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TFT - LED TV
Chassis: - COMBO-LED (V59)
INDEX
SR. NO. CONTENT
1. Safety Precautions
2. Servicing Precautions
3. Design Procedure
4. Chassis Specifications
5. Operating Specifications
6. SW Installation Procedure
9. Critical components
2
1. SAFETY PRECAUTIONS
3
4
2. SERVICING PRECAUTIONS
Examples of typical ES devices are integrated circuits and
some field-effect transistors and semiconductor "chip"
2.1 General Servicing Precautions: components. The following techniques should be used to
Always unplug the receiver AC power cord from the AC help reduce the incidence of component damage caused
power source before: by static by static electricity.
a. Removing or reinstalling any component, circuit 1. Immediately before handling any semiconductor
board module or any other receiver assembly. component r semiconductor-equipped assembly, drain
b. Disconnecting or reconnecting any receiver electrical off any electrostatic charge on your body by touching a
plug known earth ground. Alternatively, obtain and wear a
or other electrical connection. Commercially available discharging wrist strap device,
c. Connecting a test substitute in parallel with an which should be removed to prevent potential shock
electrolytic reasons prior to applying power to the unit under test.
capacitor in the receiver. 2. After removing an electrical assembly equipped with
CAUTION: A wrong part substitution or incorrect ES devices, place the assembly on a conductive surface
polarity such as aluminium foil, to prevent electrostatic charge
installation of electrolytic capacitors may result in an build up or exposure of the assembly.
explosion 3. Use only a grounded-tip soldering iron to solder or
hazard unsolder ES devices.
2. Test high voltage only by measuring it with an 4. Use only an anti-static type solder removal device.
appropriate high voltage meter or other voltage Some solder removal devices not classified as "anti-
measuring device (DVM, FETVOM, etc) equipped with static" can generate electrical charges sufficient to
a suitable high voltage probe. Do not test high damage ES devices.
voltage by "drawing an arc". 5. Do not use Freon-propelled chemicals. These can
3. Do not spray chemicals on or near this receiver or any generate electrical charges sufficient to damage ES
of its assemblies. devices.
4. Unless specified otherwise in this service manual, 6. Do not remove a replacement ES device from its
clean electrical contacts only by applying the protective package until immediately before you are
following mixture to the contacts with a pipe cleaner, ready to install it. (Most replacement ES devices are
cotton-tipped stick or comparable non-abrasive packaged with leads electrically shorted together by
applicator; 10% (by volume) Acetone and 90% (by conductive foam, aluminium foil or comparable
volume) isopropyl alcohol (90%-99% strength) conductive material).
CAUTION: This is a flammable mixture. Unless specified 7. Immediately before removing the protective material
otherwise in this service manual, lubrication of from the leads of a replacement ES device, touch the
contacts in not required. protective material to the chassis or circuit assembly
5. Do not defeat any plug/socket voltage interlocks with into which the device will be installed.
which receivers covered by this service manual might CAUTION: Be sure no power is applied to the chassis
be equipped. or circuit, and observe all other safety precautions.
6. Do not apply AC power to this instrument and/or any 8. Minimize bodily motions when handling unpackaged
of its electrical assemblies unless all solid-state device replacement ES devices. (Otherwise harmless motion
heat sinks are correctly installed. such as the brushing together of your clothes fabric or
7. Always connect the test receiver ground lead to the the lifting of your foot from a carpeted floor can
receiver chassis ground before connecting the test generate static electricity sufficient to damage an ES
receiver positive lead. Always remove the test device.)
receiver ground lead last. 2.3 General Soldering Guidelines
8. Use with this receiver only the test fixtures specified in 1. Use a grounded-tip, low-wattage soldering iron and
this service manual. CAUTION: Do not connect the appropriate tip size and shape that will maintain tip
test fixture ground strap to any heat sink in this temperature within the range or 500°F to 600°F.
receiver. 2. Use an appropriate gauge of RMA resin-core solder
composed of 60 parts tin/40 parts lead.
2.2 Electrostatically Sensitive (ES) Devices:- Some 3. Keep the soldering iron tip clean and well tinned. 4.
semiconductor (solid-state) devices can be damaged Thoroughly clean the surfaces to be soldered. Use a
easily by static electricity. Such components commonly mall wire-bristle (0.5 inch, or 1.25cm) brush with a
are called Electrostatically Sensitive (ES) Devices. metal handle. Do not use Freon-propelled spray-on
cleaners.
5
4. Use the following unsoldering technique 3. Bend into a "U" shape the replacement transistor leads.
a. Allow the soldering iron tip to reach normal 4. Connect the replacement transistor leads to the
temperature (500°F to 600°F) corresponding leads extending from the circuit board
b. Heat the component lead until the solder melts. and crimp the "U" with long nose pliers to insure metal
c. Quickly draw the melted solder with an anti-static, to metal contact then solder each connection.
suction- type solder removal device or with solder
braid. 2.6 Power Output, Transistor Device
CAUTION: Work quickly to avoid overheating the Removal/Replacement :-
circuit board printed foil. 1. Heat and remove all solder from around the transistor
5. Use the following soldering technique. leads.
a. Allow the soldering iron tip to reach a normal 2. Remove the heat sink mounting screw (if so equipped).
temperature (500°F to 600°F). 3. Carefully remove the transistor from the heat sink of
b. First, hold the soldering iron tip and solder the the circuit board.
strand against the component lead until the solder 4. Insert new transistor in the circuit board. 5. Solder each
melts. transistor lead, and clip off excess lead. 6. Replace heat
c. Quickly move the soldering iron tip to the junction of sink.
the component lead and the printed circuit foil, and
hold it there only until the solder flows onto and 2.7 Diode Removal/Replacement :-
around both the component lead and the foil. 1. Remove defective diode by clipping its leads as close as
CAUTION: Work quickly to avoid overheating the possible to diode body.
circuit board printed foil. 2. Bend the two remaining leads perpendicular y to the
d. Closely inspect the solder area and remove any circuit board.
excess or splashed solder with a small wire-bristle 3. Observing diode polarity, wrap each lead of the new
brush. diode
2.4 IC Remove/Replacement:- Some chassis circuit around the corresponding lead on the circuit board.
boards have slotted holes (oblong) through which the IC 4. Securely crimp each connection and solder it.
leads are inserted and then bent flat against the circuit 5. Inspect (on the circuit board copper side) the solder
foil. When holes are the slotted type, the following joints
technique should be used to remove and replace the IC. of the two "original" leads. If they are not shiny, reheat
When working with boards using the familiar round hole, them and if necessary, apply additional solder.
use the standard technique as outlined in paragraphs 5
and 6 above. 2.9 Fuse and Conventional Resistor
Removal/Replacement :-
2.4.1 IC Removal:- 1. Clip each fuse or resistor lead at top of the circuit board
1. Desolder and straighten each IC lead in one operation hollows take.
by gently prying up on the lead with the soldering 2. Securely crimp the leads of replacement component
iron tip as the solder melts. around notch at stake top.
