Professional Documents
Culture Documents
0.1mF 0.1mF
8 V+ 1 VREF
7
DCLOCK
500W +In ADS7816 6 Serial
OPA340 DOUT
2 12-Bit A/D Interface
VIN 5
-In CS/SHDN
3300pF 3
GND 4
VIN = 0V to 5V for
0V to 5V output.
NOTE: A/D Input = 0 to VREF
RC network filters high-frequency noise.
Copyright © 2016, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
OPA340, OPA2340, OPA4340
SBOS073C – SEPTEMBER 1997 – REVISED AUGUST 2016 www.ti.com
Table of Contents
1 Features .................................................................. 1 7.4 Device Functional Modes........................................ 15
2 Applications ........................................................... 1 8 Application and Implementation ........................ 16
3 Description ............................................................. 1 8.1 Application Information............................................ 16
4 Revision History..................................................... 2 8.2 Typical Applications ................................................ 16
5 Pin Configuration and Functions ......................... 3 9 Power Supply Recommendations...................... 19
6 Specifications......................................................... 5 10 Layout................................................................... 20
6.1 Absolute Maximum Ratings ...................................... 5 10.1 Layout Guidelines ................................................. 20
6.2 ESD Ratings ............................................................ 5 10.2 Layout Example .................................................... 20
6.3 Recommended Operating Conditions....................... 5 11 Device and Documentation Support ................. 21
6.4 Thermal Information – OPA340 ................................ 5 11.1 Device Support...................................................... 21
6.5 Thermal Information – OPA2340 .............................. 6 11.2 Documentation Support ........................................ 22
6.6 Thermal Information – OPA4340 .............................. 6 11.3 Related Links ........................................................ 22
6.7 Electrical Characteristics........................................... 6 11.4 Receiving Notification of Documentation Updates 22
6.8 Typical Characteristics .............................................. 8 11.5 Community Resources.......................................... 22
7 Detailed Description ............................................ 12 11.6 Trademarks ........................................................... 22
7.1 Overview ................................................................. 12 11.7 Electrostatic Discharge Caution ............................ 22
7.2 Functional Block Diagram ....................................... 12 11.8 Glossary ................................................................ 23
7.3 Feature Description................................................. 13 12 Mechanical, Packaging, and Orderable
Information ........................................................... 23
4 Revision History
Changes from Revision B (November 2007) to Revision C Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1
• Deleted Package/Ordering Information table, see POA at the end of the data sheet............................................................ 1
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Supply voltage 5.5
Voltage V
Signal input terminals (2) –0.5 0.5
Signal input terminals (2) 10 mA
Current
Output short circuit (3) Continuous
Operating, TA –55 125
Temperature Junction, TJ 150 °C
Storage, Tstg –55 125
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails should
be current limited to 10 mA or less.
(3) Short-circuit to ground, one amplifier per package.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
(1) VS = 5 V.
(2) Output voltage swings are measured between the output and power-supply rails.
160 0 100
140 PSRR
120 -45 80
Phase (°)
100
60
80 -90
60
40
40 -135 CMRR
20 20
0 -180
-20 0
0.1 1 10 100 1k 10k 100k 1M 10M 1 10 100 1k 10k 100k 1M
Frequency (Hz) Frequency (Hz)
Figure 1. Open-Loop Gain/Phase vs Frequency Figure 2. Power-Supply and Common-Mode Rejection vs
Frequency
10k 1k 140
Current Noise
Channel Separation (dB)
Voltage Noise (nV/ÖHz)
1k 100 130
