MINI-Compact System

Model Name MX-H630

Model Code MX-H630/ZP

SERVICE MANUAL
MINI-Compact System Contents

1. Precaution

2. Product Specification

3. Disassembly and Reassembly

4. Troubleshooting

5. PCB Diagram

6. Schematic Diagram
MX-H630

Refer to the service manual in the GSPN (see the rear cover) for more information.
Contents

Contents
1. Precaution........................................................................................................................................ 1 1
1.1. Safety Precautions ................................................................................................................... 1 1
1.2. Servicing Precautions ............................................................................................................... 1 3
1.3. Precautions for Electrostatically Sensitive Devices (ESDs) .............................................................. 1 4
1.4. Installation Precautions ............................................................................................................. 1 5
2. Product Specification ......................................................................................................................... 2 1
2.1. Product Feature ....................................................................................................................... 2 1
2.2. Specifications.......................................................................................................................... 2 2
2.3. Specifications Analysis ............................................................................................................. 2 3
2.4. Accessories ............................................................................................................................ 2 4
2.4.1. Supplied Accessories ................................................................................................... 2 4
3. Disassembly and Reassembly .............................................................................................................. 3 1
3.1. Main Disassembly and Reassembly ............................................................................................. 3 1
3.2. DECK Disassembly and Reassembly ........................................................................................... 3 5
4. Troubleshooting ................................................................................................................................ 4 1
4.1. Checkpoints by Error Mode ....................................................................................................... 4 1
4.1.1. No Power................................................................................................................... 4 2
4.1.2. No Output .................................................................................................................. 4 4
4.2. Measures to be taken when the Protection Circuit operates............................................................... 4 5
4.2.1. Operation of Power Block Protection Circuit .................................................................... 4 5
4.2.2. Check AMP in Power Protection .................................................................................... 4 6
4.3. MICOM, MPEG Initialization & Update ...................................................................................... 4 7
4.4. Buyer-Region Code Setting Method ............................................................................................ 4 8
4.4.1. The inserting method of Region Code after replacing the Main PBA ..................................... 4 8
5. PCB Diagram ................................................................................................................................... 5 1
5.1. Wiring Diagram....................................................................................................................... 5 1
5.2. FRONT PCB Top .................................................................................................................... 5 2
5.2.1. Pin Connection ........................................................................................................... 5 3
5.3. FRONT PCB Bottom ............................................................................................................... 5 4
5.4. MAIN PCB Top ...................................................................................................................... 5 5
5.4.1. Pin Connection ........................................................................................................... 5 6
5.4.2. Test Point Wave Form .................................................................................................. 5 7
5.5. MAIN PCB Bottom.................................................................................................................. 5 8
5.6. SMPS PCB Top....................................................................................................................... 5 9
5.6.1. Pin Connection ........................................................................................................... 5 10
5.7. SMPS PCB Bottom .................................................................................................................. 5 11
6. Schematic Diagram ........................................................................................................................... 6 1
6.1. Overall Block Diagram ............................................................................................................. 6 1

i Copyright 1995-2013 SAMSUNG. All rights reserved.

 Contents

6.2. FRONT ................................................................................................................................. 6 2

6.3. MAIN-1................................................................................................................................. 6 3
6.4. MAIN-2................................................................................................................................. 6 4
6.5. MAIN-3................................................................................................................................. 6 5
6.5.1. Test Point Wave Form .................................................................................................. 6 6
6.6. MAIN-4................................................................................................................................. 6 7
6.7. SMPS-1 ................................................................................................................................. 6 8
6.8. SMPS-2 ................................................................................................................................. 6 9

Copyright 1995-2013 SAMSUNG. All rights reserved. ii

1. Precaution

1. Precaution
Follow these safety instructions while servicing the ESD to prevent damage and to protect against potential hazards
such as electrical shock and X-rays.

1.1. Safety Precautions

1) When reinstalling the chassis and its assemblies, be sure to restore all of the protective devices, including the control
knobs and the compartment covers.

2) Make sure that there are no cabinet openings through which people (particularly children) can make contact with
dangerous internal components.

3) Design Alteration Warning:

Never alter or add to the mechanical or electrical design of the unit.
Example: Do not add auxiliary audio or video connectors. Such alterations might create a safety hazard.
Also, any design changes or additions will void the manufacturers warranty.

4) Leakage Current Hot Check Figure 1.1 AC Leakage Test:

WARNING

Do not use an isolation transformer during this test. Use a leakage-current tester or a metering system that complies.

With the unit completely reassembled, plug the AC cord directly into a AC outlet. With the units power switched from
the ON to the OFF position, measure the current between a known ground and all exposed metal parts.
Known Grounds - Earth
Known Metal parts - screwheads, metal cabinets, etc.

LEAKAGE (READING
DEVICE CURRENT SH OULD NOT BE
UNDER TES TER ABOVE 0.5mA)
TES T
TES T ALL
EXPO S ED METAL
SU RFACES
2-WIRE CORD
ALSO TES T WITH
PLUG REVER S ED
(US ING AC EARTH
ADAPTER P LUG GROUND
AS R EQ UIRED)

Figure 1.1 AC Leakage Test

1-1 Copyright 1995-2013 SAMSUNG. All rights reserved.

 1. Precaution

5) Insulation Resistance Cold Check:

(1) With the units AC plug disconnected from the AC source, connect an electrical jumper across the two AC prongs.
(2) Set the power switch to ON. (3) Measure the resistance between the shorted AC plug and any exposed metallic parts.
Example: screwheads, metal cabinets, antenna port, etc. If any of the exposed metallic parts has a return path to the
chassis, the measured resistance should be between 1 and 5.2 megohms. If there is no return path, the measured
resistance should be infinite. If the resistance is outside these limits, a shock hazard might exist. See Figure 1.2
Insulation Resistance Test

Ante nna
Term inal

Expo s ed
Meta l P a rt

oh m
Ohmmet er

Figure 1.2 Insulation Resistance Test

6) Components, parts and wiring that appear to have overheated or that are otherwise damaged should be replaced with
parts that meet the original specifications. Always determine the cause of damage or overheating, and correct any
potential hazards.

7) Observe the original lead dress, especially near the following areas: Antenna wiring, sharp edges, and especially the AC
and high voltage power supplies. Always inspect for pinched, out-of-place, or frayed wiring.
Do not change the spacing between components and the printed circuit board. Check the AC power cord for damage.
Make sure that no wires or components touch thermally hot parts.

8) Product Safety Notice:

Some electrical and mechanical parts have special safety-related characteristics which might not be obvious from visual
inspection. These safety features and the protection they give might be lost if the replacement component differs from
the originaleven if the replacement is rated for higher voltage, wattage, etc.

9) Components that are critical for safety are indicated in the circuit diagram by shading, or . Use replacement
components that have the same ratings, especially for flame resistance and dielectric strength specifications. A
replacement part that does not have the same safety characteristics as the original might create shock, fire or other
hazards.

Copyright 1995-2013 SAMSUNG. All rights reserved. 1-2

1. Precaution

1.2. Servicing Precautions

1) Servicing precautions are printed on the cabinet. Follow them.

2) Always unplug the units AC power cord from the AC power source before attempting to :
(a) Remove or reinstall any component or assembly, (b) Disconnect an electrical plug or connector, (c) Connect a
test component in parallel with an electrolytic capacitor.

3) Some components are raised above the printed circuit board for safety. An insulation tube or tape is sometimes used.
The internal wiring may be clamped to prevent contact with thermally hot components. Reinstall all such elements
to their original position.

4) After servicing, always check that the screws, components and wiring have been correctly reinstalled. Make sure that
the portion around the serviced part has not been damaged.

5) Check the insulation between the blades of the AC plug and accessible conductive parts (examples : metal panels,
input terminals and earphone jacks).

6) Insulation Checking Procedure :

Disconnect the power cord from the AC source. Connect an insulation resistance meter (500 V) to the blades of the
AC plug. The insulation resistance between each blade of the AC plug and accessible conductive parts (see above)
should be greater than 1 megohm.

7) Never defeat any of the B+ voltage interlocks. Do not apply AC power to the unit (or any of its assemblies) unless all
solid-state heat sinks are correctly installed.

8) Always connect a test instruments ground lead to the instrument chassis ground before connecting the positive lead;
always remove the instruments ground lead last.

CAUTION

First read the Safety Precautions section of this manual. If some unforeseen circumstance creates a conflict between the
servicing and safety precautions, always follow the safety precautions.

1-3 Copyright 1995-2013 SAMSUNG. All rights reserved.

 1. Precaution

1.3. Precautions for Electrostatically Sensitive Devices (ESDs)

Some semiconductor (solid state) devices are easily damaged by static electricity.
Such components are called Electrostatically Sensitive Devices (ESDs).
Examples include integrated circuits and some field-effect transistors.
The following techniques will reduce the occurrence of component damage caused by static electricity :

1) Immediately before handling any semiconductor components or assemblies, drain the electrostatic charge from your
body by touching a known earth ground. Alternatively, wear a discharging wrist-strap device. (Be sure to remove it
prior to applying powerthis is an electric shock precaution.)

2) After removing an ESD-equipped assembly, place it on a conductive surface such as aluminum foil to prevent
accumulation of electrostatic charge.

3) Do not use freon-propelled chemicals. These can generate electrical charges that damage ESDs.

4) Use only a grounded-tip soldering iron when soldering or unsoldering ESDs.

5) Use only an anti-static solder removal device. Many solder removal devices are not rated as anti-static (these can
accumulate sufficient electrical charge to damage ESDs).

6) Do not remove a replacement ESD from its protective package until you are ready to install it.
Most replacement ESDs are packaged with leads that are electrically shorted together by conductive foam, aluminum
foil or other conductive materials.

7) Immediately before removing the protective material from the leads of a replacement ESD, touch the protective material
to the chassis or circuit assembly into which the device will be installed.

8) Minimize body motions when handling unpackaged replacement ESDs. Motions such as brushing clothes together, or
lifting a foot from a carpeted floor can generate enough static electricity to damage an ESD.

Copyright 1995-2013 SAMSUNG. All rights reserved. 1-4

1. Precaution

1.4. Installation Precautions

1) Keep the product away from a heat source such as candle light, mosquito repellent incense, heating equipment, or direct
sunlight. Otherwise, this may cause fire.

2) Do not install the product on a place that is shaking, tilted, unstable, or seriously vibrating. The product may drop to get
damaged or injure a person. If using the product in a highly vibrating place, it may be broken or cause fire.

3) When moving the product, turn off the power switch and unplug all the connected cables with the product such as the
power plug and antenna cable. If the power cord is damaged, this may cause electric shock or fire.

