Description: 1out 1IN 1IN + GND V 2out 2IN 2IN +

SLCS115E DECEMBER 1986 REVISED JULY 2003
D Very Low Power . . . 110 W Typ at 5 V D, JG, P, OR PW PACKAGE

(TOP VIEW)
D Fast Response Time . . . tPLH = 2.5 s Typ
With 5-mV Overdrive
1OUT 1 8 VDD
D Single Supply Operation: 1IN 2 7 2OUT
TLC393C . . . 3 V to 16 V 1IN + 3 6 2IN
TLC393I . . . 3 V to 16 V GND 4 5 2IN +
TLC393Q . . . 4 V to 16 V
TLC393M . . . 4 V to 16 V
TLC193M . . . 4 V to 16 V FK PACKAGE
D On-Chip ESD Protection (TOP VIEW)
1OUT
VDD
NC
NC
NC
description
The TLC193 and TLC393 consist of dual 3 2 1 20 19
independent micropower voltage comparators NC 4 18
1IN 5 17 NC
designed to operate from a single supply. They
NC 6 16 2OUT
are functionally similar to the LM393 but uses
one-twentieth the power for similar response 1IN + 7 15 NC
times. The open-drain MOS output stage NC 8 14 2IN
9 10 11 12 13 NC
interfaces to a variety of loads and supplies. For
a similar device with a push-pull output
GND
2IN+
NC
NC
NC
configuration (see the TLC3702 data sheet).
Texas Instruments LinCMOS process offers NC No internal connection
superior analog performance to standard CMOS
processes. Along with the standard CMOS
advantages of low power without sacrificing symbol (each comparator)
speed, high input impedance, and low bias
currents, the LinCMOS process offers ex- IN +
tremely stable input offset voltages, even with OUT
differential input stresses of several volts. This IN
characteristic makes it possible to build reliable
CMOS comparators.
The TLC393C is characterized for operation over the commercial temperature range of TA = 0C to 70C. The
TLC393I is characterized for operation over the extended industrial temperature range of TA = 40C to 85C.
The TLC393Q is characterized for operation over the full automotive temperature range of TA = 40C to 125C.
The TLC193M and TLC393M are characterized for operation over the full military temperature range of
TA = 55C to 125C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
LinCMOS is a trademark of Texas Instruments Incorporated. All other trademarks are the property of their respective owners.

!" #!$% &"' Copyright 1986-2003, Texas Instruments Incorporated
&! #" #" (" " ") !"
&& *+' &! # ", &" " "%+ %!&"
", %% #""'

POST OFFICE BOX 655303 DALLAS, TEXAS 75265 1

POST OFFICE BOX 1443 HOUSTON, TEXAS 772511443

SLCS115D DECEMBER 1986 REVISED JULY 2003
AVAILABLE OPTIONS
PACKAGES
VIOmax
TA SMALL OUTLINE CHIP CARRIER CERAMIC DIP PLASTIC DIP TSSOP
at 25C
(D) (FK) (JG) (P) (PW)
0C to 70C 5 mV TLC393CD TLC393CP TLC393CPWLE
40C to 85C 5 mV TLC393ID TLC393IP TLC393IPWLE
40C to 125C 5 mV TLC393QD
55C to 125C 5 mV TLC393MD TLC193MFK TLC193MJG TLC393MP
The D package is available taped and reeled. Add the suffix R to the device type (e.g., TLC393CDR).
schematic
OUT
OPEN-DRAIN CMOS OUTPUT
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, VDD (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to 18 V
Differential input voltage, VID (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 V
Input voltage range, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to VDD
Output voltage range, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to 16 V
Input current, II . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 mA
Output current, IO (each output) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
Total supply current into VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 mA
Total current out of GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 mA
Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table
Operating free-air temperature range: TLC393C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0C to 70C
TLC393I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40C to 85C
TLC393Q . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40C to 125C
TLC393M . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55C to 125C
TLC193M . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55C to 125C
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65C to 150C
Case temperature for 60 seconds: FK package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: D or P package . . . . . . . . . . . . . . . . . 260C
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds: JG package . . . . . . . . . . . . . . . . . . . . 300C
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages, are with respect to network ground.
2. Differential voltages are at IN+ with respect to IN .
DISSIPATION RATING TABLE

