomposes overall system cost into three major categories: Electronics, Mechanical, and Final Assembly. We begin by creating a complete electronics bill-of-materials (BOM).
Each component from the largest ASIC to the smallest discrete resistor is entered into a BOM table with identifying attributes such as size, pitch, I/O count, package type, manufacturer, part number,
estimated placement cost, and die size (if the component is an IC). Integrated circuit costs are calculated from measured die area. Using assumptions for wafer size, process type, number of die per
wafer, defect density, and profit margin in combination with die area, an estimate of semiconductor cost is derived. Costs for discrete components and interconnect are derived from assumption tables
which relate BOM line items to specific cost estimates by component type and estimates for part placement costs are included. For LCD display costs, we employ a model which tabulates expected
cost from measurements of glass area, LCD type, and total pixel resolution. When market costs are available from alternative sources, LCD panel costs are taken from and referenced to these
sources.
Costs of non-electronic components such as molded plastic enclosures and metallic components are measured in terms of weight, size, thickness, type of material, and complexity to arrive at their
estimated cost. Other system items such as optics, antennas, batteries and displays are costed from a set of assumption tables derived from a combination of industry data, average high volume
costs, and external sources. For final assembly, we re-build the torn-down product, tabulating stepwise assembly times as the reconstruction proceeds, to reach a total assembly time. Using a labor
rate assumption for the country of origin, we then calculate final assembly cost.
The three major categories for system cost contributors can be broken down into the subcategories of ICs, other electronics parts, displays, batteries (as appropriate), camera modules, electronics
assembly, non-electronic elements, and final assembly. By adding the cost estimates for each of these subcategories, an overall estimated cost is derived for the system under evaluation. Product
packaging and accessories (CDs, cables, etc.) are also documented and estimated for their contribution to total cost as appropriate.
We believe our cost estimates generally fall within 15 percent of the right answer, which itself can vary depending on the market and OEM-specific factors mentioned earlier. While the TechInsights
cost model is imperfect, it yields important insights into technology and business dynamics along with good first-order contributions to system cost by component type. Additionally, the consistency of
approach and gradual modification to assumptions (smoothing out frequently-shifting pricing factors) hopefully yields a credible, but user-modifiable, view of OEM high volume cost-to-produce.
Please feel free to contact us at support@techinsights.com with any comments, questions, or proposed corrections with respect to our cost estimates. We welcome your input.
Cost Estimation Process Metrics Report Revisions 77
Deep Dive Teardown
Metrics
In our product teardowns, we gather a series of metrics for product profiling and comparison. Some metrics focus on system characteristics such as total silicon area, total system semiconductor
storage capacity, and total connection count. Other metrics reflect more subtle aspects of electronics assembly such as connection density, average component I/O count, and silicon tiling density.
Taken as a whole, the metrics allow deeper comparison and benchmarking across multiple disciplines and multiple products. Key metrics we gather on products are described below along with their
definitions and what they tend to say about the system under study. Most metrics can be used both in comparing similar products for benchmarking purposes or for quantifying differences in levels of
complexity between dissimilar product types. Data fall into two categories; either raw measured data or ratios of these measured data sets.
Total Silicon Area : This metric describes the total area of silicon as measured from X-ray or direct measurement of ICs. The area is an expression of the enclosed bare die area and excludes
packaging area. The aggregate silicon area is a good benchmark to show how integrated a design might be when making comparisons to similar systems. Total silicon area also reflects the major
cost driver for most systems we examine.
Silicon Tiling Density : Ratio of Total Silicon Area to total printed circuit board projected area (i.e. the simple board area and not the cumulative surface area of both sides of the board). This
metric directly reflects the level of efficiency and aggressiveness in integrated circuit packing and placement. Single digit Silicon Tiling Density is typical but silicon coverage of 10% - 20% has been
seen in some of the most advanced products we have examined. Higher Tiling Densities often correspond with the use of chip scale packaging (CSPs) or other small form-factor IC packaging
technologies. High density circuit boards are also often a supporting technology.
Number of Parts : Total component count including ICs, passives, modules, connectors, etc., each separated out in our reporting.
Number of Connections : The total number of connections corresponds to the total number of interconnects introduced by the aggregate component set and reflects any electrical connection
observed (solder joints, adhesive interconnect, or connector terminal interfaces).
Opportunity Count : Opportunity Count is the total number of parts plus the total number of connections; the name reflects that each of these constituent elements represents an opportunity for
failure. A high opportunity count means more complex and riskier electronics assembly.
Average Pin Count (APC) : Ratio of total number of component terminals to total number of parts, at the system level. This metric reflects the average terminal complexity of the components
and often provide a signature of integration level and/or digital-ness of the overall product. Low APCs reflect a high number of discretes or other low-pincount devices often characteristic of analog
circuitry. Conversely, high APCs are characteristic of highly integrated, high-pincount assemblies, often those composed largely of digital integrated circuits.
Connection Density : This metric is a ratio of the total Number of Connections to total printed circuit board assembly area, in units of connections per sq. inch. The metric provides data related to
the Silicon Tiling Density above, but with an emphasis on complexity of I/O interconnect. For example, with a fixed Connection Density, high tiling density of low-pincount memory chips is more readily
achieved than comparable silicon tiling of high pincount logic.
Part Density : This metric is a ratio of the total Number of Parts to total printed circuit board assembly area, in units of components per sq. inch. The metric provides data related to the Silicon Tiling
Density and Connection Density as described above, but with an emphasis on density and complexity of component packing efficiency. For example, low Part Density of high-pincount devices can
pose an equal challenge in Connection Density to high Part Density of low-pincount devices. High Part Density does reflect challenges in surface mount assembly in terms of (typically) precision of
placement, number of placements, and engineering of part clearances.
Routing Density (heuristic estimate) = 3*(Average Pin Count)*Part Density. The Routing Density metric is an empirically derived relationship that characterizes the wiring density of the
interconnect used to support the interconnection of components in a planar electronic assembly (i.e. the circuit board). Architectural issues such as bussing or other factors affecting the regularity of
wiring impact the actual Routing Density needed to support a given application, but the metric provides a ready measure of wiring complexity.
Deep Dive Teardown
Revisions
Periodically we will make revisions to these reports. In the event a revision is made, the information below may be referenced as a summary of the changes which were made.
Rev. A
- Initial Release
Rev. B
- Cost model error caused final assembly costs for the subsystems to be incorrect. Overall BOM impact was minimal (only $0.41 increase in Total COGS). Fixed these assembly costs and downstream
affected summary costs as well on the following pages: 3, 4, 33, 36, 42, & 76.
- Updated a few Taiyo Yuden RF filters with part numbers. Affected pages include the following: 7 & 63.
- Added "? = Unconfirmed" text box to pages where a part description had a "?". Affected pages include the following: 45 & 63.