4) Secure room for ventilation. Keep at least 10 cm of distance from the rear wall, and at least 5 cm from either side wall.

5) Installing the product in a special place like below rather than normal environment may cause serious quality concerns
due to its special conditions. If this is the case, make sure to contact a local Samsung service center before installing the
product. (Special places: a place where a large amount of dust is accumulated; where chemical substances are used
or the ambient temperature is too high or low; a place that is full of moisture or water; in transportation vehicles
such as a car; or in public places such as the airport or subway station where the product is supposed to operate
uninterruptedly for a long time)

6) Keep the packaging plastic wrapper out of children's reach. If children play with it improperly, they may get suffocated.

7) If installing the product on a display cabinet, shelf, desk, etc., keep the product from protruding on its lower side. If the
product falls, it may break or cause physical injury. Use only the display cabinet or shelf that fully covers the product.

8) If using lithium batteries, carefully read the following precautions:

NOTE

Ensure the batteries are inserted in the right direction. Otherwise, they may cause an explosion. Dispose of used batteries
according to the manufacturer's instructions.

Do not expose the battery to fire.

Do not disassemble, short - cut, or heat the battery.

Use only the same type and size of batteries for replacement.

Do not expose the battery to fire or excessive heat.

1-5 Copyright 1995-2013 SAMSUNG. All rights reserved.

 2. Product Specification

2. Product Specification

2.1. Product Feature

Power
2.0 ch : 230 W Total RMS / 2640 W PMPO
IR Amp

Specialized Function
CD Ripping (Able to ripping while listening)
New Bass Sound System (Called GIGA Sound)
Connectivity
USB
MIC

Disc
Type : 1 Tray
Compatible : MP3, CD / CD-R, RW, WMA

Copyright 1995-2013 SAMSUNG. All rights reserved. 2-1

2. Product Specification

2.2. Specifications

Basic Specification
Weight 2.3 Kg

Dimensions 203 (W) x 306 (H) x 256.5 (D) mm

General
Operating Temperature Range +5 C ~ +35 C

Operating Humidity Range 10 % to 75 %

Signal/Noise ratio 55 dB

FM Tuner Usable sensitivity 12 dB

Total harmonic distortion 0.6 %

Signal/Noise ratio 35 dB
AM Tuner
Usable sensitivity 58 dB
(optional)
Total harmonic distortion 1.5 %

Reading Speed : 4.8 ~ 5.6 m/sec.

CD Disc CD : 12 cm (Compact Disc)
Maximum Play Time : 74 min.

MX-H630 : 230 Watts (MAX)

Front speaker output 110 W/CH (4 /100 Hz)

MX-H730 : 550 Watts (MAX)

Front speaker output 275 W/CH (4 /100 Hz)

Amplifier
Frequency range 20 Hz ~ 20 KHz

S/N Ratio 80 dB

Channel separation 65 dB

Input sensitivity (AUX) 800 mV

NOTE

Samsung Electronics Co., Ltd reserves the right to change the specifications without notice.
Weight and dimensions are approximate.
Design and specifications are subject to change without prior notice.
For the power supply and Power Consumption, refer to the label attached to the product.

2-2 Copyright 1995-2013 SAMSUNG. All rights reserved.

 2. Product Specification

2.3. Specifications Analysis

Model Name MXH630 MX-F630 / MX-F630B / MX-F630DB

Photo

OUTPUT POWER 2.0CH 230W 2.0 CH 220 W

FRONT DISPLAY VFD VFD
DIMMER O O
CD
CD/DVD CD
DVD : MX-F630DB Only
Bluetooth O MX-F630B, MX-F630DB Only
MP3 O O
USB HOST O O
CD RIPPING O O
TAPE X X
AUDIO IN O O
HEADPHONE X X
FM / RDS FM/AM FM/AM
REMOTE KEY 45 KEY 45 KEY
DUAL VOLTAGE O O
SPK IMPENDANCE 4 OHM 4 OHM

TIP

O : Feature Included
X : Not Included

Copyright 1995-2013 SAMSUNG. All rights reserved. 2-3

2. Product Specification

2.4. Accessories

2.4.1. Supplied Accessories

Accessories Item Item code

Batteries (AAA) 4301-000116

TUNER/AUX CD/BLU ETOOTH

FOOTBALL

AUTO
CHANGE
Remote Control AH59-02613B

Users Manual AH68-02677J

FM/AM Antenna
AH42-00036A
(Optional)

2-4 Copyright 1995-2013 SAMSUNG. All rights reserved.

 3. Disassembly and Reassembly

3. Disassembly and Reassembly

3.1. Main Disassembly and Reassembly

CAUTION

Be careful to follow the disassembly sequence described in the manual. Otherwise, the product may be damaged.

Be sure to carefully read and understand the safety instructions before performing any work as the IC chips on
the PCB are vulnerable to static electricity.

In order to assemble reverse the order of disassembly.

Description Description Photo

1. Unfasten 4 screws on the 2 side Cover.

: BH 3*10 BLACK

CAUTION

Be careful not to make any scratches as you remove them.

Copyright 1995-2013 SAMSUNG. All rights reserved. 3-1

3. Disassembly and Reassembly

Description Description Photo

2. Separate the Front panel.

3-2 Copyright 1995-2013 SAMSUNG. All rights reserved.

 3. Disassembly and Reassembly

Description Description Photo

3. Unfasten 5 screws in SMPS and detach AC-CORD & 13P shield

wire.
: BH 3*10 SILVER

4. Unfasten BT screws and 2 kitting screws and detach DECK wire.

: BH 3*10 BLACK

Copyright 1995-2013 SAMSUNG. All rights reserved. 3-3

3. Disassembly and Reassembly

Description Description Photo

5. Unfasten 2 screws from inside, separate DECK from mecha.

: BH 3*10 BLACK

6. Unfasten 10 screws, and then Separate the front PCB from Front
Panel.
: BH 3*10 SILVER

3-4 Copyright 1995-2013 SAMSUNG. All rights reserved.

 3. Disassembly and Reassembly

3.2. DECK Disassembly and Reassembly

Description Description Photo

1. Separate Tray - Disc from DECK.

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3. Disassembly and Reassembly

Description Description Photo

O P E N/C LO S E

HOOK

HOOK

3-6 Copyright 1995-2013 SAMSUNG. All rights reserved.

 3. Disassembly and Reassembly

Description Description Photo

2. Lift up Holder-Cable, separate Traverse-DECK.

HOOK HOOK

Copyright 1995-2013 SAMSUNG. All rights reserved. 3-7

3. Disassembly and Reassembly

Description Description Photo

3. Disassemble complete.

Holde r-Ca ble

Tra verse- Deck

HOLDER-CHUCK Tra y-dis c

3-8 Copyright 1995-2013 SAMSUNG. All rights reserved.

 4. Troubleshooting

4. Troubleshooting

4.1. Checkpoints by Error Mode

Oscilloscope Setting Values Normal Voltage 27 MHz 32.768 KHz

Voltage/DIV 1 Vol/DIV 1 Vol/DIV 1 Vol/DIV

TIME/DIV 1 uS/DIV 10 ns/DIV 0.1 uS/DIV

Copyright 1995-2013 SAMSUNG. All rights reserved. 4-1

4. Troubleshooting

4.1.1. No Power

No P owe r

Che ck MAIN P CB No Che ck MAIN P CB No

Che ck or re pla ce S MP S .
MIC1 P IN8 : 3.3V. CN2001 7~8# (5.1V).

Ye s Ye s

Che ck MAIN P CB No Che ck MAIN P CB

UCN1 9# : VF5.1V. VFQ1 ; VFQ2 .

Ye s

Check VFD
No
Voltage on MAIN PCB Che ck or re pla ce S MP S .
CN2001 11~13# .

Ye s

(1)
Che ck CLOCK circuit in Ye s Cha nge
MAIN P CB X1 the FRONT P CB As s y.
pa rt OK?

* Re fe r to wa ve pa tte rn
No ima ge of Fig. 4-1.

Che ck pa tte rn or
re pla ce MIC1.

4-2 Copyright 1995-2013 SAMSUNG. All rights reserved.

 4. Troubleshooting

2.2KOH
3 6

2.2KOHM

2.2KOHM

10KOHM
MC71

MR50
A2 SCL

MR48

MR49
100NF
4 5

KEY_ADC2
KEY_ADC1
VSS SDA

USB_FLG
MP3.3V_PW

USB_EN
BT_RST

TU_CLK
TU_RST
BT_RX

UNDEFINED

TU_DA
BT_TX

(1)
DGND

EMULATOR OPTION
SPI_DI 1_C S3

SPI_CS3
SPI_CLK

MIC 1
SPI_DI
1

SPI_DO
RESET
16V
16V

16V
AD6
100OHM
100OHM

100OHM

MP3.3V_PW
10KOHM

1N4148WS
100OHM
33OHM
33OHM
100NF
100NF

100NF

5_R S
2
6
8
4

MR79

10KOHM
MP3.3 V MP3.3V_PW BOOT ON-BOARD FLASH MR19
33O HM
SPI_CS3
MR72
MR74
MC46
MC45

MC44
MR75

MR68
MR67

MR62

SPI_CS
MAR9
1
3
5
7

SPI_CS2
5SP_3.3V MR26
BOOT WITH EMULATOR 33O HM
(1) OPTION
107
106
105
104
103
102
101
100
99
98
97
96
95
94
93
92
91
90
89
SOUT

VDD

SPDIF_OUT

VD33PLL
VS33PLL
VD33
SIN

VS33/VSS

SR[26]
SR[25]
SR[24]
SR[23]
SR[22]
SR[21]
SR[20]
SR[07]
SR[06]
SR[05]
SR[04]

MAR8
100OHM
88 1 2
SR[02]
VFD_DO
SR[01] 87 3 4 VFD_CE
SR[00] 86 5 6 VFD_CLK
SR[12] 85 7 8 VFD_DI
84

MC78100PF
MC79100PF
MC80100PF
SR[11]
SR[10] 83 MR93 10KOH M
VD33 82 MC43 100NF 16V
VDD 81 MC42 100NF 16V A3.3V_PW
80
MIC 4

LINE_IN_L0
LINE_IN_R0 79
VD33AADC 78

MIC 2 LINE_IN_L1 77

MC39
MC41
76

MC40
330UF
100NF

10UF
LINE_IN_R1

6.3V
75 MC34

16V
MR8 27KOH M 10U F 6.3V
LINE_IN_L2
74 MR7
21
21
* 5.4.
27KOH M MAIN
MC33 P CB
10U FTop
6.3V
TUNER_L
LINE_IN_R2
73 MC32 TUNER_R MP1.35V_PW
LINE_IN_L3 MR46 27KOH M 10U F 6.3V AUX_L
LINE_IN_R3 72 MR45 27KOH M MC31 10U F 6.3V AUX_R CB2012UA300T
71
MIC1
VDDAADC

