Appendix

Surface Preparation Methods for

D
Common Substrate Materials

The following sources were used in compiling this Appendix:

Wegman, R. R., Surface Preparation Techniques for Adhesive Bonding, Noyes
Publications, Park Ridge, NJ, 1989.
Cagle, C. V., Adhesive Bonding Techniques and Applications, McGraw Hill, New York,
1968.
DeLollis, N. J., Adhesives for Metals Theory and Technology, Industrial Press, New
York, 1970.
Schields, J., Adhesives Handbook, 3rd ed, Butterworths, London, 1984.
Guttman, W. H. Concise Guide to Structural Adhesives, Reinhold, New York, 1961.
‘‘Preparing the Surface for Adhesive Bonding,’’ Hysol Division, Dexter Corp., Bulletin
Gl-600.
ASTM D 2093, ‘‘Preparation of Surfaces of Plastics Prior to Adhesive Bonding,’’ Amer-
ican Society for Testing and Materials, Conshohocken, PA.
ASTM D 2651, ‘‘Preparation of Metal Surfaces for Adhesive Bonding,’’ American So-
ciety for Testing and Materials, Conshohocken, PA.
Adhesives and Sealants, vol. 3, Engineered Materials Handbook Series, ASM Inter-
national, 1990.
Handbook of Plastics Joining, Plastics Design Library, Norwich, NY, 1997.
Note: All formulations in the following tables of this Appendix are presented on a
parts by weight basis unless otherwise indicated.

825
 D.1 Surface Preparation Methods for Metal Substrates

Substrates Cleaning solvents Substrate treatments Comments

Aluminum and Trichloroethylene 1. Sandblast or 100 grit emery cloth followed by Medium to high strength bonds, suitable for
aluminum alloys solvent degreasing non critical applications
2. Immerse for 10 min at 70–82⬚C in a Optimum bond strength per FPL etch
commercial alkaline cleaner or process. Specified in ASTM D 2651 and
MIL-A-9067. Solvent degrease may replace
Sodium metasilicate 3.0
alkaline cleaning
Sodium hydroxide 1.5
Sodium dodecylbenzene 1.5
sulfonate, such as
Nacconol 90G (Stephan Co.,
Nothfield, IL)
Water (distilled) 128.0
Wash in water below 65⬚C and etch for 12–15
min at 66–71⬚C in
Sodium dichromate 1.0
Sulfuric acid (96%) 10.0
Water (distilled) 30.0
Rinse in distilled water after washing in tap
water and dry in air
3. Alkaline clean as described in 2 above. Then P-2 etch specified in ASTM D 2651
immerse for 10–12 mins at 60-65⬚C in the
following solution:
Sulfuric acid (6.5 to 9.5N) 7–36% by wt.
Ferric sulfate 135 to 165 g / l
Rinse as descirbed in 2 above
826
 Substrates Cleaning solvents Substrate treatments Comments

Aluminum Trichloroethylene 4. Degrease with solvent. Abrade lightly with Room temperature etch
mildly abrasive cleaner. Rinse in deionized
water; wipe; or air dry. Etch 20 min at RT in
Sodium dichromate 2
Sulfuric acid (96%) 7
Rinse thoroughly in deionized water; dry at 70⬚C
for 30 min
5. Form a paste using sulfuric acid—sodium Paste form of acid etch, useful when part
dichromate solution and finely divided silica or cannot be immersed
fuller’s earth. Apply; do not permit paste to dry.
Time depends on degree of contamination
(usually greater than 10 min at RT). Wash very
thoroughly with deionized water, and air dry
6. Phosphoric acid anodizing can be performed in
accordance with ASTM D 3933
7. Sulfuric acid anodizing can be performed in Found suitable for bare aluminum
accordance with MIL-A-8625 (nonclad), machined, or chemically milled
parts which must be corrosion protected

