Professional Documents
Culture Documents
Guide
www.ti.com/switches 2012
Analog Switch Overview
➔ Table of Contents / Introduction
Today’s competitive environment
creates a constant need for higher Analog Switch Overview
performance. One common method to Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
optimize system performance involves
Selecting the Right TI Analog Switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
the use of FET switches (also referred
to as signal switches) to provide a Analog Switches
high-speed bidirectional bus interface
Selection Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
between DSPs, CPUs, industry stan-
dard buses, memory and peripherals. Pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
The Texas Instruments (TI) signal switch Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
product portfolio consists of digital
switches, analog switches and specialty Specialty Switches
switches that provide high-performance, Selection Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
low-power replacements for standard
Pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
bus-interface devices when signal
buffering (current drive) is not required. Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Availability in advanced packaging
Resources
(BGA, QFN and WCSP) also allows
Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
TI signal switches to occupy reduced
board area in space-constrained Sample and Quality Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
applications. TI signal switches optimize Worldwide Technical Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
next-generation datacom, networking,
computing, portable communications
and consumer electronic designs by
supporting both digital and analog analog applications such as audio and video data transmission. TI analog switches
applications. are available in a wide range of voltages (from 0.8 to 12 V), support fast data through-
put (up to 2-GHz bandwidth) and offer low on-resistance and input capacitance for
Analog Switches decreased signal distortion and insertion loss. TI analog switches are available in the
TI’s analog switches are designed to TI Switch (TS) technology family. The TS product family encompasses a variety of
pass (or isolate) analog signals (both analog switches with different ON resistances, bandwidth, charge injection, and total
voltage and current) and support harmonic distortion to target any application.
Switch Nomenclature
Type: A = Analog switch, AP = Analog switch with over/undershoot protection, DV = Digital video switch
V = Video switch, L = LAN switch, N = Network switch, PCIE = PCI Express® switch
TS5A31xx TS5A1xxx
TS3A4xxx
TS3A24xxx TS3A5xxx 10
4 Series Series
3 5
When switches are first considered, a easy-to-control and consume relatively • What is the maximum signal
schematic of the ideal switch (similar to little power compared to traditional distortion limit for the system?
the one below) might come to mind. In electrically controlled switches such
The following are some things to
figure 1, an input signal applied to the as relays. The switches referred to
consider when selecting the right
left I/O pin (or port) results in an identical here are Complementary Metal-Oxide
analog switch.
output signal at the right I/O pin, and Semiconductor (CMOS) Field-Effect
vice versa. However, in the real world, Transistor (FET) switches. Analog Signal Considerations
switches are not ideal; and there is V+ — For noncharge-pump switches,
always some loss. In the case of clean,
Digital vs. Analog Signal Switches
V+ determines the analog signal
Digital switches are designed to pass
properly working mechanical switches, amplitude that can be passed without
(or isolate) digital signal levels and may
the loss is so miniscule that it hardly clipping. The gate(s) of the pass
exhibit the capability to satisfactorily
bears noting. transistors must be biased relative to
pass analog signals. Examples are CBT
Ideal Switch the minimum and maximum values
and CBTLV switch families.
of the expected input voltage range.
Analog switches are designed to pass Some switches allow for biasing from
(or isolate) analog signals and often two supplies, making it easy to pass
I/O I/O exhibit good digital signal performance both positive and negative signals.
(In) (Out) as well. One example is TI’s TS Switches with integrated charge pumps
technology. can elevate the gate voltage above V+
Signal In = Signal Out (at the expense of larger I+) and thus
Fig. 1 TI offers a wide variety of signal
pass signals of a magnitude greater
switches, and sometimes the no-
Like mechanical switches, solid-state than V+.
menclature can be confused to imply
switches are not ideal either. In fact,
limited functionality for a device or VIH/VIL — Why are these important
losses associated with solid-state
family. However, it should be apparent analog switch considerations? In most
switches can be significant. Why use
the most important switch characteris- applications, the signal switch is con-
a switch like this if it is so far from
tic depends on how it is used: trolled by the output of a digital source;
ideal? The answer is convenience and
therefore, the control signal levels, VIH
reliability. Mechanical switches are • What V+ levels are present?
and VIL, must be compatible with that
subject to wear out and mechanical
• What amplitude signals are required source to ensure proper operation of
reliability issues. Solid-state switches
to be passed? the switch.
are small, fast, easy-to-use and
1.5
of crosstalk also is a measure of VNC
0.8 VOUT
ron(flat) (Ω)
SPST
TS5A3166 0.9 0.15 — 1.65 5.5 2 kV HBM 4.5 9 5/SC70,SOT-23, WCSP
SPDT (continued)
TS5A3160 0.7 0.1 0.05 1.65 5.5 2 kV HBM 3.5 3.5 6/SC70, SOT-23
TS5A4624 0.7 0.1 0.05 1.65 5.5 2 kV HBM 12 5 6/SC70
TS5A6542 0.5 0.1 0.05 2.25 5.5 ±15 kV 12.5 9.5 8/WCSP, µQFN
Contact (IEC
L-4)
TS5A12301E 0.5 0.1 0.05 2.25 5.5 ±15 kV 72 80 6/WCSP (0.4mm pitch) 1.8-V Logic
Air-Gap Compatible
Logic Threshold
Independently of V+
SPDT x 2
TS5A23157 10 4 0.15 1.65 5.5 2 kV HBM 5.7 3.8 10/MSOP, µQFN
TS5A623157 4 4 0.15 1.65 5.5 2 kV HBM 3.5 2.8 10/MSOP, µQFN Overshoot/Undershoot
Protection
TS5A23159 0.7 0.1 0.05 1.65 5.5 2 kV HBM 8 5 10/MSOP/QFN
TS3A24157 0.5 0.01 0.05 1.65 3.6 2 kV HBM 20 12 10/ µQFN, VSSOP Ultra-Low
TS3A24159 0.26 0.01 0.01 1.65 3.6 2 kV HBM 20 12 10/WCSP, SON, VSSOP RON
TS5A26542 0.5 0.1 0.05 2.25 5.5 ±15 kV 12.5 9 12/WCSP
Contact (IEC
L-4)
TS3A225E 0.1 — — 2.7 4.5 ±8kV 21 21 16/WCSP, QFN Autonomous Audio
Contact Headset Switch
Discharge
(IEC L-4)
TS3A26746E 0.08 — — 3 3.6 ±8kV 150 5 6/WCSP 2 X 2 Crosspoint
Contact Switch for Audio
Discharge Applications
(IEC L-4)
TS5A22362 0.52 0.076 0.04 2.3 5.5 2.5 kV HBM 27 13 10/WCSP, 10/SON, Negative Rail
VSSOP Capability
TS5A22364 0.52 0.076 0.04 2.3 5.5 2.5 kV HBM 27 13 10/WCSP, 10/SON, Negative Rail
VSSOP Capability,
Click Pop Suppression
TS5A22366 0.7 0.135 0.05 2.25 5.5 2.5 kV HBM 193 182 12/WCSP (0.4mm Negative Rail
pitch), 10/µQFN Capability
SPDT x 4
TS3A5018 7 5 0.3 1.65 3.6 2 kV HBM 3.5 2 16/SOIC, SSOP, (QSOP),
TSSOP, TVSOP, SON
TS3A44159 0.3 0.07 0.045 1.65 4.3 2 kV HBM 17 12 16/TSSOP, SON, µQFN
SPDT x 6
TS3A27518E 4.4 0.91 0.3 1.65 3.6 ±6 kV 14.1 16.1 24BGA, SON
Contact (IEC
L-3)
SP3T
TS5A3359 0.7 0.1 0.1 1.65 5.5 2 kV HBM 2.5 6 8/US8, 8/WCSP
SP4T x 2
TS3A5017 11 7 1 2.3 3.6 2 kV HBM 5 1.5 16/SOIC, SSOP, (QSOP),
TSSOP, TVSOP, SON,
µQFN
New products are listed in bold red.