16V
70 MR44 27KOH M MC30 10U F 6.3V
MIC 3 MIC_SIG
MC37

MC38
MB1
MIC
69
100NF

10UF
0.01OHM

6.3V
VS33ADAC
68 MC29 100NF 16V

P3CD
VD33ADAC
67 MR43 33OHM
DAC_O3
DAC_O2 66
65
MR42 33OHM UCN1 OPLCH
OPRCH

204-003466 VD33ADAC
VS33ADAC
DAC_O1
64
63
MC28 100NF 16V
TP65
DGND
(1)
VID_XI 62 50V
61 MR39 33OHM MC27
100KOHM
MR40

VID_XO
60 1 2
27MHZ

27P F
X1

SR[03] I2C_WP
SPDIF_IN 59 3 4 MAR7 P_O N1 MC26
SR[16] 58 5 6 100OHM 5 PWM_AM1 27P F
57 7 8 50V
SR[17]
TI_RST
VDD 56 MC25 100NF 16V
AUX[3] 55 1 2 TI_SD
AUX[2] 54 3 4 MAR6 P_ON
OP[7] 53 5 6 100OHM TU_RDS
OP[6] 52 7 8 VOL_DN
OP[5] 51 MR30 100OHM VOL_UP
VSS33/VSS 50
VD33 49 MC24 100NF 16V
OP[4] 48
OP[3] 47 MR28 100OHM MIC_SENS
OP[2] 46
OP[1] 45 P_ON2
MR31
VS33/VSS
RESET_B

SPI_CLK
SPI_CS2
SPI_CS3

SPI_DO
AUX[7]
AUX[6]

AUX[1]
AUX[0]

SPI_DI
DB[13]
DB[14]
DB[15]

MCLK
OP[0]
VD33
VDD

VDD

DGND
MR32
MR33
MR34
MR29
MR98
MR99
MR11
MC6
MC7
MC8

MP3.3V_PW
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44

10NF
10NF
10NF
100NF 16V

10KOHM
10KOHM
10KOHM
10KOHM

10KOHM
10KOHM
10KOHM
10KOHM

MR25
SP_3.3V
MC20

8.2KOH M
100NF
100NF

DGND
MC19 16V

DGND
16V
TP_RST

MIC5
MC21

M5.1V_PW MP3.3V_PW
RT9818C-42PV
1 /RESET ,RESET
VDD
3 MR23 0OHM
MIC4
GND
SPI_CS
1 /CS
8
MC22 MC23 SPI_DI
2 DO(IO1)
VCC
7 OPTION
3 /HOLD(IO3)
6 MD2 30
2

100NF 100NF /WP(IO2)

4 CLK
* 6.5. MAIN-3
5
100OHM
100OHM

GND
33OHM
33OHM
33OHM

33OHM
33OHM
33OHM

DGND 16V 16V DI(IO0)

MC81

MC5
47PF
100NF
4
6
8

DGND
<Fig. 4-1>
MR54
820OHM
OPTION

Copyright 1995-2013 SAMSUNG. All rights reserved. 4-3

4. Troubleshooting

4.1.2. No Output

AUDIO no output

Check Menu Music No Choos e the corre ct function, No

Function and Volume Change the function.
Or turn on the Volume .
knob ON.

Ye s Ye s

Check AIC2 No Replace MIC1 on

(TAS5342) input signal on MAIN PCB. (ES8398)
MAIN PCB .

Ye s

Check AIC2
No Replace AIC2 on
(TAS5342) output signal on
MAIN PCB. (TAS5342)
MAIN PCB.

Ye s

No
Che ck L1/L2. Re pla ce L1/L2.

Ye s

Che ck L1/L2 pa tte rn.

4-4 Copyright 1995-2013 SAMSUNG. All rights reserved.

 4. Troubleshooting

4.2. Measures to be taken when the Protection Circuit operates

4.2.1. Operation of Power Block Protection Circuit

Cases of the SMPS Protection.

1) If there is over current at the AMP IC. (Speaker Wire Short)

2) If temperature of the AMP IC is over 150 .

3) There is no power supply for amp.

Protection Circuit operates when power problem occurs in the SMPS.

Protection
Location Pin No. Remark
Open Short

MX-H630 +5.3 V (6~7#) X X

SMPS PCB +PVDD (+34V) (12~13#) X X
CNM801
12 V (9#) X X

P-ON (+5 V) (5#) X X

Copyright 1995-2013 SAMSUNG. All rights reserved. 4-5

4. Troubleshooting

4.2.2. Check AMP in Power Protection

If you think, there are problems at the AMP Part, you can check the PCB without disassembling the set.

CAUTION

Do not connect the power cord during the test!

Measurement Resistance using Tester

R CH 2 k

L CH 2 k

If Measured Resistance is very different from above

numbers, There is a Problem.
AMP Part Problem

2 CH S P E AK E R O U T

R IGHT

LE FT

4-6 Copyright 1995-2013 SAMSUNG. All rights reserved.

 4. Troubleshooting

4.3. MICOM, MPEG Initialization & Update

MPEG Version Check

1) Power On.

2) CD open status.

3) Push the number NEXT for 5 seconds, check the MICOM version.

4) Push the number PREVIOUS for 5 seconds, check the MPEG version.

MPEG Update
1) Insert USB Memory or Update DISC which have Update file, and play. Update will be displayed.

2) When finish the Set will be power off on automatically.

3) And then the Deck is automatically open.

MPEG Reset
1) During No Disc Displayed, push the stop Button 5 seconds. After displayed INITIALIZE set will power off
automatically.

Copyright 1995-2013 SAMSUNG. All rights reserved. 4-7

4. Troubleshooting

4.4. Buyer-Region Code Setting Method

4.4.1. The inserting method of Region Code after replacing the Main PBA

NOTE

When replacing the Main PBA and System Micom should be inserted the region code.

The set is not working properly if you don't insert the region code.

The region code is inserted by the remote control.

1) During AUX status.

MX-H630 : Push the ENTER button 10 Second.

<MX-H630>

2) When displayed TEST, import 46 to set the buyer.

TES T
3) When displayed , import the buyer code.
The buyer setting code can find in the table named H630 OPTION TABLE_Ver0.1

4) It will show the buyer that you set up. Then the buyer setting is succeed.

4-8 Copyright 1995-2013 SAMSUNG. All rights reserved.

 4. Troubleshooting

Table 4.1 MX-H630 Option Table

Region Code Buyer

00 Africa
01 Brazil
02 Latin American
03 USA, Canada

Copyright 1995-2013 SAMSUNG. All rights reserved. 4-9

5. PCB Diagram

5. PCB Diagram

5.1. Wiring Diagram

RF CN2 UCN1 FCN1

Pin Signa l Function Function Signa l Pin Pin Signa l Function Function Signa l Pin
1 SP + SPINDLE MOTOR+ S PINDLE MOTOR+ S P+ 1 1 GND GND GND GND 23
2 SP - SPINDLE MOTOR+ S PINDLE MOTOR+ S P- 2 2 USB_DP USB Differentia l Signa l USB Differentia l Signa l US B_DP 22
3 SL- SLED_MOTOR- S LED_MOTOR- SL- 3 3 USB_DN USB Differentia l Signa l USB Differentia l Signa l US B_DN 21
4 SL+ SLED_MOTOR+ SLED_MOTOR+ SL+ 4 4 USB_5.2V USB Power Supply USB Power Supply USB_5.2V 20
5 INSW OPEN SWITCH OPEN SWITCH INS W 5 5 MIC_S EN MIC S ens or Signa l MIC S ens or S igna l MIC_S EN 19
6 OUTSW CLOSE S WITCH CLOS E SWITCH OUTSW 6 6 AGND GND GND AGND 18
7 GND MOTOR GND MOTOR GND GND 7 7 MIC_S IGN MIC S igna l MIC S igna l MIC_S IGN 17
8 D+ NOT CONNECT NOT CONNECT NC 8 8 AGND GND GND AGND 16
9 D- NOT CONNECT NOT CONNECT NC 9 9 S T5.1V REMOCON Eye P ower S upply REMOCON Eye Power Supply S T5.1V 15

J ACK
Fro n t
10 M5.1V Abov/Driver IC P ower S upply Abov/Driver IC P ower S upply M5.1V 14
RF CN1 11 REMOCON REMOCON Eye S igna l REMOCON Eye Signa l REMOCON 13
Pin Signa l Function Function Signa l Pin 12 DGND GND GND DGND 12
1 CD_VR CD circuit Adjus t CD circuit Adjus t CD_VR 1 13 KEY_AD1 Key S igna l 1 Key Signa l 1 KEY_AD1 11
2 CD_MPD APC input s igna l APC input s igna l CD_MPD 2 14 KEY_AD2 Key S igna l 2 Key Signa l 2 KEY_AD2 10
3 CD_LD CD La s er control CD La s er control CD_LD 3 15 VOL_UP Volume Up Volume Up VOL_UP 9
De c k

4 LD_GND GND GND LD_GND 4 16 VOL_DN Volume Down Volume Down VOL_DN 8
5 SW CD/DVD OPTION CD/DVD OPTION SW 5 17 VFD_DO VFD Da ta VFD Da ta VFD_DO 7
6 F- Focus driver differentia l s igna l - Focus driver differentia l s igna l - F- 6 18 VFD_CLK VFD Working Clock Signa l VFD Working Clock S igna l VFD_CLK 6
7 T- Tra ck driver differentia l s igna l - Tra ck driver differentia l s igna l - T- 7 19 VFD_CE VFD Ena ble VFD Ena ble VFD_CE 5
8 T+ Tra ck driver differentia l s igna l + Tra ck driver differentia l s igna l + T+ 8 20 DGND GND GND DGND 4
9 F+ Focus driver differentia l s igna l + Focus driver differentia l s igna l + F+ 9 21 VFD_VP VFD Driver IC Power Supply VFD Driver IC Power Supply VFD_VP 3
10 B PD IC output s igna l PD IC output s igna l B 10 22 -VFD VFD P ower S upply(-) VFD P ower S upply(-) -VFD 2
11 C PD IC output s igna l PD IC output s igna l C 11 23 +VFD VFD P ower S upply(+) VFD P ower Supply(+) +VFD 1
12 D PD IC output s igna l PD IC output s igna l D 12
13
14
A
NC
PD IC output s igna l
NOT CONNECT
PD IC output s igna l
NOT CONNECT NC
A 13
14
Ma in P in S igna l
B T CN1
Function Function S igna l Pin
15 NC NOT CONNECT NOT CONNECT NC 15 1 BT_RST BT Res et Signa l BT Res et Signa l BT_RST 1