2. Draw away the melted solder with an anti-static 3. Solder the connections.
suction-type solder removal device (or with solder
braid) before removing the IC. CAUTION: Maintain original spacing between the replaced
2.4.2 Replacement :- component and adjacent components and the circuit
1. Carefully insert the replacement IC in the circuit board to prevent excessive component temperatures.
board.
2. Carefully bend each IC lead against the circuit foil pad
and solder it.
3. Clean the soldered areas with a small wire-bristle
brush.
(It is not necessary to re apply acrylic coating to the
areas).
7
3. DESIGN PROCEDURE FOR Combo CHASSIS
DESIGN MENU : -
Method for entering design data: -
Using remote, go to MENU, then go to AUDIO MENU. Then press
remote Digit keys 8 5 3 2 , then it enters in Design Menu.
CONNECTIVITY VIEW: -
8
DESIGN DATA FOR Combo CHASSIS
Contrast 0
different levels 0-25-50-75-100
To adjust Picture Colour Saturation level
Saturation 0
at different levels 0-25-50-75-100
To adjust Picture Hue level at different
Hue 0
levels 0-25-50-75-100
To adjust Picture Sharpness level at
Sharpness 0
different levels 0-25-50-75-100
value
60
used.
Source
Color Temp Mode: Normal/Cool/Warm
R-Gain
Parameters to adjust white balance of
G-Gain
LCD. These parameters are different for
B-Gain
different sources and vary panel to
R-Cut
panel. Also these settings are different
G-Cut
for Colour temperature modes.
B-Cut
White Balance
Sub Brightness
Parameters to adjust source offsets.
Sub Contrast
WB Offset
Color Temp Mode: Normal/Cool/Warm
R-Gain Offset
Parameters to adjust white balance of
G-Gain Offset
LCD. These parameters are different for
B-Gain Offset
different sources and vary panel to
R-cut Offset
panel. Also these settings are different
G-cut Offset
for Colour temperature modes.
B-cut Offset
Sub brightness Offset
Parameters to adjust source offsets.
Sub Contrast Offset
9
Panel selection
parameter. After
selection of proper
Panel Type
panel type, it
automatically selects all
panel parameters.
10
AUDIO ADJUSTMENT PARAMETERS: -
Audio Data Select audio data as per cabinet and
Selection model.
Source
OSD_0
OSD_25 Parameters used to adjust the audio
Audio Curve
OSD_50 curve of model. This audio curve
OSD_75 may vary from model to model.
OSD_100
Audio Output Parameter used for woofer/Non
2.0CH
Select woofer model
Selection for audio as per model.
Speaker Automatically selects all above audio
selection parameters i.e. all audio parameters
are assigned to this parameter.
Audio On Music
10
Used for adjusting power on music
Vol. volume
Audio Mode Music/Standard/Speech/User
Treble
Bass
Audio Mode 120Hz Parameters used to adjust the audio
500Hz curve of model. This audio curve
1.5KHz may vary from model to model.
5KHz
10KHz
120Hz Parameters used to adjust the audio
500Hz curve of model. This audio curve
Band Max 1.5KHz may vary from model to model.
5KHz Bandmax parameters are different
10KHz for different audio modes.
Note: -
1.) The design parameters may vary depending on model. So, kindly follow the
design data provided with each model.
2.) Clear EEPROM option is at first position in setting design data, so care should
be taken that OK key should not be pressed here, unless and until required, other
wise, Clear EEPROM will execute and all design data (Audio & Video factory
settings) will be erased.
13
4. CHASSIS SPECIFICATIONS
PARAMETERS SPECS REMARKS
NUMBER OF PROGRAMS 200
TUNING SYSTEM FS
COLOUR SYSTEM PAL
NTSC PLAYBACK YES Only in AV
SOUND SYSTEM BG
CHANNEL NAME YES IN PROGRAM EDIT
MANUAL SEARCH YES
ANALOG
TUNNING FINE TUNE YES
SKIP YES
EXCHANGE CHANNEL (SWAP) YES IN PROGRAM EDIT
INSERT CHANNEL YES IN PROGRAM EDIT
COPY CHANNEL YES IN PROGRAM EDIT
DELETE CHANNEL YES IN PROGRAM EDIT
AUTO DETECTION COLOR AND
YES
SOUND
VIVID/HI-BRIGHT/CINEMA/
SELECTABLE PICTURE MODES 5 MODES
SPORTS/USER
Color Transient Improvement YES
DNR YES 3D
ADAPTIVE LUMA CONTROL YES
ZOOM MODE AUTO/4:3/16:9
COLOR IMPROVEMENT YES
3:2 2:2 PULL DOWN YES Inbuilt
DIGITAL COMB FILTER YES 3D
PICTURE
FREEZE YES
BACKLIGHT ADJUST YES
COLOUR TEMP YES NORMAL/COOL/WARM
AUTO ADJUST (IN PC) YES
H POSITION (IN PC) YES
V POSITION (IN PC) YES For VGA Source
PHASE (In PC) YES
CLOCK (In PC) YES
3D NOISE REDUCTION YES 14
SELECTABLE SOUND
4 MODES USER/SPEECH/STANDERED/MUSIC
MODES
AUTO VOLUME LEVELLER YES
AUDIO OUTPUT POWER
(RMS)
8W x 2 (+/-2w)
AUDIO
MUSIC MODE YES Eco Vision =Audio Only
BASS / TREBLE / BALANCE YES/YES/YES
EQUALIZER 5 BAND 120Hz/500Hz/1.5KHz/5KHz/10KHz
NO.OF SPEAKERS 2
CLOCK YES
ON CHANNEL YES
OFF TIME YES Timer Features are Optional
TIMER ON TIME YES
SLEEP TIMER YES
CLOCK DISPALY YES
AUTO SWITCH OFF YES
PROGRAM DIRECTORY YES
OFF/ LOW/ MID /HIGH/AUDIO
ECO VISION YES
ONLY
QUICK VIEW YES
HOTEL MODE YES
VOLUME LOCK YES In Hotel Mode
TUNING LOCK YES In Hotel Mode
FEATURES CHANNEL LOCK -CHILD
YES (RF SOURCE)
LOCK
FRONT PANEL KEY LOCK NO
Start on predefined
YES In Hotel Mode
Source
Start on predefined
YES In Hotel Mode
Channel NO.
ENERGY METER YES
BOOT UP SOUND YES
SPECIAL SMART CONNECT HDMI CEC
YES
FEATURES
FAMILY FAVOURITE YES
15
RF IN YES
AV1 IN YES
AV2 IN NO
CONNECTIVITY
AV OUT YES
YPbPr/YCbCr YES Conectivities present
USB INPUT (2.0 aat rear side of TV.