Current Noise (fA/ÖHz)
Voltage Noise
100 10 120
10 1 110
G = 1, All Channels
1 0.1 100
1 10 100 1k 10k 100k 1M 10 100 1k 10k 100k
Frequency (Hz) Frequency (Hz)
Figure 3. Input Voltage and Current Noise Spectral Density Figure 4. Channel Separation vs Frequency
vs Frequency
0.1 5k
RL = 600 G = 100
RL = 2kW 4k
Output Resistance (W)
0.01 G = 10
G = 10
THD+N (%)
3k
RL = 10kW
RL = 600 RL = 2kW 2k G=1
0.001 G=1
RL = 10kW 1k
0.0001 0
20 100 1k 10k 20k 10 100 1k 10k 100k 1M 10M
Frequency (Hz) Frequency (Hz)
Figure 5. Total Harmonic Distortion + Noise vs Frequency Figure 6. Closed-Loop Output Impedance vs Frequency
CMRR (dB)
80
110 RL = 2kW
70
100
60
PSRR VS = 2.7V to 5V, VCM = -0.3V to (V+) -1.8V
90
50 VS = 5V, VCM = -0.3V to 5.3V
VS = 2.7V, VCM = -0.3V to 3V
80 40
-75 -50 -25 0 25 50 75 100 125 -75 -50 -25 0 25 50 75 100 125
Temperature (°C) Temperature (°C)
Figure 7. Open-Loop Gain and Power-Supply Rejection vs Figure 8. Common-Mode Rejection vs Temperature
Temperature
1000 800
Per Amplifier Per Amplifier
900
Quiescent Current (mA)
Quiescent Current (mA)
750
800
700
700
650
600
500 600
-75 -50 -25 0 25 50 75 100 125 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Temperature (°C) Supply Voltage (V)
Figure 9. Quiescent Current vs Temperature Figure 10. Quiescent Current vs Supply Voltage
100 60
-ISC
90
Short-Circuit Current (mA)
Short-Circuit Current (mA)
80
-ISC
70
50
60
50
+ISC
40 +ISC
40
30
20
10
0 30
-75 -50 -25 0 25 50 75 100 125 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Temperature (°C) Supply Voltage (V)
Figure 11. Short-Circuit Current vs Temperature Figure 12. Short-Circuit Current vs Supply Voltage
100
0.4
0.2
10 0
-0.2
-0.4
1
-0.6
-0.8
0.1 -1.0
-75 -50 -25 0 25 50 75 100 125 -1 0 1 2 3 4 5 6
Temperature (°C) Common-Mode Voltage (V)
Figure 13. Input Bias Current vs Temperature Figure 14. Input Bias Current vs Input Common-Mode
Voltage
5 6
VS = 5.5V
Maximum output
+125°C +25°C -55°C voltage without
5
4 slew rate-induced
4
3
3 VS = 2.7V
2
2
1 -55°C 1
+125°C +25°C
0
0
0 ±10 ±20 ±30 ±40 ±50 ±60 ±70 ±80 ±90 ±100 100k 1M 10M
Output Current (mA) Frequency (Hz)
Figure 15. Output Voltage Swing vs Output Current Figure 16. Maximum Output Voltage vs Frequency
18 25
Typical production Typical production
16 distribution of distribution of
14 packaged units. 20 packaged units.
Percent of Amplifiers (%)
12
10 15
6 10
4
5
2
0
0
100
200
300
400
500
-500
-400
-300
-200
-100
0 1 2 3 4 5 6 7 8 9 10 11 12 13 15
Offset Voltage (mV) Offset Voltage Drift (mV/°C)
Figure 17. Offset Voltage Production Distribution Figure 18. Offset Voltage Drift Magnitude Production
Distribution
1V/div
1ms/div 1ms/div
CL = 100 pF CL = 100 pF
Figure 19. Small-Signal Step Response Figure 20. Large-Signal Step Response
60 100
50 G = -1
0.01%
10
30
0.1%
20 G = -5 1
7 Detailed Description
7.1 Overview
The OPA340 series operational amplifiers are fabricated on a state-of-the-art, 0.6-micron CMOS process. These
devices are unity-gain stable and suitable for a wide range of general-purpose applications. Rail-to-rail input and
output make them ideal for driving sampling A/D converters. In addition, excellent AC performance makes them
well-suited for audio applications. The class AB output stage is capable of driving 600-Ω loads series and
extends 500 mV beyond the supply. Rail-to-rail input and output swing significantly increases dynamic range,
especially in low-supply applications. Figure 23 shows the input and output waveforms for the OPA340 in unity-
gain configuration. Operation is from a single 5-V supply with a 10-kΩ load connected to V/2. The input is a 5-
VPP sinusoid. Output voltage is approximately 4.98 VPP. Power-supply pins must be bypassed with 0.01-µF
ceramic capacitors.
VS = +5, G = +1, RL = 10kW
5
VIN
2V/div
5
VOUT
V+
Reference
Current
VIN+ VIN-
VBIAS1 Class AB
Control VO
Circuitry
VBIAS2
V-
(Ground)
Copyright © 2016, Texas Instruments Incorporated
V+
IOVERLOAD
10mA max
OPAx340 VOUT
VIN
5kW
Figure 24. Input Current Protection for Voltages Exceeding the Supply Voltage
V+
RS
OPAx340 VOUT
VIN 10W to
RL CL
20W
Figure 25. Series Resistor in Unity-Gain Configuration Improves Capacitive Load Drive
0.1mF 0.1mF
8 V+ 1 VREF
7
DCLOCK
500W +In ADS7816 6 Serial
OPA340 DOUT
2 12-Bit A/D Interface
VIN 5
-In CS/SHDN
3300pF 3
GND 4
VIN = 0V to 5V for
0V to 5V output.
NOTE: A/D Input = 0 to VREF
RC network filters high-frequency noise.
Copyright © 2016, Texas Instruments Incorporated
+5V
330pF
0.1mF 0.1mF
5kW 5kW
VIN
8 V+ 1 VREF
7
DCLOCK
+In ADS7816 6 Serial
OPA340 DOUT
2 12-Bit A/D Interface
5
-In CS/SHDN
3
GND 4
10MW
RL
220pF
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
Equation 1 through Equation 2 show calculations for corner frequency and gain:
(1)
(2)
= 15.9 kHz.
To further limit the bandwidth, a larger C1 must be used: choosing C1 = 1 µF,
40
C1 = 0
20
Gain = VOUT/VIN (dB)
C1 = 10 nF
0
C1 = 1 m F
-20
-40
1 10 100 1k 10 k 100 k 1M
Frequency (Hz)
Equation 3 through Equation 5 show calculations for corner frequency and gain:
(3)
(4)
(5)
= 15.9 kHz.
To further limit the bandwidth, a larger RC value must be used: increasing C values 100 times, such as
C1 = 1 µF and C2 = 0.1 µF, with unchanged resistors, results in the second-order rolloff at
CAUTION
Supply voltages larger than 7 V can permanently damage the device (see the Absolute
Maximum Ratings).
TI recommends placing 0.1-μF bypass capacitors close to the power-supply pins to reduce errors coupling in
from noisy or high-impedance power supplies.
10 Layout
GND VS–
Use low-ESR, VOUT
ceramic bypass
capacitor
Copyright © 2016, Texas Instruments Incorporated
VIN +
VOUT
±
RG RF
Copyright © 2016,
Texas Instruments Incorporated
NOTE
These files require that either the TINA software (from DesignSoft™) or TINA-TI software
be installed. Download the free TINA-TI software from the TINA-TI folder.
NOTE
These boards are unpopulated, so users must provide their own ICs. TI recommends
requesting several operational amplifier device samples when ordering the Universal Op
Amp EVM.
11.6 Trademarks
MicroAmplifier, TINA-TI, E2E are trademarks of Texas Instruments.
WEBENCH is a registered trademark of Texas Instruments.
TINA, DesignSoft are trademarks of DesignSoft, Inc.
All other trademarks are the property of their respective owners.
11.7 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.8 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 11-Apr-2018
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
OPA2340EA/250 ACTIVE VSSOP DGK 8 250 Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR A40A
& no Sb/Br)
OPA2340EA/250G4 ACTIVE VSSOP DGK 8 250 Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR A40A
& no Sb/Br)
OPA2340EA/2K5 ACTIVE VSSOP DGK 8 2500 Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR A40A
& no Sb/Br)
OPA2340EA/2K5G4 ACTIVE VSSOP DGK 8 2500 Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR A40A
& no Sb/Br)
OPA2340PA ACTIVE PDIP P 8 50 Green (RoHS CU NIPDAU N / A for Pkg Type OPA2340PA
& no Sb/Br)
OPA2340PAG4 ACTIVE PDIP P 8 50 Green (RoHS CU NIPDAU N / A for Pkg Type OPA2340PA
& no Sb/Br)
OPA2340UA ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA
& no Sb/Br) 2340UA
OPA2340UA/2K5 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR OPA
& no Sb/Br) 2340UA
OPA2340UA/2K5G4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR OPA
& no Sb/Br) 2340UA
OPA2340UAG4 ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA
& no Sb/Br) 2340UA
OPA340NA/250 ACTIVE SOT-23 DBV 5 250 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 A40
& no Sb/Br)
OPA340NA/250G4 ACTIVE SOT-23 DBV 5 250 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 A40
& no Sb/Br)
OPA340NA/3K ACTIVE SOT-23 DBV 5 3000 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 A40
& no Sb/Br)
OPA340NA/3KG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 A40
& no Sb/Br)
OPA340PA ACTIVE PDIP P 8 50 Green (RoHS CU NIPDAU | Call TI N / A for Pkg Type -40 to 85 OPA340PA
& no Sb/Br)
OPA340PAG4 ACTIVE PDIP P 8 50 Green (RoHS Call TI N / A for Pkg Type -40 to 85 OPA340PA
& no Sb/Br)
OPA340UA ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA
& no Sb/Br) 340UA
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 11-Apr-2018
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
OPA340UA/2K5 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA
& no Sb/Br) 340UA
OPA340UA/2K5G4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA
& no Sb/Br) 340UA
OPA340UAG4 ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA
& no Sb/Br) 340UA
OPA4340EA/250 ACTIVE SSOP DBQ 16 250 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA
& no Sb/Br) 4340EA
OPA4340EA/250G4 ACTIVE SSOP DBQ 16 250 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA
& no Sb/Br) 4340EA
OPA4340EA/2K5 ACTIVE SSOP DBQ 16 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA
& no Sb/Br) 4340EA
OPA4340EA/2K5G4 ACTIVE SSOP DBQ 16 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA
& no Sb/Br) 4340EA
OPA4340UA ACTIVE SOIC D 14 50 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA4340UA
& no Sb/Br)
OPA4340UA/2K5 ACTIVE SOIC D 14 2500 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA4340UA
& no Sb/Br)
OPA4340UA/2K5G4 ACTIVE SOIC D 14 2500 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA4340UA
& no Sb/Br)
OPA4340UAG4 ACTIVE SOIC D 14 50 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA4340UA
& no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com 11-Apr-2018
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Aug-2017
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Aug-2017
Pack Materials-Page 2
PACKAGE OUTLINE
DBV0005A SCALE 4.000
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
C
3.0
2.6 0.1 C
1.75
B A 1.45 MAX
1.45
PIN 1
INDEX AREA
1 5
2X 0.95
3.05
2.75
1.9 1.9
2
4
3
0.5
5X
0.3
0.15
0.2 C A B (1.1) TYP
0.00
0.25
GAGE PLANE 0.22
TYP
0.08
8
TYP 0.6
0 TYP SEATING PLANE
0.3
4214839/C 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
www.ti.com
EXAMPLE BOARD LAYOUT
DBV0005A SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
(1.9)
2
2X (0.95)
3 4
SOLDER MASK
SOLDER MASK METAL METAL UNDER OPENING
OPENING SOLDER MASK
4214839/C 04/2017
NOTES: (continued)
www.ti.com
EXAMPLE STENCIL DESIGN
DBV0005A SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
2 (1.9)
2X(0.95)
3 4
(R0.05) TYP
(2.6)
4214839/C 04/2017
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
www.ti.com
PACKAGE OUTLINE
DBQ0016A SCALE 2.800
SSOP - 1.75 mm max height
SHRINK SMALL-OUTLINE PACKAGE
SEATING PLANE
.228-.244 TYP
[5.80-6.19] .004 [0.1] C
A PIN 1 ID AREA
14X .0250
[0.635]
16
1
2X
.189-.197
[4.81-5.00] .175
NOTE 3 [4.45]
8
9
16X .008-.012
B .150-.157 [0.21-0.30] .069 MAX
[3.81-3.98] [1.75]
NOTE 4 .007 [0.17] C A B
.005-.010 TYP
[0.13-0.25]
SEE DETAIL A
.010
[0.25]
GAGE PLANE
.004-.010
0 -8 [0.11-0.25]
.016-.035
[0.41-0.88] DETAIL A
(.041 ) TYPICAL
[1.04]
4214846/A 03/2014
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 inch, per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MO-137, variation AB.
www.ti.com
EXAMPLE BOARD LAYOUT
DBQ0016A SSOP - 1.75 mm max height
SHRINK SMALL-OUTLINE PACKAGE
16X (.063)
[1.6] SEE
SYMM
DETAILS
1
16
16X (.016 )
[0.41]
14X (.0250 )
[0.635] 8 9
(.213)
[5.4]
4214846/A 03/2014
NOTES: (continued)
www.ti.com
EXAMPLE STENCIL DESIGN
DBQ0016A SSOP - 1.75 mm max height
SHRINK SMALL-OUTLINE PACKAGE
16X (.063)
[1.6]
SYMM
1
16
16X (.016 )
[0.41]
SYMM
14X (.0250 )
[0.635] 8 9
(.213)
[5.4]
4214846/A 03/2014
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
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used in or for Designers’ applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with
respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous
consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and
take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will
thoroughly test such applications and the functionality of such TI products as used in such applications.
TI’s provision of technical, application or other design advice, quality characterization, reliability data or other services or information,
including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to
assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any
way, Designer (individually or, if Designer is acting on behalf of a company, Designer’s company) agrees to use any particular TI Resource
solely for this purpose and subject to the terms of this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically
described in the published documentation for a particular TI Resource.
Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that
include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE
TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
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other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
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INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF
PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL,
DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN
CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949
and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.
Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such
products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards
and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must
ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in
life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.
Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life
support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all
medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.
TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).
Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications
and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory
requirements in connection with such selection.
Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s non-
compliance with the terms and provisions of this Notice.
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