SPST
TS5A3166 0.9 X X
TS5A3167 0.9 X X
TS5A4594 8 X
TS5A4595 8 X
TS5A4596 8 X
TS5A4597 8 X
TS12A4514 6.5 X
TS12A4515 6.5 X
TS12A4516 12 X
TS12A4517 12 X
TS5A1066 7.5 X
SPST x 2
TS5A23166 0.9 X(2) X
TS5A23167 0.9 X(2) X
TS5A2066 7.5 X(2)
TS3A4741 0.7 X(2)
TS3A4742 0.7 X(2)
SPST x 4
TS3A4751 0.7 X(4)
TS12A44513 6.5 X(2) X(2)
TS12A44514 6.5 X(4)
TS12A44515 6.5 X(4)
SPDT
TS5A2053 7.5 X
TS5A3157 10
TS5A63157 4 X X X
TS12A12511 5 X
TS5A3153 0.08 X X X
TS5A3154 0.08 X X X
TS5A9411 5.3 X
TS5A3159 0.75 X
TS5A3159A 0.7 X X
TS5A3160 0.7 X X
SPDT (continued)
TS5A4624 0.7 X X
TS5A6542 0.5 X
TS5A12301E 0.5 X X
SPDT x 2
TS5A23157 10 X X X
TS5A623157 4 X X
TS5A23159 0.7 X X
TS3A24157 0.5 X
TS3A24159 0.26 X
TS5A26542 0.5 X
TS3A225E 0.1 x x
TS3A26746E 0.08 X X
TS5A22362 0.52 X
TS5A22364 0.52 X
TS5A22366 0.7 X
SPDT x 4
TS3A5018 7 X
TS3A44159 0.3 X
SPDT x 6
TS3A27518E 4.4 X X
SP3T
TS5A3359 0.7 X X
SP4T x 2
TS3A5017 11 X
SPST
TS5A1066, TS5A3166 TS5A4594, TS12A4514, TS12A4516 TS5A4596
NO 1 5 V+ COM 1 5 V+ IN 1 5 V+
COM 2 NO 2 COM 2
NC 1 5 V+ COM 1 5 V+ IN 1 5 V+
COM 2 NC 2 COM 2
COM 1 8 NO COM 1 8 NC
N.C. 2 7 GND N.C. 2 7 GND
N.C. 3 6 IN N.C. 3 6 IN
V+ 4 5 N.C. V+ 4 5 N.C.
SPST x 4
V– 4 13 V+ V– 4 13 V+ V– 4 13 V+
SPDT x 2 TS5A22364
SPDT x 4
V+ 1 10 NO2
NO1 2 9 COM2 TS3A5018
COM1 3 8 NC2
NC1 4 7 IN2 Logic
IN 1 16 V+
TS5A23157, TS5A23159, TS5A23160 IN1 5 6 GND Control
NC1 2 15 EN
OUT+
IN1 1 10 COM1 Audio
NC1
NO1 3 14 NC4
Source 1 OUT–
COM1
NO1 2 9 NC1 COM1 4 13 NO4
IN1
GND 3 8 V+ NO1
Input
Select NC2 5 12 COM4
NO2 4 7 NC2 Shunt NO2 6 11 NC3
Switch 8-Ω
Speaker
IN2 5 6 COM2 COM2 7 10 NO3
NC2 IN2
GND 8 9 COM3
COM2
OUT+
Audio
Source 2 OUT– NO2
SP3T
4 3 2 1
D D4 D3 D2 D1
TS5A3357, TS5A3359
C C4 C3 C2 C1
NO0 1 8 V+ B B4 B3 B2 B1
NO1 2 7 COM
A A4 A3 A2 A1
NO2 3 6 IN1 TSA225E
Logic
GND 4 Control 5 IN2
4! 3! 2! 1!
D! /MIC_PRESENT! TIP_SENSE ! MICp! MICn!
C! RING2! GND(1)! VDD(1)! RING2_SENSE!
B! SLEEVE! GND(1)! VDD(1)! SLEEVE_SENSE!
A! DET_TRIGGER! ADDR_SEL! SDA! SCL!