YES
SUPPORT)
HDMI INPUT YES
PC AUDIO IN YES
PC(VGA IN) YES
PANEL MODEL NO SAMSUNG (LTA230AN01)
SCREEN SIZE & TYPE 23" (VA TYPE) TV GRADE PANEL
ASPECT RATIO 16:9
PANEL SPECIFICATIONS
Average power
consumption by TV in
POWER CONSUMPTION 35 W (Avg.)
Standard operating
condition.
REMOTE HANDSET V-MT 22 (V-2BD)
ACCESSORI
16
5. OPERATING SPECIFICATIONS
CHASSIS/PANEL SPECIFICATIONS: -
17
MULTIMEDIA SUPPORT SPECIFICATIONS
18
SOURCE WISE RESOLUTION SUPPORT
19
6. SW & E2P INSTALLATION PROCEDURE
The ATV SW installation in Combo chassis can be done with USB in two ways.
1.) SW & E2P Installation through USB.
2.) SW Installation through MST Tool.
SW installation through USB: -
Download the SW file in USB to root directory.
Confirm the file name should be “VIDEOCON.bin”
1
for Videocon brand LEDTV and “SANSUI.bin for
SANSUI brand LEDTV.
Turn the TV set ON and insert the USB in USB port
2
of TV set.
21
Note: -
1. Kindly DO NOT SWITCH OFF THE TV SET, While SW/E2P upgrade
is in process.
2. The SW and E2P update through USB is possible with mains
OFF-ON also, but only if M-Mode is ON.
3. In M-Mode, if press stand by key of remote, then M-Mode
becomes OFF.
4. Can not update SW through USB if set is permanently in Stand
by. In this case, use MST jig to load SW.
5. If required to load Videocon SW in SANSUI brand chassis with
SANSUI SW, then rename the SW file as “SANSUI.bin”.
6. If required to load SANSUI SW in Videocon brand chassis with
Videocon SW, then rename the SW as “VIDEOCON.bin”.
7. If use chassis of any other segment on 19.5” D-LED model, then
there will not be any display on this panel. This is not a
problem, but this is because, the panel resolution of 19.5” D-
LED model is different i.e. 1600X900. So, for this model, after
SW loading it is required to update the E2P of this model to
view display.
22
E2P UPLOAD THROUGH USB : -
After SW update, go to Design Menu by
1
Pressing MENU => AUDIO MENU => 8 5 3 2
Go to Setup design menu and Select Clear
2
EEPROM option and press OK key of remote.
After Clear EEPROM, the set will go to stand
3
by and will restart automatically in RF mode.
Then, take E2P in USB. File name for E2P will
4 be for VIDEOCON=> VDC_182VG_EEP
For SANSUI=> SAN_182VG_EEP.
23
E2P DOWNLOAD FROM TV SET IN USB: -
If required to make E2P file from any set in the field, then follow below
steps.
24
SW INSTALLATION THROUGH JIG: -
Step1: - First Connect MST SW loading Jig to USB port of PC and 04 Pin Header
XS352 on chassis (near AV socket). SW loading jig is common with MST719 Jig.
MST Tool is also same as MST719.
Step2: - Kindly confirm pin configuration of Jig conn. should be +5V,
RXD, TXD, GND, which is same as MST719 Jig.
Step4: - After opening tool, Press connect. If Jig is properly connected, then it
will select the chip automatically. If chip is not selected automatically, then go to
Device option in Jig and select the Chip from SPI list WIN25X32 or WIN25Q32.
Then open the MSTV tool and select Baud rate 11500 (as shown below) and
select the COM Port (confirm COM port from your Computer properties, may
be different for different PC).
25
COM Port and Baud Rate selection from MSTV Tool
26
Step4: - Then go to option of ISP tool and select the SW file (.bin file).
Step5: - Then select option of ISP tool and after setting, press RUN in
Note: - 1.) Before running SW, uncheck options Reconnect, lank, Restore data,
Multi flashes, Verify, as these actions are not required.
2.) Kindly DO NOT SWITCH OFF TV Set or PC while SW loading or do not
disconnect the Jig from PC while SW loading.
27
Step6: - After Successful SW loading it will show PASS, as shown in below
window.
28
After SW loading is complete i.e. 100%,
1 the set will go to stand by automatically
and will restart again.
29
7. COMBO LED BLOCK DIA. AND WIRING DIAGRAM
MAJOR COMPONENTS IN COMBO LED CHASSIS
SR. MAJOR IC WITH FUNCTIONS
1 N401 TSUMV59XU-Z1 EPLQFP 100 pins is the main micon.
Power management of LDO output voltage is as follows:
a.N505 output voltage :1.8V +-0.1V
2
b.N411 output voltage :3.3V +-0.1V
c.N503 output voltage :3.3VSB +-0.1V
Tuning circuit of tuner type is NXP silicon tuner,
3 The color system NTSC/PAL/SECAM and sound system
BG/DK/I.
N800 TPA3110LD2 is the digital audio amplifier, Output
4
power option 2x10W stereo.