Brass and bronze Trichloroethylene 1. Etch for 5 min at 20⬚C in Temperature must not exceed 65C when
(see also copper and washing and drying
Zinc oxide 20
copper alloys) Sulfuric acid (96%) 460
Nitric acid (69%) 360
Rinse in water below 65⬚C and re-etch in the
acid solution for 5 min at 49⬚C. Rinse in distilled
water after washing and dry in air
827
 Substrates Cleaning solvents
Chromium Trichloroethylene
Copper and copper Trichloroethylene
alloys
Substrate treatments Comments
1. Abrasion. Grit or vapor blast, or 100 grit Suitable for general purpose bonding
emery cloth, followed by solvent degreasing
2. Etch for 1–5 min at 90–95⬚C in For maximum bond strength
Hydrochloric acid (37%) 17
Water 20
Rinse in distilled water after cold / hot water
washing and dry in hot air
1. Abrasion. Sanding, wire brushing, or 100 grit Solution for general purpose bonding. Use
emery cloth, followed by vapor or solvent 320 grit emery cloth for foil
degreasing
2. Etch for 10 min at 66⬚C in For maximum bond strength. Suitable for
brass and bronze. ASTM D 2651 sulfuric
Ferric sulfate 1
acid-dichromate-ferric sulfate etch
Sulfuric acid (96%) 75
Water 8
Wash in water at 20⬚C, and etch in cold solution
of
Sodium dichromate 1
Sulfuric acid (96%) 2
Water 17
Etch until a bright clean surface has been
obtained. Rinse in water, dip in ammonium
hydroxide (s.g. 0.88) and wash in tap water.
Rinse in distilled water and dry in warm air

3. Etch for 1–2 min at 20⬚C in Room temperature etch. ASTM D 2651
nitric acid / ferric chloride etch
Ferric chloride (42% solution in water) 15
Nitric acid (69%) 30
Water 197
828
 Substrates Cleaning solvents Substrate treatments Comments

Copper Trichloroethylene Rinse in distilled water after cold water wash

and dry in air at 20⬚C
4. Etch for 30 sec at 20⬚C in Alternative etching solution to above where
fast processing is required
Ammonium persulfate 1
Water 4
Rinse in distilled water after cold water wash
and dry in air at 20⬚C
5. Solvent degrease. Immerse 30 sec at RT in For copper alloys containing over 95%
copper. Stable surface for hot bonding
Nitric acid (69%) 30
Deionized water 90
Rinse in running water and transfer
immediately to next solution; immerse for 1–2
min at 98⬚C in Ebonol C (Enthone, Inc., New
Haven, CT) 24 oz and equivalent water to make
1 gal of solution. Rinse in deionized water and
air dry
6. Solvent degrease and immerse in nitric acid ASTM D 2651 nitric acid, sodium chlorite
solution as in 5 above. Immerse immediately for etch. Suitable for copper alloys containing
2–3 mins at 93–102⬚C in the following solution over 95% copper. It is not suitable for
in 1 gal of water: adhesives containing chlorides or for hot
bonding polyethylene
Sodium chlorite (technical) 4.01 oz
Trisodium phosphate 1.34 oz
Sodium hydroxide 0.67 oz
829
 Substrates Cleaning solvents Substrate treatments Comments
Copper Trichloroethylene Rinse thoroughly in running water until a
neutral test is produced when touched with
indicator paper
Dry. Bond as soon as possible, but within the
same working day
Gold Trichloroethylene Solvent or vapor degrease after light abrasion
with a fine emery cloth

Iron See steel (mild)

Lead and lead Trichloroethylene Abrasion. Grit or vapor blast, or 100 grit emery
based solders cloth followed by solvent degreasing

Magnesium and Trichloroethylene 1. Abrasion with 100 grit emery cloth followed Apply the adhesive immediately after
magnesium alloys by solvent degreasing abrasion
2. Vapor degrease. Immerse for 10 min at 60– Medium to high bond strength. ASTM D
70⬚C in: 2651 alkaline detergent treatment
Deionized water 95
Sodium metasilicate 2.5
Trisodium pyrophosphate 1.1
Sodium hydroxide 1.1
Sodium dodecylbenzene 0.3
sulfonate, such as Nacconol 90G
Rinse in water and dry below 60⬚C
3. Vapor degrease. Immerse for 10 min at 71– High bond strength. ASTM D 2651 chromic
88⬚C in acid etch
Water 4
Chromic acid 1
Rinse in water and dry below 60⬚C
830
 Substrates Cleaning solvents Substrate treatments Comments