SP4T x 2
TS3A5017
YZP Package
Logic Logic
(Top View) 1EN 1 16 V+
Control Control
1 2 TS3A26746E IN 2 2 15 2EN
1S4 3 14 IN1
A 1 2
1S 3 4 13 2S4
A SEL V+
1S2 5 12 2S 3
B B MIC SLEEVE
C 1S1 6 11 2S2
GND RING2
C
1D 7 10 2S1
GND 8 9 2D
Key Features The TS3A26746E is a 2 × 2 cross-point switch that is used to interchange the
• Superior PSRR performance ground and MIC connections on a headphone connector. The ground switch
(-75 dB) has an ultra low rON of <0.1 Ω to minimize voltage drop across it, preventing
• Control input is 1.8 V logic undesired increases in headphone ground reference voltage. The switch state is
compatible controlled via the SEL input. When SEL=High, GND is connected to RING2 and
• ESD performance (SLEEVE, RING2) MIC is connected to SLEEVE. When SEL=Low, GND is connected to SLEEVE
o ±8-kV contact discharge (IEC and MIC is connected to RING2. An internal 100k pull-up resistor on the SEL
61000-4-2) input sets the default state of the switch. This device effectively switches the GND
• 6-bump, 0.5 mm pitch CSP and MIC lines to the appropriate coordinates with minimal signal distortion and
package (1.45 x 0.95 x 0.5 mm) power loss.
RING 2
RING 1
RIGHT
TIP
LEFT
YZP Package
(Top View)
1 2
1 2
A SEL V+
B MIC SLEEVE
C GND RING2
Key Features The TS3A225E is an audio headset switch device. The device detects the pres-
• VDD range = 2.7 V to 4.5 V ence of an analog microphone and switches a system analog microphone pin
• Break-before-make stereo jack switches between different connectors in an audio stereo jack. The microphone connection
• Ultra-low resistance ground FET in a stereo connector can be swapped with the ground connection depending on
switches (< 100 mΩ) manufacturer. When the device detects a certain configuration, it automatically
• HDA compatible MIC present connects the microphone line to the appropriate pin. The device also reports the
indicator presence of an analog microphone on an audio stereo jack.
• Optional I2C switch control
• 95 dB audio isolation In some systems, it is desirable to connect the stereo jack pin to ground. The
• IEC ESD protection on stereo TS3A225E provides two internal low resistance (<100 m) FET switches for ground
jack pins shorting.
• ±8-kV contact discharge (IEC 61000-4-2)
• ESD performance tested per JESD
TIP
22 (all pins) RING1
R1
• 2-kV Human Body Model (HBM) MIC_BIAS
(A114-B, Class II)
C1
TS3AXXXX
Applications C2
MICI MICp SLEEVE
• Mobile phones
S1
• Mobile music players MIC_REF MICn / HP_REF RING2
• Notebook computers C3
• Mobile audio applications VDD
TIP_SENSE
GND
YFF Package
(Top View)
4 3 2 1
D D4 D3 D2 D1
C C4 C3 C2 C1
B B4 B3 B2 B1
A A4 A3 A2 A1
Key Features The TS12A12511 is a single-pole double-throw (SPDT) analog switch capable of
• ±2.7 V to ±6 V dual-supply passing signals with swings of 0 to 12 V or –6 to 6 V. This switch conducts equally
operation well in both directions when it is on. It also offers a low ON-state resistance
• +2.7 V to +12 V single-supply of 5 (typical), which is matched to within one between channels. The max current
operation consumption is <1 µA and –3 dB bandwidth is >93 MHz. The TS12A12511
• ON-state resistance: 8 Ω max exhibits break-before-make switching action, preventing momentary shorting
with ±5 V supply when switching channels. This device is available packaged in an 8-lead MSOP,
• Low ON and OFF-leakage currents: 8-lead SOT-23, and 8-pin QFN.
±1 nA at 25°C, ±50 nA at 85°C
• Fast switching speed: tON=115 ns,
tOFF=56 ns (±5 V supply) TS12A12511
• Break-before-make operation
• +3.3 V, +5 V compatible digital COM 1 8 NO
control inputs NC 2 7 V–
• Available in 8-pin MSOP, SOT, GND 3 IN
6
QFN packages
V+ 4 5 N. C.
Applications
• Automatic test equipment
• Power routing
• Communication systems Rf1=20k
• Data acquisition systems
• Sample-and-hold systems
• Relay replacement Rf2=10k
• Battery-powered systems
TS12A125
+5V
R1=10k
VIN -
VOUT
+
Variable Gain
Key Features The TS3A5017 is a dual single-pole quadruple-throw (4:1) analog switch that is
• Isolation in the powered-down designed to operate from 2.3 V to 3.6 V. This device can handle both digital and
mode, V+ = 0 analog signals, and signals up to V+ can be transmitted in either direction.
• Low ON-state resistance
• Low charge injection
• Excellent ON-state resistance tON and tOFF vs. Temperature (V+ = 3.3 V)
matching TS3A5017
• Low total harmonic distortion (THD) 1EN 1
Logic Logic
16 V +
Control Control
• 2.3-V to 3.6-V single-supply IN2 2 15 2EN
operation 1S4 3 14 IN1
• Latch-up performance exceeds 1S3 4 13 2S4
100 mA per JESD 78, class II 1S2 5 12 2S3
• ESD performance tested per 1S1 6 11 2S2
JESD 22 1D 7 10 2S1
GND 8 2D
Applications
• Sample and hold circuits
• Battery-powered equipment
• Audio and video signal routing
• Communication circuits
Dual/Single SPDT Analog Switches with Input Logic Translation and IEC ESD
TS5A26542, TS5A6542, TS5A12301E
Get samples, data sheets and app reports at: www.ti.com/sc/device/PARTnumber
Key Features The TS5A26542, TS5A6542, and TS5A12301E are single-pole double-throw
• Specified break-before-make (SPDT) analog switches that are designed to operate from 2.25 V to 5.5 V. The
switching TS5A26524 is a dual SPDT, whereas the TS5A6542 and TS5A12301E are single
• Low ON-state resistance SPDT switches. The devices offer a low ON-state resistance with an excellent
(0.75 Ω typ) channel-to-channel ON-state resistance matching, and the break-before-make
• Low charge injection feature to prevent signal distortion during the transferring of a signal from one
• Excellent ON-state resistance path to another.
matching
• Low total harmonic distortion These devices have excellent total harmonic distortion (THD) performance and
• 2.25- to 5.5-V power supply (V+) consume very low power. These features make them suitable for portable audio
• 1.8 V logic compatible thresholds applications. All of the switches can be controlled by 1.8-V signals.