N403 MX25L1606E12G is the FLASH IC for software
5
storage and operation
30
MAIN CHASSIS (ACTUAL PHOTO): -
IR/KEY
SPEAKER CONN
O/P
RF IN
AUDIO IC
3110LD2
OUT
AV
LVDS
SOCKET
AV1 IN
MICON
V59
FLASH IC
YPbPr
IN
24V TO 5V
REGULATOR
VGA
IN
IN AUDIO
24V TO 12V HDMI VGA
REGULATOR
USB
IN
PWM
CONTROL IC
31
8. Connectors and Electrical Parameters
32
9. CRITICAL COMPONENTS
CRITICAL COMPONENT LIST
SR. IC DESCRIPTION QTY. LOCATION FUNCTION
1 IC,CHIP,EPLQFP,100Pin,NTSUMV59XU,EZ 1 N401 Main Micon IC
IC,CHIP,SOIC8,QM3001S/CEM9435A/AM9435P/
2 2 N504 N502 Panel Power switch IC
WPM9435
3 IC,CHIP,SOT223,G1117-3.3V 2 N503 N411 5VSTB TO 3.3VSTB Regulator
4 IC,CHIP,TO223,AZ1117ADJ 1 N505 2.5V Regulator for Micon.
5 IC,CHIP,SOT-23,CS810S 1 N402 Hardware Reset IC
6 IC,CHIP,SOT23-5-1,SY8008B 1 N551 5VSTB to 1.26V Core Power for Micon
7 IC,CHIP,TSSOP28,TPA3110L 1 N800 Audio IC
8 IC,CHIP,SOP8,BIT3260 1 NS3 PWM control IC for LED driver
9 IC,OPTO-COUPLER,KP10101B/KPC817B,DIP-4 1 N704 Optocoupler
10 IC,PWM,28V,300 MA,OB2263MP,SOT23-6 1 N700 PWM control IC for Power Supply
IC,SMD
11 1 N403 Flash IC
FLASH,SOP8,MX25L1606E12G,WINDBOND
12 IC,CHIP TDA18273 for Silicon Tuner 2 N410 Tuner Driver IC
13 VARISTOR,560V,25AMP,TVR10681KSY 1 RV01 Varistor
TRANS,N-MOSFET,650V/7A FQPF7N65C,TO-
14 1 V700 Main MOSFET
220F
15 TRANSISTOR,MOSFET,ME08N20,MOS252 1 VS1 LED Driver MOSFET
N500 - 24V to 12 V Regulator
16 IC,CHIP,MP1584,SOIC8E,DC TO DC,3A,28V 2 N500 N501
N501 - 24V to 5V Regulator
33
Panel/Model Matrix.: -
PANEL VCC Add Jumper Add Jumper Add Jumper Add Jumper
SELECTION 1100087738 1100087738 1100087737 1100087737
JP003
FFC LVDS XS408 XS408 XS405 XS405
LOCATION
LED DRIVER CNS3 CNS3 CNS2 CNS3
CONN.
LED BAR Add Jumper NA NA NA
Selection 1100087738
JP002
34
10. COMBO-LED TROUBLE SHOOTING
Normal
Abnormal
Check if 24VSTB supply at N501 is
OK or not.
Normal
Abnormal
Check if +5VSTB supply is OK or
not.
Normal
Abnormal
Check Regulator Voltage N503 –
3.3V STB is OK or not.
Normal
Check al working voltages are Abnormal
coming at micon V59, Flash IC
N403. Check if SW loading is
possible
Normal
If all the working conditions are
normal, but still the chassis can not
power ON, the please try to replace
the main chassis..
35
B.) No Picture Condition
Normal
Check the Panel VCC voltage Abnormal
Check the Power
5V/12V at JP003 is coming OK or supply area
not
Normal
Normal
Normal
Press ECO key of remote 2-3 times If change If display come then go
to change backlight value to design data & adjust
(backlight curve in chassis may be Backlight curve as per
reverse). model design data.
No Effect
Upload SW/E2P in the TV set if TV
is in M-Mode.
No Effect
Normal
Upload SW/E2P of that model in
the TV set if TV is in M-Mode.
No Effect
If all the conditions are normal, but
still problem is present, then try to
change the chassis.
37
D.) No Sound Condition
First check the audio source Abnormal Re-connect the input cables to
Input is proper. Also check all
TV and source properly.
audio inputs given to TV are OK.
Normal
1. Re-connect the speaker
Check Speaker conn. is Abnormal conn. in header XS901.
connected properly to TV or not
2. If damaged change the SPK.
damaged
Conn., SPK. Box assy.
Normal
If 12V not coming then check if
Check the power supply 12V is Abnormal 12V is coming at N500 pin
coming at C809/C817 i.e. VCC
no.7. Also check if Mute Pin no.
pin of audio IC.
1/2 of IC N800.
Normal
Normal
Check if O/P coils of Audio IC
L805/806/807/808 are OK or not.
No Effect
If all the conditions are normal, but
still problem is present, then try to
replace the Audio IC TPA3110LD2
or replace the main chassis.
38
11. REMOTE CONTROL
39
REMOTE CONTROL KEY DESCRIPTION
40
41
42
12. Common Abbreviations
D
S
C506
V502
G
3.3VSTB C502
WPM3401
1uF/16V
R511
100K
0.1uF/16V
R521 R541
NC/4.7k 47K
2
1
3
G D
12V
D
V506
S
5VSTB NC/WPM3401
VCC-PANEL
Q_MOS_P
J506 nc