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Report Publish Date Jun-15

Deep Dive Teardown

Design Wins Device Observations

Design Wins Analysis Summary Cost Drivers 2

*Excluding Supporting Materials' Cost

Design Wins Analysis Summary Cost Drivers 3

Final Assembly & Test

Motorola Moto E 2nd Gen XT1527

Design Wins Analysis Summary Cost Drivers 4

Radio Block System Block 7

Manufacturer: WiFi/BT/GPS Unknowm 2 - Samsung

#MT29TZZZ8D5BKFAH-125 W.95K Headset

Radio Block System Block 8

Forward Facing VGA Camera

Micro USB Port

Exterior Features Backlights 9

Exterior Features Backlights 10

Exterior Features Backlights 11

Major Components Main Enclosures Component Arrangement 12

Major Components Main Enclosures Component Arrangement 13

Major Components Main Enclosures Component Arrangement 14

Major Components Main Enclosures Component Arrangement 15

Major Components Main Enclosures Component Arrangement 16

In order to access the MicroSD and

MicroSD Card Slot

Micro-SIM Card Slot

Secondary Micro-SIM Card Slot

IMEI Label Inserted Micro USB

Main Main 2 RxD WiFi/BT/GPS 28

Main Main 2 RxD WiFi/BT/GPS 29

Main Main 2 RxD WiFi/BT/GPS 30

Main Main 2 RxD WiFi/BT/GPS 31

Application Processor Main Processor without cellular modem

A full Subsystem Bill of Materials is

Battery Display / Touchscreen Rear Camera 33

Battery Display / Touchscreen Rear Camera 34

Battery Display / Touchscreen Rear Camera 35

A full Subsystem Bill of Materials is

Battery Display / Touchscreen Rear Camera 36

Battery Display / Touchscreen Rear Camera 37

Battery Display / Touchscreen Rear Camera 38

Battery Display / Touchscreen Rear Camera 39

Battery Display / Touchscreen Rear Camera 40

Backlight Flex (8 LEDs) Component Function:

Battery Display / Touchscreen Rear Camera 41

5 MP BSI Camera Module

A full Subsystem Bill of Materials is

Battery Display / Touchscreen Rear Camera 42

Battery Display / Touchscreen Rear Camera 43

VGA Camera Battery Connector

Micro-SIM Card Slot

Side 1 Side 2 Cross-section 44

7 - Rohm 10 - STMicroelectronics 13 - Qualcomm 14 - Fairchild Semiconductor 16 - Maxim 6 - Hosiden

Side 1 Side 2 Cross-section 45

8 - Qualcomm Atheros 9 - NXP Semiconductor 22 - Qualcomm 17 - Skyworks

Side 1 Side 2 Cross-section 46

Side 1 Side 2 Cross-section 47

8.1 - Qualcomm Atheros

Side 1 Side 2 Cross-section 48

Side 1 Side 2 Cross-section 49

Side 1 Side 2 Cross-section 50

Side 1 Side 2 Cross-section 51

Side 1 Side 2 Cross-section 52