• TS5A6542 and TS5A26542: VIO
bias used to allow low threshold TS5A6542, TS5A26542
control voltage or TS5A12301E
• TS5A12301E: Low threshold IEC ESD
Protection
voltage independent of V+ and no Source 1
use of additional bias (VIO)
External
• No need for separate translation Connector
devices IEC ESD
Protection
• ESD performance tested per Source 2
JESD 22
• 2000-V Human Body Model
1.8-V GPIO
(HBM) (A114-B, Class II)
Ultra-Low-Voltage
• 1000-V charged-device model Control Signal
(C101)
• Common inputs IEC ESD protection on analog switch outputs.
• ±15-kV IEC61000-4-2,
contact discharge for
TS5A26542 and TS5A6542 Package Pinouts
• Comm inputs can be interfaced to
the external world due to IEC ESD
VIO 4 5 V+ 1 1 IN1 NO1 COM1 NC1
compliance
• No need for separate ESD devices NC 3 6 IN 2 2 VIO GND GND V+
GND 2 7 COM 3 3 NO2 COM2 NC2
IN2
Applications NO 1 8 GND
A B C D A B C D
• Cell phones
• PDAs TS5A6542 WCSP (YZP) package (bottom view). TS5A26542 WCSP (YZP) package (bottom view).
• Portable instrumentation
0.8 mm
C 1 C NC V+
B 1.2 mm 2 B GND COM
A 3 A NO IN
2 1 1 2
Key Features The TS5A22362, TS5A22364, and TS5A22366 are dual single-pole double-throw
• Negative signaling capability: (SPDT) analog switches that are designed to operate from 2.25 to 5.5 V. The
Analog I/O range = V+ –5.5 V to V+ devices feature negative signal capability that allow signals below ground to pass
• Internal shunt switch prevents through the switch without distortion. The break-before-make feature prevents
audible click-and-pop when signal distortion during the transferring of a signal from one path to another. Low
switching between two sources ON-state resistance, excellent channel-to-channel ON-state resistance matching,
(TS5A22364 only) and minimal total harmonic distortion (THD) performance make these switches
• Low ON-state resistance ideal for audio applications.
(0.65-Ω typ)
• Low charge injection The switch does
• Excellent ON-State resistance need the
negative swing Direct Path Audio Source
matching capability Provide Audio Signal Centered on GND
• 2.3-V to 5.5-V power supply (V+) Analog Switch
• TS5A22362/TS5A22364 packaging R1
Audio
options: Source 1
Ref R L
• 10-WCSP (0.5 mm pitch – YZP) L1 TPA6130A2
1.9 x 1.4
• SON-10 (DRL) 3 x 3 R2
Audio
• VSSOP-10 (DGS) 4.9 x 3 L2 Source 2
TS5A22364
OUT+ NC1
Audio
Source 1 OUT–
COM1
IN1
Input Select
NO1
8-Ω Speaker
Shunt
Switch
NC2 IN2
COM2
OUT+
Audio
Source 2 OUT– NO2
VCC (VDD)
rON Off
(max) (typ) Bandwidth Crosstalk Isolation ICC (IDD) Pins/
Device Configuration (min) (V) (V) (W) (MHz) (dB) (dB) (typ)(µA) Packages Description
Video Switch
2 Gbps Differential Switch, 8-Ch with
TS3DV20812 8-channel SPDT 2.25 3.6 4 1100 –35 –20 250 36/QFN
3-Side Band Signals
42/QFN, 4-Ch Differential 8:16 Mux Switch for DVI/
TS3DV421 8-channel SPDT 1.5 2.1 12.5 1900 –50 –50 230
48/TVSOP HDMI
10-channel 42/QFN, 5-Ch Differential 10:20 Mux Switch for
TS3DV520E 3 3.6 4 950 –37 –37 250
SPDT 56/QFN DVI/HDMI
12-Channel 1:2 MUX/DEMUX Switch with
TS3DV621 12-channel 42/QFN,
3 3.6 8 2200 –43 –42 300 Integrated 4-Channel Sideband Signal
SPDT
Switching
TS3V712E 7-channel SPDT 3 3.6 3 1360 –50 –38 200 32/QFN 7-Ch Video Switch
Smart Switch
Audio 2 –1.3 1.3 6 788 –120 –100 Micro-USB Connector to
Dual SP3T + Mic 1 0 2.3 12 573 –125 –37 UART and Audio Switches
TSU5511 70 20 WCSP
SPST USB 2 0 3.6 10 830 –42 –20 with ID Detection and Charger
UART 2 0 4.4 61 295 –98 –100 Detection
TS3DDR3812
A0 B0
A1 B1
A2 B2
A3 B3
A4
TSU5511 A5
B4
B5
UART_RX
C0
VBUS
UART_TX C1
D- C2
USB_DM C3
D+
C4
USB_DP ID C5
A6 B6
AUDIO_L A7 B7
AUDIO_R A8 B8
A9 B9
MIC
A10 B10
A11 B11
C6
C7
C8
C9
C10
C11
SEL
SEL1 Control Logic
SEL2
12-Ch 1:2 Mux/DeMux for DVI/HDMI and DP Applications w/4-Ch Sideband Switching
TS3DV621
Get samples, data sheets and app reports at: www.ti.com/sc/device/ts3dv621
Key Features The TS3DV621 is a multiple SP4T switch with impedance detection. The switch
• Compatible with HDMI v1.4, DVI 1.0 features impedance detection, which supports the detection of various acces-
and display port 1.1a high-speed sories that are attached through DP and DM. This device is fully controlled using
digital interface I2C and enables USB data, stereo and mono audio, video, microphone, and UART
• Wide bandwidth of 2.2 GHz data to use a common connector port.
• Four integrated side band signals Power for this device is supplied through VBAT of the system or through VBUS when
switching attached. The switch can be controlled through I2C. JIG and BOOT pins are used
• Support all video formats up to when a USB, UART JIG cable is used to test during development and manufacturing.
