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Electric power substations engineering [Book

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Article in IEEE Electrical Insulation Magazine · December 2004

DOI: 10.1109/MEI.2004.1367525 · Source: IEEE Xplore

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 B O O K
by
John J.
Shea
Handbook of Thick- and
Thin-Film Hybrid
Microelectronics
by T. K. Gupta
John Wiley & Sons
111 River Street
Hoboken, NJ 07030
Phone: (877) 762-2974
Fax: (800) 597-3299
http://www.wiley.com
ISBN: 0-471-27229-9
406 pp. - $99.95, 2003
The subject of hybrid microelectronics
pertains to the packaging and fabrication
of assemblies of microelectronic devices
prepared from thin- and thick-film tech-
nologies. The topic includes printed wir-
ing boards, thin films (up to several hun-
dred nanometers), thick films (5 to 50 mi-
crometers), integrated circuits, and multi-
chip modules. Understanding hybrid mi-
croelectronics includes aspects of materi-
als science, electrical engineering, and
mechanical engineering. After an intro-
ductory chapter the book begins with a
description of design of various compo-
nents in thick- and thin-film format, lay-
out rules for hybrid micro-circuits, com-
puter-aided design techniques, and pattern
generation. There are chapters on thick-
film materials, components, and deposition
techniques; and corresponding chapters on
64
R E V I
thin-film devices. Component assembly
is described next, including adhesives, sol-
ders, and wire bonding. Adjustment of
passive components is described after that,
primarily abrasive and laser trimming of
resistors. Then we come to a discussion
of various types of packages and thermal
effects and modeling. The final chapter
describes multi-chip modules and compo-
nents found in microwave hybrid circuits.
This book gives thorough coverage to these
subjects; the descriptions are up to date,
and cover the fundamentals, so the book
should be useful for some time to come.
Each chapter provides many references to
primary literature and other handbooks.
—K. F. Schoch, Jr.
Dielectric Properties of
Porous Media
S.O. Gladkov
Springer-Verlag
333 Meadowlands Parkway
Secaucus, NJ 07094
Phone (800) Springer
Fax (212) 460-1575
www.springer.de/phys/books/ssms/
ISBN# 3-540-00186-7
274 pp. - $89.95 (Hardback), 2003
This is a very interesting theoretical
book with some experimental data on the
fundamental principles of dielectric break-
down and thermal conductivity in porous
dielectrics. The porous materials studied
were capacitor papers, cellulose, and fi-
brous (inhomogeneous) materials saturated
in oil. The derived breakdown formulas
are based on elastic scattering of forward
and reverse traveling electrons present in
the breakdown path. This is tied into the
thermal capacity of the dielectric to show
how the material physical parameters af-
fect breakdown strength. The author pro-
vides excellent descriptions of the formu-
las by tying formula parameters to physi-
cal material properties. After each major
formula derived, the author details what
E W S
physical structure properties need to be
altered to achieve higher breakdown
strength. He also validates the equations
with graphical comparisons of theory to
experimental measurements.
The book contains seven chapters and
an appendix that has the source code for
calculating the thermal conductivity of
porous dielectric materials. The first two
chapters cover modeling of porous mate-
rials based on a fibril structure. It also has
information on thermodynamics of sys-
tems in equilibrium. The third chapter
covers heat capacity and mechanical
strength of porous materials. Chapter 4
deals with the physical bases of fast pro-
cesses (electric and thermal breakdown) in
porous materials, including frequency de-
pendence on external ac fields, ignition
time dependence on surface temperature,
influence of oil viscosity on electric
strength, and relaxation theory. Chapter 5
details the theory of heat conduction in
porous media and chapters 6 and 7 cover
the behavior of porous media in AC and
acoustic fields along with conclusions.
This book would be a valuable refer-
ence for those researchers working in the
field of electrolytic capacitors and with
porous dielectrics in general. It would also
be a good textbook for students studying
the fundamentals of dielectric breakdown
theory.
Electric Power Substations
Engineering
J.D. McDonald, editor
CRC Press LLC
2000 Corporate Blvd. NW
Boca Raton, FL 33431
Phone (800) 272-7737
Fax: (800) 374-3401
http://www.crcpress.com
ISBN 0-8493-1703-7
304 pp. $99.95 (Hardcover), 2003
New developments in substation engi-
neering, as well as existing designs and
methods, are presented in this book. Con-
IEEE Electrical Insulation Magazine
tributions from various authors make this
text a collection of tutorials that cover an
overview of the design, construction, and
various aspects that must be considered in
construction of a new power substation.
While not giving specific design details,
this book provides a good overview of the
many areas that need to be planned for in
the construction of a new substation. These
included not only the design of the power
handling equipment but the many other
factors that impact the overall design. The
topics covered regarding design and con-
struction include gas and air insulated sub-
stations, HV switching equipment, HV
power electronics, and automation sys-
tems. These chapters give a good descrip-
tion, along with many photographs and
schematics, showing the various bus/
switching configurations, equipment con-
siderations (breakers, switches, fuses), and
FACTS controllers and layout. Some of
the automation topics cover data acquisi-
tion systems, status monitoring, and com-
munications protocols. The other impor-
tant considerations to the planning of a
substation, covered in this book are oil
containment, community impact, animal
deterrents, grounding and lightning, seis-
mic, and fire protection. The final chap-
ters cover communications, building secu-
rity, computer security, and gas-insulated
transmission lines.
This would be an excellent book for
substation engineers, substation project
planners and as a supplemental book for
power engineering students.
RF MEMS Theory, Design,
and Technology
G.M. Rebeiz
John Wiley & Sons
111 River Street
Hoboken, NJ 07030
Phone: (877) 762-2974
Fax: (800) 597-3299
http://www.wiley.com
ISBN 0-471-20169-3
503 pp. - $99.95 (Hardcover), 2003
RF MEMS (micro-electro-mechanical)
devices have seen incredible growth over
the past ten years due to their tremendous
commercial and defense potential. The
November/December 2004 — Vol. 20, No. 6
View publication stats
need for higher frequency devices, over
what solid-state devices could produce, led
to the development of RF MEMS technol-
ogy. Today, many electronic companies
are producing RF MEM devices for
switches, varactors, inductors, T-lines, fil-
ters, resonators, and antennas. Focusing
solely on RF MEMS switches, varactors,
and inductors, this book provides in-depth,
practical coverage of the mechanical, elec-
trical, and fabrication design details of
these devices for microwave applications.
The author’s introduction provides an ex-
cellent review of the current state of this
rapidly changing technology. He com-
pares MEMS with various solid state de-
vices, provides case studies, and details the
limits and issues in integration, linearity,
power handling and packaging. The bulk
of the book then covers the mechanical and
electrical design. The mechanical aspects
that need to be considered are thoroughly
covered for both the static and dynamic
conditions required in MEMS. Some of the
static considerations include spring com-
ponent design, hold-down voltage, and
voltage breakdown. Some of the dynamic
considerations cover displacement analy-
sis, gas fundamentals, switching mecha-
nisms, switching energy, and responses to
various waveforms. Electromagnetic mod-
eling provides solutions for capacitive
shunt and series switches including losses,
inductance, resistance, current density, and
capacitance calculations. To gain insight
from others, there is a section detailing
about 24 switch designs made at various
companies and universities. Other chap-
ters cover fabrication, circuit design, and
very useful design equations for contact
physics used to determine power-handling
capability. Application examples included
are phase shifter designs, varactors and
tunable oscillators, inductors, filters, and
antennas. The book would be even more
useful if it had contained information on
materials and material selection.
This is an excellent book for graduate
students or practicing engineers in the field
of RF microwave technology who need to
learn about the latest developments in the
RF MEMS world.
The Physical Properties of
Thin Metal Films
G.P. Zhigal’skii and B.K. Jones, Editors
Taylor & Francis
29 West 35th Street
New York, NY 10001
In the UK
Phone +44 (0)1264 343071
Fax +44 (0)1264 343005
In the USA (800) 634-7064
Fax (800) 248 4724
http://www.tandf.co.uk
ISBN 0-415-28390-6
229 pp. - £54.99 (Hardcover), 2003
Thin metallic films are a key compo-
nent in various sensors and especially in
semiconductor fabrication. Among many
factors, the ability to create high reliabil-
ity and good quality semiconductors re-
lies on the quality of the thin metal films
used for connection layers, resistors, and
ohmic contacts, and sensors. The bulk
metal properties change as the film thick-
ness becomes comparable with, or smaller
than, the physical mechanism such as the
electron mean free path, or the carrier
wavelength, or the wavelength of light.
This book describes the complex physical
properties of thin metal films along with
the necessary theory, experimental ex-
amples, and applications to provide the
reader with practical information to make
high quality thin metal conducting films.
The authors begin by describing the
factors that determine film resistivity, sur-
face resistivity, temperature coefficient of
resistance, stability, intrinsic noise, and
ohmic linearity. There are details describ-
ing the conduction mechanisms (potential
barriers and tunneling) due to the physical
shape of metal layer during deposition,
forming island structures. The electrical
properties on both the classical and quan-
tum levels are described along with the
mechanical internal stresses and the kinet-
ics of voids. The variation and the activa-
tion energy due to local micro-stresses
explain electrical noise, 1/f noise. There
are details showing how to reduce stresses
in thin-film depositions. Also described is
electro-migration, the momentum in cur-
rent density high enough to move atoms
in thin metal films and the effects of
65