Lectut MTN 513 PDF Thermal Properties

Thermal properties of ceramics
Heat capacity : amount of heat required to raise material

temperature by one unit (ceramics > metals)
Thermal expansion coefficient: the ratio that a material expands

in accordance with changes in temperature
Thermal conductivity : the property of a material that indicates its

ability to conduct heat
Thermal shock resistance: the name given to cracking as a result

of rapid temperature change
Thermal Properties
Two temperatures directly relate to the
strength of a material
Melting temperature Tm
Glass temperature Tg
Crystalline materials have a defined temperature

at which they melt non-crystalline solids are
characterized by a temperature at which they
transition from a true solid to a very viscous
liquid
Materials: engineering, science, processing and design, 2nd edition Copyright (c)2010 Michael Ashby, Hugh Shercliff, David Cebon
Operating Temperatures
Materials have a maximum and minimum
service temperature
Tmax highest temperature at which the

material can be used continuously
without oxidation, chemical change
or excessive distortion
Tmin temperature below which the material

b
becomes b
brittle
ittl or otherwise
th i unsafe
f
to use
Heat Capacity Cp
Heat Capacity Cp
Energy needed to heat 1 kg
of a material by 1 K
Figure 12.1
Heat Capacity
Heat is atoms in motion atoms in solids vibrate at an amplitude
that increases with temperature
p because of inter-atomic bonds,
each atom cannot vibrate independently therefore, each vibration
acts like standing elastic waves
(a) An atom vibrates in a cage of

other atoms with three degrees
of freedom
(b) A row of atoms at rest
(c) A longitudinal wave
( ) One
(d) O off two possible transverse
waves
Figure 12.7
Elastic waves generated
f
from atomic
t i vibrations
ib ti
have various wavelengths
and amplitudes
p
kBT is the associated energy

of each wave kB is
Boltzmanns constant,
Figure 12.8 1.38 X 10-23 J/K
: volume occupied by an atom
Heat Capacity
The ability of a material to absorb heat
The energy
Quantitatively:
y gy required
q to p
produce a unit rise in
temperature for one mole of a material.
energy input (J/mol)

heat capacity dQ
(J/mol-K) C
dT temperature change (K)
Two ways to measure heat capacity:

Cp : Heat capacity at constant pressure.
Cv : Heat capacity at constant volume.
Cp usually > Cv
J Btu
Heat capacity has units off
mol K lb mol F
7
Callisters Materials Science and Engineering, Adapted Version.
Dependence of Heat Capacity on
Heat capacity... T
Temperature
t
-- increases with temperature
-- for solids it reaches a limiting value of 3R
3R Cv = constant
gas constant
= 8.31 J/mol-K
Adapted from Fig. 19.2,

Callisters MSE,
T (K) Adapted Version.
0 D
Debye temperature
(usually less than T room )
From atomic perspective:
-- Energy
gy is stored as atomic vibrations.
-- As temperature increases, the average energy of
atomic vibrations increases. 8
Atomic Vibrations
Atomic vibrations are in the form of lattice waves or
phonons
9
Specific Heat: Comparison
Material cp (J/kg-K)
Polymers at room T
Polypropylene 1925 cp (specific
( ifi hheat):
t) (J/k
(J/kg-K)
K)
Polyethylene 1850 Cp (heat capacity): (J/mol-K)
Polystyrene 1170
Teflon 1050
sing cp
Ceramics
Magnesia
g ((MgO)
g ) 940
increas
Alumina (Al2O3) 775

Glass 840
Metals
Aluminum 900
Steel 486
Tungsten 138
Gold 128
10
Thermal Expansion
A solid expands when heated because its atoms
are moving
g farther apart
p
Materials with a high modulus

(stiff springs) have a
low expansion coefficient
All crystalline solids expand

approximately 2% from absolute
zero to their melting point
Figure 12.9
Atomic Perspective: Thermal Expansion
Asymmetric curve: Symmetric curve:

-- increase temperature, -- increase temperature,
-- increase in interatomic -- no increase in interatomic
separation
p separation
p
-- thermal expansion -- no thermal expansion

Thermal Expansion
p Coefficient
Figure 12.2
Thermal strain per degree of

temperature change
Thermal Expansion
Materials change size when temperature
is changed
g
Tinitial
Tfinal > Tinitial