Magnesium Trichloroethylene 4. Vapor degrease. Immerse for 5–10 min at 63– ASTM D 2651 sodium hydroxide—chromic
80⬚C in acid etch
Water 12
Sodium hydroxide 1
Rinse in water. Immerse for 5–15 min at RT in
Water 123
Chromic acid 24
Calcium nitrate 1.8
Rinse in water and dry below 60⬚C
5. Light anodic treatment and various corrosion Details may be obtained from the
preventive treatments have been developed by magnesium alloy producers or from ASM
magnesium producers Handbook, Vol. 5, and Military Specification
MIL-M-4502, Type I, Classes 1, 2, and 3
6. Some dichromate conversion coatings and Preliminary tests should be conducted to
wash primers designed for corrosion prevention determine suitability of these processes
are suitable for adhesive bonding before acceptance. Details of the processes
are found in the above referenced ASME
Handbook and also in MIL-M-3171

Nickel Trichloroethylene 1. Abrasion with 100 grit emery cloth followed For general purpose bonding
by solvent degreasing
2. Etch for 5 sec at 20⬚C in nitric acid (69%). For general purpose bonding
Wash in cold and hot water followed by a
distilled water rinse and air dry at 40⬚C

Silver Trichloroethylene Abrasion with 320 grit emery cloth followed by

solvent degreasing
831
 Substrates Cleaning solvents
Steel (stainless) Trichloroethylene
832
Substrate treatments Comments
1. Abrasion with 100 grit emery cloth, grit or Dry grit or sand blasting tends to warp
vapor blast followed by solvent degreasing. thin sheet materials; these methods are
suited only for thick section parts
2. Solvent degrease and abrade with grit paper. ASTM D 2651 sulfuric, nitric, hydrofluoric
Degrease again. Immerse for 10 min at 65–71⬚C etch
in the following solution:
Water 90
Sulfuric acid (s.g. 1.84) 37
Sodium dodecylbenzene
sulfonate, such as Nacconol 90G
(Stephan Co., Northfield, IL) 0.2
Rinse thoroughly and remove smut with a stiff
brush if necessary
Immerse for 10 min at RT in the following
bright dip solution:
Water 88
Nitric acid (s.g. 1.42) 15
Hydrofluoric acid
(35.35%, s.g. 1.15) 2
3. Immerse for 2 min at approximately 93⬚C in For maximum resistance to heat and
the following solution heated by a boiling water environment. ASTM D 2651 hydrochloric,
bath: Orthophosphoric, hydrofluoric acid etch
Hydrochloric acid (s.g. 1.2) 200
Orthophosphoric acid (s.g. 1.8) 30
Hydrofluoric acid (s.gg., 1.15) 10
4. Etch for 15 min at 63⬚C in ASTM D 2651 sulfuric, sodium dichromate
etch
 Substrates Cleaning solvents Substrate treatments Comments

Steel (stainless) Trichloroethylene Saturated sodium dichromate

solution 30
Sulfuric acid 100
Remove carbon residue with nylon brush while
rinsing. Rinse in distilled water and dry in
warm air at 93⬚C
5. Vapor degrease for 10 min and pickle for 10 Room temperature etch. Treatment may be
min at 20⬚C in followed by passivation for 20 min in 5–
10% w / v chromic acid solution
Nitric acid (69%) 10
Hydrofluoric acid (48%) 2
Water 88
Dry in air under 70⬚C
6. Immerse for 15 min at 63 Ⳳ 3⬚C in the ASTM D 2651 sodium metasilicate
following solution: treatment
Water 47.2
Sodium metasilicate 1.0
Anionic surfactant, such as
Triton X2000 (Rohm and
Haas, Philadelphia, PA) 1.8
7. Immerse for 10 min at 60–65⬚C in the ASTM D 2651 hydrochloric sulfuric—
following solution: dichromate etch
Water 45
Hydrochloric acid (s.g. 1.2) 50
Formalin solution (40%) 10
Hydrogen Peroxide (30–35%) 2
Rinse thoroughly, and then immerse for 5 min at
50–65⬚C in sulfuric acid dichromate solution
used for aluminum
833
 Substrates Cleaning solvents Substrate treatments Comments
Rinse thoroughly, and then dry at not over 93⬚C