1080 P and SXGA (1280 x 1024
at 75 Hz)
• HDCP compatible
• Low and flat ON-state resistance
(rON = 8 Ω typ)
• Low input/output capacitance
(CON = 4 pF typ) D0+
• VCC operating range from 3 V to 3.6 V D0+ D0–
• Rail-to-rail switching on data I/O D0– D1+
ports (0 to Vcc) D1+ D1–
• Dedicated enable logic supports D1– D2+
Hi-Z mode D2+ D2– Dual Mode
DisplayPort
• IOFF protection prevents current Dual Mode D2– D3+
Connector
DisplayPort
leakage in powered down state D3+ D3–
SOurce
• ESD performance tested per JESD22 D3– AUX+
HPD
Key Features The TS3V712EL is a high bandwidth, 7-channel video demultiplexer for switch-
• Supports 7-channel VGA signals ing between a single VGA source and one of two end points. The device is
(R,G,B, HSYNC, VSYNC, DDC CLK, designed for ensuring video signal integrity and minimizing video signal attenu-
and DDC DAT) integrated level shifting ation by providing high bandwidth of 1.3 GHz. The TS3V712EL has integrated
buffers for HSYNC and VSYNC level shifting buffers for the HSYNC and VSYNC signals which provide voltage
• Operating voltage range level translation between 3.3 V and 5 V logic. The SCL and SDA lines use NMOS
• VDD = 3.3 V ± 10% switches which clamp the output voltage to 1 V below VDD. The video signals
• VDD_5 = 5 V ± 10% are protected against ESD with integrated diodes to VDD and GND that support
• High bandwidth of 1.3 GHz (–3 dB) levels up to ±2-kV contact discharge (IEC61000-4-2) and 7-kV human body
• R,G,B switches model (JESD22-A114E).
• r ON = 4 Ω (typ)
VDD
• CON = 8 pF (typ)
• Voltage clamping NMOS switches for
SCL and SDA channels
• ESD performance H0 H1
(14 pins on port 1 and port 2)
• ±2-kV IEC61000-4-2, contact V0 V1
discharge
• 7-kV human body model per
JESD22-A114E H2
• ESD performance (all pins)
• 3-kV human body model per
V2
JESD22-A114E
• 32-pin QFN package (RTG)
(6 mm x 3 mm)
R0
R1
Applications
G0 G1
• Notebook computers B0 B1
• Docking stations
R2
• KVM switches
G2
B2
SCL0
SCL1
SDA0 SDA1
SCL2
SDA2
SEL Control
Logic
TS3V712EL block diagram.
Key Features The TS3L501E is a 16-bit to 8-bit multiplexer/demultiplexer LAN switch with a single
• Low bit-to-bit skew select (SEL) input and Power down Mode input. The device provides additional I/Os
(tSK(o) = 100 ps max) for switching status indicating LED signals and includes high ESD protection. SEL in-
• Low and flat ON-state resistance put controls the data path of the multiplexer/demultiplexer. Power down input can put
• rON = 4 Ω typ, rON(FLAT) = 0.5 Ω typ the device into the standby mode for
• Low input/output capacitance minimizing current consumption per A0
B0
A1 B1
• CON = 8 pF typ mode selection. The device provides a A2 B2
• ESD performance (A, B, C, LED pins) low and flat ON-state resistance (rON) A3 B3
A4 B4
• ±4-kV IEC61000-4-2, contact and an excellent ON-state resistance A5 B5
A6
discharge match. Low input/output capacitance, B6
A7 B7
• 6-kV human body model (HBM) high bandwidth, low skew, and low C0
• 42-pin QFN package (RUA) – crosstalk among channels make this C1
9 mm x 3.5 mm C2
device suitable for various LAN appli- C3
• Half that of direct competition cations, such as 10/100/1000 Base-T. C4
C5
• Allows for low power loss and THD This device can be used to replace C6
• Low capacitance ensure great signal BW mechanical relays in LAN applications. C7
LED_A0
• Eliminates need for external ESD It also can be used to route signals LED_A1
LED_B0
LED_B1
• 37% size decrease from TS3L500AE from a 10/100 Base-T Ethernet trans- LED_A 2 LED_B2
LED_C0
Applications ceiver to the RJ-45 LAN connectors LED_C1
• 10/100/1000 Base-T signal switching in laptops or in docking stations. It is LED_C2
• Differential (LVDS, LVPECL) characterized for operation over the SEL Control Logic
signal switching free-air temperature range of –40ºC to
85ºC. PD Power Down
• Audio/video switching
• Hub and router signal switching
Key Features The TS5USBA224 is a double-pole, double throw (DPDT) multiplexer that includes
• Powered from VAUDIO (3.3 V typ) a low-distortion audio switch and a USB 2.0 High-Speed (480 Mbps) switch in the
• VBUS input detects data cable same package. This configuration allows the system designer to use a common
connection and automatically connector for audio and USB data. The audio switch is designed to allow audio
switches to USB path (if ASEL = L) signals to swing below ground which makes this common connector configura-
• Manual switching to audio path tion possible. The TS5USBA224 is powered up using VAUDIO. When ASEL=High,
(if ASEL = H) the audio path is selected regardless of the logic level at VBUS. If ASEL=Low and
• 1.8-V logic threshold compatibility VBUS=High, the USB path is selected. Otherwise if ASEL=Low and VBUS=Low, the
for digital inputs audio path is selected. The TS5USBA224 also features shunt resistors on the
• USB channels: 4-Ω RON audio path to reduce clicks and pops that may be heard when the audio switches
• Audio channels: 3-Ω RON are selected.
• High bandwidth (650 MHz) for USB
path
• Negative rail signaling support for
audio path
• Total harmonic distortion <0.05% Processor
• 10-μQFN (1.8mm × 1.4mm)
Applications
VBUS
• Notebook computers D+
direct to
• Analog VGA peripheral ports device USB 2.0
D– Phy
ASEL
D+
VBUS VBUS
D–
D+/R
VAudio
D–/L
L
USB Connector
TS5USBA224
AUDR
Audio
AUDL Amplifier
Key Features The TS3DS10224 is a 2:4 bidirectional multiplexer for high-speed differential and
• Flexible configurations: single ended signal applications (up to 720 Mbps). The TS3DS10224 can be used
• Single 1 to 4 in a 1:4 or dual 1:2 multiplexer/demultiplexer configuration. The TS3DS10224 of-
• Dual 1 to 2 fers a high BW of 1.2 GHz with channel RON of 13 Ω (typ). The TS3DS10224 can
• Fan-out 1 to 2 also be used to fan out a differential or single ended signal pair to two ports
• High BW (1.2 GHz typ) simultaneously (fan-out configuration). The BW performance is lower in this con-
• Low rON and CON: figuration. The TS3DS10224 operates with a 3 to 3.6V power supply. It features
• 10 Ω rON typ ESD protection of up to ±8-kV contact discharge and 2-kV human body model on
• 8 pF CON typ its I/O pins. The TS3DS10224 provides fail-safe protection by isolating the I/O pins
• ESD performance (I/O pins) with high impedance when the power supply (VCC) is not present.