Back Light circuit
G
J507 nc
5V R516 C529
C508 C509
C503 NC V503
"1" Panel off
PANEL_ON/OFF R518 4.7K
R520 4.7K
BC847 BL_ON_MUTE
V511
VIDEOCON APPD/DATE
Experience change
5VSTB
1.26V for TSU29 CORE POWER about 600mA VDDC
Normal Power 1.2V
VDDC
Close to IC
5
C507
C511 22pF/50V
C501
R551
IN
FB
N551 R553 56K 1%
0.1uF/16V
0.1uF/16V
0.1uF/16V
SY8008B
GND
10uF/10V
XS4
C0603C
EN
LX
10K
0.1uF/16V
6
R0603E
R0603E
3
2
1
C520
C521
C522
24VSTB 5
C513 C514 C505
L501 R552 4
LD05_3
4.7uH 47K 1% 0.1uF/16V 10uF/10V
C510 220uF/16V
GND 3
R0603E
0.1uF/16V
2
1
0.6 X ( 1 + 56k/47k) = 1.31V CON06-2.0
24VSTB
C552 10nF/50V
0.1uF/50V
12V
C551 R526
8
100K
N503
AVDD_MOD
Close to IC 2
IN BS
1
L510 22uH
BM1117-3.3 3.3VSTB EN SW
R527 R530 R531
5VSTB Normal Power 3.3V
NC/47k
3 1 27K 6 FREQ FB 4
work state current 120mA 91k
4
2
B360A
D500
FB 200K C553 C554
N500
3
0.1uF/16V
0.1uF/16V
0.1uF/16V
0.1uF/16V
C517 C518 R532
2.2uF/10V
0.1uF/16V
0.1uF/16V
0.1uF/16V
MP1584 3A 0.1uF
C559 10k 470uF/16V
0.1uF/16V 10uF/10V/0805 PWR-ON/OFF
C515
C528
C530
C533
C534
C524
C531
C504
220pF
R529 51K
VOUT=0.8(1+(47//100)/10)=5.16V
24VSTB
C556 10nF/50V
0.1uF/50V
5VSTB
C555 R533
8
100K
IN BS L511 22uH
2.5V/1.8V V39-2.5 2 1
EN SW
2
TSUMV29LEʱL101¡¢ R535 GND COMP
B360A
D501
L101 C557 C558
10uF/10V
200K
N505 N501
C104ºÍC105½¨ÒéNC
3
BM1117ADJ 2.5V/1.8V MP1584 3A R539
1
5V R524 470uF 0.1uF
µô,ÓÃTSUMV39LU£¬ C560 10k
C535
C104
C105
3 1 100
TSUMV39LEÒªÉϼþ 220pF
4
2
R536 51K
0.1uF/16V
C526
0.1uF/16V
C546 C523
VOUT=0.8(1+(47//100)/10)=5.16V
C525
10uF/10V
100uF/16V
L506
0.1uF/16V
0/NC
TSUMV59M VD2=RL207
C537
C536
TSUMV29,39 VD2=175MMJP
DESCRIPTION Combo D-LED Project CHK/DATE
VIDEOCON APPD/DATE
Experience change
CHIP_CONFIG
BRI_ADJ-PWM1
HDMI1-RX2N
HDMI1-RX0N
HDMI1-CLKN
HDMI1-RX2P
HDMI1-RX0P
HDMI1-CLKP
HDMI1-RX1N
R072 4.7K
HDMI1-RX1P
PANEL_ON/OFF
3.3VSTB
HDMI1-SDA
HDMI1-SCL
SYSTEM-RST
BRI_ADJ-PWM1 BRI_ADJ-PWM0
HDMI_HP1
{IPAD_PWM1, PAD_PWM0}
USB1_D+
USB1_D-
3
UART-TX
UART-RX
AD1-KEYB
V39-2.5
AD0-KEYA
IR_IN
PANEL_ON/OFF
VCC
CEC
C401
RST/RST
CS810S
N402
0.1uF/16V
GND
R405 R404
4.7K 4.7K
1
R406 SYSTEM-RST
1K C417
R407
100
100
47K 1000pF/50V
TSUMV29LU NO USB
R401
R403
HARDWARE RESET PART
N17215350
N17215348
104
103
102
101
100
FLASH
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
3.3VSTB
N401
NC
NC
TEST
E-PAD
RX2P
RX2N
DDCD_CK
RX1P
RX1N
DDCD_DA
RX0P
RX0N
RXCKP
RXCKN
HOTPLUGD
GND_EFUSE
HWRESET
CEC
IRIN
SAR1
SAR0
AVDD_DDR
DDCA_DA
DDCA_CK
PWM1/GPIO25
PWM0/GPIO26
TESTPIN
USB0_DP
USB0_DM
3.3VSTB
1 75 C409
AVDD_MOD AVDD_33 SCZ FLASH_CS0N
VDDC 2 74 SPI_FLASH-SDO R409 R408
VDDC SDO
3 73 SPI_FLASH-SDI 10K 4.7K
VGA_HS HSYNC0 SDI N403 0.1uF/16V
BIN0 4 BIN0P SCK 72 SPI_FLASH-SCK
5 71 FLASH_CS0N 1 8 R058 47 SPI_FLASH-SCK
SOGIN0 GPIO0 LED_MUTE S VCC
GIN0P 6 70 SPI_FLASH-SDO 2 7
GIN0P INT/GPIO65 PWR-ON/OFF Q HOLD
GIN0M 7 69 3 6
GIN0M VDD VDDC W C
RIN0 8 68 RXO0- 4 5 SPI_FLASH-SDI
RIN0P LVBOM VSS D
VGA_VS 9 VSYNC0 LVB0P 67 RXO0+
ADC2P5 10 AVDD_25 LVB1M 66 RXO1- GD 25Q32
BIN1 11
TSUMV39LU 65 RXO1+
0.1uF/16V
BIN1P LVB1P
C403
SOGIN1 12 SOGIN1 AVDD_MOD 64
AVDD_MOD
GIN1P 13 GIN1P LVB2M 63 RXO2-
GIN1M 14 GIN1M LVB2P 62 RXO2+
AVDD_MOD
R410
RIN1
0/NC
15
16
17
RIN1P
AVDD_33 TSUMV39LE LVBCKM
LVBCKP
61
60
59
RXOC-
RXOC+
RXO3-
CVBS2 LVB3M
AV_CVBS1
AV_CVBS0
18
19
CVBS1
CVBS0 TSUMV29LU LVB3P
LVA0M
58
57
RXO3+
RXE0-
CVBS_OUT
VCOM0 20 VCOM LVA0P 56 RXE0+
Ö÷ICÑ¡ÓÃTSUMV39LUʱ£¬¾ßÓÐMM¹¦ÄÜ£¬Ä¬ÈÏʹ
AVDD_MOD C680 1uF/16V
21
22
23
CVBSOUT
AVDD_AU33 TSUMV29LE LVA1M
LVA1P
55
54
53
RXE1-
RXE1+
RXE2-
1MByteµÄFlash£¬Èç¹ûÓÐÐèÒª£¬¿ÉÒÔʹÓÃ2MByte;
AUL0 LVA2M
AV-AULIN0 24 52 RXE2+
Èç¹û²»Ê¹ÓÃMM¹¦ÄÜ£¬ÔòFlashĬÈÏΪ512K¡£
AVDD_DMPLL
AUR0 LVA2P
VDDIO_CMD
25 AUVAG AVDD_MOD 51
1uF/16V
AVDD_REF
AVDD_PLL
C681 AVDD_MOD
AUOUTR0
AUOUTR1
AUOUTL0
AUOUTL1
Ö÷ICÑ¡ÓÃTSUMV29LUʱ£¬²»¾ßÓÐMM¹¦ÄÜ£¬Ä¬ÈÏ
LVACKM
LVACKP
AV-AURIN0
GPIO55
GPIO56
GPIO57
LVA3M
RFAGC
LVA3P
XOUT
AUR4
AUR5
AUL4
AUL5
VIFM
VIFP
ʹÓÃ512KByte¡£
VDD
XIN
MST7820LM_9
TSUMV39LU/TSUMV29LU
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
4.7uF/10V
C402
1uF/16V
1uF/16V
1uF/16V
1uF/16V
Close to IC
L401
FB
C605
C608
C609
TUNER_SDA
TUNER_SCL
AMP-AUOUTR0
AMP-AUOUTL0
TV_AGC
XTALO
RXEC+
RXEC-
RXE3+
RXE3-
XTALI
AVDD_MOD
AUOUTR3
AUOUTL3
AVDD25_DEMOD
AVDD_MOD
BL_ON_MUTE
22pF/50V XTALO
AV-AULIN4
AV-AURIN4
PC-AURIN0
PC-AULIN0
VIFM
VIFP
2
R402
24MHZ
Y401
1M
V39-2.5
1
XTALI
DESCRIPTION Combo D-LED Project CHK/DATE
C408
22pF/50V
VIDEOCON APPD/DATE
Experience change
3.3VSTB 0.1uF/16V C201
D029 ICVL0518
D031 ICVL0518
R205 100
AD1-KEYB 1 1
CON08-2.0 R420 4.7K
4.7k R419
DIODE_BI-DIR_TRIG_3
DIODE_BI-DIR_TRIG_3
1 0.1uF/16V C404
3 AD0-KEYA
4 5VSTB
KEYA
R427 R428
5 LED_R 10K
2K
6 LED_G 1K R426
5VSTB
7 C406 LED_R
LED_G
8 0.1uF/16V
R429 10K
XS605 V402
BC847 LED_MUTE
R422 4.7K
5VSTB
R423 100 IR_IN
D030 ICVL0518
C405
DIODE_BI-DIR_TRIG_3
220pF/50V
VCC-PANEL 1
VCC-PANEL VCC-PANEL 2
VCC-PANEL 3
4
1 5
2 6
3 GND 7
4 RXE3+ 8
VCC-PANEL RXE3- 9
1 5
6 RXEC+ 10
2 RXEC- 11
3 7
8 RXE2+ 12
4 RXE2- 13
5 9
10 GND 14
6 RXE1+ 15
7 11
RXO0+ 12 RXE1- 16
8 GND 17
RXO0- 13
9 RXO3+ RXE0+ 18
RXO1+ 14
10 1 RXO3- RXE0- 19
11 RXO1- 15
2
Panel30_2.0*2
16 RXO3+ 20
12 RXO2+ 3 RXOC+
17 RXO3- 21
13 RXO2- 4 RXOC-
18 RXOC+ 22
14 5 RXOC- 23
15 19
RXOC+ 6 RXO2+ GND 24
Panel30_2.0*2
16 RXO3+ 20
7 RXO2- RXO2+ 25
17 RXOC- RXO3- 21
RXO3+ 8 RXO2- 26
18 22
RXOC+ 9 RXO1+ RXO1+ 27
RXO3- 23
XS408
19 10 RXO1- RXO1- 28
20 RXOC- 24
11 RXO0+ 29
25
CON30_2.0*2
21 12 RXO0+ RXO0- 30
22 RXE0+ RXO2+ RXO0- 26
13
23 RXE0- RXO2- 27
XS404
RXE1+ 14
24 28
15
25 RXE1- RXO1+ 29
16
26 RXO1- 30
17
27 18
RXE2+ RXO0+
XS401
28 19
NC/Panel30_2.0*2
RXE2- RXO0-
29 20
30 RXEC+ 3.3VSTB 21
RXEC-
NC/10K
31 22
32 23
33 RXE3+ 24
34 25
RXE3-
35 26
NC/10K R203
36 VCC-PANEL 27
XS405
37 28
38
39
SEL 29
30
DESCRIPTION Combo D-LED Project CHK/DATE
40
ISSUED 2013-03-04 Rev: V1.0 Tony /wan
R204
VIDEOCON APPD/DATE
Experience change
ULCE0505
ULCE0505
ULCE0505
ULCE0505
ULCE0505
ULCE0505
ULCE0505
ULCE0505
XS001 HDMI_J
1
DAT2+
2
D023
D024
D026
D028
D021
D022
D025
D027
DAD2_SHIELD
3
DIODE_BI-DIR_TRIG_3
DIODE_BI-DIR_TRIG_3
DIODE_BI-DIR_TRIG_3
DIODE_BI-DIR_TRIG_3
DIODE_BI-DIR_TRIG_3
DIODE_BI-DIR_TRIG_3
DIODE_BI-DIR_TRIG_3
DIODE_BI-DIR_TRIG_3
DAT2-
4
DAT1+
5 HDMI1-RX2P1 R601 10 HDMI1-RX2P
DAD1_SHIELD
6 HDMI1-RX2N1 R602 10 HDMI1-RX2N
DAT1-
7 HDMI1-RX1P1 R603 10 HDMI1-RX1P
DAT0+
8 HDMI1-RX1N1 R604 10 HDMI1-RX1N
DAD0_SHIELD
9 HDMI1-RX0P1 R605 10 HDMI1-RX0P
DAT0-
10 HDMI1-RX0N1 R606 10 HDMI1-RX0N
CLK+
11 HDMI1-CLKP1 R607 10 HDMI1-CLKP
CLK_SHIELD
12 HDMI1-CLKN1 R608 10 HDMI1-CLKN
CLK-
13
CEC
14 R038 200 CEC
NC
15
D019 ICVL0518
DDC_SCL
16
DDC_SDA
17 HDMIB/5V
CECDD_GND
18
+5V
19
HPD
DIODE_BI-DIR_TRIG_3
10K
10K
R611 10K
1K
R612
R613
R610
R615 100
HDMI1-SCL
HDMI1-SDA
D001 ICVL0518
R616 100
C
D003 ICVL0518
D002 ICVL0518
V601 B HDMI_HP1
BC847
R614 4.7K
DIODE_BI-DIR_TRIG_3
E
DIODE_BI-DIR_TRIG_3
DIODE_BI-DIR_TRIG_3
DESCRIPTION Combo D-LED Project CHK/DATE
VIDEOCON APPD/DATE
Experience change
3.3VSTB
VGA
10
15 5
XS352
4 9 5V
14
3 UART-RX 13
4
3
8
R620 33 C601 0.047uF/50V BIN0
USB PART 0.1uF/16V
C611
F601
7 1
2 UART-TX 12 R621 33 C602 0.047uF/50V +5V
2 GIN0P
USB
FB
6
1 33
11 1 R622 C603 0.047uF/50V RIN0
USB-
2 USB_D- R630 5.1 USB1_D-
D010 ICVL0518
D009 ICVL0518
CON04-2.0 BLACK
5.1 USB1_D+
R618
3 USB_D+
R619
R631
R617
XS351 USB+
D006 ICVL0518
D005 ICVL0518
D004 ICVL0518
D613 ULCE0505
D612 ULCE0505
DIODE_BI-DIR_TRIG_3
DIODE_BI-DIR_TRIG_3
4
GND
75
75
75
C612 0.047uF/50V G_USB XS591
DIODE_BI-DIR_TRIG_3
DIODE_BI-DIR_TRIG_3
DIODE_BI-DIR_TRIG_3
R623 68 GIN0M
DIODE_BI-DIR_TRIG_3
DIODE_BI-DIR_TRIG_3
R662 100 VGA_HS
D008 ICVL0518
R624
10K R625
10K
DIODE_BI-DIR_TRIG_3
DIODE_BI-DIR_TRIG_3
R626 10K
PC-AULIN0
10K
GND 2 R627
1 1
L 3
6 6
VIN 5 10K
R 4
R629
PC-AURIN0
XS104PHONE-2-HX_17E:MTK8223PCBMT8223L-20100426-T2-SCH-B.DSN
R628 10K
D012 ICVL0518
D011 ICVL0518