TA 25C DERATING FACTOR TA = 70C TA = 85C TA = 125C
PACKAGE
POWER RATING ABOVE TA = 25C POWER RATING POWER RATING POWER RATING
D 725 mW 5.8 mW/C 464 mW 377 mW 145 mW
FK 1375 mW 11.0 mW/C 880 mW 715 mW 275 mW
JG 1050 mW 8.4 mW/C 672 mW 546 mW 210 mW
P 1000 mW 8.0 mW/C 640 mW 520 mW
PW 525 mW 4.2 mW/C 336 mW 273 mW
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265


recommended operating conditions

TLC393C
UNIT
MIN NOM MAX
Supply voltage, VDD 3 5 16 V
Common-mode input voltage, VIC 0.2 VDD 1.5 V
Low-level output current, IOL 20 mA
Operating free-air temperature, TA 0 70 C
electrical characteristics at specified operating free-air temperature, VDD = 5 V (unless otherwise

noted)
TLC393C
PARAMETER TEST CONDITIONS TA UNIT
MIN TYP MAX
VIC = VICRmin, 25C 1.4 5
VIO Inp t offset voltage
Input oltage VDD = 5 V to 10 V,
V mV
See Note 3 0C to 70C 6.5
25C 1 pA
IIO Inp t offset ccurrent
Input rrent VIC = 2.5
25V
70C 0.3 nA
25C 5 pA
IIB Inp t bias current
Input c rrent VIC = 2.5
25V
70C 0.6 nA
25C 0 to VDD 1
VICR Common mode inp
Common-mode inputt voltage
oltage range V
0C to 70C 0 to VDD 1.5
25C 84
CMMR Common-mode
Common mode rejection ratio VIC = VICRmin 70C 84 dB
0C 84
25C 85
kSVR Supply-voltage
Su ly voltage rejection ratio VDD = 5 V to 10 V 70C 85 dB
0C 85
25C 300 400
VOL Lo le el o
Low-level tp t voltage
output oltage VID = 1
1 V,
V IOL = 6 mA mV
70C 650
25C 0.8 40 nA
IOH High le el o
High-level output
tp t ccurrent
rrent VID = 1 V,
V VO = 5 V
70C 1 A
25C 22 40
IDD Supply current (both comparators) Outputs low,
low No load A
0C to 70C 50
All characteristics are measured with zero common-mode voltage unless otherwise noted.
NOTE 3: The offset voltage limits given are the maximum values required to drive the output up to 4.5 V or down to 0.3 V.




TLC393I
UNIT
MIN NOM MAX
Common-mode input voltage, VIC 0.2 VDD 1.5 V

noted)
TLC393I
MIN TYP MAX
V mV
See Note 3 40C to 85C 7
25C 1 pA
25V
85C 1 nA
25C 5 pA
25V
85C 2 nA
25C 0 to VDD 1
oltage range V
40C to 85C 0 to VDD 1.5
25C 84
CMMR Common-mode
40C 84
25C 85
kSVR Supply-voltage
40C 84
25C 300 400
VOL Lo le el o
1 V,
V IOL = 6 mA mV
85C 700
25C 0.8 40 nA
IOH High le el o
High-level output
tp t ccurrent
rrent VID = 1 V,
V VO = 5 V
85C 1 A
25C 22 40
low No load A
40C to 85C 65
NOTE 3: The offset voltage limits given are the maximum values required to drive the output up to 4.5 V or down to 0.3 V.
4



TLC393Q
UNIT
MIN NOM MAX
Common-mode input voltage, VIC 0 VDD 1.5 V

noted)
TLC393Q
MIN TYP MAX
V mV
25C 1 pA
25V
125C 15 nA
25C 5 pA
25V
125C 30 nA
25C 0 to VDD 1
oltage range V
40C to 125C 0 to VDD 1.5
25C 84
CMMR Common-mode
40C 84
25C 85
kSVR Supply-voltage
40C 84
25C 300 400
VOL Lo le el o
1 V,
V IOL = 6 mA mV
125C 800
25C 0.8 40 nA
IOH High le el o
High-level output
tp t ccurrent
rrent VID = 1 V,
V VO = 5 V
125C 1 A
25C 22 40
low No load A
40C to 125C 90
NOTE 4: The offset voltage limits given are the maximum values required to drive the output up to 4.5 V or down to 0.3 V (with a 2.5-k load to
VDD).




TLC193M, TLC393M
UNIT
MIN NOM MAX
Common-mode input voltage, VIC 0 VDD 1.5 V

noted)
TLC193M, TLC393M
MIN TYP MAX
V mV
25C 1 pA
25V
125C 15 nA
25C 5 pA
25V
125C 30 nA
25C 0 to VDD 1
oltage range V
55C to 125C 0 to VDD 1.5
25C 84
CMMR Common-mode
55C 84
25C 85
kSVR Supply-voltage
55C 84
25C 300 400
VOL Lo le el o
1 V,
V IOL = 6 mA mV
125C 800
25C 0.8 40 nA
IOH High le el o
High-level output
tp t ccurrent
rrent VID = 1 V,
V VO = 5 V
125C 1 A
25C 22 40
low No load A
55C to 125C 90
NOTE 4: The offset voltage limits given are the maximum values required to drive the output up to 4.5 V or down to 0.3 V (with a 2.5-k load to
VDD).
6


switching characteristics, VDD = 5 V, TA = 25C (see Figure 3)

TLC393C, TLC393I
TLC393Q, TLC193M,
PARAMETER TEST CONDITIONS TLC393M UNIT
MIN TYP MAX

Overdrive = 2 mV 4.5
f = 10 kH
kHz,
tPLH Propagation
Pro agation delay time, low
low-to-high-level
to high level out
output
ut Overdrive = 10 mV 1.7 s
CL = 15 pF
VI = 1.4-V step at IN + 1.1
f = 10 kH
kHz,
tPHL Propagation
Pro agation delay time, high
high-to-low-level
to low level out
output
ut Overdrive = 10 mV 1.3 s
CL = 15 pF
VI = 1.4-V step at IN + 0.10
f = 10 kHz,
tf Fall time, output Overdrive = 50 mV 22 ns
CL = 15 pF
PARAMETER MEASUREMENT INFORMATION
The TLC393 contains a digital output stage which, if held in the linear region of the transfer curve, can cause
damage to the device. Conventional operational amplifier/comparator testing incorporates the use of a servo
loop that is designed to force the device output to a level within this linear region. Since the servo-loop method
of testing cannot be used, the following alternatives for testing parameters such as input offset voltage,
common-mode rejection ratio, etc., are suggested.
To verify that the input offset voltage falls within the limits specified, the limit value is applied to the input as shown
in Figure 1(a). With the noninverting input positive with respect to the inverting input, the output should be high.
With the input polarity reversed, the output should be low.
A similar test can be made to verify the input offset voltage at the common-mode extremes. The supply voltages
can be slewed as shown in Figure 1(b) for the VICR test, rather than changing the input voltages, to provide
greater accuracy.
5V 1V
5.1 k 5.1 k
+ +
Applied VIO Applied VIO

Limit VO Limit VO
4V
(a) VIO WITH VIC = 0 V (b) VIO WITH VIC = 4 V
Figure 1. Method for Verifying That Input Offset Voltage Is Within Specified Limits