• ±8-kV contact discharge
(IEC61000-4-2)
• 2-kV human body model per
OUTA1+
OUTA0+
OUTA1–
OUTA0–
JESD22-A114E (to GND)
ENA
• ESD performance (all pins)
• 2-kV human body model per 1 5
JESD22-A114E
• Small QFN package INA+ 20 SAO
(3 x 3, 0.4-mm pitch) INA– SAI
INB+ VDD
INB– SBI
Applications GND 16 10 SBO
• Notebook computers
• PDA/ebook/tablet 15 11
OUTB1+
OUTB1–
OUTB0+
OUTB0–
ENB
1 1 +
INA – OUTA1
+ OUTA0
0 0 –
SA0
SAI
SBI
SB0
1 1 +
– OUTB1
+
INB 0 0 – OUTB0
ENB
DP3T USB 2.0 High-Speed (480 Mbps) and Audio Switches with Negative
Signal Capability
TS3USBA225
Get samples, data sheets and app reports at: www.ti.com/sc/device/ts3usba225
Key Features The TS3USBA225 is a double-pole, triple throw (DP3T) multiplexer that includes a
• High-speed USB switch low-distortion audio switch, and two USB 2.0 High-Speed (480 Mbps) switches in
(D0± and D1 ±) the same package. This configuration allows the system designer to use a common
• 6.5 Ω RDSON maximum connector for audio, and USB data. The audio switch is designed to allow audio
• 3 pF CON maximum signals to swing negatively which makes this common connector configuration
• 1.9 GHz bandwidth (-3 dB) possible. The TS3USBA225 has a VCC range of 2.7 V to 4.3 V with the capability
• VI/O accepts signals up to 4.3 V to pass true-ground audio signals down to VCC-4.3 V. The device also supports a
(independent of VCC) power-down mode that can be enabled when both SEL controls are low to minimize
• Audio switch (L&R) current consumption when no signal is transmitting. The TS3USBA225 also features
• 2.5 Ω RDSON typical internal shunt resistors on the audio path to reduce clicks and pops that may be
• Negative rail capability heard when the audio switches are selected.
• Low THD: <0.05%
• Internal shunt resistors for
click-and-pop reduction Top View
• 2.7 V to 4.3 V operating power supply L
(VCC) D0+ D0+ 1 12 11 SEL1
D+/L D1+
• 1.8-V compatible control input D1+ 2 10 D+/L
L VCC
(SEL1 and SEL2) threshold 3 9 GND
• Minimized current consumption D1–
4 8 D–/R
(~2 µA) in power-down mode RSHUNT D0–
• Power-off protection: all I/O pins are 5 6 7 SEL2
high-Z when VCC=0V R
D0–
• ESD performance tested per JESD 22 D–/R D1–
• 2000-V human body model
R
(A114-B, Class II)
• 1000 V charged device model
(C101) VCC RSHUNT
• 12-pin RUT package
• 2×1.7 mm, 0.4 mm pitch
SEL1 Control SEL2
Logic
Applications Rpd1 Rpd2
• Cell phones and smartphones
• Tablet PCs
• Media players
• Digital still cameras
• Portable navigation devices (GPS)
DPDT MHLTM (3 Gbps) and USB 2.0 High-Speed (480 Mbps) Switch with
Integrated ID line Mux
TS3USB3200
Get samples, data sheets and app reports at: www.ti.com/sc/device/ts3usb3200
Key Features The TS3USB3200 is a Double-Pole, Double Throw (DPDT) multiplexer that includes
• MHLTM switch a high-speed Mobile High-Definition Link (MHL) switch and an USB 2.0 high-speed
• Supports 5 Gbps data rate (480Mbps) switches in the same package. Also included is a Single-Pole, Double Throw
• High bandwidth of 6 GHz (SPDT) USB/MHL ID switch for easy information control. These configurations allow the
• 2.5 pF CON typical system designer to use a common USB or Micro-USB connector for both MHL video
• High-speed USB switch: signals and USB data.
• 6 GHz Bandwidth (-3 dB)
• 3.0 pF CON The TS3USB3200 has a VCC range of 2.7 V to 4.3 V and also has the option to be
• 1.8-V compatible control input powered by VBUS alone without VCC. This device supports Over-Voltage Tolerance (OVT)
(SEL1 and SEL2) threshold feature, which allows the I/O pins to withstand over-voltage conditions (up to 5.5 V). The
• Integrated USB/MHLTM ID line switch power-off protection feature forces all I/O pins to be in high-impedance mode when
for easy information control power is not present, allowing full isolation of the signals lines under such condition
• Minimized current consumption without excessive leakage current. The select pins of TS3USB3200 are compatible with
(<~30uA) during normal operation 1.8 V control voltage, allowing them to be directly interfaced with the General Purpose
• Flexible power control: Device can be I/O (GPIO) from a mobile processor.
powered by VBUS without VCC
• Over-Voltage Tolerance (OVT) on all The TS3USB3200 comes with a small 16-pin QFN package with only 2.6 mm x 1.8 mm
I/O pins up to 5.5 V without external in size, which makes it a perfect candidate to be used in mobile applications.
components
• ESD performance tested per JESD 22
ID_COM
• 2000-V human body model
ID_MHL
(A114-B, Class II)
VBUS
VCC
• 1000-V charged device model
(C101) 161 15 5
14 13
• 16-Pin RSV package USB+
D+ GND 1 12 ID_USB
• 2.6×1.8 mm, 0.4 mm pitch MHL+
D+ 2 11 MHL+
USB–
Applications D+ MHL– D– 3 10 MHL–
• Cell phones and smartphones PSEL 4 9 SEL2
5
• Tablet PCs ID_MHL 5 6 7 8
• Portable instrumentation D+ ID_USB
SEL1
USB–
USB+
GND
Dual SP2T (USB2.0 and UART) with Integrated Impedance and Charger Detection
TSU6111/A
Get samples, data sheets and app reports at: www.ti.com/sc/device/PARTnumber
Key Features The TSU6111A is a high performance differential autonomous SP2T switch with
• Dual SP2T switch (both channels impedance detection. The switch supports the detection of various accessories
support USB2.0 speed) with that are attached through DP, DM, and ID. The charger detection satisfies USB
impedance detection charger specification v1.1 and VBUS_IN has a 28 V tolerance to eliminate the
• Micro-USB accessories and charger . need for external protection. Power for this device is supplied through VBAT of the
detection system or through VBUS_IN when attached to a charger.