PC AUDIO IN
DIODE_BI-DIR_TRIG_3
DIODE_BI-DIR_TRIG_3
DESCRIPTION Combo D-LED Project CHK/DATE
VIDEOCON APPD/DATE
Experience change
AV INPUT 0.047uF/50V C613
R632 VCOM0
4
33
7 R633 0.047uF/50V C614
AV_IN AV_CVBS0 2
1 GND
47 1 1
5 AV-R L 3 AV_LOUT
6 6 AV_VOUT
8 AV_IN VIN 5
AV1 2 AV_L R634 10K AV-AULIN4 R 4 AV_ROUT
AV_LOUT C630 1uF R658 100 AUOUTL3
XS331PHONE-2-HX_17E:MTK8223PCBMT8223L-20100426-T2-SCH-B.DSN
AV_L_R_PJ_LANHEADPHONE_LAN
6
D014 ICVL0518
D013 ICVL0518
D015 ICVL0518
AV_ROUT C631 1uF R659 100 AUOUTR3
9
R635 10K AV-AURIN4
3
XS381
C632 C633
DIODE_BI-DIR_TRIG_3
DIODE_BI-DIR_TRIG_3
DIODE_BI-DIR_TRIG_3
R660 R661
R636
100K
R637 100p
100K
100p
R638
10K 10K
75
R640 0.047uF/50V C610 AV_CVBS1
47
GND 2
1 1
AV2 L
6
3
6
R646 10K AV-AULIN0
5
D032 ICVL0518
D020 ICVL0518
D033 ICVL0518
VIN
R 4
XS003PHONE-2-HX_17E:MTK8223PCBMT8223L-20100426-T2-SCH-B.DSN
R647 10K
AV_L_R_PJ_LANHEADPHONE_LAN
AV-AURIN0
DIODE_BI-DIR_TRIG_3
DIODE_BI-DIR_TRIG_3
DIODE_BI-DIR_TRIG_3
R648 R649
R639
10K 10K
75
5V
0.047uF/50V
R645 33 C619
R651 75 RIN1
GND
2 PR 1000pF/50V C615
GND
CAP_NPD
CAP_NPD
5V
1 C635 C636
1 R652 75 SOGIN1
RESISTORB
RESISTORB
3 2.2uF R664 R666
L GND 0.1uF
6 100k 220R
AV1 6 R643 33
E
5 Y C617 GIN1P
VIN B V603
R 4 BC857
N20902322
R653 75 0.047uF/50V
GND GND
XS002PHONE-2-HX_17E:MTK8223PCBMT8223L-20100426-T2-SCH-B.DSN
C634 10uF B
C
R642 33 CVBS_OUT V604
N20902233
PB C616 BIN1 BC847
CAP_NPD
RESISTORB
RESISTORB
R668 75R R669 75R AV_VOUT
E
RESISTORB
N20902320
N20902318
0.047uF/50V R665
D017 ICVL0518
D016 ICVL0518
D018 ICVL0518
RESISTORB
100k R667
75R
R644 68 C618 GIN1M
1000pF/50V
DIODE_BI-DIR_TRIG_3
DIODE_BI-DIR_TRIG_3
DIODE_BI-DIR_TRIG_3
DESCRIPTION Combo D-LED Project CHK/DATE
VIDEOCON APPD/DATE
Experience change
AMP-AUOUTR0 AMP_AUOUTR0
R801 10K
C801 R802
1nF/50V 10K
1nF/50V 10K
R803 12V
C802
AMP-AUOUTL0 AMP_AUOUTL0
R804 10K
C809 2.2uF/16V
N800
Close to V29
C0603/SMD
C810 0.1uF/16V
L805 IND_CHIP_SMD
C0603/SMD
MUTE 1 28
SDZ PVCC
INDUCTOR
SPEAK_R+
2 27
FAULTZ PVCC
220nF/50V 0.47uF/50V/1nF
AMP_AUOUTR0 C838 1uF/16V 3 26 C805
LINP BSPL C818
C839 1uF/16V 4 25
LINN OUTPL XS901
4
R822 10K 5 24
GAIN0 PGND L806 IND_CHIP_SMD C819 SPEAK_R- 3
6 23 0.47uF/50V/1nF
GAIN1 OUTNL
12V R811 10 220nF/50V 2
INDUCTOR
7 22 C806
AVCC BSNL
C800 1uF/16V 220nF/50V 1
8 21 C807
AGND BSNR
CON04-2.0
C811 1uF/16V 9 20 SPEAK_L-
10K GVDD OUTNR
R821
R810 47K 10 19
PLIMIT PGND L807 IND_CHIP_SMD C820
INDUCTOR
C804 1uF/16V 11 18 0.47uF/50V/1nF
RINN OUTPR
220nF/50V
AMP_AUOUTL0 C803 1uF/16V 12
RINP
17 C808
BSPR
L808 IND_CHIP_SMD
13 16 C821
NC PVCC 0.47uF/50V/1nF
SPEAK_L+
INDUCTOR
14 15
PBTL PVCC
C816 470uF/16V
C817 0.1uF/16V
C0603/SMD
MUTE circuit 12V
24VSTB
R818 10K
B BC857
VD801
E C
1N4148 V801
C829 12V
10uF/50V
10K
R820
R824
10K
MUTE
R800 1K
R819NC/10K
V806
BL_ON_MUTE BC847
R817 10K
LED_MUTE
VIDEOCON APPD/DATE
Experience change
C703
NC/56pF
3_3V_TUN
IF1 R701 51 VIFP
R708 33 0.1uF/16V
C710
L701 C707=180P,FOR 38.9MHZ OR 38MHZ(PAL)
C714 C717
NC/100nH C707=100P,FOR 45.75MHZ(NTSC)
180pF
4.7u/10v/0603
IF2 VIFM
C701
22P/50V C702
0.1uF/16V
R709 33 R702 51
C711
C704
CLOSE TO CHIP
22P/50V
NC/56pF
ʹÓÃTDQ-B8/116Hʱ£¬C707¡¢C704¡¢C703ºÍL704
Éϼþ£¬C701=0.1uF£¬C702=0.1uF£¬R708=33R£¬
CLOSE TO TUNER R709=33R£¬R701=51R£¬R702=51R
3_3V_TUN
R716
10K
R714 R715
AGC 100 10K
TV_AGC
C721
TUNER AGC C722
CLOSE TO CHIP
0.1u 0.022uF
CLOSE TO TUNER
VIDEOCON APPD/DATE
Experience change
A
C
D
3CT
!
CN700
3.15A250V
FUSE_1
POWER-2.DSN
FILES60W60W
FILESORCADPOWER
C:PROGRAM
L 2 102/400V CY703
LINE_FILTER_18
C-0805C
F700 3 1
!
VD700
VD703
5CT
N14623234
D D
R744 1M
RV02
RV01
R746 1M
R0805
R0805
2CT
C-0805C
NC/102/400V
RL207
!
RL207
0.33uF
CX700
7CT R0805 R0805
C2139
CAP_NP
L708
R747
22mH
CY702
5
5
TH700
R745 1M
R0805
R0805
!
4.7/5A
1CT
1M
N 1
ONE.DSN
IN
FILESTWO
ONESCH
IN
FILESTWO
POWER
D:EASTKIT
3P-3_3.96
TH_0-3
POWER-2.DSN
FILES60W60W
FILESORCADPOWER
C:PROGRAM
6CT
2 4
!
CY701
VD704
VD701
D D
N14623196
+B
C-0805C
102/400V RL207 RL207
R0805
C740
0R
CAP
100uF/500V
R0805
R748
GND1
C-0805B
R753 510K
N14624445
102
R0805
C742
GND1 GND1
R0805
100K
R754 510K
R749
N14624603 N14624682
3
2
C745
GND1 1
10uF/50V
RI
CAP
GND
FB
+B
GND1
4
4
OUT 6 N14623564
R731
R0805
R0805
N700
N14624438 5
3
VDD
IS
R750 47
SG6848_4
1K
N14623552
4
C741
N14654900 CAP_NP
VD706
BZX-20V OB2263MP/OB2273
1
BAV70
2
1
3
222/1KV
GND1
R0805
2
10
R752
B
VD707 CAP
10K
BC857C V701 E
C-0805B
R751
GND1
N14654849 R0805
R0805 R0805
+B
R735
C746
GND1
470
221
R739
R0805 R0805
47uF/50V
C743
100K 2W
1
RL207
VD705
R721 10
R720 10
LIBRARY.OLB
LIBRARYMY
FILESMY
POWER
MOS_N_5N60D:EASTKIT
D
R0805
2
1.8
L710 150
G
R740
3
GND1
D S
D710
R0805
1.8
GND1
R741
V700
GND1
L711
CAP_NP
D
3
3
FR107
CY706
CY704
R0805
CY705
C-0805C
3
4
2
1
1.8
150
101/1KV
R742
FILESLIPS-60WSCHSG6859+KA7500.DSN
POWER
TRANSFORMER_FLAT_COMPACT_54-AD:EASTKIT
C-0805C C-0805C
C744
5
6
3
1
R0805
R743
1.8
102/400V
102/400V
T700
11
10
9
7
222/400V
SANHE-28-548
4CT
9
8
7
6
5
!
10
R0805 R0805
GND1
R737
VD710
R736 100
10200
4
100
3
1
3
C754
C-0805A
N704
2
102/100V
K1010C
PC
2
N14653945 N14653934
470u/35V¦µ10X20 GF
C751
CAP
2
2
ISSUED
C747
60W OUTPUT
CAP
DESCRIPTION
1K
R0805
R723
470u/35V¦µ10X20 GF
N14653945 N14653934
BOARD.DSN
BOARD60W-SMALL
FILESPS060M02V0160W-SMALL
POWER
D:EASTKIT
L_1-4
U-TL431_2 R0805
20K
R733
N702
C756
TL431
C-0805A
R724
R0805
L702
3.3uH
1K
NC
N14502113
5.1K
VIDEOCON
R727
CAP
C752
R0805 C-0805A
104
C757
Experience change
470u/35V¦µ10X20 GF
R0805
2013-03-04
C-0805A
C753
5.1K
R728
1uF/25v/1206
1
R0805
R755 10K
R0805
24VSTB
471
R738
R734
Rev: V1.0
10K
R0805
Combo D-LED Project
A
B
24VSTB
CHK/DATE
APPD/DATE
Tony /wan
Re=20; Oµµ·Å´ó¹Ü Re=20; Yµµ·Å´ó¹Ü Re=20; Rµµ·Å´ó¹Ü
RS16,RS17 VALUE RS16,RS17 VALUE RS16,RS17 VALUE
60mAX4 2.3K~4.7K 60mAX4 52.8V 3.4K~6.8K 60mAX4 1.35K~2.7K
120mAX4 667~1.5K 120mAX4 29.7V 910~1.8K 120mAX4 400~800
BL_ON/OFF 65mAX8 1K~2K 65mAX8 27.9V 1.6K~3.2K 2X3.3K/OK 65mAX8 620~1.2K
5V
12V
0/0603 RS3
LED1
LED3
LED4
LED2
DS3 DS4
BAV70
2.7K/1206
NC/1k/0805 RS1 BAV70
2.7k/1206
NC/1k/0805
2
RS2
NC/Z5.1V
DZS1
RS16
RS17
1
RS15 33/1206
470P/100V/0805
RS30 33/1206
CS12 VS5 VS6
C
C
B B
RS31 NC/0/1206
RS32 NC/0/1206 BC2230 BC2230
LS1 60uH
E
E
24VSTB LS3 LED+
SR2100
20¡À1%/1206
20¡À1%/1206
0.1uF/50V/0603
RS8 33/1206
DS2 DS7
RS4 10k
0.1uF/100V/1206
0.1uF/100V/1206
+
330F/75V
RS18
330F/75V
CS1
+ +
CS4
RS19
CS7
CS13
CS8
10K/0805
CS6 CS10
220P/100V/0805
RS26
D
12V VS1
NS3 RS9 10 0603 G ME15N10/B0210D
1 8
VDD OUT VS9 VS10
C
2 7 BC847
EA GND S
10k 0402
3 6 B B VS13
CMP FREQ
RS10
CS3 1nF/0402
22k/ 0603
4 5 BC2230 BC2230
INN OCP
RS14
104KP/0603
E
0.1uF/0402
RS12 1k 0402
0.1uF/0402
BIT3260
CS9
CS2
20¡À1%/1206
20¡À1%/1206
CS5
1¡À1%/1206 RS20
1¡À1%/1206 RS21
1¡À1%/1206 RS24
1¡À1%/1206 RS25
1¡À1%/1206 RS33
1K/0805
RS22
RS27
RS23
DIMMING RS5 1M/0402 LED-
DS1 RS6 47k RS13
1N4148
DS8
100k/0603
33-2 DZZMM33V---EEZG
3.3¡À1%/1206
3.3¡À1%/1206
NC/1206
NC/1206
CS11
0.01uF/0402
CNS3 CNS1
LED+
LED+ 1 LED-
LED1- 2
LED1- 3
CNS2
RS37 0/0603 1
RS40 0/0603 LED2- 4 LED1
LED-
2
LED2- 5 LED2
LED+ 3
DESCRIPTION Combo D-LED Project CHK/DATE
LED3- 6
LED3- 7 LED+
4
ISSUED 2013-03-04 Rev: V1.0 Tony /wan
5
LED- 8 LED3
6
CON08-2.0 LED4
CON06-2.0
VIDEOCON APPD/DATE
Experience change
VGA_Auido
5 4 3 2 1
OPTION
Digital Tuner
TDA18273
N410
CN1
C
N401 C
PAL/SECAM MSTART
TSUMV39LU
Connect LIPS
BG/I/DK
TSUMV59XU
Power
YFS-C1W-DKA DIF2 OUT1
3D Combfilter
A702
DIF2 OUT2 3D Noise reduction
GD25Q16 Flash
N403
Speaker
B B
Sound AMP
TPA3110LD2
N800
2 X 8W
LED
A
LCD Panel A
KEY Board IR
Title
Combo D-LED Project Block diagram
IR Board Size Document Number Rev
A ?