Tfinal
final

final initial
(Tfinal Tinitial )
initial
linear coefficient of
thermal expansion (1/K or 1/C)
14
Coefficient of Thermal Expansion:
C
Comparisoni
Material
-6 (10 /C)
at room T
Polymers Polymers
P l have
h larger
l
Polypropylene 145-180
values because of
Polyethylene 106-198
weak secondary bonds
Polystyrene
y y 90-150
90 50
Teflon 126-216
Metals
ng
Aluminum 23.6
increasin
Steel 12
Tungsten 4.5
Gold 14.2
Ceramics
Magnesia (MgO) 13.5
Alumina (Al2O3) 7.6
Soda lime glass
Soda-lime 9
Silica (cryst. SiO2) 0.4
15
Thermal expansion coefficients
Comparison of thermal expansion coefficient between metals and fine ceramics
Th coefficients
The ffi i t off thermal
th l expansion
i d depend
d on th
the b
bond
d strength
t th b
between
t th
the atoms
t th
thatt
make up the materials.
Strong bonding (diamond, silicon carbide, silicon nitrite) low thermal expansion coefficient
Weak bonding ( stainless steel) higher thermal expansion coefficient in comparison with
fine ceramics
Figure 12.12
Thermal expansion coefficients vary from material

to material when two materials are constrained
to one another, the difference in their values can
lead to thermal stresses being developed from one
material expanding more than the other
Thermal Expansion: Example
Ex: A copper wire 15 m long is cooled from
40 to -9
-9C
C. How much change in length will it
experience?
Answer: For Cu
16.5 x 106 ( C)1
rearranging Equation 17.3b
0 T [16.5 x 10 6
(1 / C)](15 m)[40C (9C)]
0.012 m 12 mm
18
Example Problem
-- A brass rod is stress-free at room temperature (20C).
-- It is heated up, but prevented from lengthening.
-- At what temperature does the stress reach -172
172 MPa?
Solution:
T0 Original conditions
0
Step 1: Assume unconstrained thermal expansion

0

thermal (T f T0 )
Tf room
Step 2: Compress specimen back to original length

0

compress thermal
room
Example Problem (cont
(cont.))
0
The thermal stress can be directly
calculated as

E(compress )
g that compress = -thermal and substituting

Noting gggives
E(thermal ) E (Tf T0 ) E (T0 Tf )
R
Rearranging
i and
d solving
l i ffor Tf gives
i
20C
-172 MPa (since in compression)

Tf T0
E
Answer: 106
106C
C 100 GPa 20 x 10-6/C
20
The easiest way to prevent damage from thermal
stresses is to choose materials with similar expansion
coefficients often, this is not possible for a given design
An alternate solution is to have

graded joints between the two
materials in this example, the
high expansion stainless steel
i b
is bonded
d d tto a nickel
i k l alloy
ll off llower
expansion and the Pyrex is bonded
to a glass with a lower expansion
this creates a stepwise
p jjoint that
acts as a buffer to minimize the
expansion differences of the stainless
steel and the Pyrex
Figure 12.13
Thermal Sensing and Actuation
Designs also can utilize materials
with different thermal expansions
to sense (measure temperature) or
actuate (open close valves or
electrical circuits)
Figure
g 12.14 shows the thermal
response of a bi-material strip this
configuration magnifies the thermal
strain created when the two
materials expand at different rates,
allowing it to be used for various
applications
Fi
Figure 12
12.14
14
Thermal Conductivity
Rate at which heat is
conducted through a solid
at steady-state
Figure 12.3
Generally less than that of metals such as steel or copper
Ceramic materials, in contrast, are used for thermal insulation due to their
low thermal conductivity (except silicon carbide, aluminium nitride)
Thermal conductivity
http://global.kyocera.com/fcworld/charact/heat/images/thermalcond_zu.gif
y
When a solid is heated the heat enters as elastic wave packets
or phonons the phonons travel at the speed of sound, but only
move a short distance before they are scattered
The distance a phonon can travel

before bouncing off something else
is called the mean free ppath typically
yp y
less than 0.01 m
Figure 12.10
Thermal Conductivity: Comparison
Energy Transfer
Material k (W/m-K) Mechanism
Metals
Aluminum 247 atomic vibrations
Steel 52 and motion of free
Tungsten 178
electrons
Gold 315
Ceramics
Magnesia (MgO) 38
gk
increasing
Alumina (Al2O3) 39 atomic vibrations

Soda-lime glass 1.7
Silica (cryst. SiO2) 1.4
Polymers
Polypropylene 0.12
Polyethylene 0.46-0.50 vibration/rotation of
Polystyrene 0 13
0.13 chain molecules
Teflon 0.25
26
y
Fundamentals of ceramics, MW Barsoum

Thermal Stresses
Occur due to:
-- restrained thermal expansion/contraction
-- temperature gradients that lead to differential
dimensional changes
Thermal stress
E (T0 T f ) E T
28
Thermal Diffusivity
Thermal conductivity measures the flow
of heat at steady-state transient heat
flow is governed by the thermal
diff i it
diffusivity
(m2/s)
Thermal Expansion - Conductivity
Contours show thermal distortion parameter /
Figure 12.4
Thermal Diffusivity - Expansion
Contours show the

specific heat per unit
volume Cp - as a
general rule this
value is almost constant
for all solids
(3 X 106 J/m3 K)
Figure 12.5
Thermal Conductivity Yield Strength
Many applications require a combination of high strength
and high conductivity
Figure 12.6
Thermal Gradients
Thermal gradients are developed
when a material is rapidly
p y cooled
or heated
When the material is subjected

to the temperature differential,
the surface tries to expand/contract
while the rest of the body opposes
thi motion
this ti
This phenomenon can result in

cracking especially in brittle materials
cracking,
Figure 12.15
Th resistance
The i t off a material
t i l to
t this
thi bbehavior
h i iis measured
dbby
its thermal shock resistance Ts
Thermal Shock Resistance
Occurs due to: nonuniform heating/cooling
Ex: Assume top thin layer is rapidly cooled from T1 to T2
rapid quench

tries to contract during cooling T2 Tension develops at surface
resists contraction T1 E
E (T1 T
T2 )
Temperature difference that Critical temperature difference
can be p
produced byy cooling:
g for fracture (set = f)
quench rate f
(T1 T2 ) (T1 T2 ) fracture
k E
set equal
f k
(quench rate) for fracture Thermal Shock Resistance (TSR)
E
f k
Large TSR when is large
E
34
Thermal shock resistance
A large number of ceramic materials are sensitive to thermal shock
Some ceramic materials very high resistance to thermal shock is despite of

low ductility (e.g. fused silica, Aluminium titanate )
Result of rapid cooling tensile stress (thermal stress)cracks and

consequent failure
Thermal stresses responsible for the response to temperature stress depend on:
-geometrical boundary conditions
-thermal boundary conditions
-physical
ph sical parameters (modulus
(mod l s of elasticit
elasticity, strength
strength))
Heat Exchanger
Heat exchangers must be able to transfer heat
and withstand internal pressure from the fluids
The characteristic equation

for this design is:
The best materials are

those with the highest
values of y
Figure 12.16
Thermal Conductivity Yield Strength
Many applications require a combination of high strength
and high conductivity
Figure 12.6
Insulation
The figure represents a heated chamber that experiences
heat loss by conduction through the insulation
Power lost through wall
Best material to minimize power

loss are those with low thermal
conductivities however, many
of the materials with very
y low
conductivities also have low
Tmax values this must be
Figure 12.17 considered as Tmax generally
acts as a constraint
Spontaneous microcracking in ceramics
Due to
o thermal expansion anisotropy
o Thermal expansion mismatches in multiphase materials
o Phase-transformation-induced residual stresses
Spontaneous microcracking due to thermal expansion anisotropy

Thermal Protection System
Application:
Re-entry T
Space Shuttle Orbiter Distribution
reinf C-C silica tiles nylon felt, silicon rubber

(1650C) (400-1260C) coating (400C)
(400-1260C):
Silica tiles
-- large scale application -- microstructure:
~90% porosity!
Si fibers
bonded to one
another during
heat treatment.
100 m
43
Summary
The thermal properties of materials include:
Heat capacity:
-- energy required to increase a mole of material by a unit T
-- energy is stored as atomic vibrations
Coefficient of thermal expansion:
-- the size of a material changes with a change in temperature
-- polymers have the largest values
Thermal conductivity:
-- the abilityy of a material to transport
p heat
-- metals have the largest values
Thermal shock resistance:
-- the ability of a material to be rapidly cooled and not fracture
-- is proportional to
f k
E
44

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Lectut MTN 513 PDF Thermal Properties

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Thermal properties of ceramics

Heat capacity : amount of heat required to raise material

Thermal expansion coefficient: the ratio that a material expands

Thermal conductivity : the property of a material that indicates its

Thermal shock resistance: the name given to cracking as a result

Crystalline materials have a defined temperature

Tmax highest temperature at which the

Tmin temperature below which the material

(a) An atom vibrates in a cage of

kBT is the associated energy

: volume occupied by an atom

energy input (J/mol)

Two ways to measure heat capacity:

Adapted from Fig. 19.2,

Alumina (Al2O3) 775

Materials with a high modulus

All crystalline solids expand

Asymmetric curve: Symmetric curve:

Callisters Materials Science and Engineering, Adapted Version.

Thermal strain per degree of

Tfinal > Tinitial

Thermal expansion coefficients vary from material

Step 1: Assume unconstrained thermal expansion

Step 2: Compress specimen back to original length

g that compress = -thermal and substituting

E(thermal ) E (Tf T0 ) E (T0 Tf )

An alternate solution is to have

Generally less than that of metals such as steel or copper

The distance a phonon can travel

Alumina (Al2O3) 39 atomic vibrations

Fundamentals of ceramics, MW Barsoum

Contours show the

When the material is subjected

This phenomenon can result in

A large number of ceramic materials are sensitive to thermal shock

Some ceramic materials very high resistance to thermal shock is despite of

Result of rapid cooling tensile stress (thermal stress)cracks and

-geometrical boundary conditions

-thermal boundary conditions

The characteristic equation

The best materials are

Power lost through wall

Best material to minimize power

Fundamentals of ceramics, MW Barsoum

reinf C-C silica tiles nylon felt, silicon rubber

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