• Detection is compatible with
CEA-936A (4-Wire Protocol, UART The SP2T switch is controlled by the automatic detection logic or through manual
interface) configuration of the I2C. JIG and BOOT pins are used when a USB or UART JIG
• Plugin/unplug detection, cable is used to test the device in the development and manufacturing. TSU6111A
impedance based accessory has open-drain JIG output (active low).
detection, charger type detection
• Low input/output capacitance
CON=8pF typ.
• High bandwidth (920 MHz) and low
rON (8 Ω)
• Supports DSS for tablet PC
application VBAT
Power
• Integrated ESD and surge protection Supply VDDIO
• IEC61000-4-2 ESD protection on
Supply
VBUS, DP, DM, ID Detect
• Surge protection on VBUS, DP VBUS_IN
and DM pins DM_HT
• I2C interface with host processor USB HS DM_CON
DP_HT Micro
• 20-WCS (2.4mm × 1.9mm) package DP_CON USB
Switch
ID_CON
Applications Matrix
GND
• Cell phones, tablet computers
UART RxD
• Digital cameras, camcorders or
• Portable navigation devices USB HS TxD
INTB
SDA
Logic
SCL and DP/DM
Processor I2C Comparator
JIG
BOOT
ADC
Key Features The TSU6712A is a multiple SP4T switch with impedance detection. The switch
• USB to-USB,-UART,-audio, and features impedance detection, which supports the detection of various accessories
video that are attached through DP and DM. The TSU6712A is fully controlled using I2C and
• ESD performance DP/DM/ID/VBUS enables USB data, stereo and mono audio, video, microphone, and UART data to
to GND use a common connector port.
• ±8-kV contact discharge
• ±15-kV air gap discharge Power for this device is supplied through VBAT of the system or through VBUS when
• I2C control compatibility attached. The switch can be controlled through I2C. JIG and BOOT pins are used
• Built-in impedance detection when a USB, UART JIG cable is used to test during development and manufacturing.
• 25-bump WCSP
(1.97 mm × 1.97 mm)
Package VBUS
Battery Chg IC
Applications
• High-end smartphones
• Netbook USB VDD ISET OUT
• Tablets Transceiver D+
D– VBUS Inside Outside
• Mobile internet devices UART VBUS
• Portable handheld device Transceiver IDBP DP
USB D+
TxID DM D–
TV OUT/USB Connector
ID GND
Transceiver IRxID Mini-USB
Audio Amp/ Switch
V_R/D+ (MUS)
CODEC
V_L/D–
Video/IDBP
MIC
MIC/S_IR
S_L
AVSS
SDA SCL INTB
JIG
BOOT
Functional block diagram.
Key Features The TSU5611 is designed to interface the cellular phone UART, USB, and audio
• Dual SP3T & SPST analog switch chips with external peripherals via a micro-USB connector. The switch features
with impedance detection. impedance detection for identification of various accessories that are attached
• New interface IC for various signaling through DP and DM of the micro-USB port. When an accessory is plugged into the
in mobile phones micro-USB port, the switch uses a detection mechanism to identify the accessory
• Audio switch (see the State Machine for details). It will then switch to the appropriate channel—
• Two USB 2.0 high-speed switch data, audio, or UART.
• Smart detection
• Plug-in/un-plug detection The TSU5611 has an I2C interface for communication with the cellular phone
• USB charger detection baseband or applications processor. An interrupt is generated when anything
• Proprietary accessory detection plugged into the micro-USB is detected. Another interrupt is generated when the
with impedance sensing device is unplugged.
• Additional protection
• IEC61004 level 4 ESD protection
• 4pins (VBUS, DP,DM, ID)
• I2C interface with host processor
VSupply
• Low input/output capacitance
CON=8pF typ.
• Supports DSS for tablet PC USB_DM
application USB
USB_DP
• 20-WCS(2.4mm × 1.9mm) package VBUS
Supply
Switch Detect
Matrix
Applications DM
UART_RX
• Cell phone, netbook, MID Micro
UART DP USB
• Portable handheld device UART_TX
ID
Audio
Amp
AUDIO_L Neg. Rail
AUDIO_R and
AUDIO1 Click/Pop
MIC Free
DSS
INTB
Logic
Processor
SDA and DP/DM
I2C Comparator
SCL
ADC
Charger ISET
Control
Key Features The TSU8111 is a differential high-performance automated SP2T switch with
• Fully compliant USB single- impedance detection and integrated Li-Ion linear charger device targeted at
cell charger space-limited portable applications. The switch features impedance detection
• Input voltage dynamic power which supports the detection of various accessories that are attached through DP,
management DM and ID. The charger detection satisfies USB charger specification v1.1. VBUS
• 50 mA integrated low dropout has 28 V tolerance to avoid external protection. The device operates from either
regulator (LDO) a USB port or dedicated charger and supports charge currents up to 950 mA.
• 1% charge voltage regulation Power for this device is supplied through VBAT of the system or through VBUS when
accuracy attached.