(Op tio n )
16 VCC RF P OWER 5V RF P OWER 5V VCC 16 2 MP3.3V_P W BT Power Supply BT Power S upply MP3.3V_P W 2
17 VREF Volta ge re fe re nce Volta ge re fe re nce VREF 17 3 BT_RXT BT Communica te Signa l (Receive) BT Communica te Signa l (Receive) BT_RXT 3

BT
18 GND Digita l GROND Digita l GROND GND 18 4 BT_TXD BT Communica te Signa l (Send) BT Communica te S igna l (Send) BT_TXD 4
19 DVD_VR DVD VR DVD VR DVD_VR 19 5 GND GND GND GND 5
20 P D_GND DGND DGND PD_GND 20 6 I2C_SCL I2C_SCL I2C_SCL I2C_S CL 6
21 DVD_LD DVD La s er control DVD La s er control DVD_LD 21 7 I2C_SDA I2C_SDA I2C_SDA I2C_S DA 7
22 RF RF s igna l RF s igna l RF 22 8 GND GND GND GND 8
23 NC NOT CONNECT NOT CONNECT NC 23 9 NC NOT CONNECT NOT CONNECT NC 9
10 NC NOT CONNECT NOT CONNECT NC 10
CNM8 5 2 CN2 0 0 1
P in Signa l Function Function S igna l Pin
1 P VDD+33V AMP GVDD P ower(+) AMP GVDD Power(+) PVDD+33V 1
2 P VDD+33V AMP GVDD P ower(+) AMP GVDD Power(+) PVDD+33V 2
3 S GND AMP GND AMP GND S GND 3
4 S GND AMP GND AMP GND S GND 4
S MP S

5 1.2V AMP Power Supply AMP P ower S upply 1.2V 5

6 DGND GND GND DGND 6
7 5.1V AMP /MP EG Power Supply AMP/MPEG Power S upply 5.1V 7
8 5.1V AMP /MP EG Power Supply AMP/MPEG Power S upply 5.1V 8
9 P -ON MICOM Control S MP S Signa l MICOM Control S MP S Signa l P -ON 9
10 VPS AMP /MP EG Power Supply AMP/MPEG Power S upply VPS 10
11 VFD+ VFD Power Supply(+) VFD Power Supply(+) VFD+ 11
12 VFD- VFD Power Supply(-) VFD Power Supply(-) VFD- 12
13 -VP VFD Driver IC Power Supply VFD Driver IC Power S upply -VP 13

5-1 Copyright 1995-2013 SAMSUNG. All rights reserved.

 5. PCB Diagram

5.2. FRONT PCB Top

FCN1

(1)

Copyright 1995-2013 SAMSUNG. All rights reserved. 5-2

5. PCB Diagram

5.2.1. Pin Connection

1) FCN1
AUX/MIC/USB/VOLUME/KEY Control

Pin No. Signal

1 GND
2 USB_DP
3 USB_DN
4 USB_5.2V
5 MIC_SEN
6 AGND
7 MIC_SIGN
8 AGND
9 ST5.1V
10 M5.1V
11 REMOCON
12 DGND
13 KEY_AD1
14 KEY_AD2
15 VOL_UP
16 VOL_DN
17 VFD_DO
18 VFD_CLK
19 VFD_CE
20 DGND
21 VFD_VP
22 -VFD
23 +VFD

5-3 Copyright 1995-2013 SAMSUNG. All rights reserved.

 5. PCB Diagram

5.3. FRONT PCB Bottom

Copyright 1995-2013 SAMSUNG. All rights reserved. 5-4

5. PCB Diagram

5.4. MAIN PCB Top

UCN3

CN2 0 0 1 (5)
R F IC 2

MIC 1
AIC 2

TP1
RFCN1

MIC 4

MIC 2 (4)
(1) MIC 3
UCN1 B TC N 1
RFCN2

(2) (3)

5-5 Copyright 1995-2013 SAMSUNG. All rights reserved.

 5. PCB Diagram

5.4.1. Pin Connection

1) RFCN1 3) UCN1 4) BTCN1

Deck Control (Focus / Data) FRONT Panel Control BT control

Pin No. Signal Pin No. Signal Pin No. Signal

1 CD_VR 1 GND 1 BT_RST
2 CD_MPD 2 USB_DP 2 MP3.3V_PW
3 CD_LD 3 USB_DN 3 BT_RXT
4 LD_GND 4 USB_5.2V 4 BT_TXD
5 SW 5 MIC_SEN 5 GND
6 F- 6 AGND 6 I2C_SCL
7 T- 7 MIC_SIGN 7 I2C_SDA
8 T+ 8 AGND 8 GND
9 F+ 9 ST5.1V 9 NC
10 B 10 M5.1V 10 NC
11 C 11 REMOCON
12 D 12 DGND 5) CN2001

13 A 13 KEY_AD1 VFD / CD Voltage Supply

14 NC 14 KEY_AD2 Pin No. Signal

15 NC 15 VOL_UP 1 PVDD+33V
16 VCC 16 VOL_DN 2 PVDD+33V
17 VREF 17 VFD_DO 3 SGND
18 GND 18 VFD_CLK 4 SGND
19 DVD_VR 19 VFD_CE 5 1.2V
20 PD_GND 20 DGND 6 DGND
21 DVD_LD 21 VFD_VP 7 5.1V
22 RF 22 -VFD 8 5.1V
23 NC 23 +VFD 9 P-ON
10 VPS
2) RFCN2 11 VFD+
Deck Open / Close Control 12 VFD-
Pin No. Signal 13 -VP
1 SP+
2 SP-
3 SL-
4 SL+
5 INSW
6 OUTSW
7 GND
8 NC
9 NC

Copyright 1995-2013 SAMSUNG. All rights reserved. 5-6

5. PCB Diagram

5.4.2. Test Point Wave Form

TP1

5-7 Copyright 1995-2013 SAMSUNG. All rights reserved.

 5. PCB Diagram

5.5. MAIN PCB Bottom

Copyright 1995-2013 SAMSUNG. All rights reserved. 5-8

5. PCB Diagram

5.6. SMPS PCB Top

Z ! T O P ! S IL K
(1)
C N M8 5 2

Comply with the thresho ld of substances which are specified in 0QA_209

5-9 Copyright 1995-2013 SAMSUNG. All rights reserved.

 5. PCB Diagram

5.6.1. Pin Connection

1) CNM852
VFD/CD/AMP Voltage Supply

Pin No. Signal

1 PVDD+33V
2 PVDD+33V
3 SGND
4 SGND
5 1.2V
6 DGND
7 5.1V
8 5.1V
9 P-ON
10 VPS
11 VFD+
12 VFD-
13 -VP

Copyright 1995-2013 SAMSUNG. All rights reserved. 5-10

5. PCB Diagram

5.7. SMPS PCB Bottom

5-11 Copyright 1995-2013 SAMSUNG. All rights reserved.

 6. Schematic Diagram

6. Schematic Diagram

6.1. Overall Block Diagram

The Main Mpeg IC is ES8398ASA. SDRAM IC is M12L64164A.

AMP IC is TAS5342.

DVD/CD Engine The Main Mpeg control each IC in this PCB.

0

DP - 31 Mecha AM5766 Audio signal is come from CD Mecha, TUNER, AUX, MIC, BT.
Motor Drive Then MPEG IC encode them and sent them to AMP IC.

Tuner Control
This signal go to the Crystal Amplifier(TAS5342). And amplified signal is Low Pass Filtered. This signal is real audio signal.
8K - EEPROM F ront E nd

0 0
2M Flash Key
Control
(DVD) P T6315A
VF D Driver VFD
64MB

0
DRAM ES S_P3C (8398)

0
POWER
MP EG Chip S MPS
USB USB HOST
0
iP OD over us b

FM /AM

AUX F u nction
In put
ADC
0Au dio
De c oder
P WM
Control
TI AMP
630
FL

FR

Mic AMP

Copyright 1995-2013 SAMSUNG. All rights reserved. 6-1

6. Schematic Diagram

6.2. FRONT
AH07-00271A
UNDEFINED
POWER FVFD

P21
P20
P19

P18
P17

P16
P15
P14

P13
P12
P11

P10
1G

7G

6G

5G

4G

3G

2G

F+
F+
P9
P8

P7
P6

P5
P4
P3
P2
P1
F-
F-

9
8
7
6
5
4
3

2
1
32
31

30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
100NF

100NF
50V

10UF

50V
50V
FVC4

50V
1/2W

10UF
FVC3
1OHM

FVC6
FVR1 FVC7
VFD-
1/8W 1/8W 1/8W 1/8W 1/8W 1/8W
1/8W
KEY_AD2 820OHM 1KOHM 1.2KOHM 1.5KOHM 1.8KOHM 2.2KOHM 3.3KO HM VFD_GND TP3
FKR8 FKR9 FKR10 FKR11 FKR12 FKR13 FKR14
UNDEF INED UNDEF INED UNDEF INED UNDEF INED UNDEF INED UNDEF
UNDEFINED
INED UNDEF INED
UNDEF INED TP7
JTP 128 0A6 JTP 1280 A6 JTP
JTP 1280A
128 0A6
6 JTP 1280 A6 JTP 128 0A6 JTP 128 0A6 JTP 1280 A6
12800A6
JTP 128 A6

FSW10

FSW11

FSW12

FSW13

FSW14

FSW16
FSW9

FSW15
VFD+
TP21
TP12 VFD_GND
TP22
USB USB
USBREC
REC OPEN/GLOSE
OPEN/GLOS E GIGA
GIGA PARTY
PARTY DEMO
DEMO TP13
TP23 TP30
DGND FVC2 TP14 TP35
TP24
TP31
TP15 TP36
100UF
TP25
16V TP32
TP16
TP37
TP26
10UF TP33
TP17
50V TP38
TP27
TP34
FVC1 TP18
TP39
TP28
TP19
TP29
TP20

1/8W 1/8W 1/8W 1/8W 1/8W 1/8W

1/8W
820OHM 1KOHM 1.2KOHM 1.5KOHM 1.8KOHM 2.2KOHM 3.3KO HM VFD_GND
FKR1 FKR2 FKR3 FKR4 FKR5 FKR6 FKR7
KEY_AD1 UNDEF INED UNDEF INED UNDEF INED UNDEF INED UNDEF INED UNDEF INED UNDEF INED UNDEF INED
JTP 1280 A6 JTP 1280 A6 JTP 128 0A6 JTP 128 0A6 JTP 1280 A6 JTP 128 0A6 JTP 128 0A6 JTP 1280 A6
FSW1