Steel (mild, iron, Trichloroethylene 1. Abrasion. Grit or vapor blast followed by Xylene or toluene is preferred to acetone
and ferrous metals solvent degreasing with water free solvents and ketone, which may be moist enough to
other than cause rusting
stainless)
2. Etch in the following solution for 5 mins at ASTM D 2651 nitric-phosphoric acid etch.
23⬚C: Bonding should follow immediately after
etching treatments since ferrous metals are
Deionized water 64.99% by vol
prone to rusting. Abrasion is more suitable
Surfactant 0.01% by vol
for procedure where bonding is delayed
Phosphoric acid (85%) 30 % by vol
Nitric acid (40 Baume) 5 % by vol
3. Etch for 5–10 min at 20⬚C in
Hydrochloric acid (37%) 1
Water 1
Rinse in distilled water after cold water wash
and dry in warm air for 10 min at 93⬚C
4. Etch for 10 min at 60⬚C in For maximum strength
Orthophosphoric acid (85%) 1
Ethyl alcohol (denatured) 2
Brush off carbon residue with nylon brush while
washing in running water. Rinse with deionized
water and heat for 1 hr at 120⬚C

Tin Trichloroethylene Solvent or vapor degrease after light abrasion

with a fine emery cloth (320 grit)
834
 Substrates Cleaning solvents Substrate treatments Comments

Titanium and Trichloroethylene 1. Abrasion. Grit or vapor blast or 100 grit For general purpose bonding
titanium alloys emery cloth; followed by solvent degrease; or
scour with a nonchlorinated cleaner, rinse, and
dry
2. Etch for 5–10 min at 20⬚C in
Sodium fluoride 2
Chromium trioxide 1
Sulfuric acid (96%) 10
Water 50
Rinse in water and distilled water. Dry in air at
93⬚C
3. Etch for 2 min at RT in Suitable for alloys to be bonded with high
temperature adhesives (e.g.,
Hydrofluoric acid (60%) 63 ml
polybenzimidasole). Bond within 10 min of
Hydrochloric acid (37%) 841 ml
treatment. ASTM D 2651
Orthophosphoric acid (85%) 89 ml
Rinse in water and distilled water. Dry in air at
93⬚C
4. Etch for 10–15 min at 38–52⬚C in Alternative etch for alloys to be bonded
with polyimide adhesives is nitric:
Nitric acid (69%) 6
hydrofluoric: water in a ratio of 5:1:27 by
Hydrofluoric acid (60%) 1
wt. Etch 30 sec at 20⬚C
Water 20
Rinse with water and distilled water. Dry in
oven at 71–82⬚C for 15 min
5. Commercial etching liquids and pastes
(PlasaJell 107C, Semco)
6. Immerse for 15 min at 76⬚C in the following ASTM D 2651 nitric hydrofluoric etch
solution to make 1 gal (3.6 l):
835
 Substrates Cleaning solvents Substrate treatments Comments

Titanium Trichloroethylene Caustic cleaner, such as

Vitro-Klene (Turco Purex
Industries, Carson, CA) 6–8 oz
Water Remainder
Rinse in cold tap water, and immerse for 5 min
at RT in the following solution:
Nitric acid (s.g., 1.5) 48
Ammonium bifluoride (technical) 3
Water 49
Rinse in cold tap water and air dry at room
temperature
Immerse for 2 min at RT in the following
solution with sufficient water to make 1 gal
(3.6 l):
Trisodium phosphate (technical) 50.0 gm
Sodium fluoride (technical) 8.9 gm
Hydrofluoric acid (48%) 26.0 ml
Air dry at room temperature
8. Stainless steel surface processes have been Sulfuric, sodium dichromate etch; sodium
generally found satisfactory for titanium metasilicate; and Hydrochloric sulfuric-
dichromate etch processes for stainless
steel

Zinc and zinc alloys Trichloroethylene 1. Abrasion. Grit or vapor blast or 100 grit For general purpose bonding
emery cloth followed by solvent degreasing
2. Etch for 2–4 min at 20⬚C in
Hydrochloric acid (37%) 10–20
Water 90–80
836
 Substrates Cleaning solvents Substrate treatments Comments

Zinc Trichloroethylene Rinse with warm water and distilled water. Dry Glacial acetic acid is an alternative to
in air at 66–71⬚C for 30 min hydrochloric acid
3. Etch for 3–6 min at 38⬚C in Suitable for freshly galvanized metal
Sulfuric acid (96%) 2
Sodium dichromate 1
Water 8
837
D.2 Surface Preparation Methods for Plastic Substrates

Substrates Cleaning solvents Substrate treatments Comments

Acetal (copolymer) Acetone 1. Abrasion. Grit or vapor blast, or medium grit emery For general purpose bonding
cloth followed by solvent degreasing
2. Etch in the following acid solution for 10 sec at For maximum bond strength. ASTM D 2093
25⬚C:
Potassium dichromate 75
Distilled water 120
Sulfuric acid (96%) 1500
Rinse in distilled water, dry in air at RT

Acetal (homopolymer) Acetone 1. Abrasion. Sand with 280 grit emery cloth followed For general purpose bonding
by solvent degreasing
2. Satinizing technique. Immerse the part in the For maximum bond strength.
following for 5–30 sec at 80–120⬚C: Recommended by DuPont
Perchloroethylene 96.85
1,4 Dioxane 3.0
p-Toluenesulfonic acid 0.05
Cab-o-Sil (Cabot Corp.) 0.10
Transfer the part immediately to an oven at 120⬚C for
1 min. Wash in hot water. Dry in air at 120⬚C

Acrylonitrile Acetone 1. Abrasion. Grit or vapor blast, or 220 grit emery

butadiene styrene cloth, followed by solvent degreasing
2. Etch in chromic acid solution for 20 min at 60⬚C Recipe 2 for methyl pentene
838
 Substrates Cleaning solvents Substrate treatments Comments

Cellulosics: cellulose, Methanol, 1. Abrasion. Grit or vapor blast or 220 grit emery For general purpose bonding
cellulose acetate, isopropanol cloth followed by solvent degreasing
cellulose acetate
2. After procedure 1, dry the part at 100⬚C for 1 hr
butyrate, cellulose
and apply adhesive before the plastic cools to room
nitrate, cellulose
temperature
propionate, ethyl
cellulose

Diallyl phthalate, Acetone, methyl Abrasion. Grit or vapor blast, or 100 grit emery cloth Steel wool may be used for abrasion
diallyl isophthalate ethyl ketone followed by solvent degreasing

Epoxy Acetone, methyl Abrasion. Grit or vapor blast or 100 grit emery cloth Sand or steel shot are suitable abrasives
ethyl ketone followed by solvent degreasing

Ethylene vinyl Methanol Prime with epoxy adhesive and fuse into the surface
acetate by heating for 30 min at 100⬚C

Furane, ionomer, Acetone, methyl Abrasion. Grit or vapor blast or 100 grit emery cloth
melamine resins, ethyl ketone followed by solvent degreasing
SAN, polysulfone, and
rigid vinyl

Methyl pentene Acetone 1. Abrasion. Grit or vapor blast or 100 grit emery For general purpose bonding
cloth followed by solvent degreasing
2. Immerse for 1 hr at 60⬚C in
Potassium chromate 7.5
Water 27.5
Sulfuric acid (96%) 65.0
Rinse in water and distilled water. Dry in warm air
839
 Substrates Cleaning solvents Substrate treatments Comments

Acetone 3. Immerse for 5-10 min at 90C in potassium

Methyl pentene
permanganate (saturated solution), acidified with
sulfuric acid (96%). Rinse in water and distilled water.
Dry in warm air
4. Prime surface with a lacquer based on urea Coatings (dried) offer excellent bonding
formaldehyde resin diluted with carbon tetrachloride surfaces without further treatment

Phenolic and phenolic Acetone, methyl 1. Abrasion. Grit or vapor blast, or abrade with 100 Steel wool may be used for abrasion. Sand
melamine resins ethyl ketone, grit emery cloth followed by solvent degreasing or steel shot are suitable abrasives. Glass
detergent fabric decorative laminate may be
degreased with detergent solution
2. Removal of surface layer of one ply of fabric
previously placed on surface before curing. Expose
fresh bonding surface by tearing off the ply prior to
bonding

Polyamide (nylon) Acetone, methyl 1. Abrasion. Grit or vapor blast or abrade with 100
ethyl ketone grit emery cloth followed by solvent degreasing
2. Prime with a spreading dough based on the type of
rubber to be bonded in an admixture with isocyanate
3. Prime with resorcinol formaldehyde adhesives
Sand or steel shot are suitable abrasives
Suitable for bonding Polyamide textiles to
natural and synthetic rubbers
Good adhesion to primer coat with epoxy
adhesives in metal to plastic joints

Polycarbonate Methanol, Abrasion. Grit or vapor blast or 100 grit emery cloth Sand or steel shot are suitable abrasives
isopropanol, followed by solvent degreasing
detergent
840
 Substrates Cleaning solvents Substrate treatments Comments

Fluorocarbons: Trichloroethylene 1. Wipe with solvent and treat with the following for Sodium treated surface must not be
polychlorotrifluoro- 15 min at RT: abraded before use. Hazardous etching
ethylene, Naphthalene (128 g) dissolved in solutions require skillful handling.
polytetrafluoro- tetrhydrofuran (1 liter) to which is added Proprietary etching solutions are
ethylene, polyvinyl sodium (23 g) during a stirring period of 2 hr commercially available (see procedure 2).
fluoride, PTFE film available in etched condition
polymonochlorotri- Wash in acetone to remove excess organic materials, from various suppliers
fluoroethylene and subsequently wash with distilled or deionized
water. Before bonding dry the treated adherends in an
air circulating oven at 37 Ⳳ 3⬚C for about 1 hr
2. Wipe with solvent and treat as recommended in one
of the following commercial etchings:
Bond Aid (W. S. Shamban and Co.)
Fluorobond (Joclin Mfg. Co.)
Fluoroetch (Action Associates)
Tetraetch (W. L. Gore Associates)
3. Prime with epoxy adhesives and fuse into the Bond within 15 min of treatment
surface by heating for 10 min at 370⬚C
4. Expose to one of the following gases activated by
corona discharge:
Air (dry) for 5 min
Air (wet) for 5 min
Nitrous oxide for 10 min
Nitrogen for 5 min
5. Expose to electric discharge (50kV ac) for 4 min) Bond within 15 min of treatment
841
 Substrates Cleaning solvents Substrate treatments Comments
Polyesters, Detergent, 1. Abrasion. Grit or vapor blast or 100 grit emery For general purpose bonding
polyethylene acetone, methyl cloth followed by solvent degreasing
terphthalate (Mylar) ethyl ketone
2. Immerse for 10 min at 70–95⬚C in For maximum bond strength. Suitable for
Sodium hydroxide 2 Mylar films
Water 8
Rinse in hot water and dry in hot air
Chlorinated polyether Acetone, methyl Etch for 5 min at 71 Ⳳ 3⬚C in Suitable for film materials such as Pentane.
ethyl ketone ASTM D 2093
Potassium dichromate 75
Water 120
Sulfuric acid (96%) 1500
Rinse in water and distilled water. Dry in air

Polyethylene, Acetone, methyl 1. Solvent degreasing Low bond strength applications, generally
polypropylene, ethyl ketone only with pressure sensitive or contact
polyformaldehyde adhesives
2. Expose surface to gas burner flame (or oxyacetylene Surface must be bonded immediately after
oxidizing flame) until substrate is glossy treatment
3. Etch in the following: For maximum bond strength. ASTM D 2093
Potassium dichromate 75
Water 120
Sulfuric acid (96%) 1500
Polyethylene and polypropylene: 60 min at 25⬚C or 1
min at 71⬚C
Polyformaldehyde: 10 sec at 25⬚C
842
 Substrates Cleaning solvents Substrate treatments Comments

Polymethylmeth- Acetone, methyl Abrasion. Grit or vapor blast or 100 grit emery cloth For maximum strength relieve stresses by
acrylate (acrylic) ethyl ketone, followed by solvent degreasing annealing plastic for 5 hr at 100⬚C
detergent,
methanol,
trichloroethylene,
isopropanol

Polyphenylene Trichloroethylene Abrasion. Grit or vapor blast or 100 grit emery cloth
followed by solvent degreasing

Polyphenylene oxide Methanol Solvent degrease Plastic is soluble in xylene and may be
primed with adhesive in xylene solvent

Polystyrene Methanol, Abrasion. Grit or vapor blast or 100 grit emery cloth Suitable for rigid plastic
isopropanol, followed by solvent degreasing
detergent

Polysulfone Methanol Vapor degrease

Polyurethane Acetone, methyl Abrade with 100 grit emery cloth and solvent
ethyl ketone degrease

Polyvinylchloride, Trichloroethylene, 1. Abrasion. Grit or vapor blast or 100 grit emery Suitable for rigid plastic. For maximum
polyvinylidene methyl ethyl cloth followed by solvent degreasing strength, prime with nitrile phenolic
chloride, polyvinyl ketone adhesive
fluoride
2. Solvent wipe with ketone Suitable for plasticized material

Styrene acrylonitrile Trichloroethylene Solvent degrease

Urea formaldehyde Acetone, methyl Abrasion. Grit or vapor blast or 100 grit emery cloth
ethyl ketone followed by solvent degreasing
843
D.3 Surface Preparation Methods for Elastomeric Substrates

Substrates Cleaning solvents Substrate treatments Comments

Natural rubber Methanol, 1. Abrasion followed by brushing. Grit or vapor For general purpose bonding
isopropanol blast or 280 grit emery cloth, followed by
solvent wipe
2. Treat the surface for 2–10 min with sulfuric Adequate pretreatment is indicated by the
acid (96%) at RT. Rinse thoroughly with cold appearance of hair line surface cracks on
water / hot water. Dry after rinsing in distilled flexing the rubber. Suitable for many
water. Residual acid may be neutralized by synthetic rubbers when given 10–15 min etch
soaking for 10 min in 10% ammonium at RT. Unsuitable for use on butyl,
hydroxide after hot water washing polysulfide, silicone, chlorinated polyethylene,
and polyurethane rubbers
3. Treat surface for 2–10 min with paste made
from sulfuric acid and barium sulfate. Apply
paste with stainless steel spatula and follow
procedure 2 above
4. Treat surface for 2–10 min in Suitable for those rubbers amenable to
treatments 2 and 3
Sodium hypochlorite 6
Hydrochloric acid (37%) 1
Water 200
Rinse with cold water and dry

Butadiene styrene Toluene 1. Abrasion followed by brushing. Grit or vapor Excess toluene results in swollen rubber. A 20
blast or 280 grit emery cloth followed by solvent min drying time will restore the part to its
wipe original dimensions
844
 Substrates Cleaning solvents Substrate treatments Comments

Butadiene styrene T oluene 2. Prime with butadiene styrene adhesive in an

aliphatic solvent
3. Etch surface for 1–5 min at RT following
method 2 for natural rubber

Butadiene nitrile Methanol 1. Abrasion followed by brushing. Grit or vapor

blast or 280 grit emery cloth followed by solvent
wipe
2. Etch surface for 10–45 sec at RT following
procedure 2 for natural rubber

Butyl and Toluene 1. Solvent wipe

chlorobutyl rubber 2. Immerse in the following solution at 21–32⬚C Solution life is 4 hr maximum
for 90–150 secs:
Hydrochloric acid (37%) 0.3
Sodium hypochlorite (5.25%) 3.0
Distilled water 97.0
Rinse in tap water followed by distilled water.
Dry at 65⬚C maximum
3. Prime with butyl rubber adhesive in an
aliphatic solvent

Chlorosulfonated Acetone, methyl ethyl Abrasion followed by brushing. Grit or vapor General purpose bonding
polyethylene ketone blast or 280 grit emery cloth followed by solvent
wipe
845
 Substrates Cleaning solvents Substrate treatments Comments
Fluorosilicones Methanol Application of fluorosilicone primer to metal Primer available from Dow Corning
where intention is to bond unvulcanized rubber

Polyacrylic Methanol Abrasion followed by brushing. Grit or vapor For general purpose bonding
blast or 100 grit emery cloth followed by solvent
wipe

Polybutadiene Methanol Solvent wipe General purpose bonding

Polychloroprene Toluene, methanol, 1. Abrasion followed by brushing. Grit or vapor Adhesion improved by abrasion with 280 grit
(neoprene) isopropanol blast or 100 grit emery cloth followed by solvent emery cloth followed by solvent wipe
wipe
2. Etch surface for 5–10 min at RT following
procedure 2 for natural rubber

Polysulfide Methanol Immerse overnight in strong chlorine water,

wash and dry

Polyurethane Methanol 1. Abrasion followed by brushing. Grit or vapor

blast or 280 grit emery cloth followed by solvent
wipe
2. Incorporation of a chlorosilane into the
adhesive elastomer system. 1% by weight is
usually sufficient
Chlorosilane is available commercially.
Addition to adhesive eliminates need for
priming and improves adhesion to glass and
metals. Silane may be used as a surface
primer

Silicone Acetone, methanol 1. Application of primer (e.g., Chemlok 607,

Lord Chemical Co.)
2. Exposure to oxygen gas activated by corona
discharge for 10 min
846
D.4 Surface Preparation Methods for Miscellaneous Substrates

Substrates Cleaning solvents Substrate treatments Comments

Brick and fired non Methyl ethyl Abrade surface with a wire brush; remove all dust and
glazed building ketone contaminants
materials

Carbon graphite Acetone Abrasion. Abrade with 220 grit emery cloth and For general purpose bonding
solvent degrease after dust removal

Glass and quartz (non- Acetone, detergent 1. Abrasion Grit blast with carborundum wand water For general purposes bonding. Drying
optical) slurry, and solvent degrease. Dry for 30 min at 100C. process improves bond strength
Apply the adhesive before the glass cools to RT
2. Immerse for 10–15 min at 20⬚C in For maximum strength
Sodium dichromate 7
Water 7
Sulfuric acid (96%) 400
Rinse in water and distilled water, Dry thoroughly

Glass (optical) Acetone, detergent Clean in an ultrasonically agitated detergent bath.

Rinse: dry below 38⬚C

Ceramics and porcelain Acetone 1. Abrasion Grit blast with carborundum and water
slurry and solvent degrease
2. Solvent degrease or wash in warm aqueous
detergent, rinse and dry
847
 Substrates Cleaning solvents Substrate treatments Comments
Ceramics and porcelain Acetone 3. Immerse for 15 min at 20⬚C in
Sodium dichromate 7
Water 7
Sulfuric acid (96%) 400
Rinse in water and distilled water. Oven dry at 66⬚C

Concrete, granite, stone Perchloroethylene, 1. Abrasion. Abrade with a wire brush, degrease with
detergent detergent, and rinse with hot water before drying
2. Etch with 15% hydrochloric acid until effervescence
ceases. Wash with water until surface is litmus
neutral. Rinse with 1% ammonia and water. Dry
thoroughly before bonding
For general purpose bonding
Applied by stiff bristle brush. Acid
should be prepared in a plastic pail.
10-12% hydrochloric or sulfuric acids
are alternative etchants. 10% w / w
sodium bicarbonate may be used
instead of ammonia for acid
neutralization

Wood, plywood Abrasion. Dry wood is smoothed with a suitable emery For general purpose bonding
paper. Sand plywood along the direction of the grain

Painted surface Detergent 1. Clean with detergent solution, abrade with a Bond generally as strong as the paint
medium emery cloth, final wash with detergent

2. Remove paint by solvent or abrasion, and pretreat For maximum adhesion

exposed base
848