• 8% charge current accuracy
• Programmable charging current The switch is controlled by automatic detection logic or through I2C manually.
limit up to 950 mA for wall adapters JIG and BOOT pins are used when a USB, UART JIG cable is used to test in the
• Dual SP2T development and manufacturing. TSU8111 has open-drain JIG output (active low)
• USB & UART support 2.0 high and TSU8112 has push-pull JIG output (active high).
speed
• Impedance detection
• Charger detection
• USB BCDv1.1
• VBUS & data contact detection Battery VBAT
and
• Primary & secondary detection Power VDD
• Additional features Supply
• I2C interface with host processor Charger
• Support control signals used in VBUS
manufacturing (JIG, BOOT) DM_HT
• Interrupt for attach & detach USB HS DM_CON
EXT_HT Micro
accessory DP_CON USB
• Compatible accessories
Switch
• USB cable ID_CON
Matrix
• UART cable GND
• USB charger BCDv1.1 UART RxD
or
• Additional protection USB HS TxD
• 28 V VBUS rating with OVP
• Thermal regulation & shutdown VLDO
• ESD per JESD 22
• 2000V HBM (A114-B Class II) NTB
• 1000V CDM (C101)
SDA
• ESD performance VBUS/DP/DM/ID Logic
SCL and DP/DM
to GND Processor I2C Comparator
• ±8 kV contact discharge JIG
(IEC 61000-4-2)
BOOT
• Package ADC
• 20-WCSP (2.0 mmx1.6 mm)
Applications
• Cell phones & smart phones Functional block diagram.
• Tablet PCs
• Digital cameras & camcorders
• GPS navigation systems
• MicroUSB interface with USB/UART
Charger-Detection Device
BQ24392
Get samples, data sheets and app reports at: www.ti.com/sc/device/BQ24392
Key Features The BQ24392 is a charger-detection device with an integrated isolation switch for use
• Charger-detection device with a micro/mini USB port. The device is compliant with USB battery charging specifi-
• USB BCv1.2 compliant cation v1.2. This device allows cell phones & tablets to be charged from different adapt-
• VBUS detection ers including USB BCv1.2 compliant and non-standard USB chargers. These non-stan-
• Data contact detection dard chargers include Apple, TomTom & non-compliant USB chargers. The BQ24392
• Primary & secondary detection conforms to Dead Battery Provision (DBP) specified in BCv1.2. This includes a 32-min
• Dead battery provision. 32 min timer that cannot exceed 45 mins. This device has a USB 2.0 switch that supports high
timer speed. In addition to USB connector and host pins, BQ24392 has one input and three
• Switch output pins, resulting in minimum software workload for the system to interact with the
• USB 2.0 high speed device. VBUS has 28 V tolerance to avoid external protection. Power for this device is
• Compatible accessories supplied via VBUS when accessory is attached.
• Dedicated charging port
• Standard charging port
• Charging port
• Other chargers detected Top View
• Apple charger
CHG_DET
• Tom Tom charger
10
• Non-compliant USB charger SW_OPEN 1 9 CHG_DET
• Max voltage
DM_HOST 2 8 DM_CON
• 30V tolerance on VBUS
• ESD on VBUS, DP, DM to GND DP_HOST 3 7 DP_CON
• ± 8-KV contact discharge CHG_AL_N 4 6 GND
(IEC 61000-4-2) 5
• Package GOOD_BAT
• 10-pin uQFN RSE
Applications
• Smart-phones
• Cell phone
• Tablets
• GPS systems
Key Features TSU6721 is a high-performance USB port multimedia switch featuring automatic
• Switch matrix switching and accessory detection. The device connects a common USB port to pass
• USB & UART switch support USB audio, USB data, charging, On The Go (OTG) and factory mode signals. The audio path
2.0 HS has negative signal capability includes left (mono/stereo), right (stereo) as well as micro-
• Audio switch with negative signal phone signals. Furthermore, TSU6721 is compatible with the MCPC specification.
capability
• ID bypass switch TSU6721 features impedance detection which supports the detection of various acces-
• VBUS to MIC switch sories that are attached through DP, DM and ID pins of the USB connector. The switch
• DP to MIC switch to support MCPC is controlled by automatic switching or manually through I2C.
• Load switch
• 100 mΩ load switch TSU6721 has an integrated, low-resistive, Load Switch that is used to isolate the
• OTG support charger from the external connector. Overvoltage protection and programmable over-
• 28V VBUS rating with over- current limiter/protection are additional features included to the load switch.
voltage protection The charger detection satisfies USB charger specification v1.2. In addition to DCP,
• Programmable overcurrent limiter/ CDP & SDP, the device also detects Apple Chargers. Power for this device is supplied
protection through VBAT of the system or through VBUS when attached. TSU6721 supports
• Charger detection factory mode testing when a USB/UART JIG cable is used in development and
• USB BCDv1.2 compliant manufacturing.
• VBUS detection
• Data contact detection
• Primary & secondary detection
Compatible accessories Battery Chg IC
• USB chargers (DCP, CDP) VBAT
• Apple charger
• USB data port OUT
USB DP_HT
• Audio headset with MIC & remote Inside Outside
DM_HT VBUS
• Docking support UART/USB VBUS
DP DP_CON
• Factory cable DM USB
TxD Connector DM_CON
• Surge Protection on VBUS/DP/DM Audio ID ID_CON
RxD
• USB connector pins without TSU6721
S_R
external component S_L
• I2C interface with host processor
• Switches controlled by automatic
MIC
detection or manual control
• Interrupts generated for IDBP
plug/unplug
• Decoupling FET switch to VBUS I2C_SDA INTB
added to reduce degradation on INTB
MIC line BOOT ISET
I2C_SCL
• Support control signals used In
manufacturing (JIG, BOOT)
Applications Functional block diagram.
• Cell phones & smart phones
• Tablet PCs
• Digital cameras & camcorders
• GPS navigation systems
• Micro USB interface with USB/UART/
AUDIO
0.037
0.037 0.085
(0,95) (2,15)
(0,95)
0.057 0.077 0.091
(2,30)
(1,45) (1,95)
0.197 0.146
(5,00) (3,70)
0.102
0.124 (2,60)
(3,15) 0.244 0.260
0.067 (6,20) (6,60)
0.124
(1,70)
(3,15)
0.354 0.496
(9,00) 0.386 (12,60)
(9,80) 0.201
0.137
(3,50) (5,10)
0.260 0.327
(6,60) (8,30) 0.201
(5,10)
0.203
(5,15)
0.439
(11,15)
56-pin
QFN (RHU)
Lead pitch = 0.020 (0,50)
Height = 0.032 (0,80)
Area = 2.26 (57,4)
support.ti.com www.ti.com/quality
Internet
TI Semiconductor Product Information Center
Home Page
support.ti.com
The platform bar and E2E are trademarks of Texas Instruments. All other trademarks
are the property of their respective owners.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated