S.

CARD-NAME
no (CODE/VERSION) STORAGE and
PROCESSOR INTERFACES
& OPERATING CONDITIONs
PERFORMANCE
1 STORAGE (MAIN PROCESSOR) MAIN PROCESSOR INTERFACES:
NGTJ:  Dual power supply
(NGN Gateway card) RAM:
 1GB DDR2 SDRAM  Push button reset
CACU NGTJ GTW card
 RS232 serial port from Processor for
APC-NGTJ36/D-SE3
DISK: debug console (minicom
And
connectivity).
LAGU NGTJ GTW card  1GB of permanent storage over
NAND flash  2GiG Ethernet interfaces (PowerPC)
APC-NGTJ36/D-AE3
 256MB of permanent storage
over NOR Flash (split as boot-  For LAG configuration (AE3 only):
MAIN PROCESSOR: Internal EEB with 2 E1 towards
flash of 128 MB and code-flash of
MPC8360 Power PC main exchange CACU-EBM card.
128 MB not being used currently )
(Freescale)
 4GB grade 4 MMC microsd card  8 Nos. of 8Mbps links between
The performance of Time switch and LAG interface for
(upto 32 GB)
processor is 3-4 times LAG functionality (TIC).
more compared to  SDCARD connector for MMC
Out of the 128 MB of boot-flash, 64MB
MPC8260 used in SGTK/PIC interface
is used for u-boot, root file system, Linux
cards due to speed,
and dtb(device tree blob) files. The rest  LAG interface signals
PowerPC core and faster
storage of 64 MB can be used for storing  Mate interface signals
memory interfaces.
data (on file-system /dev/mtdblock0
mounted over /jffs2).  I2C for communicating with SLM
DSP PROCESSOR: card
TMS320C6486 
(Texas Instruments)
STORAGE (DSP PROCESSOR) 32 E1’s interface to support 1024
64MB of DDR2 interface and support channels on PCM
6 core, each core  2 Nos. of 8Mbps links (127 channels
to SPI flash for storing configuration
operating at 500MHz data. of HDLC and 127 channels of SS7 at
 1024 G711 with the same time) are connected
DTMF detection, between Time switch and PowerPC
tone generation, RTP to handle HDLC signalling (required
 Bandwidth of card over Ethernet:
packetization, for PRIAG, v5AG and LAG) and SS7
4Gbps
depacketization signalling for SG.
 Bandwidth of card over EEB:
 The channel density
8Mbps
comes down with DSP INTERFACES:
addition of echo  DSP has interface to two ethernet
cancellation, Voice ports, one with 10/100/1000Mbps
Codecs etc. OPERATING CONDITIONs: and second with 10/100Mbps
 Transparent mode  Operating power supply range -  GiG ethernet interface is connected
fax is supported 36V DC to -60V DC to vitesse GIG switch 10/100
 Operating temperature: ethernet interface is connected to
TIME SWITCH: 0 °C to 55 °C at 95% Humidity. Lantiq 10/100 ethernet switch.
 FPGA based time  Lantiq 10/100 switch is inturn
slot interchanger Power consumption of whole card connected to Vitesse GIG switch.
 4Kx4K time switch about 80 watts  DSP can support 1024 channels of
from IDT (32 links, voice with RTP packetization, DTMF
each of 8Mbps) detection and tone generation.
FRAMER:  it is possible to connect 32E1s and
 TEMUX32 used in 512 channels for LAG at same time.
NGTJ card is PM8312  8 Nos. of 8Mbps links are
 64 Mbit/s connected between Time switch
multichannel T1/E1 and DSP for DSP functionality
framer
 32 independent E1
framers
S. CARD-NAME
no (CODE/VERSION) STORAGE and
PROCESSOR INTERFACES
& OPERATING CONDITIONs
PERFORMANCE
2 STORAGE:  Power on LED indicator (+5v)
SLM  Push button reset
(Shelf Manager  2 fast Ethernet ports are used i.e.
RAM:
card) 256 MB DDR2 SDRAM
FEC1 and FEC2
APCSLML22/ H-AE2  Ethernet switch PSB6970 Lantiq
 All Ethernet connections and E1s
DISK:
PROCESSOR: are connected to 96 pin euro
NAND Flash (64 MB)
MPC8306s Power PC 10 MB for applications at /jffs2
connector J8.
(Freescale)  Two RS-232 links given from two
 e300c3 as core with  Bandwidth of card over Ethernet:
three pin connectors J17 and J18
16KB of Instruction  Ethernet Link status LEDs
4x 100Mbps on 4 E1s
cache and 16KB of  Mate interface signals
 Bandwidth of card over EEB:
data cache  I2C for communicating with other
8Mbps
 FPGA EP4C15F23C8N cards in MAX-NG chassis
(U11)  -48v is fed through J16 power
OPERATING CONDITIONs: connector is converted to +5v using
 Operating power supply range - device PTEA415050N2AD
36V DC to -60V DC
 Operating temperature :
0 °C to 55 °C at 95% Humidity.

Power consumption of whole card

About 10 watts
3 STORAGE:  Push button reset
EBM  E1s LED indication
(Ethernet 32/16 E1  32 E1s (EBM SE1) or 16 E1s (EBM
RAM:
Bridge Main card) 256 MB DDR2 SDRAM
AE1) : In EBMJ22 card, one Raycom
RC6105 device produces 2 E1's and
so to get 32 E1's, we need 16
 APC-EBMJ22/D- DISK: RC6105
SE2: 32 E1 support NAND Flash (64 MB)  Only 2 consecutive E1s like (E1[1:2],
 APC-EBMJ22/D- 10 MB for applications at /jffs2 E1[3:4]) can be connected to one
AE2: 16 E1 support RSU. Likewise 8/16 RSUs can be
 Bandwidth of card over connected to one EBM-SE2 card.
PROCESSOR: Ethernet: 4Mbps on each set of  2 fast eth ports FEC1 & FEC2; only
MPC8306s PowerPC 2 E1s FEC2 is functional
(Freescale)  Bandwidth of card over EEB:  2 No. Of 10/100 Mbps going to MLS
64Mbps for EEB-32 Copy 0 and Copy 1
 e300c3 core with 32Mbps for EEB-16  2 No. Of 10/100 Mbps spare on
16KB of instruction board for debugging
cache & 16KB data OPERATING CONDITIONs:  Dual power supply : For chassis
cache version: -48v is fed through J12
 Operating power supply range -
36V DC to -60V DC power connector
 Operating temperature for EBM:  I2C in slave mode for
0 °C to 55 °C at 95% Humidity. communicating with SLM
 RS232 from Processor for debug
Power consumption of whole card console : An RS232 connector is
About 80 watts used for connecting MPC8306 UART
to PC through a RS232 null modem
cable
S. CARD-NAME
no (CODE/VERSION) STORAGE and
PROCESSOR INTERFACES
& OPERATING CONDITIONs
PERFORMANCE
4 RAM:  It gives 20x1G Ports (SGMII
MLS  equipped with 128 MBytes Interface towards backplane) and
(MAX-NG Layer 3 DDR2 SDRAM 2x1G Ports (SFP as 1G UPLINK).
Switch Card)  The board is equipped with  The MLS Card can be managed
APC-MLSJ64/O-SD1 16MBytes of NOR SPI boot through RS232 serial port using a
Command Line Interface (CLI).
 The MAX-NG Layer-3 Flash.
Switch (MLS) Card is  Optional NAND Flash, e.g.  Supports I2C communication
a 22 port Ethernet 64MBytes  A power LED is available
Carrier switch card  Board status LEDs
based on Vitesse  Port status LEDs
VSC7460 carrier  LED mode select button
Ethernet switch.  Mode indicator LED tower
 The VSC7460 Devices  NPI status LED
contain a powerful
VCore-III CPU
System
 inbuilt 32KB
instruction cache
 32KB of data cache

5 STORAGE:  LM75A is a temperature-to-digital

TSN converter using
(Temperature  temperature register to store
the digital temp reading o on-chip band gap
Sensor Card) temperature sensor
 set-point registers to store
o sigma-delta A-to-D
programmable over-
8 temperature sensor conversion technique
temperature shutdown and
ICs (LM75A) hysteresis limits

2 layered PCB  TSN is interfaced to SLM card

OPERATING CONDITIONs: through I2C interface
 VCC(2.8V to 5.5V) and GND
provided from the SLM card
 maximum rated current is
15mA
 Operating temperature for
EBM: -55 °C to +125 °C