A close approximation of the input offset voltage can be obtained by using a binary search method to vary the
differential input voltage while monitoring the output state. When the applied input voltage differential is equal,
but opposite in polarity, to the input offset voltage, the output changes states.
Figure 2 illustrates a practical circuit for direct dc measurement of input offset voltage that does not bias the
comparator in the linear region. The circuit consists of a switching-mode servo loop in which U1A generates
a triangular waveform of approximately 20-mV amplitude. U1B acts as a buffer, with C2 and R4 removing any
residual dc offset. The signal is then applied to the inverting input of the comparator under test, while the
noninverting input is driven by the output of the integrator formed by U1C through the voltage divider formed
by R9 and R10. The loop reaches a stable operating point when the output of the comparator under test has
a duty cycle of exactly 50%, which can only occur when the incoming triangle wave is sliced symmetrically or
when the voltage at the noninverting input exactly equals the input offset voltage.
The voltage divider formed by R9 and R10 provides an increase in input offset voltage by a factor of 100 to
make measurement easier. The values of R5, R8, R9, and R10 can significantly influence the accuracy of the
reading; therefore, it is suggested that their tolerance level be 1% or lower.
Measuring the extremely low values of input current requires isolation from all other sources of leakage current
and compensation for the leakage of the test socket and board. With a good picoammeter, the socket and board
leakage can be measured with no device in the socket. Subsequently, this open-socket leakage value can be
subtracted from the measurement obtained with a device in the socket to obtain the actual input current of the
device.
VDD C3
U1B R5 0.68 F
1/4 TLC274CN 1.8 k, 1%
+ C2
Buffer 1 F
R6 U1C
1/4 TLC274CN
5.1 k
DUT
R4
47 k R7
1 M VIO
+
(X100)
R1 +
240 k Integrator
R8
1.8 k, 1%
U1A
1/4 TLC274CN C4
0.1 F
C1
0.1 F
+ Triangle
Generator R9
R10 10 k, 1%
100 , 1%
R2
10 k
R3
100 k
Figure 2. Circuit for Input Offset Voltage Measurement
8


Propagation delay time is defined as the interval between the application of an input step function and the instant
when the output reaches 50% of its maximum value. Propagation delay time, low-to-high-level output, is
measured from the leading edge of the input pulse, while propagation delay time, high-to-low-level output, is
measured from the trailing edge of the input pulse. Propagation delay time measurement at low input signal
levels can be greatly affected by the input offset voltage. The offset voltage should be balanced by the
adjustment at the inverting input (as shown in Figure 3) so that the circuit is just at the transition point. Then a
low signal, for example, 105 mV or 5 mV overdrive, causes the output to change state.
VDD
1 F
Pulse 5.1 k
Generator
50 DUT
Input Offset Voltage 1V
10 CL
Compensation 10 Turn (see Note A)
Adjustment 1 k
1V 0.1 F
TEST CIRCUIT
Overdrive Overdrive
Input Input 100 mV

100 mV
90% 90%
Low-to-High- High-to-Low-
Level Output 50% Level Output 50%
10% 10%
tr tf
tPLH tPHL
VOLTAGE WAVEFORMS
NOTE A: CL includes probe and jig capacitance.
Figure 3. Propagation Delay, Rise Time, and Fall Time Circuit and Voltage Waveforms



TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE
VIO Input offset voltage Distribution 4
IIB Input bias current vs Free-air temperature 5
CMRR Common-mode rejection ratio vs Free-air temperature 6
kSVR Supply-voltage rejection ratio vs Free-air temperature 7
vs Low-level
Low level output
out ut current 8
VOL Lo le el o
Low-level output
tp t voltage
oltage vs Free-air temperature 9
vs High-level
High level output
out ut voltage 10
IOH Lo le el output
Low-level o tp t current
c rrent vs Free-air temperature 11
vs Su
Supply
ly voltage 12
IDD S ppl current
Supply c rrent vs Free-air temperature 13
tPLH Low-to-high level output propagation delay time vs Supply voltage 14
tPHL High-to-low level output propagation delay time vs Supply voltage 15
Low-to-high-level output response Low-to-high level output propagation delay time 16
High-to-low level output response High-to-low level output propagation delay time 17
tf Fall time vs Supply voltage 18
INPUT BIAS CURRENT

DISTRIBUTION OF INPUT vs
OFFSET VOLTAGE FREE-AIR TEMPERATURE
100 10

VDD = 5 V VDD = 5 V
90 VIC = 2.5 V VIC = 2.5 V

TA = 25C

80
IIB Input Bias Current nA

70
Number of Units
60

50

0.1
40

30
0.01

20
10
0
5

4 3

2 1 0 1 2 3 4 5
0.001
25 50 75 100 125
VIO Input Offset Voltage mV TA Free-Air Temperature C
Figure 4 Figure 5
Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
10


COMMON-MODE REJECTION RATIO SUPPLY VOLTAGE REJECTION RATIO

vs vs
FREE-AIR TEMPERATURE FREE-AIR TEMPERATURE
90 90
kSVR Supply Voltage Rejection Ratio dB

89 VDD = 5 V 89 VDD = 5 V to 10 V
88 88
CMRR Common-Mode
Rejection Ratio dB
87 87
86 86
85 85
84 84
83 83
82 82
81 81
80 80
75 50 25 0 25 50 75 100 125 75 50 25 0 25 50 75 100 125
TA Free-Air Temperature C TA Free-Air Temperature C
Figure 6 Figure 7
LOW-LEVEL OUTPUT VOLTAGE LOW-LEVEL OUTPUT VOLTAGE

vs vs
LOW-LEVEL OUTPUT CURRENT FREE-AIR TEMPERATURE
1.5 600
TA = 25C VDD = 5 V
4V
VOL Low-Level Output Voltage V
IOL = 6 mA
VOL Low-Level Output Voltage mV
1.25 500
VDD = 3 V
1 400
5V
0.75
300
10 V
0.5 200
0.25
VDD = 16 V 100
0 0
0 2 4 6 8 10 12 14 16 18 20 75 50 25 0 25 50 75 100 125
IOL Low-Level Output Current mA TA Free-Air Temperature C
Figure 8 Figure 9



HIGH-LEVEL OUTPUT CURRENT HIGH-LEVEL OUTPUT CURRENT

vs vs
HIGH-LEVEL OUTPUT VOLTAGE FREE-AIR TEMPERATURE
1000 1000
VDD = VOH = 5 V
I OH High-Level Output Current nA

I OH High-Level Output Current nA
TA = 125C
100 100
TA = 85C
TA = 70C
10 10
TA = 25C
1 1
VOH = VDD
0.1 0.1
0 2 4 6 8 10 12 14 16 25 50 75 100 125
VOH High-Level Output Voltage V TA Free-Air Temperature C
Figure 10 Figure 11
SUPPLY CURRENT SUPPLY CURRENT

vs vs
SUPPLY VOLTAGE FREE-AIR TEMPERATURE
50 40
Outputs Low VDD = 5 V
TA = 55C
No Loads No Load
45 35
40 TA = 40C
I DD Supply Current A
IDD Supply Current A
30
35
TA = 25C 25
30
Outputs Low
25 20
TA = 85C
20
15
15 TA = 125C
10
10
Outputs High
5
5
0 0
0 2 4 6 8 10 12 14 16 75 50 25 0 25 50 75 100 125
VDD Supply Voltage V TA Free-Air Temperature C
Figure 12 Figure 13
12


LOW-TO-HIGH-LEVEL HIGH-TO-LOW-LEVEL
OUTPUT RESPONSE TIME OUTPUT RESPONSE TIME
vs vs
SUPPLY VOLTAGE SUPPLY VOLTAGE
6 5
CL = 15 pF CL = 15 pF
RL = 5.1 k (pullup to VDD) 4.5 RL = 5.1 k (pullup to VDD)
TA = 25C TA = 25C
Output Propagation Delay Time s
Output Propagation Delay Time s

4
t PLH Low-to-High-Level
t PHL High-to-Low Level

Overdrive = 2 mV
3.5
4
Overdrive = 2 mV
3
5 mV
3 2.5
5 mV
10 mV 2
2 20 mV
1.5 10 mV
40 mV 1 20 mV
1
0.5
40 mV
0 0
0 2 4 6 8 10 12 14 16 0 2 4 6 8 10 12 14 16
VDD Supply Voltage V VDD Supply Voltage V
Figure 14 Figure 15
LOW-TO-HIGH-LEVEL OUTPUT HIGH-TO-LOW-LEVEL OUTPUT

PROPAGATION DELAY PROPAGATION DELAY
FOR VARIOUS INPUT OVERDRIVES FOR VARIOUS INPUT OVERDRIVES
5 5
40 mV
VO Output
VO Output
Voltage V
Voltage V
20 mV 40 mV
10 mV 20 mV
5 mV 10 mV
2 mV 5 mV
2 mV
0 0
VDD = 5 V
100 100 CL = 15 pF
Differential Input
Differential Input
RL = 5.1 k (pullup to VDD)

Voltage mV
Voltage mV
TA = 25C
VDD = 5 V
0 CL = 15 pF 0
TA = 25C
0 1 2 3 4 5 0 1 2 3 4 5
tPLH Low-to-High-Level Output tPHL High-to-Low-Level Output
Propagation Delay Time s Propagation Delay Time s
Figure 16 Figure 17



OUTPUT FALL TIME
vs
SUPPLY VOLTAGE
60
50
CL = 100 pF
40
t f Fall Time ns
50 pF
30
15 pF
20
10 50-mV Overdrive
TA = 25C
0
0 2 4 6 8 10 12 14 16
VDD Supply Voltage V
Figure 18
APPLICATION INFORMATION
The input should always remain within the supply rails in order to avoid forward biasing the diodes in the electrostatic
discharge (ESD) protection structure. If either input exceeds this range, the device will not be damaged as long as
the input current is limited to less than 5 mA. To maintain the expected output state, the inputs must remain within
the common-mode range. For example, at 25C with VDD = 5 V, both inputs must remain between 0.2 V and 4 V
to assure proper device operation.
To assure reliable operation, the supply should be decoupled with a capacitor (0.1-F) positioned as close to the
device as possible.
The TLC393 has internal ESD-protection circuits that prevent functional failures at voltages up to 2000 V as tested
under MIL-STD-883C, Method 3015.2; however, care should be exercised in handling these devices, as exposure
to ESD may result in the degradation of the device parametric performance.
Table of Applications
FIGURE
Pulse-width-modulated motor speed controller 19
Enhanced supply supervisor 20
Two-phase nonoverlapping clock generator 21
Micropower switching regulator 28
14


12 V
SN75603
12 V DIR Half-H Driver
5V
C2 EN
(see Note A)
5.1 k
+ 5.1 k
100 k
10 k +
5V
Motor
10 k C1
0.01 F 1/2 TLC393
1/2 TLC393 12 V
(see Note B)
SN75604
DIR Half-H Driver
10 k
5V
EN
10 k
Motor Speed Control
Potentiometer
5V
Direction
Control
S1
SPDT
NOTES: A. The recommended minimum capacitance is 10 F to eliminate common ground switching noise.
B. Adjust C1 for change in oscillator frequency.
Figure 19. Pulse-Width-Modulated Motor Speed Controller



5V
12 V
VCC SENSE 5V
3.3 k 10 k
12-V 5.1 k
Sense +
To P
RESIN TL7705A RESET Reset
1 k 1/2 TLC393
REF CT GND
2.5 V
12 V CT
1 F
(see Note B)
5.1 k
+
To P Interrupt
R1 Early Power Fail
VUNREG
1/2 TLC393
(see Note A)
R2
Monitors 5-VDC Rail
Monitors 12-VDC Rail
Early Power Fail Warning
(R1 +R2)
NOTES: A. V UNREG + 2.5
R2
B. The value of CT determines the time delay of reset.
Figure 20. Enhanced Supply Supervisor
16


12 V 12 V
R1
100
(see Note B) 5.1 k
12 V
1OUT
R2
5 k + 1/2 TLC393
(see Note C)
5.1 k
100 k 12 V
+
1/2 TLC393 22 k 5.1 k
C1
0.01 F
(see Note A) 2OUT
100 k 100 k + 1/2 TLC393
R3
100 k
12 V (see Note B)
1OUT
2OUT
NOTES: A. Adjust C1 for a change in oscillator frequency where:

1/f = 1.85(100 k)C1
B. Adjust R1 and R3 to change duty cycle
C. Adjust R2 to change deadtime
Figure 21. Two-Phase Nonoverlapping Clock Generator


PACKAGE OPTION ADDENDUM
www.ti.com 17-Mar-2017
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
5962-9555101NXD ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM Q193M

& no Sb/Br)
5962-9555101NXDR ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM Q193M
& no Sb/Br)
5962-9555101QPA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 9555101QPA
TLC193M
TLC193MJGB ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 9555101QPA
TLC193M
TLC393CD ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 C393C
& no Sb/Br)
TLC393CDG4 ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 C393C
& no Sb/Br)
TLC393CDR ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 C393C
& no Sb/Br)
TLC393CDRG4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 C393C
& no Sb/Br)
TLC393CP ACTIVE PDIP P 8 50 Pb-Free CU NIPDAU N / A for Pkg Type 0 to 70 TLC393CP
(RoHS)
TLC393CPSR ACTIVE SO PS 8 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 P393
& no Sb/Br)
TLC393CPW ACTIVE TSSOP PW 8 150 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 P393
& no Sb/Br)
TLC393CPWR ACTIVE TSSOP PW 8 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 P393
& no Sb/Br)
TLC393CPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 P393
& no Sb/Br)
TLC393ID ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 C393I
& no Sb/Br)
TLC393IDG4 ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 C393I
& no Sb/Br)
TLC393IDR ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 C393I
& no Sb/Br)
TLC393IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 C393I
& no Sb/Br)
Addendum-Page 1
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
TLC393IP ACTIVE PDIP P 8 50 Pb-Free CU NIPDAU N / A for Pkg Type -40 to 85 TLC393IP
(RoHS)
TLC393IPE4 ACTIVE PDIP P 8 50 Pb-Free CU NIPDAU N / A for Pkg Type -40 to 85 TLC393IP
(RoHS)
TLC393IPW ACTIVE TSSOP PW 8 150 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 Y393
& no Sb/Br)
TLC393IPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 Y393
& no Sb/Br)
TLC393IPWR ACTIVE TSSOP PW 8 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 Y393
& no Sb/Br)
TLC393IPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 Y393
& no Sb/Br)
TLC393QDR ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 C393Q
& no Sb/Br)
TLC393QDRG4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM C393Q
& no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 2
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TLC393 :
Automotive: TLC393-Q1
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com 17-Feb-2016
TAPE AND REEL INFORMATION
*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
5962-9555101NXDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TLC393CDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TLC393CPSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
TLC393CPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
TLC393IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TLC393IPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
TLC393QDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TLC393QDRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 17-Feb-2016
*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
5962-9555101NXDR SOIC D 8 2500 367.0 367.0 38.0
TLC393CDR SOIC D 8 2500 340.5 338.1 20.6
TLC393CPSR SO PS 8 2000 367.0 367.0 38.0
TLC393CPWR TSSOP PW 8 2000 367.0 367.0 35.0
TLC393IDR SOIC D 8 2500 340.5 338.1 20.6
TLC393IPWR TSSOP PW 8 2000 367.0 367.0 35.0
TLC393QDR SOIC D 8 2500 367.0 367.0 38.0
TLC393QDRG4 SOIC D 8 2500 367.0 367.0 38.0
Pack Materials-Page 2
MECHANICAL DATA
MCER001A JANUARY 1995 REVISED JANUARY 1997
JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE
0.400 (10,16)
0.355 (9,00)
8 5
0.280 (7,11)
0.245 (6,22)
1 4
0.065 (1,65)
0.045 (1,14)
0.063 (1,60) 0.310 (7,87)

0.020 (0,51) MIN
0.015 (0,38) 0.290 (7,37)
0.200 (5,08) MAX

Seating Plane
0.130 (3,30) MIN
0.023 (0,58)
015
0.015 (0,38)
0.100 (2,54) 0.014 (0,36)
0.008 (0,20)
4040107/C 08/96
NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification.
E. Falls within MIL STD 1835 GDIP1-T8

PACKAGE OUTLINE
PW0008A SCALE 2.800
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
C
6.6 SEATING PLANE
TYP
6.2
A PIN 1 ID 0.1 C
AREA
6X 0.65
8
1
3.1 2X
2.9
NOTE 3 1.95
4
5
0.30
8X
0.19
4.5 1.2 MAX
B 0.1 C A B
4.3
NOTE 4
(0.15) TYP
SEE DETAIL A
0.25
GAGE PLANE
0.75 0.15
0 -8 0.05
0.50
DETAIL A
TYPICAL
4221848/A 02/2015
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153, variation AA.
www.ti.com
EXAMPLE BOARD LAYOUT
PW0008A TSSOP - 1.2 mm max height
8X (1.5)
8X (0.45) SYMM
(R0.05)
1 TYP
8
SYMM
6X (0.65)
5
4
(5.8)
LAND PATTERN EXAMPLE

SCALE:10X
SOLDER MASK METAL UNDER SOLDER MASK

METAL OPENING
OPENING SOLDER MASK
0.05 MAX 0.05 MIN

ALL AROUND ALL AROUND
NON SOLDER MASK SOLDER MASK

DEFINED DEFINED
SOLDER MASK DETAILS

NOT TO SCALE
4221848/A 02/2015
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
PW0008A TSSOP - 1.2 mm max height
8X (1.5)
SYMM (R0.05) TYP
8X (0.45)
1
8
SYMM
6X (0.65)
5
4
(5.8)
SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL
SCALE:10X
4221848/A 02/2015
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
IMPORTANT NOTICE
Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its
semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers
should obtain the latest relevant information before placing orders and should verify that such information is current and complete.
TIs published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated
circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and
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Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is
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Copyright 2017, Texas Instruments Incorporated

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 

        

D Very Low Power . . . 110 W Typ at 5 V D, JG, P, OR PW PACKAGE

OPEN-DRAIN CMOS OUTPUT

DISSIPATION RATING TABLE

recommended operating conditions

electrical characteristics at specified operating free-air temperature, VDD = 5 V (unless otherwise

recommended operating conditions

electrical characteristics at specified operating free-air temperature, VDD = 5 V (unless otherwise

recommended operating conditions

electrical characteristics at specified operating free-air temperature, VDD = 5 V (unless otherwise

recommended operating conditions

electrical characteristics at specified operating free-air temperature, VDD = 5 V (unless otherwise

switching characteristics, VDD = 5 V, TA = 25C (see Figure 3)

MIN TYP MAX

PARAMETER MEASUREMENT INFORMATION

Applied VIO Applied VIO

(a) VIO WITH VIC = 0 V (b) VIO WITH VIC = 4 V

PARAMETER MEASUREMENT INFORMATION

Figure 2. Circuit for Input Offset Voltage Measurement

PARAMETER MEASUREMENT INFORMATION

Input Input 100 mV

INPUT BIAS CURRENT

VIO Input Offset Voltage mV TA Free-Air Temperature C

COMMON-MODE REJECTION RATIO SUPPLY VOLTAGE REJECTION RATIO

kSVR Supply Voltage Rejection Ratio dB

LOW-LEVEL OUTPUT VOLTAGE LOW-LEVEL OUTPUT VOLTAGE

HIGH-LEVEL OUTPUT CURRENT HIGH-LEVEL OUTPUT CURRENT

I OH High-Level Output Current nA

VOH High-Level Output Voltage V TA Free-Air Temperature C

SUPPLY CURRENT SUPPLY CURRENT

IDD Supply Current A

VDD Supply Voltage V TA Free-Air Temperature C

Output Propagation Delay Time s

t PHL High-to-Low Level

VDD Supply Voltage V VDD Supply Voltage V

LOW-TO-HIGH-LEVEL OUTPUT HIGH-TO-LOW-LEVEL OUTPUT

RL = 5.1 k (pullup to VDD)

VDD Supply Voltage V

Figure 19. Pulse-Width-Modulated Motor Speed Controller

Figure 20. Enhanced Supply Supervisor

NOTES: A. Adjust C1 for a change in oscillator frequency where:

Figure 21. Two-Phase Nonoverlapping Clock Generator

5962-9555101NXD ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM Q193M

OTHER QUALIFIED VERSIONS OF TLC393 :

NOTE: Qualified Version Definitions:

TAPE AND REEL INFORMATION

*All dimensions are nominal

*All dimensions are nominal

MCER001A JANUARY 1995 REVISED JANUARY 1997

JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE

0.063 (1,60) 0.310 (7,87)

0.200 (5,08) MAX

0.130 (3,30) MIN

NOTES: A. All linear dimensions are in inches (millimeters).

POST OFFICE BOX 655303 DALLAS, TEXAS 75265

LAND PATTERN EXAMPLE

SOLDER MASK METAL UNDER SOLDER MASK

0.05 MAX 0.05 MIN

NON SOLDER MASK SOLDER MASK

SOLDER MASK DETAILS

6. Publication IPC-7351 may have alternate designs.

SOLDER PASTE EXAMPLE