FSW2

FSW3

FSW4

FSW5

FSW6

FSW7

FSW8

1G

7G

6G

5G

3G

2G
P9
P8
P7
P6
P5
P4
P3
P2
P1
P21
P20
P19
P18
P17
P16
P15
P14

P13
P12
P11
P10
4G
STO P REW
REW EQ MP3/CDD
MP3/C POWER
POWER TURNER AUX
AUX DELETE
DELETE

DGND
DGND

MGND1
5.1V
1 UP_VOL 5.1V
3 5.1V VFD_GND
MGND2 2 DN_VOL
UNDEFINED VFD_GND

FVOL
EVEKD2F3024M

P21
P20
UNDEFINED
1/8W UNDEF INED

1G
2G
3G
4G
5G
6G
7G
220O HM 3857ST 100NF
FMR6 FMB2 DGND 50V
10V FVC8

1N4148
220UF
FMD3

FMC5

44
43
42
41
40
39
38
37
36
35
34
100NF
MIC_SEN

FVC9
UNDEFINED

FVD3
GDZJ4.3B

75

50V
2.2KOHM

4.3

220UF
FVC10
16V
UNDEF INED

VDD
GR1
GR2
GR3
GR4
VSS

SG24/GR5
SG23/GR6
SG22/GR7
SG21/GR8
SG20/GR9
3857ST
1/8W

FMB1
FMR5

50V 1 33
FMC4

P19
50V
1UF

LED1
1UF 2 SG19/GR10 32
FMC1 MGND
MIC_SIG 3
LED2 SG18/GR11
31 P18
P17
100KOHM

4
LED3
LED4
SG17/GR12
VEE
30 -VP
FMJ1 FUC1 FUC2 FUC3
FUC3 FUC4
FUC4 51KOHM 1/8W
5 29
FUC5 P16
1/8W

OSC SG16/KS16
7 470U F
470UF 100NF 47NF 10NF 1/8W FVR8 6 PT6315A 28
6
1/4W 1/8W
10V 50V 50V 50V 470O HM 7
DOUT SG15/KS15
27
P15
AT12535250C01

FVR9
FMR3

2
100O HM
FMR2
220O HM C
2SC1008- Y VFD_DT FVR10
100OHM 1/8W
8
DIN
FVIC1
SG14/KS14
26 P14
B FMQ1 VFD_CLK 100OHM 1/8W CLK SG13/KS13 P13
10KOHM

3 MGND1 FVR11 9 25
100OHM 1/8W P12

11160-204136-01
OR3 E
VFD_CE
FMC3

STB SG12/KS12
10NF

1UF
50V

4 1 USB_5V 10 24
FMR1

P11
16V

1/8W

K1 SG11/KS11
22KOHM

5 2 USB_DN 11 23
SG10/KS10
P10
33OHM

K2
FMD1

47NF

100NF
FMC2

1 3 USD_DP
1N4148 FMD2

SG1/KS1
SG2/KS2
SG3/KS3
SG4/KS4
SG5/KS5
SG6/KS6
SG7/KS7
SG8/KS8
SG9/KS9
50V

50V
1/8W

1/8W

4 DGND
FMR7

VDD
VSS
VCC1
FMC6

VCC2
MGND2
75
1N4148
FMR4

UNDEFINED 10UF
75

UNDEF INED FUJ1 50V

12
13
14
15
16
17
18
19
20
21
22
3857ST DGND

FMB3
OPEN DGND
VFD_GND

MIC_AGND1 MGND

P1
P2
P3
P4
P5
P6
P7
P8
P9
DGND

T1 T2 T3 T4 T5
T5 T6
T6 T7
T7 T8
T8 T9
T9 T10 T11 T12 T13
T13 T14
T14 T15
T15 T16
T16 T17
T17 T18
T18 T19
T19 U1 U2 U3
U3 U4
U4

50V
1/8W
1NF REMOCON
23 C1 22O HM
UGND DGND R5.1V FRR2 1 MGND1
22
FCZ100E-23SS-K

D_P USD_DP OUT

REMOCON
21 50V
D_N USB_DN R5. 1V FRR1 2
20 1NF
U5.4V USB_5V VCC

KSM-913TE5
FRC1
MIC_SEN 19
18 MIC_SEN C2 47OHM 3 MGND2
MGND

FRD1

FRD2
MGND 1/8W FRC2 GND

UZ5.6BSB
MIG_SIG 17 MIC_SIG 50V

UZ5.6BSB
100NF

5.6
5.6
MGND 16 MGND
5.1V 15 10UF 50V
14 5.1V VFD_GND DGND
R5.1V R5.1V
REMOCON 13 REMOCON 50V
DGND 12 1NF
11 DGND C3
KEY_1 KEY_AD1 DGND
KEY_2 10
9 KEY_AD2 50V
JOG+ UP_VOL DGND
8 1NF
JOG- DN_VOL C4
VFD_DO 7
6 VFD_DT
VFD_CLK VFD_CLK
VFD_CE 5 VFD_CE
DGND 4
3 VFD_GND
VP- -VP MGND DGND
VFD- 2 VFD-
VFD+ 1 VFD+

FCN1

6-2 Copyright 1995-2013 SAMSUNG. All rights reserved.

 6. Schematic Diagram

6.3. MAIN-1

TU_RDS
POWER
AUDIO
TU3.3V_PW

PVDD+33V_A
SGND_A
VFD+_A
PVDD+33V_PW

VFD-_A

NR01
TP2002
GND1A
-28V_A

ECO_A

P33VA
VFD+A

0OHM
P12VA

TUR7
VFD-A

10KOHM
TUR6

100OHM
GNDA
-28VA

ECOA

5.1VA

FM
P12V

1/16W
AM
CN2001
1
PVDD+33V FM_S
2

20
19
18
17
16
PVDD+33V
3 +12V_A_PW TIC1
MAIN-SMPS PCB

SGND
4 FMJ1

GPO3/DCLK
GPO1
NC
SGND PBD3

DFS
GPO2/INT-
5 FMRF TUR9
12V M5.1V_PW TUR1
0OHM

MGND2 MGND1
DGND 6 TUC16 1 15 TUC9 100OHM
SCB-1113-00-2

7 0.01OHM 10PF NC DOUT 10UF 10V

2 14

MGND3
5.1V TUNER_L

MGND1
1 FMI LOUT
5.1V 8 3 13 FM
RFGND ROUT TUNER_R

C3004
9

VT4001
ECO TUC17 4 12

220UF

100NF

TL1

100NH
C3005
P_ON LPI GND TUC1 0 TUR2
10

12
VPS 2PF 5 11 10UF 10V 100OHM

47UF
TUC12 100NF
/RST
50V DGND VDD

TUC2
11

33KOHM

33KOHM
VFD+

TUC3
VFD+

TUR3

TUR4
22PF
22PF
12

RCLK
SCLK
DGND

SDIO
/SEN
VFD- VFD-

VIO

6.3V
13
-28V VP-

ESDC1

TUC5
DGND MP3.3V_PW

ESDC2
TU3.3V_PW

50V

470NF 50V

6
7
8
9
10
DGND

SGND
GND
ECO
VFD+
GND11

P33V
VFD-

12V
TUR1 5

470NF
PVDD+33V
-28V

5.1V
AM_S TUX1

2
4

8
6
ANT1 32.768HZ 0OHM
AM 1 Q0 Q3 4 DGND
TUC1 5
DGND 3
2

100OHM 1

7
3
5
AM_G 470NF 1 2

VT4002
2 3

TUR18

FM_RDS
1 25V

AM

0OHM

TUR17
Q1 Q2 3 4

12
5 6

22PF 50V
22PF 50V
7 8

TUC18

TUC19
AM
TUR16
FMRF 10KOHM
DGND
4730 US E DGND

DGND

TU_RST

TU_CLK
TU_DA
TU_CE
TIC1 OPTION SPEC TUR9 TUR18 TUR6 NR01
1204-002700 FM 4702 0 OHM 0 OHM OMIT 0 OHM
1204-003347 AM 4730 OMIT OMIT 10KOHMOMIT
1204-003345 RDS 4705 OMIT 0 OHM OMIT OMIT
USB5V_PW
M5.1V_PW
U_GND_

TP2001
USB5V

U12A
U13A
U14A
U15A

U17A
U18A
U19A
U11A
U1A
U3A
U8A

U5A
U6A
U7A
U2A
DN_
DP_

VFD+ VFD+
VFD- 23
22 VFD-
-28V VP-
DGND 21
VFD_CE 20 VFD_CE
VFD_CLK 19 VFD_CLK
MAIN-FRONT PCB

VFD_DO 18
VFD_DO
JOG- 17 VOL_DN
JOG+ 16 VOL_UP
15 TPTX
KEY_AD2 KEY_ADC2 UCN3
KEY_AD1 14 KEY_ADC1

GCC02-0096
DGND 13 UART_RX 5
12 M5.1V_PW 4
REMOTE REMOCON_IN UQ2
5.1V 11 AO3415AS
5.1V 10 2
D

9 UART_TX 3
6V
UF 116V

AGND
100KOHM

UR5
UC1

UR7

8 1
G

MIC_SIG MIC_SIG
7
11UF

AGND 100OHM
MIC_SENS 6 MIC_S ENS TPRX
USB5.2V 5
UR3
10KOHM

D_N 4 33OHM DGND

UC2

UR6
100NF

D_P USB_DN
3 33OHM USB_DP
GND 2 UR4
47KOHM
USD1

UR1

UR2

1
47KOHM

C
B
P_O N1
U_GND

DN
DP

U1
U3
U8

U5
U6
U7
U2
USB5

UCN1
U11
U10
U12
U13
U14
U15

U17
U18
U19

E
UQ1
DTC114EU
DGND
DGND

Copyright 1995-2013 SAMSUNG. All rights reserved. 6-3

6. Schematic Diagram

6.4. MAIN-2

SPMO_N
SPMO_P
MOCTL
POWER MP3.3V_PW
AUR6R
220O HM
RF5V_PW AUX_R AUXI_R
AUR6L
C3002 220O HM
100NF 10V
AUXI_L

22UF 6.3V
AUX_L

RFR1

RFC4
4.7OHM

RFR2
10KOHM

AUR7R
AUR7L

AUC5R
1/16W

AUC5L
RFR14

47KOHM
1/4W

RFR21

47KOHM
RFR23

OPTION

OPTION
4.7KOHM

10KOHM

10KOHM
EMC IMPRO VE

220PF
220PF

VD6

VD5
RFIC1 TG1 TG2
TG2 TG3
TG3 TG4
TG4

1/16W

1/16W

1/16W
RF5V_PW RFR15
RFR 28 1 OUT1 8 1KOHM
10KOHM VCC 1/16W

RF5V_
2 7
RF5V
1/16W IN1-

RFQ1
E
OUT2
B CDLD 3 IN1+ 6
RF5V_PW DM5V_PW
DM5V_PW RFC1 8 SW IN2-
4 5
C
100P F RFR 3 GND
RFBD1 A DGND

RFR18

RFR22
RFC7 220OHM IN2+

2.2KOHM

680OHM
100P F

1MOHM
0.01OHM

RFR16
B

1/16W
RFC8

1/16W
100P F

1NF 50V

1/16W
MVRER
FRGND

PUHRF

1NF 50V

RFC6
RFC5
RFC9 C
100P F

RF10
RF11
RF12
RF13
RF14
RF15
RFC1 0 D

RF1
RF2
RF3

RF5
RF6
RF7
RF8
RF9
RFC N1 RFC 3 100P F
(NC) RFR 31 CDVR
22O HM

100NF 10V
RFR17

RFR19

RFR20
RFC14
330UF CDLDO

18KOHM

22KOHM
23 EMCBD1

3.3KOHM
NC DGND

1/16W
100NF 10V

1/16W

1/16W
22 AUXR AUXL
AUXL

RFC20

RFR4
47KOHM
RF

RFD2
21 RFC 2 PUHRF

1/16W
EMC1
DVD_LD 0.2O HM

15PF
20 10UF
PD_GND 19 EMC2 AUXI_L 4
DVD_VR 18 100P F AUXI_R 2
GND 17 RFC 1 3
VREF MVREF 1
16 DGND DGND
VCC 15
NC 14 10UF
NC 13 DGND
A 12
A VJK2
D D
11

DVDVR
DVDLD
C C
10

D_VR
D_LD
B B
9
F+ FOC US_P
8 MPR1
T+ TRACK_P 12
12
7 TRACK_N
T- 10KOHM

47KOHM
6

MPC9
MPR2
F- FOC US_N

10UF
5 SW MPIC1 MPBD4 MP3.3V_PW A3.3V_PW
SW 4 MPL2
LD_GND M5.1V_PW 4.7UH 0.01OHM MPBD1
3 CDLDO 1 8
CD_LD 2 2
PGND NC
7
CD_MPD MPD VIN SS 22O HM
1 3 LX
6

1.1KOHM
CD_VR CDVR

MPR14
AGND EN
4 FB COMP
5 MPBD5
0.01OHM

6.3V
DGND
GND1

MGND1 MPR5
TP1
TP2
TP3

TP5
TP6
TP7
TP8
TP9
TP10
TP11
TP12
TP13
TP14
TP15
TP17
TP22

MPC13
10UF 10V

MPC12
10UF 10V
MPC1

MPC2

100NF
30KOHM

MPR4
MPC38.2KOHM
MPR15
10KOHM

47KOHM
MPR3

MPC11
DCLOAD_N
DCLOAD_P

1/10W

33NF

47UF
SLED_N
SLED_P

OUTSW
SPMON

RFGND
SPMOP

2.2NF
INSW

RFCN2
RFR 50
1 33OHM
SP+ 2 SPMO _P OPEN_SW DGND
DGND
10022HS-09C

SP- SPMO _N

P_ON2
3.3C
3 CLOSE_SW
SL- SLED_N
RFC11

RFC12

4 RFR 51
RFR52

RFR53
47KOHM

47KOHM

SL+
100NF

SLED_P
100NF

5 33OHM
INSW 6 MPR6
OUTSW 7
12
12

GND 1KOHM

MPR7
10KOHM
NC 8
9 MPL1 MPBD2 MP1.35V_PW
NC M5.1V_PW 0.01OHM
DGND 4.7UH

MGND1
1 PGND 8
NC
2 VIN 7
RF_1
RF_2
RF_3
RF_4
RF_5
RF_6
RF_7
RF_8
RF_9

SS

MPR11
3 AGND LX EN 6
RFR 49

1/10W
4 FB 5
RFC 17 33OHM COMP MPBD3

3.3KOHM
DA MPR10 0.01OHM

MPC86.3V
MPIC2 3.6KOHM
RFR 48

10UF 10V

MPC14
10UF 10V
100NFF 10V
100N

MPC4
3.3KOHM

MPC5

100NF
1/10W

MPR9
8.2KOHM
RFIC2 DRV

1/10W
RFR 32

33NF 16V
10KOHM
MPR8

MPC7
RFR 47
22KOHM 1KOHM

47UF
1/10W
1 28
FOC US VINFC MUTE
2 27

MPC6
MGND1

1/16W TRB_1 BIAS 1/16W

RFR 33 3 26

50V
2.2NF
1/16W
6.8KOHM REGO2 VINTK TRACK RFR 42
SLEGN 4 25 RFR 46
VINSL+ TRB_2 1KOHM
1/16W 5 24 39KOHM
REGO1 OPOU T
1/16W OPOUT
6 23 RFR 45
RFR41
RFR43

27KOHM

1/16W
1MOHM

CLOSE FWD VINLD

1KOHM SPINDLE
7 22 DGND
1/16W

1/16W

OPEN REV GND

RFR 39 RFR
RFR40
40 DGND
8 21
Vcc1 VCTL 10KOHM 1.2KOHM M5.1V_PW
9 20 1/16W
VOTR- OPIN USB5V_PW
10 19 RFR 44 1/16W 1/16W USIC1
RFR38

VOTR+ Vcc2 22KOHM

3.3KOHM
MGND2

11 18
1/16W

SLED_N VOS L+ VOLD- SPMO_N

12 17 RFR 37 1 6
SLED_P VOS L- VOLD+ DGND IN OUT

FOC US_N 13 16 2.2OH M 2 GND ILIM

5
VOFC- VOTK- TRACK_N 1/8W 3 4
14 15 SPMO_P USB_EN EN /FAULT
FOC US_P VOFC+ VOTK+ TRACK_P
RFR35

RFR34

10UF
10UF
1/8W
10KOHM
10KOHM

10V
10V
1/16W

1/16W

RFR 36

10UF 10V
USR1

USR2

16.5KOHM

C3003
10KOHM

10KOHM

USC3
USR3
2.2OH M

100NF
USC1
USC2
RFC16
RFC15
330UF

10UF
10V

M5.1V_PW M5.1V DGND DM5V_PW

16V

MPQ3 USB_FLG
AO3415AS
D
S
MPR12

MPC10
6V
UF 116V
100KOHM
1/16W

DGND
G
11UF

MPR13
10KOHM
1/16W

P_ON
C
B MPQ4
P_O N DTC114EU
E

DGND

6-4 Copyright 1995-2013 SAMSUNG. All rights reserved.

 AUDIO
POWER
6.5. MAIN-3

12507HS-H10M
MGND2

BTCN1
MIC2

MP3.3V_PW
BTC6
C73 1 54

MGND1
100NF

1
2
3
4
5
6
7
8
9
10V VDD VSS 100PF

10
2 53

1
1
1
1
0
0
0
0
DB0 DQ0 DQ15 DB15 100PF

PLL2
C74 100NF 3 52 BT8
10V VDDQ VSSQ BT8B BTC7
DB1
4 DQ1 DQ14
51 DB14
BT7
BT7B
5 50

1
BT1

1
1
0
0
1
0
0
DB2 DQ2 DQ13 DB13 BT1B

PLL1
6 VSSQ VDDQ
49 C79 100NF BT4
BT4B
7 48 10V BT5
DB3 DQ3 DQ12 DB12 BT5B
8 47

1
0
1
1
0
DB4 DQ4 DQ11 DB11 BT16
BT6B
C75

0 1
100NF 9 VDDQ VSSQ
46
10V 10 45 BT2 BTC1 100NF
DB5 DQ5 DQ10 DB10 BTR1
11 44 MC12 4.7KOHM

1 0 4.5

5.5
6.0
5.0
DB6 DQ6 DQ9 DB9 BTC215PF

4.75

5.75
5.25
12 43

PLL0 MULTI
VSSQ VDDQ

0 0 BYPASS
13 42

SPINDLE
DB7 DQ7 DQ8 DB8 BTC3 BTR2

USB_DP
USB_DN
TRACK
SLEG N
FOCUS
C76 100NF 14 41 100NF 10V 15PF
VDD VSS
BT3
MP3.3V_PW

162
135
10V 15 40 4.7KOHM

M12L64164A-5T
LDQM NC

148.5
121.5
DQM BTC4

N/A

155.25
141.75
128.25
16 39
BTBD2

10UF
BR1

BT OPTION
DWE# /WE UDQM DQM

FRE Q
CAS#
17 /CAS CLK
38 DSCK
18 37 BTC5100NF
/RAS CKE MC63
BR2

RAS0# 470NF
19 36

Copyright 1995-2013 SAMSUNG. All rights reserved.

CS0# /CS NC MR47

DGND
20 35 4.7KOHM 25V

1
0
RAS1# A13 A11 MA11

1
0
1
0
DGND

PL3
21 34 MC64

S_L
OTP
RAS2# A12 A9 MA9 10NF
22 33
33O HM
33O HM

0.2O HM

A10/AP A8
BTBD3 0.2O HM

MA10 MA8 50V

23 32
BTBD1

MA0 A0 A7 MA7 MC65

0.2O HM
0.01OHM

MA1
24 A1 A6
31 MA6 470NF
MA2
25 A2 A5
30 MA5 25V
26 29 MC66

CRYSTAL
MA3 A3 A4 MA4 10NF DTC114EU

TEST MODE
TEST MODE
MC77 27 28

DCLK INPUT
BTBD4

S_P_OPTION
VDD VSS
BT_TX

CLK SOURCE
BT_RX

BR4
I2C_SCL

50V
I2C_SDA

E
C

100NF

NORMAL MODE
NORMAL MODE
10V 10KOHM
B

MP3.3V_PW 1/16W D
BT_RST

DGND
BQ2

MR89
MR88
MR87
MR86
BQ1

1UF 16V S
MC1 MR1
AO3415AS

15PF 4.7KOHM BTC8

4.7KOHM
MR90
MC2 MR2 100KOHM
P_O N2

DGND
MA0
MA1
MA2
MA3
MA9
MA8
MA7
MA6
MA5
MA4

RAS1#
RAS2#

S_P_O PT

MP3.3V_PW
15PF 4.7KOHM
PUHRF

1KOHM
1KOHM

MA10
MA11
MVREF
MIN

OTP
OPOUT
C
B

D
A

MPD
1.2KOHM
1.2KOHM

BR3
1/16W

MC67
MP3.3V_PW

MC3 MR3
15PF 4.7KOHM

10UF
MC61

MC68
MC4 MR4 100PF
16V
15PF 4.7KOHM
6.3V
100NF
50V
MR5
4.7KOHM

MR6

MC74
MC72
MC70
MC69
MC62
MC59

MR96
MR95
MC10
MC60

MC76
MC75
4.7KOHM

16V
10UF

33OHM
MC58

16V
16V
16V
16V
16V
16V

50V

16V
6.3V

100NF
100NF
100NF
100NF
100NF
100NF

100NF
100P F
680P F

100NF

33OHM

PLL0
PLL1
PLL3
PLL2

OTP
PLL3
PLL2
PLL1
PLL0
MP3.3V_PW

176
175
174
173
172
171
170
169
168
167
166
165
164
163
162
161
160
159
158
157
156
155
154
153
152
151
150
149
148
147
146
145
144
143
142
141
140
139
138
137
136
135
134
133

MP1.35V_PW

S_P_OPT
F
E
D
C
B
A

VDD
VDD
TRO
SLO
FOO
DMO
SLV
MIN
VGA
VPA

VD33
VD33
DVCC
REFD
CDPD
DRFP

MAR1
AVS33
AVD33

DMA[0]
DMA[1]
DMA[2]
DMA[3]
DMA[9]
DMA[8]
DMA[7]
DMA[6]
SYSC LK
DMA[5]
DMA[4]
USB_CP
USB_DM

100OHM

DRAS1_B
DRAS2_B
DMA[10]
DMA[11]
VS33/VSS
USB_AGND
USB_VCCA

1 2 1 132 MR85 470KOHM

CS0# DCS0_B SPNP
RAS0#
3 4 2 DRAS0_B
131 SPNN MOCTL
5 6 3 130 MC55 1NF 50V MC57
CAS# DCAS_B AGC1
7 8 MR12 4 129 MC54 100PF 10UF
DWE# DWE_B AGC2 50V
68OHM 5 128 MC56
DSCK DSCK VBO MVREF
MR13 16V 100NF 6 127 100NF
33OHM VDD CDLD CDLD
MC14 7 126 MR84 10KOHM MC53 10PF
DQM DQM REX 50V
100NF 8 125 MC52 22NF 25V
16V VD33 PI MIN
MAR2 9 124
100OHM MC16 VS33/VSS V165O DA
1 2 15PF MC15 10 123 MC82 100PF
DB7 DB[7] FE FE
3 4 50V 11 122
DB6 DB[6] TE TE
5 6 12 121 MC50 4.7NF 50V
DB5 DB[5] MB MC51
7 8 13 120 MC49 1NF 50V 10UF 6.3V
DB4 DB[4] DB
1 2 14 119 MC48 100NF 16V
DB3 DB[3] MP
MAR3 3 4 15 118
DB2 DB[2] VGB MR70
100OHM 5 6 16 117 MC47 100NF 16V
DB1 DB[1] VPB 10KOHM
7 8 MC17 17 116 MC11 100PF MP3.3V_PW
DB0 DB[0] OPEN/VOBS
100NF 18 VDD OPENSW
115 MR82 100OHM
16V OPEN_SW
1 2 19 114 MC13 100PF MR71
DB8 DB[8] CLOSE/VOBS1
MAR4 3 4 20 113 MR80 100OHM
DB9 DB[9] CLOSESW CLOSE_SW
100OHM 5 6 21 112 10KOHM
DB10 DB[10] AMPSTBY DRV
7 8 MC18 22 111
DB11 DB[11] SR[31]
100NF 23 110 MC83 100NF
16V VD33 SR[30]
24 109 MC9
VS33/VSS AUX[4] REMOCON_IN
1 2 25 108 MR76 100OHM 47PF
DB12 DB[12] AUX[5] BT_RST
MAR5 3 4 26 107 MR75 100OHM
P3CD

DB13 DB[13] SOUT BT_TX

100OHM 5 6 27 106 MR74 100OHM
MIC1

DB14 DB[14] SIN BT_RX

7 8 28 105 MC46 100NF 16V
DB15 DB[15] VDD
MR14 100OHM 29 104 MC45 100NF 16V
UART_RX AUX[7] VD33
MR15 100OHM MC19 16V 30 103
UART_TX AUX[6] VS33/VSS
1204-003466

100NF 31 VDD SPDIF_OUT

102 MR72 10KOHM MP3.3V_PW
MC20 32 101
VD33 SR[26]
100NF 16V 33 100 MR68 33OHM
VS33/VSS SR[25] KEY_ADC2
34 99 MR67 33OHM
RESET RESET_B SR[24] KEY_ADC1
I2C_SCL MR16 33OHM 35 AUX[1] SR[23]
98 1 2 1 TU_DA
MR17 33OHM 36 97 MAR9
3 100OHM
4
I2C_SDA AUX[0] SR[22] TU_CLK
MR18 33OHM 37 96 5 6
SPI_CS2 SPI_CS2 SR[21] TU_RST
SPI_CS3
38 SPI_CS3 SR[20]
95 7 8 USB_EN
MR20 33OHM 39 94 MR62 100OHM
SPI_CLK SPI_CLK SR[07] USB_FLG
MR21 33OHM 40 93
SPI_DI SPI_DI SR[06]
MR22 33OHM 41 92
SPI_DO SPI_DO SR[05]
TP_RST 42 91
SPI_CS MCLK SR[04]
43 90 MC44 100NF 16V
OP[0] VD33PLL
100NF 44 VDD VS33PLL
89
16V
MC21
DGND

MR92
MR91
MR24
1
OP[1]
OP[2]
OP[3]
OP[4]
VD33
VSS33/VSS
OP[5]
OP[6]
OP[7]
AUX[2]
AUX[3]
VDD
SR[17]
SR[16]
SPDIF_IN
SR[03]
VID_XO
VID_XI
VS33ADAC
VD33ADAC
DAC_O1
DAC_O2
DAC_O3
VD33ADAC
VS33ADAC
MIC
VDDAADC
LINE_IN_R3
LINE_IN_L3
LINE_IN_R2
LINE_IN_L2
LINE_IN_R1
LINE_IN_L1
VD33AADC
LINE_IN_R0
LINE_IN_L0
VDD
VD33
SR[10]
SR[11]
SR[12]
SR[00]
SR[01]
SR[02]

45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88

16V
100NF
MC22

2
10KOHM
10KOHM
10KOHM
GND
MR25

/RESET,RESET
MIC5

DGND
8.2KOHM
7
5
3
1
7
5
3
1
7
5
3
1
MP3.3V MP3.3V_PW

MR28
MR30
MR39
MR44
MR45
MR46
MR7
MR8

MC24
MC25
MC28
MC29
MC42
MC43

RT9818C-42PV
MR42
MR43

VDD
MR93

16V

MP3.3V_PW
100NF
21

MC23
21

3
MAR8
100O HM

8
8
2
8
6
4
2

100NF
100NF
100NF
100NF

33O HM
33O HM
33O HM

M5.1V_PW
10KOHM

MP3.3V_PW
100O HM
100O HM
27KOHM
27KOHM
27KOHM
27KOHM
27KOHM

4 MAR6
4 MAR7

16V
16V
16V
16V
100NF 16V
100NF 16V

6 100O HM
6 100O HM

DGND
5
MC32
MC33
MC34

MC30
MC31

MR31
10KOHM
10KOHM
10KOHM MR32
10KOHM
MR33 MC78100PF MR50A
P_ON1

TI_RST
I2C_WP
10UF
10UF
10UF
10UF

MR34 MC79100PF 2.2KOHM

PWM_AM1

MR29 MC80100PF
DGND

10KOHM
10UF 6.3V
6.3V
6.3V
6.3V
6.3V

10KOHM MR98 MR40

10KOHM
4
3
2
1

DGND

10KOHM MR99 100KOHM

MR11
X1
SPI_DI
A2
A1
A0

MC6
SPI_CS
VSS

27MHZ
MC7
TP65
MIC3

MC8
AUX_L
AUX_R

OPLCH
OPRCH
VFD_DI
SCL
VCC
WP

SDA

VFD_CE
VFD_DO

10NF
UNDEFINED

MIC_SIG

DGND
VFD_CLK

TUNER_L
TUNER_R

10NF MR79
27PF
27PF

SP_CS 10NF
5
6
7
8

MC26
MC27

3SP_DI MC41
50V
50V

100NF 10KOHM
SP_GND
SPI_DI

4
3
2
1
5SP_3.3V
SPI_CS3
SPI_CLK

SPI_DO

MP3.3V_PW
RESET

MC37
P_ON
TI_SD
DGND

100NF MC39
P_ON2
VOL_UP

16V
TU_RDS
VOL_DN

/CS

GND
MIC_SENS

MC38 10UF
DO(IO1)
/WP(IO2)

10UF 6.3V MC71

MIC4

100NF
/HOLD(IO3)

DI(IO0)
TP 1

6.3V
CLK

MR48
VCC

MC81 MC40 2.2KOHM

A3.3V_PW

OPTION 100NF
330UF
16V
AD6

5
6
7
8
SPI_DI

MR54 SP_3.3V MR49

1N4148WS

820OHM
SPI_CS
SPI_CS3

SPI_CS2

2.2KOHM
MB1
0.01OHM
CB2012UA300T
5_RS

MC5
DGND
MD2
EMULATOR OPTION

47PF MR50
1_CS 3

BOOT ON-BOARD FLASH

BOOT WITH EMULATOR

4SP_DO
30

2SP_CLK 10KOHM
MR23 0OHM
MP3.3V_PW

OPTION
MP1.35V_PW
33O HM

MP3.3V_PW
OPTION
MR26
MR19

33O HM
I2C_WP

I2C_SDA
I2C_SCL

SPI_DO
SPI_CLK

6-5
6. Schematic Diagram
6. Schematic Diagram

6.5.1. Test Point Wave Form

TP1

6-6 Copyright 1995-2013 SAMSUNG. All rights reserved.

 6. Schematic Diagram

6.6. MAIN-4

POWER PVDD+33V_PW
AUDIO

10KOHM

APR4
1/10W
APR3

TI_RST
100KO HM
M5.1V_PW APD1 1/10W
E
APQ1

APD2
APR2 B

5.6
C

0OHM SRA2203S
1/10W BAT54C
30
DGND B
C
APQ2
SRC1203S E

AMP MUTE CIRCUIT DGND

R-
PVDD+33V_PW
FL+

3.3OHM
AR31

100NF

18OHM
AR13

3.3OHM
AR17
+12V_A_PW 0OHM

AR28
AR22 OPTION

1MF

AC29
10OHM

R+
100NF
470NF
AC23

AC33
L1 L11

330PF

10NF
AR21 TAS5342ADDV 1 4 1 3

AC60
AC55
1UF

AC41

10OHM
1UF

AIC2
AC40

10NF
AC56
1 GVDD_B 44
2 GVDD_A
43 AC54
/OTW 2 3 2 4

AC24

AC34
AC27
BST_ A

18OHM 330PF
3 42

10NF
NC
NC 33NF DGND DGND
4 41

AC30
NC
DGND 5 PVDD_ A

100NF
TI_S
TI_SDD /SD 40 DGND
PVDD_ A
6 39

AR18
OPRCH

AR14
PWM_A

3.3OHM
OUT_ A
OUT_A
TI_RS T
7 /RESET_ AB 38 SPK2
GND_ A
AR24 8 37 AR30
AR23 22KO HM PWM_B
GND_ B 0OHM MGND2
0OHM 9 OC_ ADJ 36 AC53 4
OUT_ B
OUT_B + -
10 35 33NF 2
AC42

OPTION
330PF

GND
PVDD_ B
11 AGND 34 AC50 1
BST_ B
12 VREG 33 100NF 3 - +
BST_ C
AC43 13 M3 32 AC51 100NF AR32

AR19

3.3OHM
18OHM
PVDD_ C

AR15
DGND 14 31 AC52 0OHM
15
M2
OUT_C
OUT_ C
30 33NF OPTION MGND1
M1 AC57 1MF DGND

AC31
GND_ C
100NF 16 29

100NF
PWM_C
OPLCH GND_ D
17 /RESET_ CD 28 AC25

AC35
470NF
OUT_ D
OUT_D
18 27 AR29 AC58 330PF L21

10NF
PWM_D
PVDD_ D
+12V_A_PW 19 26 3.3O HM 10NF 1 4 1 3
AR25
NC
PVDD_ D AC48
+12V_A_PW 100NF
3.3O HM
20 NC 25 AC49
21 NC
24 33NF DGND
VDD
BST_ D
22 GVDD_C 23 2 3 2 4

AC28
AC26

AC36
18OHM 330PF

GVDD_D

10NF
AR26 AR27 DGND DGND
10OHM 10OHM

AC32
L2

100NF
1UF
AC47
1UF
AC44

AC46

L+
3.3OHM
AR20
AR16
100NF
10UF
AC45

AR33
0OHM
OPTION
DGND

L-
Copyright 1995-2013 SAMSUNG. All rights reserved. 6-7
6. Schematic Diagram

6.7. SMPS-1
RM851
1(32 16) TRM853 B-28V_DC_S
B+_380 V_CT_P N201_S N202_S
f KTD863
CM879
B-28V_20 0V_SW_S DM852 TO-92L
UF4004 CM853 470nF 50V CM858
TM892S
100nF 50V RM861 (20 12) 22uF 50V
EE25 25W
(16 08) 3.3K(1608) N205_S RD
PS-O N_S
N203_S N204_S
EY811
f EY810 RM801
CM892
RM891
CM852 RM860
CM805 10uF 50V N.C
DBM801 10K(1608) RM876
CM806 630V 10nF 68K N.C CM880
GBU605 f 1KV 10nF 2W
{  RD
(20 12)
(16 08) TRM854
220nF 50V
1(16 08)
+
N101_P KTN2907AS
600V,6A CM801 (16 08)
S OT-23
450V 120uF
RU DM801 DM891 TRM891 GND_S

-

GND_P UF4007 FBM801 SB1 100 KTA1572

3.5*5.0 N206_S TO-92L
EY809
Radial
Drain1_550V_S W _P N102_SW _P B12V_DC_S
B12V_80 V_SW_S TRM892
RM893 KTN2222AS RM895 CM897
PS-O N_S 10K(1 608) S OT-23 10K 470nF 50V
(16 08) (20 12) N210_S
EY808 N209_S
LI_ LX2 _ P NE _ LX2 _ P N207_S CM862
2

RM802 CM863 CM896

DM802 RM896 25V 100uF
10(3 216) 100n 50V
UF4004 25V 100uF RM894 CM895 10K(3 216) RD
LX802S (160 8)
f CV615280S
VCC1_CT _P N103_P N104_SW _P
{ RD 10K 100n 50V
N208_S
(16 08) (16 08) RM897
1(16 08)
EY812
1

EY807

5
L1_NT_P CM898
N.C A5.3V_DC_S GND_S

GND

VCC

N.C

Dra in
A5 .3 V_ 4 0 V_ S W_ S N2 1 1 _ S
f CM803
DM857 FBM851
CX802S SB3 100
EY806 f 275VAC, 0.33uF
ICM801
CM815 50V 47uF {
DM858
3.5*5.0
Axial
DM853

N.C
ICE3B R1765JZ

F.B
CM861

BA
CM859

CS
100nF 50V RD 3.3V
SB3 100 CM857 CM871 50V 22uF
10V 470uF
f (16 08)
10V 1000uF 10V 1000uF RD
S OD-123
RD
DM859

4
NT80 1S {  RD RD
N.C
5D-15
RM869
1(32 16) GND_S B+3.4V_DC_S
EY805 CS1_CT _P N2 1 2 _ S N2 1 3 _ S

BA_CT_P VFD_30V_S W_S CM877

DM851
470nF 50V
UF4004 TRM851
EY804 CM851 (20 12)
RM803 KTC3205 CM873 N215_S
LI_LX1_P NE_LX1_P CM802 2W 1.0 50V 47uF TO-92L
2

10nF 100 V CM878 CM899

220nF 50V RD 220nF 50V RM822 N.C
LX801S f f (16 08)
RM85 8
10K(1608)
RM875 (1608) N.C(1608)
f CV615280S CY891S CY892S
N214_S 1(1608) B-3.4V_DC_S
250VAC 250VAC
1000pF 1000pF FB1_CT_P
1

EY803 RM859
10K(3216)
RM804
4.7(3216)
N111_P
RM853 RM872
RX801S GND_S 1K(1608) 5.1K/F GND_S
f 1/2W 1.2M (1608)
N216_S
N219_S RM879
DM803 DM804 CM804 RM854 20K/F
12V,1000mW 1nF 50V
S OD-123
N.C
(1608)
f 1K(1608) RM856 (1608)
680/F
IC891S N225_S
CX801S
f 275VAC,0.33uF LTV817(B) CM872
(1608)
RM877
33pF 50V 4.7K(3216)
(1608) N226_S
CM856
L1_FP _P TRM855
100nF 50V
N218_S N220_S KTN2222AS
(1608)
VX801S GND_P N217_S S OT-23
f 14D751
f RM855
GND_S
f N112_P 10K(1608)

FP 801S VCC2_CT_P CY895S

DM812 TRM852
T3.15AL/250VAC TRM811 RM812 250VAC ICM851 RM873
RB551V-30 15K(1608) RM857 KTN2222AS P S -ON_S
KTN2907AS 470pF KIA431AM 20K(3216)
S OD-323 GND_P GND_S 6.8K/F S OT-23
S OT-23 S OT-23
N113_P (1608)
N224_S
EY801 EY802
LI_ IN_ P NE _ IN_ P CM860
RM811 1nF 50V
CM891 15K(1608) GND_S (1608)
DM811
N.C
1
2

N114_P N115_P
f PD8 01S

YW396-03AV(WHITE)
1N4148W
S OD-123
f
IC892S GND_S
LTV817(B) DM855
RM871 1N4148W
680(3216) S OD-123
N2 2 1 _ S N222_S N2 2 3 _ S

GND_P

6-8 Copyright 1995-2013 SAMSUNG. All rights reserved.

 6. Schematic Diagram

6.8. SMPS-2

CY894S
f 250V TA891S
470pF f EER3335H
B+_38 0V_CT_P GND_S
CA851
1KV 10nF
EY814
RA809 CA809 DA861
{ B33V_DC_S
2W 68K 630V 10nF S F35G N251_S

LA851
VCC2_CT _P N151_P B33V_15 0V_SW_S DA862
5*18, 2. 2uH
S F35G
BAR CHOKE
DA805 { EY815
DA806
UF4007 FBA801 DA863
N.C
3.5*5.0 S F35G
Radial CA854 CA862
N152_SW _P  { {
RA811 50V 680uF RA861 100nF 50V
68K(1 608) Drain2_550V_ S W_P MK CA857 22K(2 012) (16 08)
N153_P
N.C
EY17
MA801
ZC_CT _P 1 8 {
ZC GND TMP F10N65A
FB2_CT_P 2 7 DA807 TO-220F f EY816
FB VCC RB551V-30
S OD-323
CS2_CT _P Gat e_CT_P N155_P CA808
3 CS GATE 6
RA801 1KV 220 pF
CA801 RA806
10K
68pF 50V 4.7(3216)
(160 8) 4 HV HV 5 GND_S
(16 08) DA802 N156_P HS801
4.7V RA803
SO D-123 ICA801 33K(2 012)
RA805 f GND_P N252_S
220(3 216)
f ICE2Q S03
DA853
N157_P 18V
RA804 SO D-123 CNM852
RA858
N158_P 1K(20 12) EY813
RA807 43K/F (1608)
RA802 CA805 RA853
CA806 RA854 13
18K(1608) 1uF 50V 5W 0.1 B33V_DC_S
220pF 50V 3.3K(1608) 1.5K(1608) 12
(20 12) B33V_DC_S
(16 08) N256_S GND_S 11
10 GND_S
N159_P TRA801
B12V_D C_S 9
KTN2222AS 8
N253 _S GND_S
S OT-23 RA857 A5.3V_DC_S 7
6 A5.3V_DC_S
15K/F(1608)
CA861 P S -ON_S 5
4 GND_S
f 33pF 50V
(1608) B+3.4V_DC_S 3
IC893S 2 B-3.4V_DC_S
B-28V_DC_S 1
LTV817(B)
DA801 CA803
RB551V-30 1nF 50V DA803 CA853 N255_S
12V CA802 N257_S
S OD-323 (1608) 22nF 50V RA855 127301113K2
S OD-123 1nF 50V
(1608) 100K(1608)
(1608) N254_S

ICA851
KIA431AM
RA859
S OT-23
4.7K/F(1608)

GND_P

CY896S
GND_S
N.C

GND_P GND_S

Copyright 1995-2013 SAMSUNG. All rights reserved. 6-9

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Area Web Site

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https://gspn1.samsungcsportal.com
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E.Asia, W.Asia,
https://gspn2.samsungcsportal.com
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N.America, S.America https://gspn3.samsungcsportal.com

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Co.,Ltd.
2013 Samsung Electronics Co.,Ltd.
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All rights reserved.
applicable International and/or domestic law.
Printed in Korea