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2SK168

Silicon N-Channel Junction FET

Application

VHF Amplifier, Mixer, Local oscillator

Outline

TO-92 (2)

1. Gate
2. Source
3. Drain

3
2
1
2SK168

Absolute Maximum Ratings (Ta = 25°C)


Item Symbol Ratings Unit
Gate to drain voltage VGDO –30 V
Gate to source voltage VGSS –1 V
Gate current IG 10 mA
Drain current ID 20 mA
Channel power dissipation Pch 200 mW
Channel temperature Tch 150 °C
Storage temperature Tstg –55 to +150 °C

Electrical Characteristics (Ta = 25°C)


Item Symbol Min Typ Max Unit Test conditions
Gate to drain breakdown V(BR)GDO –30 — — V I G = –100 µA, IS = 0
voltage
Gate cutoff current I GSS — — –10 nA VGS = –0.5 V, VDS = 0
1
Drain current I DSS* 4 — 20 mA VDS = 5 V, VGS = 0
Gate to source cutoff voltage VGS(off) — — –3.0 V VDS = 5 V, ID = 10 µA
Forward transfer admittance |yfs| 8 10 — mS VDS = 5 V, VGS = 0, f = 1 kHz
Input capacitance Ciss — 6.8 — pF VDS = 5 V, VGS = 0, f = 1 MHz
Reverse transfer capacitance Crss — 0.1 — pF VDS = 5 V, VGS = 0, f = 1 MHz
Power gain PG — 27 — dB VDS = 5 V, VGS = 0,
f = 100 MHz
Noise figure NF — 1.7 — dB VDS = 5 V, VGS = 0,
f = 100 MHz
Note: 1. The 2SK168 is grouped by I DSS as follows.
D E F
4 to 8 6 to 12 10 to 20

2
2SK168

Maximum Channel Power


Dissipation Curve Typical Output Characteristics (1)
300 10
Channel Power Dissipation Pch (mW)

VGS = 0
8

Drain Current ID (mA)


Pc
h
–0.2 V =
200 20
6 0
m
W
–0.4
4
100 –0.6

2 –0.8
–1.0

0 50 100 150 0 10 20 30 40 50
Ambient Temperature Ta (°C) Drain to Source Voltage VDS (V)

Typical Output Characteristics (2) Typical Transfer Characteristics


10 15

VGS = 0 VDS = 5 V
8
Drain Current ID (mA)

Drain Current ID (mA)

–0.2 V 10
6

–0.4 F
4
–0.6 5 E

2 –0.8 D
–1.0

0
0 1 2 3 4 5 –3.0 –2.0 –1.0 0
Drain to Source Voltage VDS (V) Gate to Source Voltage VGS (V)

3
2SK168

Forward Transfer Admittance vs.


Forward Transfer Admittance vs.
Drain to Source Voltage
Drain Current
Forward Transfer Admittance yfs (mS)

Forward Transfer Admittance yfs (mS)


15
Ta = –25°C 50

25°C
20
10 75°C
10

5 VGS = 0
2 VDS = 5 V
f = 1 kHz
f = 1 kHz
1.0

0.5
0 5 10 15 0.2 0.5 1.0 2 5 10 20
Drain to Source Voltage VDS (V) Drain Current ID (mA)

Reverse Transfer Capacitance vs.


Input Capacitance vs. Drain to Source Voltage
Drain to Source Voltage 5
Reverse Transfer Capacitance Crss (pF)

20
VGS = 0 VGS = 0
Input Capacitance Ciss (pF)

f = 1 MHz 2 f = 1 MHz

10 1.0

0.5

5
0.2

0.1

2 0.05
0.1 0.2 0.5 1.0 2 5 10 0.1 0.2 0.5 1.0 2 5 10
Drain to Source Voltage VDS (V) Drain to Source Voltage VDS (V)

4
2SK168

Output Capacitance vs. Power Gain vs.


Drain to Source Voltage Drain to Source Voltage
200 30

VGS = 0
Output Capacitance Coss (pF)

100
f = 1 MHz

Power Gain PG (dB)


50
20
VGS = 0
20 f = 100 MHz

10 10

2
0.1 0.2 0.5 1.0 2 5 10 0 5 10 15
Drain to Source Voltage VDS (V) Drain to Source Voltage VDS (V)

Noise Figure vs.


Power Gain vs. Drain Current Drain to Source Voltage
30 8

E F VGS = 0
f = 100 MHz
Noise Figure NF (dB)
Power Gain PG (dB)

6
D
20

10 VDS = 5 V
f = 100 MHz
2
VGS Variable

0
2 4 6 8 10 12 14 16 0 4 8 12 16
Drain Current ID (mA) Drain to Source Voltage VDS (V)

5
2SK168
Input and Output Admittance Transfer Admittance vs.
vs. Frequency Frequency
5 50

Reverse Transfer Admittance yrs (mS)


Forward Transfer Admittance yfs (mS)
gis
yis = gis+jbis VDS = 5 V
ID = 10 mA
Output Admittance yos (mS)

yos = gos+jbos
Input Admittance yis (mS)

2 20
VDS = 5 V bis×10 gfs
ID = 10 mA
1.0 10
bos×10
gos –bfs
0.5 5 –10 brs

0.2 2 yfs = gfs+jbfs 10 grs


yrs = grs+jbfs
0.1 1.0

0.05 0.5
50 100 200 500 50 100 200 500
Frequency f (MHz) Frequency f (MHz)

Input and Output Admittance Transfer Admittance vs.


vs. Drain Current Drain Current
5 50
Reverse Transfer Admittance yrs (mS)
Forward Transfer Admittance yfs (mS)

bos VDS = 5 V
Output Admittance yos (mS)

f = 100 MHz
Input Admittance yis (mS)

2 20
gis
gfs
1.0 10
bis×10
–bfs
0.5 5
–100 brs

0.2 VDS = 5 V yis = gis+jbis 2


f = 100 MHz yos = gos+jbos
100 grs
0.1 gos is Negligible 1.0 yfs = gfs+jbfs
Small at This Frequency yrs = grs+jbrs
0.05 0.5
0.5 1.0 2 5 10 20 50 0.5 1.0 2 5 10 20 50
Drain Current ID (mA) Drain Current ID (mA)

6
2SK168
Power Gain and Noise Figure
Test Circuit

Shield
5.4 3.0
D.U.T.
50 L2 4,700
C1 L1 C2 V.V
SG Output 1,000 50
Impedance S.G.

Unit R : Ω
C : pF
VDD
C1, C2 : 0 to 30 pF Variable Air
L1 : 3.5 T 1 mmφ Copper Ribbon, Tin plated 10 mm Inside dia.
L2 : 4.5 T 1 mmφ Copper Ribbon, Tin plated 10 mm Inside dia.

7
Unit: mm

4.8 ± 0.3 3.8 ± 0.3

5.0 ± 0.2
2.3 Max
12.7 Min
0.60 Max
0.7

0.45 ± 0.1 0.5

1.27
2.54

Hitachi Code TO-92 (2)


JEDEC Conforms
EIAJ Conforms
Weight (reference value) 0.25 g
Cautions

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contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
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products.

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